JP2010225698A - Pattern forming method, extreme ultraviolet exposure mask, method of manufacturing extreme ultraviolet exposure mask, and method of correcting extreme ultraviolet exposure mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern forming method for forming a pattern which decreases reflectivity of EUV light with a less dose amount. <P>SOLUTION: The pattern forming method includes: a film forming process for forming a high-absorption film 14, which has high absorption coefficient of an extreme ultraviolet ray and lowers an etching speed when mixed with an outermost layer of a multilayer reflection film 12, on the multilayer reflection film 12 on a substrate 10 having the multilayer reflection film 12 which can reflect the extreme ultraviolet ray; a mixing process for generating a second mixing layer 32 and a first mixing layer 31, in which the outermost layer and the high-absorption film 14 are mixed, between at least the outermost layer and high absorption film 14 by irradiating ion beams 20 on the high absorption film 14, and an etching process for removing a component of the high absorption film 14 except for the second mixing layer 32 by etching after the mixing process, and exposing the outermost layer of the multilayer reflection film 12 and the second mixing layer 32. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a mask used as a pattern original when a semiconductor device or the like is manufactured by a lithography technique, and a method for forming the pattern. More specifically, the present invention relates to a mask used with an exposure apparatus that performs pattern transfer using light having a wavelength in the extreme ultraviolet region as a light source, and a pattern forming method thereof.

  Semiconductor integrated circuits are being miniaturized and highly integrated in order to improve performance and productivity, and also with regard to lithography technology for forming circuit patterns, technological development for forming finer patterns with high precision Is underway. The light source of the exposure apparatus is also shortened in wavelength, and an apparatus and a process using extreme ultraviolet light (EUV (Extreme Ultraviolet) light, hereinafter simply referred to as “EUV light”) having a wavelength of 13.5 nm have been developed. .

  In the wavelength region of EUV light, the refractive index of all substances is close to 1, and the absorption coefficient is large. For this reason, a reflection optical system using a multilayer film in which two kinds of materials having a relatively large difference in refractive index are alternately laminated is used instead of an optical system using a conventional lens. As for the mask used for exposure, unlike a conventional photomask in which a light-shielding pattern is formed on a synthetic quartz substrate, it is necessary to form a multilayer mirror on the substrate and to form a pattern that selectively reduces the reflectance. .

  As a method of forming a pattern in which the reflectance of EUV light is selectively reduced in a part of the multilayer mirror, for example, a method of forming a pattern that absorbs EUV light on the multilayer film, or patterning the multilayer mirror itself A processing method, a method of partially modifying the structure of a multilayer film, and the like have been proposed.

  A method of forming a pattern that absorbs EUV light on a multilayer film is disclosed in, for example, Patent Document 1. As the material of the absorption pattern, a material having a large absorption coefficient for EUV light, such as tantalum, is used. In addition, an intermediate layer (hereinafter referred to as an intermediate layer) is formed between the absorption pattern and the multilayer mirror for the purpose of preventing damage to the multilayer film when etching the absorption pattern or correcting defects generated in the absorption pattern. , Also referred to as a buffer layer).

  In order to project and expose such a pattern on a semiconductor wafer, light irradiated from a light source toward the multilayer mirror on the substrate and reflected by the multilayer mirror is guided onto the semiconductor wafer. Therefore, the exposure light is not incident on the mask perpendicularly as in the prior art, but the light is incident from an oblique direction typically about 6 degrees with respect to the normal direction of the substrate.

  When light is incident from an oblique direction as described above, when the absorption pattern is formed on the multilayer film, the absorption pattern is shaded, and this influence tends to increase as the absorption pattern becomes thicker. In the case where the multilayer film itself is directly patterned, the thickness of the entire multilayer film is much thicker than the absorption pattern, so it is necessary to consider the influence of the light incident direction and shadow.

  On the other hand, a method is known in which the reflectance is lowered by selectively altering a part of the multilayer film. In this case, the step of the pattern portion for reducing the reflectance of the exposure light can be reduced as compared with the above method. For example, as disclosed in Patent Documents 1 to 3, the reflectance is reduced by causing mixing between two layers constituting the multilayer film by selectively irradiating an electron beam or an ion beam. Is possible. For example, when a multilayer film in which molybdenum and silicon are alternately laminated is irradiated with an electron beam to cause mixing, the volume is reduced by becoming molybdenum silicide. For this reason, although it becomes a partially dented form, this level | step difference is smaller than the thickness of the above-mentioned absorption pattern generally used.

