JP2010270197A - Resin composition for coating and cured product obtained by using the composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition for coating which improves performance of a device and decreases variation of performance between devices. <P>SOLUTION: The resin composition 5 for coating includes: a coated inorganic particle product composed of inorganic particles and a coating resin adhering to at least a part of each surface of the inorganic particles; fumed silica; and a curable resin. In particular, the resin composition for coating includes: a coated magnetic particle product composed of magnetic particles 6 and coating resin adhering to at least a part of each surface of the magnetic particles; fumed silica; and the curable resin, or includes: the coated fluorescent particle product composed of fluorescent particles and the coating resin adhering to at least a part of each surface of the fluorescent particles; fumed silica; and the curable resin. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a resin composition for coating and a cured product obtained using the composition. More specifically, the present invention relates to a coating resin composition comprising an inorganic particle covering body comprising inorganic particles and a covering resin body attached to at least a part of the surface of the inorganic particle, and a curing obtained using the composition. About the body.

  Conventionally, inductors are used in power supply devices and drive circuits in portable electronic devices such as mobile phones and digital cameras. Such an inductor usually includes a coil formed by winding a metal wire and a terminal electrode connected to the coil. The inductor is required to be thin and small and have a large inductance.

  In contrast, in Patent Document 1, an attempt is made to increase the inductance of the inductor by covering the coil of the inductor with a cured body obtained from a magnetic resin (coating resin composition) containing magnetic material powder.

JP 2008-306017 A Japanese Patent No. 2927279

However, the inductor disclosed in Patent Document 1 has a problem that the inductance value varies greatly.
Accordingly, an object of the present invention is to obtain a coating resin composition capable of increasing the inductance value in the inductor and reducing the variation in the inductance value. Another object of the present invention is to obtain an inductor having a large inductance value and a small variation in the inductance value.

  Further, as a light emitting device capable of obtaining white light, a light emitting device having an LED chip whose light emitting layer is made of a gallium nitride compound semiconductor and a coating member (cured body) covering the LED chip is known (patent). Reference 2). Here, the coating member is obtained from a transparent resin (a coating resin composition) containing a YAG phosphor. In this light emitting device, the LED chip emits blue light, and the YAG phosphor in the coating member existing around the LED chip is excited by the blue light and emits yellow light. And white light is obtained by the mixed color of blue light and yellow light.

However, there is a problem that the chromaticity of white light in the manufactured light emitting device has a large variation.
Accordingly, an object of the present invention is to obtain a coating resin composition that can obtain white light having a preferable chromaticity and can reduce variations in chromaticity of white light. Another object of the present invention is to obtain a light emitting device that emits white light having a preferable chromaticity and has a small variation in chromaticity of white light.

  Thus, in a device having a cured body obtained from a coating resin composition containing inorganic particles such as magnetic material powder and YAG phosphor, when performance is further improved, variation in performance between devices is suppressed. There is a need.

  Accordingly, an object of the present invention is to obtain a coating resin composition that can improve device performance and can reduce variation in performance between devices. Another object of the present invention is to obtain a device with improved performance and small variation in performance between devices.

The present inventors have found that the above problem can be solved by using an inorganic particle coated body comprising inorganic particles and a coated resin body attached to at least a part of the surface of the inorganic particles.
That is, the coating resin composition according to the present invention includes an inorganic particle covering body composed of inorganic particles and a covering resin body attached to at least a part of the surface of the inorganic particles, fumed silica, and a curable resin. And

The cured body according to the present invention is obtained from the coating resin composition.
The first coating resin composition according to the present invention comprises a magnetic particle covering body comprising a magnetic particle and a covering resin body attached to at least a part of the surface of the magnetic particle, fumed silica, and a curable resin. Features.

  In the magnetic particle coated body, when the total of the magnetic particles and the coated resin body is 100 parts by mass, the coated resin body is included in an amount of more than 50 parts by mass and less than 100 parts by mass, and the magnetic particles are It is preferably contained in an amount exceeding 0 parts by mass and less than 50 parts by mass.

The covering resin body is preferably a cured product formed from an epoxy compound.
Alternatively, the coating resin body is preferably a cured product formed from a (meth) acryloyl group-containing compound having one or more (meth) acryloyl groups in the molecule.

Or it is preferable that the said coating resin body is formed from a polyimide resin.
The curable resin is preferably an epoxy compound.
The first method for producing a coating resin composition according to the present invention is characterized in that the magnetic particle coating, the fumed silica, and the curable resin are mixed after the magnetic particle coating is produced.

The first cured body according to the present invention is obtained from the first resin composition for coating.
An inductor according to the present invention is an inductor comprising a coil formed by winding a metal wire and a terminal electrode connected to the coil, wherein at least a part of the coil surface is a first resin composition for coating. It is covered with the 1st hardening body obtained from a thing.

  An inductor manufacturing method according to the present invention is a method for manufacturing an inductor comprising a coil formed by winding a metal wire and a terminal electrode connected to the coil, wherein the base on which the terminal electrode is formed is provided. A coil mounting process in which a plurality of coils are mounted on a collective base that can be obtained in large numbers, and at least part of the mounted coil surface is covered with a cured body obtained from the first resin composition for coating, and a collective inductor And a cutting step of cutting the collective inductor into a single inductor.

  A second coating resin composition according to the present invention comprises a phosphor particle covering body, a fumed silica, and a curable resin comprising phosphor particles and a covering resin body attached to at least a part of the surface of the phosphor particles. It is characterized by including.

  In the phosphor particle covering body, when the total of the phosphor particles and the covering resin body is 100 parts by mass, the covering resin body is included in an amount of more than 50 parts by mass and less than 100 parts by mass. It is preferable that the body particles are contained in an amount exceeding 0 parts by mass and less than 50 parts by mass.

The covering resin body is preferably a cured product formed from a silicone resin.
The second cured body according to the present invention is obtained from the second resin composition for coating.

  The light-emitting device according to the present invention is a light-emitting device comprising an LED chip (light-emitting diode chip) and a cured body covering the LED chip, wherein the cured body is a second resin composition for coating. A cured product obtained from the above.

  A method for producing a light emitting device according to the present invention is a method for producing a light emitting device comprising an LED chip and a cured body covering the LED chip, wherein the LED chip is made from a second coating resin composition. The method includes a step of covering with the obtained cured body.

When a device is produced using the coating resin composition according to the present invention, the performance of the device can be improved, and the variation in performance between devices can be reduced.
Specifically, when an inductor is manufactured using the first coating resin composition according to the present invention, the inductance value in the inductor can be increased, and the variation in the inductance value can be reduced.

  Furthermore, when a light-emitting device is produced using the second coating resin composition according to the present invention, preferable white light chromaticity can be obtained, and variation in white light chromaticity can be reduced.

FIG. 1 is a diagram for explaining the inductor according to the first embodiment. FIG. 2 is a diagram for explaining the inductor according to the first embodiment. FIG. 3 is a diagram for explaining the inductor according to the second embodiment. FIG. 4 is a diagram for explaining the inductor according to the second embodiment. FIG. 5 is a diagram for explaining the inductor according to the third embodiment. FIG. 6 is a diagram for explaining the inductor manufacturing method according to the first embodiment. FIG. 7 is a diagram for explaining the inductor manufacturing method according to the first embodiment. FIG. 8 is a diagram for explaining the inductor manufacturing method according to the first embodiment. FIG. 9 is a diagram for explaining the inductor manufacturing method according to the first embodiment. FIG. 10 is a diagram for explaining the inductor manufacturing method according to the first embodiment. FIG. 11 is a diagram for explaining the inductor manufacturing method according to the first embodiment. FIG. 12A is a diagram for explaining the inductor manufacturing method according to the first embodiment; 12-2 is a drawing for explaining the inductor manufacturing method according to the first embodiment. FIG. FIG. 13 is a diagram for explaining how the coated resin body adheres in the magnetic particle coated body. FIG. 14 is a view for explaining a light emitting device according to the present invention. FIG. 15 is a diagram for explaining a light emitting device according to the present invention. FIG. 16 is a view for explaining a light emitting device according to the present invention. FIG. 17 is a view for explaining a light emitting device according to the present invention. FIG. 18 is a view for explaining a light emitting device according to the present invention. FIG. 19 is a diagram for explaining a light emitting device according to the present invention.

Hereinafter, the present invention will be specifically described.
The resin composition for coating according to the present invention includes an inorganic particle covering, fumed silica, and a curable resin, and the inorganic particle covering includes an inorganic particle and a covering resin attached to at least a part of the surface of the inorganic particle. Consists of. Moreover, the hardening body which concerns on this invention is obtained from the said resin composition for a coating. Since the coating resin composition includes the coating resin body according to the present invention, when the cured product is produced by curing the resin composition, the inorganic particles do not settle, and the cured body is inorganic. The particles are uniformly dispersed. Therefore, as described later, when a device is produced using the coating resin composition according to the present invention, the performance of the device can be improved and the variation in performance between devices can be reduced.

  Hereinafter, the first coating resin composition, the first cured body, the second coating resin composition, and the second cured body will be described in detail.

<First Resin Composition for Coating and First Cured>
[First Resin Composition for Coating]
The first resin composition for coating according to the present invention includes a magnetic particle coating, fumed silica, and a curable resin.

(Magnetic particle coating)
The magnetic particle covering body includes magnetic particles and a covering resin body attached to at least a part of the surface of the magnetic particles. Since the first resin composition for coating according to the present invention includes the coating resin body, when the first cured body is produced by curing the resin composition, the magnetic particles do not settle. The magnetic particles are uniformly dispersed in the first cured body. Specifically, the coating resin body adheres to the magnetic particles, so that the specific gravity of the entire magnetic particle coating body is lower than that of the magnetic particles. On the other hand, the viscosity of the first coating resin composition may once decrease in the process of being cured by heating. In this process, the magnetic particle coated body having a reduced specific gravity is less likely to settle than when the magnetic particles are present alone in the composition. For this reason, the magnetic particles are uniformly dispersed in the first cured body finally obtained. Therefore, as described later, according to the first resin composition for coating according to the present invention, it has a large inductance value (in this specification, “inductance value” is also referred to as “L value”). In addition, an inductor having a small variation in inductance value can be manufactured. In the first cured body, the coating resin body and the portion where the curable resin is cured are integrated.

  The coating resin body is preferably a cured product formed from an epoxy compound, a cured product formed from a (meth) acryloyl group-containing compound having one or more (meth) acryloyl groups in the molecule, or a polyimide resin. .

First, the magnetic particle covering body when the covering resin body is a cured product formed from an epoxy compound will be described.
Examples of the material forming the magnetic particles include ferrite, amorphous alloy, permalloy, electromagnetic soft iron, silicon steel, Sendust alloy, and Fe—Al alloy. Magnetic particles made of these materials may be used alone or in combination of two or more.

Ferrite is an oxide represented by the following composition formula (1).
AFe ₂ O ₄ (1)
(A represents a divalent metal ion of Mn, Mg, Ni, Co, Cu or Zn. As A, the above metal ions may be used alone or in combination of two or more.)

  In particular, NiZn ferrite (when A is a divalent metal ion of Ni and Zn in the above formula (1)) and MnZn ferrite (when A is Mn and Zn in the above formula (1)) (When it is an ion) is preferably used. The magnetic particles made of ferrite may be sintered ferrite powder obtained by finely pulverizing a ferrite sintered body.

  Examples of the amorphous alloy include cobalt-based, iron-based, and nickel-based high magnetic permeability materials. The amorphous alloy includes, for example, 70 to 98 mass% in total of Co, Fe and Ni and 2 to 30 mass% in total of B, Si and P (the total of Co, Fe and Ni and B, Si and P is included) 100 mass%), and further includes Al, Mn, Zr, Nb, and the like.

  As the cobalt-based high magnetic permeability material, specifically, an alloy composed of Co-84 mass%, Fe-5.3 mass%, Si-8.5 mass%, and B-2.2 mass%, Co -84 wt%, Fe-3.3 wt%, B-1.3 wt%, P-9.8 wt% and Al-1.6 wt% alloy, Co-89 wt% and Fe-5 .3 mass%, Si-2.3 mass% and B-3.4 mass% alloy, Co-81.9 mass%, Fe-5.1 mass%, Si-10 mass% and B-3 Alloy consisting of 1 mass%, Co-80 mass%, Fe-10 mass%, Si-6 mass% and B-4 mass%, Co-78.8 mass% and Fe-5.1 mass% And an alloy composed of Si-6.1% by mass, B-4.7% by mass, and Ni-5.3% by mass. Specifically, as an iron-based high magnetic permeability material, an alloy composed of Fe-95.4 mass% and B-4.6 mass%, Fe-91.4 mass% and Si-5.9 mass% And an alloy composed of B-2.7% by mass. Specific examples of the Ni-based high magnetic permeability material include an alloy composed of Ni-94.5% by mass and P-5.5% by mass.

  Permalloys include 78-Permalloy, 45-Permalloy, Hipernik, Monimax, Sinimax, Radiometal, 1040 Alloy, Mumetal, Cr-Permalloy, Mo-Permalloy, Supermalloy, HardPerm, HardPerm, 36 Species and 2 types, JIS PC 1 to 3 types, JIS Pd 1 and 2 types, JIS PE 1 and 2 types, and the like. Examples of electromagnetic soft iron include industrial pure iron, armco iron, Cioffi pure iron, and low carbon steel plate. Examples of silicon steel include non-oriented silicon steel and directional silicon steel. Examples of the sendust alloy and Fe-Al alloy include alpalm, hypermal, sendust, and super sendust.

As a material for forming magnetic particles, a material having higher magnetic permeability is more preferable.
Of these, magnetic particles made of NiZn-based or MnZn-based ferrite and magnetic particles made of an amorphous alloy are preferably used.

  As long as the epoxy compound used for producing the coating resin body has two or more epoxy groups in one molecule, the molecular structure and the molecular weight are not limited. As the epoxy compound, an aromatic epoxy resin is used. , Alicyclic epoxy resins, aliphatic epoxy resins and the like.

