JP2011044382A - Female side connector for substrate connection, and connector assembly including the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector for substrate connection with high reliability of connection. <P>SOLUTION: In a female side connector for substrate connection comprising a grip having an insertion hole and a protrusion provided facing inward the inner circumferential surface of the insertion hole, at least part of the grip is coated with at least one kind of plating material which is selected from a group of nickel-tungsten, nickel-phosphorus, nickel-tin, nickel-cobalt, and nickel-boron. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a female connector for board connection that can be used in a small electronic device and a connector assembly including the same.

  2. Description of the Related Art Today, board connection connector assemblies are used in electronic devices such as mobile phones and digital cameras to connect two printed wiring boards to each other. In this board connecting connector assembly, one printed wiring board to be connected is provided with a socket, and the other board to be connected is provided with a header. By connecting the socket and the header, both the socket and the header are connected. Electrical circuits formed on the printed wiring board are connected to each other.

  In a conventional board connecting connector assembly, for example, as shown in Patent Document 1, a contact formed by bending a strip conductor into a bag path is provided in one of the sockets to be connected, As the connector, a post having a conductor portion protruding from the header is inserted and fitted, and the inner side surface of the bag path-like portion of the contact and the outer side surface of the post are brought into spring contact with each other to conduct.

  However, since the connector disclosed in Patent Document 1 has a structure in which the inner side surface of the contact path and the outer side surface of the post are brought into contact with each other, the contact is bent when further thinning the structure. In addition to difficulty in molding, shortening the length of the contact part makes it difficult to secure a sufficient contact area, and the coupling force between the contact and the post weakens, making it easy to come off. was there.

  In addition, by narrowing the pitch and increasing the density of such contacts, it is necessary to narrow the pitch of these press-fit grooves as well as the contacts and posts fixed to the connector housing. However, since the housing into which the contacts and posts are press-fitted uses synthetic resin members, there is a limit to miniaturization due to workability and strength, etc., making it difficult to narrow the pitch, and to withstand the press-fitting of contacts and posts, Since a minimum wall thickness is required for the housing, it is difficult to reduce the height from this point.

  On the other hand, in Patent Document 2, a bump is formed on one printed wiring board, an insertion hole into which the bump is inserted is formed on the other printed wiring board, and a member for holding the bump is provided in the insertion hole. A connector assembly for connecting a board for connecting both printed wiring boards by inserting a bump into the insertion hole and holding the bump with the member is disclosed.

  However, in Patent Document 2, since the member that normally holds the bump is formed of a material having extremely small elastic force such as copper, it is difficult to hold the bump well by the member. There was a problem that the electrical connection could not be maintained.

JP 2004-055464 A JP 2007-134169 A

  The present invention has been made in view of the above, and an object of the present invention is to provide a female connector and a connector assembly for board connection with high reliability in mechanical and electrical connection.

In order to solve the above-mentioned problems, a female connector for board connection according to the present invention includes a holding part having an insertion hole and a protruding part provided inwardly on the inner peripheral surface of the insertion hole. A female connector for connection,
At least a part of the gripping part is covered with at least one type of plating material selected from the group consisting of nickel-tungsten, nickel-phosphorus, nickel-tin, nickel-cobalt, and nickel-boron. To do.

  The board connecting connector assembly according to the present invention has two connectors, and is a board connecting connector assembly for connecting two circuit boards, wherein one connector is a circuit of one circuit board. A male connector having conductive bumps to be electrically connected, and the other connector has an insertion hole into which the bump can be inserted, and a female side including a grip portion electrically connected to a circuit of the other circuit board. And at least one kind of plating material selected from the group consisting of nickel-tungsten, nickel-phosphorus, nickel-tin, nickel-cobalt, and nickel-boron at least in contact with the bumps of the grip portion. It is characterized by being coated.

  According to the present invention, at least one type of plating selected from the group consisting of nickel-tungsten, nickel-phosphorus, nickel-tin, nickel-cobalt, and nickel-boron is provided on at least a contact portion of the grip portion with the bump. Since the material is coated, it is possible to prevent the gripping portion from sagging and to hold the bumps well by the gripping portion, thereby maintaining a good mechanical and electrical connection. .

