JP2010510653A - Board-on-chip package and manufacturing method thereof - Google Patents
Board-on-chip package and manufacturing method thereof Download PDFInfo
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- JP2010510653A JP2010510653A JP2009537126A JP2009537126A JP2010510653A JP 2010510653 A JP2010510653 A JP 2010510653A JP 2009537126 A JP2009537126 A JP 2009537126A JP 2009537126 A JP2009537126 A JP 2009537126A JP 2010510653 A JP2010510653 A JP 2010510653A
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Images
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Abstract
ボードオンチップ(BOC)型半導体パッケージは、開口部を有する基材および活性面上に導電領域を有する半導体ダイを含む。活性面が基材の上側面に面し、基材の開口部を完全に被覆するように、基材にダイを載せる。ダイの活性面の導電領域は、基材の開口部に露出する。接着剤を用いてダイを基材に接合させ、基材の開口部を介して、ワイヤボンドで基材に電気的に結合させる。基材の開口部を充填する封止材で、ワイヤボンドを保護する。封止材の外側領域で基材の下側面に、はんだボールを埋め込む。パッケージは、ダイの非活性側に封止材が存在しない、およびダイの側方に封止材が存在しないことを特徴とする。A board on chip (BOC) type semiconductor package includes a substrate having an opening and a semiconductor die having a conductive region on an active surface. The die is placed on the substrate so that the active surface faces the upper surface of the substrate and completely covers the opening of the substrate. The conductive area of the active surface of the die is exposed at the opening of the substrate. The die is bonded to the substrate using an adhesive, and is electrically bonded to the substrate by wire bonding through the opening of the substrate. The wire bond is protected by a sealing material that fills the opening of the substrate. Solder balls are embedded in the lower surface of the substrate in the outer region of the encapsulant. The package is characterized in that no encapsulant is present on the inactive side of the die and no encapsulant is present on the side of the die.
Description
本発明の分野
本発明は半導体パッケージおよびその製造方法に関する。
The present invention relates to a semiconductor package and a method for manufacturing the same.
本発明の背景
DRAM(ダイナミック・ランダム・アクセス・メモリ)メモリーデバイスの半導体パッケージ技術における近年の成果は、ボードオンチップまたはBOCパッケージである。これらのパッケージは、ウィンドウ型半導体パッケージとも呼ばれ、基材を貫通する開口部を有して成る基材を含み、半導体チップまたはダイを、接着材によって、基材の上側面上の開口部の上にフェースダウン方式で載せて、チップの活性(またはアクティブ)面が基材の方に面し、部分的に開口部に露出するようにする。複数のボンディングワイヤは、ダイの活性面を、開口部を介して、基材の下側面に接続する。第1封止材を基材の下側面に形成して、開口部を充填してボンディングワイヤを封止し、基材の上側面上に第2封止材を形成して、チップの裏側および/または側方を封止する。複数のはんだボールを基材の下側面に取り付け、第1封止材の外側に配置する。
BACKGROUND OF THE INVENTION A recent achievement in semiconductor packaging technology for DRAM (Dynamic Random Access Memory) memory devices is a board-on-chip or BOC package. These packages, also called window-type semiconductor packages, include a substrate having an opening that penetrates the substrate, and the semiconductor chip or die is bonded to the opening on the upper side of the substrate by an adhesive. The chip is mounted face down so that the active (or active) surface of the chip faces the substrate and is partially exposed to the opening. The plurality of bonding wires connect the active surface of the die to the lower surface of the substrate through the opening. Forming a first encapsulant on the lower surface of the substrate, filling the opening to seal the bonding wire, forming a second encapsulant on the upper surface of the substrate, Seal the sides. A plurality of solder balls are attached to the lower surface of the base material and disposed outside the first sealing material.
実際には、BOCパッケージを、少なくとも2つの異なる方法を用いて製造できる。1つの方法では、印刷可能な接着剤ペーストを基材に適用し、ダイ取付前に、Bステージにして非粘着状態にする。一般的に、複数のダイを単一の基材上に載せて、複数のパッケージを単一のボードで作れるようにする。モールディングおよびはんだボールの取付後、パッケージを互いに分離して、単一のパッケージを製造する。図1はこの方法の一般的な態様におけるパッケージの上面図を示し、図2はその断面図を示しており、ダイ11を基材10の開口部100の上に載せることができるパターンで、接着剤12を基材10の上側面101上に印刷する。ダイ11を接着剤12の上に取り付けた後、ワイヤボンド13を、開口部100を介して、ダイ11の活性側111上のワイヤボンドパッド112から、基材10の裏側102に形成する。
In practice, the BOC package can be manufactured using at least two different methods. In one method, a printable adhesive paste is applied to the substrate and placed in a B-stage prior to die attachment to a non-tacky state. In general, multiple dies are mounted on a single substrate so that multiple packages can be made on a single board. After the molding and solder ball installation, the packages are separated from each other to produce a single package. FIG. 1 shows a top view of a package in a general embodiment of the method, and FIG. 2 shows a cross-sectional view thereof, with a pattern in which a
モールド工程において、封止材15をワイヤボンド13、ダイ11の非活性側110、およびダイ11の側方113に適用する。モールディング後、はんだボール14を基材10の裏側102に取り付け、切断操作でパッケージを互いに分離する。図3は、この方法のもう1つの一般的な態様を表すパッケージの断面を示しており、ダイ11の非活性側110は封止されていないが、ダイ11の側方113は封止されている。
In the molding process, the
この従来の方法は、いくつかの欠点を有する。図1および2に示すように、接着剤12は、開口部100の全周辺部に沿って印刷されず、ダイ11の活性面111と基材10の上側面101との間に隙間Gが残る。接着剤12中の隙間Gは、ダイの非活性側および/または側方に、封止材15を用いることを必要とするが、ワイヤボンド13を封止する間、封止材15は、基材10とダイ11との間を流れ、ダイ11の側方113および非活性側110に沿って流れ出す。更に、ダイ11の非活性側110および/または側方113はモールド材料内に封入され、その広大なモールド領域が、モールド工程に固有の熱応力によって、結果的に基材を反らせ得る。このことは、モールド工程の間、基材の応力を解放できる構造にダイを配置することを必要とする。
This conventional method has several drawbacks. As shown in FIGS. 1 and 2, the
図4Aは、単一基材10から複数のパッケージを製造することを可能にする、一般的な構造を示す。この構造では、接着剤12を基材10の開口部100の周辺領域に印刷して、後から開口部100を覆うようにダイを接着剤12上に載せることができる。この構造では、モールドされるパッケージのブロック間に、モールドされない基材領域を組み込むことによって応力を解放しており、モールドしたパッケージのブロック間の領域では、基材10にスリット104が含まれる。図4Bはこの構造の拡大図であり、スリット104によって提供される応力解放領域は、メモリパッケージ自身が必要とするよりも、かなり広い基材領域を使用する必要があることを示す。基材10は、メモリパッケージに用いられる高価な材料の1つであるため、このムダは非常に望ましくない。最後に、モールド工程に固有の温度および圧力は、半導体ダイ上に熱応力を与え、歩留まりを低くさせ得る。
FIG. 4A shows a general structure that allows multiple packages to be manufactured from a
図5は、第2の方法を用いて製造したBOCパッケージの上面図で、図6はその断面図である。この方法では、基材の開口部100に対応する場所に穴を有するテープ接着剤17を、基材10の上側面101のテープ取り付け領域105の上に貼り付けて、接着テープの穴を、基材の開口部と整列させる。このようにして、接着テープ17を、ダイ11と基材10との間に一切隙間を形成することなく、ダイ11の活性面111と基材の上側面101との間に介在させる。ダイ11をテープ接着剤17の上に取り付けた後、ワイヤボンド13を、開口部100を介して、ダイ11の活性側111のワイヤボンドパッド112から、基材10の裏側102に形成する。次に1つの工程で、封止材15をワイヤボンド13の上に適用し、モールド工程において、第2封止材16をダイ11の側方113上に適用する。モールド後、はんだボール14を基材10の裏側102に取り付け、切断工程でパッケージを互いに分離させる。
FIG. 5 is a top view of a BOC package manufactured using the second method, and FIG. 6 is a cross-sectional view thereof. In this method, a
もう1つの態様において、封止材をダイの非活性側とダイの側方に適用する。この方法は、接着剤によって被覆されず、基材の開口部に隣接する領域に起因する、ダイの活性面と基材の上側面との間の隙間の問題を解決するが、重大な欠点を有する。第1に、テープ接着剤の使用は、印刷可能なペーストなどの流動可能接着剤よりも、はるかに高価である。第2に、ダイをテープの上に完璧に整列させて配置することはできないこともあり、ダイの下に幾らかの隙間を存在させてしまう。最後にこの方法は、モールド工程において、ダイの側方および/または裏側を封止する必要がある。従って、上記に記載した方法のように、著しい基材のムダおよびダイにおける熱応力を伴う。 In another embodiment, encapsulant is applied to the non-active side of the die and the sides of the die. This method solves the problem of the gap between the active surface of the die and the upper surface of the substrate due to the area adjacent to the substrate opening, which is not covered by the adhesive, but has a significant drawback. Have. First, the use of tape adhesives is much more expensive than flowable adhesives such as printable pastes. Second, the die may not be perfectly aligned on the tape, leaving some gaps under the die. Finally, this method requires that the sides and / or back side of the die be sealed during the molding process. Thus, as with the method described above, it involves significant substrate waste and die thermal stress.
ダイ取り付け用の流動性ペーストを用いて、ダイの活性面と基材の上側面との間の隙間を消失させること、基材のムダを減少させること、ダイの裏側および/または側方を封止するために用いられるモールド工程の間に、ダイに生じる熱応力を消失させることを可能にすることによって、これら両方の方法の欠点を克服する半導体パッケージおよびそのパッケージの製造方法を有することは、非常に有用である。 The flowable paste for die attachment is used to eliminate gaps between the active surface of the die and the top side of the substrate, to reduce substrate waste, and to seal the back and / or sides of the die. Having a semiconductor package and a method of manufacturing the package that overcomes the disadvantages of both methods by allowing the thermal stress generated in the die to be eliminated during the molding process used to stop, Very useful.
本発明の概要
本発明は、a)上側面、上側面に対向する下側面、上側面および下側面を貫通する開口部、および下側面上のワイヤボンドパッドを有する基材(または基板)、b)1つまたはそれより多くの導電領域を有する活性側(active side)、および活性側に対向する非活性側(inactive side)を有する半導体ダイであって、活性側が、基材の上側面および下側面を貫通する開口部の上に配置され、開口部を完全に覆っている、基材上に載せられている半導体ダイ、c)基材の上側面とダイの活性側との間に配置され、それらを結合する接着剤であって、導電領域を除き、ダイの活性側が接着剤によって完全に被覆される接着剤、d)ダイの活性側上の導電領域を、基材の開口部を介して、基材の下側面上のワイヤボンドパッドに接続する、複数の導電性ボンディングワイヤ、e)基材の下側面上に適用され、ボンディングワイヤを封止し、基材の開口部を充填する封止材、およびf)封止材の外側領域で基材の下側面上に埋め込まれている複数のはんだボールを含んで成る半導体パッケージであって、ダイの非活性側上に封止材が存在しないこと、およびダイの側方に封止材が存在しないことを特徴とする、半導体パッケージである。
SUMMARY OF THE INVENTION The present invention comprises: a) a substrate (or substrate) having an upper side, a lower side opposite the upper side, an opening through the upper side and the lower side, and a wire bond pad on the lower side; b ) A semiconductor die having an active side having one or more conductive regions and an inactive side opposite the active side, the active side being the upper side and the lower side of the substrate A semiconductor die placed on the substrate, placed over the opening penetrating the side and completely covering the opening; c) placed between the upper side of the substrate and the active side of the die An adhesive that joins them, except for the conductive area, the active side of the die being completely covered by the adhesive, d) the conductive area on the active side of the die through the opening in the substrate On the bottom side of the substrate. A plurality of conductive bonding wires connected to the bond pads, e) applied on the underside of the substrate, sealing the bonding wires and filling the openings in the substrate, and f) of the sealing material A semiconductor package comprising a plurality of solder balls embedded on the underside of the substrate in the outer region, wherein no encapsulant is present on the non-active side of the die and sealed to the side of the die The semiconductor package is characterized in that no stopper is present.
