JP2010249411A - Film pipe, cooling module with film pipe, and method of manufacturing film pipe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film pipe capable of surely cooling a heating element (cooled object) with a simple structure, a cooling module having the film pipe, and a method of manufacturing the film pipe. <P>SOLUTION: This film pipe 10 is constituted by overlapping and joining a plurality of films 1-4, and has a first film space having a medium passage B through which a cooling medium passes, and a second film space having a heat insulating part C. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a film pipe, a cooling module including the film pipe, and a method for manufacturing the film pipe.

  In recent years, the amount of energy used is constantly increasing as global warming prevention is required. For example, in the information technology field, the amount of data handled is dramatically increased and the energy consumed for data processing is also increasing due to the advancement of electronic devices and the development of advanced information communication networks.

  In a server room or a data center in which a large number of blade servers or storage servers that handle a large amount of data are installed, energy consumed by electronic devices is discharged as a large amount of heat. Therefore, additional energy is required to cool these electronic devices.

  In particular, in a server, power consumption per rack is increased to several kW or more. As the power consumption density increases, a system having a high cooling capacity is required for cooling the central processing unit (CPU) or the like that serves as a heating element.

  For example, a water-cooled heat sink called a CPU jacket is installed on the heating element, and the heating element is water-cooled with a solvent such as water, or heat discharged from electronic devices such as servers, that is, exhaust heat energy is recovered by water cooling. However, an adsorption heat pump that reuses the same has been proposed.

  A cooling module for a computer having a plurality of heat generating units and a flat display, a heat receiving head fixed to at least one heat generating unit, a tube connected to the heat receiving head and disposed inside the computer, And the tube absorbs heat generated in the heat generating part in a part of the tube and dissipates heat in the other part in the course of the tube installation using the circulating coolant as a heat transfer medium. Cooling modules have been proposed.

JP 2004-127288 A JP 2007-245025 A

  However, for heat recovery by a solvent such as water, installation of piping is necessary. If such a pipe is installed in a small space in the server, the arrangement of the pipe becomes complicated. In addition, it is necessary to attach a plurality of CPU jackets and to arrange a large number of connectors at the branch points of the piping. Moreover, there is a risk of water leakage from the piping or the like, and a certain cost is required to prevent this.

  Furthermore, in order to prevent loss of heat recovery, it is necessary to provide a heat insulating material in the pipe. However, the thickness of the heat insulating material cannot be increased in the server from the viewpoint of limiting the installation space. Moreover, the thickness of piping including the said heat insulating material may inhibit the flow of the wind in a server.

  Furthermore, in order to suppress the release of heat from the server to the entire room in which the server is provided, it is necessary to collect not only the heat generated from the CPU but also the heat generated from other electronic components. Therefore, the above problem is not limited to the problem of heat generation from the CPU.

  Furthermore, when an exhaust heat recovery mechanism such as an adsorption heat pump is installed in the server, it is also necessary to modularize the cooling mechanism in order to realize easy installation.

  Therefore, the present invention has been made in view of the above points, and has a simple structure and a film pipe capable of reliably cooling a heating element (cooling target), a cooling module including the film pipe, and It is an object of the present invention to provide a method for manufacturing a film pipe.

  According to one aspect of the present invention, a plurality of films are overlapped and joined, and between the first films formed with a medium path through which the cooling medium passes, and between the second films provided with a heat insulating portion. The film piping characterized by including these is provided.

  According to another aspect of the present invention, the medium includes a cooling unit and a film pipe connected to the cooling unit, and the film pipe is a medium in which a plurality of films are stacked and joined, and the cooling medium passes therethrough. There is provided a cooling module including a space between first films formed with a path and a space between second films provided with a heat insulating portion.

  According to another aspect of the present invention, there is provided a film pipe manufacturing method in which a plurality of films are stacked via a thermally expandable resin, and the thermally expandable resin layer expanded by heating is a heat insulating portion. And a heat insulating part forming step formed between the films.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the film piping which can cool a heat generating body (cooling object) reliably, the cooling module provided with film piping, and film piping with a simple structure can be provided.