  Therefore, according to the present invention, it is possible to provide a female connector for board connection and a connector assembly with high mechanical and electrical connection reliability.

It is sectional drawing which expands and shows a part of board assembly connector assembly of the assembly state which concerns on the 1st Embodiment of this invention. It is a top view which expands and shows a part of female side connector of the connector assembly for board | substrate connection which concerns on the 1st Embodiment of this invention. 1 is an exploded perspective view showing a circuit board connector assembly according to a first embodiment of the present invention together with a circuit board. It is a perspective view which shows the male connector and the female connector of the state mounted in the circuit board which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the connector assembly for board connection which concerns on the 1st Embodiment of this invention in an assembly state. It is a perspective view which shows the male connector which concerns on the 1st Embodiment of this invention seeing from the surface side. It is a perspective view which shows the male connector which concerns on the 1st Embodiment of this invention seeing from a back surface side. The male connector which concerns on the 1st Embodiment of this invention is shown, (a) is the top view, (b) is the front view, (c) is the side view. It is a perspective view which shows the female connector which concerns on the 1st Embodiment of this invention seeing from the surface side. It is a perspective view which shows the female connector which concerns on the 1st Embodiment of this invention seeing from a back surface side. The female connector which concerns on the 1st Embodiment of this invention is shown, (a) is the top view, (b) is the front view, (c) is the side view. It is sectional drawing which expands and shows a part of board assembly connector assembly of the assembly state which concerns on the 2nd Embodiment of this invention. It is a top view which expands and shows a part of female side connector 3 of the connector assembly for board connection which concerns on the 2nd Embodiment of this invention. It is a top view which expands and shows a part of female connector of the board | substrate connector assembly which concerns on a certain aspect of the 3rd Embodiment of this invention. It is a top view which expands and shows a part of female connector of the connector assembly for board | substrate connections which concerns on another aspect of the 3rd Embodiment of this invention. It is a top view which expands and shows a part of female connector of the connector assembly for board | substrate connections which concerns on another aspect of the 3rd Embodiment of this invention. It is a top view which expands and shows a part of female connector of the connector assembly for board | substrate connections which concerns on another aspect of the 3rd Embodiment of this invention. It is a top view which expands and shows a part of female connector of the connector assembly for board | substrate connections which concerns on another aspect of the 3rd Embodiment of this invention. It is a top view which expands and shows a part of female connector of the connector assembly for board | substrate connections which concerns on another aspect of the 3rd Embodiment of this invention. It is a top view which expands and shows a part of female connector of the connector assembly for board | substrate connections which concerns on another aspect of the 3rd Embodiment of this invention. It is the figure which showed the outline of the repeated bending test. It is a graph which shows the result of a repeated bending test. It is the figure which showed the outline of the 180 degree bending test. It is a graph which shows the result of a 180 degree bending test, The horizontal axis is 260 degreeC reflow frequency, The vertical axis | shaft is made into the fracture distance (mm). It is a graph which shows the result of a 180 degree bending test, the horizontal axis is 260 degreeC reflow frequency, and the vertical axis is R / t.

[First embodiment]
A board connecting connector assembly 1 according to a first embodiment of the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 3, a connector assembly 1 for board connection according to the present invention includes one connector (male side connector) 2 connected to one circuit board (first circuit board) 4 and the other circuit board. (Second circuit board) 5 and the other connector (female connector) 3 to be connected to one connector (male connector) 2 to the other connector (female connector) 3 Then, the circuit boards 4 and 5 are connected to each other. One connector (male side connector) 2 has conductive bumps 11 that are electrically connected to the circuit of one circuit board (first circuit board) 4. On the other hand, the other connector (female side connector) 3 has an insertion hole 31 into which the bump 11 can be inserted. The insertion hole 31 is electrically connected to the circuit of the other circuit board (second circuit board) 5. In addition, at least one projecting portion 31 a that holds the bump 11 and is elastically deformable is formed. In the present invention, the insertion hole 31 and the protruding portion 31a formed on the inner peripheral surface 31b of the insertion hole 31 toward the center are collectively referred to as a gripping portion 31c. At least a contact portion of the grip portion 31c with the bump 11 is covered with a female terminal 35 such as copper, and is made of nickel-tungsten, nickel-phosphorus, nickel-tin, nickel-cobalt, nickel-boron. At least one type of plating material 6 selected from the group is coated.