もう1つの態様において、本発明は、a)上側面、上側面に対向する下側面、上側面および下側面を貫通する開口部、および下側面上にワイヤボンドパッドを有する基材を準備し、b)1つまたはそれより多くの導電領域を有する活性側、および活性側に対向する非活性側を有する、少なくとも1つの半導体ダイを準備し、c)ダイを基材に取り付けた後で、接着剤が、開口部を取り囲み、開口部を含めてダイの設置面積と少なくとも同じ大きさを有するように、基材の上側面上に接着剤パターンで流動可能接着剤を適用して、d)任意で、流動可能接着剤を固化させ、非粘着状態とし、e)ダイを基材上に載せて、活性側が、基材の上側面および下側面を貫通する開口部の上に配置され、開口部を完全に被覆しており、ダイの活性面上の導電領域は基材の開口部に露出して、ダイの活性面は、導電領域を除き、接着剤によって完全に被覆されるようにし、f)任意で、接着剤を硬化させ、g)複数の導電性ボンディングワイヤを取り付けて、ダイの活性側上の導電領域を、基材の開口部を介して、基材の下側面上のワイヤボンドパッドに接続し、h)基材の下側面上に封止材を適用して、ボンディングワイヤを封止し、基材の開口部を充填し、i)封止材を硬化させ、およびj)封止材の外側領域で基材の下側面上に、複数のはんだボールを埋め込むことを含む、半導体パッケージの製造方法であって、ダイの非活性側に対する封止工程が存在しないこと、およびダイの側方に対する封止工程が存在しないことを特徴とする、半導体パッケージの製造方法である。 In another aspect, the present invention provides: a) a substrate having an upper side, a lower side opposite the upper side, an opening extending through the upper side and the lower side, and a wire bond pad on the lower side; b) providing at least one semiconductor die having an active side having one or more conductive regions and a non-active side opposite the active side; c) bonding after the die is attached to the substrate Apply flowable adhesive in an adhesive pattern on the upper side of the substrate so that the agent surrounds the opening and has at least the same size as the die footprint, including the opening, d) optional E) solidify the flowable adhesive to a non-tacky state, e) place the die on the substrate, the active side is placed over the opening through the upper and lower sides of the substrate, and the opening Completely covering the active surface of the die. The areas are exposed at the substrate openings, and the active surface of the die is completely covered by the adhesive, except for the conductive areas, f) optionally the adhesive is cured, and g) multiple conductive A conductive bonding wire is attached and the conductive area on the active side of the die is connected to the wire bond pad on the lower side of the substrate through the opening in the substrate, and h) sealed on the lower side of the substrate. Apply a stop to seal the bonding wire, fill the opening in the substrate, i) cure the seal, and j) on the underside of the substrate in the outer region of the seal, A method of manufacturing a semiconductor package comprising embedding a plurality of solder balls, characterized in that there is no sealing step for the inactive side of the die and no sealing step for the side of the die. A method for manufacturing a semiconductor package.
第3の態様において、本発明は、a)上側面、上側面に対向する下側面、上側および下側面を貫通する開口部、および下側面上にワイヤボンドパッドを有する基材を準備し、b)1つまたはそれより多くの導電領域を有する活性側、および活性側に対向する非活性側を有する、少なくとも1つの半導体ダイを準備し、c)ダイを基材に取り付けた後で、接着剤が、開口部を取り囲み、開口部を含めてダイの設置面積と少なくとも同じ大きさを有するように、ダイの活性側上に接着剤パターンで、流動可能接着剤を適用して、d)任意で、流動可能接着剤を固化させ、非粘着状態とし、e)ダイを基材上に載せて、活性側が、基材の上側および下側面を貫通する開口部の上に配置され、開口部を完全に被覆しており、ダイの活性面上の導電領域は基材の開口部に露出して、ダイの活性面は、導電領域を除き、接着剤によって完全に被覆されるようにし、f)任意で、接着剤を硬化させ、g)複数の導電性ボンディングワイヤを取り付けて、ダイの活性側上の導電領域を、基材の開口部を介して、基材の下側面上のワイヤボンドパッドに接続し、h)基材の下側面上に封止材を適用して、ボンディングワイヤを封止し、基材の開口部を充填し、i)封止材を硬化させ、およびj)封止材の外側領域で基材の下側面上に、複数のはんだボールを埋め込むことを含む、半導体パッケージの製造方法であって、ダイの非活性側に対する封止工程が存在しないこと、およびダイの側方に対する封止工程が存在しないことを特徴とする、半導体パッケージの製造方法である。 In a third aspect, the present invention provides: a) a substrate having an upper side, a lower side opposite the upper side, an opening penetrating the upper side and the lower side, and a wire bond pad on the lower side; b Adhesive) after providing at least one semiconductor die having an active side having one or more conductive regions and a non-active side opposite the active side, and c) attaching the die to the substrate Applying a flowable adhesive in an adhesive pattern on the active side of the die so that it surrounds the opening and has at least the same size as the die footprint, including the opening, and d) optionally E) solidify the flowable adhesive to a non-tacky state, e) place the die on the substrate, the active side is placed over the opening through the upper and lower sides of the substrate, and the opening is completely And conductive areas on the active surface of the die Exposed at the substrate opening, the active surface of the die is completely covered by the adhesive, except for the conductive areas, f) optionally, the adhesive is cured, and g) a plurality of conductive bonds. Attach the wire and connect the conductive area on the active side of the die to the wire bond pad on the lower side of the substrate through the opening in the substrate, h) the encapsulant on the lower side of the substrate Applying a plurality of seals to the bonding wire, filling the openings in the substrate, i) curing the sealant, and j) a plurality of surfaces on the lower surface of the substrate in the outer region of the sealant A method of manufacturing a semiconductor package comprising embedding solder balls, characterized in that there is no sealing step for the non-active side of the die and there is no sealing step for the side of the die It is a manufacturing method of a package.
第4の態様において、本発明は、表側面、表側面に対向する裏側面、ならびに表側面および裏側面を貫通する開口部を含む、ボードオンチップ半導体パッケージを製造するための基材であって、モールド応力解放領域が存在しないことを特徴とする基材である。 In a fourth aspect, the present invention is a base material for manufacturing a board-on-chip semiconductor package, comprising a front side surface, a back side surface facing the front side surface, and an opening penetrating the front side surface and the back side surface. The base material is characterized in that there is no mold stress release region.
添付図を参照して、下記の詳細な説明を読むことによって、本発明をより充分に理解することができる。 The present invention can be more fully understood by reading the following detailed description with reference to the accompanying drawings.
定義事項
本明細書で用いる場合、“アルキル”なる用語は、炭素原子が1〜24の分岐または非分岐の飽和炭化水素基を示し、例えば、メチル(“Me”)、エチル(“Et”)、n−プロピル、イソプロピル、n−ブチル、イソブチル、t−ブチル、オクチル、デシルなどである。
Definitions As used herein, the term “alkyl” refers to a branched or unbranched saturated hydrocarbon group having from 1 to 24 carbon atoms, for example, methyl (“Me”), ethyl (“Et”) , N-propyl, isopropyl, n-butyl, isobutyl, t-butyl, octyl, decyl and the like.
本明細書で用いる場合、化合物、生成物、または組成物の“有効量”なる用語は、望ましい結果を提供するための化合物、生成物、または組成物の充分な量を意味する。下記で指摘するように、必要とされる正確な量はパッケージ毎に、用いる特定の化合物、生成物または組成物、その使用方法などに応じて変化する。従って、常に正確な量を特定できるとは限らない。しかしながら、当業者が日常的な実験のみで、有効量を決定できる。 As used herein, the term “effective amount” of a compound, product, or composition means a sufficient amount of the compound, product, or composition to provide the desired result. As pointed out below, the exact amount required will vary from package to package, depending on the particular compound, product or composition used, its method of use, and the like. Therefore, it is not always possible to specify an accurate amount. However, an effective amount can be determined by one of ordinary skill in the art using only routine experimentation.
本明細書で用いる場合、“適当”なる用語を用いて、所定の目的に対して、化合物、生成物、または組成物と相性の良いものを意味する。当業者が日常的な実験のみで、所定の目的に対する適合性を決定できる。 As used herein, the term “suitable” is used to mean something that is compatible with a compound, product, or composition for a given purpose. One of ordinary skill in the art can determine suitability for a given purpose only through routine experimentation.
本明細書で用いる場合、“置換(substituted)”を用いて、炭素または適当なヘテロ原子が除去されて他の部分(または基、moiety)と置き換えられる水素または他の原子を有することを一般的に意味する。更に、“置換”は、本発明で使用する下記の化合物、生成物、または組成物の基本的かつ新規な有用性を変化させない置換を意味することを、意図している。 As used herein, “substituted” is generally used to have hydrogen or other atoms in which a carbon or appropriate heteroatom is removed and replaced with another moiety (or group, moiety). Means to. Furthermore, “substitution” is intended to mean a substitution that does not alter the basic and novel utility of the following compounds, products, or compositions used in the present invention.
本明細書で用いる場合、“Bステージ化”(およびその変形語または派生語)を用いて、加熱または照射による材料の処理を示しており、もし、材料が溶媒に溶解または分散しているならば、材料を部分的に硬化させながらまたはさせないで溶媒を蒸発させて、もし、材料が溶媒を有することなく、そのままであるならば、材料を部分的に硬化させて、粘着性を有する状態とする、またはより固化した状態にする。もし材料が流動可能接着剤であるならば、Bステージ化は、完全に硬化させることなく、非常に低い流動性を与え、接着剤を用いて或る物品をもう1つのものに接合させた後、更なる硬化を行なってよい。流動性の低下は、溶媒の蒸発、樹脂もしくはポリマーの部分的な成長または硬化あるいはその両方によって実行されてよい。 As used herein, “B-staging” (and variants or derivatives thereof) is used to indicate processing of a material by heating or irradiation, if the material is dissolved or dispersed in a solvent E.g., evaporating the solvent with or without partially curing the material, and if the material remains as it is without solvent, partially curing the material to have a sticky state Or make it more solidified. If the material is a flowable adhesive, B-staging provides very low flow without fully curing and after bonding one article to another using the adhesive Further curing may be performed. The decrease in fluidity may be effected by solvent evaporation, partial growth or curing of the resin or polymer, or both.
本明細書で用いる場合、“印刷可能なペースト”は、基材、ダイ、またはウェハのような面に印刷することができる任意の液状接着剤である。 As used herein, a “printable paste” is any liquid adhesive that can be printed on a surface such as a substrate, die, or wafer.
