JP2010243534A - Method for manufacturing electrophoretic device, method for manufacturing electronic apparatus, electrophoretic device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrophoretic device which includes a technology of more easily sealing a dispersion liquid of electrophoretic particles. <P>SOLUTION: The method for manufacturing an electrophotographic device includes steps for: making a first substrate (S1) having a first sealing frame formed thereon face a second substrate (S2) on which a second sealing frame having a shape corresponding to the first sealing frame in a plan view is formed; and filling a region demarcated by the first sealing frame and the second sealing frame with the dispersion liquid (L) of the electrophoretic particles. The method for manufacturing an electrophotographic device includes: a first step of injecting the dispersion liquid of the electrophoretic particles to the inside of the first sealing frame having projections formed on the surface thereof; and a second step of heating the second sealing frame having recesses formed on the surface thereof by a tool (40) via a second substrate to widen openings of the recesses and inserting the projections into the recesses. The method enables easy sealing between substrates by the projections of the first sealing frame and the recesses of the second sealing frame. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electrophoretic device, and more particularly to a method for sealing a dispersion of electrophoretic particles.

  Generally, when an electric field is applied to a dispersion system in which fine particles are dispersed in a liquid, the fine particles move (migrate) in the liquid by Coulomb force. This phenomenon is called electrophoresis, and the fine particles are called electrophoretic particles. Devices (electrophoresis devices and electrophoretic display devices) that display desired information (images) using such electrophoresis are attracting attention as new display devices.

  The electrophoretic device has a configuration in which, for example, a dispersion of electrophoretic particles is disposed between the counter electrode of the first substrate and the pixel electrode of the second substrate. A configuration in which a dispersion of electrophoretic particles is encapsulated in advance and arranged side by side, or a partition is provided between the first and second substrates. The partition is filled with the dispersion of electrophoretic particles and the outer periphery thereof is sealed. There is a configuration one.

  For example, Patent Document 1 below discloses an apparatus having the latter configuration. That is, a technique for sealing by applying the electrophoretic precursor A to the substrate 10 on which the particle restricting portion (partition wall portion) 16 is formed, facing the substrate 20, and bonding the substrates 10 and 20 with the seal portion 26. Is disclosed. Patent Document 2 below discloses a technique of sealing the exposed surface of the dispersion 40 filled between the partition walls 20 and the upper end portion of the partition walls 20 with a sealing film 30 using a polymerizable compound. .

JP 2007-033680 A JP 2004-138959 A

  The inventor has been conducting research and development on an electrophoresis apparatus, and has been studying an apparatus that is easy to manufacture and has good characteristics.

  For example, an adhesive or laser welding is often used for bonding the partition walls or the seal portion (sealing frame).

  However, lasers are difficult to maintain and expensive. Moreover, it is necessary to apply the adhesive with high accuracy so that there is no contamination with the sealing material.

  Accordingly, development of a simpler technique for sealing an electrophoretic particle dispersion is desired, and a specific aspect of the present invention aims to provide a method for manufacturing an electrophoretic device including such a technique. .

  An electrophoretic device manufacturing method which is one of the specific embodiments according to the present invention includes a first substrate on which a first sealing frame is formed, and a second shape corresponding to the first sealing frame in plan view. Manufacture of an electrophoretic device in which a second substrate on which a sealing frame is formed is opposed to each other, and a region partitioned by the first sealing frame and the second sealing frame is filled with a dispersion of electrophoretic particles. In the method, a convex portion is formed on the surface of the first sealing frame, a concave portion is formed on the surface of the second sealing frame, and electrophoretic particles are formed in the first sealing frame. A first step of injecting the dispersion liquid, and heating the second sealing frame with a jig through the second substrate to widen the opening of the concave portion and insert the convex portion into the concave portion And a second step.

  According to this method, sealing between the substrates can be easily performed by the convex portion of the first sealing frame and the concave portion of the second sealing frame.

  For example, after the second step, there is a third step of cooling the second sealing frame. According to this method, the convex part of the first sealing frame and the concave part of the second sealing frame can be joined more quickly.

  For example, the convex portion is disposed along the first sealing frame, the concave portion is disposed along the second sealing frame, and the width of the convex portion is larger than the width of the opening of the concave portion. large. According to this method, the convex part of the 1st sealing frame and the concave part of the 2nd sealing frame can be joined more firmly.

