JP2010283111A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment capable of restraining a grounding wiring pattern from being corroded. <P>SOLUTION: A resist layer 57 is provided to expose only a side face 56a of the grounding wiring pattern 56. An exposed portion of the grounding wiring pattern 56 is thereby only the side face 56a, and an exposed area is remarkably reduced by this manner. Resultingly, the corrosion is restrained while securing a function as the grounding wiring pattern of removing electrostatic electricity transmitted to a key substrate 50 to a device outside. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic device having a printed wiring board in which a wiring pattern formed of a conductive material on a base material is covered with an electrically insulating resist layer.

  In general, an electronic apparatus has a printed wiring board in which a wiring pattern formed of a conductive material on a base material is covered with an electrically insulating resist layer. In such an electronic device, static electricity charged on an operator's finger or the like may enter the housing and be transmitted to the printed wiring board, causing a problem in an electronic element or the like mounted on the board.

  Conventionally, in order to remove such invading static electricity, there is a printed wiring board in which a grounding wiring pattern is formed (see, for example, Patent Document 1). This prior art electronic device is an in-vehicle magnetic tape reproducing device that reproduces a magnetic tape inserted from an insertion slot, and a resist layer is formed on a portion facing the insertion slot in a printed wiring board (front substrate). Form no grounding wiring pattern (exposed pattern). This grounding wiring pattern is connected to a grounded casing. This makes it possible to remove static electricity that has entered from the insertion opening or the like through the grounding wiring pattern.

Japanese Utility Model Publication No. 5-31199

  In the above prior art, a resist layer is not formed on the upper surface (surface opposite to the substrate) of the grounding wiring pattern. When the upper surface of the grounding wiring pattern is exposed in this manner, the grounding wiring pattern is likely to be corroded because the exposed area is large. When corrosion occurs, there is a problem in that the grounding effect is lowered due to an increase in resistance or disconnection of the conductive material constituting the pattern.

  The objective of this invention is providing the electronic device which can suppress corrosion of the wiring pattern for grounding.

  In order to achieve the above object, an electronic device according to a first invention is an electronic device having at least one printed wiring board in which a wiring pattern formed of a conductive material on a base material is covered with an electrically insulating resist layer. The wiring pattern includes a ground wiring pattern and other circuit wiring patterns, and the resist layer includes the resist layer, the ground wiring pattern, and the base material in this order. A vertical laminated structure is formed along the direction, and the vertical side surface of the ground wiring pattern is exposed.

  Generally, in an electronic device having at least one printed wiring board in which a wiring pattern formed of a conductive material on a base material is covered with an electrically insulating resist layer, static electricity charged on an operator's finger or the like is There is a risk of intrusion through a gap, for example, a cover mating portion, and the like, which is transmitted to the printed wiring board and causes a problem in an electronic element or the like mounted on the board.

  Therefore, a grounding wiring pattern is formed on the printed wiring board, and static electricity transmitted to the board is released to the outside of the apparatus through the grounding wiring pattern. As a result, it is possible to prevent a problem from occurring in an electronic element or the like. Usually, the grounding wiring pattern is provided so that the upper surface (the surface opposite to the base material) is exposed by removing the resist layer on the pattern.

  However, when the upper surface of the grounding wiring pattern is exposed in this way, corrosion is likely to occur because the exposed area is large. When corrosion occurs, there is a problem that the grounding effect is lowered due to an increase in resistance or disconnection of the conductive material constituting the pattern.

  Therefore, in the first invention of the present application, a vertical laminated structure along the thickness direction of the base material is formed in the order of the resist layer, the grounding wiring pattern, and the base material, and the vertical side surfaces of the grounding wiring pattern are exposed. Thus, a resist layer is provided. As a result, the exposed portion of the grounding wiring pattern is only the side surface, and the exposed area can be significantly reduced as compared with the case where the upper surface is exposed as described above. As a result, corrosion can be suppressed while ensuring a function as a grounding wiring pattern for releasing static electricity transmitted to the substrate to the outside of the apparatus.

  Further, since the exposed area can be reduced, it is possible to prevent a short circuit between the grounding wiring pattern and the electronic element caused by foreign matter or the like. Furthermore, there is also an effect of preventing a decrease in aesthetics due to corrosion.

  The electronic device according to a second aspect of the present invention is the electronic device according to the first aspect, wherein the grounding wiring pattern is formed along an outer periphery of the printed wiring board so as to cover a periphery of the circuit wiring pattern. The side surface is covered, and the side surface outside the substrate is exposed.