本発明の詳細な説明
図7は、本発明に基づく半導体パッケージの1つの態様を図示する上面図を表しており、図8Aは、その断面図を表している。基材20は、上側面201および上側面に対向する下側面202を有しており、基材20の上側面201および下側面202を貫通するように形成される少なくとも1つの開口部200を有する。本発明のために考えられる基材は、限定するわけではないが、BT樹脂、エポキシ樹脂、およびFR−4を含む一般的な樹脂材料で主に作られる、硬質または半硬質(フレキシブルテープではない)である。基材は任意の寸法でよいが、一般的には20mm×100mmと100mm×250mmとの間で、0.1と0.6mmとの間の厚さである。
DETAILED DESCRIPTION OF THE INVENTION FIG. 7 represents a top view illustrating one embodiment of a semiconductor package according to the present invention, and FIG. 8A represents a cross-sectional view thereof. The
1つの態様では、接着剤適用(または塗布)領域206は、開口部付近で基材20の上側面201上に規定され、領域206は、開口部を含めて、ダイの設置面積と少なくとも同じ広さである。
In one aspect, an adhesive application (or application)
1つの態様では、基材はモールド時の応力解放領域を有しないように設計される。図11は、基材を構成できる1つの実施例の上面図を図示しており、基材20は、表側面201および表側面に対向する裏側面を有しており、表側面201および裏側面202を貫通し、そこを通ってワイヤボンドを形成することができる開口部200を含む。この基材構造は、モールド応力解放領域が存在しないことを特徴とする。本発明で説明するパッケージおよび製造方法では、ダイの裏側および/または側方を封止するためのパッケージのモールドは必要ないということによって可能となる、基材領域の節約という同じ利点を有する多くの変更および類似するアレンジメントを、当業者は想到することができる。
In one aspect, the substrate is designed so that it does not have a stress relief region when molded. FIG. 11 illustrates a top view of one embodiment that can constitute a substrate, where the
半導体ダイ21またはチップを基材20に載せて、ダイ21の活性側211を流動可能接着剤22の上に配置して、接着剤22がダイ21の活性面211と基材の上側面201との間に介在するようにする。活性面211は開口部200より大きく、開口部200を完全に覆い、ダイ21の活性面211上の導電領域が基材20の開口部200に露出できる。ダイ21の活性面211は、導電領域を除いて流動可能接着剤22によって完全に被覆され、ダイと基材との間に隙間が形成されない。
The semiconductor die 21 or chip is placed on the
半導体チップまたはダイ21は、任意の寸法および厚さであってよく、例えば、0.05〜0.4mmの範囲の厚さを有するDRAMのようなシリコンIC部品である。他の態様では、ダイ21はシリコンのデジタルシグナルプロセッサであってよく、またはガリウムヒ素、インジウムリンまたは任意の他の半導体材料で作られていてよい。電気要素および回路を形成する活性面211(表側または前側面としても知られる)、および活性面211に対向する非活性面210(裏側または後側面としても知られる)を有する半導体ダイ21を製造する。活性面211は、少なくとも1つの導電領域に形成される複数のワイヤボンドバッド212を有しており、これらはチップの活性面211を、基材20の下側面202上のワイヤボンドパッド203にワイヤボンディングさせて、それらの間に電気接続部を形成するために用いられる。
The semiconductor chip or die 21 may be of any size and thickness, for example, a silicon IC component such as a DRAM having a thickness in the range of 0.05 to 0.4 mm. In other embodiments, the
1つの態様では、半導体ダイは、例えば、ダイの中心および縁の両方といった複数の箇所にボンディングパッドを有する。この態様では、基材は、これらのボンディングパッド位置の各々に対応して複数の開口部を含む。 In one aspect, the semiconductor die has bonding pads at multiple locations, for example, both the center and the edge of the die. In this aspect, the substrate includes a plurality of openings corresponding to each of these bonding pad locations.
接着剤22は、基材20の上側面201をダイ21の活性側211に接合する。ワイヤボンドパッド212を含んでいるダイ21上の導電領域が、基材20の開口部200の上にあって、開口部200を完全に覆うように、ダイ21を基材20に配置する。このようにして、ダイ21と基材20との間に接着剤被覆隙間が存在しないように、ダイ21を基材20に取り付けるが、導電領域に含有されるボンドパッド212上に、ワイヤボンド23を形成することができるように、導電領域を露出させる。
The adhesive 22 joins the
1つの態様では、基材20の上側面201に、接着剤22を適用する。もう1つの態様では、ウェハからのダイシング(singulation、個別切断)前に、ダイ21の活性側211に、接着剤22を適用する。もう1つの態様では、ウェハからのダイシング後に、ダイ21の活性側211に、接着剤22を適用する。
In one embodiment, the adhesive 22 is applied to the
限定するわけではないが、ステンシル印刷、スクリーン印刷、インクジェット印刷、または他の同様の印刷、スプレッディング(spreading)、ディスペンシング(dispensing)、または噴霧方法を含む、流動可能接着剤を使用する任意の方法を用いて、ダイ21または基材20のいずれか一方に、接着剤22を適用してよい。ダイ21を基材20に取り付けた後、接着剤22が、導電領域を除き、ダイ21の活性面211を完全に被覆するようなパターンで、接着剤22を適用する。導電領域は接着剤22が存在しない状態で、基材20の開口部200と整列することができ、導電領域に含まれるボンドパッド212にワイヤボンディングすることができる。ダイを覆うのに必要な接着剤の量および特定の印刷パターンは、接着剤の流動性、ボンディング圧力、および他の同様のパラメータに依存し、必要以上に実験を行なうことなく、当業者は決定できる。接着剤の厚さは、湿潤状態では、一般的に10〜250ミクロンである。
Any using flowable adhesives including, but not limited to, stencil printing, screen printing, inkjet printing, or other similar printing, spreading, dispensing, or spraying methods The adhesive 22 may be applied to either the die 21 or the
図12Aは、本発明の1つの態様における基材20上の印刷パターンを図示しており、接着剤22を基材20の上側面201に適用し、接着剤22が基材20の開口部200を完全に囲み、ダイの設置面積と少なくとも同じ広さを有するようにするが、基材20の上側面201を必ずしも完全には被覆していない。接着剤の使用を最小限にするために、この態様を用いることができる。この種類の印刷パターンは、図8Aの断面図に示されるようなパッケージとなり、接着剤22は、ダイ21の外側縁まで、または縁をごく僅か越えて延在する。
FIG. 12A illustrates a printed pattern on the
図12Bは、本発明の1つの態様における、基材20上の印刷パターンを図示しており、接着剤22を、開口部200を除く基材20全体の上側面201に適用している。図12Aに示されるパターンの場合よりも、より少ない個別の印刷要素が必要となるので、印刷工程を簡略化するために、この態様を用いることができる。図12Bに図示される印刷パターンは、図8Bの断面図に示されるパッケージとなり、接着剤22は、ダイ21の外側縁を十分に超えて延在する。
FIG. 12B illustrates a printed pattern on the
図10は、本発明のもう1つの態様における印刷パターンを図示しており、基材の開口部上で整列するように露出するダイの導電領域を残す、接着剤が無い導電領域Vを除くウェハ(従って、ウェハをダイシングした後の全てのダイ)を覆うパターンで、接着剤22をウェハ26の活性面211に適用している。
FIG. 10 illustrates a printed pattern in another aspect of the present invention, excluding the conductive area V without adhesive, leaving the conductive areas of the die exposed to align over the openings in the substrate. Therefore, the adhesive 22 is applied to the
ダイを取り付けるために用いられる接着剤は、基材またはウェハに適用する時、流動可能でなければならず、接着剤をステンシル印刷、スクリーン印刷、インクジェット印刷、または他の同様の印刷、スプレッディング、ディスペンシングまたは噴霧方法を介して適用することができる。接着剤は、基材に予備形成物として適用される、ラミネートされる、またはパンチされるような既成のフィルムまたはテープではない。ウェハまたはダイのいずれかに適用した後、接着剤を固化、またはBステージ化、または硬化させることができ、上記に列挙した適用方法に適当な流動性をもはや有さないようになる。 The adhesive used to attach the die must be flowable when applied to a substrate or wafer, and the adhesive can be stencil printed, screen printed, inkjet printed, or other similar printing, spreading, It can be applied via dispensing or spraying methods. Adhesives are not preformed films or tapes that are applied, preformed, laminated, or punched to a substrate. After application to either the wafer or die, the adhesive can be solidified, B-staged, or cured, and no longer has the proper fluidity for the application methods listed above.
1つの態様では、接着剤は印刷可能なペーストである。 In one aspect, the adhesive is a printable paste.
適当な接着剤の選択は、ダイの種類および寸法、基材の種類、パッケージ形状、ならびにリフロー温度および要求される信頼性のような下流の製造因子に基づく。接着剤は一般的にいくつかの種類のポリマーまたは硬化性樹脂を含み、それらには熱可塑性樹脂、熱硬化性樹脂、エラストマー、熱硬化性ゴム、またはこれらの組み合わせが含まれる。接着剤は、溶媒を含んでも、含まなくてもよい。ポリマーまたは硬化性樹脂は、存在し得る充填材を除き、一般的に主成分である。一般的に接着剤組成物に用いられる他の成分を、当業者の裁量で添加してよく、そのような他の成分には、限定するわけではないが、硬化剤、フラックス剤、湿潤剤、流動制御剤、接着促進剤、および脱泡剤が含まれる。硬化剤は、接着剤の硬化を開始、伝播、促進させる任意の材料または材料の組み合わせであり、促進剤、触媒、開始剤、および固化剤(hardeners)が含まれる。接着剤組成物は充填材も含んでよく、その場合、充填材は組成物全体の95%以下の量で存在する。 The selection of an appropriate adhesive is based on downstream manufacturing factors such as die type and dimensions, substrate type, package shape, and reflow temperature and required reliability. Adhesives typically include several types of polymers or curable resins, including thermoplastic resins, thermosetting resins, elastomers, thermosetting rubbers, or combinations thereof. The adhesive may or may not contain a solvent. The polymer or curable resin is generally the major component, except for fillers that may be present. Other ingredients commonly used in adhesive compositions may be added at the discretion of one of ordinary skill in the art and include, but are not limited to, curing agents, fluxing agents, wetting agents, Flow control agents, adhesion promoters, and defoamers are included. A curing agent is any material or combination of materials that initiates, propagates, and accelerates the curing of the adhesive and includes accelerators, catalysts, initiators, and hardeners. The adhesive composition may also include a filler, in which case the filler is present in an amount of no more than 95% of the total composition.
接着剤に用いられる樹脂およびポリマーは、固体、液体、またはその2つの組み合わせでよい。適当な樹脂には、エポキシ、アクリレートまたはメタクリレート、マレイミド、ビニルエーテル、ポリエステル、ポリ(ブタジエン)、ポリイミド、ベンゾシクロブテン、シリコーン化オレフィン、シリコーン樹脂、スチレン樹脂、シアネートエステル樹脂、またはポリオレフィン、またはシロキサンが含まれる。 The resin and polymer used for the adhesive may be solid, liquid, or a combination of the two. Suitable resins include epoxy, acrylate or methacrylate, maleimide, vinyl ether, polyester, poly (butadiene), polyimide, benzocyclobutene, siliconized olefin, silicone resin, styrene resin, cyanate ester resin, or polyolefin, or siloxane. It is.
1つの態様では、固体芳香族ビスマレイミド(BMI)樹脂粉末を接着剤に含める。適当な固体BMI樹脂は、
Xは芳香族基であり、代表的な芳香族基には、
基を架橋するこれらXを有するビスマレイミド樹脂は市販されており、例えば、Sartomer(アメリカ合衆国)またはHOS−Technic GmbH(オーストリア)から入手できる。 Bismaleimide resins with these X cross-linking groups are commercially available and are available, for example, from Sartomer (USA) or HOS-Technic GmbH (Austria).
