JP2010245932A - Piezoelectric resonance component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric resonance component capable of improving the fixation strength of a metal cap and ensuring high insulation property. <P>SOLUTION: A piezoelectric resonance component includes: a substrate 11 with terminal electrodes 16a, 17a formed on at least an upper surface thereof and which is made of an insulated material; a piezoelectric resonance element 13 mounted on the upper surface of the substrate; and a metal cap 15 fixed through a sealing resin 14 to the upper surface of the substrate so as to seal the piezoelectric resonance element 13. The metal cap 15 is formed by performing half-etching on a metal plate and has a bottom surface of the same plane, and the sealing resin 14 contains insulating fillers. Therefore, an adhesion area between the metal cap 15 and the sealing resin 14 becomes larger and a fixation strength of the metal cap 15 can be improved. Furthermore, high insulation property can be ensured between a metal cap bottom surface 15a and the terminal electrodes 16a, 17a on the upper surface of the substrate without increasing the number of components and man-hours. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a piezoelectric resonant component including a piezoelectric resonant element on a capacitive substrate represented by, for example, a piezoelectric oscillator.

  In recent years, with the downsizing, low profile, high accuracy, and low price of electronic devices, the demand for smaller and more accurate piezoelectric oscillators used in electronic devices has increased. Instead, surface mount type piezoelectric resonant components are widely used. A piezoelectric oscillator is known as an example of a surface-mount type piezoelectric resonant component. The piezoelectric resonator includes a capacitive substrate having a rectangular internal electrode layer and a terminal electrode, a piezoelectric resonant element mounted on the capacitive substrate via a conductive adhesive, and the capacitor so as to seal the piezoelectric resonant element. An alumina cap fixed on a substrate via a sealing resin is provided as a package. As described above, a ceramic cap such as alumina or a resin cap is generally used as a package of a surface mount type piezoelectric resonant component. In some cases, it was bulky and could not satisfy the demands for small size and low profile. Therefore, in order to reduce the product height, a package that uses a metal cap has been proposed.

  And, for example, in Patent Document 1, after drawing a thin metal plate so that a flange is formed on the outer periphery of the opening of the metal cap, the flange is positioned near the outer surface of the cap and the outer surface. A piezoelectric component is disclosed in which an opening of a metal cap is bonded and sealed in a substantially line contact state with a substrate by cutting in parallel.

  In addition, the piezoelectric resonant component that employs a metal cap has a short distance between the metal cap and the terminal electrode on the upper surface of the substrate, so it is important to ensure high insulation between the metal cap and the terminal electrode on the upper surface of the substrate. is there.

  For example, Patent Document 2 discloses an electronic component in which a metal cap having an insulating film on an end face of an opening and the vicinity thereof is bonded to a substrate with an insulating adhesive.

JP-A-8-111627 JP 2001-110925 A

  However, in Patent Document 1, when the metal cap and the upper surface of the substrate are connected via the sealing resin, the adhesion area between the metal cap and the sealing resin is small. there were.

  Moreover, in patent document 2, after forming an insulating film in a metal cap, since the metal cap was joined to a board | substrate with an insulating adhesive agent, there existed a subject that the number of components and a man-hour increased.

  The present invention solves the above-mentioned problems, and ensures high insulation between the metal cap and the terminal electrode on the upper surface of the board without increasing the fixing strength of the metal cap and increasing the number of components and man-hours. An object of the present invention is to provide a piezoelectric resonant component that can be used.

  In order to achieve the above object, a piezoelectric resonant component of the present invention seals a substrate made of an insulating material having terminal electrodes formed on at least an upper surface, a piezoelectric element mounted on the upper surface of the substrate, and the piezoelectric element. A metal cap fixed to the upper surface of the substrate via a sealing resin, the metal cap is formed by half-etching a metal plate and has a bottom surface on the same plane, and the sealing resin is insulative. It is set as the structure containing a filler.

  According to the piezoelectric resonant component of the present invention, since the metal cap and the capacitor substrate are connected via the sealing resin on the entire bottom surface of the metal cap, the bonding area between the metal cap and the sealing resin increases, Fixing strength can be improved.