  For example, the first sealing frame is formed in a mesh shape so as to partition a plurality of unit pixels, and the dispersion liquid of the electrophoretic particles is injected into a plurality of regions partitioned by the first sealing frame. Is done. In this way, the first and second sealing frames may be arranged in a mesh shape, and the unit pixels may be separated by joining the convex portions of the first sealing frame and the concave portions of the second sealing frame.

  For example, a partition wall that partitions a plurality of unit pixels is formed in an inner region of the first sealing frame, and the dispersion liquid of the electrophoretic particles is injected into the plurality of regions partitioned by the partition wall. As described above, the unit pixels may be separated by the partition wall, and the outer periphery of the pixel region that is an aggregate of these may be sealed by joining the convex portion of the first sealing frame and the concave portion of the second sealing frame. .

  For example, the jig is made of a heat conducting member having a shape corresponding to the first sealing frame in plan view. According to this method, only the first sealing frame can be efficiently heated.

  For example, the height of the first sealing frame is greater than the height of the second sealing frame. According to this method, the dispersion of the electrophoretic particles into the first sealing frame can be easily filled.

  The method for manufacturing an electronic apparatus according to the present invention includes the method for manufacturing the electrophoresis apparatus. According to this method, an electronic device can be easily manufactured, and the productivity of the electronic device can be improved.

  An electrophoretic device which is one of the specific embodiments according to the present invention includes a first substrate on which a first sealing frame is formed, and a second sealing frame having a shape corresponding to the first sealing frame in plan view. An electrophoretic device in which a dispersion liquid of electrophoretic particles is filled in a region defined by the first sealing frame and the second sealing frame. The first sealing frame and the second sealing frame are joined by fitting a convex portion formed on the surface of the first sealing frame into a concave portion formed on the surface of the second sealing frame. is doing.

  According to this configuration, the substrates are sealed by joining the convex portions of the first sealing frame and the concave portions of the second sealing frame.

  An electronic apparatus according to the present invention includes the electrophoresis device. According to such a configuration, an electronic device can be easily manufactured, and the productivity of the electronic device can be improved.

It is a circuit diagram which shows the structural example of an electrophoresis apparatus. 2 is a cross-sectional view illustrating a configuration of the electrophoresis apparatus according to Embodiment 1. FIG. FIG. 6 is a cross-sectional view illustrating a manufacturing process of the electrophoresis device according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a manufacturing process of the electrophoresis device according to the first embodiment. FIG. 6 is a plan view illustrating a manufacturing process for the electrophoresis device according to the first embodiment. FIG. 10 is a cross-sectional view showing a manufacturing process of the electrophoresis apparatus of the second embodiment. FIG. 10 is a plan view showing a manufacturing process for the electrophoresis apparatus of the second embodiment. It is a figure which shows the other shape of a recessed part and a convex part. It is a figure which shows the other shape of a recessed part and a convex part. It is a perspective view which shows the electronic paper which is an example of an electronic device. It is a perspective view which shows the mobile telephone which is an example of an electronic device. It is a perspective view which shows the portable information processing apparatus which is an example of an electronic device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same or related code | symbol is attached | subjected to what has the same function, and the repeated description is abbreviate | omitted.

<Embodiment 1>
FIG. 1 is a circuit diagram illustrating a configuration example of an electrophoretic device (electrophoretic display device, electro-optical device). As shown in FIG. 1, pixels P are arranged in a matrix at intersections of a plurality of data lines DL and a plurality of scanning lines SL. Each pixel P has a dispersion liquid L of electrophoretic particles disposed between the pixel electrode PE and the common electrode CE, and the pixel electrode PE is connected to the data line DL via the transistor T. The gate electrode of the transistor T is connected to the scanning line SL. FIG. 1 is an example, and other elements such as a storage capacitor may be incorporated as needed.

  FIG. 2 is a cross-sectional view showing the configuration of the electrophoresis apparatus of the present embodiment. As shown in FIG. 2, the electrophoretic particle dispersion L is filled in a space formed by the substrates S <b> 1 and S <b> 2 and the partition walls 30. On the substrate S1 side, the pixel electrode PE is arranged for each pixel. The transistor T is formed in the insulating layer 10 and is connected to the pixel electrode through a contact portion. In addition to the transistor T, various wirings (for example, the data line and the scanning line) and elements (for example, the capacitor element) are disposed in the insulating layer 10, but are omitted in FIG. is there. On the substrate S2 side, the common electrode CE is arranged in common for a plurality of pixels. The pixel electrode PE and the transistor T may be formed on the substrate S2 side, and the common electrode CE may be formed on the substrate S1 side.