もう1つの態様では、接着剤組成物に用いられるマレイミド樹脂には、一般構造
更なる態様では、マレイミド樹脂は、
(C36は、36の炭素原子数の直線または分岐した鎖(環状部分を伴うまたは伴わない)を示す)、 (C 36 represents a straight or branched chain of 36 carbon atoms (with or without a cyclic moiety)),
適当なアクリレート樹脂には、一般構造
nは1〜6、R1は−Hまたは−CH3であり、X2は芳香族または脂肪族基である。代表的なX2構成要素には、ポリ(ブタジエン)、ポリ(カーボネート)、ポリ(ウレタン)、ポリ(エーテル)、ポリ(エステル)、単純炭化水素、およびカルボニル、カルボキシル、アミド、カルバメート、尿素、またはエーテルのような官能基を含有する単純炭化水素が含まれる。市販の材料には、共栄社化学株式会社から入手可能なブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、イソデシル(メタ)アクリレート、n−ラウリル(メタ)アクリレート、アルキル(メタ)アクリレート、トリデシル(メタ)アクリレート、n−ステアリル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、2−フェノキシエチル(メタ)アクリレート、イソボルニル(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、1,9−ノナンジオールジ(メタ)アクリレート、パーフルオロオクチルエチル(メタ)アクリレート、1,10−デカンジオールジ(メタ)アクリレート、ノニルフェノールポリプロポキシレート(メタ)アクリレート、およびポリペントキシレートテトラヒドロフルフリルアクリレート;Sartomer Company ,Incから入手可能なポリブタジエンウレタンジメタクリレート(CN302、NTX6513)およびポリブタジエンジメタクリレート(CN301、NTX6039、PRO6270);根上工業株式会社から入手可能なポリカーボネートウレタンジアクリレート(ArtResin UN9200A);Radcure Specialities,Incから入手可能なアクリル化脂肪族ウレタンオリゴマー(Ebecryl 230、264、265、270、284、4830、4833、4834、4835、4866、4881、4883、8402、8800−20R、8803、8804);Radcure Specialities,Incから入手可能なポリエステルアクリレートオリゴマー(Ebecryl 657、770、810、830、1657、1810、1830)、およびSartomer Company,Incから入手可能なエポキシアクリレート樹脂(CN104、111、112、115、116、117、118、119、120、124、136)が含まれる。1つの態様では、アクリレート樹脂は、イソボルニルアクリレート、イソボルニルメタクリレート、ラウリルアクリレート、ラウリルメタクリレート、アクリレート官能性を有するポリ(ブタジエン)およびメタクリレート官能性を有するポリ(ブタジエン)から成る群から選択される。 n is 1 to 6, R 1 is —H or —CH 3 , and X 2 is an aromatic or aliphatic group. Exemplary X 2 components include poly (butadiene), poly (carbonate), poly (urethane), poly (ether), poly (ester), simple hydrocarbon, and carbonyl, carboxyl, amide, carbamate, urea, Or simple hydrocarbons containing functional groups such as ethers are included. Commercially available materials include butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n-lauryl (meth) acrylate, alkyl (available from Kyoeisha Chemical Co., Ltd.) (Meth) acrylate, tridecyl (meth) acrylate, n-stearyl (meth) acrylate, cyclohexyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, 1,4 -Butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, perfluorooctylethyl (meth) acrylate, 1,10- Candiol di (meth) acrylate, nonylphenol polypropoxylate (meth) acrylate, and polypentoxylate tetrahydrofurfuryl acrylate; polybutadiene urethane dimethacrylate (CN302, NTX6513) and polybutadiene dimethacrylate (CN301) available from Sartomer Company, Inc. , NTX6039, PRO6270); polycarbonate urethane diacrylate (ArtResin UN9200A) available from Negami Kogyo Co., Ltd .; acrylated aliphatic urethane oligomers (Ebecryl 230, 264, 265, 270, 284, 4830) available from Radcure Specialties, Inc. , 4833, 4834, 4835, 4866 , 4881, 4883, 8402, 8800-20R, 8803, 8804); polyester acrylate oligomers (Ebecryl 657, 770, 810, 830, 1657, 1810, 1830) available from Radcure Specialties, Inc, and Sartomer Company, Inc. Available epoxy acrylate resins (CN104, 111, 112, 115, 116, 117, 118, 119, 120, 124, 136) are included. In one embodiment, the acrylate resin is selected from the group consisting of isobornyl acrylate, isobornyl methacrylate, lauryl acrylate, lauryl methacrylate, poly (butadiene) with acrylate functionality and poly (butadiene) with methacrylate functionality. The
適当なビニルエーテル樹脂には、一般構造
適当なポリ(ブタジエン)樹脂には、ポリ(ブタジエン)、エポキシ化ポリ(ブタジエン)、マレイン化ポリ(ブタジエン)、アクリル化ポリ(ブタジエン)、ブタジエン−スチレン共重合体、およびブタジエン−アクリロニトリル共重合体が含まれる。市販の材料には、Sartomer Company,Incから入手可能なホモポリマーブタジエン(Ricon130、131、134、142、150、152、153、154、156、157、P30D);Sartomer Company,Incから入手可能なブタジエンおよびスチレンのランダム共重合体(Ricon100、181、184);Sartomer Company,Incから入手可能なマレイン化ポリブタジエン(Ricon130MA8、130MA13、130MA20、131MA5、131MA10、131MA17、131MA20、156MA17);Sartomer Company,Incから入手可能なアクリル化ポリ(ブタジエン)(CN302、NTX6513、CN301、NTX6039、PRO6270、Riacryl 3100、Riacryl 3500);SartomerCompany,Incから入手可能なエポキシ化ポリ(ブタジエン)(Polybd600、605);およびダイセル化学工業株式会社から入手可能なEpolead PB3600;ならびにHanse Chemicalから入手可能なアクリロニトリルおよびブタジエン共重合体(Hycar CTBNシリーズ、ATBNシリーズ、VTBNシリーズおよびETBNシリーズ)が含まれる。
Suitable poly (butadiene) resins include poly (butadiene), epoxidized poly (butadiene), maleated poly (butadiene), acrylated poly (butadiene), butadiene-styrene copolymers, and butadiene-acrylonitrile copolymers. Is included. Commercially available materials include homopolymer butadiene available from Sartomer Company, Inc (Ricon 130, 131, 134, 142, 150, 152, 153, 154, 156, 157, P30D); butadiene available from Sartomer Company, Inc. And random copolymers of styrene (
適当なエポキシ樹脂には、ビスフェノール、ナフタレン、および脂肪族型エポキシが含まれる。市販の材料には、大日本インキ化学工業株式会社から入手可能なビスフェノール型エポキシ樹脂(Epiclon 830LVP、830CRP、835LV、850CRP;大日本インキ化学工業株式会社から入手可能なナフタレン型エポキシ(Epiclon HP4032);Ciba Specialty Chemicalsから入手可能な脂肪族エポキシ樹脂(Araldite CY179、184、192、175、179)、Union Carbide Corporationから入手可能な(Epoxy 1234、249、206)、およびダイセル化学工業株式会社から入手可能な(EHPE−3150)が含まれる。他の適当なエポキシ樹脂には、脂環式エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン−フェノール型エポキシ樹脂、反応性エポキシ希釈剤、およびそれらの混合物が含まれる。 Suitable epoxy resins include bisphenol, naphthalene, and aliphatic type epoxies. Commercially available materials include bisphenol type epoxy resins (Epiclon 830LVP, 830CRP, 835LV, 850CRP available from Dainippon Ink and Chemicals, Inc .; naphthalene type epoxy (Epiclon HP4032) available from Dainippon Ink and Chemicals, Inc .; Aliphatic epoxy resins available from Ciba Specialty Chemicals (Araldite CY179, 184, 192, 175, 179), available from Union Carbide Corporation (Epoxy 1234, 249, 206), and available from Daicel Chemical Industries, Ltd. (EHPE-3150) Other suitable epoxy resins include alicyclic epoxy resins, bisphenol A epoxy resins, bisphenols F type epoxy resin, novolak type epoxy resins, biphenyl type epoxy resins, naphthalene type epoxy resins, dicyclopentadiene - phenol epoxy resins, reactive epoxy diluents, and mixtures thereof.
適当なシリコーン化オレフィン樹脂は、一般構造
n1は2またはそれより大きく、n2は1またはそれより大きく、n1>n2である。これらの材料は市販されており、例えば、National Starch and Chemical Companyから入手することができる。 n 1 is 2 or greater, n 2 is 1 or greater, and n 1 > n 2 . These materials are commercially available and can be obtained, for example, from the National Starch and Chemical Company.
適当なシリコーン樹脂には、一般構造
nは0または任意の整数であり、X4およびX5は水素、メチル、アミン、エポキシ、カルボキシル、ヒドロキシ、アクリレート、メタクリレート、メルカプト、フェノール、またはビニル官能基であり、R2およびR3は−H、−CH3、ビニル、フェニル、または2つより多い炭素数の任意の炭化水素構造であってよい。市販の材料には、Shin−Etsu Silicone International Trading(Shanghai)Co.,Ltdから入手可能なKF8012、KF8002、KF8003、KF−1001、X−22−3710、KF6001、X−22−164C、KF2001、X−22−170DX、X−22−173DX、X−22−174DX、X−22−176DX、KF−857、KF862、KF8001、X−22−3367、およびX−22−3939Aが含まれる。 n is 0 or any integer, X 4 and X 5 are hydrogen, methyl, amine, epoxy, carboxyl, hydroxy, acrylate, methacrylate, mercapto, phenol, or vinyl functional groups, and R 2 and R 3 are — It may be H, —CH 3 , vinyl, phenyl, or any hydrocarbon structure having more than two carbon atoms. Commercially available materials include Shin-Etsu Silicon International Trading (Shanghai) Co. KF8012, KF8002, KF8003, KF-1001, X-22-3710, KF6001, X-22-164C, KF2001, X-22-170DX, X-22-173DX, X-22-174DX, available from Ltd. X-22-176DX, KF-857, KF862, KF8001, X-22-3367, and X-22-3939A are included.
適当なスチレン樹脂には、一般構造
nは1またはそれより大きく、R4は−Hまたは−CH3であり、X6は脂肪族基である。代表的なX3構成要素には、ポリ(ブタジエン)、ポリ(カーボネート)、ポリ(ウレタン)、ポリ(エーテル)、ポリ(エステル)、単純炭化水素、およびカルボニル、カルボキシル、アミド、カルバメート、尿素、またはエーテルのような官能基を含有する単純炭化水素が含まれる。これらの樹脂は市販されており、例えば、National Starch and Chemical CopmanyまたはSigma−Aldrichから入手することができる。 n is 1 or greater, R 4 is —H or —CH 3 , and X 6 is an aliphatic group. Representative X 3 entities include poly (butadiene), poly (carbonates), poly (urethanes), poly (ether), poly (esters), simple hydrocarbons, and carbonyl, carboxyl, amide, carbamate, urea, Or simple hydrocarbons containing functional groups such as ethers are included. These resins are commercially available and can be obtained from, for example, National Starch and Chemical Company or Sigma-Aldrich.
適当なシアネートエステル樹脂には、一般構造
接着剤組成物に適当なポリマーには、ポリアミド、フェノキシ、ポリベンゾオキサジン、アクリレート、シアネートエステル、ビスマレイミド、ポリエーテルスルホン、ポリイミド、ベンゾオキサジン、ビニルエーテル、シリコーン化オレフィン、ポリオレフィン、ポリベンゾオキサゾール、ポリエステル、ポリスチレン、ポリカーボネート、ポリプロピレン、ポリ(ビニルクロライド)、ポリイソブチレン、ポリアクリロニトリル、ポリ(メチルメタクリレート)、ポリ(ビニルアセテート)、ポリ(2−ビニルプリジン)(poly(2−vinylpridine))、シス−1,4−ポリイソプレン、3,4−ポリクロロプレン、ビニル共重合体、ポリ(エチレンオキシド)、ポリ(エチレングリコール)、ポリホルムアルデヒド、ポリアセトアルデヒド、ポリ(b−プロピオールアセトン)、ポリ(10−デカノエート)、ポリ(エチレンテレフタレート)、ポリカプロラクタム、ポリ(11−ウンデカノアミド)、ポリ(m−フェニレン−テレフタルアミド)、ポリ(テトラメチレン−m−ベンゼンスルホンアミド)、ポリエステルポリアクリレート、ポリ(フェニレンオキシド)、ポリ(フェニレンスルフィド)、ポリスルホン、ポリイミド、ポリエーテルエーテルケトン、ポリエーテルイミド、フッ素化ポリイミド、ポリイミドシロキサン、イソインドロキナゾリンジオン、ポリチオエーテルイミドポリフェニルキノキサリン、ポリキニキサロン、イミドアリールエーテルフェニルキノキサリン共重合体、ポリキノキサリン、ポリベンゾイミダゾール、ポリベンゾオキサゾール、ポリノルボルネン、ポリ(アリーレンエーテル)、ポリシラン、パリレン、ベンゾシクロブテン、ヒドロキシ(ベンゾオキサゾール)共重合体、ポリ(シラリレンシロキサン)、およびポリベンゾイミダゾールが更に含まれる。 Suitable polymers for the adhesive composition include polyamide, phenoxy, polybenzoxazine, acrylate, cyanate ester, bismaleimide, polyethersulfone, polyimide, benzoxazine, vinyl ether, siliconized olefin, polyolefin, polybenzoxazole, polyester, Polystyrene, polycarbonate, polypropylene, poly (vinyl chloride), polyisobutylene, polyacrylonitrile, poly (methyl methacrylate), poly (vinyl acetate), poly (2-vinylpridine) (poly (2-vinylpridine)), cis-1,4 -Polyisoprene, 3,4-polychloroprene, vinyl copolymers, poly (ethylene oxide), poly (ethylene glycol), polyformaldehyde, Riacetaldehyde, poly (b-propiolacetone), poly (10-decanoate), poly (ethylene terephthalate), polycaprolactam, poly (11-undecanoamide), poly (m-phenylene-terephthalamide), poly (tetramethylene- m-benzenesulfonamide), polyester polyacrylate, poly (phenylene oxide), poly (phenylene sulfide), polysulfone, polyimide, polyetheretherketone, polyetherimide, fluorinated polyimide, polyimidesiloxane, isoindoloquinazolinedione, poly Thioetherimido polyphenylquinoxaline, polyquinoxalone, imidoaryl ether phenylquinoxaline copolymer, polyquinoxaline, polybenzimidazole, polybenzo Kisazoru, polynorbornene, poly (arylene ether), polysilane, parylene, benzocyclobutene, hydroxy (benzoxazole) copolymer, poly (ancillary Ren siloxane), and polybenzimidazole are further included.