It is a perspective view which shows the basic structure of the film piping which concerns on embodiment of this invention. It is a perspective view which shows the structure of the modification of the film piping shown in FIG. It is a figure (the 1) which shows the 1st manufacturing method of the film piping which concerns on embodiment of this invention. It is a figure (the 2) which shows the 1st manufacturing method of the film piping which concerns on embodiment of this invention. It is a figure (the 1) which shows the 2nd manufacturing method of the film piping which concerns on embodiment of this invention. It is a figure (the 2) which shows the 2nd manufacturing method of the film piping which concerns on embodiment of this invention. It is a figure (the 1) which shows the manufacturing method of the Example of the film piping which concerns on embodiment of this invention. It is a figure (the 2) which shows the manufacturing method of the Example of the film piping which concerns on embodiment of this invention. It is a figure (the 3) which shows the manufacturing method of the Example of the film piping which concerns on embodiment of this invention. It is FIG. (4) which shows the manufacturing method of the Example of the film piping which concerns on embodiment of this invention. It is a figure (the 5) which shows the manufacturing method of the Example of the film piping which concerns on embodiment of this invention. It is a figure which shows the 1st application example (shape example of a water conduit) of film piping concerning embodiment of this invention. It is a figure which shows the 2nd application example of the film piping concerning embodiment of this invention. It is a figure which shows mounting to the electronic device of a cooling module. It is a figure for demonstrating the water conduit provided corresponding to the arrangement | sequence of the IC chip shown in FIG. It is a schematic diagram at the time of providing a cooling module in a server. It is a block diagram which shows joining to the circulation mechanism containing an adsorption type heat pump of a cooling module. It is a figure which shows joining of a cooling module and a coupler.

  Embodiments of the present invention will be described below.

1. First, a basic structure of a film pipe according to an embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 1, in the film pipe 10 according to the embodiment of the present invention, a flexible film 2 is also overlapped on a flexible film 1. And the film 1 and the film 2 are partially joined by adhesion | attachment or welding. In FIG. 1, a portion A with a satin pattern is the joint portion.

  In the film 1 and the film 2, a space portion is formed at a predetermined interval at a position where the film 1 and the film 2 are not joined to each other (a position indicated by B in FIG. 1 and between the first films). The space portion can be connected to an external pipe in the film pipe 10 and functions as a water conduit (medium path) through which cooling water as a cooling medium passes.

  On the surface of the film 1 opposite to the surface on which the film 2 is provided, a flexible film 3 is provided in an overlapping manner. The film 1 and the film 3 are partially joined by adhesion or welding. The joining location of the film 1 and the film 3 is located substantially below the joining location of the film 1 and the film 2.

  In the film 1 and the film 3, a space part is formed at a predetermined interval at a part that is not joined to each other (a part indicated by C1 in FIG. 1). The said space part is located under the said water conduit, and functions as an air layer which is a sealed heat insulation layer (heat insulation part) in the film piping 10.

  On the surface of the film 2 opposite to the film 1, a flexible film 4 is provided so as to overlap. And the film 2 and the film 4 are partially joined by adhesion | attachment or welding. The joining location of the film 2 and the film 4 is located substantially above the joining location of the film 1 and the film 2.

  In the film 2 and the film 4, a space portion is formed at a predetermined interval at a portion that is not joined to each other (a portion indicated by C <b> 2 in FIG. 1, between the second films). The said space part is located above the said water conduit, and functions as an air layer which is a sealed heat insulation layer in the film piping 10.

  The films 1 to 4 may be made of the same material or may be made of different materials. Examples of the material constituting the films 1 to 4 include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutyl terephthalate (PBT), polyvinyl chloride (PVC), polyvinylidene chloride (PDC), and polypropylene (PP). , Polyethylene (PE), polyamide (PA), vinylon, ethylene-vinyl acetate copolymer (EVA), polyimide, and other resins can be used. However, the above-described materials are merely examples, and the films 1 to 4 may be composed of other materials.

The films 1 to 4 may have a multilayer structure from the viewpoint of reinforcing the strength. The films 1 to 4 have a multilayered structure in which a layer containing a metal such as aluminum (Al) or an inorganic material such as titanium oxide (TiO ₂ ) or silicon oxide (SiO ₂ ) is formed by a vapor deposition method or the like. May be.

  The effect of the film pipe 10 having such a basic structure will be described in detail later with reference to FIGS.

  By the way, in the film piping 10 shown in FIG. 1, the locations C1 and C2 that function as an air layer that is a hermetically sealed heat insulating layer are provided only below and above the water conduit shown by B in FIG. The present invention is not limited to such an example, and may have a structure as shown in FIG. In FIG. 2, the same parts as those shown in FIG.

