JP2011029354A - Method of manufacturing light permeable electromagnetic wave shield material, and light permeable electromagnetic wave shield material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light permeable electromagnetic wave shield material, in which an electromagnetic wave shield layer having a uniform thickness and line width is formed. <P>SOLUTION: The method of manufacturing the light permeable electromagnetic wave shield material includes the processes of: forming a patterned resin layer 130 by patterning and printing a composition containing a synthetic resin having no anionic group on a surface processing layer 120 of a transparent base material 110 in which the surface processing layer 120 containing a compound having an anionic group is formed; forming a patterned plating catalyst layer 140 on the resin layer 130 by bringing a plating catalyst compound solution into contact with the resin layer 130; and forming a patterned metal conductive layer 150 on the plating catalyst layer 140 by performing nonelectrolytic plating and/or electrolytic plating. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electromagnetic wave shielding light-transmitting window material useful as a front filter of a plasma display panel (PDP), a window material (such as a sticking film) of a building that requires an electromagnetic wave shield such as a hospital, and the like, and a manufacturing method thereof. .

  In recent years, flat panel displays such as liquid crystal displays, plasma displays (PDPs), EL displays, and CRT displays have been mainly used for large-screen displays, and PDPs have become common as next-generation large-screen display devices. However, in this PDP, high-frequency pulse discharge is performed on the light emitting unit for image display, and there is a risk of radiating unnecessary electromagnetic waves.

  Therefore, a light transmissive electromagnetic wave shielding material having an electromagnetic wave shielding property and a light transmissive property has been developed and put into practical use as a front filter for PDP. Such a light-transmitting electromagnetic wave shielding material is also used as a window material for installation of precision equipment such as hospitals and laboratories in order to protect precision equipment from electromagnetic waves.

  In the light transmissive electromagnetic wave shielding material, a metal conductive layer formed by electroless plating or the like is formed on a transparent substrate. The metal conductive layer generally has a pattern such as a mesh shape, electromagnetic waves are shielded by the mesh portion, and light transmission is ensured by the opening. The metal conductive layer needs to have a very fine pattern with a very narrow line width in order to achieve both excellent light transmittance and electromagnetic shielding properties.

  Therefore, in Patent Document 1, a printing pattern layer is formed by printing a printing paste containing electroless plating catalyst particles such as palladium particles and a binder resin in a mesh shape, and electroless plating is performed on the printing pattern layer. A method of forming a metal conductive layer is disclosed.

JP 11-170420 A

  However, in the method of Patent Document 1, the deposition of the plated metal is not uniform, and it is difficult to form an electromagnetic wave shielding layer having a uniform thickness and line width. In particular, the variation in the thickness distribution of the plated metal is likely to cause defective appearance and uneven electrical resistance, and the uneven electrical resistance is a problem because it causes a decrease in electromagnetic shielding properties.

  Therefore, an object of the present invention is to provide a method for producing a light-transmitting electromagnetic wave shielding material in which a plated metal is uniformly deposited and an electromagnetic wave shielding layer having a uniform thickness and line width is formed.

  A further object of the present invention is to provide a light transmissive electromagnetic wave shielding material in which an electromagnetic wave shielding layer having a uniform thickness and line width is formed.

  The plating unevenness generated in the conventional method is considered to be caused by the presence state of the electroless plating catalyst particles used in the printed pattern layer. That is, in order to form an electromagnetic wave shielding layer having a uniform thickness and line width, the catalyst particles must be uniformly dispersed on the surface of the printed pattern layer. However, since the catalyst particles are dispersed in the printed pattern layer in the conventional method, it is very difficult to uniformly expose the fine catalyst particles on the surface of the printed pattern layer. It is considered that an undeposited portion or an excessively precipitated portion is generated.

  As a result of various studies in view of such knowledge, the present inventors have used the above method by selectively adsorbing a plating catalyst on a resin layer that does not contain catalyst particles printed in a pattern. I found that the problem could be solved.

That is, the present invention includes the following steps:
By printing a composition containing a synthetic resin in a pattern on the surface-treated layer of the transparent substrate on which the surface-treated layer containing a compound having an anionic group is formed on one surface, a patterned resin Forming a layer;
A step of forming a patterned plating catalyst layer on the resin layer by bringing a plating catalyst compound solution into contact with the transparent substrate having the surface treatment layer and the patterned resin layer; and electroless plating and / or A step of forming a patterned metal conductive layer on the plating catalyst layer by electrolytic plating;
The above-mentioned problems are solved by a method for producing a light-transmitting electromagnetic wave shielding material containing

Furthermore, the present invention is formed on a transparent substrate, a surface treatment layer formed on one surface of the transparent substrate, a patterned resin layer formed on the surface treatment layer, and the resin layer Having a patterned plating catalyst layer, and a patterned metal conductive layer formed on the plating catalyst layer;
The surface treatment layer provides a light-transmitting electromagnetic wave shielding material containing a compound having an anionic group.

  According to the method of the present invention, since the plating catalyst metal is exposed on the surface of the resin layer, it is possible to deposit the plating metal uniformly, whereby the line width and thickness are uniform and have a fine pattern. A metal conductive layer can be formed. Therefore, the light transmissive electromagnetic wave shielding material having such a metal conductive layer is excellent in electromagnetic wave shielding properties, light transmissive properties, appearance properties, and visibility.

It is a schematic sectional drawing explaining each process of the manufacturing method of the light transmissive electromagnetic wave shielding material by this invention.

  The manufacturing method of the light transmissive electromagnetic wave shielding material of this invention is demonstrated referring a figure. FIG. 1 is a schematic view illustrating a method for producing a light transmissive electromagnetic wave shielding material of the present invention.

  In the method of the present invention, first, a composition containing a synthetic resin is patterned on the surface treatment layer 120 of the transparent substrate 110 in which the surface treatment layer 120 containing a compound having an anionic group is formed on at least one surface. Step (A) of forming the patterned resin layer 130 is performed by printing in a pattern.