接着剤組成物に含有される他の適当な材料には、モノビニル芳香族炭化水素および共役ジエン、例えば、スチレン−ブタジエン、スチレン−ブタジエン−スチレン(SBS)、スチレン−イソプレン−スチレン(SIS)、スチレン−エチレン−ブチレン−スチレン(SEBS)、およびスチレン−エチレン−プロピレン−スチレン(SEPS)のブロック共重合体のようなゴム重合体が含まれる。 Other suitable materials included in the adhesive composition include monovinyl aromatic hydrocarbons and conjugated dienes such as styrene-butadiene, styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene. Rubber polymers such as block copolymers of ethylene-butylene-styrene (SEBS) and styrene-ethylene-propylene-styrene (SEPS) are included.
接着剤組成物に含有される他の適当な材料には、エチレン−ビニルアセテートポリマー、他のエチレンエステルおよび共重合体、例えば、エチレンメタクリレート、エチレンn−ブチルアクリレートおよびエチレンアクリル酸;ポリエチレンおよびポリプロピレンのようなポリオレフィン;ポリビニルアセテートおよびそれらのランダム共重合体;ポリアクリレート;ポリアミド;ポリエステル;ならびにポリビニルアルコールおよびそれらの共重合体が含まれる。 Other suitable materials contained in the adhesive composition include ethylene-vinyl acetate polymers, other ethylene esters and copolymers such as ethylene methacrylate, ethylene n-butyl acrylate and ethylene acrylic acid; polyethylene and polypropylene. Polyvinyl acetate and their random copolymers; polyacrylates; polyamides; polyesters; and polyvinyl alcohol and their copolymers.
接着剤組成物に含有される適当な熱可塑性ゴムには、カルボキシ末端ブタジエン−ニトリル(CTBN)/エポキシ付加物、アクリレートゴム、ビニル末端ブタジエンゴム、およびニトリルブタジエンゴム(NBR)が含まれる。1つの態様では、CTBNエポキシ付加物は、約20〜80重量%のCTBNおよび約20〜80重量%のジグリシジルエーテルビスフェノールA:ビスフェノールAエポキシ(DGEBA)からなる。種々のCTBN材料がNoveon Inc.から入手可能であり、種々のビスフェノールAエポキシ材料は、大日本インキ化学工業株式会社およびShell Chemicalsから入手可能である。NBRゴムは、Zeon Corporationから市販されている。 Suitable thermoplastic rubbers contained in the adhesive composition include carboxy-terminated butadiene-nitrile (CTBN) / epoxy adducts, acrylate rubbers, vinyl-terminated butadiene rubbers, and nitrile butadiene rubbers (NBR). In one embodiment, the CTBN epoxy adduct consists of about 20-80 wt% CTBN and about 20-80 wt% diglycidyl ether bisphenol A: bisphenol A epoxy (DGEBA). Various CTBN materials are available from Noveon Inc. Various bisphenol A epoxy materials are available from Dainippon Ink Chemical Co., Ltd. and Shell Chemicals. NBR rubber is commercially available from Zeon Corporation.
接着剤配合物に含有される適当なシロキサンには、骨格ならびに透過性(permeability)を与える少なくとも1つのシロキサン部分および反応して新しい共有結合を形成するように反応できる少なくとも1つの反応性部分である骨格からぶら下がるペンダント(pendant)を含んで成る弾性ポリマーが含まれる。適当なシロキサンの例には、3−(トリス(トリメチルシリルオキシ)シリル)−プロピルメタクリレート、n−ブチルアクリレート、グリシジルメタクリレート、アクリロニトリル、およびシアノエチルアクリレート;3−(トリス(トリメチルシリルオキシ)シリル)−プロピルメタクリレート、n−ブチルアクリレート、グリシジルメタクリレート、およびアクリロニトリル;ならびに3−(トリス(トリメチルシリルオキシ)シリル)−プロピルメタクリレート、n−ブチルアクリレート、グリシジルメタクリレート、およびシアノエチルアクリレートから製造される弾性ポリマーが含まれる。 Suitable siloxanes contained in the adhesive formulation include at least one siloxane moiety that provides backbone and permeability and at least one reactive moiety that can react to react to form a new covalent bond. An elastic polymer comprising a pendant hanging from the skeleton is included. Examples of suitable siloxanes include 3- (tris (trimethylsilyloxy) silyl) -propyl methacrylate, n-butyl acrylate, glycidyl methacrylate, acrylonitrile, and cyanoethyl acrylate; 3- (tris (trimethylsilyloxy) silyl) -propyl methacrylate; Included are elastic polymers made from n-butyl acrylate, glycidyl methacrylate, and acrylonitrile; and 3- (tris (trimethylsilyloxy) silyl) -propyl methacrylate, n-butyl acrylate, glycidyl methacrylate, and cyanoethyl acrylate.
接着剤組成物が硬化剤を必要とする場合、その選択は、用いるポリマー化学および用いる処理条件に基づく。硬化剤として、組成物は、芳香族アミン、アリル環式アミン、脂肪族アミン、第3ホスフィン、トリアジン、金属塩、芳香族ヒドロキシル化合物、またはこれらの組み合わせを用いてよい。そのような触媒の例には、イミダゾール(例えば、2−メチルイミダゾール、2−ウンデシルイミダゾール、2−ヘプタデシルイミダゾール、2−フェニルイミダゾール、2−エチル4−メチルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−プロピル−2−メチルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール、1−シアノエチル−2−ウンデシルイミダゾール、1−シアノエチル−2−フェニルイミダゾール、1−グアナミノエチル−2−メチルイミダゾールならびにイミダゾールおよびトリメリット酸の付加物);第3アミン(例えば、N,N−ジメチルベンジルアミン、N,N−ジメチルアニリン、N,N−ジメチルトルイジン、N,N−ジメチル−p−アニシジン、p−ハロゲノ−N,N−ジメチルアニリン、2−N−エチルアニリノエタノール、トリ−n−ブチルアミン、ピリジン、キノリン、N−メチルモルホリン、トリエタノールアミン、トリエチレンジアミン、N,N,N’,N’−テトラメチルブタンジアミン、N−メチルピペリジン);フェノール類(例えば、フェノール、クレゾール、キシレノール、レゾルシン、およびフロログルシン);有機金属塩(例えば、ナフテン酸鉛、ステアリン酸鉛、ナフテン酸亜鉛、オクチル酸亜鉛、オレイン酸スズ、マレイン酸ジブチルスズ、ナフテン酸マンガン、ナフテン酸コバルト、およびアセチルアセトン鉄);および無機金属塩(例えば、塩化第2スズ、塩化亜鉛および塩化アルミニウム);過酸化物(例えば、過酸化ベンゾイル、過酸化ラウロイル、過酸化オクタノイル、過酸化アセチル、過酸化パラクロロベンゾイルおよびジ−t−ブチルジパーフタレート);酸無水物(例えば、カルボン酸無水物、マレイン酸無水物、フタル酸無水物、ラウリル酸無水物、ピロメリット酸無水物、トリメリット酸無水物、ヘキサヒドロフタル酸無水物、ヘキサヒドロピロメリット酸無水物およびヘキサヒドロトリメリット酸無水物);アゾ化合物(例えば、アゾイソブチロニトリル、2,2’−アゾビスプロパン、m,m’−アゾキシスチレン、ヒドラゾン)、ならびにこれらの混合物が含まれる。 If the adhesive composition requires a curing agent, the choice is based on the polymer chemistry used and the processing conditions used. As a curing agent, the composition may use aromatic amines, allyl cyclic amines, aliphatic amines, tertiary phosphines, triazines, metal salts, aromatic hydroxyl compounds, or combinations thereof. Examples of such catalysts include imidazole (eg, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methyl Imidazole, 1-propyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenyl Imidazole, 1-guanaminoethyl-2-methylimidazole and adducts of imidazole and trimellitic acid); tertiary amines (eg, N, N-dimethylbenzylamine, N, N-dimethylaniline, N, N-dimethyltoluidine, N , N-dimethyl -P-anisidine, p-halogeno-N, N-dimethylaniline, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine, quinoline, N-methylmorpholine, triethanolamine, triethylenediamine, N, N , N ′, N′-tetramethylbutanediamine, N-methylpiperidine); phenols (eg, phenol, cresol, xylenol, resorcin, and phloroglucin); organometallic salts (eg, lead naphthenate, lead stearate, naphthene) Zinc oxide, zinc octylate, tin oleate, dibutyltin maleate, manganese naphthenate, cobalt naphthenate and iron acetylacetone); and inorganic metal salts (eg stannic chloride, zinc chloride and aluminum chloride); peroxides (For example, benzoic peroxide Acid, lauroyl peroxide, octanoyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide and di-t-butyl diperphthalate); acid anhydrides (eg carboxylic acid anhydrides, maleic acid anhydrides, phthalic acid anhydrides) , Lauric anhydride, pyromellitic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, hexahydropyromellitic anhydride and hexahydrotrimellitic anhydride); azo compounds (eg, azoisobutyrate) Nitrile, 2,2′-azobispropane, m, m′-azoxystyrene, hydrazone), and mixtures thereof.
もう1つの態様では、硬化促進剤を、トリフェニルホスフィン、アルキル−置換イミダゾール、イミダゾリウム塩、オニウム塩、第4ホスホニウム化合物、オニウムボレート、金属キレート、1,8−ジアザビシクロ[5.4.0]ウンデ−7−センまたはその混合物からなる群から選択してよい。 In another embodiment, the curing accelerator is triphenylphosphine, alkyl-substituted imidazole, imidazolium salt, onium salt, quaternary phosphonium compound, onium borate, metal chelate, 1,8-diazabicyclo [5.4.0]. It may be selected from the group consisting of unde-7-cene or mixtures thereof.
もう1つの態様では、ラジカルまたはイオン性硬化樹脂のどちらが選択されるかに基づき、硬化剤は、フリーラジカル開始剤またはカチオン開始剤のいずれかであってよい。フリーラジカル開始剤を用いる場合、それは有効量で存在する。有効量は、一般的に、有機化合物(存在する充填材を除く)の0.1〜10重量パーセントである。フリーラジカル開始剤には、過酸化物、例えばブチルパーオクトエートおよび過酸化ジクミル、およびアゾ化合物、例えば2,2’−アゾビス(2−メチル−プロパンニトリル)および2,2’−アゾビス(2−メチル−ブタンニトリル)が含まれる。 In another aspect, the curing agent may be either a free radical initiator or a cationic initiator based on whether a radical or ionic curable resin is selected. If a free radical initiator is used, it is present in an effective amount. Effective amounts are generally 0.1 to 10 weight percent of the organic compound (excluding any filler present). Free radical initiators include peroxides such as butyl peroctoate and dicumyl peroxide, and azo compounds such as 2,2′-azobis (2-methyl-propanenitrile) and 2,2′-azobis (2- Methyl-butanenitrile).