  In the second invention of the present application, the grounding wiring pattern is formed along the outer periphery of the printed wiring board so as to cover the periphery of the circuit wiring pattern, the side surface on the inner side of the board is covered, and the side surface on the outer side of the board is Exposed. Thereby, the static electricity transmitted to the printed wiring board can be released to the outside of the apparatus through the grounding wiring pattern before being transmitted to the circuit wiring pattern. As a result, electronic elements and the like connected to each other can be protected by the circuit wiring pattern. Further, since only the side surface outside the substrate is exposed, static electricity can be prevented from entering the inside of the substrate.

  According to a third aspect of the present invention, there is provided an electronic apparatus according to the second aspect, further comprising: a plurality of covers constituting a casing of the electronic apparatus, wherein the grounding wiring pattern is provided in the vicinity of a matching portion of the plurality of covers. It is formed on a wiring board.

  In the case where the housing of the electronic device is composed of a plurality of covers, it is conceivable that static electricity enters through the gaps in the mating portions of the covers when the operator's finger contacts the housing.

  In the third invention of the present application, by providing a printed wiring board in which a grounding wiring pattern is formed in the vicinity of the matching portion of the plurality of covers, static electricity that has entered from the matching portion can be quickly released to the outside of the apparatus. .

  An electronic device according to a fourth aspect of the present invention is the electronic device according to any one of the first to third aspects, wherein the printed wiring board is connected to the main board on which electronic elements are mounted, and the key having a plurality of key contacts connected to the main board. The grounding wiring pattern is formed on the key substrate.

  In the fourth invention of the present application, unlike the main board, by providing a grounding wiring pattern on a key board that does not have an electronic element or the like, it is possible to prevent the electronic element or the like from being placed near the path of static electricity. You can prevent problems. In addition, by providing the grounding wiring pattern on the key board in this manner, for example, static electricity that has entered from the gap between the cover and each key can be quickly released to the outside of the apparatus.

  According to the present invention, corrosion of the grounding wiring pattern can be suppressed.

It is a perspective view showing the external appearance which looked at the printed label production apparatus from diagonally upward. It is the perspective view showing the external appearance which looked at the printed label production apparatus of the state which open | released the lower cover from diagonally downward direction. It is a figure showing the internal structure of a cartridge. It is the perspective view which looked at the printed label production apparatus of the state which removed the upper cover from diagonally upward direction. It is a sectional side view by the VV cross section in FIG. It is a top view showing the detailed structure of a key board | substrate. FIG. 7 is a partial cross-sectional view conceptually showing a layer structure of a key board corresponding to a VII-VII cross section in FIG. 6.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  In the present embodiment, the present invention is applied to a printed label producing apparatus 1 as an electronic apparatus. The printed label producing apparatus 1 produces a printed label by cutting a printed label tape on which a desired printing has been performed to a predetermined length. First, a schematic configuration of the print label producing apparatus 1 will be described. In the present embodiment, the front / rear / left / right / up / down directions of the print label producing apparatus 1 refer to the directions shown in FIGS.

  FIG. 1 is a perspective view showing an appearance of the print label producing apparatus 1 as viewed obliquely from above.

  As shown in FIG. 1, the casing 2 of the print label producing apparatus 1 includes a lower cover 15 that constitutes the lower surface of the apparatus, a lateral cover 16 (cover) that constitutes the side surface of the apparatus, and an upper cover 17 that constitutes the upper surface of the apparatus. Cover). The upper cover 17 has function keys for executing various functions of the print label producing apparatus 1 such as a keyboard 3 for performing various operations such as character input from the front direction to the rear direction, and a power switch and a print key. A group 4 and a liquid crystal display 5 for displaying input characters and symbols are provided. Further, a cutter lever 7 for cutting a printed label tape 106 (see FIG. 3 described later) is provided on the right rear side of the horizontal cover 16.

  FIG. 2 is a perspective view illustrating an appearance of the print label producing apparatus 1 with the lower cover 15 opened as viewed obliquely from below.