  FIG. 1 is an enlarged cross-sectional view showing the vicinity of the insertion hole 31 of the board connecting connector assembly 1 according to the first embodiment of the present invention, and shows the case where the board connecting connector assembly 1 is in an assembled state. Show. FIG. 2 is an enlarged plan view showing the vicinity of the insertion hole 31 of the female connector 3 in the connector assembly for board connection 1 according to the first embodiment of the present invention. As shown in FIG. 1, the female connector 3 includes a female substrate 32, and the female substrate 32 includes an FPC board (Flexible Printed Circuit) 33 and a cover member 34. The FPC board 33 has an insertion hole 31 into which a bump is inserted, and the cover member 34 has an accommodation hole 38 following the insertion hole 31. A grip portion 31 c that holds the bump 11 is formed on the inner peripheral surface 31 b of the insertion hole 31. Further, a female terminal 35 that is electrically connected to the second circuit board 5 is formed on the surface of the grip portion 31c. Further, a desired plating material 6 is coated on the surface of the female terminal 35 or the gripping portion 31c, whereby the strength of the gripping portion 31c can be improved and the mechanical and electrical connection with the bump 11 is good. Can be. As the plating material 6, nickel-tungsten, nickel-phosphorus, nickel-tin, nickel-cobalt, nickel-boron are preferably used. Most preferred is nickel-tungsten.

  Since the grip portion 31c is covered with the plating material 6 described above, the grip portion 31c has elasticity that allows the head portion 14 of the bump 11 to pass through the insertion hole 31, and the insertion hole 31 has a circular shape. In addition, the FPC 33 is formed with notches 41 communicating with the insertion holes 31 radially around the insertion holes 31 at substantially equal intervals. Therefore, the protruding portion 31 a of the grip portion 31 c can be elastically deformed in the axial direction of the insertion hole 31, and the protruding portion 31 a can hold the bump 11. In the first embodiment of the present invention, the storage hole 38 of the cover member 34 is formed in a circular shape, but may have any shape as long as the head 14 of the bump 11 can be stored.

  When nickel-tungsten is used as the plating material 6, the concentration of the tungsten component is preferably 3 to 45 mass% with respect to the plating material 6. This is because if the concentration of the tungsten component is within the above range, the film strength increases. That is, if the concentration of the tungsten component is less than 3% by mass, the crystal grains become large and the strength decreases, and if it exceeds 45% by mass, amorphization increases and the strength decreases.

  When nickel-phosphorus is used as the plating material 6, the concentration of the phosphorus component is preferably 1 to 15% by mass with respect to the plating material 6. This is because, if the concentration of the phosphorus component is in the above range, the film strength is increased as described above. That is, if the concentration of the phosphorus component is less than 1% by mass, the crystal grains increase and the strength decreases, and if it exceeds 15% by mass, amorphization increases and the strength decreases.

  Furthermore, when nickel-tin is used as the plating material 6, the concentration of the tin component is preferably 20 to 80% by mass with respect to the plating material 6. This is because if the concentration of the tin component is within the above range, the wear resistance is increased. That is, when the concentration of the tin component is less than 20% by mass, the properties of one metal are increased and the wear resistance is lowered.

  When nickel-cobalt is used as the plating material 6, the concentration of the cobalt component is preferably 20 to 80 mass% with respect to the plating material 6. This is because if the concentration of the cobalt component is within the above range, the wear resistance is increased. That is, when the concentration of the cobalt component is less than 20% by mass, the properties of one metal are increased and the wear resistance is lowered.

  When nickel-boron is used as the plating material 6, the concentration of the boron component is preferably 1 to 5% by mass with respect to the plating material 6. This is because when the concentration of the boron component is within the above range, the film strength increases. That is, if the concentration of the boron component is less than 1% by mass, the crystal grains become large and the strength decreases, and if it exceeds 5% by mass, amorphization becomes large and the strength decreases.

