JP2011009516A - Method of manufacturing electronic component, and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component in which a sealing part can be securely sealed when lead members connected to a body extend to the outside of a housing through the sealing part, and to provide the electronic component.SOLUTION: In the method of manufacturing a multilayer electrolytic capacitor 1, the sealing part 6 of the housing 2 has a thermosetting resin material 15 to be thermally set injected between lead members 40, 50 and an inside resin layer of the housing 2. At this time, the thermosetting resin material 15 to be thermally set enters the gap between lead members 40, 50 and the housing 2, so even when the lead members 40, 50 connected to a laminate 3 extend to the outside of the housing 2 through the sealing part 6, the sealing part 6 can be securely sealed.

Description

  The present invention relates to an electronic component manufacturing method and an electronic component.

  In electronic parts such as an organic electrolytic capacitor, a lithium ion secondary battery (LIB), and an electric double layer capacitor (EDLC), a so-called laminate outer package is widely used for housing an element body (for example, Patent Document 1, 2). The laminate exterior body has an inner resin layer, a metal layer formed outside the inner resin layer, and an outer resin layer formed outside the metal layer, and the inner resin layers face each other at the sealing portion. It is the exterior body which can be welded.

JP 2008-251464 A JP 2000-77044 A

  However, if the lead member connected to the element body is extended to the outside of the exterior body through the sealing portion, it is obstructed by the lead member and it becomes difficult to reliably weld the inner resin layers to each other. If the body contains a liquid such as an electrolyte, there is a risk of liquid leakage.

  The present invention provides a method of manufacturing an electronic component and an electronic device capable of reliably sealing a sealing portion when a lead member connected to the element body extends outside the exterior body via the sealing portion. It is an object to provide parts.

  In order to solve the above problems, a method of manufacturing an electronic component according to the present invention includes an inner resin layer, a metal layer formed outside the inner resin layer, and an outer resin layer formed outside the metal layer, A preparatory step of preparing an exterior body that can be welded with the inner resin layers facing each other in the sealing portion, and an element body to which the lead member is connected, and after the preparation step, the sealing portion is removed from the element body A housing step of housing the element body in the exterior body so that the lead member extends outside the exterior body, and a welding step of welding the inner resin layers facing each other in the sealing portion after the housing step, An arrangement step of disposing a thermosetting resin material before thermosetting between the lead member and the inner resin layer at least in the sealing portion after the housing step and before the welding step or after the welding step; It is characterized by including.

  In this method of manufacturing an electronic component, a thermosetting resin material before thermosetting is disposed between the lead member and the inner resin layer in the sealing portion of the exterior body. At this time, since the thermosetting resin material before thermosetting enters the gap between the lead member and the inner resin layer, the lead member connected to the element body extends to the outside of the exterior body through the sealing portion. In that case, the sealing portion can be reliably sealed.

  Here, when the placement step is performed after the housing step and before the welding step, the welding step is performed at a temperature equal to or higher than the higher one of the melting temperature of the inner resin layer and the thermosetting temperature of the thermosetting resin material. It is preferable to implement. In this case, the welding of the inner resin layer and the thermosetting of the thermosetting resin material can be efficiently performed in the same process.

  When the element body contains a liquid, it is preferable to use a thermosetting resin material having a thermosetting temperature lower than the boiling point of the liquid. In this case, it is possible to prevent the liquid from being vaporized when the thermosetting resin material is thermoset.

  Moreover, it is preferable to use the thermosetting resin material whose viscosity before thermosetting is 100 mPa * s or less. In this case, the thermosetting resin material before thermosetting can easily enter the gap between the lead member and the inner resin layer.

  The electronic component according to the present invention includes an inner resin layer, a metal layer formed outside the inner resin layer, and an outer resin layer formed outside the metal layer, and the inner resin layers face each other in the sealing portion. An exterior body that has been welded, an element body accommodated in the exterior body, and a lead member connected to the element body and extending from the element body to the outside of the exterior body through the sealing portion, A thermosetting resin material after thermosetting is disposed between the lead member and the inner resin layer in the sealing portion.

  In this electronic component, since the thermosetting resin material after thermosetting is disposed between the lead member and the inner resin layer in the sealing portion, the sealing portion can be reliably sealed.

  According to the present invention, when the lead member connected to the element body extends to the outside of the exterior body via the sealing portion, the sealing portion can be reliably sealed.