JP-A-7-333829 Japanese Examined Patent Publication No. 6-66251 US Pat. No. 6,707,123 US Pat. No. 6,756,158

  As described above, a pattern having a small step on the surface can be formed by utilizing the decrease in reflectance due to mixing in the multilayer film. However, in order to sufficiently change the structure of the multilayer film by collision of ions accelerated by ion beam irradiation, it is necessary to have a high dose amount (the ion beam irradiation amount per unit area or unit volume, the same applies hereinafter). When a pattern is formed by scanning a focused ion beam, there is a problem that it takes a very long time to form a pattern as compared with a method of performing an etching process after forming a resist pattern by electron beam lithography.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a pattern forming method capable of forming a pattern in which the reflectance of EUV light is reduced with a small dose.
Another object of the present invention is to provide an extreme ultraviolet exposure mask capable of producing in a short time an extreme ultraviolet exposure mask having a high EUV light reflectance contrast and an EUV light reflected light contrast having a high contrast. It is to provide a method for manufacturing a mask for an automobile.
Still another object of the present invention is to provide a method for correcting an extreme ultraviolet exposure mask, which can stably produce an extreme ultraviolet exposure mask having a high EUV light reflectance contrast.

  In the pattern forming method of the present invention, the absorption coefficient of the extreme ultraviolet light is higher than the absorption coefficient of the multilayer reflective film on the surface of the multilayer reflective film in the substrate having the multilayer reflective film capable of reflecting extreme ultraviolet light. And a film forming step of forming a high absorption film whose etching rate is reduced by being mixed with the outermost surface layer of the multilayer reflection film; and irradiating the high absorption film with an ion beam, A first mixed layer in which the respective layers inside are mixed, and a second mixed layer in which the outermost surface layer and the superabsorbent film are mixed between the outermost surface layer and the superabsorbent film A mixing step for forming a layer, and an etching process for exposing the outermost surface layer of the multilayer reflective film and the mixed layer by removing components of the high absorption film except the mixed layer by etching following the mixing step It is characterized in that it comprises, when.

That is, according to the present invention, a mixed layer is formed by laminating a material having a high absorption coefficient with respect to EUV light on the multilayer film and having a lower etching rate by mixing with the outermost surface layer of the multilayer film and irradiating the selected position with an ion beam. After the step is formed, there is a step of exposing the surface of the multilayer reflective film in the ion beam non-irradiated region by an etching process.
According to the present invention, by performing the etching process subsequent to the ion beam irradiation step, the multilayer reflective film in the ion beam non-irradiated region is exposed in a state where the EUV light can be reflected. On the other hand, at the ion beam irradiation position, the multilayer reflective film is exposed in a state where the reflectance of EUV light is lowered. Therefore, it is possible to selectively form a desired drawing pattern having a different EUV light reflectance on the surface of the multilayer reflective film by irradiation with an ion beam.

In the pattern forming method of the present invention, in the mixing step, the high absorption film is scanned with a focused ion beam according to a predetermined pattern, and the mixed layer forming the predetermined pattern is formed by the scanning process. It is preferable to do.
According to the present invention, since the focused ion beam is employed and the ion beam is focused, the high absorption film can be directly irradiated with the ion beam for forming the mixed layer.

  Moreover, the pattern formation method of this invention can be equipped with the patterning process of forming the pattern film which has a predetermined pattern on the surface of the said high absorption film between the said film-forming process and the said mixing process.

That is, according to the present invention, a layer having a high absorption coefficient for EUV light and having a lower etching rate due to mixing with the outermost surface layer of the multilayer reflective film is laminated on the multilayer reflective film, and a predetermined pattern is formed on the layer. After the pattern is formed, the ion beam is irradiated.
According to the present invention, a part of the ion beam is blocked by the pattern film having a predetermined pattern shape, so that the multilayer reflective film is irradiated with the ion beam in the same shape as the predetermined pattern. In this case, the pattern forming method of the present invention can be suitably applied to a general pattern forming process.

In the pattern forming method of the present invention, it is preferable that the outermost surface layer contains silicon as a main component.
In the pattern forming method of the present invention, it is preferable that the high absorption film has chromium as a main component.

The extreme ultraviolet exposure mask of the present invention is an extreme ultraviolet exposure mask manufactured by the pattern forming method of the present invention, wherein the multilayer reflective film can reflect extreme ultraviolet light, and the mixed layer is the extreme ultraviolet. It is characterized by being able to absorb light.
According to this invention, since the reflectance of EUV light is different between the multilayer reflective film and the mixed layer, the pattern shape can be projected onto the object based on the brightness of the EUV light.

The method for manufacturing an extreme ultraviolet exposure mask according to the present invention includes an extreme ultraviolet exposure mask using a mask blank in which a buffer layer for pattern correction and an absorption layer for forming a transfer pattern are sequentially laminated on a multilayer reflective film. In this manufacturing method, the outermost surface layer of the multilayer reflective film and the buffer layer are mixed by irradiating an ion beam to an area where the buffer layer is exposed to the outside around the transfer pattern, and the multilayer reflection is performed. A peripheral mixing step for producing a mixed layer having a reflectance lower than that of extreme ultraviolet light at the outermost surface layer of the film, and an etching step for removing the buffer layer by etching while leaving the mixed layer. It is characterized by.
According to this invention, the mixed layer is formed around the transfer pattern. For this reason, when the transfer pattern is projected onto the object based on the transfer pattern, multiple exposure around the transfer pattern can be suppressed.