  FIG. 3 is an exploded perspective view showing the board connecting connector assembly 1 according to the first embodiment together with the circuit boards 4 and 5. The board connecting connector assembly 1 includes one connector (male connector) 2 and the other connector (female connector) 3, and the circuit board is connected to one connector (male connector) 2. Circuit board (first circuit board) 4 and the other circuit board (second circuit board) 5 connected to the other connector (female connector) 3. FIG. 4 shows one connector (male connector) 2 mounted on one circuit board (first circuit board) 4 and the other mounted on the other circuit board (second circuit board) 5. FIG. 5 is a perspective view showing each of the connectors (female side connectors) 3, and FIG. 5 is a diagram for connecting a board assembled by connecting one connector (male side connector) 2 to the other connector (female side connector) 3. 1 is a perspective view showing a connector assembly 1. FIG.

  As shown in FIG. 3 to FIG. 5, the board connecting connector assembly 1 schematically includes a plug 11 provided on the female connector 3 with bumps 11 that are locking pieces provided on the male connector 2. The male connector 2 and the female connector 3 are locked with each other in a state of passing through the hole 31. In this locked state, the first circuit board 4 connected to the male connector 2 and the second circuit board 5 connected to the female connector 3 are electrically connected. Yes.

  6 is a perspective view showing the male connector 2 as seen from the front side, FIG. 7 is a perspective view showing the male connector 2 as seen from the back side, and FIG. 8A is a plan view of the male connector 2. (B) is the front view, and (c) is the side view.

  As shown in FIGS. 6 to 8, the male connector 2 has a male substrate 12 formed in a strip shape. A plurality of bumps 11 protrude from the surface of the male base 12. These bumps 11 are arranged in a line along the longitudinal direction of the male substrate 12 with a predetermined interval. The bump 11 is made of a metal material and has conductivity. The bump 11 includes a neck 13 having a circular cross section projecting from the surface of the male base 12 and a head 14 continuously provided at the projecting end of the neck 13, and the vertical cross section is formed in a mushroom shape. Has been. The neck portion 13 is formed so as to increase in diameter from the base portion toward the protruding end portion, and is inserted into the insertion hole 31 of the female connector 3. The head 14 is formed in a dome shape in cross section, and the diameter thereof is larger than the diameter of the neck 13. The head 14 faces the protruding portion 31 a of the insertion hole 31 in a state where the neck 13 is inserted into the insertion hole 31 of the female connector 3.

  The neck portion 13 of each bump 11 is surrounded by an annular terminal portion 15 projecting from the surface of the male base 12 and is connected to the terminal portion 15. The bump 11 constitutes a male terminal 16 together with the terminal portion 15.

  The terminal portion 15 is formed on the back surface of the male base body 12 via a connection portion 17 provided on the surface of the male base body 12 and a through-hole plating portion 18 formed through the front and back surfaces of the male base body 12. It is connected to the provided mounting pad section 19. The connection part 17, the through-hole plating part 18 and the mounting pad part 19 have conductivity. The male connector 2 is mounted on the second circuit board 5 in a state where the mounting pad portion 19 is connected to the electric circuit 5a on the second circuit board 5, whereby the second circuit board 5 and The male terminal 16 is electrically connected.

  9 is a perspective view showing the female connector 3 as seen from the front side, FIG. 10 is a perspective view showing the female side connector 3 as seen from the back side, and FIG. 11A is a plan view of the female side connector 3. (B) is the front view, (c) is the side view.

  As shown in FIGS. 9 to 11, the female connector 3 has a female base 32 formed in a strip shape. The female substrate 32 has a two-layer structure in which an FPC 33 and a cover member 34 are stacked as two plate members.

  A plurality of insertion holes 31 corresponding to the bumps 11 of the male connector 2 are formed in the FPC 33 so as to penetrate therethrough. A female terminal 35 that is electrically connected to the second circuit board 5 is formed on the inner peripheral surface 31 b and the protruding portion 31 a (that is, the grip portion 31 c) of the insertion hole 31.

  The female terminal 35 is connected to a mounting pad portion 37 provided on the back surface of the FPC 33 via a connection portion 36 provided on the back surface of the FPC 33. The connection portion 36 and the mounting pad portion 37 are conductive. The female connector 3 is mounted on the second circuit board 5 in a state where the mounting pad portion 37 is connected to the electric circuit 5a on the second circuit board 5, whereby the second circuit board 5 and The female terminal 35 is electrically connected.