It is a perspective view of the multilayer electrolytic capacitor manufactured by one Embodiment of the manufacturing method of the electronic component which concerns on this invention. It is a perspective view of the laminated body of the multilayer electrolytic capacitor of FIG. It is a disassembled perspective view of the laminated body of the multilayer electrolytic capacitor of FIG. It is a partial cross section figure of the anode foil of the laminated body of FIG. It is sectional drawing along the VV line of FIG. It is a perspective view for demonstrating the manufacturing process of the multilayer electrolytic capacitor of FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.

  FIG. 1 is a perspective view of a multilayer electrolytic capacitor manufactured by an embodiment of a method for manufacturing an electronic component according to the present invention. As shown in FIG. 1, a multilayer electrolytic capacitor (electronic component) 1 includes an exterior body 2 that is a so-called laminate exterior body, and a substantially rectangular parallelepiped multilayer body (element body) 3 housed in the exterior body 2. It is equipped with. The exterior body 2 includes a substantially rectangular parallelepiped box-shaped main body 4 and a substantially rectangular lid 5 that covers the opening 4 a of the main body 4. The lid part 5 is liquid-tightly joined to a flange part 4 b formed integrally with the opening part 4 a of the main body part 4. In the exterior body 2, a portion where the flange portion 4 b of the main body portion 4 and the lid portion 5 abut is a sealing portion 6.

  Furthermore, the multilayer electrolytic capacitor 1 includes lead members 40 and 50 connected to the multilayer body 3. Each lead member 40, 50 extends from the laminate 3 to the outside of the exterior body 2 via the sealing portion 6. Each lead member 40, 50 is located on the same side with respect to the laminate 3, and the lead member 40 and the lead member 50 are juxtaposed along a direction substantially perpendicular to the direction in which they extend. ing.

  2 is a perspective view of the multilayer body of the multilayer electrolytic capacitor of FIG. 1, and FIG. 3 is an exploded perspective view of the multilayer body of the multilayer electrolytic capacitor of FIG. As shown in FIGS. 2 and 3, the laminate 3 is configured by alternately laminating a plurality of anode foils 10 and a plurality of cathode foils 20 with separators 30 interposed therebetween.

  The anode foil 10 is made of a foil-like valve metal. Here, an aluminum foil (for example, a thickness of 50 to 150 μm) is used as the anode foil 10. As shown in FIG. 4, the anode foil 10 includes an etching layer 11 formed by an etching process, and an oxide film layer 12 formed on the etching layer 11. The cathode foil 20 is made of a metal etching foil in which an etching layer is formed on a metal plain foil. Here, an aluminum etching foil (for example, a thickness of 10 to 100 μm) is used as the cathode foil 20. The separator 30 is made of insulating paper, fiber nonwoven fabric, or the like, and has a substantially rectangular shape. The separator 30 has a function of electrically insulating the anode foil 10 and the cathode foil 20 and holding an electrolytic solution.

  The anode foil 10 includes a substantially rectangular main electrode portion 13 and a substantially rectangular lead portion 14 formed integrally with a part of one side of the main electrode portion 13. The cathode foil 20 has a substantially rectangular main electrode portion 23 and a substantially rectangular lead portion 24 formed integrally with a part of one side of the main electrode portion 23. The main electrode portions 13 and 23 are opposed to each other via the separator 30 in the stacking direction of the stacked body 3. The lead-out portions 14 and 24 are drawn to the same side with respect to the laminate 3, and the lead-out portion 14 and the lead-out portion 24 are juxtaposed along a direction substantially orthogonal to the direction in which they are drawn out. .

  The lead members 40 and 50 are made of a metal plain foil. Here, aluminum foil is used as the lead members 40 and 50. The lead member 40 is connected to each anode foil 10, and the lead member 50 is connected to each cathode foil 20.

  The lead member 40 includes a plurality of connection portions 41 fixed to the lead-out portion 14 of each anode foil 10, a plurality of connection portions 42 that connect adjacent connection portions 41 to each other, and a sealing portion 6. It has the extension part 43 extended outside. Each connecting portion 41 is fixed to the surface of the drawing portion 14 by caulking joining, ultrasonic welding, or the like in a state where it is in contact with the surface of the drawing portion 14 of each anode foil 10. Thereby, the drawer | drawing-out part 14 and the connection part 41 are electrically and physically connected.