  Specific examples of aromatic epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol type epoxy resins such as bisphenol S type epoxy resins, phenol novolac type epoxy resins, and novolacs such as cresol novolac type epoxy resins. Type epoxy resin. Specific examples of the alicyclic epoxy resin include an epoxy resin having at least one alicyclic epoxy ring. Specific examples of the aliphatic epoxy resins include polyglycidyl ethers of aliphatic polyhydric alcohols or alkylene oxide adducts thereof. The above epoxy resins may be used alone or in combination of two or more. The epoxy compound may be liquid at room temperature (25 ° C.) or solid. In the case of using a solid epoxy resin when producing the coating resin body, it is preferable to mix and dissolve with a liquid epoxy resin. Of these, bisphenol A type epoxy resins and bisphenol F type epoxy resins are preferably used.

  When an aromatic epoxy resin or an aliphatic epoxy resin is used as the epoxy compound, the coated resin body attached to at least a part of the surface of the magnetic particles is usually a manifest type curing agent for curing the epoxy compound, more specifically, It is prepared using an addition polymerization type curing agent. Examples of the addition polymerization type curing agent include amine-based curing agents, acid anhydride-based curing agents, and thiol-based curing agents. The above addition polymerization type curing agents may be used alone or in combination of two or more.

  Below, when using an aromatic epoxy resin or an aliphatic epoxy resin as an epoxy compound, the manufacturing method of a magnetic particle coating body is demonstrated concretely. First, a blend is prepared by blending magnetic particles, an epoxy compound, and an addition polymerization type curing agent. At this time, it is preferable to obtain the above blend by blending the epoxy compound and the addition polymerization curing agent so that the viscosity of the mixture obtained by mixing only the epoxy compound and the addition polymerization curing agent is 10,000 cP or more. Thereby, when hardening the said compound, it can harden | cure, with a magnetic particle disperse | distributing uniformly. That is, in the finally obtained magnetic particle coated body, variation in the ratio between the magnetic particles and the coated resin body can be reduced. The said viscosity can be adjusted with the kind and compounding quantity of an epoxy compound and an addition polymerization type hardening | curing agent. The viscosity is measured with an E-type viscometer. An addition polymerization type hardening | curing agent is normally mix | blended in the quantity of 5-50 mass parts with respect to 100 mass parts of epoxy compounds. Further, the epoxy compound and the addition polymerization type curing agent (total) are usually more than 50 parts by mass and less than 100 parts by mass in the epoxy compound, the addition polymerization type curing agent and 100 parts by mass of the magnetic particles, preferably 50 It is desirable to blend in an amount exceeding 80 parts by weight and exceeding part by weight. Thereby, the ratio of the coating resin body and the magnetic particles in the obtained magnetic particle coating body can be within a preferable range.

Subsequently, although the said compound is hardened, this hardening is normally completed in 30 minutes-2 days at normal temperature (25 degreeC). In the cured product thus obtained, the magnetic particles are dispersed.
Next, the cured product is pulverized to produce a magnetic particle coating. For example, the cured product may be pulverized using a mill to produce a magnetic particle coating, or the cured product may be pulverized using a mill to obtain a pulverized product, and then classified to form a magnetic particle coating. It may be manufactured. The magnetic particle coated body thus obtained is composed of magnetic particles and a coated resin body adhered to at least a part of the surface of the magnetic particles. The coated resin body is usually composed of an epoxy compound and an addition polymerization type curing agent. It is a formed cured product.

  In addition, when an alicyclic epoxy resin is used as an epoxy compound, the coating resin body attached to at least a part of the surface of the magnetic particles is usually a sensible type curing agent for curing the epoxy compound, more specifically a cationic type. It is prepared using a curing agent. Examples of the cationic curing agent include iodonium salt compounds such as diphenyliodonium hexafluorophosphate, sulfonium salt compounds such as triphenylsulfonium hexafluorophosphate, phosphonium salt compounds, pyridinium salt compounds, and iron-arene complex compounds. The cationic curing agents may be used alone or in combination of two or more.

  Below, when using an alicyclic epoxy resin as an epoxy compound, the manufacturing method of a magnetic particle covering is demonstrated concretely. First, a blend in which an epoxy compound and a cationic curing agent are blended is prepared. At this time, it is preferable to blend the epoxy compound and the cationic curing agent so that the viscosity of the mixture is 1000 cP or less to obtain the blend. Thereby, the hardened | cured material (coating resin body) formed from the said compound can be made to adhere uniformly to the surface of a magnetic particle. That is, in the finally obtained magnetic particle coated body, variation in the ratio between the magnetic particles and the coated resin body can be reduced. The said viscosity can be adjusted with the kind and compounding quantity of an epoxy compound and a cationic hardening | curing agent. The viscosity is measured with an E-type viscometer. A cationic hardening | curing agent is mix | blended with the quantity of 0.5-10 mass parts normally with respect to 100 mass parts of epoxy compounds.

  In addition, you may further mix volatile solvents, such as ether and hexane, into the said compound. In this case, the volatile solvent is used in an amount of, for example, 0.3 to 10 parts by mass with respect to 100 parts by mass of the epoxy compound.

  Next, the compound is sprayed on the magnetic particles, and ultraviolet rays are irradiated to polymerize the epoxy compound on the surface of the magnetic particles, thereby producing a magnetic particle coating. At this time, it is preferable to blow the above-mentioned composition in a state where the magnetic particles are blown by blowing air on the magnetic particles. Further, the epoxy compound and the cationic curing agent (total) are usually more than 50 parts by mass and preferably 50 parts by mass with respect to 100 parts by mass of the epoxy compound, the cationic curing agent and the magnetic particles. It is desirable to spray so that it may exceed 80 parts by mass. Thereby, the ratio of the coating resin body and the magnetic particles in the obtained magnetic particle coating body can be within a preferable range. The magnetic particle coated body thus obtained is composed of magnetic particles and a coated resin body adhered to at least a part of the surface of the magnetic particles, and the coated resin body is usually formed from an epoxy compound and a cationic curing agent. It is a cured product.

  Next, the magnetic particle coated body when the coated resin body is a cured product formed from a (meth) acryloyl group-containing compound having at least one (meth) acryloyl group in the molecule will be described. The (meth) acryloyl group-containing compound is a compound that can be polymerized by ultraviolet irradiation. In this specification, the acryloyl group and the methacryloyl group are also collectively referred to as “(meth) acryloyl group”.

About a magnetic particle, it is the same as the case where the said coating resin body is a hardened | cured material formed from an epoxy compound.
Specific examples of the monofunctional (meth) acryloyl group-containing compound having one (meth) acryloyl group in the molecule used for preparing the coating resin body include 2-ethylhexyl (meth) acrylate, ethoxydiethylene glycol di (Meth) acrylate, phenoxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dicyclopentenyl (meth) acrylate, phenol ethylene oxide (EO) modified (meth) acrylate, nonylphenol EO modified (meth) acrylate, nonylphenol propylene oxide (PO) modified (meth) acrylate, 2-ethylhexyl EO modified (meth) acrylate, N- (meth) acryloyloxyethyl hexahydride Phthalimide and the like. Of these, phenol EO-modified acrylate, nonylphenol EO-modified acrylate, nonylphenol PO-modified acrylate, 2-ethylhexyl EO-modified acrylate, and N-acryloyloxyethyl hexahydrophthalimide are preferably used.

  Specific examples of the polyfunctional (meth) acryloyl group-containing compound having two or more (meth) acryloyl groups in the molecule used for preparing the coating resin body include neopentyl glycol di (meth) acrylate, 1 , 6-hexanediol di (meth) acrylate, hydroxypivalate neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, bis ((meth) acryloxyethyl) bisphenol A, tricyclodecane dimethylol di ( Bifunctional compounds such as (meth) acrylate, isocyanuric acid EO-modified di (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane PO-modified tri (meth) acrylate, isocyanuric acid EO-modified tri (meth) acrylate, Tri- or higher functional compounds such as intererythritol tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate Can be mentioned. In addition, examples of the polyfunctional (meth) acryloyl group-containing compound include polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, and polyol (meth) acrylate prepolymers in the molecule. And a polyfunctional (meth) acrylic prepolymer having two or more (meth) acryloyl groups. A polyester (meth) acrylate-based prepolymer is obtained, for example, by esterifying hydroxyl groups of a polyester oligomer having hydroxyl groups at both ends obtained by condensation of a polyvalent carboxylic acid and a polyhydric alcohol with (meth) acrylic acid. It is done. It can also be obtained by esterifying the terminal hydroxyl group of an oligomer obtained by adding alkylene oxide to a polyvalent carboxylic acid with (meth) acrylic acid. The epoxy (meth) acrylate-based prepolymer is obtained by, for example, reacting (meth) acrylic acid with an oxirane ring of a relatively low molecular weight bisphenol type epoxy resin or novolak type epoxy resin and esterifying it. The urethane (meth) acrylate-based prepolymer is obtained, for example, by esterifying a polyurethane oligomer obtained by a reaction between a polyether polyol or a polyester polyol and a polyisocyanate with (meth) acrylic acid. The polyol (meth) acrylate-based prepolymer is obtained by esterifying a hydroxyl group of a polyether polyol with (meth) acrylic acid. Among these, tricyclodecane dimethylol diacrylate, isocyanuric acid EO-modified diacrylate, trimethylolpropane triacrylate, trimethylolpropane PO-modified triacrylate, isocyanuric acid EO-modified triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate Ditrimethylolpropane tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and polyester acrylate prepolymers are preferably used.

  The said (meth) acryloyl group containing compound may be used independently, or may be used in combination of 2 or more type, as long as the hardened | cured material is obtained. From the viewpoint of curability, it is preferable to use, for example, one or more polyfunctional (meth) acryloyl group-containing compounds. It is also preferable to use a combination of one or more monofunctional (meth) acryloyl group-containing compounds and one or more polyfunctional (meth) acryloyl group-containing compounds.

  When producing a coated resin body attached to at least a part of the surface of the magnetic particles, a radical polymerization initiator is usually used as a photopolymerization initiator. The radical polymerization initiator generates radicals by irradiation with ultraviolet rays and initiates polymerization of the (meth) acryloyl group-containing compound.

  As radical polymerization initiators, benzophenone initiators such as benzophenone and Michler's ketone, diketone initiators such as benzyl and phenylmethoxy diketone, acetophenone initiators such as acetophenone, benzoin initiators such as benzoin ethyl ether and benzyldimethyl ketal Thioxanthone initiators such as 2,4-diethylthioxanthone, and quinone initiators such as 2-methylanthraquinone and camphorquinone. Among these, acetophenone-based initiators are preferably used from the viewpoint of absorption wavelength. The above radical polymerization initiators may be used alone or in combination of two or more.

  Below, the manufacturing method of a magnetic particle coating body is demonstrated concretely. First, a blend in which a (meth) acryloyl group-containing compound and a radical polymerization initiator are blended is prepared. At this time, it is preferable to blend the (meth) acryloyl group-containing compound and the radical polymerization initiator so that the viscosity of the blend becomes 1000 cP or less to obtain the blend. Thereby, the hardened | cured material (coating resin body) formed from the said compound can be made to adhere uniformly to the surface of a magnetic particle. That is, in the finally obtained magnetic particle coated body, variation in the ratio between the magnetic particles and the coated resin body can be reduced. The said viscosity can be adjusted with the kind and compounding quantity of a (meth) acryloyl group containing compound and a radical polymerization initiator. The viscosity is measured with an E-type viscometer. A radical polymerization initiator is normally mix | blended in the quantity of 0.3-10 mass parts with respect to 100 mass parts of (meth) acryloyl group containing compounds.

  In addition, you may further mix volatile solvents, such as ether and hexane, into the said compound. In this case, the volatile solvent is used in an amount of, for example, 0.3 to 10 parts by mass with respect to 100 parts by mass of the (meth) acryloyl group-containing compound.

  Next, the compound is sprayed onto the magnetic particles, and ultraviolet rays are irradiated to polymerize the (meth) acryloyl group-containing compound on the surface of the magnetic particles to produce a magnetic particle coating. At this time, it is preferable to blow the above-mentioned composition in a state where the magnetic particles are blown by blowing air on the magnetic particles. The (meth) acryloyl group-containing compound and the radical polymerization initiator (total) are usually more than 50 parts by mass and 100 parts by mass with respect to 100 parts by mass of the (meth) acryloyl group-containing compound, radical polymerization initiator and magnetic particles. It is desirable to spray it in an amount less than, preferably more than 50 parts by mass and 80 parts by mass or less. Thereby, the ratio of the coating resin body and the magnetic particles in the obtained magnetic particle coating body can be within a preferable range. The magnetic particle coated body thus obtained is composed of magnetic particles and a coated resin body adhered to at least a part of the surface of the magnetic particles. The coated resin body is usually composed of a (meth) acryloyl group-containing compound and a radical. It is a cured product formed from a polymerization initiator.

Finally, the magnetic particle covering body when the covering resin body is a polyimide resin will be described.
About a magnetic particle, it is the same as the case where the said coating resin body is a hardened | cured material formed from an epoxy compound.

  The polyimide resin used for preparing the coated resin body is not particularly limited as long as it has a imide bond in the molecular main chain. Examples of the polyimide resin include a condensation polymer of aromatic diamine and aromatic tetracarboxylic acid. Bismaleimide resin that is an addition polymer of aromatic diamine and bismaleimide, polyamino bismaleimide resin that is addition polymer of aminobenzoic acid hydrazide and bismaleimide, bismaleimide triazine composed of dicyanate compound and bismaleimide resin Resin etc. are mentioned. A polyimide resin may be used independently or may be used in combination of 2 or more type.

  When producing a coated resin body adhered to at least a part of the surface of the magnetic particles, a compound in which a polyimide resin is dissolved in a solvent is usually used. Examples of the solvent include volatile solvents such as toluene, xylene, and ethyl acetate.