  In addition, since the sealing resin contains an insulating filler, when the sealing resin is cured at a high temperature while applying a load to the metal cap, the insulating filler is interposed between the metal cap bottom surface and the terminal electrode on the substrate top surface. Since the distance between the bottom surface of the metal cap and the terminal electrode on the top surface of the substrate can be ensured by interposing, between the bottom surface of the metal cap and the terminal electrode on the top surface of the substrate without increasing the number of components and man-hours. High insulation can be ensured.

1 is an exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention. Sectional drawing of the AA surface of the piezoelectric oscillator in embodiment of this invention Sectional drawing of the BB surface of the piezoelectric oscillator in embodiment of this invention The bottom view of the metal cap in an embodiment of the invention Sectional drawing of the piezoelectric oscillator in the comparative example 2

(Embodiment)
Hereinafter, embodiments of the piezoelectric resonant component of the present invention will be described with reference to the drawings, taking a piezoelectric resonator as one of the piezoelectric resonant components as an example.

  FIG. 1 is an exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the AA plane of the piezoelectric oscillator according to Embodiment 1 of the present invention.

  As shown in FIGS. 1 and 2, the piezoelectric resonator according to the embodiment of the present invention includes a piezoelectric resonant element 13 having a confinement electrode 18 mounted on a capacitor substrate 11 via a conductive adhesive 12, A metal cap 15 fixed on the capacitor substrate 11 with a sealing resin 14 is provided so as to seal the piezoelectric resonance element 13. The metal cap 15 has a coplanar metal cap bottom surface 15a and a metal cap inner side surface 15b formed by half-etching from a metal plate. The surface roughness of the metal cap inner side surface 15b is equal to that of the metal cap bottom surface 15a. It is rougher than the surface roughness. The metal cap bottom surface 15a, a part of the inner surface 15b of the metal cap, and a part of the outer surface 15c of the metal cap are bonded to the sealing resin 14. Here, the sealing resin 14 contains an insulating filler.

  Next, the effects of the piezoelectric resonant component according to the present invention will be described below together with an embodiment of the manufacturing method, taking a piezoelectric resonator as one of the piezoelectric resonant components as an example.

  First, a method for manufacturing the capacitor substrate 11 will be described with reference to FIGS.

First, an organic binder, a plasticizer, an organic solvent and, if necessary, a dispersing agent are mixed with a dielectric powder mainly composed of CaTiO ₃ to prepare a ceramic slurry, and this ceramic slurry is formed into a sheet by a doctor blade method or the like. Mold to obtain a green sheet. Next, a Pd paste is screen-printed on the green sheet to form a conductor layer pattern that becomes the internal electrode 19. Further, Pd paste is screen-printed on another green sheet to form a conductor layer pattern that becomes terminal electrodes 16c, 17c, and 18c on the lower surface of the substrate. Then, after laminating a plurality of these green sheets, a conductor layer pattern to be the terminal electrodes 16a and 17a on the upper surface of the substrate is formed by transfer to obtain a laminate. And this laminated body is cut | disconnected and the laminated body of an individual piece is obtained.

  Next, in order to remove the plasticizer and the organic binder, the individual laminate is fired at a temperature of 1200 to 1400 ° C. for about 2 hours to obtain a sintered body.

  Next, Ag paste is applied to a predetermined position on the side surface where the internal electrode is exposed, dried, and then baked at a temperature of 700 to 900 ° C. to form terminal electrodes 16b, 17b, and 18b on the side surface of the substrate. . Thereby, the terminal electrode 16b on the side surface of the substrate is connected to one internal electrode 19, the terminal electrode 16a on the upper surface of the substrate, and the terminal electrode 16c on the lower surface of the substrate, and the terminal electrode 17b on the side surface of the substrate is connected to the other internal electrode 19 and the upper surface of the substrate. The terminal electrode 17a and the terminal electrode 17c on the lower surface of the substrate are connected, and the terminal electrode 18b on the side surface of the substrate is connected to the internal electrode 20 and the terminal electrode 18c on the lower surface of the substrate.

  Next, Ni plating and Au plating are performed on the surfaces of the terminal electrodes 16, 17, 18 to obtain the capacitor substrate 11 shown in FIG. 1. The dimensions of the capacitive substrate 11 obtained as described above were 3.2 mm in length, 1.3 mm in width, and 0.3 mm in thickness. Further, the surface roughness Ra of the terminal electrodes 16a and 17a on the upper surface of the substrate after Au plating was 1.0 μm. The surface roughness was measured using a contact type surface roughness meter.