  The lead member 50 includes a plurality of connection portions 51 fixed to the drawing portion 24 of each cathode foil 20, a plurality of connection portions 52 that connect adjacent connection portions 51 to each other, and a sealing portion 6. It has the extension part 53 extended outside. Each connection portion 51 is fixed to the surface of the drawing portion 24 by caulking bonding, ultrasonic welding, or the like in a state where the connection portion 51 is in contact with the surface of the drawing portion 24 of each cathode foil 20. Thereby, the drawer | drawing-out part 24 and the connection part 51 are electrically and physically connected.

  The lead member 40 has a zigzag folded shape that is bent at two locations between adjacent connection portions 41 (here, the boundary between the connection portion 41 and the coupling portion 42). In other words, the lead member 40 is folded so that the drawn portion 14 of each anode foil 10 is sandwiched between the connecting portion 41 and the connecting portion 42. Similarly, the lead member 50 has a zigzag folded shape that is bent at two locations between adjacent connecting portions 51 (here, the boundary between the connecting portion 51 and the connecting portion 52). In other words, the lead member 50 is folded so that the drawn portion 24 of each cathode foil 20 is sandwiched between the connecting portion 51 and the connecting portion 52.

  FIG. 5 is a cross-sectional view taken along line VV in FIG. As shown in FIG. 5, each of the main body portion 4 and the lid portion 5 includes an inner resin layer 7, a metal layer 8 formed outside the inner resin layer 7, and an outer resin formed outside the metal layer 8. It has a layer 9. The inner resin layer 7 is made of polypropylene, for example, and has a function as an adhesive layer. The metal layer 8 is made of, for example, an aluminum foil and has a function as a core material. The outer resin layer 9 is made of a material having excellent mechanical strength, such as nylon or PET, and has a function as a protective layer.

  In the sealing portion 6, the inner resin layer 7 of the main body portion 4 and the inner resin layer 7 of the lid portion 5 face each other, and the inner resin layer 7 of the main body portion 4 and the lid portion 5 are bonded by heat sealing (thermal fusion). The inner resin layer 7 is welded. Further, at least in the gap between the extended portion 43 of the lead member 40 and the inner resin layer 7 and in the gap between the extended portion 53 of the lead member 50 and the inner resin layer 7, the thermosetting resin material 15 that has been thermoset. Has entered. The thermosetting resin material 15 is made of epoxy resin, acrylic resin, silicone, or the like.

  Next, a method for manufacturing the multilayer electrolytic capacitor 1 will be described. FIG. 6 is a perspective view for explaining a manufacturing process of the multilayer electrolytic capacitor of FIG.

  First, a plurality of anode foils 10 are formed by punching the anode foil base material with a mold, and a plurality of cathode foils 20 are formed by punching the cathode foil base material with a mold. The anode foil base material and the cathode foil base material are made of large-sized aluminum foil. On both surfaces of the anode foil base material, an etching layer and an oxide film layer are formed in advance by etching and anodizing treatment (chemical conversion treatment). Subsequently, the anode foil 10 and the lead member 40 are connected by caulking joining, ultrasonic welding, or the like, and the anode electrode 10 and the lead member 50 are connected to each other so that the main electrode portions 13 and 23 face each other. The foil 10 and the cathode foil 20 are alternately laminated via the separator 30.

  In this way, the laminate 3 to which the lead members 40 and 50 are connected is prepared, while the exterior body 2 is prepared. As described above, the outer package 2 can be welded with the inner resin layers 7 facing each other in the sealing portion 6.

  Subsequently, the laminate 3 is accommodated in the exterior body 2 such that the lead members 40 and 50 extend from the laminate 3 to the outside of the exterior body 2 through the sealing portion 6. Specifically, the laminated body 3 is accommodated in the main body 4 through the opening 4a so that the lead members 40 and 50 cross one side of the flange 4b, and the flange 4b is covered with the lid 4b so as to cover the opening 4a. The part 5 is brought into contact.

  Subsequently, in the sealing portion 6, the inner resin layer 7 of the main body portion 4 and the inner resin layer 7 of the lid portion 5 face each other. The inner resin layer 7 is welded. Here, the injection of the electrolytic solution is performed from the remaining one side after the three sides of the rectangular annular sealing portion 6 are sealed, but the laminate 3 may be impregnated with the electrolytic solution in advance. In order to improve the adhesion between the lead members 40 and 50 and the inner resin layer 7, the lead members 40 and 50 are subjected to plasma cleaning treatment before connection to the anode foil 10 and the cathode foil 20. Is preferred.

