JP2010230719A - Semiconductor device and image display device mounting the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent disconnection of wiring provided at a film substrate due to stress for a semiconductor device caused by the temperature rise in an image display device. <P>SOLUTION: The semiconductor device includes a semiconductor element 1 held on a film substrate 2, an output terminal part 5 provided at the film substrate 2, and wiring 8 provided at the film substrate 2 and connecting the semiconductor element 1 and the output terminal part 5. The wiring 8 has a wave line shape having the same circular arc size or different circular arc size. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a semiconductor device that drives an image of an image display device such as a liquid crystal display and a plasma display, and an image display device including the semiconductor device.

  In recent years, liquid crystal displays and plasma displays have become mainstream in image display devices because of high image quality. Image display devices such as liquid crystal displays and plasma displays are provided with semiconductor devices for image driving.

  FIG. 3 shows a conventional semiconductor device for image driving (see, for example, Patent Document 1). As shown in FIG. 3, in the semiconductor device 9 for image driving, the semiconductor element 1 is held on the film substrate 2, and the heat radiating plate 3 having the screw holes 7 is attached to the holding portion of the semiconductor element 1. . Although not shown, the semiconductor device 9 is provided with a heat transfer material such as grease between the semiconductor element 1 and the heat radiating plate 3, and has a mechanism for releasing heat generated by the power of the semiconductor element 1 to the heat radiating plate 3. ing. An output terminal portion 5 and an input terminal portion 6 are respectively provided at opposite ends of the film substrate 2, and the semiconductor element 1 and the output terminal portion 5 are connected by a plurality of wires 8. The film substrate 2 is provided with slits 4 that have long sides in the direction in which the wires 8 extend and do not cross the wires 8.

  FIG. 4 shows a state in which a conventional semiconductor device for image driving is mounted as a part of an image display device. As shown in FIG. 4, the chassis 10 is provided with a connector 12 and a circuit board 14. A panel 11 is provided on the surface opposite to the surface on which the connector 12 and the like of the chassis 10 are provided, and the semiconductor device 9 is provided so as to sandwich the chassis 10 and the panel 11. Here, the input terminal portion 6 shown in FIG. 3 is connected to the circuit board 14 by the connector 12, and the output terminal portion 5 is connected to the panel 11 by a conductive material such as an anisotropic conductive film (ACF). The semiconductor device 9 is fixed to the chassis 10 with screws 13 in the screw holes 7. The base material of the film substrate 2 is polyimide, and the material of the heat sink 3 is generally aluminum (Al).

The temperature of the image display device rises due to the application of power. Since there is a difference in thermal expansion coefficient between the panel 11 and the chassis 10, the positional relationship between the panel 11 and the chassis 10 is shifted due to a rise in the temperature of the image display device, and stress is applied to the semiconductor device 9 for image driving. . There is a problem that the wiring 8 provided on the film substrate 2 is disconnected due to the stress applied to the semiconductor device 9, and particularly in a large screen panel, the positional relationship is greatly shifted, and this problem becomes remarkable. Therefore, the conventional semiconductor device 9 shown in FIGS. 3 and 4 is provided with slits 4 in the film substrate 2 in order to relieve stress applied to the semiconductor device 9.
JP 2008-298828 A

  However, it is necessary to make the film substrate thin for further cost reduction. In such a case, even if a slit is provided in the film substrate, the wiring may be disconnected.

  The present invention has been made in view of the above-described conventional problems, and an object thereof is to prevent a wiring provided on a film substrate from being disconnected due to a stress applied to a semiconductor device due to a temperature increase of an image display device.

  In order to achieve the above object, according to the present invention, a semiconductor device has a structure in which a wiring provided on a film substrate has a wavy shape. Specifically, a semiconductor device according to the present invention includes a semiconductor element held on a film substrate, an output terminal portion provided on the film substrate, and a semiconductor device connected to the output terminal portion provided on the film substrate. And the wiring has a wavy line shape having the same or different arc dimensions.