  Below, the manufacturing method of a magnetic particle coating body is demonstrated concretely. First, a blend in which a polyimide resin and a solvent are blended is prepared. At this time, a solvent is mix | blended in the quantity which can melt | dissolve a polyimide resin. Thereby, the hardened | cured material (coating resin body) formed from the said compound can be made to adhere uniformly to the surface of a magnetic particle. That is, in the finally obtained magnetic particle coated body, variation in the ratio between the magnetic particles and the coated resin body can be reduced.

  Subsequently, while spraying the said compound with respect to a magnetic particle, a solvent is evaporated and a magnetic particle coating body is manufactured. At this time, it is preferable to blow the above-mentioned composition in a state where the magnetic particles are blown by blowing air on the magnetic particles. In particular, it is preferable to evaporate the solvent by applying hot air. In addition, the polyimide resin is sprayed to 100 parts by mass of the polyimide resin and the magnetic particles so that the amount is usually more than 50 parts by mass and less than 100 parts by mass, preferably more than 50 parts by mass and 80 parts by mass or less. Is desirable. Thereby, the ratio of the coating resin body and the magnetic particles in the obtained magnetic particle coating body can be within a preferable range. The magnetic particle coating obtained in this way is composed of magnetic particles and a coating resin body adhered to at least a part of the surface of the magnetic particles, and the coating resin body is formed of a polyimide resin.

  In the above-described magnetic particle coated body, when the magnetic particle coated body (total of magnetic particles and coated resin body) is 100 parts by mass, the coated resin body is preferably included in an amount of more than 50 parts by mass and less than 100 parts by mass. More preferably, it is contained in an amount of more than 50 parts by weight and 80 parts by weight or less, and the magnetic particles are preferably contained in an amount of more than 0 parts by weight and less than 50 parts by weight, more preferably 20 parts by weight to 50 parts by weight. It is desirable to be included in an amount less than. When the amount of the magnetic particles and the coating resin body is in the above range, when the first cured body is produced by curing the first coating resin composition according to the present invention, the magnetic particles do not settle more, The magnetic particles are more uniformly dispersed in the first cured body. Specifically, when the coating resin body adheres to the magnetic particles at the above ratio, the specific gravity of the magnetic particle coating body as a whole is significantly lower than that of the magnetic particles. By the way, the viscosity of the first coating resin composition may once decrease in the process of being cured by heating. In this process, the magnetic particle coated body having a reduced specific gravity is difficult to settle. For this reason, the magnetic particles are more uniformly dispersed in the first cured body finally obtained. Therefore, according to the first resin composition for coating including such a magnetic particle coating, an inductor having a large L value and a smaller variation in the L value can be produced. In addition, the ratio of the amount of the magnetic particles and the coating resin body in the magnetic particle coating body can be considered to be the same as the ratio of the amount of the raw material used when producing the magnetic particle coating body. Specifically, if an aromatic epoxy resin or an aliphatic epoxy resin is used as the epoxy compound, the ratio of the magnetic particles to the epoxy compound and the addition polymerization curing agent and the ratio of the magnetic particles to the coating resin body are Can be considered the same. The same applies when other epoxy compounds, (meth) acryloyl group-containing compounds and polyimide resins are used.

  In the magnetic particle coated body obtained as described above, the coated resin body is attached to at least a part of the surface of the magnetic particles. Specifically, in the magnetic particle covering body 60, the covering resin body 61 may cover the entire surface of the magnetic particles 6 uniformly (FIG. 13 (a)) or intermittently (FIG. 13 (b)). In addition, a part of the surface of the magnetic particle 6 may be uniformly covered (FIG. 13C) or intermittently covered (FIG. 13D). In addition, one magnetic particle covering may contain one magnetic particle or a plurality of magnetic particles.

  Of cured products formed from epoxy compounds, cured products formed from (meth) acryloyl group-containing compounds having at least one (meth) acryloyl group in the molecule, and polyimide resins, it is easy to produce as a coated resin body Then, the hardened | cured material formed from an epoxy compound is used more preferable.

(Fumed silica)
When fumed silica is used, sedimentation of the magnetic particle coating body can be suppressed in the first coating resin composition according to the present invention, and the first coating resin composition according to the present invention is heated. In the process of producing a first cured product by curing, the change in the viscosity of the composition can be kept small. Thus, since the first resin composition for coating according to the present invention includes the magnetic particle coating body and fumed silica, when the first cured body is produced by curing the resin composition. The magnetic particles do not settle, and the magnetic particles are uniformly dispersed in the first cured body. Therefore, as will be described later, according to the first coating resin composition of the present invention, an inductor having a large L value and a small variation in the L value can be manufactured.

  Fumed silica is usually produced by vaporizing a volatile silicon compound such as silicon tetrachloride and subjecting it to combustion hydrolysis in an oxygen hydrogen flame, for example. In this invention, it does not restrict | limit in particular, A well-known thing can be used. Fumed silica may be used alone or in combination of two or more.

The fumed silica preferably has a primary particle size in the range of 5 to 50 nm.
(Curable resin)
As the curable resin, an epoxy compound that is a thermosetting resin, specifically, an aromatic epoxy resin or an aliphatic epoxy resin is preferably used. About an aromatic epoxy resin and an aliphatic epoxy resin, it is the same as that of the epoxy resin demonstrated in the magnetic particle coating body.

(Other)
As other components, a curing agent for curing the curable resin is used. When the curable resin is an aromatic epoxy resin or an aliphatic epoxy resin, it is usually a latent curing agent that can cure the curable resin by heating, or a manifest type that can cure the curable resin at room temperature (25 ° C.) or under heating. A curing agent is used. Examples of the latent curing agent include curing of amine curing agents, dicyandiamide curing agents, imidazole curing agents, capsule type imidazole curing agents, amine imide curing agents, polyamine salt curing agents, and hydrazide curing agents. Agents. Examples of the above-described manifesting curing agent include the above-described addition polymerization curing agents. A hardening | curing agent may be used independently or may be used in combination of 2 or more type.

  In addition, when a latent curing agent is used for the first coating resin composition, the viscosity of the composition once decreases in the process of being cured by heating. However, in the first coating resin composition, the magnetic particles are present as magnetic particle-coated granules having a reduced specific gravity, so that the resin composition is uniformly dispersed without sedimentation of the magnetic particles. Can be cured in a wet state.

  The first coating resin composition may further contain a coloring material. When using a color material, it is preferable that it is contained in the quantity of 0.01-3.0 mass% in the 1st resin composition for coatings.

(First coating resin composition)
The first coating resin composition according to the present invention includes the above-described magnetic particle coating, fumed silica, curable resin, and other components such as a curing agent as necessary. In other words, the first coating resin composition according to the present invention comprises a magnetic particle coating, a fumed silica, a curable resin, and a curing agent as necessary after the magnetic particle coating is prepared as described above. It can be obtained by mixing other ingredients. When using a curing agent, the amount of the magnetic particle coating is 10 to 1000 parts by mass and the fumed silica is 0.1 to 10 parts by mass, preferably 3 to 100 parts by mass of the curable resin and the curing agent. It is desirable to blend in an amount of 10 parts by mass. When the blending amount is in the above range, in the process of producing the first cured body by curing the first coating resin composition according to the present invention, the magnetic particles do not settle, and the first cured body is in the first cured body. Magnetic particles can be uniformly dispersed. Further, the curing agent may be used in an amount capable of curing the first coating resin composition. For example, from the viewpoint of curability, the curing agent is 0.7 to 1.3 with respect to 1 equivalent of the curable resin. It is preferable to mix | blend in the quantity of an equivalent.

[First cured body]
The first cured body according to the present invention is obtained from the first coating resin composition, and in the first cured body, the magnetic particles are uniformly dispersed in the matrix formed from the resin coating and the curable resin. Has been. Since this first hardened body is suitably used for an inductor mounted on a portable electronic device, a case where the first hardened body is used for an inductor will be described as an example.

  An inductor according to the present invention is an inductor comprising a coil formed by winding a metal wire and a terminal electrode connected to the coil, wherein at least a part of the coil surface is the first coating resin composition. Covered with a first cured body obtained from Hereinafter, embodiments of the inductor will be described more specifically with reference to the drawings.

(Inductor of Embodiment 1)
First, based on FIG. 1 and FIG. 2, the structure of the inductor of Embodiment 1 is demonstrated. Here, FIG. 1 is an external perspective view of the inductor according to the first embodiment, and FIG. 2 is a cross-sectional view taken along a cutting line AA shown in FIG. In the inductor according to the first embodiment, the terminal electrode is formed by the lead frame, and the first cured body is formed on the entire circumference (all the outer circumference) of the coil.

  In the inductor (inductor 1) of the first embodiment shown in FIGS. 1 and 2, the bobbin 2 is made of a magnetic material such as ferrite and has a large-diameter flange portion 2b at both ends of a cylindrical core 2a. A metal wire 3 is wound around the core 2 a of the bobbin 2 to form a coil 4.

  The outer peripheral surface of the coil 4 is covered with a first hardened body 5 including magnetic particles 6. The first cured body 5 is formed from the first coating resin composition described above. Note that the magnetic particles 6 contained in the first cured body 5 are schematically illustrated, and are actually invisible because they are minute particles. Thus, since the 1st hardening body 5 contains the magnetic particle 6, it has the property as a magnetic body. Therefore, when the first hardened body 5 covers the entire outer periphery of the coil 4, the coil 4 is potted by the core 2a of the bobbin 2, which is a magnetic material, the flange portion 2b, and the first hardened body 5. The magnetic circuit is in a closed state (that is, a closed magnetic circuit) like the mold core. As a result, compared with the case where the coil 4 is not covered with the 1st hardening body 5, the magnetic permeability (mu) of the coil 4 becomes high and the L value of an inductor becomes large. Incidentally, even in the inductor disclosed in Japanese Patent Application Laid-Open No. 2008-306017, the coil is covered with a hardened body, and therefore, compared with the case where the coil is not covered with the hardened body, the magnetic permeability μ and the L value of the coil. Is big. However, the first cured body according to the present invention is more magnetic than the cured body disclosed in Japanese Patent Application Laid-Open No. 2008-306017 because it is formed from the first coating resin composition including the magnetic particle coating described above. The particles are more uniformly dispersed. Therefore, the inductor according to the first embodiment can suppress variations in the magnetic permeability μ and the L value of the coil as compared with the inductor disclosed in Japanese Patent Application Laid-Open No. 2008-306017.

  Further, when an inductor having a predetermined L value is manufactured, the number of turns of the metal wire can be reduced in the inductor according to the first embodiment as compared with the case where the coil 4 is not covered with the first hardened body 5. For this reason, in the inductor according to the first embodiment, the size of the coil can be reduced as compared with the case where the coil 4 is not covered with the first hardened body 5, that is, the inductor can be reduced in size. By the way, when the size of the inductor is reduced, the inductor itself has closed magnetism. When the first cured body according to the present invention is used for such a small inductor, there is an advantage that the L value can be further improved.

  As the content of the magnetic particles 6 increases, the permeability μ of the coil 4 increases and the L value also increases. However, the content is appropriate in consideration of workability and cost when forming the first cured body 5. The amount can be determined. Moreover, if the 1st hardening body 5 is formed so that it may enter between the flange parts 2b of the bobbin 2, as shown in FIG. 2, since the magnetic resistance of a magnetic circuit will fall, L value can be enlarged efficiently.

  The lead frame 11 as a base is made of a metal material, and a circular through hole 13 on which the coil 4 is mounted is formed. Reference numerals 14a to 14d denote four terminal electrodes formed at the four corners of the inductor 1 by the lead frame 11 (the terminal electrodes 14d are hidden behind the coil 4 in the drawing). The terminal electrodes 14a to 14d have bent portions 15a to 15d that are bent in one direction on the metal wire 3 side. Winding terminals 3a and 3b of the metal wire 3 are entangled with the bent portions 15a and 15b of the terminal electrodes 14a and 14b, and then electrically coupled by welding or soldering. On the other hand, the terminal electrodes 14c and 14d are normally not connected and are used as dummy terminals. The connection of the winding terminals 3a and 3b to the terminal electrodes 14a to 14d is not limited to the terminal electrodes 14a and 14b, and may be arbitrary. When the inductor 1 is used as a transformer, for example, the metal wire 3 is wound twice and the four winding terminals of the metal wire 3 are coupled to the terminal electrodes 14a to 14d. The terminal electrodes 14a to 14d are connected to a mounting board (not shown) on which the inductor 1 is mounted, and are electrically connected to an electronic circuit on the mounting board.

  In addition, the coil 4, the first cured body 5 covering the coil 4, and the terminal electrodes 14 a to 14 d on the lead frame 11 are typically sealed with a sealing material 7 that does not contain magnetic particles and is made of an epoxy resin or the like. As a result, the magnetic particles 6 are not exposed on the surface of the inductor 1, and the magnetic particles 6 can be prevented from falling off due to contact during mounting or impact during use, and the inductor having a stable L value and excellent reliability can be obtained. Can be provided. In general, since the entire inductor 1 is sealed with the sealing material 7, an inductor that is mechanically strong and excellent in weather resistance can be obtained. Further, since the bent portions 15 a to 15 d of the terminal electrodes 14 a to 14 d are embedded in the sealing material 7, the terminal electrodes 14 a to 14 d are securely fixed to the sealing material 7. Here, in FIG. 1, the sealing material 7 is shown as a transparent member for convenience of explanation.

  Next, a method for manufacturing the inductor according to the first embodiment will be described. The inductor manufacturing method according to the first embodiment, which includes a coil formed by winding a metal wire and a terminal electrode connected to the coil, is a collective base that can take a large number of bases on which terminal electrodes are formed. A coil mounting step (S1) for mounting a plurality of coils, and a collective inductor manufacturing step for manufacturing the collective inductor by covering the mounted coil surface with the first cured body obtained from the first resin composition for coating. (S2) and a cutting step (S3) for cutting the collective inductor into a single inductor. Hereinafter, the manufacturing process will be described with reference to the drawings.

