JP2010283108A5 - - Google Patents

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Publication number
JP2010283108A5
JP2010283108A5 JP2009134818A JP2009134818A JP2010283108A5 JP 2010283108 A5 JP2010283108 A5 JP 2010283108A5 JP 2009134818 A JP2009134818 A JP 2009134818A JP 2009134818 A JP2009134818 A JP 2009134818A JP 2010283108 A5 JP2010283108 A5 JP 2010283108A5
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JP
Japan
Prior art keywords
substrate
back surface
holding
imprint apparatus
contact
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JP2009134818A
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Japanese (ja)
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JP2010283108A (en
JP5328495B2 (en
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Priority to JP2009134818A priority Critical patent/JP5328495B2/en
Priority claimed from JP2009134818A external-priority patent/JP5328495B2/en
Publication of JP2010283108A publication Critical patent/JP2010283108A/en
Publication of JP2010283108A5 publication Critical patent/JP2010283108A5/ja
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Publication of JP5328495B2 publication Critical patent/JP5328495B2/en
Expired - Fee Related legal-status Critical Current
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Description

本発明の一実施形態のインプリント装置は、パターンが形成された型を基板上の被転写部材に接触させて前記パターンを前記基板に形成するインプリント装置であって、前記型を前記被転写部材に接触させるときに前記基板の裏面の全域を保持する第1の保持手段と、前記型と前記被転写部材とを引き離す離型手段とを備え、前記離型手段は、前記型と前記被転写部材とを引き離すときに前記基板の裏面を保持する第2の保持手段を備え、前記第2の保持手段は、前記基板の裏面の外周端部に当接する凸状の当接手段を備えることを特徴とする。
An imprint apparatus according to an embodiment of the present invention is an imprint apparatus that forms a pattern on a substrate by bringing a pattern-formed mold into contact with a member to be transferred on the substrate. comprising a first holding means for holding the entire area of the back surface of the substrate when contacting the member, and a releasing means for separating the said transfer target member before and SL-type, said release means, said said mold Second holding means for holding the back surface of the substrate when being separated from the member to be transferred is provided, and the second holding means is provided with convex contact means for contacting the outer peripheral edge of the back surface of the substrate. It is characterized by that.

Claims (6)

パターンが形成された型を基板上の被転写部材に接触させて前記パターンを前記基板に形成するインプリント装置であって、
前記型を前記被転写部材に接触させるときに前記基板の裏面の全域を保持する第1の保持手段と、
記型と前記被転写部材とを引き離す離型手段とを備え、
前記離型手段は、前記型と前記被転写部材とを引き離すときに前記基板の裏面を保持する第2の保持手段を備え、
前記第2の保持手段は、前記基板の裏面の外周端部に当接する凸状の当接手段を備えることを特徴とするインプリント装置。
An imprint apparatus that forms a pattern on the substrate by bringing a pattern-formed mold into contact with a transfer member on the substrate,
First holding means for holding the entire back surface of the substrate when the mold is brought into contact with the transferred member;
Wherein the front Symbol type and a release means for separating a target transfer member,
The mold release means includes second holding means for holding the back surface of the substrate when the mold and the transferred member are separated from each other.
The imprint apparatus, wherein the second holding unit includes a convex contact unit that contacts an outer peripheral end of the back surface of the substrate.
前記当接手段は、前記基板の裏面の外周端部全域に当接するように設けられており、
前記第2の保持手段は、前記当接手段が前記基板の裏面の外周端部全域に当接したときに、該基板の裏面と前記第2の保持手段とで形成される空間と該第2の保持手段が設けられている空間とを連通する連通手段を備えることを特徴とする請求項1に記載のインプリント装置。
The contact means is provided so as to contact the entire outer peripheral end portion of the back surface of the substrate,
The second holding means includes a space formed between the back surface of the substrate and the second holding means when the contact means contacts the entire outer peripheral end portion of the back surface of the substrate, and the second holding means. The imprint apparatus according to claim 1, further comprising communication means for communicating with a space in which the holding means is provided.
前記基板が円形状であり、
前記第2の保持手段が備える前記当接手段を前記基板の裏面と平行な面で切ったときの断面が円環形状であることを特徴とする請求項2に記載のインプリント装置。
The substrate is circular;
3. The imprint apparatus according to claim 2, wherein a cross section of the abutment unit included in the second holding unit when cut by a plane parallel to the back surface of the substrate is an annular shape.
前記当接手段は、前記基板の裏面の外周端部の一部に当接するように設けられていることを特徴とする請求項1に記載のインプリント装置。   The imprint apparatus according to claim 1, wherein the abutting unit is provided so as to abut a part of an outer peripheral end portion of the back surface of the substrate. 前記当接手段が可撓性部材であることを特徴とする請求項1乃至4のいずれかに記載のインプリント装置。   The imprint apparatus according to claim 1, wherein the contact means is a flexible member. 請求項1乃至5のいずれかに記載のインプリント装置を用いて前記パターンを基板に形成する工程と、
前記工程において前記パターンを形成された基板を加工する工程と、
を有することを特徴とする物品の製造方法。
Forming the pattern on the substrate using the imprint apparatus according to claim 1;
Processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:
JP2009134818A 2009-06-04 2009-06-04 Imprint apparatus and article manufacturing method Expired - Fee Related JP5328495B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009134818A JP5328495B2 (en) 2009-06-04 2009-06-04 Imprint apparatus and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009134818A JP5328495B2 (en) 2009-06-04 2009-06-04 Imprint apparatus and article manufacturing method