The extreme ultraviolet exposure mask of the present invention is an extreme ultraviolet formed by using a mask blank formed by sequentially laminating a pattern correction buffer layer and an absorption layer for forming a predetermined transfer pattern on a multilayer reflective film. An exposure mask, wherein the outermost surface layer of the multilayer reflective film and the buffer layer are mixed around the transfer pattern, and is lower than the reflectance of extreme ultraviolet light in the outermost surface layer of the multilayer reflective film A mixed layer having a reflectance is formed.
According to this invention, the mixed layer is formed around the transfer pattern. For this reason, when the transfer pattern is projected onto the object based on the transfer pattern, multiple exposure around the transfer pattern can be suppressed.

The method for correcting a mask for extreme ultraviolet exposure according to the present invention includes an extreme ultraviolet exposure using a mask blank in which a buffer layer for pattern correction and an absorption layer for forming a predetermined transfer pattern are sequentially laminated on a multilayer reflective film. A mask correction method, wherein the absorbing layer forming the transfer pattern is missing and the missing portion where the buffer layer is exposed is irradiated with an ion beam, and the outermost surface layer of the multilayer reflective film, the buffer layer, A mixing process that produces a mixed layer having a reflectance lower than that of extreme ultraviolet light in the outermost surface layer of the multilayer reflective film, and the buffer layer exposed to the outside is mixed with the mixed layer. An etching process for removing the etching layer leaving the absorbing layer forming the transfer pattern and exposing an outermost surface layer of the multilayer reflective film. .
According to the present invention, when it is determined that the transfer pattern is missing after the formation of the transfer pattern in the manufacturing process of the extreme ultraviolet exposure mask, a mixed layer is formed in the missing part to increase the reflectance of the EUV light. Can be reduced. Therefore, the missing of the absorption layer can be corrected by forming the mixed layer.

According to the pattern forming method of the present invention, absorption by the mixed layer formed on the surface can be used in combination even when mixing in the multilayer reflective film is insufficient and the reflectivity with respect to EUV light remains somewhat. Therefore, a sufficient pattern contrast can be obtained with an ion beam having a dose amount lower than the dose amount required for complete mixing in the multilayer film.
Further, according to the extreme ultraviolet exposure mask and the extreme ultraviolet exposure mask manufacturing method of the present invention, a sufficient pattern contrast can be obtained with an ion beam having a low dose as described above. The mask for extreme ultraviolet exposure which can be shortened and has sufficient pattern contrast can be manufactured in a short time.
Further, according to the method for correcting an extreme ultraviolet exposure mask of the present invention, the missing of the absorption layer can be corrected by the mixed layer, and therefore an extreme ultraviolet exposure mask having a high contrast of the EUV light reflectance can be stably manufactured.

It is sectional drawing which shows the structure of the mask for extreme ultraviolet exposure of 1st Embodiment of this invention. It is a flowchart which shows the manufacturing method and pattern formation method of the mask for extreme ultraviolet exposures of the embodiment. It is sectional drawing which shows one process of manufacture of the mask for the same extreme ultraviolet exposure. It is sectional drawing which shows one process of manufacture of the mask for the same extreme ultraviolet exposure. (A) And (B) is sectional drawing which shows one process of manufacture of the mask for the same extreme ultraviolet exposure. It is sectional drawing which shows one process of manufacture of the mask for the same extreme ultraviolet exposure. It is a flowchart which shows the manufacturing method and pattern formation method of the mask for extreme ultraviolet exposure of 2nd Embodiment of this invention. It is sectional drawing which shows one process of manufacture of the mask for extreme ultraviolet exposure in the embodiment. (A) And (B) is sectional drawing which shows one process of manufacture of the mask for extreme ultraviolet exposure in the embodiment. (A) And (B) is sectional drawing which shows one process of manufacture of the mask for extreme ultraviolet exposure in the embodiment. It is sectional drawing which shows the process of the mask for extreme ultraviolet exposure in the embodiment, and the structure of the mask for extreme ultraviolet exposure in the embodiment. It is a flowchart which shows the correction method and pattern formation method of the mask for extreme ultraviolet exposure of 3rd Embodiment of this invention. It is sectional drawing which shows one process of manufacture of the mask for extreme ultraviolet exposure in the embodiment. (A) And (B) is sectional drawing which shows one process of manufacture of the mask for extreme ultraviolet exposure in the embodiment. It is sectional drawing which shows the process of the mask for extreme ultraviolet exposure in the embodiment, and the structure of the mask for extreme ultraviolet exposure in the embodiment. It is a flowchart which shows the manufacturing method of the mask for extreme ultraviolet exposure of 4th Embodiment of this invention. (A) thru | or (C) is sectional drawing which shows one process of manufacture of the mask for extreme ultraviolet exposure in the embodiment. It is sectional drawing which shows the 1 process of the manufacture of the mask for extreme ultraviolet exposure in the same embodiment, and the structure of the mask for extreme ultraviolet exposure.