Next, the step of forming the patterned plating catalyst layer 140 on the resin layer 130 by bringing the plating catalyst compound solution into contact with the transparent substrate 110 having the surface treatment layer 120 and the patterned resin layer 130 (B) ). When a solution containing a noble metal salt compound and a tin salt compound is used as the plating catalyst compound solution, the noble metal salt compound and the tin salt compound in the solution are [PdSn ₃ Cl _{10 + n} ] ^x− and [PdSn ₃ Cl] ^{4. -} forming a complex having a negative charge, such as. On the other hand, a surface treatment layer 120 containing a compound having an anionic group is formed on the transparent substrate 110. Therefore, when the plating catalyst compound solution is brought into contact with the transparent substrate 110 having the surface treatment layer 120 and the patterned resin layer 130, the complex is not adsorbed on the surface treatment layer 120 due to repulsion of negative charges. It is ionically adsorbed only on the resin layer 130. When performing electroplating, the complex is reduced by an acid or the like contained in the plating catalyst compound solution, whereby a plating catalyst layer 140 made of a plating catalyst metal such as palladium metal is selectively formed only on the resin layer 130. .

  Next, the step (C) of forming the patterned metal conductive layer 150 on the plating catalyst layer 140 by performing electroless plating and / or electrolytic plating is performed. The plating catalyst layer 140 can deposit the plating metal uniformly without plating unevenness by electroless plating or electrolytic plating.

  According to such a method of the present invention, the metal conductive layer 150 having a uniform thickness and line width can be formed on the plating catalyst layer 140 in a short time. Further, since the resin layer 130 does not contain catalyst particles such as palladium particles, the degree of design at the time of printing is improved, and the resin layer 130 having a finer pattern can be formed with a dimension almost as designed. Therefore, by using such a resin layer 130, the metal conductive layer 150 having a finer pattern can be formed.

  Below, the method of this invention is demonstrated in detail for every process.

  In the method of the present invention, first, a composition containing a synthetic resin is formed into a pattern on the surface-treated layer of the transparent substrate on which the surface-treated layer containing a compound having an anionic group is formed on one surface. A step of forming a patterned resin layer is performed by printing.

[Surface treatment layer]
The surface treatment layer contains a compound having an anionic group. In the present invention, the anionic group means a functional group having an anion or a functional group that generates an anion by dissociation.

As the anionic group in the compound, —COOM, —SO ₃ M, —OSO ₃ M, and —PO ₃ M ₂ (wherein, M represents a hydrogen atom, an alkali metal atom, or an alkaline earth metal atom) Is preferred. M in the above formula represents a cation, specifically a hydrogen atom; an alkali metal atom such as lithium, sodium or potassium; an alkaline earth metal atom such as barium or calcium; ammonium (NH ₄ ⁺ ), an alkanolamine or the like. The amines are preferably mentioned. Among these, M is preferably a hydrogen atom, a lithium ion, a sodium ion, a potassium ion, or an ammonium ion. When such an anionic group is brought into contact with the catalyst compound solution, dissociation of M ⁺ ions easily occurs, and adsorption of a negatively charged complex can be prevented.

Among them, the anionic _{group, -COONa, -COOH, -SO 3 Na} , -SO 3 H is preferred. These anionic groups can prevent the complex having a negative charge from being adsorbed to the surface treatment layer in the step of forming the plating catalyst layer.

  The surface treatment layer includes at least a binder resin, and additionally includes a component such as a surfactant as necessary. As the compound having an anionic group, at least one of the binder resin and the surfactant preferably has an anionic group.

  Preferred examples of the binder resin include polyester resins, polyurethane resins, acrylic resins, and vinyl acetate resins. These may be used individually by 1 type, or may use 2 or more types together. Further, as the binder resin, a binder resin having a group containing active hydrogen such as a hydroxyl group or an amino group is used, and in the surface treatment layer, the binder resin is cured such as polyisocyanate having at least two isocyanate groups. It may be cured with an agent.

  When the binder resin having an anionic group is used, the content of the anionic group in the binder resin is preferably 0.1 to 2 mmol / g, particularly 0.8 to 1.2 mmol / g.

  The number average molecular weight of the binder resin is preferably 5,000 to 40,000, particularly 10,000 to 35,000. The number average molecular weight is a value measured by gel permeation chromatography (GPC) and converted using a standard polystyrene calibration curve.

  As the surfactant, an anionic surfactant is preferably used. Examples of anionic surfactants include fatty acid soaps, N-acyl amino acids and salts thereof, and carboxylates such as alkyl ether carboxylates; alkyl sulfonates, alkyl benzene sulfonates, alkyl naphthalene sulfonates, sulfosuccinates , Sulfonates such as α-olefin sulfonates and N-acyl sulfonates. These may be used individually by 1 type, or may use 2 or more types together. Of these, α-olefin sulfonates, particularly sodium α-olefin sulfonates (olefins having 2 to 18 carbon atoms, particularly 14 to 16 carbon atoms) are preferably used.

  The amount of the anionic group in the anionic surfactant is preferably 0.1 to 2.0 mmol / g, particularly 0.8 to 1.2 mmol / g.

  The content of the anionic surfactant in the surface treatment layer is preferably 0.05 to 10 parts by mass, particularly 0.1 to 5 parts by mass with respect to 100 parts by mass of the binder resin.

  In the surface treatment layer, at least one of the binder resin and the surfactant only needs to have an anionic group. Since an adsorption of a negatively charged complex can be prevented more highly, it is preferable to use at least an anionic surfactant, and it is particularly preferable to use both a binder resin having an anionic group and an anionic surfactant. In addition, when an anionic surfactant is used, the binder resin does not need to have an anionic group. When a binder resin having an anionic group is used, a surfactant other than an anionic surfactant such as a cationic surfactant, an amphoteric surfactant, and a nonionic surfactant is used as the surfactant. May be used, and a surfactant may not be used.

The amount of the anionic groups on the surface of the surface treatment layer, 0.1~2.0mmol / cm ^2, is preferably particularly 0.8~1.2mmol / cm ^2. When the amount of the anionic group is within the above range, the formation of the plating catalyst layer on the surface treatment layer can be suppressed. In addition,
The surface of the surface treatment layer means a region from the exposed surface of the surface treatment layer to a depth of 20 nm. The amount of the anionic group on the surface of the surface treatment layer can be analyzed by FTIR (Fourier transform infrared spectroscopic analyzer), XPS (X-ray photoelectron spectroscopic analyzer) or the like.

  The surface treatment layer preferably contains a wax. By using the wax, the surface smoothness of the surface treatment layer can be improved, and the thickness and line width uniformity of the resin layer and the metal conductive layer can be improved. In forming the surface treatment layer, the wax is preferably used as a wax emulsion. The wax emulsion refers to a wax component in which wax is dispersed as fine particles in water or a water-soluble dispersion medium.

  As the wax, polyethylene wax, polypropylene wax, acrylic wax, fatty acid wax and the like are used. The molecular weight of the wax is preferably 1000 to 10000, particularly 1500 to 6000.