Publications (3)

Publication Number Publication Date
JP2010283108A JP2010283108A (en) 2010-12-16
JP2010283108A5 true JP2010283108A5 (en) 2012-07-19
JP5328495B2 JP5328495B2 (en) 2013-10-30

Family

ID=43539609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009134818A Expired - Fee Related JP5328495B2 (en) 2009-06-04 2009-06-04 Imprint apparatus and article manufacturing method

Country Status (1)

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JP (1) JP5328495B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011077882A1 (en) * 2009-12-25 2011-06-30 株式会社日立ハイテクノロジーズ Double-side imprint device
JP5438578B2 (en) * 2010-03-29 2014-03-12 富士フイルム株式会社 Method and apparatus for forming fine uneven pattern
WO2011155582A1 (en) * 2010-06-11 2011-12-15 株式会社日立ハイテクノロジーズ Stamper for microstructure transfer and microstructure transfer device
JP6497938B2 (en) * 2015-01-05 2019-04-10 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method.

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0379314A (en) * 1989-08-22 1991-04-04 Omron Corp Manufacture of optical part and mold for optical part
JP3456290B2 (en) * 1995-01-31 2003-10-14 オムロン株式会社 Optical element manufacturing method and optical element manufacturing apparatus
JPH09219041A (en) * 1996-02-13 1997-08-19 Sony Corp Production of optical recording medium and apparatus for production using the same
JP4515625B2 (en) * 2000-12-08 2010-08-04 大日本印刷株式会社 Lens sheet peeling method and peeling apparatus
JP5497984B2 (en) * 2005-07-07 2014-05-21 天野エンザイム株式会社 Method for producing beer or beer-like beverage
JP2007083626A (en) * 2005-09-22 2007-04-05 Ricoh Co Ltd Microstructure transfer device
EP1957249B1 (en) * 2005-12-08 2014-11-12 Canon Nanotechnologies, Inc. Method and system for double-sided patterning of substrates
US20090273119A1 (en) * 2006-03-10 2009-11-05 Tetsuya Imai Imprint Method and Imprint Apparatus
JP5088369B2 (en) * 2007-05-18 2012-12-05 コニカミノルタホールディングス株式会社 Imprint method
JP2010269580A (en) * 2009-05-25 2010-12-02 Canon Inc Imprint apparatus and manufacturing method for article

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