  Specifically, the coil mounting step (S1) includes the assembly base manufacturing step (S1-1), the adhesive material bonding step (S1-2), the bobbin mounting step (S1-3), and the coil winding step (S1-4). ) And a terminal processing step (S1-5).

  First, in the assembly base manufacturing process (S1-1), an assembly lead frame (an assembly base that can take a large number of bases on which terminal electrodes are formed) is manufactured as an assembly base. Specifically, as shown in FIG. 6, a thin plate made of a metal material is pressed to form a large number of through holes 13, bent portions 15 a to 15 d of terminal electrodes 14 a to 14 d, and the like. A collective lead frame 10 as a collective base from which a large number 11 can be obtained is completed. The form of the collective lead frame 10 is not limited, and may be a long reel shape, or may be a collective lead frame obtained by cutting a long reel-shaped collective lead frame into a certain length.

  Next, in the adhesive material bonding step (S1-2), the adhesive material is bonded to the assembly lead frame obtained in the assembly base manufacturing step (S1-1). Specifically, as shown in FIG. 7, a sheet-like adhesive tape 16 as an adhesive is applied to the entire back surface of the assembly lead frame 10 by applying pressure in the direction of arrow C. Through this step, the adhesive surface 16 a of the adhesive tape 16 is exposed from the plurality of through holes 13 formed in the assembly lead frame 10.

  Next, in the bobbin mounting step (S1-3), a plurality of bobbins are collectively mounted on the assembly base to which the adhesive material is bonded. Specifically, as shown in FIG. 8, the plurality of bobbins 2 are aligned by a tray (not shown) according to the position of the through hole 13 of the assembly lead frame 10, and then the tray is moved in the direction of arrow D. The plurality of bobbins 2 are moved and mounted in the through holes 13. That is, since the adhesive surface 16a of the adhesive tape 16 is exposed on the bottom surface of the through hole 13 as described above, by pressing the bobbin 2 aligned by the tray in the direction of arrow D, the bobbin 2 It is fitted into the through hole 13, is in close contact with the adhesive surface 16 a, and is fixed in the through hole 13.

  Here, the diameter of the through hole 13 may be slightly smaller than the diameter of the bobbin 2 and the bobbin 2 may be press-fitted into the through hole 13. In this case, the bobbin 2 is firmly bonded to the assembly lead frame 10, and the bobbin 2 does not come out of the through hole 13 even if the adhesive force of the adhesive tape 16 is somewhat weak. Further, the press-fitting of the bobbin 2 improves the positional accuracy of the bobbin 2 with respect to the collective lead frame 10, and the subsequent coil winding process (S1-4) can be performed smoothly. Alternatively, the diameter of the through hole 13 may be slightly larger than the diameter of the bobbin 2 to provide a clearance, and the bobbin 2 may be gently fitted into the through hole 13. In this case, the bobbin 2 is fixed to the assembly lead frame 10 only by the adhesive force of the adhesive tape 16, but the bobbin 2 can be fitted into the through hole 13 even if the alignment of the bobbin 2 with respect to the through hole 13 is not precise. Can do. Thereby, the tray for aligning the bobbins 2 can be designed roughly to some extent, and the bobbin mounting step (S1-3) can be simplified. Whether the bobbin 2 and the through hole 13 of the assembly lead frame 10 are to be press-fitted or loose-fitted may be selected according to product specifications and manufacturing process capability.

  Next, in the coil winding step (S1-4), a metal wire is continuously wound around the bobbin on the assembly base on which the bobbin is mounted to form a coil. Specifically, as shown in FIG. 9, the nozzle 40 of the winding machine (not shown) has a rotating shaft and can feed the metal wire 3 while rotating in the direction of arrow E. Thereby, the bobbin 2 mounted on the collective lead frame 10 is wound by the metal wire 3 fed out from the nozzle 40, and the coil 4 is manufactured. Specifically, the nozzle 40 wraps the metal wire 3 around the bent portion 15b, rotates in the direction of arrow E, winds it around the core 2a of the bobbin 2, winds a predetermined number of times, and then turns the bent portion 15a. To tie. Subsequently, the nozzle 40 moves to the adjacent bobbin 2, is wound around the bent portion 15 b, wound around the core 2 a of the bobbin 2, wound a predetermined number of times, and then is wound around the bent portion 15 a. .

  Next, in the terminal processing step (S1-5), terminal processing is performed by arc welding, soldering, or the like on the bent portions 15a and 15b in which the metal wire 3 is tangled in the coil winding step (S1-4). The winding terminals 3a and 3b of the wire 3 are securely coupled to the bent portions 15a and 15b. Thus, by providing the bent portions 15a to 15d in the assembly lead frame 10, the coil winding step (S1-4) and the terminal processing step (S1-5) are facilitated, and the metal wire 3 and the terminal electrode 14a and 14b are reliably electrically coupled.

  Next, in the collective inductor manufacturing step (S2), the coil surface formed in the coil mounting step (S1) as described above is covered with the first cured body obtained from the first coating resin composition, Manufacture collective inductors. Specifically, as shown in FIG. 10, the first coating resin composition according to the present invention is dispensed to the outer periphery of the coil 4 mounted on the assembly lead frame 10 (that is, the exposed portion of the metal wire 3). The outer periphery of the coil 4 is covered with the resin composition.

  Next, the first coating resin composition is cured. In the case where a latent type or a manifestation type curing agent is used for the first coating resin composition, the heating temperature and the heating time may be appropriately selected according to the type and blending amount of the curable resin and the latent curing agent to be used. Good. In addition, you may harden the said resin composition by heating at the sealing process mentioned later. In the case where a sensible type curing agent is used for the first coating resin composition, it may be cured at room temperature (25 ° C.), and the curing time depends on the type and amount of the curable resin and sensible type curing agent used. What is necessary is just to select suitably according to. Further, in this way, the outer periphery of the coil 4 is covered with the first cured body 5 obtained from the first coating resin composition, and the collective inductor 50 is obtained.

  The inductor manufactured in the collective inductor manufacturing process (S2) is preferably sealed with resin. Specifically, as shown in FIG. 11, the assembly lead frame 10 and the coil 4 covered with the first hardened body 5 are injection molded, transfer molded, or liquid resin with a sealing material 7 such as an epoxy resin. Sealing is performed by a molding method such as molding. Thereby, the collective inductor 50 in which a large number of inductors are gathered is completed. Thus, when sealed with the sealing material 7, an inductor that is mechanically strong and excellent in weather resistance can be obtained. Further, since the bent portions 15a to 15d (see FIG. 6) formed in the collective lead frame 10 are bent in a direction to be embedded in the sealing material 7, terminal electrodes 14a to 14 formed by the collective lead frame 10 are formed. 14d (refer to FIG. 6) is firmly fixed to the sealing material 7 and hardly peeled off, so that a highly reliable inductor is obtained. Note that the back surface of the assembly lead frame 10 is preferably not sealed with the sealing material 7. Further, it is preferable to seal at the same height as the coil 4 or slightly lower than the coil 4.

  Finally, in the cutting step (S3), the collective inductor obtained in the collective inductor manufacturing step (S2) is cut into a single inductor. Specifically, as shown in FIG. 12A, the completed collective inductor 50 is cut along the cutting lines X and Y by dicing or press punching. In the case of punching, it is preferable that the interval between the lead frames is widened and the vicinity of the cutting lines X and Y (that is, the punching region) is not sealed in manufacturing the collective inductor 50. FIG. 12-2 shows a state where the collective inductor 50 is cut by the cutting step (S3) and a large number of single inductors 1 are completed. As described above, in the above-described inductor manufacturing method, a large number of inductors can be simultaneously manufactured at the same time by the collective lead frame 10, so that mass production is possible at a low cost, and there is little variation in product dimensions and characteristics. Can provide.

  As described above, according to the first embodiment, since the coil is covered with the first hardened body in which magnetic particles are uniformly dispersed, a high-performance inductor having a high magnetic permeability μ and a large L value is provided. Can be provided. Further, variation in L value among products can be suppressed.

(Inductor of Embodiment 2)
First, based on FIG. 3 and FIG. 4, the structure of the inductor of Embodiment 2 is demonstrated. Here, FIG. 3 is an external perspective view of the inductor according to the second embodiment, and FIG. 4 is a top view of the inductor according to the second embodiment as viewed from above. In addition, the same number is attached | subjected to the same element as Embodiment 1, and the overlapping description is abbreviate | omitted. In the inductor according to the second embodiment, the terminal electrode is formed by the lead frame, and the first cured body is formed on a part of the outer periphery of the coil.

  In the inductor (inductor 20) according to the second embodiment, unlike the inductor according to the first embodiment, a part (two places) of the outer peripheral surface of the coil 4 is covered with the first cured bodies 5a and 5b including the magnetic particles 6. Yes. For this reason, the coil 4 is in a state in which a part of the magnetic circuit is closed by the bobbin 2 and the magnetic resins 5a and 5b. Therefore, if the size of the coil 4 and the number of turns of the metal wire 3 are equal to the inductor of the first embodiment (inductor 1), the resistance value of the inductor of the second embodiment is the same as that of the inductor of the first embodiment, and the L value is It is smaller than the inductor of form 1.

  In the inductor according to the second embodiment, the first hardened bodies 5a and 5b are formed so as to face two locations on the outer periphery of the coil 4. However, the present invention is not limited to this. You may form in three places or you may form in the narrow range of one place. The closing range of the magnetic circuit of the coil 4 varies depending on the range of the first hardened body formed on the outer periphery of the coil 4. That is, since the magnetic permeability μ of the coil 4 can be changed, an inductor having an arbitrary L value can be obtained without changing the resistance value. Thus, according to the 1st hardening body which concerns on this invention, the magnitude | size of the coil 4 and the winding number of the metal wire 3 remain the same, By changing the formation range of the 1st hardening body formed in the outer periphery of the coil 4 The L value can be changed arbitrarily without changing the resistance value. Therefore, a series of inductors can be easily realized. Further, variation in the L value can be suppressed among manufactured inductors. Also, of course, in the production of the first coating resin composition described above, by changing the type and content of the magnetic particles (that is, the content of the magnetic particle coating to be blended in the first coating resin composition). Can also control the L value.

  Next, a method for manufacturing the inductor according to the second embodiment will be described. Except for the collective inductor manufacturing step (S2), the process is the same as that of the inductor of the first embodiment. In the collective inductor manufacturing step (S2), the coil surface formed in the coil mounting step (S1) is covered with the first cured body obtained from the first coating resin composition, and the collective inductor is manufactured. Specifically, the first coating resin composition according to the present invention is dispensed to a part of the outer periphery of the coil 4 mounted on the assembly lead frame 10 (that is, two portions of the exposed portion of the metal wire 3). The outer periphery of the coil 4 is covered with the resin composition. The point of curing the first coating resin composition is the same as in the inductor of the first embodiment. Thus, a part (2 places) of the outer periphery of the coil 4 is covered with the first cured bodies 5a and 5b obtained from the first resin composition for coating, and the collective inductor 50 is obtained.

  As described above, according to the second embodiment, inductors having the same resistance value and different L values can be easily manufactured by changing the range of the first cured body that covers the outer periphery of the coil. Further, variation in the L value can be suppressed among manufactured inductors. Therefore, it is possible to provide a low-cost inductor with a series of L values.

(Inductor of Embodiment 3)
First, the configuration of the inductor according to the third embodiment will be described with reference to FIG. Here, FIG. 5 is an external perspective view of the inductor according to the third embodiment. In addition, the same number is attached | subjected to the same element as Embodiment 1, and the overlapping description is abbreviate | omitted. In the inductor of the third embodiment, terminal electrodes are formed by a circuit board that is a double-sided printed wiring board, and the first cured body is formed on the entire circumference (all the outer circumference) of the coil.

  In the inductor (inductor 30) of the third embodiment shown in FIG. 5, unlike the inductor of the first embodiment, a circuit board 31 is used instead of the lead frame 11 as a base. The circuit board 31 is made of a double-sided printed wiring board, and the winding terminals 3a and 3b of the metal wire 3 are electrically connected to the wiring patterns 32a and 32b formed at the corners of the circuit board 31 by thermocompression bonding or soldering. Combined. Furthermore, the wiring patterns 32a and 32b are connected to electrodes formed on the back surface of the circuit board 31 through through holes (not shown), and are connected to a mounting board (not shown) on which the inductor 30 is mounted.

  Next, the inductor manufacturing method according to the third embodiment is the same as the inductor manufacturing method according to the first embodiment except that, in the coil mounting step (S1), an aggregate circuit board is used instead of the aggregate lead frame.

  As described above, according to the third embodiment, since the coil is covered with the first cured body in which magnetic particles are uniformly dispersed, a high-performance inductor having a high magnetic permeability μ and a large L value is provided. it can. Further, variation in L value among products can be suppressed.

  In the inductor according to the third embodiment, the first cured body 5 is formed on the entire circumference of the coil 4, but is not limited to this. For example, as described in the second embodiment, the first cured body 5 is used. May be formed on a part of the outer periphery of the coil 4. Also in this case, the L value can be adjusted according to the formation range.

(Other)
In the inductors of the first to third embodiments, the coil 4 includes the bobbin 2 as a core. However, the coil 4 is not limited to this form, and may include an air-core coil that does not have the bobbin 2. . When the coil 4 is an air-core coil, a mode in which the entire coil 4 is embedded in the first hardened body 5 and the outside thereof is sealed with the sealing material 7 is preferable.

  Moreover, although the inductor of Embodiment 1-3 is an inductor which mounts a single coil, the inductor which concerns on this invention may change the shape of a lead frame, and may be the multiple inductor which mounts multiple coils. .

  Furthermore, the first cured body according to the present invention is not limited to an inductor, and can be applied to a composite type SMD component in which another electronic component such as an IC chip is mounted on a lead frame together with a coil.

<Second Resin Composition for Coating and Second Cured>
[Second Resin Composition for Coating]
The second resin composition for coating according to the present invention includes a phosphor particle covering, fumed silica, and a curable resin.