カチオン開始剤を用いる場合、それは有効量で存在する。有効量は、一般的に、有機化合物(存在する充填材を除く)の0.1〜10重量パーセントである。適当なカチオン硬化剤には、ジシアンジアミド、フェノールノボラック、アジピックジヒドラジド、ジアリルメラミン、ジアミノマルコニトリル(diamino malconitrile)、BF3−アミン錯体、アミン塩および修飾されたイミダゾール化合物が含まれる。 If a cationic initiator is used, it is present in an effective amount. Effective amounts are generally 0.1 to 10 weight percent of the organic compound (excluding any filler present). Suitable cationic curing agents include dicyandiamide, phenol novolac, adipic dihydrazide, diallyl melamine, diaminomalconitile, BF3-amine complexes, amine salts and modified imidazole compounds.
金属化合物を、シアネートエステル系の硬化促進剤として用いることもでき、限定するわけではないが、それには、金属ナフテネート、金属アセチルアセトネート(キレート)、金属オクトエート、金属アセテート、金属ハロゲン化物、金属イミダゾール錯体、および金属アミン化合物が含まれる。 Metal compounds can also be used as cyanate ester based accelerators, including but not limited to metal naphthenates, metal acetylacetonates (chelates), metal octoates, metal acetates, metal halides, metal imidazoles. Complexes and metal amine compounds are included.
接着剤配合物に含めてよい他の硬化促進剤には、トリフェニルホスフィン、アルキル−置換イミダゾール、イミダゾリウム塩、およびオニウムボレートが含まれる。 Other cure accelerators that may be included in the adhesive formulation include triphenylphosphine, alkyl-substituted imidazoles, imidazolium salts, and onium borates.
ある場合では、接着剤組成物に対して、2種類以上の硬化を用いることが望ましいことがある。例えば、カチオンおよびフリーラジカル開始剤の両方が望ましいことがあり、その場合、フリーラジカル硬化およびイオン性硬化樹脂を組成物に用いることができる。これらの組成物は、樹脂の各種類に合った有効量の開始剤を含有する。そのような組成物は、例えば、UV照射を用いてカチオン開始剤により硬化処理を開始することができ、その後の処理工程にて、熱を加えた場合にフリーラジカル開始剤によって硬化処理を完了できる。 In some cases, it may be desirable to use more than one type of cure for the adhesive composition. For example, both cationic and free radical initiators may be desirable, in which case free radical curable and ionic curable resins may be used in the composition. These compositions contain an effective amount of initiator for each type of resin. Such compositions can be initiated with a cationic initiator using, for example, UV irradiation, and can be completed with a free radical initiator when heat is applied in subsequent processing steps. .
1種またはそれより多くの充填材を、接着剤組成物に含ませることができ、通常、レオロジー特性の向上および応力の減少のために添加する。接着剤はダイの活性側と接するようになるため、充填材は電気的に非導電性である。適当な非導電性充填材の例には、アルミナ、水酸化アルミニウム、シリカ、バーミキュライト、雲母、珪灰石、炭酸カルシウム、酸化チタン、砂、ガラス、硫酸バリウム、ジルコニウム、カーボンブラック、有機フィラー、ならびに例えばテトラフルオロエチレン、トリフルオロエチレン、ビニリデンフルオライド、ビニルフルオライド、ビニリデンクロライド、およびビニルクロライドのようなハロゲン化エチレンポリマーが含まれる。充填材粒子は、ナノサイズ〜数mmの範囲で、任意の適当な寸法でよい。いずれかの特定のパッケージ構造に対する寸法の選択は、当業者の知識の範囲内である。充填材は、組成物全体の0〜95重量%の量で存在してよい。 One or more fillers can be included in the adhesive composition and are usually added to improve rheological properties and reduce stress. Since the adhesive comes into contact with the active side of the die, the filler is electrically non-conductive. Examples of suitable non-conductive fillers include alumina, aluminum hydroxide, silica, vermiculite, mica, wollastonite, calcium carbonate, titanium oxide, sand, glass, barium sulfate, zirconium, carbon black, organic fillers, and for example Included are halogenated ethylene polymers such as tetrafluoroethylene, trifluoroethylene, vinylidene fluoride, vinyl fluoride, vinylidene chloride, and vinyl chloride. The filler particles can be of any suitable dimensions, ranging from nanosize to several mm. The selection of dimensions for any particular package structure is within the knowledge of those skilled in the art. The filler may be present in an amount from 0 to 95% by weight of the total composition.
1つの態様では、接着剤配合物はスペーサーを含んでおり、それはボンドライン(bondline)を所定の厚さにコントロールする目的で添加される粒子である。適当なスペーサーの選択は、パッケージ構造および接着剤配合に基づき、当業者は過度に実験をすることなく選択できる。適当なスペーサーには、限定するわけではないが、シリカ、テフロン(登録商標)、ポリマーまたはエラストマー材料が含まれる。それらは25〜150ミクロンの寸法範囲でよく、有効量で用いる。 In one embodiment, the adhesive formulation includes a spacer, which is a particle added for the purpose of controlling the bondline to a predetermined thickness. The selection of an appropriate spacer is based on the package structure and adhesive formulation and can be selected by one skilled in the art without undue experimentation. Suitable spacers include, but are not limited to, silica, Teflon, polymer or elastomeric material. They can range in size from 25 to 150 microns and are used in effective amounts.
もう1つの態様では、カップリング剤を接着組成物に添加することができる。一般的に、カップリング剤はシランであり、例えば、エポキシ型シランカップリング剤、アミン型シランカップリング剤、またはメルカプト型シランカップリング剤である。カップリング剤を用いる場合、有効量で用いる。一般的な有効量は、5重量%までの量である。 In another aspect, a coupling agent can be added to the adhesive composition. Generally, the coupling agent is a silane, for example, an epoxy type silane coupling agent, an amine type silane coupling agent, or a mercapto type silane coupling agent. When a coupling agent is used, it is used in an effective amount. Typical effective amounts are up to 5% by weight.
更なる態様では、接着剤組成物に界面活性剤を添加することができる。適当な界面活性剤には、シリコーン、ポリエチレングリコール、ポリオキシエチレン/ポリオキシプロピレンブロック共重合体、エチレンジアミン系ポリオキシエチレン/ポリオキシプロピレンブロック共重合体、ポリオール系ポリオキシアルキレン、脂肪アルコール系ポリオキシアルキレン、および脂肪アルコールポリオキシアルキレンアルキルエーテルが含まれる。用いる場合、界面活性剤を有効量用い、一般的な有効量は、5重量%までの量である。 In a further aspect, a surfactant can be added to the adhesive composition. Suitable surfactants include silicone, polyethylene glycol, polyoxyethylene / polyoxypropylene block copolymer, ethylenediamine-based polyoxyethylene / polyoxypropylene block copolymer, polyol-based polyoxyalkylene, fatty alcohol-based polyoxy Alkylene and fatty alcohol polyoxyalkylene alkyl ethers are included. When used, an effective amount of surfactant is used, with typical effective amounts being up to 5% by weight.
もう1つの態様では、接着剤組成物に湿潤剤を含有することができる。湿潤剤の選択は、使用に関する要件および用いる樹脂化学に基づく。用いる場合、湿潤剤は有効量で用い、一般的な有効量は5重量%までの量である。適当な湿潤剤の例には、3Mから入手可能であるFluorad FC−4430 Fluorosurfactant、Rhom and Haasから入手可能なClariant Fluowet OTN、BYK W−990、Surfynol 104 Surfactant、Crompton Silwet L−7280、Triton X100、240よりも大きい好ましい分子量Mwを有するプロピレングリコール、Gama−Butyrolactone、キャスターオイル、グリセリンまたは他の脂肪酸、およびシランが含まれる。
In another embodiment, the adhesive composition can contain a wetting agent. The choice of wetting agent is based on the requirements for use and the resin chemistry used. When used, wetting agents are used in effective amounts, with typical effective amounts being up to 5% by weight. Examples of suitable wetting agents include Fluorad FC-4430 Fluorosurfactant available from 3M, Clariant Fluowet OTN, BYK W-990 available from 3M,
更なる態様では、接着剤組成物に流動制御剤を含むことができる。流動制御剤の選択は、使用に関する要件および用いられる樹脂化学に基づく。用いる場合、流動制御剤は有効量で存在し、有効量は5重量%までの量である。適当な流動制御剤の例には、Cabotから入手可能なCab−O−Sil TS720、Degussaから入手可能なAerosil R202またはR972、ヒュームドシリカ、ヒュームドアルミナ、またはヒュームド金属酸化物が含まれる。 In a further aspect, the adhesive composition can include a flow control agent. The choice of flow control agent is based on the requirements for use and the resin chemistry used. When used, the flow control agent is present in an effective amount, which is an amount up to 5% by weight. Examples of suitable flow control agents include Cab-O-Sil TS720 available from Cabot, Aerosil R202 or R972 available from Degussa, fumed silica, fumed alumina, or fumed metal oxide.
もう1つの態様では、接着促進剤を、接着剤組成物に含むことができる。接着促進剤の選択は、使用に関する要件および用いる樹脂化学に基づく。用いる場合、接着促進剤は有効量で用い、有効量は5重量%までの量である。適当な接着促進剤の例には、シランカップリング剤、例えばDow Corningから入手可能なZ6040エポキシシランまたはZ6020アミンシラン;OSI Silquestから入手可能なA186 Silane、A187 Silane、A174 Silane、またはA1289;Degussaから入手可能なOrganosilane SI264;城北化学工業株式会社より入手可能なJohoku Chemical CBT−1 カーボベンゾトリアゾール;機能性ベンゾトリアゾール;チアゾール;チタネート;およびジルコネートが含まれる。 In another aspect, an adhesion promoter can be included in the adhesive composition. The choice of adhesion promoter is based on the requirements for use and the resin chemistry used. When used, the adhesion promoter is used in an effective amount, which is an amount up to 5% by weight. Examples of suitable adhesion promoters include silane coupling agents such as Z6040 epoxy silane or Z6020 amine silane available from Dow Corning; A186 Silane, A187 Silane, A174 Silane, or A1289 available from OSI Silquest; Organosilane SI264 available; Joho Chemical CBT-1 carbobenzotriazole available from Johoku Chemical Co., Ltd .; functional benzotriazole; thiazole; titanate; and zirconate.
更なる態様では、脱泡剤(消泡剤)を、接着剤組成物に添加することができる。脱泡剤の選択は、使用に関する要件および用いる樹脂化学に基づく。用いられる場合、脱泡剤は有効量で用い、有効量は5重量%までの量である。適当な脱泡剤の例には、Dow Corningから入手可能なAntifoam 1400、DuPont Modoflow、およびBYK A−510が含まれる。 In a further aspect, a defoamer (antifoam) can be added to the adhesive composition. The choice of defoamer is based on the requirements for use and the resin chemistry used. When used, the defoamer is used in an effective amount, which is an amount up to 5% by weight. Examples of suitable defoamers include Antifoam 1400, DuPont Modoflow, and BYK A-510 available from Dow Corning.
いくつかの態様では、接着性の向上および粘着性の付与のために、これらの組成物を粘着性樹脂を用いて配合する。粘着性樹脂の例には、天然樹脂、および変性した天然樹脂:ポリテルペン樹脂;フェノール変性したテルペン樹脂;クマロンインデン樹脂;脂肪族および芳香族石油炭化水素樹脂;フタレートエステル;水素化炭化水素、水素化ロジンおよび水素化ロジンエステルが含まれる。 In some embodiments, these compositions are formulated with a tacky resin to improve adhesion and impart tack. Examples of adhesive resins include natural resins and modified natural resins: polyterpene resins; phenol-modified terpene resins; coumarone indene resins; aliphatic and aromatic petroleum hydrocarbon resins; phthalate esters; hydrogenated hydrocarbons, hydrogen Rosin and hydrogenated rosin esters.
ある態様では、接着剤組成物に他の成分を含むことができ、それには、例えば、液体ポリブテンまたはポリプロピレンのような希釈剤;パラフィンおよびマイクロクリスタリンワックスのような石油ワックス、ポリエチレングリース、水素化動物、魚および植物油脂、鉱油および合成ワックス、ナフテンまたはパラフィン鉱油が含まれる。 In certain embodiments, the adhesive composition can include other ingredients, such as diluents such as liquid polybutene or polypropylene; petroleum waxes such as paraffin and microcrystalline wax, polyethylene greases, hydrogenated animals. , Fish and vegetable oils, mineral oils and synthetic waxes, naphthenic or paraffinic mineral oils.