  In the film pipe 10 ′ shown in FIG. 2, not only below and above the water conduit indicated by B, but between the two water conduits and below and above the joints between the film 1 and the film 2. However, the film 3 ′ is laminated and bonded on the film 1, and the film 4 ′ is laminated and bonded on the film 2 so that the air layers C 3 and C 4 as the sealed heat insulating layers are located. With such a structure, the formation volume of the air layers C3 and C4, which are hermetically sealed heat insulation layers, is larger than that of the structure shown in FIG. 1, and the heat insulation effect is improved.

2. Next, a film piping manufacturing method according to an embodiment of the present invention will be described with reference to FIGS. 3 and 4. 3 and 4, the same parts as those shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  First, the flexible film 2 is also provided on the flexible film 1 (see FIG. 3A, film lamination step).

  Next, the film 1 and the film 2 are welded and partially joined using heat at a position indicated by an arrow D in FIG. 3A (see FIG. 3B).

  Thereafter, the film 1 and the film 2 are slightly bent so that a space portion is formed between the two joints D ′ (see FIG. 3C). The space portion can be connected to an external pipe and functions as a water conduit B through which cooling water as a cooling medium passes. In the step shown in FIG. 3C, the film 1 and the film 2 may be slightly bent by blowing (injecting) air between the two joints D ′.

  Next, in a state where the film 1 and the film 2 are slightly bent, the flexible film 3 is provided on the film 1 on the surface opposite to the surface on which the film 2 is provided, Further, a flexible film 4 is provided on the surface of the film 2 opposite to the film 1 (see FIG. 4D).

  Next, the film 1 to the film 4 are welded by using heat at a location slightly outside the two joining locations D ′ of the film 1 and the film 2, that is, at a location indicated by an arrow E in FIG. Then, the film 3 between the two joints E ′ is slightly bent downward, and the film 4 between the two joints E ′ is slightly bent upward (see FIG. 4E). .

  As a result, a space portion is formed between the two joints E ′ and between the film 1 and the film 3 and between the film 2 and the film 4. The space portion is located below the water conduit B and functions as an air layer C <b> 1 as a sealed heat insulating layer in the film pipe 10. Moreover, a space part is formed in the location which is not mutually joined in the film 1 and the film 3 (location shown by C1 in FIG. 1) with a predetermined interval. The said space part is located above the said water conduit B, and functions as the air layer C2 which is the heat insulation layer sealed in the film piping 10. FIG.

Thereafter, unnecessary portions of the film 1 to the film 4 that are located outside the joining portion E ′ are deleted, and the film pipe 10 is completed (see FIG. 4F).
By the way, in the method shown in FIG.3 and FIG.4, as mentioned above, in the process shown in FIG.4 (d), on the film 1 and the surface on the opposite side to the surface in which the film 2 is provided, In the process shown in FIG. 4 (e), the flat film 3 is provided in an overlapped manner, and the flat film 4 is provided on the surface of the film 2 opposite to the film 1. The film 4 is welded and partially joined using heat to form air layers C1 and C2 which are sealed heat insulating layers. However, the present invention is not limited to such an example.

  For example, the film 3 and the film 4 are formed in a three-dimensional (three-dimensional) shape in advance to form a bent shape, and the surface on the film 1 opposite to the surface on which the film 2 is provided. In addition, the film 3 is overlapped, and the film 4 is overlapped on the surface of the film 2 opposite to the film 1, and then the films 1 to 4 are welded using heat. The air layers C <b> 1 and C <b> 2 that are partially bonded and sealed as a heat insulating layer may be formed.

  For example, the film 3 or the film 4 is provided in the cavity portion of the mold along the shape of the cavity portion, and the film 3 or 4 is bent and temporarily fixed, and in this state, on the film 1 and the film 2 The film 3 is provided on the surface opposite to the surface on which the film 4 is provided, and the film 4 is provided on the surface opposite to the film 1 on the film 2, and then the film 1 is provided. The film 4 may be welded using heat and partially joined to form the air layers C1 and C2 which are sealed heat insulating layers.