  The content of the wax in the surface treatment layer is preferably 2 to 10 parts by mass, particularly 3 to 8 parts by mass with respect to 100 parts by mass of the binder resin.

  In order to form the surface treatment layer on the transparent substrate, in addition to the binder resin, if necessary, each component such as a surfactant and a wax is mixed with water or an organic solvent (methanol, ethanol, n-propanol, isopropyl alcohol). , Butanol, dichloromethane, tetrahydrofuran, cyclohexanone, etc.) and the like, and the resulting resin composition is applied onto a transparent substrate.

  As a coating method, a gravure coater, reverse roll coater, reverse kiss coater, air knife coater, bar coater or the like is used. In addition to coating, a surface treatment layer can be formed on the transparent substrate by immersing the transparent substrate in the resin composition. The resin composition coated on the transparent substrate is preferably heat-dried at a temperature of 100 to 180 ° C, particularly 140 to 180 ° C. The drying time may be about 1 to 10 minutes.

  The surface treatment layer may be formed at least on the surface of the transparent substrate on which the metal conductive layer is formed, but is further formed on the surface of the transparent substrate opposite to the surface on which the metal conductive layer is formed. May be. Prevents formation of a plating catalyst layer or metal conductive layer on the back side of a transparent substrate when a surface treatment layer is formed on the surface of the transparent substrate opposite to the surface on which the metal conductive layer is formed can do.

  Moreover, the product currently marketed can also be used directly for the transparent base material which has a surface treatment layer. As a commercial item, product name A8300, A1300 by Toyobo Co., Ltd. etc. can be used, for example.

  The thickness of the surface treatment layer is preferably 50 to 150 nm, particularly 65 to 95 nm.

  The transparent substrate on which the surface treatment layer is formed is not particularly limited as long as it has transparency and flexibility and can withstand the subsequent treatment. Examples of the material for the transparent substrate include glass, polyester (eg, polyethylene terephthalate, (PET), polybutylene terephthalate), acrylic resin (eg, polymethyl methacrylate (PMMA)), polycarbonate (PC), polystyrene, and cellulose triacetate. , Polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride, polyethylene, ethylene-vinyl acetate copolymer, polyvinyl butyral, metal ion crosslinked ethylene-methacrylic acid copolymer, polyurethane, cellophane, etc. PET, PC, and PMMA, which are less transparent due to processing (heating, solvent, bending) and are highly transparent, are preferable. Moreover, a base material is used as a sheet | seat, a film, or a board which consists of these materials.

  The thickness of the transparent substrate is usually appropriately set within a range of 0.05 to 5 mm according to the form at the time of use and the required mechanical strength.

[Resin layer forming step]
In the method of the present invention, a patterned resin layer is formed by printing a composition containing a synthetic resin in a pattern on the surface treatment layer described above.

  As the synthetic resin used for the patterned resin layer, a synthetic resin that can ionically adsorb a complex having a negative charge formed by a noble metal salt compound, a tin salt compound, or the like is used. As the synthetic resin, it is preferable to use a polyester resin or a polyurethane resin. These synthetic resins can strongly adsorb the complex.

  Moreover, it is preferable that the synthetic resin used for the resin layer does not have an anionic group. The content of the anionic group in the synthetic resin is preferably 0.1 mmol / g or less, particularly 0.05 mmol / g or less.

  The synthetic resin used for the resin layer preferably has a cationic group. The cationic group means a functional group having a cation or a functional group that generates a cation by dissociation. A synthetic resin having a cationic group can more strongly adsorb a negatively charged complex.

As such a cationic group, preferably a primary amino group (—NH ₂ ), a secondary amino group (—NHR), a tertiary amino group (—NRR ′), an acrylamide group (CH ₂ ═CHCONH) -), and methacrylamide groups _{(CH 2 = C (CH 3} ) CONH-) and the like. R and R ′ in the secondary amino group and the tertiary amino group are alkyl groups having 1 to 8 carbon atoms.

  The content of the cationic group in the synthetic resin is preferably 0.1 to 2.0 mmol / g, particularly preferably 0.8 to 1.2 mmol / g.

  The patterned resin layer preferably further contains a dispersant. By using a dispersant, the synthetic resin is highly dispersed to improve the hardness and surface smoothness of the resin layer, and the thickness and line width of the resulting metal conductive layer can be made uniform.

  Examples of the dispersant include oxide particles such as silica, alumina, and titania, metal particles such as silver powder and copper powder, and carbon particles such as activated carbon, graphite, fullerene, and carbon fiber. Of these, silica particles are preferably used.

The average particle diameter of the silica particles is preferably 10 to 100 nm, particularly preferably 10 to 30 nm. The specific surface area of the silica particles, 100~500m ² / g, is preferably especially 100 to 300 m ² / g. Such silica particles can further improve the hardness and surface smoothness of the patterned resin layer.

  The patterned resin layer may contain a black colorant. By including a black colorant, it becomes possible to impart antiglare properties to the transparent base material side of the light-transmitting electromagnetic wave shielding material.

  Preferred examples of the black colorant include black dyes, black pigments, carbon black, titanium black, black iron oxide, graphite, and activated carbon. These may be used individually by 1 type and may be used in mixture of 2 or more types. Examples of carbon black include acetylene black, channel black, and furnace black. The average particle size of carbon black is preferably 0.1 to 1,000 nm, particularly preferably 5 to 500 nm.

  The black colorant content in the patterned resin layer is preferably 5 to 30 parts by mass, particularly 5 to 15 parts by mass with respect to 100 parts by mass of the synthetic resin.

  In order to form a patterned resin layer on the surface treatment layer, each component such as a dispersant and a black colorant is added to an organic solvent (methanol, ethanol, n-propanol, (Isopropyl alcohol, butanol, dichloromethane, tetrahydrofuran, cyclohexanone, etc.) are dissolved or dispersed, and the resulting composition is printed in a pattern on the surface treatment layer.

  Examples of printing methods include gravure printing, flexographic printing, gravure offset printing, screen printing, ink jet printing, electrostatic printing, and the like. Among these, gravure printing and gravure offset printing are possible because the pattern can be thinned. Particularly preferred.

  After printing the composition on the surface treatment layer, the composition is preferably dried by heating at 80 to 160 ° C, more preferably 90 to 130 ° C. If the drying temperature is less than 80 ° C., the evaporation rate of the solvent is slow and there is a possibility that sufficient film formability may not be obtained, and if it exceeds 160 ° C., thermal decomposition of the compound may occur. The drying time is preferably 5 seconds to 5 minutes.

