JP2010267693A5 - - Google Patents
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- Publication number
- JP2010267693A5 JP2010267693A5 JP2009116254A JP2009116254A JP2010267693A5 JP 2010267693 A5 JP2010267693 A5 JP 2010267693A5 JP 2009116254 A JP2009116254 A JP 2009116254A JP 2009116254 A JP2009116254 A JP 2009116254A JP 2010267693 A5 JP2010267693 A5 JP 2010267693A5
- Authority
- JP
- Japan
- Prior art keywords
- resist layer
- solder resist
- soldering
- mesh
- screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
次に、ＮＰＲ３３００（日本ポリテック（株）製）を上記、第１のソルダーレジスト層の上にスクリーン印刷し、１００℃で５分乾燥して第２のソルダーレジスト層とした。次いで、１２０℃で９０分間保持して第１のソルダーレジスト層と第２のソルダーレジスト層の両方を熱硬化させた。第２のソルダーレジスト層の形成に用いたスクリーン版は、３２５メッシュ、線径２８μｍのステンレスメッシュであって、インナーリード部４辺全てにおいて、第２のソルダーレジスト層の端部を第１のソルダーレジスト層の端部より金属配線が露出している側へ約６０μｍの位置に形成できるように、開口部を設計したものである（図６のパターン）。 Next, NPR3300 (manufactured by Nippon Polytech Co., Ltd.) was screen-printed on the first solder resist layer and dried at 100 ° C. for 5 minutes to form a second solder resist layer. Subsequently, it hold | maintained at 120 degreeC for 90 minute (s), and both the 1st soldering resist layer and the 2nd soldering resist layer were thermosetted. The screen plate used for forming the second solder resist layer is a stainless steel mesh of 325 mesh and a wire diameter of 28 μm. The opening is designed so that it can be formed at a position of about 60 μm from the end of the resist layer to the side where the metal wiring is exposed (pattern in FIG. 6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009116254A JP2010267693A (en) | 2009-05-13 | 2009-05-13 | Method for forming solder resist and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009116254A JP2010267693A (en) | 2009-05-13 | 2009-05-13 | Method for forming solder resist and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010267693A JP2010267693A (en) | 2010-11-25 |
| JP2010267693A5 true JP2010267693A5 (en) | 2012-05-17 |
Family
ID=43364444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009116254A Pending JP2010267693A (en) | 2009-05-13 | 2009-05-13 | Method for forming solder resist and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010267693A (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614294A (en) * | 1984-06-18 | 1986-01-10 | 松下電器産業株式会社 | Method of producing printed board |
| JPS61110490A (en) * | 1984-11-02 | 1986-05-28 | 松下電器産業株式会社 | Resist film formation for printed circuit board |
| JPS63271997A (en) * | 1987-04-28 | 1988-11-09 | Ibiden Co Ltd | Printed wiring board |
| JPH04106996A (en) * | 1990-08-24 | 1992-04-08 | Seiko Epson Corp | Circuit board |
| JPH05191021A (en) * | 1992-01-14 | 1993-07-30 | Matsushita Electric Works Ltd | Printed wiring board |
| JPH06252550A (en) * | 1993-02-26 | 1994-09-09 | Matsushita Electric Works Ltd | Manufacture of printed wiring board |
| JP3378297B2 (en) * | 1993-04-30 | 2003-02-17 | 日本シイエムケイ株式会社 | Manufacturing method of printed wiring board |
| JPH09312463A (en) * | 1996-05-22 | 1997-12-02 | Ajinomoto Co Inc | Method of forming pattern |
| JP5106726B2 (en) * | 2001-08-10 | 2012-12-26 | イビデン株式会社 | Wiring board manufacturing method |
| TWI288590B (en) * | 2005-10-31 | 2007-10-11 | Unimicron Technology Corp | Method of forming solder mask and circuit board with solder mask |
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2009
- 2009-05-13 JP JP2009116254A patent/JP2010267693A/en active Pending
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