JP2011047015A - Method for manufacturing thin film having metal-plated layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film having a metal plated layer, especially, a thin film having a metal layer not depending on chemical reagent etching in one kind of manufacturing process. <P>SOLUTION: A peeling layer is provided mainly on the surface of a thin film by spray coating, coating or printing in such a manner that a blank part is previously left in the peeling layer. A metal plating layer is formed on the peeling layer and the blank part by plating processing so as to cover the peeling layer and the blank part by the resulting metal plated layer, and then an adhesive layer is provided on the metal plated layer by spray coating, coating and printing. Successively, a base layer is adhered on the adhesive layer or a base layer having an adhesive layer is adhered to the metal plated layer. Finally, the base layer and the adhesive layer are peeled so that an excessive metal plated layer and the peeling layer are simultaneously peeled by the adhesive layer and a metal plated layer comprising only a specific design, line shape, character, symbol or numerical character is left. Thereby, the thin film having the metal plated layer is applied in a radio frequency identification (RFID) system, an antenna of a radio transmitter or a conductive product. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a method of manufacturing a thin film having a kind of metal plating layer, and more particularly to a method of manufacturing a thin film having a metal layer that does not use chemical agent etching in a kind of manufacturing process.

Current metal transfer films or metal thin films are often used in radio frequency identification (RFID) systems and other products such as antennas or thin film circuit boards with wireless transmission technology. In these methods, a special-shaped metal layer is formed on the surface of the thin film by sputtering, vapor deposition or electroplating, and then an RFID chip or other wireless transmission chip is electrically connected to the terminal of the metal layer, thereby generating an RFID signal or other wireless signal. It can be detected. In a known method for producing a metal transfer film, the surface of a thin film is electroplated to cover a single metal plating layer, and then the excess metal plating layer is washed away with an acidic solvent, an alkaline solvent or other chemical solvent. As a result, many harmful heavy metal liquids or waste chemical solvents are generated in the production process. The heavy metal liquid and the chemical solvent must be cleaned using special equipment and then discharged into a river, and it is difficult to reduce the manufacturing cost of the metal transfer film product. On the other hand, if it is discharged without being cleaned, there is a risk of causing great damage to the environment. From this, it can be seen that there are significant drawbacks in the known methods for producing metal transfer films or metal thin films.

A coating release layer coating step, a metal plating layer coating step, an adhesive layer coating (or a base layer having an adhesive layer attached) step, a base layer attaching step, an extra metal plating layer and an adhesive layer. By using a manufacturing method including a peeling step, it is possible to form a specific design, linear, letter, code or numeric metal plating layer on the surface of the thin film without using chemical etching, thereby reducing production costs and protecting the environment. It is a main object of the present invention to provide a method for producing a thin film having a kind of metal plating layer that can realize the object.

In order to achieve the above object, a method of manufacturing a thin film having a metal plating layer according to the present invention includes the following steps.

<B> A coating release layer coating step that coats the surface of the thin film by spraying, coating or printing, leaving a blank space of a specific design, linear, letter, code or number in advance on the release layer; <B> A metal plating layer is formed by plating a surface of the release layer, and the release layer and the blank portion are covered with the metal plating layer; <c> an upper portion of the metal plating layer A step of spraying, coating or printing the adhesive layer, and covering the metal plating layer with the adhesive layer, covering the adhesive layer, and <d> pasting the base layer on top of the adhesive layer; <E> Finally, the base layer is peeled off, and the extra metal plating layer and the peeling layer other than the blank portion are simultaneously peeled off by the adhesive layer, leaving only a specific shape or line shape on the surface of the thin film. And a peeling step of wearing layer.

The method for producing a thin film having a metal plating layer according to the present invention has a blank portion on a peeling layer that is spray-coated, applied, or printed on the thin film, and therefore, after covering the peeling layer and the blank portion with the metal plating layer, While the metal plating layer is tightly bonded to the thin film in the blank part, the metal plating layer can easily peel off the part of the peeling layer, and when the base layer is finally peeled off, an extra metal other than the blank part is removed by the adhesive layer. The plating layer and the release layer can be peeled off simultaneously. For this reason, a specific-shaped or linear metal plating layer can be left on the surface of the thin film. Since no acidic or alkaline solvent is used to wash off the metal plating layer, there is no impact on the ecological environment such as waste water and solid waste, and the manufacturing method according to the present invention reduces production costs and protects the environment. There is an effect.