The resin layer preferably does not contain an anionic group in order to adsorb the plating catalyst. Therefore, the amount of anionic groups on the surface of the resin layer is preferably 0.1 mol / cm ² or less, particularly 0.05 mol / cm ² or less. The surface of the resin layer means a region extending from the exposed surface of the resin layer to a depth of 20 nm.

  The resin layer preferably contains a cationic group. The cationic group is as described above for the synthetic resin.

  The amount of anionic groups on the surface of the resin layer can be analyzed by FTIR (Fourier transform infrared spectroscopic analyzer), XPS (X-ray photoelectron spectroscopic analyzer) or the like.

  The pattern shape of the resin layer may be appropriately determined so as to obtain a desired metal conductive layer, but is preferably a stripe shape and a mesh shape (including a lattice shape), particularly a mesh shape.

  The shape of the mesh pattern in the resin layer is not particularly limited, and examples thereof include a lattice shape in which rectangular openings are formed, and a punching metal shape in which circular, hexagonal, triangular, or elliptical openings are formed. . Further, the openings are not limited to those regularly arranged, and may be a random pattern.

  The line width of the mesh-like resin layer is generally 25 μm or less, preferably 5 to 20 μm, and particularly 5 to 15 μm. The line pitch is preferably 300 μm or less. Further, the aperture ratio is preferably 70 to 95%, particularly 70 to 85%. In addition, an aperture ratio means the ratio for which the opening part accounts in the projection area of a resin layer.

  The shape of the opening surrounded by the line of the resin layer can be any shape such as a circle, an ellipse, and a square (quadrangle, hexagon), but is generally a square, and particularly preferably a square.

  The thickness of the resin layer is preferably 100 to 1000 nm, particularly 200 to 500 nm. The resin layer having such a thickness can adsorb a sufficient amount of the plating catalyst on the surface.

[Plating catalyst layer formation process]
In the method of the present invention, a patterned plating catalyst layer is then formed on the resin layer by bringing the plating catalyst compound solution into contact with a transparent substrate having a surface treatment layer and a patterned resin layer.

  The plating catalyst compound solution is preferably an aqueous solution containing a noble metal salt compound, a tin salt compound, and an acid. In an aqueous solution containing such a component, a noble metal ion and a tin ion form a negatively charged complex and can be selectively adsorbed only on the patterned resin layer.

  Instead of the tin salt compound, a sulfur compound such as sulfur dichloride or a copper compound such as cuprous chloride or cupric chloride can be used, and the noble metal ion and the sulfur ion or copper ion have a negative charge. The same effect as when a complex is formed and a tin chloride compound is used is obtained.

  Examples of the noble metal salt compound include platinum compounds such as platinum chloride salts; gold compounds such as gold chloride salts; palladium compounds such as palladium chloride and palladium sulfate; and silver compounds such as silver nitrate and silver sulfate. Among them, it is preferable to use a palladium compound, particularly palladium chloride, because a complex that can be strongly adsorbed to the patterned resin layer can be formed.

  The content of the noble metal compound in the plating catalyst compound solution is preferably 50 to 500 mg / liter, particularly 100 to 300 mg / liter. When the content of the noble metal compound is within the above range, a complex having a negative charge can be sufficiently formed.

  Examples of the tin salt compound include stannous chloride and stannous sulfate. Among them, it is preferable to use stannous chloride because a complex that can be strongly adsorbed to the patterned resin layer can be formed.

  The content of the tin salt compound in the plating catalyst compound solution is preferably 20 to 50 times the mass of the noble metal compound. The content of the tin salt compound is preferably 10 to 50 g / liter, particularly 10 to 20 g / liter.

  Preferred examples of the acid include hydrochloric acid and sulfuric acid. The acid content in the plating catalyst compound solution is preferably 0.5 to 3 mol / liter, particularly 1.0 to 3 mol / liter.

  As a method of bringing the plating catalyst compound solution into contact with the transparent substrate having the surface treatment layer and the patterned resin layer, a method of spraying the plating catalyst compound solution on the surface treatment layer and the resin layer formed on the transparent substrate A method of immersing the transparent base material on which the surface treatment layer and the resin layer are formed in the plating catalyst compound solution can be used. The temperature of the plating catalyst compound solution at the time of contacting is preferably 10 to 50 ° C, particularly 25 to 45 ° C. The contact time may be about 1 to 10 minutes.

  In addition, as described above, if the surface treatment layer is formed on the surface of the transparent substrate opposite to the surface on which the metal conductive layer is formed, the back surface of the transparent substrate is sprayed and immersed in the plating catalyst compound solution. It is possible to prevent the plating catalyst layer from being formed on the side.

  After the plating catalyst compound solution is brought into contact with the resin layer, the transparent substrate on which the surface treatment layer and the resin layer are formed is preferably washed with water. By washing with water, the plating catalyst compound solution in contact with the surface treatment layer can be removed, and the noble metal salt compound and tin salt compound are hydrolyzed to form a negatively charged complex and adsorbed on the resin layer. Can be further promoted.

  In addition to tap water, water used for washing may be water sterilized with deionized water, halogen, UV germicidal lamps, various oxidizing agents (ozone, hydrogen peroxide, chlorate, etc.), etc. it can. The temperature of water used for washing with water is preferably 0 to 50 ° C, particularly 30 to 50 ° C. The washing time may be 5 seconds to 2 minutes.

  As described above, after the plating catalyst compound solution is brought into contact with the resin layer, the plating catalyst layer made of a noble metal such as palladium metal can be formed, preferably by washing with water. The thickness of the plating catalyst layer is preferably 10 to 100 nm, particularly preferably 20 to 50 nm. If the plating catalyst layer has such a thickness, it contains a sufficient amount of the plating catalyst and has low electrical resistance. Therefore, by performing the plating treatment, the electromagnetic shielding layer having a uniform thickness and line width can be shortened. Can be formed in time.

[Electroless plating process]
Next, in the method of the present invention, a step of forming a patterned metal conductive layer on the plating catalyst layer by performing electroless plating and / or electrolytic plating on the plating catalyst layer is performed. In addition, after the electroless plating is initially performed, it is preferable to further perform the electrolytic plating in order to reduce the electric resistance of the metal conductive layer.

  The plating metal can be used as long as it is conductive and can be plated, and may be a single metal, an alloy, a conductive metal oxide, etc. It may be made of fine fine particles.