  Since the protruding portion 31a of the grip portion 31c in the FPC 33 of the female side base 32 is covered with the female side terminal 35 and the plating material 6 is covered thereon, the head 14 of the bump 11 is inserted into the insertion hole 31. It has elasticity that allows it to pass through. Specifically, the insertion holes 31 are formed in a circular shape, and the FPC 33 of the female side base 32 is formed with notches 41 communicating with the insertion holes 31 at substantially equal intervals around the insertion holes 31. . Thereby, the peripheral part of the insertion hole 31 in the FPC 33 can be elastically deformed in the axial direction of the insertion hole 31. In the present embodiment, the storage hole 38 of the cover member 34 is formed in a circular shape.

  The cover member 34 is laminated on the surface of the FPC 33. In the cover member 34, storage holes 38 are formed so as to correspond to the respective insertion holes 31 of the FPC 33, and these storage holes 38 communicate with the corresponding insertion holes 31. The diameter of the storage hole 38 is formed to be larger than the diameter of the insertion hole 31, and the head is a portion that protrudes from the insertion hole 31 (FPC 33) in the bump 11 in which the neck 13 is inserted into the insertion hole 31. 14 is accommodated.

  According to this embodiment, the peripheral portion of the female-side base 32 around the insertion hole 31 has elasticity that allows the head 14 of the bump 11 to pass through the insertion hole 31, so that the insertion hole 31 has By pushing the bumps 11, the peripheral portion of the insertion hole 31 in the female base body 32 is elastically deformed, whereby the head 14 of the bump 11 passes through the insertion hole 31, and the female connector 3 and the male connector 2 and the female-side terminal 35 and the male-side terminal 16 are in contact with each other, so that the connecting operation of the female-side connector 3 and the male-side connector 2 can be performed relatively easily. Further, since the peripheral portion of the female-side base 32 has the elasticity that allows the head 14 of the bump 11 to pass through the insertion hole 31 in this manner, the insertion hole Since 31 does not need to be polished, the board connecting connector assembly 1 can be reduced in height.

  According to the present embodiment described above, the bump 11 penetrating the insertion hole 31 is hooked on the female base body 32 to lock the female connector 3 and the male connector 2. Even if it is lowered, the female connector 3 and the male connector 2 can be reliably locked, and the board connecting connector assembly 1 can be made thinner.

  In the present embodiment, the head 14 of the bump 11 faces the protruding portion 31a of the insertion hole 31 of the female connector 3 when the male connector 2 and the female connector 3 are coupled. The female connector 3 and the male connector 2 can be locked also by the head portion 14 of the eleventh head and the protruding portion 31a of the gripping portion 31c, and the male connector 2 and the female connector 3 are more reliably coupled. be able to.

  In this embodiment, since the female base 32 has a two-layer structure, the FPC 33 that is one plate member on which the female terminal 35 is formed is reinforced and protected by the cover member 34 that is the other plate member. The contact reliability between the female terminal 35 and the male terminal 16 can be improved. Further, the head 14 of the bump 11 protruding from the insertion hole 31 is housed in the housing hole 38 of the cover member 34, so that the appearance of the board connecting connector assembly 1 can be improved and the projecting portion thereof can be improved. It is possible to prevent the peripheral components from being hindered.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 12 is an enlarged cross-sectional view showing a part of the board connection connector assembly in an assembled state, and FIG. 13 is an enlarged plan view showing a part of the female connector of the board connection connector assembly according to the present embodiment. FIG. In addition, the same part as embodiment mentioned above is shown with the same code | symbol, and description is abbreviate | omitted (same also in subsequent embodiment).

  The present embodiment is different from the first embodiment in that the female-side base 32 is not a two-layer structure but a single-layer structure using a single plate member. Accordingly, a step hole 51 is formed through the female base body 32 of the present embodiment, and the insertion hole 31 that opens on one side of the female base body 32 is inserted into the step hole 51. A storage hole 38 that is formed to have a larger diameter than the insertion hole 31 and communicates with the insertion hole 31 and opens to the other surface side of the female base 32 is formed.