  The partition walls 30 are, for example, arranged in a grid pattern (see FIG. 5 described later), and partition each pixel. Sealing frames (20A, 20B) are arranged on the outer periphery of the pixel region composed of the plurality of pixels.

  Here, in the present embodiment, the sealing frame 20B (second sealing frame) is disposed on the outer periphery of the substrate S2, and the sealing frame 20A (first sealing frame) is disposed on the outer periphery of the substrate S1, The projections of the sealing frame 20A are fitted into the recesses of the sealing frame 20B so that the devices are sealed together.

  In FIG. 1 and FIG. 2, white particles are shown as electrophoretic particles. For example, when a voltage is applied between the pixel electrode PE and the common electrode CE, the electrophoretic particles are electrophoresed toward one of the electrodes according to the electric field generated therebetween. For example, when the white particles have a positive charge, if the pixel electrode PE is set to a negative potential, the white particles move to the pixel electrode PE side (lower side) and gather to display black. Conversely, when the pixel electrode PE is set to a positive potential, the white particles move to the common electrode CE side (upper side) and gather to display white. In this manner, desired information (image) is displayed according to the presence or absence or the number of white particles gathering on the display-side electrode. Here, although white particles are used as the electrophoretic particles, black or other colored particles may be used. As the particles, inorganic pigment-based particles, organic pigment-based particles, polymer fine particles, or the like can be used, and two or more kinds of various particles may be mixed and used. The particle diameter is, for example, about 0.05 to 10 μm, preferably about 0.2 to 2 μm. Moreover, the ratio with respect to a dispersion liquid is adjusted with about 5-90%, for example, Preferably, it adjusts with about 10-80%. Although there is no restriction | limiting in the dispersion medium which comprises a dispersion liquid, For example, aromatic hydrocarbons, hexane, cyclohexane, kerosene, isopar, aliphatic hydrocarbons, such as a paraffin hydrocarbon, halogenated hydrocarbons, phosphate ester , Phthalic acid esters, carboxylic acid esters, chlorinated paraffin, silicones and the like can be used. The ratio of the dispersion medium with respect to the dispersion liquid is adjusted to, for example, about 20 to 90%, preferably about 40 to 60%. In addition to the dispersion medium, for example, various additives such as a charge control agent composed of an electrolyte, a surfactant, a lubricant, and a stabilizer may be added to the dispersion. Various dyes may be dissolved.

  Below, the manufacturing process of the electrophoresis apparatus of this Embodiment is demonstrated, referring FIGS. 3-5. 3 to 5 are cross-sectional views or plan views showing the manufacturing process of the electrophoresis apparatus of the present embodiment. In the following cross-sectional views, the electrodes and transistors described in detail in FIG. 2 are omitted.

  As shown in FIGS. 3A and 3B, a substrate S1 on which the sealing frame 20A and the partition walls 30 are formed and a substrate S2 on which the sealing frame 20B is formed are prepared. As the material of the sealing frame 20A, a resin material having thermal expansibility, for example, PET (polyethylene terephthalate) is used. PET is suitable because thermal expansion occurs at about 80 ° C. In addition, acrylate, methacrylate, cyanoacrylate, epoxy, olefin, paraffin, vinyl acetate, urethane, ionomer, elastomer, silicone, fluorine, and other monomers, oligomers, and polymers can be used. . As the sealing frame 20B and the partition wall 30, the same material as the sealing frame 20A may be used, or other materials (for example, other resin resins) may be used. Although there is no restriction | limiting in the formation method of sealing frame 20A, 20B and the partition 30, It can form using the photolithographic method and the nanoimprint method. In addition to the nanoimprint method, it may be formed by a printing process such as a screen printing method, a relief printing method, or a gravure printing method.

  Here, as described above, the partition walls 30 are arranged so as to divide the display area in a grid pattern, and the sealing frame 20A is arranged in a substantially rectangular shape so as to surround the display area (see FIG. 5). Further, the sealing frame 20B is a substantially rectangular pattern that is substantially the same as the sealing frame 20A.