  According to the semiconductor device of the present invention, since the wiring has a wavy line shape, the stress applied to the wiring can be relieved, so that a semiconductor device having excellent quality that does not cause disconnection of the wiring even when mounted on a large screen panel. Obtainable.

  Moreover, in the semiconductor device of the present invention, the film substrate has a slit provided along the direction in which the wiring extends between the semiconductor element and the output terminal portion, and at least the peripheral portion of the slit in the wiring is It may have a wavy line shape.

  In this case, it is preferable that the slit has a wavy shape that meanders in parallel with the wiring at the peripheral edge thereof.

  Further, in this case, it is preferable to further include a dummy wiring provided around the slit in the film substrate and having a closed shape.

  In the semiconductor device of the present invention, the radius of curvature of the wavy circular arc is preferably 100 μm or more.

  An image display device according to the present invention is characterized in that the semiconductor device of the present invention is mounted.

  According to the image display device of the present invention, since the wiring of the mounted semiconductor device has a wavy line shape, stress applied to the wiring can be relieved, so that an image display device with excellent quality that does not cause disconnection of the wiring is obtained. be able to.

  According to the semiconductor device and the image display device according to the present invention, since the wiring provided in the image driving semiconductor device has a wavy shape, the stress applied to the wiring can be relieved, so that the temperature of the image display device increases. The disconnection of the wiring provided in the film substrate caused by the stress with respect to the generated semiconductor device can be prevented.

  A semiconductor device and an image display device according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view of a semiconductor device for image driving according to the present invention. FIG. 1A is an overall view of an image driving semiconductor device, and FIGS. 1B and 1C each show an example of an enlarged view of a portion A in FIG.

  As shown in FIGS. 1A and 1B, a semiconductor device 9 for image driving has a semiconductor element 1 held on a film substrate 2, and a heat dissipation having a screw hole 7 in a holding portion of the semiconductor element 1. A plate 3 is affixed. Although not shown, the semiconductor device 9 is provided with a heat transfer material such as grease between the semiconductor element 1 and the heat radiating plate 3, and has a mechanism for releasing heat generated by the power of the semiconductor element 1 to the heat radiating plate 3. ing. An output terminal portion 5 and an input terminal portion 6 are respectively provided at opposite ends of the film substrate 2, and the semiconductor element 1 and the output terminal portion 5 are connected by a plurality of wires 8. The film substrate 2 is provided with slits 4 that have long sides in the direction in which the wires 8 extend and do not cross the wires 8. The present embodiment is characterized in that a portion between the semiconductor element 1 and the output terminal portion 5 on the film substrate 2 in each wiring 8 has a wavy line shape having the same arc size.

  As shown in FIG. 1C, it is preferable to further provide a dummy wiring 15 having a closed shape around the slit 4. Moreover, it is preferable that the slit 4 has a wavy shape that meanders in parallel with the wiring 8 having a wavy shape.

  FIG. 2 is a perspective view showing a state in which the image driving semiconductor device according to the present embodiment is mounted as a part of the image display device.

  As shown in FIG. 2, the chassis 10 is provided with a connector 12 and a circuit board 14. A panel 11 is provided on the surface opposite to the surface on which the connector 12 and the like of the chassis 10 are provided, and the semiconductor device 9 is provided so as to sandwich the chassis 10 and the panel 11. Here, the input terminal portion 6 shown in FIG. 1A is connected to the circuit board 14 by the connector 12, the output terminal portion 5 is connected to the panel 11, and the semiconductor device 9 is connected to the chassis 10 by the screw 13 in the screw hole 7. It is fixed.

  According to this embodiment, the semiconductor device 9 for image driving is mounted as a part of the image display device, and stress due to the difference in thermal expansion coefficient between the panel 11 and the chassis 10 is applied to the wiring 8 provided on the film substrate 2. However, since the wiring 8 has a wavy shape, stress applied to the wiring 8 can be relieved, so that disconnection can be prevented. Further, as shown in FIGS. 1A and 1B, when the slit 4 of the film substrate 2 is provided between the wirings between the semiconductor element 1 and the output terminal portion 5 as in the conventional technique, Since this stress can be further relaxed, the stress applied to the wiring 8 is also relaxed, which is effective.