(Phosphor particle coating)
The phosphor particle covering body includes phosphor particles and a covering resin body attached to at least a part of the surface of the phosphor particles. Since the second resin composition for coating according to the present invention contains the coating resin body, the phosphor particles settle when the resin composition is cured to produce the second cured body. First, the phosphor particles are uniformly dispersed in the second cured body. In detail, it is the same as that of the case of the 1st resin composition for coating. That is, when the coating resin body adheres to the phosphor particles, the specific gravity of the entire phosphor particle coating body is lower than that of the phosphor particles. On the other hand, the viscosity of the second coating resin composition may decrease once in the process of being cured by heating. In this process, the phosphor particle covering with a reduced specific gravity is less likely to settle than when the phosphor particles are present alone in the composition. For this reason, phosphor particles are uniformly dispersed in the finally obtained second cured body. Therefore, as will be described later, according to the second coating resin composition of the present invention, it is possible to manufacture a light emitting device that emits white light with a preferable chromaticity and has a small variation in chromaticity of white light. In the second cured body, the coating resin body and the portion where the curable resin is cured are integrated.

  The coating resin body is preferably a cured product formed from an epoxy compound, a cured product formed from a (meth) acryloyl group-containing compound having one or more (meth) acryloyl groups in the molecule, or a polyimide resin. .

First, the phosphor particle covering body when the covering resin body is a cured product formed from an epoxy compound will be described.
The phosphor particles are particles made of a phosphor that is excited by blue light emitted from the LED chip and can emit yellow light. For example, the particle | grains which consist of a YAG type fluorescent substance are mentioned.

  As in the case of the first coating resin composition, the epoxy compound used for preparing the coated resin body has two or more epoxy groups in one molecule. Without limitation, examples of the epoxy compound include aromatic epoxy resins, alicyclic epoxy resins, and aliphatic epoxy resins.

  Specific examples of the aromatic epoxy resin, alicyclic epoxy resin, and aliphatic epoxy resin include the same compounds as those in the first coating resin composition. The above epoxy resins may be used alone or in combination of two or more. The epoxy compound may be liquid at room temperature (25 ° C.) or solid. In the case of using a solid epoxy resin when producing the coating resin body, it is preferable to mix and dissolve with a liquid epoxy resin. Of these, bisphenol A type epoxy resins and bisphenol F type epoxy resins are preferably used.

  When an aromatic epoxy resin or an aliphatic epoxy resin is used as the epoxy compound, the coating resin body attached to at least a part of the surface of the phosphor particles is usually a sensible-type curing agent for curing the epoxy compound, more specifically Is prepared using an addition polymerization type curing agent. Examples of the addition polymerization type curing agent include the same curing agent as in the case of the first coating resin composition. The above addition polymerization type curing agents may be used alone or in combination of two or more.

  Below, when using an aromatic epoxy resin or an aliphatic epoxy resin as an epoxy compound, the manufacturing method of a fluorescent substance particle covering is demonstrated concretely. First, a blend in which phosphor particles, an epoxy compound, and an addition polymerization type curing agent are blended is prepared. At this time, it is preferable to obtain the above blend by blending the epoxy compound and the addition polymerization curing agent so that the viscosity of the mixture obtained by mixing only the epoxy compound and the addition polymerization curing agent is 10,000 cP or more. Thereby, when hardening the said compound, it can harden | cure with a fluorescent substance particle disperse | distributing uniformly. That is, in the finally obtained phosphor particle covering, variation in the ratio between the phosphor particles and the covering resin body can be reduced. The said viscosity can be adjusted with the kind and compounding quantity of an epoxy compound and an addition polymerization type hardening | curing agent. The viscosity is measured with an E-type viscometer. An addition polymerization type hardening | curing agent is normally mix | blended in the quantity of 5-50 mass parts with respect to 100 mass parts of epoxy compounds. Moreover, the epoxy compound and the addition polymerization type curing agent (total) are usually in an amount of more than 50 parts by mass and less than 100 parts by mass in the epoxy compound, the addition polymerization type curing agent and 100 parts by mass of the phosphor particles, It is desirable to blend in an amount exceeding 50 parts by weight and not more than 80 parts by weight. Thereby, the ratio of the coating resin body and fluorescent substance particle in the obtained fluorescent substance particle covering can be made into a preferable range.

Subsequently, although the said compound is hardened, this hardening is normally completed in 30 minutes-2 days at normal temperature (25 degreeC). In the cured product thus obtained, the phosphor particles are dispersed.
Next, the cured product is pulverized to produce a phosphor particle covering. For example, the cured product may be pulverized using a mill to produce a phosphor particle coated body. Alternatively, the cured product may be pulverized using a mill to obtain a pulverized product, followed by classification and phosphor particle coating. The body may be manufactured. The phosphor particle coated body thus obtained is composed of phosphor particles and a coated resin body attached to at least a part of the surface of the phosphor particles. The coated resin body is usually an epoxy compound and an addition polymerization type. It is a cured product formed from a curing agent.

  When an alicyclic epoxy resin is used as the epoxy compound, the coated resin body attached to at least a part of the surface of the phosphor particles is usually a sensible-type curing agent for curing the epoxy compound, more specifically a cation. It is prepared using a mold curing agent. Examples of the cationic curing agent include the same curing agent as in the case of the first coating resin composition. The cationic curing agents may be used alone or in combination of two or more.

  Below, when using an alicyclic epoxy resin as an epoxy compound, the manufacturing method of a fluorescent substance particle covering is demonstrated concretely. First, a blend in which an epoxy compound and a cationic curing agent are blended is prepared. At this time, it is preferable to blend the epoxy compound and the cationic curing agent so that the viscosity of the mixture is 1000 cP or less to obtain the blend. Thereby, the hardened | cured material (coating resin body) formed from the said compound can be made to adhere uniformly to the surface of fluorescent substance particle. That is, in the finally obtained phosphor particle covering, variation in the ratio between the phosphor particles and the covering resin body can be reduced. The said viscosity can be adjusted with the kind and compounding quantity of an epoxy compound and a cationic hardening | curing agent. The viscosity is measured with an E-type viscometer. A cationic hardening | curing agent is mix | blended with the quantity of 0.5-10 mass parts normally with respect to 100 mass parts of epoxy compounds.

  In addition, you may further mix volatile solvents, such as ether and hexane, into the said compound. In this case, the volatile solvent is used in an amount of, for example, 0.3 to 10 parts by mass with respect to 100 parts by mass of the epoxy compound.

  Subsequently, while spraying the said composition with respect to a fluorescent substance particle and irradiating an ultraviolet-ray, an epoxy compound is polymerized on the surface of a fluorescent substance particle, and a fluorescent substance particle coating body is manufactured. At this time, it is preferable to spray the phosphor particles while blowing the phosphor particles in a state where the phosphor particles are dancing. The epoxy compound and the cationic curing agent (total) are usually more than 50 parts by mass and preferably 50 parts by mass with respect to 100 parts by mass of the epoxy compound, the cationic curing agent and the phosphor particles. It is desirable to spray so that it may exceed 80 mass parts. Thereby, the ratio of the coating resin body and fluorescent substance particle in the obtained fluorescent substance particle covering can be made into a preferable range. The phosphor particle coated body thus obtained is composed of phosphor particles and a coated resin body adhered to at least a part of the surface of the phosphor particles. It is a cured product formed from the agent.

  Next, the phosphor particle covering body in the case where the covering resin body is a cured product formed from a (meth) acryloyl group-containing compound having at least one (meth) acryloyl group in the molecule will be described. The (meth) acryloyl group-containing compound is a compound that can be polymerized by ultraviolet irradiation. In this specification, the acryloyl group and the methacryloyl group are also collectively referred to as “(meth) acryloyl group”.

The phosphor particles are the same as when the coating resin body is a cured product formed from an epoxy compound.
Specific examples of the monofunctional (meth) acryloyl group-containing compound having one (meth) acryloyl group in the molecule used for preparing the coating resin body include the case of the first coating resin composition Similar compounds are mentioned. Among these, preferable compounds are the same as those in the first coating resin composition.

  As the polyfunctional (meth) acryloyl group-containing compound having two or more (meth) acryloyl groups in the molecule used for preparing the coated resin body, the same compounds as those in the first coating resin composition may be used. Can be mentioned. Among these, preferable compounds are the same as those in the first coating resin composition.

  The said (meth) acryloyl group containing compound may be used independently, or may be used in combination of 2 or more type, as long as the hardened | cured material is obtained. From the viewpoint of curability, it is preferable to use, for example, one or more polyfunctional (meth) acryloyl group-containing compounds. It is also preferable to use a combination of one or more monofunctional (meth) acryloyl group-containing compounds and one or more polyfunctional (meth) acryloyl group-containing compounds.

  When producing a coated resin body attached to at least a part of the phosphor particle surface, a radical polymerization initiator is usually used as a photopolymerization initiator. The radical polymerization initiator generates radicals by irradiation with ultraviolet rays and initiates polymerization of the (meth) acryloyl group-containing compound.

  Specific examples of the radical polymerization initiator include the same initiators as in the case of the first coating resin composition. Among these, preferable initiators are the same as those in the first coating resin composition. The above radical polymerization initiators may be used alone or in combination of two or more.

  Below, the manufacturing method of a fluorescent substance particle coating body is demonstrated concretely. First, a blend in which a (meth) acryloyl group-containing compound and a radical polymerization initiator are blended is prepared. At this time, it is preferable to blend the (meth) acryloyl group-containing compound and the radical polymerization initiator so that the viscosity of the blend becomes 1000 cP or less to obtain the blend. Thereby, the hardened | cured material (coating resin body) formed from the said compound can be made to adhere uniformly to the surface of fluorescent substance particle. That is, in the finally obtained phosphor particle covering, variation in the ratio between the phosphor particles and the covering resin body can be reduced. The said viscosity can be adjusted with the kind and compounding quantity of a (meth) acryloyl group containing compound and a radical polymerization initiator. The viscosity is measured with an E-type viscometer. A radical polymerization initiator is normally mix | blended in the quantity of 0.3-10 mass parts with respect to 100 mass parts of (meth) acryloyl group containing compounds.

  In addition, you may further mix volatile solvents, such as ether and hexane, into the said compound. In this case, the volatile solvent is used in an amount of, for example, 0.3 to 10 parts by mass with respect to 100 parts by mass of the (meth) acryloyl group-containing compound.

  Subsequently, while spraying the said composition with respect to a fluorescent substance particle and irradiating an ultraviolet-ray, a (meth) acryloyl group containing compound is polymerized on the surface of a fluorescent substance particle, and a fluorescent substance particle coating body is manufactured. At this time, it is preferable to spray the phosphor particles while blowing the phosphor particles in a state where the phosphor particles are dancing. The (meth) acryloyl group-containing compound and the radical polymerization initiator (total) are usually more than 50 parts by mass and 100 parts by mass with respect to 100 parts by mass of the (meth) acryloyl group-containing compound, the radical polymerization initiator and the phosphor particles. It is desirable to spray it in an amount less than 50 parts by weight, preferably more than 50 parts by weight and 80 parts by weight or less. Thereby, the ratio of the coating resin body and fluorescent substance particle in the obtained fluorescent substance particle covering can be made into a preferable range. The phosphor particle coated body thus obtained is composed of phosphor particles and a coated resin body attached to at least a part of the surface of the phosphor particles, and the coated resin body usually contains a (meth) acryloyl group. It is a cured product formed from a compound and a radical polymerization initiator.

Finally, the phosphor particle covering body when the covering resin body is a polyimide resin will be described.
The phosphor particles are the same as when the coating resin body is a cured product formed from an epoxy compound.

  As in the case of the first coating resin composition, the polyimide resin used for preparing the coating resin body is not particularly limited as long as it has a imide bond in the molecular main chain. Specifically, the same resin as in the case of the first coating resin composition may be mentioned. A polyimide resin may be used independently or may be used in combination of 2 or more type.

  When producing a coated resin body attached to at least a part of the surface of the phosphor particles, a compound in which a polyimide resin is dissolved in a solvent is usually used. Examples of the solvent include volatile solvents such as toluene, xylene, and ethyl acetate.

  Below, the manufacturing method of a fluorescent substance particle coating body is demonstrated concretely. First, a blend in which a polyimide resin and a solvent are blended is prepared. At this time, a solvent is mix | blended in the quantity which can melt | dissolve a polyimide resin. Thereby, the hardened | cured material (coating resin body) formed from the said compound can be made to adhere uniformly to the surface of fluorescent substance particle. That is, in the finally obtained phosphor particle covering, variation in the ratio between the phosphor particles and the covering resin body can be reduced.

  Subsequently, while spraying the said composition with respect to a fluorescent substance particle, a solvent is evaporated and a fluorescent substance particle coating body is manufactured. At this time, it is preferable to spray the phosphor particles while blowing the phosphor particles in a state where the phosphor particles are dancing. In particular, it is preferable to evaporate the solvent by applying hot air. Further, the polyimide resin is sprayed to 100 parts by mass of the polyimide resin and the phosphor particles so that the amount is usually more than 50 parts by mass and less than 100 parts by mass, preferably more than 50 parts by mass and 80 parts by mass or less. It is desirable. Thereby, the ratio of the coating resin body and fluorescent substance particle in the obtained fluorescent substance particle covering can be made into a preferable range. The phosphor particle covering body thus obtained is composed of phosphor particles and a covering resin body adhered to at least a part of the surface of the phosphor particles, and the covering resin body is formed of a polyimide resin.