  As a plating metal in electroless plating, aluminum, nickel, indium, chromium, gold, vanadium, tin, cadmium, silver, platinum, copper, titanium, cobalt, lead, or the like can be used. In particular, silver, copper, or aluminum is preferably used because a metal conductive layer with high electromagnetic shielding properties can be obtained. A metal conductive layer formed using these plated metals is suitable for achieving both light transmittance and electromagnetic shielding properties.

  Electroless plating can be performed at room temperature or under heating according to a conventional method using an electroless plating bath. That is, the plating substrate is immersed in a bath containing a plating solution containing a plating metal salt, a chelating agent, a pH adjuster, a reducing agent, etc. as a basic composition, or a component plating solution is added separately from two or more solutions What is necessary is just to select suitably, such as performing a plating process by a system.

  As an example of electroless plating, when an electromagnetic shielding layer made of Cu is formed, a water-soluble copper salt such as copper sulfate 1 to 100 g / L, particularly 5 to 50 g / L, a reducing agent such as formaldehyde 0.5 to 0.5 10 g / L, especially 1 to 5 g / L, a solution containing 20 to 100 g / L, particularly 30 to 70 g / L of a complexing agent such as EDTA, and adjusted to pH 12 to 13.5, particularly 12.5 to 13 A method of immersing a transparent substrate having a plating catalyst layer or the like at 50 to 90 ° C. for 30 seconds to 60 minutes can be employed.

  When performing electroless plating, the substrate to be plated may be rocked and rotated, or the vicinity thereof may be agitated with air.

[Electrolytic plating process]
In the method of the present invention, a step of forming a metal conductive layer on the plating catalyst layer by electrolytic plating can also be performed. Since a plating catalyst layer made of a noble metal such as palladium is formed on the resin layer, it is preferable to form the metal conductive layer by performing only electrolytic plating. By omitting the electroless plating process, the manufacturing process can be simplified.

  In the case of performing electroplating, it is preferable to perform electroplating directly after performing the step of bringing the plating catalyst layer into contact with the conductor solution. Moreover, after performing the electroless plating described above, electrolytic plating can be further performed.

(Conducting process)
The conductorization step can be carried out by bringing the plating catalyst layer into contact with a conductor solution containing a metal compound, a reducing compound, and a metal hydroxide. According to the said process, the thin film which consists of metals can be formed in the catalyst layer surface, and precipitation of the metal in electrolytic plating can be accelerated | stimulated.

  The conductorization liquid contains a metal compound, a reducing compound, and a metal hydroxide. A copper compound is preferably used as the metal compound. Specifically, copper sulfate, copper chloride, copper carbonate, copper oxide, and copper hydroxide are preferable as the copper compound. Among these, copper sulfate is particularly preferable because the metal deposition performance of the plating catalyst layer can be improved during the plating treatment. The content of the copper compound in the conductor liquid is preferably 0.1 to 5 g / liter, particularly 0.8 to 1.2 g / liter in terms of copper.

  Examples of reducing compounds include stannous chloride, sodium borohydride, dimethylamine borane, trimethylamine borane, formic acid or salts thereof, alcohol such as methanol, ethanol, propanol, ethylene glycol, glycerin, glucose, glucose, sorbit, cellulose, Examples include reducing sugars such as sucrose, mannitol, and gluconolactone.

  Examples of the metal hydroxide include sodium hydroxide, potassium hydroxide, and lithium hydroxide. The content of the metal hydroxide in the conductor liquid is preferably 10 to 80 g / liter, particularly 30 to 50 g / liter.

  The conductorizing liquid preferably further contains a complexing agent. Examples of complexing agents include hydantoins such as hydantoin, 1-methylhydantoin, 1,3-dimethylhydantoin, 5,5-dimethylhydantoin, and allantoin; organic carboxylic acids such as citric acid, tartaric acid, succinic acid, and salts thereof Can be mentioned. The content of the complexing agent in the conductor liquid is preferably 2 to 50 g / liter, particularly 10 to 40 g / liter.

  The pH of the conductor liquid is preferably 10.0 to 14.0, particularly preferably 11.55 to 13.5. The temperature of the conductor liquid is preferably 20 to 70 ° C, particularly 35 to 50 ° C. The contact time between the plating catalyst layer and the conductor solution is preferably 30 seconds to 20 minutes, particularly 3 to 5 minutes.

  As a method for bringing the plating catalyst layer into contact with the conductor-forming liquid, a method of immersing the transparent substrate on which the plating catalyst layer is formed in the conductor-forming liquid is preferably used. In addition, you may use the method of spraying a conductor-ized liquid on the plating catalyst layer formed on the transparent base material.

  As the plating metal in the electrolytic plating, aluminum, nickel, indium, chromium, gold, vanadium, tin, cadmium, silver, platinum, copper, titanium, cobalt, lead, or the like can be used. In particular, silver, copper, or aluminum is preferably used because a metal conductive layer with high electromagnetic shielding properties can be obtained. A metal conductive layer formed using these plated metals is suitable for achieving both light transmittance and electromagnetic shielding properties.

  Electroplating can be performed according to a conventional method using an electrolytic plating bath.

As the copper sulfate plating solution, for example, a plating bath in which a known brightener is added to an aqueous solution containing 100 to 250 g / liter of copper sulfate, 20 to 120 g / liter of sulfuric acid, and 20 to 70 ppm of chlorine ions can be used. The conditions for copper sulfate plating may be the same as usual. For example, plating may be performed at a liquid temperature of 25 ° C. and a current density of about 3 A / dm ² , and plating may be performed up to a predetermined film thickness.

  The metal conductive layer formed on the plating catalyst layer by electroless plating or electrolytic plating has the same pattern shape as the resin layer. Therefore, the pattern shape of the metal conductive layer is preferably a stripe shape and a mesh shape (including a lattice shape), particularly a mesh shape. The metal conductive layer having these patterns can ensure conductivity (electromagnetic wave shielding property) by the pattern forming portion and can ensure light transmission by the opening.

  The line width of the mesh-shaped metal conductive layer is generally 25 μm or less, preferably 5 to 20 μm, particularly 10 to 20 μm. The line pitch is preferably 300 μm or less. Further, the aperture ratio is preferably 75 to 95%, particularly 70 to 85%. In addition, an aperture ratio means the ratio for which the opening part accounts in the projection area of an electromagnetic wave shield layer.