  Subsequently, an aging process is performed. Here, the lead member 40 is connected to the anode of the DC power source, and the lead member 50 is connected to the cathode of the DC power source, and a DC voltage is applied between the anode foil 10 and the cathode foil 20. As a result, the damaged portion of the oxide film layer 12 of the anode foil 10 is repaired, and the oxide film layer is formed on the cut surface by punching the anode foil 10.

  Subsequently, as shown in FIG. 6, the thermosetting resin material 15 before thermosetting is injected into a portion where the lead members 40 and 50 pass in the sealing portion 6. Thereby, the thermosetting resin material 15 before thermosetting enters the gap between the lead members 40 and 50 and the inner resin layer 7. Then, in the drying furnace, the thermosetting resin material 15 is cured to complete the multilayer electrolytic capacitor 1. The thermosetting temperature of the thermosetting resin material 15 is a temperature lower than the boiling point of the electrolytic solution (for example, a temperature of 100 ° C. or lower). Moreover, the viscosity of the thermosetting resin material 15 before thermosetting is 100 mPa · s or less. The injection of the thermosetting resin material 15 may be performed along the rectangular annular sealing portion 6.

  As described above, in the method for manufacturing the multilayer electrolytic capacitor 1, the thermosetting resin material 15 before thermosetting is provided between the lead members 40 and 50 and the inner resin layer 7 in the sealing portion 6 of the outer package 2. Inject. At this time, since the thermosetting resin material 15 before thermosetting enters the gap between the lead members 40 and 50 and the inner resin layer 7, the lead members 40 and 50 connected to the laminate 3 are sealed portions 6. Even if it extends to the outside of the exterior body 2 via the seal, the sealing portion 6 can be reliably sealed. That is, in the multilayer electrolytic capacitor 1, since the thermosetting resin material 15 after thermosetting is disposed between the lead members 40, 50 and the inner resin layer 7 in the sealing portion 6, the sealing portion 6 Is securely sealed.

  Further, since the thermosetting resin material 15 having a thermosetting temperature lower than the boiling point of the electrolytic solution is used, it is possible to prevent the electrolytic solution from vaporizing when the thermosetting resin material 15 is thermoset.

  Further, since the thermosetting resin material 15 having a viscosity before thermosetting of 100 mPa · s or less is used, the thermosetting resin material before thermosetting is provided in the gap between the lead members 40 and 50 and the inner resin layer 7. 15 becomes easy to enter.

  The present invention is not limited to the embodiment described above.

  For example, after housing the laminate 3 in the exterior body 2 and before welding the inner resin layer 7 of the main body 4 and the inner resin layer 7 of the lid 5, at least the lead members 40 and 50 in the sealing portion 6. You may inject | pour the thermosetting resin material 15 before thermosetting into the part which passes. In this case, the inner resin layer 7 of the main body 4 and the inner side of the lid 5 at a temperature equal to or higher than the higher one of the melting temperature of the inner resin layer 7 and the thermosetting temperature of the thermosetting resin material 15. It is preferable to weld the resin layer 7. According to this, the welding of the inner resin layer 7 and the thermosetting of the thermosetting resin material 15 can be efficiently performed in the same process.

Further, the present invention is applicable to any electronic component (for example, a lithium ion secondary battery, an electric double layer capacitor, etc.) in which a so-called laminate outer package is used for housing the element body. However, since the use temperature and the use pressure of the electrolytic capacitor are relatively high, the present invention is extremely effective for the electrolytic capacitor from the viewpoint of preventing leakage of the electrolytic solution.
[Example]

  Finally, examples and comparative examples will be described.