当業者に知られている種類および量の安定化剤、酸化防止剤、衝撃改質剤、および着色剤のような他の添加剤も、接着剤組成物に添加することができる。 Other additives such as stabilizers, antioxidants, impact modifiers, and colorants known to those skilled in the art can also be added to the adhesive composition.
25℃〜230℃の範囲の適切な沸点を有する一般的な溶剤を、接着剤組成物に用いることができる。用いることができる溶剤の例には、ケトン、エステル、アルコール、エーテル、および安定であり、組成物中の樹脂を溶解する他の一般的な溶剤が含まれる。適当な溶剤には、γ−ブチロラクトン、プロピレングリコールメチルエチルアセテート(PGMEA)、および4−メチル−2−ペンタノンが含まれる。 A general solvent having an appropriate boiling point in the range of 25 ° C. to 230 ° C. can be used for the adhesive composition. Examples of solvents that can be used include ketones, esters, alcohols, ethers, and other common solvents that are stable and dissolve the resin in the composition. Suitable solvents include γ-butyrolactone, propylene glycol methyl ethyl acetate (PGMEA), and 4-methyl-2-pentanone.
接着剤を基材またはダイに適用した後、任意の処理工程で、それを乾燥および/またはBステージにすることができる。本発明の1つの態様では、接着剤を固化させて非粘着状態とし、半導体ダイを取り付ける前に、基材、ウェハ、またはダイを、別々の場所に保存および/または移動できるようにする。一般的に、接着剤で被覆された基材、ダイ、またはウェハを挿入物を用いることなく、相互に重ねることができるように、接着剤を充分に固化させる。接着剤の固化は、用いる接着剤配合物に基づき、種々の方法で実施できる。 After applying the adhesive to the substrate or die, it can be dried and / or B-staged at any processing step. In one aspect of the invention, the adhesive is allowed to solidify and become non-tacky so that the substrate, wafer, or die can be stored and / or moved to separate locations prior to attaching the semiconductor die. In general, the adhesive is sufficiently solidified so that the adhesive coated substrate, die, or wafer can be stacked on top of each other without the use of inserts. The adhesive can be solidified by various methods based on the adhesive formulation used.
1つの態様では、接着剤は、流動可能な状態であるように、融点より高い温度で適用される熱可塑性材料である。この場合、接着剤は、接着剤の融点および/または軟化点より低い温度で冷却されることによって、固化する。 In one aspect, the adhesive is a thermoplastic material that is applied at a temperature above the melting point so that it is flowable. In this case, the adhesive solidifies by being cooled at a temperature lower than the melting point and / or the softening point of the adhesive.
もう1つの態様では、接着剤は、少なくとも液体熱硬化性樹脂および溶媒を含む。この態様では、溶媒を蒸発させて、1種または複数の熱硬化性樹脂を部分的に硬化させるように、接着剤および基材を充分に加熱することによって、接着剤を固化させて、非粘着性または非常に低い流動性の状態にする。 In another aspect, the adhesive includes at least a liquid thermosetting resin and a solvent. In this aspect, the adhesive and the substrate are sufficiently heated to evaporate the solvent and partially cure the one or more thermosetting resins, causing the adhesive to solidify and become non-tacky. Or very low fluidity.
もう1つの態様では、接着剤は、溶媒に溶解している固体熱硬化性樹脂を含む。基材に適用した後、溶媒を蒸発させるように、接着剤および基材を充分に加熱して、非粘着性熱硬化性樹脂被覆が基材上に残るようにすることによって、接着剤を固化させて、非粘着性または非常に低い流動性の状態にする。 In another aspect, the adhesive includes a solid thermosetting resin dissolved in a solvent. After application to the substrate, the adhesive and substrate are heated sufficiently to allow the solvent to evaporate, allowing the adhesive to solidify by leaving a non-tacky thermosetting resin coating on the substrate. To a non-tacky or very low fluidity state.
もう1つの態様では、接着剤は、少なくとも1つの液体熱硬化性樹脂を含む。基材に適用した後、熱硬化性樹脂が非粘着性または非常に低い流動性の状態に部分的になるように、接着剤および基材を充分に加熱することによって、接着剤を固化させて、非粘着性または非常に低い流動性の状態にする。 In another aspect, the adhesive includes at least one liquid thermosetting resin. After application to the substrate, the adhesive is solidified by sufficiently heating the adhesive and the substrate so that the thermosetting resin is partially non-tacky or very low fluidity. To a non-tacky or very low fluidity state.
接着剤は、メカニズムと組み合わせて、乾燥、Bステージ化、および硬化することができる樹脂の組み合わせを含んでもよいことを、当業者は理解するであろう。例えば、紫外線照射の使用によって、配合物をBステージにしてよく、ダイ取付の後、下流の製造工程において、熱の使用によって硬化させてよい。配合物は、2つの別々の硬化温度を有する樹脂の組み合わせを含んでもよく、第1(低温側)温度で基材を加熱することによって、第1樹脂を硬化させ、接着剤配合物全体を固化させて非粘着性状態とし、接着剤を固化させることができる。この場合、第2(高温側)硬化温度を有する第2樹脂を、ダイの取り付け後に続く処理工程において硬化させる。 One skilled in the art will appreciate that the adhesive may include a combination of resins that can be dried, B-staged, and cured in combination with the mechanism. For example, the formulation may be B-staged through the use of ultraviolet radiation and may be cured by the use of heat in the downstream manufacturing process after die attach. The formulation may include a combination of resins having two separate cure temperatures, by curing the first resin by heating the substrate at the first (cold side) temperature and solidifying the entire adhesive formulation It can be made into a non-tacky state, and an adhesive agent can be solidified. In this case, the second resin having the second (high temperature side) curing temperature is cured in a processing step that follows the attachment of the die.
接着剤は硬化を必要としても、必要としなくてもよい。接着剤が硬化を必要とする場合、個別の処理工程として、またははんだリフローまたはワイヤボンディングのようなもう1つの処理操作と併せて、硬化を行なってよい。 The adhesive may or may not require curing. If the adhesive requires curing, curing may be performed as a separate processing step or in conjunction with another processing operation such as solder reflow or wire bonding.
Bステージ化工程を用いる場合、Bステージ化温度は、一般的に80℃〜200℃の範囲内であり、選択された特定の接着剤配合物に応じて、Bステージ化は1分〜2時間の範囲の時間内で実施する。Bステージ化プロファイルの時間および温度は、接着剤組成物によって変わり、特定の工業的な製造プロセスに適当なBステージ化プロファイルを提供するように、種々の組成物を想到することができる。 When using a B-staging process, the B-staging temperature is generally in the range of 80 ° C. to 200 ° C., and depending on the particular adhesive formulation selected, B staging is 1 minute to 2 hours. Within a range of hours. The time and temperature of the B-staged profile will vary depending on the adhesive composition, and various compositions can be devised to provide a B-staged profile suitable for a particular industrial manufacturing process.
別の態様では、ダイ取付の前に、接着剤を固化させない。この場合、接着剤がまだ流動可能な状態のまま、ダイを基材上に載せる。このことは、ダイを接着剤に押し当てた時、ダイの周囲にフィレットが形成されることを可能にする。接着剤の流動性およびダイを載せるために用いる圧力を調節して、それぞれ特定のパッケージ構造に対して所望の量のフィレットを与えることができる。この態様では、接着剤が基材の開口部に流れることを避けるように、注意しなければならない。なぜなら、これはワイヤボンディングを妨げるからである。 In another aspect, the adhesive is not solidified prior to die attach. In this case, the die is placed on the substrate while the adhesive is still flowable. This allows a fillet to form around the die when the die is pressed against the adhesive. The fluidity of the adhesive and the pressure used to place the die can be adjusted to provide the desired amount of fillet for each particular package structure. In this embodiment, care must be taken to prevent the adhesive from flowing into the openings in the substrate. This is because this prevents wire bonding.
図13は、本発明のもう1つの態様の代表的な印刷パターンを図示しており、基材開口部200の周囲に、接着剤22で被覆されない小さい非流れ領域Fが存在するように、接着剤22を基材20の表側面201に適用する。ダイを取り付けた時、接着剤の流動性は、ダイの外側周囲にフィレットの形成を可能にする。接着剤の流動性は、接着剤22を開口部200の周囲の非流れ領域F内に流入させ、接着剤22が、導電(ワイヤボンドパッド)領域を除き、ダイの活性面を完全に被覆するようになり、即ち、基材20の開口部200には流れ込まない。
FIG. 13 illustrates an exemplary printed pattern of another aspect of the present invention, wherein the adhesion is such that there is a small non-flow region F that is not coated with adhesive 22 around the
硬化工程をダイの取付接着に用いる場合、ワイヤボンディング前、ワイヤボンディング中に行なってよく、またはワイヤボンディングおよび封止後に行なってよい。ダイ取付接着の硬化は別の処理工程であってよく、または封止材の硬化処理と同時に行なってよい。 When the curing step is used for die attachment bonding, it may be performed before wire bonding, during wire bonding, or after wire bonding and sealing. Curing of the die attach bond may be a separate processing step or may occur simultaneously with the curing process of the encapsulant.
ダイの取付接着のため硬化温度は、一般的に80℃〜250℃の範囲内であり、特定の樹脂化学および選択した硬化剤に応じて、硬化は数秒〜120分までの範囲の時間内で実施する。各接着剤組成物の硬化プロファイルの時間および温度は異なり、特定の工業的な製造プロセスに適する硬化プロファイルを提供するように、種々の組成物を設計することができる。 Curing temperatures are generally in the range of 80 ° C. to 250 ° C. for die attach bonding, and depending on the specific resin chemistry and curing agent selected, curing can be in the range of seconds to 120 minutes. carry out. The time and temperature of the curing profile of each adhesive composition is different, and various compositions can be designed to provide a curing profile suitable for a particular industrial manufacturing process.
接着剤が硬化性である場合、熱への暴露、紫外線(UV)照射、またはこれらの組み合わせによって、それを硬化させてよい。各接着剤組成物の硬化条件は変わり、特定の工業的な製造プロセスに適当な硬化プロファイルを提供するように、種々の組成物を設計することができる。 If the adhesive is curable, it may be cured by exposure to heat, ultraviolet (UV) irradiation, or a combination thereof. The curing conditions for each adhesive composition vary, and various compositions can be designed to provide a curing profile suitable for a particular industrial manufacturing process.
1つの態様では、接着剤は、Bステージになった後、少なくとも2ヶ月の可使時間を有する。この長い可使時間は、乾燥させたまたは部分的に進行させた接着剤の可使時間を延長させるために一般的に用いられる任意の手段によって達成してよく、限定するわけではないが、その手段は、接着剤配合物に、(i)少なくとも1種の潜在硬化剤、(ii)高濃度の熱可塑性樹脂、および(iii)大きい分子量の樹脂のうち1種またはそれより多くの使用である。接着剤を室温で保存した後、標準的なダイ取り付け条件で、接着剤の流動性を調べることによって、可使時間を試験する。接着剤が、標準的なダイ取付条件でダイ表面を湿潤化させ得る場合、それはまだ可使時間内である。しかしながら、接着剤がダイを湿潤化させるには不十分な流動性を有する場合、それはダイを取り付けるには有用ではなく、その可使時間外であると考えられる。 In one aspect, the adhesive has a pot life of at least 2 months after being in the B stage. This long pot life may be achieved by any means commonly used to extend the pot life of a dried or partially advanced adhesive, including but not limited to A means is the use of one or more of (i) at least one latent curing agent, (ii) a high concentration of thermoplastic resin, and (iii) a high molecular weight resin in the adhesive formulation. . After the adhesive is stored at room temperature, the pot life is tested by examining the fluidity of the adhesive under standard die attach conditions. If the adhesive can wet the die surface with standard die attach conditions, it is still within the pot life. However, if the adhesive has insufficient fluidity to wet the die, it is not useful for attaching the die and is considered outside its pot life.