  Moreover, although there is no restriction | limiting in the material of board | substrates S1 and S2, you may use the flexible board | substrate which consists of a plastics or a metal other than a hard board | substrate like a glass substrate. In addition, a light-transmitting material is used for the display side.

  Next, as shown in FIG. 3C, a dispersion L of electrophoretic particles is injected between the partition walls 30 on the substrate S1. At this time, by using the surface tension of the dispersion liquid and injecting the dispersion liquid so as to rise from the partition wall 30, at the time of sealing between the substrates S <b> 1 and S <b> 2, which will be described later, mixing of air is reduced in each pixel. The accuracy can be displayed. Moreover, it is preferable that the height of the partition wall 30 is made to correspond to the height after bonding of sealing frames 20A and 20B described later, and is adjusted in advance to a height that is in close contact with the surface of the substrate S2.

  Next, as shown in FIG. 3D, the bonding surfaces (sealing surfaces) of the substrates S1 and S2 are made to face each other, and as shown in FIG. 4A, the sealing frame 20B is placed on the sealing frame 20A. Align and mount. At this time, since the convex portion of the sealing frame 20A is larger than the concave portion of the sealing frame 20B, the convex portion does not enter the concave portion. Here, the convex portion refers to a region that eventually enters the concave portion.

  Next, the jig 40 is mounted on the substrate S2 so as to match the pattern of the sealing frame 20B (see FIG. 5). For example, as shown in FIG. 5, this jig is made of a metal frame (heat conducting member) having substantially the same pattern as the sealing frame 20 </ b> B in plan view. The frame is heated by passing a current through the wiring. In addition, the heater may be brought into contact with the metal frame and heated by heat conduction from the heater. The entire surface of the substrate S2 may be heated, but depending on the material of the substrate S2, the sealing frames 20A and 20B may be misaligned due to thermal expansion of the substrate S2 itself. Therefore, it is preferable to use the heating jig shown in FIG. 5 that can heat a necessary region in a short time.

  At this time, as shown in FIG. 4B, the sealing frame 20B is thermally expanded, and the opening area of the concave portion is increased. Therefore, by pressing the substrates S1 and S2 while the sealing frame 20B is heated, the convex portion of the sealing frame 20A is inserted into the concave portion of the sealing frame 20B.

  Next, the jig 40 is removed and the substrate S2 side is cooled. Although there is no restriction | limiting in a cooling means, For example, it cools by applying cold wind to board | substrate S2. In addition, the jig shown in FIG. 5 is configured by stacking semiconductors of different conductivity types, and the sealing frame 20B is cooled by utilizing the Peltier effect (cooling effect) generated by flowing current between these semiconductors. May be. By this cooling, the sealing frame 20B contracts, and the concave portion of the sealing frame 20B and the convex portion of the sealing frame 20A are firmly joined (FIG. 4C).

  As described above, in this embodiment, the sealing frame is provided on the upper and lower substrates, and the sealing is performed by meshing the unevenness formed on these surfaces, so that the device is manufactured easily and accurately. be able to. In addition, by forming the recesses in advance, using the thermal expansion of the sealing frame, and inserting the projections in a state where the recesses are widened, the gaps between the sealing frames are engaged like a wedge so that a stronger seal ( Bonding). In other words, it can be “caulked”.

  In the present embodiment, there is no limitation on the balance of the heights (HA, HB) of the sealing frames 20A, 20B, but by setting the sealing frame 20B lower than the sealing frame 20A, The capacity can be reduced, and heat conduction can be performed quickly.

  In addition, it is possible to realize a process in consideration of the environment and safety by using a lower cost than using a laser for sealing and not using an adhesive.

<Embodiment 2>
In the first embodiment, the pixels 30 are separated by the partition walls 30. However, the partition wall 30 may be configured as the sealing frames 20A and 20B of the first embodiment.

  Hereinafter, the manufacturing process of the electrophoresis device of the present embodiment will be described with reference to FIGS. 6 and 7. 6 and 7 are cross-sectional views or plan views showing the manufacturing process of the electrophoresis apparatus of the present embodiment. Note that portions different from the first embodiment will be described in detail.