  In the phosphor particle covering body described above, when the phosphor particle covering body (total of phosphor particles and covering resin body) is 100 parts by mass, the covering resin body is preferably more than 50 parts by mass and less than 100 parts by mass. Contained in an amount, more preferably more than 50 parts by weight and less than 80 parts by weight, and phosphor particles are preferably contained in an amount of more than 0 parts by weight and less than 50 parts by weight, more preferably 20 parts by weight. It is desirable that it is contained in an amount of less than 50 parts by mass. When the amount of the phosphor particles and the coating resin body is within the above range, the phosphor particles are more settled when the second cured resin composition is produced by curing the second coating resin composition according to the present invention. First, the phosphor particles are more uniformly dispersed in the second cured body. Specifically, when the coating resin body adheres to the phosphor particles at the above ratio, the specific gravity of the phosphor particle coating body as a whole is significantly lower than that of the phosphor particles. By the way, the viscosity of the second coating resin composition may once decrease in the process of being cured by heating. In this process, the phosphor particle coated body having a reduced specific gravity is difficult to settle. For this reason, phosphor particles are more uniformly dispersed in the finally obtained second cured body. Therefore, according to the second resin composition for coating containing such a phosphor particle coating, a light emitting device that emits white light with a preferable chromaticity and has a smaller variation in chromaticity of white light can be manufactured. In addition, the ratio of the amount of the phosphor particles and the coating resin body in the phosphor particle covering body can be considered to be the same as the ratio of the amount of the raw material used when producing the phosphor particle covering body. Specifically, when an aromatic epoxy resin or an aliphatic epoxy resin is used as the epoxy compound, the ratio of the phosphor particles to the epoxy compound and the addition polymerization type curing agent, and the phosphor particles to the coating resin body The ratio can be regarded as the same. The same applies when other epoxy compounds, (meth) acryloyl group-containing compounds and polyimide resins are used.

  In the phosphor particle covering obtained as described above, the coating resin body adheres to at least a part of the surface of the phosphor particles. Specifically, in FIGS. 13A to 13D, when the magnetic particle covering 60 is replaced with the phosphor particle covering 60 and the magnetic particles 6 are replaced with the phosphor particles 6, The covering resin body 61 may cover the entire surface of the phosphor particles 6 uniformly (FIG. 13A) or may be covered intermittently (FIG. 13B), or a part of the surface of the phosphor particles 6 may be covered. It may be covered uniformly (FIG. 13 (c)) or intermittently (FIG. 13 (d)). Further, one phosphor particle covering body may include one phosphor particle or a plurality of phosphor particles.

  Of cured products formed from epoxy compounds, cured products formed from (meth) acryloyl group-containing compounds having at least one (meth) acryloyl group in the molecule, and polyimide resins, it is easy to produce as a coated resin body Then, the hardened | cured material formed from an epoxy compound is used more preferable.

(Fumed silica)
When fumed silica is used, sedimentation of the phosphor particle coating can be suppressed in the second coating resin composition according to the present invention, and further, the second coating resin composition according to the present invention is heated. In the process of producing the second cured product by curing, the change in the viscosity of the composition can be kept small. Thus, since the second resin composition for coating according to the present invention includes the phosphor particle covering body and fumed silica, when the second cured body is manufactured by curing the resin composition. In addition, the phosphor particles do not settle, and the phosphor particles are uniformly dispersed in the second cured body. Therefore, as will be described later, according to the second coating resin composition of the present invention, it is possible to manufacture a light emitting device that emits white light with a preferable chromaticity and has a small variation in chromaticity of white light.

Fumed silica is usually produced by vaporizing a volatile silicon compound such as silicon tetrachloride and subjecting it to combustion hydrolysis in an oxygen hydrogen flame, for example. In this invention, it does not restrict | limit in particular, A well-known thing can be used. Fumed silica may be used alone or in combination of two or more.
The fumed silica preferably has a primary particle size in the range of 5 to 50 nm.

(Curable resin and other components)
As the curable resin, an epoxy compound that is a thermosetting resin, specifically, an aromatic epoxy resin or an aliphatic epoxy resin is preferably used. About an aromatic epoxy resin and an aliphatic epoxy resin, it is the same as that of the epoxy resin demonstrated in the fluorescent substance particle coating body.

  When the curable resin is the epoxy compound, a curing agent for curing the curable resin is used as the other component. When the curable resin is an aromatic epoxy resin or an aliphatic epoxy resin, it is usually a latent curing agent that can cure the curable resin by heating, or a manifest type that can cure the curable resin at room temperature (25 ° C.) or under heating. A curing agent is used. Examples of the latent curing agent include curing of amine curing agents, dicyandiamide curing agents, imidazole curing agents, capsule type imidazole curing agents, amine imide curing agents, polyamine salt curing agents, and hydrazide curing agents. Agents. Examples of the above-described manifesting curing agent include the above-described addition polymerization curing agents. A hardening | curing agent may be used independently or may be used in combination of 2 or more type.

  In addition, when a latent curing agent is used for the second coating resin composition, the viscosity of the composition once decreases in the process of being cured by heating. However, in the second coating resin composition, the phosphor particles are present as phosphor particle-coated granules having a reduced specific gravity. Therefore, the resin composition is uniform without the phosphor particles being settled. Can be cured in a dispersed state.

  Furthermore, a silicone resin having a polysiloxane structure is also preferably used as the curable resin from the viewpoint of heat resistance. Examples of the silicone resin include an epoxy group, a (meth) acryloyl group as a reaction active site, an addition type silicone resin having a vinyl group that can be reacted with a catalyst or an organic peroxide, or a derivative thereof; a moisture curable silicone resin; acetone, Examples thereof include a silicone resin that is cured by a condensation reaction in which alcohol or oxime is eliminated.

  When the curable resin is the above-mentioned silicone resin, specifically, a silicone resin composition that is commercially available in a state prepared in advance so as to be cured by heating or ultraviolet irradiation is suitably used. The above composition may be one-component or two-component, and more specifically, organic modified silicone resin and phenyl silicone resin manufactured by Shin-Etsu Chemical Co., Ltd., and Toray Dow Corning Co., Ltd. Examples of such products include those manufactured by Company, Momentive Performance Materials Japan GK, and Asahi Kasei Wacker Silicone Co., Ltd., as described above.

  As other components, a light reducing material such as a pigment or a glass filler or a cured silicone resin may be used. Thereby, the chromaticity and workability of white light obtained from the light emitting device can be adjusted.

(Second coating resin composition)
The second coating resin composition according to the present invention includes the above-described phosphor particle covering, fumed silica, curable resin, and other components such as a curing agent as necessary.

  In other words, when the curable resin is the above-described epoxy compound, the second coating resin composition according to the present invention is the phosphor particle-coated body, the fumes after the phosphor particle-coated body is prepared as described above. It is obtained by mixing dosilica, a curable resin, and other components such as a curing agent if necessary. When a curing agent is used, the phosphor particle coating is used in an amount of 10 to 1000 parts by mass and fumed silica is 0.1 to 10 parts by mass, preferably 3 to 100 parts by mass of the curable resin and the curing agent. It is desirable to blend in an amount of -10 parts by mass. When the blending amount is in the above range, in the process of producing the second cured body by curing the second coating resin composition according to the present invention, the phosphor particles do not settle, and the second cured body is in the second cured body. The phosphor particles can be uniformly dispersed. The curing agent may be used in an amount capable of curing the second coating resin composition. For example, from the viewpoint of curability, the curing agent is 0.7 to 1.3 with respect to 1 equivalent of the curable resin. It is preferable to mix | blend in the quantity of an equivalent.

  When the curable resin is the above-mentioned silicone resin, the second coating resin composition according to the present invention, after preparing the phosphor particle coating as described above, the phosphor particle coating, fumed silica, It is obtained by mixing a silicone resin composition. With respect to 100 parts by mass of the total amount of the silicone resin composition, the phosphor particle covering is in an amount of 10 to 1000 parts by mass, and fumed silica is in an amount of 0.1 to 10 parts by mass, preferably 3 to 10 parts by mass. It is desirable to blend. When the blending amount is in the above range, in the process of producing the second cured body by curing the second coating resin composition according to the present invention, the phosphor particles do not settle, and the second cured body is in the second cured body. The phosphor particles can be uniformly dispersed.

[Second cured body]
The second cured body according to the present invention is obtained from the second resin composition for coating, and in the second cured body, the phosphor particles are uniformly in the matrix formed from the resin coating and the curable resin. Is distributed. Since this second cured body is suitably used in a light emitting device, an example in which the second cured body is used in a light emitting device will be described.

  The light emitting device according to the present invention is a light emitting device including an LED chip and a cured body covering the LED chip, and the cured body is a second obtained from a second coating resin composition. It is a cured body. Hereinafter, embodiments of the light emitting device will be described more specifically with reference to the drawings.

  FIG. 14 is a perspective view of a case body constituting the light emitting device according to the embodiment of the present invention. In FIG. 14, reference numeral 102 denotes a case body having a substantially cubic shape. A cup-shaped recess 102b having an inclined surface that reflects light directed toward the light emitting direction is formed on the upper surface 102a of the case body 102. . Reference numerals 103a and 103b denote a pair of metal cores made of an Mg alloy-based metal core material, which constitutes the case body 102 and can be injection-molded with high thermal conductivity, and face each other with a slit 102c therebetween.

  Reference numeral 104 denotes an insulating member constituting a part of the case body 102. The insulating member 104 is filled in the slit 102c, insulates and separates the metal cores 103a and 103b as a pair of electrodes, and couples the metal cores 103a and 103b. Further, the exposed surfaces of the metal cores 103a and 103b are subjected to glossy Ag plating. As a result, the inclined surface 102d on the inner surface of the recess 102b is a light reflecting surface covered with Ag plating. Reference numeral 105 denotes an LED chip mounted on the bottom surface 102e of the recess 102b. As the LED chip, an InGaN-based LED chip is preferably used.

  FIG. 15 is a completed cross-sectional view of the light emitting device of the present invention in which the case body 102 of FIG. 14 is sectioned along AA and further provided with a second cured body. In FIG. 15, reference numeral 101 denotes a light emitting device, which is composed of a case body 102 including the pair of metal cores 103 a and 103 b and the insulating member 104. Reference numeral 106 denotes a submount package. The LED chip 105 is mounted and integrated on a submount substrate 106a made of ceramic or the like by face-down bonding. The submount package 106 is mounted on the bottom surface 2e by soldering or the like.

  Thus, the LED chip 105 is electrically connected to the metal cores 103a and 103b through the submount substrate 106a, and the lower portions of the metal cores 103a and 103b form terminal electrodes connected to the mounting substrate. Reference numeral 107 denotes a second cured body having an inclined surface on the outer periphery, which includes phosphor particles 107 a and covers the surface of the LED chip 105.

  Here, the operation of the light emitting device 101 will be described with reference to FIG. In FIG. 15, when a drive voltage is applied to the metal cores 103a and 103b constituting the light emitting device 101, a drive voltage is applied to the LED chip 105 through the submount substrate 106a, and blue light Pb (not shown) is applied from the LED chip 105. ) Emits light. When the blue light Pb collides with the phosphor particles 107a mixed in the second cured body 107, the phosphor particles 107a are excited and wavelength conversion is performed, and yellow light Pe (not shown) is emitted from the phosphor particles 107a. ) Is emitted.

  As a result, the light emitting device 101 emits the light from the LED chip 105 and is output without colliding with the phosphor particles 107a, and the yellow light Pe that has collided with the phosphor particles 107a and has been wavelength-converted. The white light Ph mixed with is emitted. Since the LED chip 105 is surrounded by the inclined surface 102d with Ag plating having excellent reflection efficiency as described above, the white light Ph is efficiently emitted forward.

  As described above, in the light emitting device 101 according to the embodiment of the present invention, the surface of the LED chip 105 is covered with the second cured body 107 including the phosphor particles 107a, and thus emits white light Ph. The second cured body 107 is formed from the above-described second coating resin composition. Note that the phosphor particles 107a contained in the second cured body 107 are schematically illustrated, and are actually invisible because they are minute particles. By the way, also in the conventional light-emitting device, since the LED chip is covered with the hardening body containing a fluorescent substance particle, it can light-emit white light. However, the second cured body according to the present invention is formed of the second coating resin composition including the above-described phosphor particle covering, so that the phosphor particles are more uniform than the conventional cured body. Are distributed. Therefore, the light emitting device according to the embodiment of the present invention can suppress the variation in chromaticity of white light compared to the conventional light emitting device.

  Next, a method for manufacturing the light emitting device 101 will be described with reference to the drawings. The manufacturing method of the light emitting device 101 is a manufacturing method of the light emitting device 101 including the LED chip 105 and the second cured body 107 covering the LED chip 105, and the LED chip 105 is coated with the second coating. A step of covering with a cured body 107 obtained from the resin composition for use.

  Specifically, first, a collective substrate is manufactured. FIG. 16 is a perspective view showing a manufacturing process of a collective substrate. 110 is a collective substrate, which is formed by injection molding or press molding from a metal core material such as an Mg alloy, and has a total of nine cup-shaped concave portions 102b vertically and horizontally. Aligned. Next, the slit 102c is processed so as to separate the center of the concave portion 102b to the left and right, and the slit 102c is filled with resin as the insulating member 104 and cured. Next, glossy Ag plating is applied to the inclined surface 102d inside the concave portion 102b so that the inclined surface 102d of the concave portion 102b functions as a light reflecting surface.

  Next, a process of mounting the submount package 106 having the LED chip 105 on the collective substrate 110 as shown in FIG. 17 will be described. Nine submount packages 106 are prepared, and the nine submount packages 106 are simultaneously mounted on the bottom surface 102e of the recess 102b of the collective substrate 110, respectively.

  Next, a process of providing the second cured body 107 on the collective substrate 110 on which the submount package 106 is mounted will be described. A second coating resin composition is filled into the position of the recess 102 b provided on the collective substrate 110 and cured to obtain a second cured body 107. When a thermosetting curable resin is used, the heating temperature and the heating time may be appropriately selected according to the type and blending amount of the resin and curing agent used. Moreover, when an ultraviolet curable curable resin is used, the ultraviolet irradiation amount and the ultraviolet irradiation time may be appropriately selected according to the type and blending amount of the resin used.