  Next, a method for manufacturing the piezoelectric resonance element 13 will be described with reference to FIGS.

First, an Ag paste is applied to the front and back surfaces of a thick plate-like sintered body block made of a piezoelectric ceramic material containing PbTiZrO ₃ as a main component, dried, and then baked at 750 ° C. to form a polarization electrode. The sintered body block on which the electrode for polarization is formed is polarized by applying a DC voltage in the thickness direction of the sintered body block.

  Next, this sintered body block is cut with a dicing saw to form a rectangular thin plate. Then, the thickness direction of the rectangular thin plate is precisely polished so that a predetermined resonance frequency as a piezoelectric resonance element is obtained. Thereafter, the vibration confinement electrode 21 is formed by sputtering in the order of Cr, Cu, and Ag on the front surface, the back surface, and one end surface of the rectangular thin plate. Thereafter, a rectangular thin plate on which the vibration confinement electrode 21 is formed is cut out by a dicing saw so that the width dimension is 0.38 mm, and the piezoelectric resonant element 13 having a length of 2.0 mm, a width of 0.38 mm, and a thickness of about 160 μm is obtained. obtain.

  Then, the manufacturing method of the metal cap 15 is demonstrated using FIG. 2, FIG.

  First, a metal plate having an outer shape of 100 mm × 100 mm and a thickness of 0.4 mm is prepared using SUS304, which is a type of stainless steel. Next, the metal plate is later cut in the vertical direction and the horizontal direction to perform masking and half-etching so that a large number of metal caps can be obtained. Here, half etching refers to etching that is performed from one side and does not penetrate through the other side. A method of masking the metal plate and performing half etching will be described in detail below.

  First, a portion of the metal plate that becomes the metal cap bottom surface 15a is masked using a resist to prevent corrosion by the etching solution. The other surface is masked over the entire surface using a resist. Next, half etching is performed by applying an etching solution to the masked metal plate. A ferric chloride solution was used as an etching solution when performing half-etching. In this half etching, it is preferable that the thickness C of the central portion of the metal cap upper surface 15d is 5 to 50% of the thickness of the metal plate.

  Next, the half-etched metal plate is cut into individual pieces so as to have a predetermined size using a processing machine such as a laser processing machine or a dicing saw to obtain the metal cap 15 of the embodiment. Here, the outer dimension of the obtained metal cap 15 is 3.0 mm × 1.0 mm × 0.4 mm. The vertical width D of the metal cap bottom surface 15a was 0.2 mm, the horizontal width E was 0.1 mm, and the thickness C of the central portion of the metal cap upper surface 15d was 0.1 mm. Further, the surface roughness Ra of the inner side surface 15b of the metal cap is 10 μm, the surface roughness Ra of the metal cap bottom surface 15a is about 0.1 μm, and the surface roughness Ra of the inner side surface 15b of the metal cap is set to that of the metal cap bottom surface 15a. It was made rougher than the surface roughness Ra.

  Next, a method for manufacturing a piezoelectric resonator using the capacitor substrate 11, the piezoelectric resonance element 13, the metal cap 15, the conductive adhesive 12, and the sealing resin 14 obtained above will be described with reference to FIGS. 1 and 2. explain.

  First, the conductive adhesive 12 is formed on the terminal electrodes 16a and 17a on the upper surface of the capacitor substrate 11 by screen printing. Thereafter, the piezoelectric resonant element 13 having the vibration confining electrode 21 is mounted and pressed and fixed, and then the conductive adhesive 12 is cured at a temperature of 70 to 250 ° C., and the piezoelectric resonant element 13 is mounted and fixed on the capacitor substrate 11. At the same time, the vibration confinement electrode 21 of the piezoelectric resonance element 13 and the terminal electrodes 16a and 17a on the upper surface of the substrate are electrically connected.

Next, the sealing resin will be described below. As the sealing resin, an epoxy resin containing an insulating filler was used, and SiO ₂ powder was used as the insulating filler. The average particle diameter of the insulating filler is 5 μm and spherical, and the insulating filler content is 5%, 30%, 70%, 90% of the weight of the sealing resin, and the insulating filler as a comparative example. 5 types of sealing resin of the sealing resin which does not contain is prepared. Here, the average particle diameter was measured based on an electron microscope image of a cross section of the cured sealing resin.