A method of manufacturing a thin film having a kind of metal plating layer, which is formed by spraying, coating, or printing a release layer on the surface of the thin film. A blank portion is left in advance on the release layer, and an adhesive layer is plated on the release layer and the blank portion, thereby covering the release layer and the blank portion with a metal plating layer. An adhesive layer is sprayed, applied, or printed on the metal plating layer. Subsequently, a base layer is attached on the adhesive layer, or a base layer having an adhesive layer is attached on the metal plating layer. Finally, the base layer and the adhesive layer are peeled off, and the excess metal plating layer and the peeling layer other than the blank portion are simultaneously peeled off by the adhesive layer to leave the metal plating layer of a specific design, linear, letter, sign or number. Furthermore, a thin film having a metal plating layer can be used for a radio frequency identification (RFID) system or other wireless transmission antennas or electrical conduction products.

If the present invention is used, an acidic solvent or an alkaline solvent is not used for washing off the metal plating layer, so there is no influence on the ecological environment such as waste water and solid waste, and the manufacturing method according to the present invention reduces the production cost. And it has the effect of environmental protection that is kind to the earth.

It is a flowchart of the manufacturing method of the transfer film which has a metal layer concerning the present invention. It is a flowchart of the manufacturing method of another Example of the transfer film which has a metal layer concerning this invention. It is the top view by which the peeling layer was implemented on the thin film surface which concerns on this invention. It is sectional drawing by which the peeling layer was implemented on the thin film surface concerning this invention. It is a top view of the covering metal plating layer on the surface of the release layer according to the present invention. It is sectional drawing of the coating metal plating layer of the surface of the peeling layer which concerns on this invention. It is a top view of the contact bonding layer provided in the surface of the metal plating layer concerning this invention. It is sectional drawing of the contact bonding layer provided in the surface of the metal plating layer which concerns on this invention. It is the top view which affixed the base layer on the contact bonding layer which concerns on this invention. It is sectional drawing which affixed the base layer on the contact bonding layer which concerns on this invention. It is a top view of peeling operation of the base layer which concerns on this invention. It is sectional drawing of peeling operation of the base layer which concerns on this invention. It is an aspect figure of the transfer film which has a metal layer concerning the present invention.

1 and 2 show an embodiment of a method for producing a thin film having a metal plating layer according to the present invention. Includes the following main steps:

<B> As shown in FIGS. 3 and 4, the coating release layer coating step coats the release layer 2 by spray coating, coating or printing on the surface of the thin film 1, and the release layer 2 has a specific design, A linear, letter, code, or number blank 21 is left in advance. Among these, the thin film 1 uses a thin film made of a polymer chemical reaction of a thermosetting resin polymer and / or a thermoplastic resin polymer, or a sensor thin film (for example, PU, UP and PS, and other high molecular polymers). . The release layer 2 is a transparent or colored resin layer having hydrophilicity or lipophilicity and having release properties. The material is polyvinyl alcohol, polyvinyl acetate, or the like.

<B> As shown in FIGS. 5 and 6, the coating of the metal plating layer is performed by plating one metal plating layer 3 on the surface of the release layer 2, and this metal plating layer 3 is blank from the release layer 2. Cover part 21. Among them, the coating of the metal plating layer 3 may be any method capable of coating the surface of the release layer 2 and the blank portion 21 with other metal ions such as electroplating, sputtering, vapor deposition, and evaporation. .

<C> As shown in FIGS. 7 and 8, the coating of the adhesive layer is performed by spraying, coating, or printing the adhesive layer 4 on the metal plating layer 3 and covering the surface of the metal plating layer 3 with the adhesive layer 4. Alternatively, as shown in FIGS. 9 and 10, a base layer 5 having an adhesive layer 4 is attached on the metal plating layer 3, and the adhesive layer 4 and the base layer 5 are covered with the metal plating layer 3.

<D> Subsequently, as shown in FIGS. 9 and 10, a base layer 5 is stuck on the adhesive layer 4, and the base layer 5 may be a paper member, a polymer, or an organic compound.

<E> As shown in FIGS. 11 and 12, the base layer 5 and the adhesive layer 4 are peeled off. Finally, the base layer 5 is peeled off, and the excess metal plating layer 3 and the peeling layer 2 other than the blank portion 21 are peeled off by the adhesive layer 4, and a specific design, linear shape is formed on the surface of the thin film 1 as shown in FIG. , Leaving only the metal plating layer 31a of letters, symbols or numbers. The thin film 1 can be applied to other products such as a radio frequency identification (RFID) system or other wireless transmission antennas and conductive or thin film circuit boards.