(First embodiment)
Hereinafter, an extreme ultraviolet exposure mask, a pattern forming method, and an extreme ultraviolet exposure mask manufacturing method according to a first embodiment of the present invention will be described with reference to FIGS.

(Configuration of extreme ultraviolet exposure mask)
FIG. 1 is a cross-sectional view showing the configuration of the extreme ultraviolet exposure mask of this embodiment. As shown in FIG. 1, an extreme ultraviolet exposure mask 1 (hereinafter referred to as “mask 1”) includes a substrate 10 and a multilayer reflective film 12 formed on the surface of the substrate 10. At least a part of the multilayer reflective film 12 is formed so as to overlap the first mixed layer 31 in which the layers of the multilayer reflective film 12 are mixed and the first mixed layer 31 in the thickness direction of the multilayer reflective film 12. The second mixed layer 32 is configured.

  The substrate 10 is preferably made of a material having a small coefficient of thermal expansion, and the substrate 10 of this embodiment is a glass substrate containing, for example, titanium oxide. In addition, the substrate 10 and the multilayer reflective film 12 are preferably configured to be flat, and the first surface 10a of the substrate 10 is polished to be smooth.

  The multilayer reflective film 12 is a reflective film configured to reflect EUV light. The multilayer reflective film 12 of the present embodiment is configured by alternately laminating first layers 12a and second layers 12b. The first layer 12a contains molybdenum. The second layer 12b contains silicon. In the present embodiment, the thicknesses of the first layer and the second layer are 2.8 nm and 4.2 nm, respectively. The multilayer reflective film 12 is configured such that the number of stacked layers of the first layer 12a and the second layer 12b is 40 pairs. In addition, the thickness and the number of laminated layers of the first layer 12a and the second layer 12b described above exemplify typical values, and the configuration of the multilayer reflective film 12 of the present embodiment is not limited to this. .

The multilayer reflective film 12 is configured to be thermally unstable in a high temperature environment, and when heated to a predetermined temperature or higher, an Si compound (at the interface between the first layer 12a and the second layer 12b). In this embodiment, molybdenum silicide) is generated and the clear interface disappears.
The first mixed layer 31 is a portion configured to generate the above-described Si compound in the multilayer reflective film 12. The first mixed layer 31 is configured such that there is no clear interface between the first layer 12a and the second layer 12b, and the first layer 12a and the second layer 12b are mixed. In the present embodiment, the first mixed layer 31 does not need to be completely mixed with the first layer 12a and the second layer 12b, and a part of the interface between the first layer 12a and the second layer 12b remains. It does not matter.

  The second mixed layer 32 is configured to be exposed on the outermost surface of the multilayer reflective film 12, has a high EUV light absorption coefficient, and has an etching rate when mixed with the outermost surface layer of the multilayer reflective film 12. Contains decreasing components. In the present embodiment, the second mixed layer 32 contains chromium (Cr). Further, since the second mixed layer 32 is mixed with the first layer 12a of the multilayer reflective film 12, a clear interface disappears in the same manner as the first mixed layer 31 described above. In the portion where the interface disappears in the second mixed layer 32, chromium silicide is generated.

Note that components other than chromium can be used as a component that has a high EUV light absorption coefficient and that decreases the etching rate when mixed with the outermost surface layer of the multilayer reflective film 12. For example, iron (Fe), cobalt (Co), nickel (Ni), titanium (Ti), or tungsten (W).
The first mixed layer 31 and the second mixed layer 32 constitute a mixed layer 30.

Below, the effect | action of the mask 1 is demonstrated.
As shown in FIG. 1, when EUV light L1 is incident on the multilayer reflective film 12, for example, the mask 1 reflects the EUV light L1 at each layer in the multilayer reflective film 12. On the other hand, when the EUV light L 2 is incident on the mixed layer 30, the EUV light L 2 is absorbed in the second mixed layer 32. Further, the EUV light L2 that has passed through the second mixed layer 32 and reached the first mixed layer 31 cannot be reflected because the interface between the first layer 12a and the second layer 12b disappears in the first mixed layer 31. Yes, it is absorbed as it passes through the glass substrate 10 side. As a result, in the region where the mixed layer 30 is formed on the surface of the multilayer reflective film 12, the reflectance of the EUV light L2 is reduced.

  As described above, since the mixed layer 30 is disposed in a part of the multilayer reflective film 12, the reflected light of the EUV light L1 and L2 has a contrast, and a pattern corresponding to the shape of the mixed layer 30 is formed based on this contrast. Can be exposed.

(Manufacturing method and pattern forming method of extreme ultraviolet exposure mask)
Below, the manufacturing method of the mask 1 is explained in full detail. The pattern forming method of this embodiment will also be described in detail.

  FIG. 2 is a flowchart showing a method for manufacturing an extreme ultraviolet exposure mask according to this embodiment. 3 to 6 are cross-sectional views showing one process of manufacturing in the manufacturing method of the extreme ultraviolet exposure mask of this embodiment.