  As shown in FIG. 2, a cartridge holder 9 to which a cartridge 8 for supplying a printed label tape 106 can be attached and detached is provided at the lower rear side of the print label producing apparatus 1. The cartridge holder 9 is covered when the lower cover 15 configured to be openable and closable with the front end portion of the print label producing apparatus 1 as a rotation shaft is closed, and is exposed when the lower cover 15 is opened. The cartridge holder 9 has a ribbon take-up shaft 11 for taking up a used ink ribbon 10 (see FIG. 3 to be described later) in the cartridge 8 and a tape for carrying a printed printed label tape 106. A tape feed roller drive shaft 12 for driving a feed roller 22 (see FIG. 3 described later) is provided. The cartridge holder 9 is provided with a print head 13 for performing desired printing on the cover film 6 (see FIG. 3 to be described later) so as to be positioned at the opening 14 when the cartridge is mounted.

  FIG. 3 is a diagram illustrating the internal structure of the cartridge 8. 3 shows the print head 13 and the roller holder 19 that are part of the printing mechanism of the print label producing apparatus 1 as well as the internal structure of the cartridge 8.

  As shown in FIG. 3, the cartridge 8 includes a cover film 6 that is a transparent film, an ink ribbon 10 that is coated with ink transferred to the cover film 6, and a cover film 6 that has been printed. Rolls 25, 26, and 27 configured in a roll shape are wound around reel members that are rotatably attached to the cover film 6 and the base tape 20 having the same tape width that are bonded to the back surface. Is provided. Between these rolls 25, 26 and 27, a ribbon take-up roller 21 for taking up the ink ribbon 10 after being used for printing is provided. Further, in the vicinity of the opening 14, the base tape 20 and the cover film 6 are pressed and adhered to the cartridge 8 to form a printed label tape 106, and the printed label tape 106 is discharged to the outside of the cartridge 8. The tape feed roller 22 is provided.

  A roller holder 19 provided on the print label producing apparatus 1 side holds a platen roller 18 disposed at a position facing the print head 13 and a pressing roller 23 disposed at a position facing the tape feed roller 22. Hold. The platen roller 18 and the pressing roller 23 are rotatably attached to a roller holder 19, and the roller holder 19 is rotatably attached to a holder shaft 24. By rotation of the roller holder 19, the platen roller 18 and the pressure roller 23 are pressed against the print head 13 and the tape feed roller 22 by a pressing position A (shown by a solid line in FIG. 3), and the print head 13 and the tape feed roller. It is held at one of the retreat positions B (indicated by a two-dot chain line in FIG.

  When the cartridge 8 having the above configuration is mounted on the cartridge holder 9, the ribbon take-up shaft 11 and the tape feed roller drive shaft 12 provided on the cartridge holder 9 are connected to the ribbon take-up roller 21 and the tape feed roller 22 of the cartridge 8. Each is connected. When the lower cover 15 is closed, the roller holder 19 rotates to reach the pressing position A, and the platen roller 18 and the pressing roller 23 are pressed against the print head 13 and the tape feed roller 22. Thereafter, the ribbon take-up roller 21 and the tape feed roller 22 are rotationally driven when the print label is produced. As a result, the cover film 6 and the ink ribbon 10 are fed out from the respective rolls 25 and 26, overlapped and conveyed to the print head 13, and predetermined printing is performed. Then, the used ink ribbon 10 is separated from the cover film 6 on which printing has been performed, and is taken up by the ribbon take-up roller 21. On the other hand, the printed cover film 6 is bonded to the base tape 20 fed from the roll 27 by the tape feed roller 22 to form a printed label tape 106. The printed label tape 106 is It is discharged outside. Then, by operating the cutter lever 7 described above, the printed label tape 106 is cut into a predetermined length, and a printed label is created.

  When the lower cover 15 is opened after the print label is created, the roller holder 19 is rotated to the retracted position B, and the platen roller 18 and the pressing roller 23 are separated from the print head 13 and the tape feed roller 22. Thereby, the cartridge 8 can be detached from the cartridge holder 9.

  In the printed label producing apparatus 1 described above, the greatest feature of this embodiment is the structure of the grounding wiring pattern provided on the printed wiring board. The details will be described below.

  FIG. 4 is a perspective view of the printed label producing apparatus 1 with the upper cover 17 removed as viewed obliquely from above, and FIG. 5 is a side sectional view taken along the line VV in FIG.

  As shown in FIGS. 4 and 5, the print label producing apparatus 1 includes a main board 41 (printed wiring board) in which an electronic element (IC chip or the like) is mounted inside a housing 2, and the main board 41. It has a key board 50 (printed wiring board) connected via a harness 42 and having a plurality of key contacts 51 (see FIG. 6 described later). The main board 41 and the key board 50 are printed wiring boards in which a wiring pattern formed of a conductive material on a base material is covered with an electrically insulating resist layer. In FIG. 4, the wiring patterns and resist layers of the main board 41 and the key board 50 are not shown for the sake of complexity.