  The thickness of the metal conductive layer is preferably 1 to 200 μm, particularly 3 to 10 μm. If the thickness of the metal conductive layer is too thin, sufficient electromagnetic shielding properties may not be obtained, and if it is too thick, sufficient light transmission properties may not be obtained.

[Blackening treatment]
In the method of the present invention, it is preferable to further perform a step of blackening the metal conductive layer and forming a blackened layer on at least a part of the surface of the metal conductive layer. By the blackening treatment, it is possible to impart an antiglare property to the metal conductive layer side of the light transmissive electromagnetic wave shielding material.

  The blackening treatment is preferably performed by electroplating a nickel and zinc alloy or a nickel and tin alloy. Blackening treatment layers made of these alloys are excellent in blackness and conductivity.

  The mass ratio (Ni: Zn or Sn) of zinc or tin to nickel in the blackening treatment layer made of an alloy of nickel and zinc or tin is 0.4 to 1.4, particularly 0.2 to 1.2. Is preferred. The thickness of the blackening treatment layer made of the alloy is preferably 0.001 to 1 μm, particularly preferably 0.01 to 0.1 μm.

  The blackening treatment can also be performed by metal oxidation treatment or sulfurization treatment of the metal conductive layer. In particular, the oxidation treatment can obtain a more excellent antiglare effect, and is also preferable from the viewpoint of simplicity of waste liquid treatment and environmental safety.

  When oxidation treatment is performed as a blackening treatment, the blackening treatment solution is generally a mixed aqueous solution of hypochlorite and sodium hydroxide, a mixed aqueous solution of chlorite and sodium hydroxide, peroxodisulfuric acid and water. It is possible to use a mixed aqueous solution of sodium oxide, and in particular, from the economical point of view, a mixed aqueous solution of hypochlorite and sodium hydroxide or a mixed aqueous solution of chlorite and sodium hydroxide is used. It is preferable.

  When performing a sulfurization treatment as a blackening treatment, it is generally possible to use an aqueous solution such as potassium sulfide, barium sulfide and ammonium sulfide as the blackening treatment solution, preferably potassium sulfide and ammonium sulfide. Particularly, ammonium sulfide is preferably used because it can be used at a low temperature.

  The thickness of the blackening treatment layer is not particularly limited, but is 0.01 to 1 μm, preferably 0.01 to 0.5 μm. If the thickness is less than 0.01 μm, the antiglare effect of light may not be sufficient, and if it exceeds 1 μm, the apparent aperture ratio when viewed from the perspective may be reduced.

  The light transmissive electromagnetic wave shielding material formed by the method of the present invention has a surface treatment layer containing a compound having an anionic group on the entire surface of at least one surface of a transparent substrate, and a synthetic resin is formed on the surface treatment layer. A patterned resin layer, a patterned plating catalyst layer, and a patterned metal conductive layer in this order. The detailed configuration of each layer is as described above.

  The light-transmitting electromagnetic wave shielding material of the present invention has excellent light transmission and electromagnetic wave shielding properties because the metal conductive layer has a uniform thickness and line width. The surface resistivity of the metal conductive layer can be 3Ω / □ or less, particularly 1Ω / □ or less. The total light transmittance of the light-transmitting electromagnetic wave shielding material can be 75% or more, particularly 80 to 90%. In addition, the measurement of the total light transmittance of the light-transmitting electromagnetic wave shielding material is performed using a fully automatic direct reading haze computer HGM-2DP (manufactured by Suga Test Instruments Co., Ltd.) or the like, and the total light in the thickness direction of the light-transmitting electromagnetic wave shielding material. This is done by measuring the transmittance.

  The light-transmitting electromagnetic wave shielding material is used in applications requiring light transmission, for example, display surfaces of display devices such as LCDs, PDPs, and CRTs of various electric devices that generate electromagnetic waves, or transparent glass surfaces and transparent of facilities and houses. It is suitably applied to the panel surface. Since the light transmissive electromagnetic wave shielding material has high light transmissive property and electromagnetic wave shielding property, the light transmissive electromagnetic wave shielding material is suitably used for the display filter of the display device described above, particularly for the plasma display filter.

  As the display filter, the light-transmitting electromagnetic wave shielding material of the present invention can be used as it is, but it can also be obtained, for example, by bonding it to a transparent substrate such as a glass plate via an adhesive layer. . In such a display filter, the opening of the metal conductive layer is filled with an adhesive layer.

  In addition to the transparent substrate, the electromagnetic wave shielding layer, and the adhesive layer, the electronic display filter may further include an antireflection layer, a color tone correction filter layer, a near infrared cut layer, and the like. The order of stacking these layers is determined according to the purpose. Further, the display filter may be provided with an electrode for connecting to the ground electrode of the PDP main body in order to enhance the electromagnetic wave shielding function.

  Hereinafter, the present invention will be described with reference to examples. The present invention is not limited by the following examples.

Example 1
1. Formation of Patterned Resin Layer First, a PET film (thickness 100 μm; product name A8300 manufactured by Toyobo Co., Ltd.) having a surface treatment layer (thickness 85 nm) on both surfaces was prepared. Surface treatment layer, a polyester resin (-SO ₃ Na group content of 1.0 mmol / g, number average molecular weight of 25,000) having a -SO ₃ Na group as the binder resin 100 parts by weight of an anionic surfactant (alpha- 5 parts by mass of sodium olefin sulfonate, -SO ₃ Na group content 1.0 mmol / g) and 5 parts by mass of polyethylene emulsion wax agent. Further, the amount of —SO ₃ Na group on the surface of the surface treatment layer was 1.0 mmol / cm ² .

  Next, 100 parts by mass of a polyester resin (cationic group content 1.0 mmol / g, number average molecular weight 20,000; VYLON (registered trademark) 67CX manufactured by Toyobo Co., Ltd.), dispersant (silica particles; AEROSIL (registered trademark) ) 200 Nippon Aerosil Co., Ltd.) 4 parts by mass and cyclohexanone 50 parts by mass were mixed thoroughly to prepare a resin layer forming composition. The resin layer forming composition was gravure-printed in a mesh shape on one surface treatment layer, and then dried at 120 ° C. for 5 minutes. As a result, a mesh-like resin layer (thickness 0.5 μm, line width 15 μm, shape of opening: square shape with 140 μm on one side, opening ratio 77%) was obtained on the PET film.