  Then, using the five kinds of sealing resins produced above, five kinds of piezoelectric oscillators were produced by the following method.

  First, a metal cap 15 shown in FIG. 1 is prepared, and a paste-like seal prepared as described above is formed on the metal cap bottom surface 15a, a part of the metal cap inner side surface 15b, and a part of the metal cap outer side surface 15c. Resin is applied and the metal cap 15 is mounted on the capacitor substrate 11.

  Next, the sealing resin is cured at a temperature of 185 ° C. while applying a load of about 100 gf to the metal cap 15, and the capacitor substrate 11 and the metal cap 15 are connected to obtain five types of piezoelectric oscillators.

  Here, the piezoelectric oscillator manufactured using the sealing resin having an insulating filler content of 5% is the piezoelectric oscillator of Example 1, and the piezoelectric oscillator manufactured using the sealing resin having an insulating filler content of 30%. A piezoelectric oscillator produced using the piezoelectric oscillator of Example 2 and a sealing resin with an insulating filler content of 70% is a piezoelectric oscillator of Example 3 and sealed with an insulating filler content of 90%. The piezoelectric oscillator manufactured using the stop resin was used as the piezoelectric oscillator of Example 4, and the piezoelectric oscillator manufactured using the sealing resin containing no insulating filler was used as the piezoelectric oscillator of Comparative Example 1. The five types of produced piezoelectric oscillators had the same design specifications except that the sealing resin used was different.

And about the piezoelectric oscillator of Examples 1-4 and the comparative example 1, 100 each of the insulation resistance between the terminal electrode 16 and the terminal electrode 17 of the capacity | capacitance board | substrate 11 was evaluated, and the average value and the minimum value were calculated | required. The insulation resistance was measured using an insulation resistance meter at an applied voltage of 10V. The insulation resistance value sufficient for a piezoelectric oscillator was evaluated as 10 ¹⁰ Ω or more.

  These results are shown in (Table 1).

  As is clear from the results of (Table 1), the piezoelectric oscillators of Examples 1 to 4 have higher minimum insulation resistance than the piezoelectric oscillator of Comparative Example 1. Further, in the piezoelectric resonators of Examples 2 to 4 in which the content of the insulating filler is 30% or more and 90% or less with respect to the weight of the sealing resin, the content of the insulating filler is based on the weight of the sealing resin. The minimum value of the insulation resistance is higher than that of the piezoelectric oscillator of Example 1 that is 5%.

  This result will be described below.

In the piezoelectric resonator of Comparative Example 1, since the sealing resin does not contain an insulating filler, the viscosity of the sealing resin is reduced when the sealing resin is cured at a high temperature while applying a load to the metal cap 15. In some cases, the distance between the metal cap bottom surface 15a and the terminal electrodes 16a and 17a on the top surface of the substrate is shortened, so that sufficient insulation is ensured between the metal cap bottom surface 15a and the terminal electrodes 16a and 17a on the top surface of the substrate. The minimum value of insulation resistance was 2 × 10 ⁹ Ω.

On the other hand, in the piezoelectric resonators of Examples 1 to 4, when the sealing resin contains an insulating filler, when the sealing resin is cured at a high temperature while applying a load to the metal cap 15, The distance between the metal cap bottom surface 15a and the terminal electrodes 16a and 17a on the top surface of the substrate is ensured by interposing an insulating filler between the metal cap bottom surface 15a shown in FIG. 3 and the terminal electrodes 16a and 17a on the top surface of the substrate. Therefore, high insulation between the metal cap bottom surface 15a and the terminal electrodes 16a and 17a on the top surface of the substrate can be ensured, and the minimum value of the insulation resistance of the piezoelectric oscillator of the first embodiment is 2 × 10 ^10. Ω.

In addition, the piezoelectric resonators of Examples 2 to 4 in which the content of the insulating filler is 30% or more and 90% or less with respect to the weight of the sealing resin further include the metal cap bottom surface 15a and the terminal electrode 16a on the top surface of the substrate. Since the distance to 17a can be ensured, higher insulation is ensured as compared with the piezoelectric oscillator of Example 1 in which the content of the insulating filler is 5% with respect to the weight of the sealing resin. The minimum value of the insulation resistance of the piezoelectric resonators of Examples 2 to 4 was 2 × 10 ¹¹ Ω or more.