  Further, a thermally expandable resin is provided in advance between the film 1 and the film 3 and between the film 1 and the film 2 and between the film 2 and the film 4. 4 may be overlapped, and the film 1 to the film 4 may be welded using heat and partially joined at a position indicated by an arrow E in FIG. When heating is performed in such a state, a component in the thermally expandable resin changes to a gas, and a thermally expandable resin layer that has expanded as a heat insulating layer (heat insulating portion) by the pressure can be formed (formation of heat insulating portion). Process).

  As the thermally expandable resin, for example, thermally expandable microcapsules “Matsumoto Microsphere (registered trademark)” F series (F-20, F-36, etc.) of Matsumoto Yushi Seiyaku Co., Ltd. can be used. Thermally expandable microcapsules are microcapsules in which liquid low-boiling hydrocarbons are wrapped with a thermoplastic polymer shell. When heated, the polymer shell softens and the liquid hydrocarbon in the capsule changes to a gas, so that the capsule expands at that pressure.

  In the embodiment using the thermally expandable resin layer, there is no step of slightly deflecting the film 1 and the film 2 shown in FIG. 3C or blowing (injecting) air between the two joints D ′. A jig or the like required for the process becomes unnecessary, and the manufacturing process can be simplified.

  By the way, in the example shown in FIG.3 and FIG.4, in the joining of the films 1 thru | or the film 4, welding by heat is used, However, This invention is not limited to this example. For example, as shown in FIGS. 5 and 6, the films 1 to 4 may be bonded together using an adhesive.

  In the example shown in FIGS. 5 and 6, first, films 1 to 4 are prepared (see FIG. 5A, film lamination step).

  An adhesive 5a is provided in advance on the film 1 at a location corresponding to the joining location D 'shown in FIG. In addition, an adhesive 5b and an adhesive 5c are provided in advance on the film 2 and the film 3, respectively, by pattern printing or the like at locations corresponding to the joining location E ′ shown in FIG. As the adhesives 5a to 5c, for example, a general two-component reaction type polyurethane adhesive as a dry laminate adhesive can be used.

  Next, the film 3, the film 1, the film 2, and the film 4 are laminated in this order, and are bonded together via the adhesives 5 a to 5 c (see FIG. 5B, film bonding process).

  Thereafter, air is blown (injected) between the two joints D ′ of the film 1 and the film 2 to form a space portion. The said space part can be connected with external piping, and functions as the water conduit B through which the cooling water which is a cooling medium passes. Further, between the film 1 and the film 3 and between the two joints E ′, air is blown (injected) to form a space portion. The space portion is located below the water conduit B and functions as an air layer C <b> 1 as a sealed heat insulating layer in the film pipe 10. Further, air is blown (injected) between the film 2 and the film 4 and between the two joints E 'to form a space portion. The said space part is located above the said water conduit B, and functions as the air layer C2 which is a heat insulation layer sealed in the film piping 10 (refer FIG.6 (c), space formation process).

  Next, unnecessary portions of the films 1 to 4 that are located outside the joining portion E ′ are deleted, and the film pipe 10 is completed (see FIG. 6D).

  Thus, in the example shown in FIGS. 5 and 6, the water conduit B and the air layers C <b> 1 and C <b> 2 can be formed collectively with fewer steps than the steps shown in FIGS. 3 and 4.

3. Example of Film Piping According to Embodiment of the Present Invention Next, an example of film piping according to the above-described embodiment of the present invention will be described with reference to FIGS. 7 to 11, (b) is a perspective view, and (a) is a cross-sectional view taken along the line XX of the perspective view.

  The inventor of the present invention produced a film pipe by the method shown in FIGS. In this example, the same film, specifically, a laminate film made of PET was used as each of the four flexible films 11 to 14.

  First, films 11 and 12 and two metal pipes 15 were prepared so as to form a water conduit through which cooling water as a cooling medium passes. And the one end part of the two metal piping 15 was clamped with the film 11 and the film 12 located above the film 11 (refer FIG. 7).

  A metal pipe 15 was prepared by roughening the surface of the joint portion with the films 11 and 12 in advance using sandpaper having a coarseness of 1000 (# 1000). The metal pipe 15 is made of copper (Cu), has a diameter of 4 mm, and has a thickness of 0.5 mm.

  Next, in a state where the film 11 and the film 12 are bent using a mold not shown, the space 11 is formed between the two metal pipes 15 and the film 11 and the film 12 are illustrated using heat. 7 (a), welding was performed at a position indicated by an arrow F, and the films 11 and 12 and the films 11 and 12 and the metal pipe 15 were sealed and joined (see FIG. 8). The heating temperature here was 100 ° C. The space formed between the two joints F ′ can be connected to an external pipe and functions as a water conduit through which cooling water as a cooling medium passes.