2. Formation of Patterned Plating Catalyst Layer A resin layer is formed on a plating catalyst compound solution (35 ° C.) made of an aqueous solution containing 0.2 g / liter of palladium chloride, 15 mg / liter of stannous chloride, and 200 ml / liter of 35 mass% hydrochloric acid. The PET film was immersed for 4 minutes and then washed with water. Next, the PET film on which the resin layer was formed was immersed in a conductor solution (35 ° C.) for 4 minutes and then washed with water. Thereby, a patterned plating catalyst layer (thickness 0.03 μm) made of palladium metal was formed on the resin layer.

3. Formation of a patterned metal conductive layer Using a PET film having a plating catalyst layer as a cathode, the following electroplating solution and electrolysis were performed by an electroplating apparatus (Hull cell DC power supply (10A2 type); manufactured by Yamamoto Kakin Tester Co., Ltd.). Electrolytic plating treatment was performed under plating conditions. As the anode, a platinum-coated titanium plate was used. By electroplating, a light-transmitting electromagnetic wave shielding material having a metal conductive layer (thickness: 4 μm, shape of opening: square shape having a side of 140 μm, opening ratio of 77%) made of copper on the surface of the plating catalyst layer was obtained. .

Electrolytic plating solution (A)
H ₂ O: 800 ml
CuSO ₄ .5H ₂ O: 81.1 g
H ₂ SO ₄ (96.0 wt%): 160 ml
HCl (36.0 wt%): 0.1 ml
HNO ₃ (70.0 wt%): 300 ml
Electrolytic plating conditions Plating solution temperature: 45 ° C
Applied voltage: 3V
Cathode current density: 1 A / dm ²
Processing time: 1 minute

(Example 2)
In the formation of the mesh-like resin layer of Example 1, 100 parts by mass of a polyurethane resin (cationic group content 1.0 mmol / g, number average molecular weight 25,000), dispersant (silica particles; AEROSIL (registered trademark) 200) Nippon Aerosil Co., Ltd.) A light-transmitting electromagnetic wave shielding material in the same manner as in Example 1 except that the resin layer forming composition prepared by thoroughly mixing 4 parts by mass and 50 parts by mass of cyclohexanone was used. Was made. The metal conductive layer included in the light-transmitting electromagnetic wave shielding material had a thickness of 0.5 μm, a square opening with one side of 140 μm, and an opening ratio of 77%.

(Example 3)
A light-transmitting electromagnetic wave shielding material was produced in the same manner as in Example 1 except that a PET film (thickness 100 μm; product name A1300, manufactured by Toyobo Co., Ltd.) having a surface treatment layer having the following composition on both surfaces was used. .

Surface treatment layer comprises a binder resin -SO ₃ polyester resin having a Na group (-SO ₃ Na group content of 1.0 mmol / g, number average molecular weight of 25,000) 100 parts by mass. Further, the amount of —SO ₃ Na group on the surface of the surface treatment layer was 1.0 mol / cm ² .

  The metal conductive layer included in the light-transmitting electromagnetic wave shielding material had a thickness of 30 nm, a square opening with one side of 140 μm, and an opening ratio of 77%.

(Comparative Example 1)
A light-transmitting electromagnetic wave shielding material was produced in the same manner as in Example 1 except that a PET film (thickness: 100 μm; product name: T680 manufactured by Mitsubishi Plastics, Inc.) having a surface treatment layer having the following composition on both surfaces was used. .

The surface treatment layer contains only a polyester resin (anionic group content 0 mmol / g, number average molecular weight 25,000) as a binder resin. Further, the amount of anionic groups on the surface of the surface treatment layer was 0 mmol / cm ² .

  In Comparative Example 1, metal copper was deposited not only on the resin layer but also on the surface treatment layer exposed at the opening of the resin layer by plating, and a mesh-like metal conductive layer could not be obtained.

(Comparative Example 2)
A light-transmitting electromagnetic wave shielding material was produced in the same manner as in Example 1 except that a PET film (thickness: 100 μm; product name: 03PF, manufactured by Teijin Ltd.) having a surface treatment layer having the following composition on both surfaces was used.

The surface treatment layer contains only a polyester resin (anionic group content 0 mmol / g, number average molecular weight 25,000) as a binder resin. Further, the amount of anionic groups on the surface of the surface treatment layer was 0 mmol / cm ² .

  Also in Comparative Example 2, metal copper was deposited not only on the resin layer but also on the surface treatment layer exposed at the opening of the resin layer by plating, and a mesh-like metal conductive layer could not be obtained. .

(Comparative Example 3)
1. Formation of Patterned Pd Particle-Containing Resin Layer First, a PET film (thickness 100 μm; product name A8300 manufactured by Toyobo Co., Ltd.) having a surface treatment layer (thickness 90 nm) on both surfaces was prepared. Surface treatment layer, a polyester resin (-SO ₃ Na group content of 1.0 mmol / g, number average molecular weight of 25,000) having a -SO ₃ Na group as the binder resin 100 parts by weight of an anionic surfactant (alpha- sodium olefin sulfonate, including -SO ₃ Na group content of 1.0 mmol / g) 5 parts by mass. Further, the amount of —SO ₃ Na group on the surface of the surface treatment layer was 2.0 mmol / cm ² .

  Next, 100 parts by mass of a polyester resin (anionic group content 1.0 mmol / g, number average molecular weight 25,000; VYLON (registered trademark) 67CX manufactured by Toyobo Co., Ltd.), 10 parts by mass of palladium particles (average particle diameter 100 μm) Part and 50 parts by mass of cyclohexanone were sufficiently mixed to prepare a resin layer forming composition. The resin layer forming composition was gravure-printed in a mesh shape on one surface treatment layer, and then dried at 120 ° C. for 5 minutes. As a result, a mesh-like resin layer (thickness 0.5 μm, line width 20 μm, shape of opening: square shape having a side of 140 μm, opening ratio 77%) containing palladium particles on a PET film was obtained.

2. Preparation of Metal Conductive Layer A PET film on which a Pd particle-containing resin layer is formed is immersed in an electroless copper plating solution (Melplate CU-5100 manufactured by Meltex Co., Ltd.), and electroless copper plating is performed at 50 ° C. for 20 minutes. Then, an electrolytic plating treatment was further performed under the following electrolytic plating solution and electrolytic plating conditions. As the anode, a platinum-coated titanium plate was used. A light-transmitting electromagnetic wave shield having a metal conductive layer made of copper (thickness 0.5 μm, shape of opening: square shape with a side of 140 μm, opening ratio 77%) on the surface of the resin layer containing Pd particles by electrolytic plating treatment The material was obtained.