  The female terminal 35 is formed on the peripheral surface of the step hole 51 including the inner peripheral surface 31 b of the insertion hole 31, and the plating material 6 is formed thereon.

  According to this embodiment, since the female side base 32 has a single layer structure, the female side base 32 can be simplified as compared with the female side base 32 having a two-layer structure.

  Further, the notch 41 communicating with the insertion hole 31 opens to one surface side of the female side base 32 and is formed at the same height as the insertion hole 31, and a peripheral portion of the female side base 32 around the insertion hole 31. However, it can be elastically deformed in the axial direction of the insertion hole 31. Thereby, the surrounding part of the insertion hole 31 in the female side base | substrate 32 has the elasticity which accept | permits the head 14 of the bump 11 passing the insertion hole 31 similarly to 1st Embodiment. .

[Third embodiment]
Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 14 is an enlarged plan view showing the vicinity of the insertion hole 31 of the female connector of the board connecting connector assembly according to the present embodiment. The third embodiment of the present invention is different from the first embodiment in the shape of the protruding portion. In the third embodiment, as shown in FIG. 14, the protruding portion 31 a of the grip portion 31 c has a substantially triangular shape whose width decreases from the inner peripheral surface of the insertion hole 31 toward the center. Four are formed on the inner peripheral surface of the outer peripheral surface substantially equally radially from the inner peripheral surface toward the center. From the viewpoint of the holding force of the bumps by the protrusions 31a, it is preferable that four or more protrusions 31a are formed. When four projecting portions 31a are formed, as shown in FIG. 14, four projecting portions 31a can be formed substantially uniformly by forming the groove portions so that the groove portions cross in the vicinity of the center.

  As another aspect, as shown in FIG. 15, the protruding portion 31 a has a shape whose width decreases from the inner peripheral surface of the insertion hole 31 toward the center, and the inner peripheral surface of the insertion hole 31 The four protruding portions 31a are formed in the vicinity of the center of the insertion hole 31 so that the tip of the protruding portion 31a is cut out in a round shape while applying a weight to a configuration in which four are formed radially evenly from the inner peripheral surface toward the center. It is also possible to adopt a configuration. In this manner, the bumps can be easily inserted / removed by forming the tip of the protruding portion 31a in the vicinity of the center of the insertion hole 31 by cutting it out into a round shape.

  As another aspect, as shown in FIG. 16, the protruding portion 31 a has a shape whose width decreases from the inner peripheral surface of the insertion hole 31 toward the center, and the inner periphery of the insertion hole 31 A configuration in which four protrusions 31a are formed in a square shape near the center of the insertion hole 31 by applying a weight to a configuration in which four are formed radially evenly from the peripheral surface toward the center may be employed. . Thus, by forming a protruding portion 31a by notching a square in the vicinity of the center of the insertion hole 31, it is possible to easily insert and remove the bump as described above.

  As another aspect, as shown in FIG. 17, the protruding portion 31 a has a shape that decreases in width from the inner peripheral surface of the insertion hole 31 toward the center, and the inner peripheral surface of the insertion hole 31 Weighting is applied to the configuration in which four substantially radially from the peripheral surface to the center are formed, and round notches are formed between the protruding portions 31 a on the inner peripheral surface of the insertion hole 31. Further, as shown in FIG. 18, a V-shaped cutout 50 may be formed. Thus, by forming the notch 50 between the protrusion parts 31a in the internal peripheral surface of the insertion hole 31, a bump can be inserted / extracted easily. Furthermore, as shown in FIG. 19, six protrusions 31a may be formed instead of four. By increasing the number of the protrusions 31a, the width at the base of the protrusions 31a is shortened, so that it is difficult to break and the contact reliability can be improved. Further, as shown in FIG. 20, at least one of the sides 52 of the protruding portion 31a can be a curved line instead of a straight line. Thereby, since the length of a span can be taken long similarly to the above, while being hard to break, contact reliability can be improved.

  The present invention is not limited to the above embodiment, and various other embodiments can be adopted without departing from the gist of the present invention.

  Examples of the present invention will be described in detail below, but the present invention is not limited to the following examples.