  Next, the film 13 temporarily fixed and bent on the mold 16a as the film support shown in FIG. 9A is provided so as to overlap the surface on the film 11 opposite to the surface on which the film 12 is provided. The film 14 temporarily fixed and bent on the mold 16b as the film support was provided on the film 12 on the surface opposite to the film 11 (see FIG. 9).

  Next, the film 11 to the film 14 are welded using heat at a location slightly outside the two joint locations F ′ of the film 11 and the film 12, that is, at a location indicated by an arrow G in FIG. And sealed and joined (see FIG. 10). The heating temperature here was 100 ° C. As a result, a space portion that functions as an air layer that is a sealed heat insulating layer is formed between the two joints G ′ and between the film 11 and the film 13 and between the film 12 and the film 14. It was.

  Thereafter, unnecessary portions of the film 11 to the film 14 located outside the joining portion G ′ were deleted, and the film piping 20 was completed (see FIG. 11).

  The inventor of the present invention connects the film pipe 20 produced through the above-described steps to a small pump through a rubber pipe having a diameter of 6 mm and a thickness of 1 mm, and water at a rate of 300 ml per minute. The water transfer test was conducted. As a result, it was confirmed that there was no water leakage from the film pipe 20 or air leakage as a heat insulating layer.

4). Application Examples of Film Piping According to Embodiment of the Present Invention Next, application examples of film piping according to an embodiment of the present invention will be described with reference to FIGS.

(1) 1st example In FIG. 12, the 1st application example (shape example of a water conduit) of the film piping concerning embodiment of this invention is shown. In FIG. 12, the arrow indicates the direction of the water flowing in the film pipe. Further, in FIG. 12, locations shown in gray indicate conduits B <b> 1 and B <b> 2 that can be connected to external piping in the film piping and through which cooling water that is a cooling medium passes.

  In the production of the film piping according to the embodiment of the present invention, as described with reference to FIGS. 3 to 6, the films are joined by welding or adhesion. As shown in FIG. 12, arbitrary water conduits can be formed collectively.

  In the example shown in FIG. 12, in the film pipe 30, a water conduit B <b> 1 as an outward path with respect to the cooling control and a water conduit B <b> 2 as a return path are formed. The water conduit B2 is formed in a straight line, whereas the water conduit B1 has a complicated shape having a bent portion. Since each film in the film piping 30 is joined by welding or adhesion, a plurality of water conduits B1 and B2 can be formed at once, and the water conduit B1 having a complicated shape can be formed as a connector or the like. It can be formed without requiring a joining member and without causing leakage of cooling water from the joining member.

  Therefore, when forming a plurality of water conduits or when forming a water conduit having a complicated shape, the number of parts and the assembly of the pipes are smaller than when the film pipe 30 according to the embodiment of the present invention is not used. The number of steps can be reduced.

(2) Second Example FIG. 13 shows a second application example of the film pipe according to the embodiment of the present invention. In FIG. 13, the arrows indicate the direction of the water flowing in the film pipe. Further, in FIG. 13, the locations shown in gray indicate the water conduits B3 and B4 through which the cooling water as the cooling medium can be connected with the external piping in the film piping 40 and 50, and the hatched locations are The air layers C5 and C6, which are sealed heat insulation layers, are shown.

  In the example shown in FIG. 13, the film pipes 40 and 50 are formed integrally with the water cooling jacket 70, and the cooling module 80 including the film pipes 40 and 50 and the water cooling jacket 70 is formed.

  A water distribution pipe (not shown) is provided in the water cooling jacket 70 as an example of the heat recovery unit, and heat from the cooling target of the water cooling jacket 70 such as a CPU is recovered when water flows into the water distribution pipe. .

  In the film piping 40, a water conduit B <b> 3 that is connected to a water distribution pipe (not shown) provided in the cooling jacket (cooling unit) 70 and that supplies cooling water to the water distribution pipe is provided. And the air layer C5 which is a sealed heat insulation layer is provided around the water conduit B3. Further, the film pipe 50 is provided with a water conduit B4 that is connected to a water pipe (not shown) provided in the cooling jacket 70 and that discharges water from the water pipe. And the air layer C6 which is a sealed heat insulation layer is provided in the circumference | surroundings of the water conduit B4.