  FIG. 3 shows a process of manufacturing the mask 1 in the multilayer reflective film forming step S10 shown in FIG. In the multilayer reflective film forming step S10, as shown in FIG. 3A, at least one surface (for example, the first surface 10a) of the plate-like substrate 10 is formed smoothly. Subsequently, as shown in FIG. 3B, molybdenum and silicon are alternately formed on the surface of the first surface 10a, and the multilayer reflective film 12 is laminated. At this time, the outermost surface layer of the multilayer reflective film is the second layer 12b mainly composed of silicon.

  In addition, about the reflective film mirror which has the board | substrate 10 and multilayer reflective film 12 which were formed in multilayer reflective film formation process S10, the generally available Mo / Si multilayer film reflective mirror can also be selected and employ | adopted. .

  As shown in FIG. 2, following the multilayer reflective film forming step S <b> 10, a pattern forming step S <b> 20 for forming a predetermined pattern by the mixed layer 30 on the multilayer reflective film 12 is performed. The predetermined pattern is, for example, a circuit pattern for exposing a desired circuit shape on a semiconductor substrate by adding contrast of reflected light when reflecting the EUV light L1 and L2 using the mask 1.

  FIG. 4 shows a process of manufacturing the mask 1 in the film forming step S21 in the pattern forming step S20 shown in FIG. As shown in FIG. 4, in the film forming step S21, the superabsorbent film 14 mainly composed of chromium is formed on the surface of the multilayer reflective film 12 to a thickness of, for example, 20 nm. In this case, when a pure chromium film is formed by a sputtering method, crystal grains are likely to grow. Therefore, it is preferable to add nitrogen or the like as typically used in a photomask.

Subsequently, as shown in FIG. 2, a mixing step S <b> 22 is performed in which the high absorption film 14 is irradiated with the ion beam 20 to generate the mixed layer 30. 5A and 5B show a process of manufacturing the mask 1 in the mixing step S22. As shown in FIG. 5A, in the mixing step S22, the focused ion beam 20 is irradiated toward the high absorption film. As the ion beam 20, a liquid metal ion source such as gallium (Ga) can be used. Further, the acceleration voltage of the focused ion beam 20 may be about 30 kV to 100 kV. The irradiation dose of the focused ion beam 20 varies depending on the ion source to be used, the acceleration voltage, and the desired reflectance, but is preferably about 10 ⁸ to 10 ¹⁴ ions / cm ² .

As shown in FIG. 5B, after the focused ion beam 20 is irradiated, the predetermined pattern as described above is drawn. The predetermined pattern is formed by the first mixed layer 31 and the second mixed layer 32 corresponding to the position where the focused ion beam 20 is irradiated. The interface between the second mixed layer 32 and the superabsorbent film 14 is unclear, but the unclear interface is formed by the silicon constituting the second layer 12b, which is the outermost surface layer of the multilayer reflective film 12, being a superabsorbent film. 14 is located at the inside of the superabsorbent film 14 by the distance that diffuses into it.
On the other hand, in the first mixed layer 31, the first layer 12a and the second layer 12b of the multilayer reflective film 12 are mixed, and the interface is unclear.

  In the mixing step S22, it is not essential to completely mix the first layer 12a and the second layer 12b in the first mixed layer 31. That is, the irradiation dose of the focused ion beam 20 described above may not be so high that the first layer 12a and the second layer 12b are completely mixed. Similarly, the irradiation time of the focused ion beam 20 may be shorter than the time for completely mixing the first layer 12a and the second layer 12b.

Subsequently, as shown in FIG. 2, an etching step S23 for removing the high absorption film 14 by etching is performed. FIG. 6 shows a process of manufacturing the mask 1 in the etching step S23. As shown in FIG. 6, the high absorption film 14 is processed and removed by dry etching using plasma containing a gas containing chlorine and oxygen, and the portion of the multilayer reflective film 12 that is not irradiated with the focused ion beam 20 is exposed to the surface. . In the portion irradiated with the focused ion beam 20, mixing occurs at the interface between the high absorption film 14 and the multilayer reflective film 12 and inside the multilayer reflective film 12 as described above. Further, the second mixed layer 32 containing chromium silicide is laminated on the first mixed layer 31 whose structure has been altered.
In the mixed layer 30, the reflectance of the EUV light is reduced as described above. Thereby, the multilayer reflective film 12 and the mixed layer 30 form a pattern in which the reflectivity with respect to the EUV light is selectively lowered according to the pattern drawn by the scanning of the focused ion beam 20.