  The main board 41 is disposed below the liquid crystal display 5 at the rear of the apparatus. In addition, the key substrate 50 is provided so that the left and right outer peripheral portions 53 of the outer periphery thereof are in the vicinity of the mating portion 43 between the upper cover 17 and the lateral cover 16. The harness 42 is connected to the rear end of the key board 50. The connection portion between the harness 42 and the key board 50 allows a terminal 42a on the key board side of the harness 42 to penetrate from a lower side into a terminal hole 52 (see FIG. 6 described later) provided in the key board 50. The terminal 42a protruding upward is fixed by soldering.

  FIG. 6 is a plan view showing the detailed structure of the key substrate 50, and FIG. 7 is a partial sectional view conceptually showing the layer structure of the key substrate 50 corresponding to the section VII-VII in FIG.

  The key substrate 50 includes a base material 54, a circuit wiring pattern 55 (wiring pattern) and a ground wiring pattern 56 (wiring pattern) formed of a conductive material on the base material 54, the circuit wiring pattern 55, It has an electrically insulating resist layer 57 for covering the grounding wiring pattern 56 and a plurality of the key contacts 51 connected to the circuit wiring pattern 55 and formed of carbon or the like.

  The key contact 51 is provided at a position corresponding to each key constituting the keyboard 3 and the function key group 4 described above. The key contact 51 is closed when the operator operates each key of the keyboard 3 and the function key group 4. Accordingly, a corresponding operation signal is input from the key substrate 50 to the main substrate 41 via the harness 42, and operation control corresponding to the operation signal is performed.

  The circuit wiring pattern 55 constitutes a key circuit by connecting at least one key contact 51 and the corresponding terminal 42a of the harness 42, and between the terminal hole 52 and the key contact 51 and a plurality of them. Each of the key contacts 51 is wired between each other. In FIG. 6, only a part of the circuit wiring pattern 55 is shown to prevent complication. The end portion of the circuit wiring pattern 55 on the terminal hole 52 side is connected to the terminal 42a of the harness 42 penetrating the terminal hole 52 by soldering as described above.

  The grounding wiring pattern 56 is formed along the outer periphery 53 of the key substrate so as to cover the periphery of the circuit wiring pattern 55 and around the entire periphery of the substrate excluding the portion where the terminal hole 52 is formed. The ground wiring pattern 56 is connected to the DC jack 60 (see FIGS. 2 and 4) via the harness 42. The DC jack 60 is connected to an output plug of an AC adapter (not shown) as an external power source. The grounding wiring pattern 56 is grounded to the outside of the housing 2 through the AC adapter. As shown in FIG. 6, on the left and right sides and the rear side of the key substrate 50, exposed portions 59 where the resist layer 57 is not formed are formed on the substrate external side of the ground wiring pattern 56. The exposed portion 59 is formed to have a width of about 2 mm to 5 mm, for example. In FIG. 6, the portion where the resist layer 57 is formed is indicated by hatching, and the exposed portion 59 where the resist layer 57 is not formed is indicated in white.

  The laminated structure of the formation part of this exposed part 59 is demonstrated using FIG. As shown in FIG. 7, in the range A where the ground wiring pattern 56 is formed, the resist layer 57, the ground wiring pattern 56, and the base material 54 are stacked in the vertical direction along the thickness direction of the base material 54 in this order. The structure is structured. In the range B where the exposed portion 59 is formed, since the resist layer 57 is not formed, the layer structure is composed of only the base material 54. As a result, the upper surface 54a of the base 54 is exposed and the side surface 56a of the ground wiring pattern 56 on the outside of the substrate is exposed. The height of the side surface 56a in the vertical direction is very small because it corresponds to the thickness of the grounding wiring pattern 56. For this reason, the exposed area of the grounding wiring pattern 56 is, for example, the upper surface of the grounding wiring pattern 56. Compared to the exposed configuration, the size can be significantly reduced.

  Further, in the range C that is further outside the substrate of the exposed portion 59, the resist layer 57 and the base material 54 are two-layered. Similarly, in the range D that is inside the substrate of the grounding wiring pattern 56, the resist layer is similarly formed. A two-layer structure of 57 and a base 54 is formed. As a result, the side surface 56 b on the substrate inner side of the grounding wiring pattern 56 is covered with the resist layer 57. Although not shown here, in the range D, the formation portion of the circuit wiring pattern 55 has a three-layer structure of the resist layer 57, the circuit wiring pattern 55, and the base material 54.