  Concavities and convexities are formed on the surface of the water pipe that is provided in the cooling jacket 70 and joined to the film pipes 40 and 50 of the water distribution pipe extending from the cooling jacket 70, and provided on the film pipes 40 and 50. The adhesive layer adheres to the unevenness, and the film pipes 40 and 50 and the water pipe extending from the cooling jacket 70 are joined. Thereby, the cooling module 80 is formed.

  In such a structure, since a joining member such as a connector is not necessary, the number of parts can be kept low, and the cooling module 80 corresponding to space saving can be realized.

  Furthermore, the cooling module 80 can be easily installed according to the structure of the electronic device. That is, since the film pipes 40 and 50 of the cooling module 80 are formed by joining flexible films, the heat generating body (cooling target) has an outer shape (uneven shape, etc.) based on flexibility. It can follow and deform. That is, since the film pipes 40 and 50 have a degree of freedom of deformation unlike metal pipes, the contact area with respect to an electronic component that is a heating element (cooling target) can be increased. Therefore, the electronic component can be reliably cooled without providing complicated piping corresponding to the structure of the electronic device.

  Then, in the cooling module in which the film piping is connected to the cooling jacket 70, the heat generated from the electronic components other than the CPU is made by making the shape of the water conduit of the film piping correspond to the arrangement of the electronic components provided in the electronic device. Can be recovered. This will be described with reference to FIG.

  FIG. 14 is a diagram illustrating mounting of the cooling module on an electronic device. In FIG. 14, the detailed configuration of the film pipes 45 and 50 is omitted for easy viewing of the drawing.

  As indicated by arrows in FIG. 14, the cooling module 90 is mounted on the electronic device 100. On the wiring board 91 of the electronic device 100, in addition to the CPU 95, a plurality of (four in FIG. 14) IC chips 96-1 to 96-4 that are electronic components such as a memory are arranged side by side with a predetermined interval. Yes. Similarly to the CPU 95, the IC chips 96-1 to 96-4 are also heat generators (cooling targets). In the film piping 45 of the cooling module 90, the water conduit B3 branches into B3a to B3d at a predetermined interval in the middle corresponding to the arrangement of the IC chips 96-1 to 96-4.

  Here, the water conduits B3b to B3d provided corresponding to the arrangement of the IC chips 96-1 to 96-4 will be further described with reference to FIG. FIG. 15A is a perspective view showing a contact relationship between the IC chips 96-1 to 96-4 and the water conduits B3b to B3d, and FIG. 15B is a top view of FIG. 15A. .

  Referring to FIG. 15, in the film pipe 45, the location between the IC chips 96-1 and 96-2, the location between the IC chips 96-2 and 96-3, and the location between the IC chips 96-3 and 96-4. Unlike the other places, the heat insulating layer is not formed in the places, and the water conduits B3b to B3d are exposed. The water conduit B3b is in contact with the IC chips 96-1 and 96-2 which are heating elements (cooling targets), and the water conduit B3c is in contact with the IC chips 96-2 and 96-3 which are heating elements (cooling targets). The water conduit B3d is in contact with the IC chips 96-3 and 96-4 that are heating elements (cooling targets).

  Thus, in the film piping 45, the part which contacts a heat generating body has a two-layer structure which consists of the film 1 and the film 2 which does not have a heat insulation layer, and makes a film by contacting the water conduit B and a heat generating body. The heat recovery by the pipe 45 itself is realized. Therefore, heat recovery from a plurality of electronic components such as the CPU 95 and the IC chips 96-1 to 96-4 is enabled by one heat recovery system called the cooling module 90.

  However, the outer peripheral surface of the water conduit B3b in contact with the IC chips 96-1 and 96-2, the outer peripheral surface of the water conduit B3c in contact with the IC chips 96-2 and 96-3, and the IC chip 96. -3 and 96-4 may be formed on the outer peripheral surface of the water conduit B3d with a high thermal conductivity material such as a thin film made of copper (Cu). Thereby, the water conduits B3b to B3d can efficiently recover the heat from the IC chips 96-1 to 96-4.

  FIG. 16 shows a schematic diagram when such a cooling module that realizes heat recovery from a plurality of electronic components is provided in the server. 16A is a top view, and FIG. 16B is a side view when viewed in the arrow Y direction in FIG. 16A. In FIG. 16A, the arrow indicates the flow of water flowing in the film pipe.