1. Nickel tungsten Using the alloy coating method disclosed in Japanese Patent Laid-Open No. 2001-271132, the protruding portion according to the present invention was coated (plated) with a nickel tungsten alloy. Specifically, as a plating solution, 0.06 mol / L nickel sulfate (NiSO ₄ ), 0.14 mol / L sodium tungstate (Na ₂ WO ₄ —H ₂ O), 0.14 mol / L An electrolytic aqueous solution composed of L sodium citrate (Na ₃ C ₆ H ₅ O ₇ -2H ₂ O), 0.5 mol / L ammonium chloride (NH ₄ Cl), and a platinum anode having a thickness of 0.5 mm The protrusions were plated by electrolytic deposition using a plate and a 0.2 mm thick copper cathode plate. The electrolytic current density was 5 to 20 A / dm ² , and the bath temperature was 40 to 50 ° C.

  A characteristic test was performed on the protrusions plated as described above. First, the bending test was repeatedly performed about the protrusion part plated first. In the repeated bending test, as shown in FIG. 21, the direction of the free end of the protruding portion returned after bending the free end of the flat rectangular protruding portion by θ1 and the direction of the free end of the first protruding portion are formed. Assuming that the angle is θ2, in the case of no reflow at 260 ° C., the deformation angle θ2 was approximately 0 ° in both cases and once. On the other hand, in the case of nickel plating using a watt bath, the deformation angle θ2 is about 110 ° when θ1 = 135 ° and the number of times of bending is 100 times, and is about 82 ° when θ1 = 170 ° and the number of times of bending is 100 times. FIG. 22 shows the result. The horizontal axis represents the number of reflows at 260 ° C., and the vertical axis represents the deformation angle θ2. As shown in FIG. 22, when nickel tungsten was plated on the protruding portion, the toughness of the protruding portion was improved as compared with nickel plating using a Watt bath. Further, since no decrease in toughness was observed depending on the number of reflows, no decrease in toughness due to heat was observed.

  Subsequently, a 180 ° bending test was performed on the protrusion. In the bending test, as shown in FIG. 23, a test piece (copper plate-like body in which Ni—W alloy is electrolytically deposited) 40 having a thickness d is sandwiched between flat plates so that the flat plates are brought into close contact with each other. The flat plates were brought close to each other, and the fracture distance generated in the test piece 40 was measured. In FIG. 24, the horizontal axis represents the number of reflows at 260 ° C., and the vertical axis represents the breaking distance (mm). In FIG. 25, the horizontal axis represents the number of reflows at 260 ° C., and the vertical axis represents R / t (where R represents the bending radius and t represents the degree of toughness). From these, it was found that the Ni-W alloy electrodeposition film has very strong toughness and is not easily lowered by reflow heating.

  Therefore, if nickel tungsten is plated on the protruding portion by the above-described method, the toughness can be improved, and a board connecting connector assembly in which the toughness is not lowered by heat can be obtained.

2. Nickel phosphorus Subsequently, the projecting portion according to the present invention was coated (plated) with a nickel phosphorus alloy. Specifically, as a plating solution, an electrolysis comprising 160 g / L nickel sulfate, 40 g / L nickel chloride, 40 g / L basic nickel carbonate, 44 g / L phosphorous acid, and 30 g / L normal phosphoric acid. An aqueous solution was used. The pH of the aqueous electrolytic solution was set to 0.5 to 1.0, the bath temperature was set to 85 ° C., the current density was set to 4 A / cm ² , and the current efficiency was set to 50%. By this method, it was possible to improve the toughness of the protrusion.

3. Nickel-tin Subsequently, the projecting portion according to the present invention was coated (plated) with a nickel-tin alloy. Specifically, as a plating solution, 50 g / L of stannous chloride (SnCl ₂ .2H ₂ O), 300 g / L of nickel chloride (NiCl ₂ .6H ₂ O), 30 g / L of sodium fluoride (NaF) ) And 35 g / L of acidic ammonium fluoride (NH ₄ HF ₂ ). The pH of the electrolytic aqueous solution was set to 2.5, the bath temperature was set to 65 ° C., and the current density was set to 2.5 A / dm ² . A nickel tin alloy anode containing 28% tin was used as the anode. By this method, the toughness of the protruding portion could be improved as described above.