  In addition, since the piezoelectric resonator manufactured using the sealing resin in which the content of the insulating filler exceeds 90% with respect to the weight of the sealing resin, the fixing strength of the metal cap 15 is weakened. The content of the conductive filler is preferably 90% or less with respect to the weight of the sealing resin.

  Further, by making the average particle diameter of the insulating filler larger than the surface roughness of the terminal electrodes 16a and 17a on the front surface side of the substrate and larger than the surface roughness of the metal cap bottom surface 15a, the metal cap bottom surface 15a and the substrate top surface are surely formed. Since the distance between the terminal electrodes 16a and 17a can be secured, high insulation between the metal cap 15 and the terminal electrodes 16a and 17a on the upper surface of the capacitor substrate can be secured.

  Next, in order to compare and evaluate the fixing strength, a piezoelectric resonator of Comparative Example 2 was produced as a comparative example. The piezoelectric resonator of Comparative Example 2 and the manufacturing method thereof will be described below.

  The piezoelectric resonator of Comparative Example 2 is the same as the piezoelectric resonator of Example 3 except that the shape of the metal cap 25 and the connection between the metal cap 25 and the capacitor substrate 11 via the sealing resin 14 are different from those of the above example. It is the same. As shown in FIG. 5, in the piezoelectric resonator of Comparative Example 2, the shape of the opening of the metal cap 25 is a shape that does not have a bottom surface on the same plane and the flange portion is cut. The opening of the cap 25 and the capacitor substrate 11 are connected.

  In addition, as for the method of manufacturing the piezoelectric resonator of Comparative Example 2, the method of manufacturing the metal cap 25 and the method of connecting the metal cap 25 and the capacitor substrate 11 through the sealing resin 14 are as described below. Example 3 is the same as Example 3 except for the difference. First, after drawing a 0.1 mm thin metal plate so that a flange portion is formed on the outer periphery of the opening of the metal cap 25, the flange portion is positioned near the outer surface of the metal cap and parallel to the outer surface. The metal cap 25 is produced by cutting. Then, the sealing resin 14 is applied to the opening of the metal cap 25 and the metal cap 25 is mounted on the capacitor substrate 11. Next, as in this example, the sealing resin 14 is cured at a temperature of 185 ° C. while applying a load of about 100 gf to the metal cap 25, and the capacitor substrate 11 and the metal cap 25 are connected. A piezoelectric oscillator is obtained. Here, the outer dimensions of the metal cap 25 are the same as those of the metal cap 15 of the embodiment. The same sealing resin as that of Example 3 was used.

  And about the piezoelectric oscillator of Example 3 and Comparative Example 2, the fixing strength of a metal cap was measured 30 each for each sample, and the average value was calculated | required and evaluated. The fixing strength was measured by pressing the metal cap from the direction G shown in FIG. The evaluation results are shown in (Table 2).

  As is clear from the results of (Table 2), in the piezoelectric resonator of Example 3, the fixing strength of the metal cap is larger than that of the piezoelectric resonator of Comparative Example 2.

  As described above, the piezoelectric resonator according to the present invention has the metal cap bottom surface 15a on the same plane, and the metal cap 15 and the capacitor substrate 11 are connected to each other through the sealing resin 14 over the entire metal cap bottom surface 15a. Therefore, the adhesion area between the metal cap 15 and the sealing resin 14 is increased, and the fixing strength of the metal cap 15 can be improved.

  Further, by making the surface roughness of the inner surface 15b of the metal cap rougher than the surface roughness of the bottom surface 15a of the metal cap, the sealing resin 14 on the inner surface 15b of the metal cap when the sealing resin 14 is applied to the metal cap 15 is obtained. Therefore, the adhesion area between the inner surface 15b of the metal cap and the sealing resin 14 is increased, and the fixing strength of the metal cap 15 can be further improved.

  Here, the reason why the surface roughness of the metal cap inner side surface 15b is made rougher than the surface roughness of the metal cap bottom surface 15a is that the surface roughness of the metal cap bottom surface 15a is reduced and the surface of the metal cap inner side surface 15b is made. This is because by increasing the roughness, the insulation between the metal cap 15 and the terminal electrodes 16a and 17a on the upper surface of the substrate can be maintained, and the fixing strength of the metal cap 15 can be improved.