複数のワイヤボンド23を、ワイヤボンディングプロセスにおいて、基材20の開口部200を介して形成する。ボンディングワイヤ23を、ダイ21の導電領域上の露出したワイヤボンドパッド212に結合させ、基材20の対応する開口部200を介して、基材20の下側面202のワイヤボンドパッド203に結合させる。このようにして、ダイ21の活性面211を、基材の下側面202に電気的に接続させることができる。ボンディングワイヤ23は、金のような電気信号を伝導する任意の金属から成る。
A plurality of
封止材25を、基材20の下側面202上のワイヤボンド23の上に形成し、ボンディングワイヤ23を包囲または封止し、基材20の開口部200を充填するようにする。封止材25を、ディスペンシング、ポッティング、印刷、モールディング、または他の同様の方法によって適用してよい。封止材25は、後の製造プロセスの工程の間、ボンディングワイヤ23を保護する任意の材料でよく、パッケージは、限定するわけではないが、エポキシおよびシリコーンを含んで使用する。封止材25を、選択した封止材組成物に合わせた条件で硬化させる。各封止材組成物の硬化プロファイルの時間および温度は異なり、特定の工業的な製造プロセスに適当な硬化プロファイルを提供するように、種々の組成物を設計することができる。
A sealing
はんだボール24を、封止材25の外側領域で基材20の下側面202に埋め込む。はんだボール24は、パッケージと例えば回路基材との間で電気接続を形成するために一般的に用いられる、任意の導電性金属から成ってよい。
このパッケージは、ダイの裏側および/または側方に封止材が存在しないことを特に特徴とする。従って、パッケージのモールディングを必要としない。 This package is particularly characterized by the absence of sealing material on the back and / or sides of the die. Therefore, no package molding is required.
図9A〜9Eは、本発明を更に説明するために提示されており、本発明の1つの態様の方法に基づき準備された、様々な段階にある基材の上面図を示す。図9Aは、裸の基材20の表側面201を示す。図9Bは、接着剤22を適用した後で、基材20の表側面201を示す。図9Cは、ダイ21を取り付けた後で、基材上に接着剤22を有する、基材20の表側面201を示す。図9Dは、開口部200を介してワイヤボンド23を形成した後の、基材20の裏側面202を示す。図9Eは、封止材25をワイヤボンド23の上に適用した後の、基材20の裏側面202を示す。
FIGS. 9A-9E are presented to further illustrate the present invention and show top views of the substrate in various stages prepared according to the method of one aspect of the present invention. FIG. 9A shows the
当業者には明らかなように、本発明の概念および範囲から逸脱することなく、本発明の多くの改良および変更を行なうことができる。本明細書で記載した特定の実施態様は、単に例として提示されるものであり、本発明は、権利を与えられた請求項に均等な全範囲と共に、添付の請求項の用語によってのみ限定される。 Many modifications and variations of this invention can be made without departing from its concept and scope, as will be apparent to those skilled in the art. The specific embodiments described herein are provided by way of illustration only, and the invention is limited only by the terms of the appended claims, along with the full scope of equivalents to the claims that are entitled. The
Claims (16)
b)1つまたはそれより多くの導電領域を有する活性側、および活性側に対向する非活性側を有する半導体ダイであって、活性側が、基材の上側面および下側面を貫通する開口部の上に配置され、その開口部を完全に覆っている、基材上に載せられている半導体ダイ、
c)基材の上側面とダイの活性側との間に配置され、それらを結合する接着剤であって、導電領域を除き、ダイの活性側が接着剤によって完全に被覆される接着剤、
d)ダイの活性側上の導電領域を、基材の開口部を介して、基材の下側面上のワイヤボンドパッドに接続する複数の導電性ボンディングワイヤ、
e)基材の下側面上に適用され、ボンディングワイヤを封止し、基材の開口部を充填する封止材、ならびに
f)封止材の外側領域の基材で下側面上に埋め込まれている、複数のはんだボール
を含んで成る半導体パッケージであって、
ダイの非活性側上に封止材が存在しないこと、およびダイの側方に封止材が存在しないことを特徴とする半導体パッケージ。 a) a substrate having an upper side, a lower side opposite to the upper side, an opening through the upper side and the lower side, and a wire bond pad on the lower side;
b) a semiconductor die having an active side having one or more conductive regions and a non-active side opposite the active side, the active side of the opening penetrating the upper and lower sides of the substrate A semiconductor die placed on a substrate, placed on top and completely covering the opening,
c) an adhesive disposed between and bonding the upper side of the substrate and the active side of the die, wherein the active side of the die is completely covered by the adhesive except for the conductive area;
d) a plurality of conductive bonding wires connecting the conductive area on the active side of the die to the wire bond pads on the lower side of the substrate through openings in the substrate;
e) a sealant applied on the lower surface of the substrate to seal the bonding wire and fill the opening in the substrate; and f) embedded on the lower surface with the substrate in the outer region of the sealant. A semiconductor package comprising a plurality of solder balls,
A semiconductor package characterized in that no encapsulant is present on the inactive side of the die and no encapsulant is present on the side of the die.
b)1つまたはそれより多くの導電領域を有する活性側、および活性側に対向する非活性側を有する、少なくとも1つの半導体ダイを供給し、
c)ダイを基材に取り付けた後で、接着剤が、開口部を取り囲み、開口部を含めてダイの設置面積と少なくとも同じ大きさを有するように、基材の上側面上に接着剤パターンで流動可能接着剤を適用して、
d)任意で、流動可能接着剤を固化させ、非粘着状態とし、
e)ダイを基材上に載せて、活性側が、基材の上側面および下側面を貫通する開口部の上に配置され、開口部を完全に覆い、ダイの活性面上の導電領域は基材の開口部に露出して、ダイの活性面は、導電領域を除き、接着剤によって完全に被覆されるようにし、
f)任意で、接着剤を硬化させ、
g)複数の導電性ボンディングワイヤを取り付けて、ダイの活性側上の導電領域を、基材の開口部を介して、基材の下側面上のワイヤボンドパッドに接続し、
h)基材の下側面上に封止材を適用して、ボンディングワイヤを封止し、基材の開口部を充填し、
i)封止材を硬化させ、および
j)封止材の外側領域で基材の下側面上に、複数のはんだボールを埋め込むこと
を含む、半導体パッケージの製造方法であって、
ダイの非活性側に対する封止工程が存在しないこと、およびダイの側方に対する封止工程が存在しないことを特徴とする、半導体パッケージの製造方法。 a) providing a substrate having an upper side, a lower side opposite the upper side, an opening through the upper side and the lower side, and a wire bond pad on the lower side;
b) providing at least one semiconductor die having an active side having one or more conductive regions and a non-active side opposite the active side;
c) After attaching the die to the substrate, the adhesive pattern on the upper side of the substrate so that the adhesive surrounds the opening and has at least the same size as the die footprint including the opening. Apply flowable adhesive with
d) optionally solidifying the flowable adhesive to a non-tacky state;
e) Place the die on the substrate, the active side is placed over the opening through the upper and lower sides of the substrate, completely covering the opening, and the conductive area on the active surface of the die is Exposed in the material openings, the active surface of the die is completely covered by the adhesive, except for the conductive areas,
f) optionally curing the adhesive;
g) attaching a plurality of conductive bonding wires and connecting the conductive area on the active side of the die through the opening in the substrate to a wire bond pad on the lower side of the substrate;
h) Applying a sealing material on the lower surface of the substrate, sealing the bonding wire, filling the opening of the substrate,
a method of manufacturing a semiconductor package comprising: i) curing the encapsulant; and j) embedding a plurality of solder balls on the lower surface of the substrate in an outer region of the encapsulant,
A method of manufacturing a semiconductor package, characterized in that there is no sealing step for the non-active side of the die and no sealing step for the side of the die.
b)1つまたはそれより多くの導電領域を有する活性側、および活性側に対向する非活性側を有する、少なくとも1つの半導体ダイを供給し、
c)ダイを基材に取り付けた後で、接着剤が、開口部を包囲し、開口部を含めてダイの設置面積と少なくとも同じ大きさを有するように、ダイの活性側上に接着剤パターンで、流動可能接着剤を適用して、
d)任意で、流動可能接着剤を固化させ、非粘着状態とし、
e)ダイを基材上に載せて、活性側が、基材の上側面および下側面を貫通する開口部の上に配置され、開口部を完全に被覆しており、ダイの活性面上の導電領域は基材の開口部に露出して、ダイの活性面は、導電領域を除き、接着剤によって完全に被覆されるようにし、
f)任意で、接着剤を硬化し、
g)複数の導電性ボンディングワイヤを取り付けて、ダイの活性側上の導電領域を、基材の開口部を介して、基材の下側面上のワイヤボンドパッドに接続し、
h)基材の下側面上に封止材を適用して、ボンディングワイヤを封止し、基材の開口部を充填し、
i)封止材を硬化し、および
j)封止材の外側領域で基材の下側面上に、複数のはんだボールを埋め込むこと
を含む、半導体パッケージの製造方法であって、
ダイの非活性側に対する封止工程が存在しないこと、およびダイの側方に対する封止工程が存在しないことを特徴とする、半導体パッケージの製造方法。 a) providing a substrate having an upper side, a lower side opposite the upper side, an opening through the upper side and the lower side, and a wire bond pad on the lower side;
b) providing at least one semiconductor die having an active side having one or more conductive regions and a non-active side opposite the active side;
c) an adhesive pattern on the active side of the die so that the adhesive surrounds the opening and has at least the same size as the footprint of the die, including the opening, after attaching the die to the substrate. Apply the flowable adhesive,
d) optionally solidifying the flowable adhesive to a non-tacky state;
e) Place the die on the substrate, the active side is placed over the opening through the top and bottom sides of the substrate, completely covering the opening and conducting on the active surface of the die The area is exposed at the opening of the substrate so that the active surface of the die is completely covered by the adhesive, except for the conductive area,
f) optionally curing the adhesive;
g) attaching a plurality of conductive bonding wires and connecting the conductive area on the active side of the die through the opening in the substrate to a wire bond pad on the lower side of the substrate;
h) Applying a sealing material on the lower surface of the substrate, sealing the bonding wire, filling the opening of the substrate,
a method of manufacturing a semiconductor package comprising: i) curing the encapsulant; and j) embedding a plurality of solder balls on the lower surface of the substrate in an outer region of the encapsulant,
A method of manufacturing a semiconductor package, characterized in that there is no sealing step for the non-active side of the die and no sealing step for the side of the die.
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PCT/US2006/044465 WO2008060280A1 (en) | 2006-11-16 | 2006-11-16 | Board on chip package and process for making same |
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EP (1) | EP2082423A1 (en) |
JP (1) | JP2010510653A (en) |
KR (1) | KR20090088789A (en) |
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Cited By (1)
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US9269647B2 (en) | 2014-05-29 | 2016-02-23 | Samsung Electronics Co., Ltd. | Semiconductor package having heat dissipating member |
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KR101395322B1 (en) * | 2012-07-18 | 2014-05-16 | 도레이첨단소재 주식회사 | Adhesive composition having improved reliability at high voltage condition and adhesive tape for semiconductor packaging using the same |
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TW411537B (en) * | 1998-07-31 | 2000-11-11 | Siliconware Precision Industries Co Ltd | Semiconductor package with CSP-BGA structure |
TW409377B (en) * | 1999-05-21 | 2000-10-21 | Siliconware Precision Industries Co Ltd | Small scale ball grid array package |
US6385049B1 (en) * | 2001-07-05 | 2002-05-07 | Walsin Advanced Electronics Ltd | Multi-board BGA package |
US20050062152A1 (en) * | 2003-09-24 | 2005-03-24 | Chung-Che Tsai | Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same |
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2006
- 2006-11-16 WO PCT/US2006/044465 patent/WO2008060280A1/en active Application Filing
- 2006-11-16 KR KR1020087032244A patent/KR20090088789A/en not_active Application Discontinuation
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- 2006-11-16 JP JP2009537126A patent/JP2010510653A/en active Pending
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US9269647B2 (en) | 2014-05-29 | 2016-02-23 | Samsung Electronics Co., Ltd. | Semiconductor package having heat dissipating member |
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