  16, on a wiring board 91 provided in the server, a CPU 95, a plurality of (five in FIG. 16) IC chips 96-1 to 96-5 such as memories, and other electronic components 97 to 99 are provided. Is provided. The IC chips 96-1 to 96-5 and the like are provided side by side with a predetermined interval. Above the wiring substrate 91, a cooling module 190 including the cooling jacket 70 and the film pipes 50 and 140 according to the embodiment of the present invention is provided.

  The cooling jacket 70 is provided on the upper surface of the CPU 95 and is connected to the film pipes 50 and 140.

  In the film pipe 140, the water conduit B3 is branched into B3a to B3d at a predetermined interval in the middle corresponding to the arrangement of the IC chips 96-1 to 96-5. In the film piping 140, the location between the IC chips 96-1 and 96-2, the location between the IC chips 96-2 and 96-3, the location between the IC chips 96-3 and 96-4, and the IC chip 96-4. And unlike other places, the place between 96-5 has a two-layer structure consisting of the film 1 and the film 2 without a heat insulating layer, and the water conduits B3a to B3d are exposed. That is, in the film pipe 140, the heat insulating layer is partially provided.

  The water conduit B3a is in contact with the IC chips 96-1 and 96-2, the water conduit B3b is in contact with the IC chips 96-2 and 96-3, and the water conduit B3c is in the IC chips 96-3 and 96-2. -4 and the water conduit B3d is in contact with the IC chips 96-4 and 96-5.

  In the cooling module 190 having such a structure, water as a cooling medium circulates through the cooling jacket 70 with the film pipe 50 as the forward path and the film pipe 140 as the forward path (circulation mechanism will be described later). Heat generated from the CPU 95 is recovered in the cooling jacket 70, and heat generated from the IC chips 96-1 to 96-5 is recovered by the film pipe 140.

  Therefore, heat recovery from a plurality of electronic components such as the CPU 95 and the IC chips 96-1 to 96-4 can be performed by one heat recovery system called the cooling module 90, and cooling can be performed reliably.

(3) Third Example By the way, in the example shown in FIG. 16, a mechanism including an adsorption heat pump can be used as a circulation mechanism of water as a cooling medium. This will be described with reference to FIG. FIG. 17 is a block diagram showing the joining of the cooling module to the circulation mechanism including the adsorption heat pump.

  In the example illustrated in FIG. 17, the cooling module 190 illustrated in FIG. 16 is connected to the adsorption heat pump 210 via the coupler 205. A pump 220 connected to the adsorption heat pump 210 is connected to the cooling module 190 via a coupler 225.

  The adsorption heat pump 210 desorbs (desorbs) the refrigerant from the adsorbent using the heated water sent from the cooling module 190 in the desorption process after the adsorption process of adsorbing the refrigerant on the adsorbent. Then, the heated water sent from the cooling module 190 is cooled by utilizing the heat absorption of the adsorbent in the desorption process. The cooled water is returned again to the cooling module 190 by the pump 220.

  As described above, the coupler 205 is used when the cooling module 190 and the adsorption heat pump 210 are joined, and the coupler 225 is used when the cooling module 190 and the pump 220 are joined. This will be described with reference to FIG. FIG. 18 is an enlarged view of a portion surrounded by a dotted line Z in FIG. In addition, since the joining structure of the cooling module 190 and the pump 220 is the same as the joining structure of the cooling module 190 and the adsorption heat pump 210, the cooling module will be described with the description of the joining structure of the cooling module 190 and the adsorption heat pump 210. It replaces with description of the joining structure of 190 and the pump 220. FIG.

  Referring to FIG. 18, the film pipe 140 of the cooling module 190 is connected to a metal pipe 205 a extending from the inside of the coupler 205 to the outside. The end of the metal pipe 205a and the vicinity thereof are inserted into the film pipe 140 of the cooling module 190.

  Concavities and convexities are formed on the surface of the metal pipe 205 a where the film pipe 140 is joined, and an adhesive layer provided on the film pipe 140 adheres to the irregularities and extends from the film pipe 140 and the coupler 205. The distributed water pipe 205a is joined. In addition, you may coat | cover the location which is not inserted in the film piping 140 among the water distribution pipes 205a extended from the coupler 205 with a heat insulating material.