According to the method for manufacturing a thin film having a metal plating layer according to the present invention, the release layer 2 spray-coated, applied, or printed on the thin film 1 has the blank portion 21, so that the release layer 2 and the blank portion 21 are made of metal. By coating the plating layer 3, the metal plating layer 3 is tightly bonded to the thin film 1 in the blank portion 21, and the portion in the peeling layer 2 is easily peeled off. The excess metal plating layer 3 and the release layer 2 other than the blank portion 21 are peeled off together by the adhesive layer 4, leaving only the specific design, linear, letter, code or number metal plating layer 31 a on the surface of the thin film 1. it can. From the above description, the production method of the present invention eliminates the etching of the metal plating layer 3 with an acidic solvent, an alkaline solvent or other chemical solvent, can prevent the generation of a toxic solvent, and does not require cleaning by facilities such as waste water treatment, It has the effect of reducing production costs and protecting the environment.

DESCRIPTION OF SYMBOLS 1 Thin film 2 Peeling layer 21 Blank part 3 Metal plating layer 31a Metal plating layer 4 Adhesion layer 5 Base layer

Claims (10)

A method for producing a thin film having a metal plating layer,
<B> A coating release layer coating step that coats the surface of the thin film by spraying, coating, or printing, leaving a specific design, linear, letter, code or number blank in advance in the release layer;
<B> A metal plating layer coating step for forming a metal plating layer on the surface of the release layer, and covering the release layer and the blank portion with the metal plating layer;
<C> A coating step of an adhesive layer, which is formed by spraying, applying or printing an adhesive layer on the metal plating layer, and covering the metal plating layer with the adhesive layer;
<D> A base layer pasting step of pasting the base layer on top of the adhesive layer;
<E> Finally, the base layer is peeled off, and the metal layer and the release layer other than the blank portion are simultaneously peeled off by the adhesive layer, leaving only a specific shape or line on the surface of the thin film, A method for producing a thin film having a metal plating layer, comprising a step of peeling off an adhesive layer. 2. The method for producing a thin film having a metal plating layer according to claim 1, wherein the thin film comprises a polymer chemical reaction member of a thermosetting resin polymer or a thermoplastic resin polymer. The method of manufacturing a thin film having a metal plating layer according to claim 1, wherein the thin film is a film or a sensor film. The method for producing a thin film having a metal plating layer according to claim 1, wherein the release layer is a transparent or colored resin layer having hydrophilicity or lipophilicity and release properties. The metal plating layer according to claim 1, wherein the method of coating the metal plating layer comprises coating the metal plating layer on the surface of the thin film by electroplating, sputtering, evaporation. The manufacturing method of the thin film which has this. A method for producing a thin film having a metal plating layer,
<B> A coating release layer coating step that coats the surface of the thin film by spraying, coating, or printing, leaving a specific design, linear, letter, code or number blank in advance in the release layer;
<B> A metal plating layer coating step in which a surface of the release layer is formed by plating one metal plating layer, and the metal plating layer covers the release layer and the blank portion;
<C> A step of attaching the base layer having an adhesive layer, wherein a base layer having an adhesive layer is attached onto the metal plating layer, and the adhesive layer and the base layer are covered with the adhesive layer and the base layer by the adhesive layer and the base layer. When,
<D> Finally, the base layer is peeled off, and the metal layer and the peeling layer other than the blank portion are simultaneously peeled off by the adhesive layer, leaving only a specific shape or line on the surface of the thin film, A method for producing a thin film having a metal plating layer, comprising a step of peeling off an adhesive layer. 7. The method for producing a thin film having a metal plating layer according to claim 6, wherein the thin film comprises a polymer chemical reaction member of a thermosetting resin polymer or a thermoplastic resin polymer. The method of manufacturing a thin film having a metal plating layer according to claim 7, wherein the thin film is a film or a sensor film. The method for producing a thin film having a metal plating layer according to claim 6, wherein the release layer is a transparent or colored resin layer having hydrophilicity or lipophilicity and release properties. The metal plating layer according to claim 6, wherein the method of coating the metal plating layer comprises coating the surface of the thin film with a metal plating layer by electroplating, sputtering, evaporation. The manufacturing method of the thin film which has this.