  Finally, a separation process for separating the light emitting device 101 from the completed aggregate substrate 110 will be described. FIG. 18 shows a separation process of the light emitting device 101. The collective substrate 110 is cut and separated along a plurality of dicing lines DL intersecting at an angle of 90 degrees to obtain individual light emitting devices 101. Thus, according to the manufacturing method using the collective substrate 110, the light emitting device 101 can be mass-produced, and the manufacturing efficiency can be greatly improved.

  Note that although the collective substrate 110 is shown with nine light emitting devices 101, the number is not limited to this and can be selected as appropriate. The shape of the insulating member 104 is not necessarily limited to the above-described shape as long as it has a function of insulating and separating the pair of metal cores 103a and 103b and a function of binding them.

  As shown in FIG. 19, in the light emitting device of the present invention, the second cured body 107 may be formed in a substantially disk shape having an inclined surface on the outer periphery so as not to contact the surface of the LED chip 105. May be provided.

  EXAMPLES Hereinafter, although this invention is demonstrated further more concretely based on an Example, this invention is not limited to these Examples.

[Example 1-1]
(Preparation of magnetic particle coating)
Magnetic particles made of NiZn ferrite were used as magnetic particles. Moreover, in order to produce a coating resin body, an epoxy resin mixture composed of a bisphenol F type epoxy resin and a bisphenol A type epoxy resin as an epoxy compound, and an amine curing agent as an addition polymerization type curing agent were used.

  Specifically, using a disposable cup, 100 parts by mass of magnetic particles, 100 parts by mass of the epoxy resin mixture, and 30 parts by mass of the amine curing agent were mixed to obtain a blend. In the above mixing, the amine curing agent was mixed in an amount of 1 equivalent with respect to 1 equivalent of the epoxy resin mixture. The blend was cured at room temperature (25 ° C.) for 30 minutes to obtain a cured product.

  At this time, a mixture obtained by mixing only 100 parts by mass of the epoxy resin mixture and 30 parts by mass of the amine curing agent was prepared separately, and the viscosity was measured by an E-type viscometer.

  The cured product was crushed with a hammer and then further pulverized with a mill. Thereafter, the resultant was sieved with a 20 μm mesh sieve to obtain a magnetic particle coated body (1-1) comprising magnetic particles and a coated resin body adhered to at least a part of the surface of the magnetic particles. In the obtained magnetic particle coated body, when the total of the magnetic particles and the coated resin body is 100 parts by mass, the coated resin body is included in an amount of 56.5 parts by mass, and the magnetic particles are 43.5 parts by mass. Included in the amount.

(Preparation of the first coating resin composition)
AEROSIL 200 (registered trademark, manufactured by Nippon Aerosil Co., Ltd.) was used as fumed silica, bisphenol F type epoxy resin was used as the curable resin, and amine type curing agent was used as the latent curing agent.

  Specifically, 36.9 parts by mass of the magnetic particle coating (1-1), 6.15 parts by mass of fumed silica, 100 parts by mass of a bisphenol F-type epoxy resin, and 23 parts by mass of an amine curing agent are mixed. A first coating resin composition (1-1) was obtained. In addition, in the said mixing, the amine hardening | curing agent was mixed in the quantity of 1 equivalent with respect to 1 equivalent of bisphenol F type epoxy resins.

(Production of inductor having first cured body)
The inductor mounting step (S1), the collective inductor manufacturing step (S2), and the cutting step (S3) were performed to produce an inductor corresponding to the inductor of the first embodiment.

  Of the coil mounting process (S1), in the assembly base manufacturing process (S1-1), an assembly lead frame as an assembly base (an assembly base that can take a large number of bases on which terminal electrodes are formed) was manufactured. . Specifically, as shown in FIG. 6, a thin plate made of a metal material is pressed to form a large number of through holes 13, bent portions 15 a to 15 d of terminal electrodes 14 a to 14 d, and the like. A collective lead frame 10 as a collective base from which a large number of 11 can be obtained was completed.

  Next, in the adhesive material bonding step (S1-2), the adhesive material was bonded to the assembly lead frame obtained in the assembly base manufacturing step (S1-1). Specifically, as shown in FIG. 7, a sheet-like adhesive tape 16 as an adhesive was applied to the entire back surface of the assembly lead frame 10 by applying pressure in the direction of arrow C. By this step, the adhesive surface 16a of the adhesive tape 16 was exposed from the plurality of through holes 13 formed in the assembly lead frame 10.

  Next, in the bobbin mounting step (S1-3), a plurality of bobbins were collectively mounted on the assembly base to which the adhesive material was bonded. Specifically, as shown in FIG. 8, the plurality of bobbins 2 are aligned by a tray (not shown) according to the position of the through hole 13 of the assembly lead frame 10, and then the tray is moved in the direction of arrow D. The plurality of bobbins 2 were moved and mounted in the through holes 13. That is, since the adhesive surface 16a of the adhesive tape 16 is exposed on the bottom surface of the through hole 13 as described above, by pressing the bobbin 2 aligned by the tray in the direction of arrow D, the bobbin 2 It was fitted into the through-hole 13, adhered to the adhesive surface 16 a, and fixed in the through-hole 13.

  Next, in the coil winding step (S1-4), a metal wire was continuously wound around the bobbin on the assembly base on which the bobbin was mounted to form a coil. Specifically, as shown in FIG. 9, the nozzle 40 of the winding machine (not shown) has a rotating shaft and was able to feed the metal wire 3 while rotating in the direction of arrow E. Thereby, the bobbin 2 mounted on the assembly lead frame 10 was wound by the metal wire 3 fed out from the nozzle 40, and the coil 4 was manufactured. Specifically, the nozzle 40 wraps the metal wire 3 around the bent portion 15b, rotates in the direction of arrow E, winds it around the core 2a of the bobbin 2, winds a predetermined number of times, and then turns the bent portion 15a. Entangled with. Subsequently, the nozzle 40 moved to the adjacent bobbin 2, wound around the bent portion 15b, wound around the core 2a of the bobbin 2, wound a predetermined number of times, and then wound around the bent portion 15a.

  Next, in the terminal processing step (S1-5), terminal processing is performed by soldering on the bent portions 15a and 15b in which the metal wire 3 is entangled in the coil winding step (S1-4), and the winding of the metal wire 3 is performed. The line terminals 3a and 3b were securely coupled to the bent portions 15a and 15b. Thus, by providing the bent portions 15a to 15d in the assembly lead frame 10, the coil winding step (S1-4) and the terminal processing step (S1-5) are facilitated, and the metal wire 3 and the terminal electrode 14a and 14b were reliably electrically coupled.

  Next, in the collective inductor manufacturing step (S2), the coil surface formed in the coil mounting step (S1) as described above is covered with the first cured body obtained from the first coating resin composition, A collective inductor was manufactured. Specifically, the first coating resin composition (1-1) is applied to the outer periphery of the coil 4 mounted on the assembly lead frame 10 (that is, the exposed portion of the metal wire 3) with a dispenser. The outer periphery was covered with the resin composition (see FIG. 10).

  Next, the first coating resin composition was cured by heating at 130 ° C. for 2 hours and then cooled. In this manner, the outer periphery of the coil 4 was covered with the first cured body obtained from the first resin composition for coating (1-1), and a collective inductor was obtained.

  The inductor manufactured in the collective inductor manufacturing process (S2) was sealed with resin. Specifically, the assembly lead frame 10 and the coil 4 covered with the first cured body were sealed with a sealing material 7 (epoxy resin) by liquid resin molding (see FIG. 11). Here, sealing was performed at the same height as the coil 4. Thereby, a collective inductor 50 in which a large number of inductors are gathered was completed.

  Finally, in the cutting step (S3), the collective inductor obtained in the collective inductor manufacturing step (S2) was cut into a single inductor. Specifically, the completed collective inductor 50 was cut by dicing along cutting lines X and Y (see FIG. 12-1). The collective inductor 50 was cut by the cutting step (S3), and a large number of single inductors 1 were completed (see FIG. 12-2).

  In the manufacturing of the inductor, manufacturing conditions were used such that the inductor type obtained was 2020C100M when the coil surface was not covered with the first cured body in the collective inductor manufacturing step (S2).

[Comparative Example 1-1]
An inductor was manufactured in the same manner as in Example 1-1 except that the coil surface was not covered with the first cured body in the collective inductor manufacturing step (S2). As a result, an inductor of 2020C100M was obtained.

[Reference Example 1-1]
A coating resin composition was prepared in the same manner as in Example 1-1 except that a coating resin composition was prepared using magnetic particles (independent) instead of the magnetic particle coating.

  Specifically, 16.1 parts by mass of magnetic particles (magnetic particles made of NiZn-based ferrite), 7.19 parts by mass of fumed silica (AEROSIL 200 (registered trademark), manufactured by Nippon Aerosil Co., Ltd.), bisphenol F type epoxy 116.9 parts by mass of the resin and 26.9 parts by mass of the amine curing agent were mixed to obtain a coating resin composition. In addition, in the said mixing, the amine hardening | curing agent was mixed in the quantity of 1 equivalent with respect to 1 equivalent of bisphenol F type epoxy resins.

Next, an inductor having a cured body was produced in the same manner as in Example 1-1 except that the coating resin composition was used.
[Example 1-2]
The first coating resin composition and the first cured body were prepared in the same manner as in Example 1-1 except that magnetic particles made of MnZn ferrite were used instead of magnetic particles made of NiZn ferrite as magnetic particles. An inductor having this was manufactured.

[Reference Example 1-2]
An inductor having a coating resin composition and a cured body was produced in the same manner as in Reference Example 1-1 except that magnetic particles made of MnZn ferrite were used instead of magnetic particles made of NiZn ferrite as magnetic particles.

[Example 1-3]
In the same manner as in Example 1-1, except that magnetic particles made of an amorphous alloy were used instead of magnetic particles made of NiZn-based ferrite as magnetic particles, the first coating resin composition and the first cured body were used. An inductor was produced.

[Reference Example 1-3]
An inductor having a coating resin composition and a cured body was produced in the same manner as in Reference Example 1-1 except that magnetic particles made of an amorphous alloy were used instead of magnetic particles made of NiZn-based ferrite.

[Example 1-4]
(Preparation of magnetic particle coating)
A magnetic particle coated body (1-4) was produced in the same manner as in Example 1-1 except that the contents of the magnetic particles and the resin coated body in the magnetic particle coated body were changed.

  Specifically, magnetic particles made of NiZn-based ferrite were used as the magnetic particles. Moreover, in order to produce a coating resin body, an epoxy resin mixture composed of a bisphenol F type epoxy resin and a bisphenol A type epoxy resin as an epoxy compound, and an amine curing agent as an addition polymerization type curing agent were used.

  More specifically, using a disposable cup, 100 parts by mass of magnetic particles, 325.2 parts by mass of an epoxy resin mixture, and 74.8 parts by mass of an amine curing agent were mixed to obtain a blend. In the above mixing, the amine curing agent was mixed in an amount of 1 equivalent with respect to 1 equivalent of the epoxy resin mixture. The blend was cured at room temperature (25 ° C.) for 30 minutes to obtain a cured product.

  At this time, a mixture obtained by mixing only 325.2 parts by mass of the epoxy resin mixture and 74.8 parts by mass of the amine curing agent was separately prepared, and the viscosity was measured by an E-type viscometer. It was.

  The cured product was crushed with a hammer and then further pulverized with a mill. Thereafter, the mixture was sieved with a 20 μm mesh sieve to obtain a magnetic particle coated body (1-4) comprising magnetic particles and a coated resin body attached to at least a part of the surface of the magnetic particles. In the obtained magnetic particle coated body, when the total of the magnetic particles and the coated resin body is 100 parts by mass, the coated resin body is included in an amount of 80 parts by mass, and the magnetic particles are included in an amount of 20 parts by mass. It was.

(Preparation of the first coating resin composition)
AEROSIL 200 (registered trademark, manufactured by Nippon Aerosil Co., Ltd.) was used as fumed silica, bisphenol F type epoxy resin was used as the curable resin, and amine type curing agent was used as the latent curing agent.

  Specifically, 80.3 parts by mass of the magnetic particle coating (1-4), 3.98 parts by mass of fumed silica, 64.7 parts by mass of a bisphenol F-type epoxy resin, and 14.9 parts by mass of an amine curing agent. By mixing, a first coating resin composition (1-4) was obtained. In addition, in the said mixing, the amine hardening | curing agent was mixed in the quantity of 1 equivalent with respect to 1 equivalent of bisphenol F type epoxy resins.

(Production of inductor having first cured body)
In the same manner as in Example 1-1 except that the first coating resin composition (1-4) was used instead of the first coating resin composition (1-1), the first cured body was obtained. An inductor having this was manufactured.

[Example 1-5]
(Preparation of magnetic particle coating)
A magnetic particle coated body (1-5) was produced in the same manner as in Example 1-1 except that the contents of the magnetic particles and the resin coated body in the magnetic particle coated body were changed.

  Specifically, magnetic particles made of NiZn-based ferrite were used as the magnetic particles. Moreover, in order to produce a coating resin body, an epoxy resin mixture composed of a bisphenol F type epoxy resin and a bisphenol A type epoxy resin as an epoxy compound, and an amine curing agent as an addition polymerization type curing agent were used.

  More specifically, using a disposable cup, 100 parts by mass of magnetic particles, 35.5 parts by mass of the epoxy resin mixture, and 31.2 parts by mass of the amine curing agent were mixed to obtain a blend. In the above mixing, the amine curing agent was mixed in an amount of 1 equivalent with respect to 1 equivalent of the epoxy resin mixture. The blend was cured at room temperature (25 ° C.) for 30 minutes to obtain a cured product.

  At this time, another mixture obtained by mixing only 35.5 parts by mass of the epoxy resin mixture and 31.2 parts by mass of the amine curing agent was prepared separately, and the viscosity was measured by an E-type viscometer. It was.