  With the above configuration, the side surface 56a of the ground wiring pattern 56 on the outside of the substrate is exposed on the left and right sides and the rear side of the key substrate 50 on which the exposed portion 59 is formed. As a result, the static electricity that has entered from the gap between the housings 2 (for example, the mating portion 43 of the upper cover 17 and the side cover 16) can be transmitted to the grounding wiring pattern 56 via the exposed side surface 56a and escaped to the outside of the apparatus. It can be done. In this example, the exposed portion 59 is formed on the left and right sides where the operator can easily grasp the housing 2 and the rear side corresponding to the function key group 4 with high operation frequency, but not on the front side. The exposed portion 59 may also be formed on the front side.

  According to the printed label producing apparatus 1 of the embodiment described above, the following effects can be obtained. That is, in general, in an electronic apparatus having a printed wiring board, static electricity charged on an operator's finger or the like penetrates from a gap in the housing, for example, a cover fitting portion, and is transmitted to the printed wiring board, and is mounted on the board. There is a risk of causing problems in electronic elements and the like. Therefore, a grounding wiring pattern is formed on the printed wiring board, and static electricity transmitted to the board is released to the outside of the apparatus through the grounding wiring pattern. As a result, it is possible to prevent a problem from occurring in an electronic element or the like. Usually, the grounding wiring pattern is provided so that the upper surface (the surface opposite to the base material) is exposed by removing the resist layer on the pattern. However, when the upper surface of the grounding wiring pattern is exposed in this way, corrosion is likely to occur because the exposed area is large. When corrosion occurs, there is a problem that the grounding effect is lowered due to an increase in resistance or disconnection of the conductive material constituting the pattern.

  Therefore, in the printed label producing apparatus 1 of the present embodiment, the resist layer 57 is provided so that the side surface 56a of the ground wiring pattern 56 is exposed. As a result, the exposed portion of the ground wiring pattern 56 is only the side surface 56a, and the exposed area can be significantly reduced as compared with the case where the upper surface is exposed as described above. As a result, corrosion can be suppressed while ensuring a function as a grounding wiring pattern for releasing static electricity transmitted to the key substrate 50 to the outside of the apparatus.

  Further, since the exposed area can be reduced, it is possible to prevent a short circuit between the ground wiring pattern 56 and the key contact 51 and the like caused by foreign matter or the like. Furthermore, there is also an effect of preventing a decrease in aesthetics due to corrosion.

  In the present embodiment, in particular, the grounding wiring pattern 56 is formed along the outer periphery of the key substrate 50 so as to cover the periphery of the circuit wiring pattern 55, and the side surface 56 b on the inner side of the substrate is covered. The outer side surface 56a is exposed. Thereby, the static electricity transmitted to the key substrate 50 can be released to the outside of the apparatus via the ground wiring pattern 56 before being transmitted to the circuit wiring pattern 55. As a result, the key contacts 51 connected to each other by the circuit wiring pattern 55 and the main board 41 connected via the harness 42 by the circuit wiring pattern 55 can be protected. Further, since only the side surface 56a on the outside of the substrate is exposed, static electricity can be prevented from entering the inside of the substrate.

  In the present embodiment, in particular, a key substrate 50 having a grounding wiring pattern 56 formed around is provided in the vicinity of the mating portion 43 between the upper cover 17 and the lateral cover 16 constituting the casing 2 of the print label producing apparatus 1. . Thereby, when an operator's finger | toe contacts the housing | casing 2, the static electricity which penetrate | invades from the clearance gap between the matching parts 43 of the covers 16 and 17 can be quickly escaped outside the apparatus.

  In the present embodiment, in particular, unlike the main board 41, the grounding wiring pattern 56 is provided on the key board 50 on which no electronic elements are mounted, thereby preventing the electronic elements from being placed near the path of static electricity. In addition, problems such as electronic elements can be prevented. Further, by providing the grounding wiring pattern 56 on the key board 50 in this way, not only the alignment portion 43 of the covers 16 and 17 but also the gap between the upper cover 17 and the keys constituting the keyboard 3 and the function key group 4, for example. It is possible to quickly escape the invading static electricity to the outside of the apparatus.

  In the above description, the grounding wiring pattern 56 is provided only on the key substrate 50, but may be provided on the main substrate 41. For example, it is effective when the main board 41 is installed at a position where static electricity easily enters.