  As shown in FIG. 6A, a dispersion L of electrophoretic particles is injected between partition walls (partition / sealing frame) 30A on the substrate S1 so that the patterns of the partition walls 30A and 30B fit on the substrate S1. A substrate S2 is mounted. As the material of the partition wall 30A, a resin material having thermal expansibility, for example, the material described in the first embodiment such as PET can be used. Further, as the partition wall 30B, the same material as the partition wall 30A may be used, or another material (for example, other resin material) may be used. Further, the method for forming the partition walls 30A and 30B is not limited, and the partition walls 30A and 30B can be formed by the method described in the first embodiment.

  When injecting the dispersion liquid L of electrophoretic particles between the partition walls 30A on the substrate S1, by using the surface tension of the dispersion liquid and injecting a dispersion liquid that rises from the partition walls 30A, the substrate S1, which will be described later, At the time of sealing between S2, it is possible to reduce air contamination in each pixel and display with high accuracy. Further, by making the height of the partition wall 30A higher than that of the partition wall 30B, it is possible to increase the injection amount of the dispersion liquid, to reduce air mixing in each pixel, and to perform highly accurate display. Further, the air entrainment can be further reduced by sliding the upper substrate 2 along the liquid surface of the dispersion liquid L and superimposing it on the substrate S1. In addition, a lyophilic treatment for the dispersion L may be performed on the surface of the substrate S2 in advance.

  Next, as shown in FIG. 6B, the jig 40 is mounted on the substrate S2 so as to match the pattern of the partition walls 30B (see FIG. 6). For example, as shown in FIG. 6, the jig 40 is formed of a metal frame having substantially the same pattern as the partition wall 30 </ b> B in plan view. By heating with this jig 40, the partition wall 30B is thermally expanded, and the opening area of the concave portion is increased. Therefore, by pressing the substrates S1 and S2 while the partition wall 30B is heated, the projections of the partition wall 30A are inserted into the recesses of the partition wall 30B.

  Next, the jig 40 is removed, and the substrate S2 side is cooled in the same manner as in the first embodiment. By this cooling, the sealing frame 30B contracts, and the concave portion of the partition wall 30B and the convex portion of the partition wall 30A are firmly joined.

  As described above, also in this embodiment, the partition walls are respectively provided on the upper and lower substrates, and the unevenness formed on the surface is engaged to separate and seal between the pixels. It can be performed. Also, by forming the recesses small in advance, using the thermal expansion of the sealing frame, and inserting the projections with the recesses widened, the partition walls are engaged like a wedge so that a stronger bond can be achieved. it can.

  In the present embodiment, by setting the partition wall 30A higher than the partition wall 30B, it is possible to increase the injection amount of the dispersion liquid, to reduce air mixing in each pixel, and to perform display with high accuracy. Further, the capacity of the partition wall 30B can be reduced, and heat conduction can be performed quickly.

<Modification>
In the first and second embodiments, the cross-sectional shape of the concave portion is rectangular and the cross-sectional shape of the convex portion is trapezoidal, but the cross-sectional shape of the concave and convex portions is not limited, and various modifications are possible.

  8 and 9 are diagrams showing other shapes of the concave portion and the convex portion of the present embodiment. As shown in FIG. 8A, the cross-sectional shape of the concave portion and the cross-sectional shape of the convex portion may be formed so as to include at least a part of a circle (FIG. 8B). FIG. 8C is a partial perspective view of a concave portion and a convex portion. Further, as shown in FIGS. 9A, 9B, 9C, and 9D, the cross-sectional shape of the concave portion and the cross-sectional shape of the convex portion may be a shape including at least a part of a triangle. In this way, by making the uneven shape correspond to each other and further making the size of the convex portion (the width shown in FIG. 8C) larger than the size (width) of the opening portion of the concave portion, it becomes stronger. Joining can be achieved.

  In the first and second embodiments, each pixel is separated into a lattice shape (a plurality of rectangles). However, the planar shape of one pixel in a mesh shape is not limited to a rectangle, and various shapes such as a honeycomb shape, a round shape, and a triangular shape are available. Can be modified.

  As described above, the examples and application examples described through the above-described embodiment can be used in appropriate combination according to the application, or can be used with modification or improvement. The present invention is described in the description of the above-described embodiment. It is not limited.

<Electronic equipment>
The electrophoresis apparatus described in Embodiments 1 and 2 and the like can be incorporated into various electronic devices.