4). Nickel-cobalt Subsequently, the nickel cobalt alloy was coated (plated) on the protrusions according to the present invention. Specifically, an electrolytic aqueous solution comprising 200 g / L NiSO ₄ .6H ₂ O, 19 g / L CoSO ₄ .7H ₂ O, 15 g / L NaCl, and 30 g / L H ₂ BO ₃ as a plating solution. Was used. The pH of the electrolytic aqueous solution was set to 5.6, the bath temperature was set to 20 ° C., and the current density was set to 1.0 A / dm ² . By this method, the toughness of the protruding portion could be improved as described above.

5). Nickel-boron Furthermore, the nickel boron alloy was coat | covered (plated) to the protrusion part which concerns on this invention. Specifically, an electrolytic aqueous solution composed of 240 g / L NiSO ₄ , 45 g / L NiCl ₂ , 30 g / L H ₃ BO ₄ , 3 g / L trimethylamine borane was used as the plating solution. The bath temperature of the electrolytic aqueous solution was set to 55 ° C., the current density was set to 1 A / dm ² , and the energization time was set to 3 minutes (when the plating thickness was 0.5 μm). By this method, the toughness of the protruding portion could be improved as described above.

DESCRIPTION OF SYMBOLS 1 Board connection connector assembly 2 Male side connector 3 Female side connector 4 1st circuit board 5 2nd circuit board 6 Plating material 11 Bump (locking piece)
DESCRIPTION OF SYMBOLS 12 Male side base | substrate 13 Neck part 14 Head 16 Male side terminal 31 Insertion hole 31a Projection part of insertion hole 31b Inner peripheral surface of insertion hole 31c Holding part 32 Female side base | substrate 33 FPC (plate member)
34 Cover member (plate member)
35 Female terminal 38 Storage hole 41 Notch 51 Step hole

Claims (13)

A female connector for board connection comprising a gripping part having an insertion hole and a protrusion provided inwardly on the inner peripheral surface of the insertion hole,
At least a part of the gripping part is covered with at least one type of plating material selected from the group consisting of nickel-tungsten, nickel-phosphorus, nickel-tin, nickel-cobalt, and nickel-boron. Female connector for board connection.   The female connector for board connection according to claim 1, wherein the plating material is nickel-tungsten, and the concentration of the tungsten component is 3 to 45 mass% with respect to the plating material.   2. The female connector for board connection according to claim 1, wherein the plating material is nickel-phosphorus, and the concentration of the phosphorus component is 1 to 15% by mass with respect to the plating material.   2. The female connector for board connection according to claim 1, wherein the plating material is nickel-tin, and the concentration of the tin component is 20 to 80% by mass with respect to the plating material.   The female connector for board connection according to claim 1, wherein the plating material is nickel-cobalt, and the concentration of the cobalt component is 20 to 80 mass% with respect to the plating material.   2. The female connector for board connection according to claim 1, wherein the plating material is nickel-boron, and the concentration of the boron component is 1 to 5 mass% with respect to the plating material.   The female side for board connection according to any one of claims 1 to 6, wherein the holding part has a protruding part having a substantially triangular shape whose width decreases from the periphery of the insertion hole toward the center. connector.   8. The female connector for board connection according to claim 7, wherein at least one side of the protruding portion is non-linear.   8. The female connector for board connection according to claim 7, wherein a tip of the protruding portion is cut out.   8. The female connector for board connection according to claim 7, wherein a tip of the protruding portion is formed at an acute angle.   8. The female connector for connecting a board according to claim 7, wherein a base of the protruding portion is cut out. A connector assembly for connecting a board having two connectors and connecting two circuit boards,
One connector is a male connector having conductive bumps that are electrically connected to the circuit on one circuit board,
The other connector is a female-side connector that includes an insertion hole into which the bump can be inserted and includes a grip portion that is electrically connected to the circuit of the other circuit board.
At least a part selected from the group consisting of nickel-tungsten, nickel-phosphorus, nickel-tin, nickel-cobalt, and nickel-boron is coated on at least a contact portion of the grip portion with the bump. A board assembly connector assembly characterized by the above.   13. The board connecting connector according to claim 12, wherein the bump includes a large-diameter head provided at a tip and a small-diameter neck that follows, and the gripping part grips the neck.

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