  Thus, since the cooling module 190 including the cooling jacket 70, the film pipe 50, and the film pipe 140 is joined to the circulation mechanism including the adsorption heat pump 210, the heating element can be efficiently cooled.

  Although the embodiment of the present invention has been described in detail above, the present invention is not limited to the specific embodiment, and various modifications and changes are within the scope of the gist of the present invention described in the claims. It can be changed.

Regarding the above description, the following items are further disclosed.
(Appendix 1)
Multiple films are stacked and joined,
A film pipe comprising: a space between first films formed with a medium path through which a cooling medium passes; and a space between second films provided with a heat insulating portion.
(Appendix 2)
The film piping according to appendix 1,
The film piping, wherein the plurality of films are joined by welding.
(Appendix 3)
The film piping according to appendix 1,
The film piping characterized in that the plurality of films are bonded together by adhesion.
(Appendix 4)
The film piping according to appendix 1,
The heat insulating part is partially provided;
Film piping characterized in that a film forming the medium path is exposed at a location where the heat insulating portion is not provided.
(Appendix 5)
The film piping according to appendix 4,
A film pipe, wherein a thermally conductive layer is formed on the exposed film.
(Appendix 6)
The film piping according to any one of appendices 1 to 5,
The film pipe having a multilayer structure having a layer containing a metal or an inorganic substance.
(Appendix 7)
The film piping according to any one of appendices 1 to 6,
The film pipe is connected to a heat pump.
(Appendix 8)
A cooling section;
Including a film pipe connected to the cooling unit,
The film piping is
Multiple films are stacked and joined,
A cooling module comprising: a space between first films formed with a medium path through which a cooling medium passes; and a space between second films provided with a heat insulating portion.
(Appendix 9)
The cooling module according to appendix 8, wherein
The heat insulating part is partially provided;
A cooling module, wherein the film constituting the medium path is exposed at a place where the heat insulating portion is not provided, and heat from the object to be cooled is recovered.
(Appendix 10)
A method for manufacturing film piping,
A film laminating step of stacking a plurality of films;
A film bonding step for bonding the plurality of stacked films;
A space forming step of forming a space between the plurality of bonded films,
An adhesive is provided between the plurality of stacked films, and the plurality of films are bonded together in the film bonding step.
(Appendix 11)
A method for manufacturing film piping,
A film laminating step of stacking a plurality of three-dimensionally formed films;
And a film joining step for joining the plurality of stacked films.
(Appendix 12)
A method for manufacturing film piping,
A film laminating step of laminating a plurality of films via a thermally expandable resin;
And a heat insulating portion forming step in which a thermally expandable resin layer expanded by heating is formed between the films as a heat insulating portion.

1, 2, 3, 4, 11, 12, 13, 14 Film 10, 10 ', 20, 45, 50, 140 Film piping 70 Cooling jacket 80, 90, 190 Cooling module 95 CPU
96 IC chip 210 Heat pump B Water conduit C Thermal insulation layer

Claims (7)

Multiple films are stacked and joined,
A film pipe comprising: a space between first films formed with a medium path through which a cooling medium passes; and a space between second films provided with a heat insulating portion. The film piping according to claim 1,
The film pipe is connected to a heat pump. A cooling section;
Including a film pipe connected to the cooling unit,
The film piping is
Multiple films are stacked and joined,
A cooling module comprising: a space between first films formed with a medium path through which a cooling medium passes; and a space between second films provided with a heat insulating portion. The cooling module according to claim 3, wherein
The heat insulating part is partially provided;
A cooling module, wherein the film constituting the medium path is exposed at a place where the heat insulating portion is not provided, and heat from the object to be cooled is recovered. A method for manufacturing film piping,
A film laminating step of stacking a plurality of films;
A film bonding step for bonding the plurality of stacked films;
A space forming step of forming a space between the plurality of bonded films,
An adhesive is provided between the plurality of stacked films, and the plurality of films are bonded together in the film bonding step. A method for manufacturing film piping,
A film laminating step of stacking a plurality of three-dimensionally formed films;
And a film joining step for joining the plurality of stacked films. A method for manufacturing film piping,
A film laminating step of laminating a plurality of films via a thermally expandable resin;
And a heat insulating portion forming step in which a thermally expandable resin layer expanded by heating is formed between the films as a heat insulating portion.

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