(Electronic paper)
For example, the electrophoresis apparatus can be applied to electronic paper. FIG. 10 is a perspective view illustrating an electronic paper which is an example of the electronic apparatus.

  An electronic paper 1000 illustrated in FIG. 10 includes a main body 1001 formed of a rewritable sheet having the same texture and flexibility as paper, and a display unit 1002. In such electronic paper 1000, the display unit 1002 is configured by the electrophoresis apparatus as described above.

(Other electronic devices)
Examples of the electronic apparatus having the various electro-optical devices include those shown in FIGS.

  FIG. 11 is a perspective view illustrating a mobile phone which is an example of an electronic apparatus. The cellular phone 1100 includes a display portion 1101 and the electrophoresis device can be incorporated in the display portion.

  FIG. 12 is a perspective view illustrating a portable information processing apparatus which is an example of an electronic apparatus. The portable information processing apparatus 1200 includes an input unit 1201 such as a keyboard, a main body unit 1202 in which a calculation unit, a storage unit, and the like are stored, and a display unit 1203. The electrophoretic device can be incorporated in the display portion.

  In addition, for example, a TV, viewfinder type, monitor direct-view type video tape recorder, car navigation device, pager, electronic notebook, calculator, electronic newspaper, word processor, personal computer, workstation, videophone, POS terminal, touch panel It can also be applied to other equipment. The electrophoretic device can be incorporated in the display portion of these various electronic devices.

  DESCRIPTION OF SYMBOLS 10 ... Insulating layer, 20A, 20B ... Sealing frame, 30 ... Partition, 30A, 30B ... Partition, 40 ... Jig, CE ... Common electrode, DL ... Data line, L ... Electrophoretic particle dispersion, P ... Pixel , PE: pixel electrode, S1, S2: substrate, SL: scanning line, T: transistor

Claims (10)

A first substrate on which a first sealing frame is formed and a second substrate on which a second sealing frame having a shape corresponding to the first sealing frame in a plan view is opposed to each other, and the first sealing An electrophoretic device manufacturing method in which a region partitioned by a frame and the second sealing frame is filled with a dispersion of electrophoretic particles,
A convex portion is formed on the surface of the first sealing frame, and a concave portion is formed on the surface of the second sealing frame,
A first step of injecting a dispersion of electrophoretic particles into the first sealing frame;
A second step of expanding the opening of the concave portion by heating the second sealing frame with a jig through the second substrate, and inserting the convex portion into the concave portion;
The manufacturing method of the electrophoresis apparatus which has.   The method for manufacturing an electrophoretic device according to claim 1, further comprising a third step of cooling the second sealing frame after the second step. The convex portion is disposed along the first sealing frame, and the concave portion is disposed along the second sealing frame;
The method for manufacturing an electrophoretic device according to claim 1, wherein a width of the convex portion is larger than a width of the opening portion of the concave portion. The first sealing frame is formed in a mesh shape so as to partition a plurality of unit pixels,
4. The method of manufacturing an electrophoretic device according to claim 1, wherein the electrophoretic particle dispersion is injected into a plurality of regions partitioned by the first sealing frame. 5. A partition that partitions a plurality of unit pixels is formed in the inner region of the first sealing frame,
The method for manufacturing an electrophoretic device according to claim 1, wherein the dispersion liquid of the electrophoretic particles is injected into a plurality of regions partitioned by the partition wall.   The method for manufacturing an electrophoresis apparatus according to claim 1, wherein the jig is formed of a heat conductive member having a shape corresponding to the first sealing frame in a plan view.   The method for manufacturing an electrophoretic device according to claim 1, wherein a height of the first sealing frame is larger than a height of the second sealing frame.   An electronic device manufacturing method comprising the method for manufacturing an electrophoretic device according to claim 1. A first substrate on which a first sealing frame is formed and a second substrate on which a second sealing frame having a shape corresponding to the first sealing frame in a plan view is opposed to each other, and the first sealing An electrophoretic device in which a region partitioned by a frame and the second sealing frame is filled with a dispersion of electrophoretic particles,
The first sealing frame and the second sealing frame are formed by fitting a convex portion formed on the surface of the first sealing frame into a concave portion formed on the surface of the second sealing frame. Electrophoresis device joining.   An electronic apparatus comprising the electrophoresis apparatus according to claim 9.

Images