  As described above, according to the extreme ultraviolet exposure mask 1, the extreme ultraviolet exposure mask manufacturing method, and the pattern forming method of the present embodiment, the first layer 12 a and the second layer 12 b in the multilayer reflective film 12. In addition to the mixing, the multilayer reflection film 12 and the high absorption film 14 are mixed. That is, a plurality of elements of the first mixed layer 31 and the second mixed layer 32 are provided as a configuration for reducing the reflectance of the EUV light. For this reason, for example, even when mixing inside the multilayer reflective film 12 is insufficient and the reflectance of the EUV light in the first mixed layer 31 remains somewhat, it is formed on the surface of the first mixed layer 31. Further, the absorption of EUV light in the second mixed layer 32 can be used in combination. For this reason, the dose of the ion beam for generating the mixed layer is suppressed lower than before, and a sufficient pattern contrast is obtained.

  Further, since the reflectance is lowered by the first mixed layer 31, a sufficient pattern contrast can be obtained even if the thickness of the second mixed layer 32 is thinner than the absorbing layer as disclosed in Patent Document 1, for example. . For this reason, the height by which the second mixed layer 32 protrudes from the outermost surface of the multilayer reflective film 12 in the thickness direction of the multilayer reflective film 12 can be kept low. Therefore, the EUV light incident at an angle with respect to the multilayer reflective film 12 is suppressed from being blocked by the second mixed layer 32. As a result, exposure light (EUV light) can be reflected more faithfully with respect to a predetermined pattern.

  In the mixing step S22, the focused ion beam 20 is irradiated to form the mixed layer 30, and then the etching step S23 is performed to expose the mixed layer 30. Therefore, the multilayer reflective film 12 in the region where the focused ion beam 20 is not irradiated is exposed in a state in which EUV light can be reflected, while the multilayer reflective film 12 at the ion beam irradiation position has the EUV light reflectivity by the mixed layer 30. Exposed in a lowered state. Therefore, it is possible to selectively form a desired drawing pattern having a different EUV light reflectance on the surface of the multilayer reflective film by irradiation with an ion beam.

  Further, since the focused ion beam is used as the ion beam, the pattern of the mixed layer 30 can be formed only by irradiating the ion beam so as to scan the surface of the high absorption film 14. For this reason, a material for forming a predetermined pattern such as a circuit shape can be reduced, and an extreme ultraviolet exposure mask can be efficiently manufactured.

(Second Embodiment)
Next, an extreme ultraviolet exposure mask, an extreme ultraviolet exposure mask manufacturing method, and a pattern forming method according to a second embodiment of the present invention will be described with reference to FIGS. In each embodiment described below, portions having the same configuration as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  In this embodiment, the configuration of the manufactured extreme ultraviolet exposure mask is substantially the same as the mask 1 of the first embodiment described above. However, the manufacturing method and the pattern forming method are different from those of the first embodiment. In the present embodiment, after the superabsorbent film 14 is laminated, the pattern film 16 containing a material having a high ability to block the ion beam is further laminated on the superabsorbent film 14 and masking having a predetermined pattern is performed. The entire surface is irradiated with the ion beam 20.

FIG. 7 is a flowchart showing a method for manufacturing an extreme ultraviolet exposure mask and a pattern forming method according to this embodiment. 8 to 11 are cross-sectional views showing a process of manufacturing the extreme ultraviolet exposure mask of this embodiment.
As shown in FIG. 7, in the present embodiment, a pattern forming step S120 is provided instead of the pattern forming step S20. The pattern forming step S120 includes a patterning step S122, a mixing step S123, and an etching step S124 after the film forming step similar to that of the first embodiment.

  FIG. 8 is a cross-sectional view showing a process of manufacturing the extreme ultraviolet exposure mask of the present embodiment, and shows a state after the film formation step S21 shown in FIG. 7 is completed. The steps up to the film forming step S21 can be performed as in the first embodiment.

  9A and 9B are cross-sectional views showing a process of manufacturing an extreme ultraviolet exposure mask in the patterning step S122. As shown in FIG. 9A, in the patterning step S122, a pattern film 16 containing tantalum as a main component is formed on the surface of the high absorption film. Since the pattern film 16 is used as an ion beam masking pattern, it is advantageous to have a large film thickness. However, if the film thickness is too large, it becomes difficult to form the pattern with high accuracy. In the present embodiment, the film thickness of the pattern film 16 is 70 nm, for example. The film thickness of the pattern film 16 is selected according to the type of ion beam, acceleration voltage, and dose used in the mixing step S123 described later.

  Next, as shown in FIG. 9B, a resist pattern having a predetermined pattern shape is formed using an electron beam lithography technique or the like to form a pattern film 16 in a predetermined pattern shape. In the case where a predetermined pattern is formed by etching using a resist as a mask, it is assumed that the necessary pattern is finally reversed in black and white. Although not shown in the figure, when a pattern is similarly formed by the lift-off method, a similar result can be obtained by finally forming a necessary pattern with a resist.

  Subsequently, a mixing step S123 is performed as shown in FIG. FIGS. 10A and 10B show a process of manufacturing an extreme ultraviolet exposure mask in the mixing step S123.