Electrolytic plating solution (A)
H ₂ O: 800 ml
CuSO ₄ .5H ₂ O: 81.1 g
H ₂ SO ₄ (96.0 wt%): 160 ml
HCl (36.0 wt%): 0.1 ml
HNO ₃ (70.0 wt%): 300 ml
Electrolytic plating conditions Plating solution temperature: 45 ° C
Applied voltage: 3V
Cathode current density: 1 A / dm ²
Processing time: 1 minute

(Comparative Example 4)
A light-transmitting electromagnetic wave shielding material was produced in the same manner as in Comparative Example 3 except that a PET film (thickness: 100 μm; product name: T680 manufactured by Mitsubishi Plastics, Inc.) having a surface treatment layer having the following composition on both surfaces was used. .

The surface treatment layer comprises 100 parts by mass of a polyester resin (-SO ₃ Na group content 1.0 mmol / g, number average molecular weight 25,000) as a binder resin, an anionic surfactant (sodium α-olefin sulfonate, -SO ₃ Na group content 1.0 mmol / g) 5 parts by mass are included. Further, the amount of —SO ₃ Na group on the surface of the surface treatment layer was 1.0 mmol / cm ² .

  The metal conductive layer included in the light-transmitting electromagnetic wave shielding material had a thickness of 0.5 μm, a square opening with one side of 140 μm, and an opening ratio of 77%.

(Evaluation)
1. Electric resistivity Before electroplating, the plating catalyst layers (Examples 1 to 3, Comparative Examples 1 and 2) or Pd particle-containing resin layers (Comparative Examples 3 and 4) were formed by electroless plating. The surface resistivity of the copper thin film was measured using a resistivity meter (Loresta GP MCP-T610 type; manufactured by Mitsubishi Plastics, Inc.). The lower the surface resistivity, the more uniformly the metal film can be formed by electrolytic plating. The results are shown in Table 1.

2. Selective Plating Properties It was visually evaluated whether a mesh-like metal conductive layer was formed by selectively performing plating treatment only on the plating catalyst layer or the Pd particle-containing resin layer. The results are shown in Table 1. In Table 1, what is selectively plated and a mesh-like metal conductive layer is obtained is indicated by “◯”, and is not only the plating catalyst layer or the Pd particle-containing resin layer but also the exposed surface treatment layer. The case where the plating process has been performed and the mesh-like metal conductive layer is not formed is defined as “x”.

3. Uniformity of the line width of the metal conductive layer The line width of the metal conductive layer was observed and measured at 50 locations at a magnification of 2000 times with an optical microscope, the average value, and the maximum and minimum values of the line width. The line width difference ΔW (μm) was obtained. This line width difference ΔW was used as a measure of the uniformity of the metal conductive layer line width.

  In Comparative Examples 1 and 2, not only the resin layer but also the surface treatment layer exposed at the opening of the resin layer, metal copper is deposited by plating, and a mesh-like metal conductive layer cannot be obtained. It was. Moreover, in Comparative Examples 3 and 4, metal copper was deposited only on the Pd particle-containing resin layer by the plating treatment, and a mesh-like metal conductive layer was obtained. However, the metal conductive layer was finer than the Examples. It did not have a mesh pattern, and the thickness and line width were not uniform.

  On the other hand, in Examples 1 to 3, metal copper is selectively deposited only on the resin layer by plating, thereby forming a metal conductive layer having a fine mesh pattern and uniform thickness and line width. It had been.

110 transparent substrate,
120 surface treatment layer,
130 patterned resin layer,
140 patterned catalyst layer for plating,
150 Patterned metal conductive layer.

Claims (12)

By printing a composition containing a synthetic resin in a pattern on the surface-treated layer of the transparent substrate on which the surface-treated layer containing a compound having an anionic group is formed on one surface, a patterned resin Forming a layer;
A step of forming a patterned plating catalyst layer on the resin layer by bringing a plating catalyst compound solution into contact with the transparent substrate having the surface treatment layer and the patterned resin layer; and electroless plating and / or A step of forming a patterned metal conductive layer on the plating catalyst layer by electrolytic plating;
A method for producing a light-transmitting electromagnetic wave shielding material comprising: The anionic group is composed of —COOM, —SO ₃ M, —OSO ₃ M, and —PO ₃ M ₂ (wherein M represents a hydrogen atom, an alkali metal atom, or an alkaline earth metal atom). The method for producing a light-transmitting electromagnetic wave shielding material according to claim 1, which is at least one selected from the group.   The method for producing a light-transmitting electromagnetic wave shielding material according to claim 1 or 2, wherein the compound having an anionic group is a binder resin having an anionic group and / or an anionic surfactant.   The method for producing a light-transmitting electromagnetic wave shielding material according to claim 3, wherein the binder resin having an anionic group is at least one selected from the group consisting of a polyester resin, a polyurethane resin, an acrylic resin, and a vinyl acetate resin. .   The method for producing a light-transmitting electromagnetic wave shielding material according to claim 3 or 4, wherein the anionic surfactant is an α-olefin sulfonate.   The method for producing a light-transmitting electromagnetic wave shielding material according to any one of claims 1 to 5, wherein the plating catalyst compound solution is an aqueous solution containing a noble metal salt compound, a tin salt compound, and an acid.   The method for producing a light-transmitting electromagnetic wave shielding material according to claim 6, wherein the noble metal salt compound is palladium chloride and the tin salt compound is stannous chloride. A transparent substrate, a surface treatment layer formed on one surface of the transparent substrate, a patterned resin layer formed on the surface treatment layer, and a patterned plating catalyst layer formed on the resin layer And a patterned metal conductive layer formed on the plating catalyst layer,
The light-transmitting electromagnetic wave shielding material in which the surface treatment layer contains a compound having an anionic group. The anionic group is composed of —COOM, —SO ₃ M, —OSO ₃ M, and —PO ₃ M ₂ (wherein M represents a hydrogen atom, an alkali metal atom, or an alkaline earth metal atom). The light transmissive electromagnetic wave shielding material according to claim 8, which is at least one selected from the group.   The light-transmitting electromagnetic wave shielding material according to claim 8 or 9, wherein the compound having an anionic group is a binder resin having an anionic group and / or an anionic surfactant.   The light-transmitting electromagnetic wave shielding material according to claim 10, wherein the binder resin having an anionic group is at least one selected from the group consisting of a polyester resin, a polyurethane resin, an acrylic resin, and a vinyl acetate resin.   The light-transmitting electromagnetic wave shielding material according to claim 10 or 11, wherein the anionic surfactant is an α-olefin sulfonate.

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