JP2010523317A5 - - Google Patents
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- Publication number
- JP2010523317A5 JP2010523317A5 JP2010502233A JP2010502233A JP2010523317A5 JP 2010523317 A5 JP2010523317 A5 JP 2010523317A5 JP 2010502233 A JP2010502233 A JP 2010502233A JP 2010502233 A JP2010502233 A JP 2010502233A JP 2010523317 A5 JP2010523317 A5 JP 2010523317A5
- Authority
- JP
- Japan
- Prior art keywords
- template
- hot melt
- melt adhesive
- pattern
- duplex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004831 Hot glue Substances 0.000 claims 25
- 239000000758 substrate Substances 0.000 claims 10
- 238000000151 deposition Methods 0.000 claims 4
- 238000000926 separation method Methods 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 2
Claims (12)
ホットメルト接着剤の供給源からホットメルト接着剤の供給を受容するダイアダプターと、
前記ダイアダプターからホットメルト接着剤を受容して、該ホットメルト接着剤を第1のパターンで基材上に堆積させる第1の型板と、
前記ダイアダプターからホットメルト接着剤を受容して、該ホットメルト接着剤を第2のパターンで前記基材上に堆積させる第2の型板と、
前記第1の型板と前記第2の型板とを互いに分離しつつ、前記第1と第2のパターンの前記ホットメルト接着剤が、重畳パターンに従って、前記基材上に堆積されることを可能とする、前記第1の型板と前記第2の型板との間に介在した分離板とを具備し、
前記ホットメルト接着剤の前記第1と第2のパターンのうち第1のパターンの一部が、前記ホットメルト接着剤の前記第1と第2のパターンのうち第2のパターンの一部に重なり合うようにした複式型板組立体。 A duplex template assembly for use in connection with a hot melt adhesive supply system for depositing a hot melt adhesive on a substrate according to a predetermined pattern comprising:
A die adapter for receiving a supply of hot melt adhesive from a source of hot melt adhesive;
Receiving a hot melt adhesive from the die adapter and depositing the hot melt adhesive in a first pattern on a substrate;
Receiving a hot melt adhesive from the die adapter and depositing the hot melt adhesive in a second pattern on the substrate;
The hot melt adhesive of the first and second patterns is deposited on the substrate according to a superimposed pattern while separating the first template and the second template from each other. Enabling a separation plate interposed between the first template and the second template,
A part of the first pattern of the first and second patterns of the hot melt adhesive overlaps a part of the second pattern of the first and second patterns of the hot melt adhesive. A duplex template assembly.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90753507P | 2007-04-06 | 2007-04-06 | |
US60/907,535 | 2007-04-06 | ||
US12/073,374 US10137472B2 (en) | 2007-04-06 | 2008-03-05 | Dual pattern shim assembly for use in conjunction with hot melt adhesive dispensing systems |
US12/073,374 | 2008-03-05 | ||
PCT/US2008/058887 WO2008124367A1 (en) | 2007-04-06 | 2008-03-31 | Dual pattern shim assembly for use in conjunction with hot melt adhesive dispensing systems |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010523317A JP2010523317A (en) | 2010-07-15 |
JP2010523317A5 true JP2010523317A5 (en) | 2011-05-19 |
JP5731191B2 JP5731191B2 (en) | 2015-06-10 |
Family
ID=39825854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010502233A Active JP5731191B2 (en) | 2007-04-06 | 2008-03-31 | Duplex template assembly for use in connection with a hot melt adhesive supply system. |
Country Status (10)
Country | Link |
---|---|
US (1) | US10137472B2 (en) |
EP (1) | EP2144708B1 (en) |
JP (1) | JP5731191B2 (en) |
KR (1) | KR20090129457A (en) |
CN (2) | CN105728261B (en) |
BR (1) | BRPI0809914B1 (en) |
MX (1) | MX2009010821A (en) |
PL (1) | PL2144708T3 (en) |
RU (1) | RU2432213C2 (en) |
WO (1) | WO2008124367A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10137472B2 (en) * | 2007-04-06 | 2018-11-27 | Illinois Tool Works Inc. | Dual pattern shim assembly for use in conjunction with hot melt adhesive dispensing systems |
US8186296B2 (en) | 2010-05-05 | 2012-05-29 | The Procter & Gamble Company | Methods and apparatus for applying adhesives in patterns to an advancing substrate |
JP5315453B1 (en) * | 2012-03-07 | 2013-10-16 | 日東電工株式会社 | Shim member, die coater and coating film manufacturing method |
US9034425B2 (en) | 2012-04-11 | 2015-05-19 | Nordson Corporation | Method and apparatus for applying adhesive on an elastic strand in a personal disposable hygiene product |
US9682392B2 (en) | 2012-04-11 | 2017-06-20 | Nordson Corporation | Method for applying varying amounts or types of adhesive on an elastic strand |
US9265672B2 (en) | 2012-11-27 | 2016-02-23 | The Procter & Gamble Company | Methods and apparatus for applying adhesives in patterns to an advancing substrate |
US9295590B2 (en) | 2012-11-27 | 2016-03-29 | The Procter & Gamble Company | Method and apparatus for applying an elastic material to a moving substrate in a curved path |
US9248054B2 (en) | 2012-11-27 | 2016-02-02 | The Procter & Gamble Company | Methods and apparatus for making elastic laminates |