  The cured product was crushed with a hammer and then further pulverized with a mill. Thereafter, the mixture was sieved with a 20 μm mesh sieve to obtain a magnetic particle coated body (1-5) composed of magnetic particles and a coated resin body attached to at least a part of the surface of the magnetic particles. In the obtained magnetic particle coated body, when the total of the magnetic particles and the coated resin body is 100 parts by mass, the coated resin body is included in an amount of 40 parts by mass, and the magnetic particles are included in an amount of 60 parts by mass. It was.

(Preparation of the first coating resin composition)
AEROSIL 200 (registered trademark, manufactured by Nippon Aerosil Co., Ltd.) was used as fumed silica, bisphenol F type epoxy resin was used as the curable resin, and amine type curing agent was used as the latent curing agent.

  Specifically, 26.8 parts by mass of the magnetic particle coating (1-5), 6.66 parts by mass of fumed silica, 108.2 parts by mass of bisphenol F-type epoxy resin, and 24.9 parts by mass of the amine-based curing agent. By mixing, a first coating resin composition (1-5) was obtained. In addition, in the said mixing, the amine hardening | curing agent was mixed in the quantity of 1 equivalent with respect to 1 equivalent of bisphenol F type epoxy resins.

(Production of inductor having first cured body)
In the same manner as in Example 1-1 except that the first coating resin composition (1-5) was used instead of the first coating resin composition (1-1), the first cured body was obtained. An inductor having this was manufactured.

[Example 1-6]
(Preparation of magnetic particle coating)
Magnetic particles made of NiZn ferrite were used as magnetic particles. Further, in order to produce a coated resin body, 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexenecarboxylate as an alicyclic epoxy resin, and triphenylsulfonium hexafluorophosphate as a cationic polymerization initiator Was used.

  Specifically, 100 parts by mass of the alicyclic epoxy resin and 3 parts by mass of the cationic polymerization initiator were mixed to obtain a blend. At this time, the viscosity of the blend was measured with an E-type viscometer and found to be 1000 cP or less.

  Magnetic particles were put in a fluid tank equipped with a coating device and an ultraviolet irradiation device, and air was sent to the fluid tank to cause the magnetic particles to flow. The compound was put into a coating device, and the compound was made into a mist through a nozzle of the coating device and sprayed on the flowing magnetic particles. Here, the blend was sprayed so that the blend was 56.5 parts by mass with respect to a total of 100 parts by mass of the blend composed of the alicyclic epoxy resin and the cationic polymerization initiator and the magnetic particles. . Simultaneously with the start of spraying of the blend, the magnetic particles in the fluid tank were irradiated with ultraviolet rays, and the alicyclic epoxy resin was polymerized on the surface of the magnetic particles to prepare a resin coating. As a result, a magnetic particle coated body (1-6) comprising magnetic particles and a coated resin body attached to at least a part of the surface of the magnetic particles was obtained. In the obtained magnetic particle coated body, when the total of the magnetic particles and the coated resin body is 100 parts by mass, the coated resin body is included in an amount of 56.5 parts by mass, and the magnetic particles are 43.5 parts by mass. Included in the amount.

(Preparation of the first coating resin composition)
AEROSIL 200 (registered trademark, manufactured by Nippon Aerosil Co., Ltd.) was used as fumed silica, bisphenol F type epoxy resin was used as the curable resin, and amine type curing agent was used as the latent curing agent.

  Specifically, 36.9 parts by mass of the magnetic particle coating (1-6), 6.15 parts by mass of fumed silica, 100 parts by mass of a bisphenol F-type epoxy resin, and 23 parts by mass of an amine curing agent are mixed. A first coating resin composition (1-6) was obtained. In addition, in the said mixing, the amine hardening | curing agent was mixed in the quantity of 1 equivalent with respect to 1 equivalent of bisphenol F type epoxy resins.

(Production of inductor having first cured body)
In the same manner as in Example 1-1 except that the first coating resin composition (1-6) was used instead of the first coating resin composition (1-1), the first cured body was obtained. An inductor having this was manufactured.

[Example 1-7]
(Preparation of magnetic particle coating)
Magnetic particles made of NiZn ferrite were used as magnetic particles. Moreover, in order to produce a coating resin body, tricyclodecane dimethylol diacrylate as an acryloyl group-containing compound (polyfunctional compound) and commercially available 2-methyl-1- (as a radical polymerization initiator (acetophenone-based initiator) 4-Methylthiophenyl) -2-morpholino-propan-1-one was used.

  Specifically, 100 parts by mass of the acryloyl group-containing compound and 3 parts by mass of the radical polymerization initiator were mixed to obtain a blend. At this time, the viscosity of the blend was measured with an E-type viscometer and found to be 1000 cP or less.

  Magnetic particles were put in a fluid tank equipped with a coating device and an ultraviolet irradiation device, and air was sent to the fluid tank to cause the magnetic particles to flow. The compound was put into a coating device, and the compound was made into a mist through a nozzle of the coating device and sprayed on the flowing magnetic particles. Here, the blend was sprayed so that the blend was 56.5 parts by mass with respect to 100 parts by mass in total of the blend composed of the acryloyl group-containing compound and the radical polymerization initiator and the magnetic particles. Simultaneously with the start of spraying of the blend, the magnetic particles in the fluidized tank were irradiated with ultraviolet rays, and the acryloyl group-containing compound was polymerized on the surface of the magnetic particles to prepare a resin coating. As a result, a magnetic particle coated body (1-7) comprising magnetic particles and a coated resin body attached to at least a part of the surface of the magnetic particles was obtained. In the obtained magnetic particle coated body, when the total of the magnetic particles and the coated resin body is 100 parts by mass, the coated resin body is included in an amount of 56.5 parts by mass, and the magnetic particles are 43.5 parts by mass. Included in the amount.

(Preparation of the first coating resin composition)
AEROSIL 200 (registered trademark, manufactured by Nippon Aerosil Co., Ltd.) was used as fumed silica, bisphenol F type epoxy resin was used as the curable resin, and amine type curing agent was used as the latent curing agent.

  Specifically, 36.9 parts by mass of the magnetic particle coating (1-7), 6.15 parts by mass of fumed silica, 100 parts by mass of a bisphenol F-type epoxy resin, and 23 parts by mass of an amine curing agent are mixed. A first coating resin composition (1-7) was obtained. In addition, in the said mixing, the amine hardening | curing agent was mixed in the quantity of 1 equivalent with respect to 1 equivalent of bisphenol F type epoxy resins.

(Production of inductor having first cured body)
In the same manner as in Example 1-1 except that the first coating resin composition (1-7) was used instead of the first coating resin composition (1-1), the first cured body was obtained. An inductor having this was manufactured.

[Example 1-8]
(Preparation of magnetic particle coating)
Magnetic particles made of NiZn ferrite were used as magnetic particles. Moreover, in order to produce a coating resin body, a compound in which a polyimide resin was dissolved in a volatile solvent was used.

  Magnetic particles were put in a fluid tank equipped with a coating device and an ultraviolet irradiation device, and hot air was sent to the fluid tank to cause the magnetic particles to flow. The compound was put into a coating device, and the compound was made into a mist through a nozzle of the coating device and sprayed on the flowing magnetic particles. Here, the compound was sprayed so that the polyimide resin was 56.5 parts by mass with respect to 100 parts by mass in total of the polyimide resin and the magnetic particles. The solvent in the formulation was evaporated with hot air to prepare a magnetic particle coating. As a result, a magnetic particle coated body (1-8) comprising magnetic particles and a coated resin body attached to at least a part of the surface of the magnetic particles was obtained. In the obtained magnetic particle coated body, when the total of the magnetic particles and the coated resin body is 100 parts by mass, the coated resin body is included in an amount of 56.5 parts by mass, and the magnetic particles are 43.5 parts by mass. Included in the amount.

(Preparation of the first coating resin composition)
AEROSIL 200 (registered trademark, manufactured by Nippon Aerosil Co., Ltd.) was used as fumed silica, bisphenol F type epoxy resin was used as the curable resin, and amine type curing agent was used as the latent curing agent.

  Specifically, 36.9 parts by mass of the magnetic particle coating (1-8), 6.15 parts by mass of fumed silica, 100 parts by mass of a bisphenol F-type epoxy resin, and 23 parts by mass of an amine curing agent are mixed. A first coating resin composition (1-8) was obtained. In addition, in the said mixing, the amine hardening | curing agent was mixed in the quantity of 1 equivalent with respect to 1 equivalent of bisphenol F type epoxy resins.

(Production of inductor having first cured body)
In the same manner as in Example 1-1 except that the first coating resin composition (1-8) was used instead of the first coating resin composition (1-1), the first cured body was prepared. An inductor having this was manufactured.

[Evaluation]
For the inductors of Examples 1-1 to 1-8, Comparative Example 1-1, and Reference Example 1-1, the L value (nominal inductance value) was measured under the conditions of 100 kHz and 25 ° C. Moreover, the dispersion | variation in L value was calculated | required. The results are shown in Table 1. The variation is a value obtained by manufacturing 1000 inductors.

このように、コイルの全周に第一の硬化体が形成されているインダクタ（実施例１−１〜１−８）では、第一の硬化体が形成されていないインダクタ（比較例１−１）に比較して、Ｌ値が改善できた。また、実施例１−１〜１−８と参考例１−１との比較より、磁性粒子被覆体を含む第一のコーティング樹脂組成物を用いたインダクタでは、Ｌ値が増加しても、得られたインダクタ間でのＬ値のばらつきが抑えられた。

Thus, in the inductor (Examples 1-1 to 1-8) in which the first cured body is formed on the entire circumference of the coil, the inductor in which the first cured body is not formed (Comparative Example 1-1). L value was improved as compared with (). Further, from comparison between Examples 1-1 to 1-8 and Reference Example 1-1, the inductor using the first coating resin composition containing the magnetic particle coating was obtained even when the L value increased. The variation in L value among the inductors thus obtained was suppressed.

DESCRIPTION OF SYMBOLS 1, 20, 30: Inductor 2: Bobbin 2a: Core 2b: Flange part 3: Metal wire 3a, 3b: Winding terminal 4: Coil 5, 5a, 5b: 1st hardening body 6: Magnetic particle 7: Sealing Stop material 10: Collective lead frame 11: Lead frame 13: Through hole 14a to 14d: Terminal electrode 15a to 15d: Bending part 16: Adhesive tape 16a: Adhesive surface 31: Circuit board 32a, 32b: Wiring pattern 40: Nozzle 50: Collective inductor 60: Magnetic particle covering body 61: Covering resin body 101: Light emitting device 102: Case body 102a: Upper surface 102b: Recessed portion 102c: Slit 102d: Inclined surface 102e: Bottom surface 103a, 3b: Metal core 104: Insulating member 105: LED chip 106: Submount package 106a: Submount Plate 107: second cured body 107a: phosphor particles 110: the assembly substrate 111: second curing assemblies 111a: connecting member Ph: white light

Claims (18)

  A coating resin composition comprising an inorganic particle covering body comprising inorganic particles and a covering resin body attached to at least a part of the surface of the inorganic particles, fumed silica, and a curable resin.   A cured product obtained from the coating resin composition according to claim 1.   A coating resin composition comprising: a magnetic particle coating comprising magnetic particles and a coating resin coated on at least a part of the surface of the magnetic particles, fumed silica, and a curable resin.   In the magnetic particle coated body, when the total of the magnetic particles and the coated resin body is 100 parts by mass, the coated resin body is included in an amount of more than 50 parts by mass and less than 100 parts by mass, and the magnetic particles The coating resin composition according to claim 3, wherein the coating resin composition is contained in an amount exceeding 0 part by mass and less than 50 parts by mass.   The coating resin composition according to claim 3 or 4, wherein the coating resin body is a cured product formed from an epoxy compound.   The coating resin according to claim 3 or 4, wherein the coating resin body is a cured product formed from a (meth) acryloyl group-containing compound having at least one (meth) acryloyl group in the molecule. Composition.   The coating resin composition according to claim 3, wherein the coating resin body is formed of a polyimide resin.   The coating resin composition according to claim 3, wherein the curable resin is an epoxy compound.   The method for producing a coating resin composition according to any one of claims 3 to 8, wherein the magnetic particle coating, fumed silica, and curable resin are mixed after the magnetic particle coating is produced. .   A cured product obtained from the coating resin composition according to claim 3. An inductor comprising a coil formed by winding a metal wire, and a terminal electrode connected to the coil,
At least a part of the coil surface is covered with a cured body obtained from the coating resin composition according to any one of claims 3 to 8. A method of manufacturing an inductor comprising a coil formed by winding a metal wire and a terminal electrode connected to the coil,
A coil mounting step of mounting a plurality of coils on an assembly base that can take a large number of bases on which the terminal electrodes are formed;
A collective inductor manufacturing process for manufacturing a collective inductor by covering at least a part of the surface of the mounted coil with a cured body obtained from the resin composition for coating according to any one of claims 3 to 8,
A cutting step of cutting the collective inductor into a single inductor;
An inductor manufacturing method comprising:   A coating resin composition comprising a phosphor particle covering body comprising a phosphor particle and a covering resin body attached to at least a part of the surface of the phosphor particle, fumed silica, and a curable resin.   In the phosphor particle coated body, when the total of the phosphor particles and the coating resin body is 100 parts by mass, the coating resin body is included in an amount of more than 50 parts by mass and less than 100 parts by mass, 14. The resin composition for coating according to claim 13, wherein the body particles are contained in an amount exceeding 0 part by mass and less than 50 parts by mass.   The coating resin composition according to claim 13 or 14, wherein the coating resin body is a cured product formed from a silicone resin.   A cured product obtained from the coating resin composition according to any one of claims 13 to 15. A light emitting device comprising an LED chip and a cured body covering the LED chip,
The said hardening body is a hardening body obtained from the resin composition for coating in any one of Claims 13-15, The light-emitting device characterized by the above-mentioned. A method of manufacturing a light emitting device comprising an LED chip and a cured body covering the LED chip,
A method for producing a light emitting device, comprising a step of covering the LED chip with a cured body obtained from the coating resin composition according to any one of claims 13 to 15.

Images