  As shown in FIG. 10A, in the mixing step S123, the entire surface is irradiated with the ion beam 20 from the pattern film 16 on which the predetermined pattern is formed. The irradiation amount of the ion beam 20 may be the same as that in the first embodiment. The ion beam 20 is absorbed by the pattern film 16, but can reach the high absorption film 14 and the multilayer reflective film 12 in the through-hole portion in the thickness direction formed in the pattern film 16 in the patterning step S <b> 122.

  As shown in FIG. 10B, the ion beam 20 irradiated through the through-hole formed in the pattern film 16 causes a gap between the multilayer reflective film 12 and the high absorption film 14 as in the first embodiment. The second mixed layer 32 is formed. At the same time, the first layer 12 a and the second layer 12 b of the multilayer reflective film 12 are mixed to produce the first mixed layer 31. Thus, a pattern of the mixed layer 30 having a predetermined pattern shape is formed as in the first embodiment.

  Subsequently, an etching step S124 is performed as shown in FIG. FIG. 11 shows a process of manufacturing an extreme ultraviolet exposure mask in the etching step S124. As shown in FIG. 11, the pattern film 16 is removed by etching, and then the high absorption film 14 is removed by etching. The outermost surface of the multilayer reflective film 12 is exposed in the area masked by the pattern film 16. On the other hand, the second mixed layer 32 containing chromium and silicon remains in the region of the surface of the multilayer reflective film 12 corresponding to the through-hole formed in the pattern film 16. In addition, a first mixed layer 31 in which silicon and molybdenum are mixed is generated inside the multilayer reflective film 12. As described above, the extreme ultraviolet exposure mask 100 in which the pattern in which the reflectance with respect to the EUV light is selectively reduced is formed by the mixed layer 30 including the first mixed layer 31 and the second mixed layer 32 is manufactured.

  In the present embodiment, the pattern film 16 is laminated on the surface of the high absorption film 14, thereby forming the mixed layer 30 having a predetermined pattern shape even when the entire surface of the pattern film 16 is irradiated with the ion beam. Can do. Therefore, the present invention can be suitably applied even to an apparatus in which the trajectory of the ion beam cannot be strictly controlled, and the contrast of reflected EUV light can be increased.

(Third embodiment)
Next, a method for correcting an extreme ultraviolet exposure mask according to a third embodiment of the present invention will be described with reference to FIGS. The extreme ultraviolet exposure mask correction method of this embodiment corrects the pattern of the extreme ultraviolet exposure mask in which the pattern film 16 that can absorb EUV light and has a predetermined pattern shape is disposed on the surface of the multilayer reflective film 12. It is a method to do. Unlike the above-described embodiments, the extreme ultraviolet exposure mask of this embodiment is not peeled off by etching, and the reflection of EUV light is suppressed by the pattern film 16 so that the contrast of reflected light of EUV light is high. The resulting mask.

FIG. 12 is a flowchart showing the pattern correction method of this embodiment. 13 to 15 are cross-sectional views showing one process of the pattern correction process in the manufacturing process of the extreme ultraviolet exposure mask.
In the present embodiment, for example, a mask blank formed by sequentially laminating a buffer layer for pattern correction (high absorption film 14) and an absorption layer (pattern film 16) for forming a predetermined transfer pattern on the multilayer reflective film 12. 200a (not shown) can be used. A multilayer reflective film forming step S10, a film forming step S21, and a patterning step S122 similar to those in the second embodiment are applied until a predetermined pattern is formed on the pattern film 16 (see FIG. 12).

  FIG. 13 is a cross-sectional view showing a state where the patterning step S122 is completed. As shown in FIG. 13, after the patterning step S122 is completed, a pinhole 40 is generated in the thickness direction of the pattern film 16. The pinhole 40 is a missing portion of the pattern film 16 that is not assumed in the patterning step S122. The pinhole 40 is determined by, for example, a defect inspection of the pattern film 16 performed after the patterning step S122. If the pinhole 40 remains, EUV light can enter through the pinhole 40 and can be reflected by the multilayer reflective film 12 and emitted from the pinhole 40. For this reason, unintended exposure defects may occur due to unexpected reflected EUV light.

14A and 14B are cross-sectional views illustrating a process of correcting the extreme ultraviolet exposure mask in the correction mixing step S223 illustrated in FIG. In the modified mixing step S223, the ion beam 20 is irradiated into the pinhole 40, and the ion beam 20 reaches the high absorption film 14 and the multilayer reflective film 12 through the pinhole 40.
Then, the mixed layer 30 is generated in the region irradiated with the ion beam 20 as in the above embodiments. At this time, as shown in FIG. 14B, the portions of the first layer 12a, the second layer 12b, and the high absorption film 14 of the multilayer reflective film 12 that overlap the pinhole 40 in the thickness direction of the pattern film 16 are The mixed layer 30 is obtained. In the mixed layer 30, the reflectance of EUV light is reduced as described above.