  In addition, since the metal cap 15 has the bottom surface 15a in the same plane, a pressing force when a load is applied to the metal cap 15 is received by the plane, so that the pressing force does not concentrate on the local area and the metal cap shown in FIG. Since the distance between the bottom surface 15a and the terminal electrodes 16a and 17a on the upper surface of the substrate can be maintained, insulation between the metal cap bottom surface 15a and the terminal electrodes 16a and 17a on the upper surface of the substrate can be ensured.

  As described above, the piezoelectric resonator of the present invention has the metal cap bottom surface 15a on the same plane, and can improve the fixing strength of the metal cap 15 by containing an insulating filler in the sealing resin. In addition, insulation between the metal cap 15 and the terminal electrodes 16a and 17a on the upper surface of the substrate can be ensured.

  In the above embodiment, as shown in FIG. 4, the vertical width D at the bottom surface of the metal cap is 0.2 mm and the lateral width E is 0.1 mm. The width D and the width E in the horizontal direction are 0.05 mm or more, and a larger fixing strength than that of Comparative Example 2 is obtained.

  In the above embodiment, the surface roughness Ra of the inner surface 15b of the metal cap is 10 μm. However, the surface roughness Ra of the inner surface 15b of the metal cap is 1 μm or more, and the sealing resin is applied to the metal cap. Since the wettability of the sealing resin 14 to the inner surface 15b of the metal cap is improved, the surface roughness Ra of the inner surface 15b of the metal cap is preferably set to 1 μm or more.

In the above embodiment, SiO ₂ is used as the insulating filler of the sealing resin. However, the same effect can be obtained in the piezoelectric oscillator using the sealing resin containing Al ₂ O ₃ or the like as the insulating filler. can get.

  Further, in the above embodiment, the dimensions of the capacitor substrate are 3.2 mm in length and 1.3 mm in width, and the dimensions of the metal cap corresponding to this are mentioned, but the piezoelectric oscillation using metal caps of other sizes Similar effects can be obtained in the child.

  In the above embodiment, stainless steel is used as the material of the metal cap. However, even if a metal cap mainly composed of aluminum, iron-nickel alloy, copper, or the like is used, the effect that the fixing strength can be increased is obtained. The same effect can be obtained by using a metal cap that has been subjected to a surface treatment such as forming a film on the surface.

  In the above embodiment, the piezoelectric oscillator has been described as an example. However, the same effect can be obtained in a piezoelectric resonant component such as a piezoelectric filter.

  The piezoelectric resonant component according to the present invention is particularly useful for a piezoelectric resonant component such as a piezoelectric oscillator and a piezoelectric filter because it can improve the fixing strength of the metal cap and ensure high insulation.

DESCRIPTION OF SYMBOLS 11 Capacitance board 12 Conductive adhesive 13 Piezoelectric resonance element 14 Sealing resin 15 Metal cap 15a Metal cap bottom surface 15b Metal cap inner surface 15c Metal cap outer surface 15d Metal cap upper surface 16, 17, 18 Terminal electrode 16a, 17a Terminal electrodes 16b, 17b, 18b Terminal electrodes 16c, 17c, 18c on the substrate side surface Terminal electrodes 19, 20 Internal electrode 21 Vibration confinement electrode 25 Metal cap

Claims (3)

A substrate made of an insulating material having terminal electrodes formed on at least the upper surface, a piezoelectric element mounted on the upper surface of the substrate, and a metal fixed to the upper surface of the substrate via a sealing resin so as to seal the piezoelectric element A piezoelectric resonant component comprising: a cap, wherein the metal cap is formed by half-etching a metal plate, has a bottom surface on the same plane, and the sealing resin contains an insulating filler. The piezoelectric resonant component according to claim 1, wherein the content of the insulating filler is 30% or more and 90% or less with respect to the weight of the sealing resin. The piezoelectric resonant component according to claim 1, wherein the average particle diameter of the insulating filler is larger than the surface roughness of the terminal electrode on the upper surface of the substrate and larger than the surface roughness of the bottom surface of the metal cap.

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