  In the above description, only the side surface 56a on the outside of the substrate of the grounding wiring pattern 56 is exposed, but only the side surface 56b on the inside of the substrate or both side surfaces 56a and 56b may be exposed. Thus, for example, even when static electricity may enter the inside of the key board 50 due to the device structure, the static electricity is transmitted to the grounding wiring pattern 56 via the exposed side surface 56b, and the outside of the device. Can escape.

  In the above description, the case where the printed label tape 106 that has been printed is cut with a cutter to create a print label has been described as an example. However, the present invention is not limited to this. That is, when a label mount (so-called die-cut label) previously separated into a predetermined size corresponding to the label is continuously arranged on the tape fed out from the roll, the tape can be cut without being cut with a cutter. After the label is discharged, only the label mount (the one with the corresponding print) may be peeled off from the tape to produce a print label, and the present invention can be applied to such a case.

  Moreover, in the above, it was the system which prints on the cover film 6 different from the base tape 20, and affixes these, However, It is not restricted to this, Printing is performed on the to-be-printed tape layer with which the printing tape was equipped. The present invention may be applied to a method of performing (a type in which bonding is not performed).

  Furthermore, the above is an example in which the base tape 20 and the cover film 6 are wound around a reel member to form a roll, and the roll is placed in the cartridge 8 and the printed label tape 106 is fed out. However, this is not a limitation. For example, a long flat paper-like or strip-like tape or sheet (including one formed by cutting a tape wound around a roll and then cutting to an appropriate length) is stacked in a predetermined storage section. A cartridge is formed (for example, by stacking in a tray shape), and the cartridge is mounted on the cartridge holder 9 on the print label producing apparatus 1 side, and is transported, conveyed, and printed to produce a print label. You may do it.

  Further, the roll is directly detachably mounted on the printing label producing apparatus 1 side, and a long flat paper or strip-like tape or sheet is transferred one by one from the outside of the printing label producing apparatus 1 by a predetermined feeder mechanism. However, it is also possible to supply the print label producing apparatus 1 to the inside of the print label producing apparatus 1, and the arrangement is not limited to that which can be attached to and detached from the main body side of the print label producing apparatus 1 such as the cartridge 8. Alternatively, it is conceivable to provide rolls 25, 27, etc. as an integrated type. In this case, the same effect is obtained.

  In the above, the case where the present invention is applied to the printed label producing apparatus 1 as an example of an electronic device has been described. However, other than this, for example, a PC, a portable terminal, a cellular phone, an electronic musical instrument, an electronic calculator, a game machine, etc. The present invention can be applied to various electronic devices as long as the electronic device has a wiring board.

  In addition to those already described above, the methods according to the above-described embodiments and modifications may be used in appropriate combination.

  In addition, although not illustrated one by one, the present invention is implemented with various modifications within a range not departing from the gist thereof.

1 Print label production equipment (electronic equipment)
16 Side cover (cover)
17 Upper cover (cover)
41 Main board (printed wiring board)
43 Matching section 50 Key board (printed wiring board)
51 Key contact 54 Base material 55 Circuit wiring pattern (wiring pattern)
56 Grounding wiring pattern (wiring pattern)
56a side surface 56b side surface 57 resist layer

Claims (4)

An electronic device having at least one printed wiring board in which a wiring pattern formed of a conductive material on a base material is covered with an electrically insulating resist layer,
The wiring pattern is
It consists of a grounding wiring pattern and other circuit wiring patterns.
The resist layer is
The resist layer, the grounding wiring pattern, and the base material are formed in the order of the laminated structure in the vertical direction along the thickness direction of the base material, and the vertical side surface of the grounding wiring pattern is exposed. An electronic device characterized by being provided. The electronic device according to claim 1,
The grounding wiring pattern is:
It is formed along the outer periphery of the printed wiring board so as to cover the periphery of the circuit wiring pattern, the side surface inside the substrate is covered, and the side surface outside the substrate is exposed. Electronics. The electronic device according to claim 2,
A plurality of covers constituting a casing of the electronic device;
The grounding wiring pattern is:
An electronic apparatus formed on the printed wiring board provided in the vicinity of a matching portion of the plurality of covers. The electronic device according to any one of claims 1 to 3,
The printed wiring board is
A main board on which electronic elements are mounted, and a key board connected to the main board and having a plurality of key contacts,
The grounding wiring pattern is:
An electronic apparatus formed on the key substrate.

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