US10150136B2 (en) | 2014-06-10 | 2018-12-11 | Illinois Tool Works Inc. | Rapid changeover slot die assembly for a fluid application device |
US9724722B2 (en) * | 2014-06-10 | 2017-08-08 | Illinois Tool Works Inc. | Rapid changeover slot die assembly for a fluid application device |
US9718085B2 (en) * | 2015-04-20 | 2017-08-01 | Illinois Tool Works Inc. | Hot melt adhesive applicator system with small footprint |
US10081022B2 (en) | 2015-09-15 | 2018-09-25 | Illinois Tool Works Inc. | Die mounted contact applicator |
US9889599B2 (en) * | 2015-09-15 | 2018-02-13 | Illinois Tool Works Inc. | Multi-temperature contact applicator |
FR3054771B1 (en) * | 2016-07-27 | 2020-11-06 | Saint Gobain | GLASS EQUIPPED WITH AN ELECTRIC CONDUCTIVE DEVICE WITH IMPROVED WELDING ZONES |
WO2018048968A1 (en) | 2016-09-08 | 2018-03-15 | Nordson Corporation | Active adhesive recirculation regulation |
ES2676356B1 (en) * | 2017-01-18 | 2019-05-14 | Valco Melton S L U | HEAD FOR THE APPLICATION OF THERMOPHUSTIC ADHESIVE |
CN112718381B (en) * | 2019-10-14 | 2021-12-10 | 怡定兴科技股份有限公司 | Slit type coating die head and slit type coating device |
EP3825012A1 (en) * | 2019-11-22 | 2021-05-26 | Bostik Sa | Use of a blank shim plate for preventing drooling in die slot coating |
JP2021154195A (en) * | 2020-03-26 | 2021-10-07 | ノードソン コーポレーションNordson Corporation | Nozzle, adhesive application head, adhesive application device, and diaper manufacturing method |
CN113769490B (en) * | 2021-08-19 | 2022-12-30 | 江苏鼎盛滤袋有限公司 | Composite hot-melt filter bag and preparation process thereof |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US256496A (en) * | 1882-04-18 | Coffin | ||
US3448183A (en) * | 1966-08-05 | 1969-06-03 | Dow Chemical Co | Method for the preparation of multilayer film |
US4476165A (en) * | 1982-06-07 | 1984-10-09 | Acumeter Laboratories, Inc. | Method of and apparatus for multi-layer viscous fluid deposition such as for the application of adhesives and the like |
US4774109A (en) | 1987-07-21 | 1988-09-27 | Nordson Corporation | Method and apparatus for applying narrow, closely spaced beads of viscous liquid to a substrate |
JPH0639824Y2 (en) | 1990-02-24 | 1994-10-19 | アイカ工業株式会社 | Coating device |
US5728430A (en) * | 1995-06-07 | 1998-03-17 | Avery Dennison Corporation | Method for multilayer coating using pressure gradient regulation |
US5871585A (en) | 1996-03-20 | 1999-02-16 | Minnesota Mining And Maufacturing Company | Apparatus for applying a fluid to a moving web of material |
JPH10277460A (en) * | 1997-04-07 | 1998-10-20 | Matsushita Electric Ind Co Ltd | Coater |
JPH11226469A (en) | 1998-02-16 | 1999-08-24 | Nitto Denko Corp | Stripe coating method, adhesive tape production, and stripe coating die |
US6601741B2 (en) | 2001-11-28 | 2003-08-05 | Illinois Tool Works Inc. | Laminated distribution manifold plate system |
JP2003275651A (en) | 2002-03-20 | 2003-09-30 | Hitachi Maxell Ltd | Coating machine |
US7152815B2 (en) | 2003-06-04 | 2006-12-26 | Nordson Corporation | Dispensing system, nozzle and method for independently dispensing and controlling liquid |
JP4767482B2 (en) | 2003-07-08 | 2011-09-07 | ノードソン コーポレーション | Liquid or melt application method and nozzle |
JP4573550B2 (en) | 2004-03-23 | 2010-11-04 | 東レエンジニアリング株式会社 | Coating equipment |
JP2006015235A (en) | 2004-07-01 | 2006-01-19 | Nordson Corp | Slot die, method of charging liquid into porous material, method of treating fringe of porous wooden board, chipboard and particle board |
JP4682565B2 (en) | 2004-09-06 | 2011-05-11 | パナソニック電工株式会社 | Coating head, coating device using the same, and bonding device |
US10137472B2 (en) * | 2007-04-06 | 2018-11-27 | Illinois Tool Works Inc. | Dual pattern shim assembly for use in conjunction with hot melt adhesive dispensing systems |
-
2008
- 2008-03-05 US US12/073,374 patent/US10137472B2/en active Active
- 2008-03-31 JP JP2010502233A patent/JP5731191B2/en active Active
- 2008-03-31 WO PCT/US2008/058887 patent/WO2008124367A1/en active Application Filing
- 2008-03-31 BR BRPI0809914A patent/BRPI0809914B1/en active IP Right Grant
- 2008-03-31 CN CN201610119045.XA patent/CN105728261B/en active Active
- 2008-03-31 CN CN200880014488A patent/CN101678385A/en active Pending
- 2008-03-31 PL PL08744766T patent/PL2144708T3/en unknown
- 2008-03-31 MX MX2009010821A patent/MX2009010821A/en active IP Right Grant
- 2008-03-31 KR KR1020097020894A patent/KR20090129457A/en not_active Application Discontinuation
- 2008-03-31 EP EP08744766.0A patent/EP2144708B1/en active Active
- 2008-03-31 RU RU2009140972/05A patent/RU2432213C2/en active
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