  As shown in FIG. 1C, when the slit 4 has a wavy shape that meanders in parallel with the wavy wire 8, the stress applied to the slit 4 is relieved and the slit 4 is prevented from breaking, thereby preventing the film substrate 2 from being broken. This is desirable because it prevents breakage. In addition, when the dummy wiring 15 having a closed shape is provided around the slit 4, it is possible to prevent the slit 4 of the film substrate 2 from being broken by stress even when the film substrate 2 becomes extremely thin.

  In addition, in all the wavy shapes described above, it has been experimentally found that if the radius of curvature of the arc is 100 μm or more, it is sufficient as an effect of measures against disconnection, and the arc may be a perfect circle or an ellipse.

  It is not necessary that all the arc shapes between the semiconductor element 1 and the output terminal 5 have the same size, and the wiring 8 provided on the film substrate 2 is a block having a different arc size for each part as necessary. The blocks may be arranged so as to have the same arc size.

  Although FIG. 1A shows a structure including the heat sink 3, the present invention is also applied to the case where the power applied to the semiconductor element 1 is reduced and the heat sink 3 becomes unnecessary due to future technological progress. Is valid. In this case, since the stress due to the difference in thermal expansion coefficient between the chassis 10 and the panel 11 is not blocked by the heat radiating plate 3 and extends between the semiconductor element 1 and the input terminal portion 6, the wavy line shape is the semiconductor element 1. It is desirable that the present invention be applied not only to the wiring 8 between the semiconductor device 1 and the output terminal portion 5 but also to the wiring 8 between the semiconductor element 1 and the input terminal portion 6.

  Here, in FIG. 2, the input terminal portion 6 of the image driving semiconductor device 9 is connected to the circuit board 14 by the connector 12. However, the connection method may be connection using an anisotropic conductive film (ACF), but is not limited thereto. In FIG. 2, the semiconductor device 9 is fixed to the chassis 10 with the screw 13, but the fixing method is not limited to this.

  The semiconductor device and the image display device according to the present invention can relieve stress on the wiring provided in the semiconductor device for image driving resulting from the difference in thermal expansion coefficient between the panel and the chassis, and prevent disconnection of the wiring. It is useful for liquid crystal displays and plasma displays.

(A) is a top view which shows the semiconductor device for an image drive which concerns on one Embodiment of this invention. (B) And (c) is an enlarged view of the A section of Fig.1 (a). 1 is a perspective view illustrating a state in which an image driving semiconductor device according to an embodiment of the present invention is mounted on an image display device. It is a top view which shows the conventional semiconductor device for an image drive. It is a perspective view which shows the state by which the conventional semiconductor device for image drive was mounted in the image display apparatus.

DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Film board 3 Heat sink 4 Slit 5 Output terminal part 6 Input terminal part 7 Screw hole 8 Wiring 9 Semiconductor device 10 Chassis 11 Panel 12 Connector 13 Screw 14 Circuit board 15 Dummy wiring

Claims (6)

A semiconductor element held on a film substrate;
An output terminal provided on the film substrate;
Provided on the film substrate, comprising wiring for connecting the semiconductor element and the output terminal portion,
The semiconductor device according to claim 1, wherein the wiring has a wavy line shape having the same or different arc dimensions. The film substrate has a slit provided along the direction in which the wiring extends between the semiconductor element and the output terminal portion,
The semiconductor device according to claim 1, wherein at least a peripheral portion of the slit in the wiring has the wavy shape.   The semiconductor device according to claim 2, wherein the slit has a wavy shape that meanders in parallel with the wiring at a peripheral portion thereof.   The semiconductor device according to claim 2, further comprising a dummy wiring provided around the slit in the film substrate and having a closed shape.   5. The semiconductor device according to claim 1, wherein a radius of curvature of the wavy-line arc is 100 μm or more.   An image display device, wherein the semiconductor device according to claim 1 is mounted.

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