  Example 1 A multilayer electrolytic capacitor was produced by the following procedure. An aluminum conversion foil having a film as an anode foil was punched out to 17 mm × 32 mm, and the cathode foil was punched out to the same size. Then, lead members were connected, and 5 anode foils and 6 cathode foils were bonded to 12 sheets. It laminated | stacked alternately via the separator. Subsequently, the laminate to which the lead member was connected was housed in the exterior body, and the three sides of the rectangular annular sealing portion were sealed. And electrolyte solution was inject | poured through 1 side of the remaining sealing member, and 1 side of the sealing member was sealed. Subsequently, an aging process was performed. Furthermore, a thermosetting resin material before thermosetting was injected into a portion where the lead member passes in the sealing portion, and was thermoset to complete a multilayer electrolytic capacitor. As the thermosetting resin material, an epoxy resin having a viscosity before thermosetting of 70 mPa · s was used.

  (Example 2) As the thermosetting resin material, an acrylic resin having a viscosity before thermosetting of 45 mPa · s was used to manufacture a multilayer electrolytic capacitor in the same procedure as in Example 1.

  (Example 3) A multilayer electrolytic capacitor was produced in the same procedure as in Example 1, using a silicone resin having a viscosity before thermosetting of 90 mPa · s as the thermosetting resin material.

  (Example 4) As the thermosetting resin material, an epoxy resin having a viscosity before thermosetting of 130 mPa · s was used to manufacture a multilayer electrolytic capacitor in the same procedure as in Example 1.

  (Example 5) A multilayer electrolytic capacitor was produced in the same procedure as in Example 1, using an acrylic resin having a viscosity before thermosetting of 200 mPa · s as the thermosetting resin material.

  (Comparative Example 1) A multilayer electrolytic capacitor was manufactured in the same manner as in Example 1 except that no thermosetting resin material was injected.

  For the multilayer electrolytic capacitors of Examples 1 to 5 and Comparative Example 1 described above, a voltage application test was performed at a temperature of 105 ° C., and the change in weight after the lapse of 500 hours was measured, thereby confirming liquid leakage. The results are as follows: Example 1: -3%, Example 2: -2%, Example 3: -6%, Example 4: -13%, Example 5: -22%, Comparative Example 1: -68 %.

  Thus, what inject | poured the thermosetting resin material (Examples 1-5) was able to suppress a weight change small compared with the thing (comparative example 1) which did not inject | pour a thermosetting resin material. . Especially the thing (Examples 1-3) which inject | poured the thermosetting resin material whose viscosity before thermosetting is 100 mPa * s or less was able to suppress a weight change to 6% or less. This is because the thermosetting resin material before thermosetting can easily enter the gap formed in the portion where the lead member passes in the sealing portion.

  DESCRIPTION OF SYMBOLS 1 ... Multilayer type electrolytic capacitor (electronic component), 2 ... Exterior body, 3 ... Laminated body (element body), 6 ... Sealing part, 7 ... Inner resin layer, 8 ... Metal layer, 9 ... Outer resin layer, 15 ... Thermosetting resin material, 40, 50 ... lead member.

Claims (5)

It has an inner resin layer, a metal layer formed on the outer side of the inner resin layer, and an outer resin layer formed on the outer side of the metal layer. A preparatory process for preparing an exterior body that can be connected and an element body to which a lead member is connected;
An accommodating step of accommodating the element body in the exterior body such that the lead member extends from the element body to the outside of the exterior body through the sealing portion after the preparation step;
After the housing step, a welding step of welding the inner resin layers facing each other in the sealing portion;
A thermosetting resin material before thermosetting is disposed between the lead member and the inner resin layer at least in the sealing portion after the housing step and before the welding step or after the welding step. An electronic component manufacturing method comprising: an arranging step for performing electronic components.   When the placement step is performed after the housing step and before the welding step, the melting temperature of the inner resin layer and the thermosetting temperature of the thermosetting resin material are higher than the higher temperature. The method of manufacturing an electronic component according to claim 1, wherein the welding step is performed.   3. The method of manufacturing an electronic component according to claim 1, wherein, when the element body includes a liquid, the thermosetting resin material having a thermosetting temperature lower than a boiling point of the liquid is used.   The method for producing an electronic component according to claim 1, wherein the thermosetting resin material having a viscosity before thermosetting of 100 mPa · s or less is used. It has an inner resin layer, a metal layer formed on the outer side of the inner resin layer, and an outer resin layer formed on the outer side of the metal layer. An exterior body,
An element body contained in the exterior body;
A lead member connected to the element body and extending from the element body to the outside of the exterior body via the sealing portion,
An electronic component, wherein a thermosetting resin material after thermosetting is disposed between the lead member and the inner resin layer at least in the sealing portion.

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