  Subsequently, an etching step S124 shown in FIG. 12 is performed. FIG. 15 is a cross-sectional view showing a process of correcting the extreme ultraviolet exposure mask in the etching step S124. As shown in FIG. 15, in the etching step S124, the high absorption film 14 is removed while leaving the pattern film 16 by dry etching using a gas containing chlorine and oxygen. Then, the surface of the multilayer reflective film 12 corresponding to the portion of the through hole that penetrates the pattern film 16 in the thickness direction is exposed to the outside. Here, the second mixed layer 32 remains on the outermost surface of the multilayer reflective film 12, and the reflectance of the EUV light is reduced. As a result, the extreme ultraviolet exposure mask 200 corrected by the correction method of the present embodiment is physically free of the pinhole 40, but EUV light is not reflected in the pinhole 40 portion. Has been corrected.

  According to the extreme ultraviolet exposure mask correction method of this embodiment, the first layer 12a and the second layer 12b of the multilayer reflective film 12 are mixed to destroy the periodic structure, and the light absorption by the second mixed layer 32 is performed. Can be used in combination. For this reason, for example, a sufficient correction effect can be obtained even if the dose amount of the ion beam is low as compared with the conventional method of reducing the reflectance only by destroying the periodic structure of the multilayer reflective film.

  Further, since the mixed layer 30 according to the present invention and the pattern film 16 on the multilayer reflective film 12 are used in combination, it is convenient when the pattern film 16 is inspected and a part of the pattern film 16 is missing. The pattern can be corrected.

(Fourth embodiment)
Next, an extreme ultraviolet exposure mask and an extreme ultraviolet exposure mask manufacturing method according to a fourth embodiment of the present invention will be described with reference to FIGS.
When a large number of chips are formed on a semiconductor substrate, it may be difficult to completely shield the boundary between adjacent chips with an exposure apparatus. In the present embodiment, in addition to the pattern for transferring onto a semiconductor substrate or the like, the mixed layer 30 is configured in a region used auxiliary around the pattern.

  FIG. 16 is a flowchart showing a method for manufacturing an extreme ultraviolet exposure mask according to this embodiment. The present embodiment is different from the above-described extreme ultraviolet exposure mask manufacturing method of the second embodiment in that a peripheral mixing step S323 is provided instead of the mixing step S123. In addition, the same processes as in the second embodiment are performed up to the patterning process S122.

FIGS. 17A to 17C are cross-sectional views respectively showing one process of manufacturing in the method for manufacturing an extreme ultraviolet exposure mask of the present embodiment.
FIG. 17A shows a state where the patterning step S122 is completed. At this time, a plurality of through holes penetrating in the thickness direction are formed in the pattern film 16, and the through holes form a predetermined pattern along the surface of the pattern film 16.

  Here, an area A in FIG. 17 indicates an area where a pattern to be transferred is formed on the semiconductor substrate, and an area B indicates a position on the mask surface corresponding to a chip adjacent to the chip to be transferred. . Although it is preferable that the exposure light does not enter the outside of the region A, it is actually difficult to make the light incident only on the pattern region strictly on the exposure apparatus side corresponding to various patterns. For this reason, the exposure light may enter a position corresponding to the adjacent chip position as indicated by reference numeral C in FIG. In this case, a portion (peripheral region 50) where the regions indicated by the reference characters B and C overlap each other is subjected to multiple exposure, and thus the reflectance of the EUV light needs to be sufficiently low.

  In the present embodiment, the peripheral region 50 is left in a state where the pattern film 16 is opened and the high absorption film 14 is exposed to the outside. In this case, the data of the peripheral frame-like portion may be put in the pattern data for processing the pattern film 16 in advance, or the pattern data may be formed by an overlay drawing technique using a laser drawing apparatus or the like. At this time, defect inspection and correction of the pattern film 16 can be performed as shown in the third embodiment. Next, as shown in FIG. 17B, the peripheral region 50 is irradiated with the ion beam 20. Then, as shown in FIG. 17C, a mixed layer 30 is generated at the interface between the high absorption film 14 and the multilayer reflective film 12 and inside the multilayer reflective film 12.

  Subsequently, the etching step S124 shown in FIG. 16 is performed, and the high absorption film 14 exposed in the opening of the pattern film 16 is removed by dry etching using a gas containing chlorine and oxygen, and the lower multilayer reflective film 12 is removed. Is exposed. At this time, the second mixed layer 32 remains in the peripheral region 50 where the mixed layer 30 is formed. In this manner, the extreme ultraviolet exposure mask 300 of the present embodiment is manufactured.

  In the extreme ultraviolet exposure mask and the extreme ultraviolet exposure mask manufacturing method of the present embodiment, a frame-shaped peripheral region 50 in which the reflectance of EUV light is reduced is formed in a peripheral region of a pattern transferred to a semiconductor substrate or the like. Has been. Therefore, reflection of exposure light can be suitably suppressed in a region where there is a possibility of multiple exposure.

  Even when the pattern film 16 is thin in order to reduce the influence of the shadow due to the thickness of the pattern film 16, EUV light is absorbed by the mixed layer 30 in the peripheral region 50 instead of the pattern film 16. For this reason, since the pattern film 16 is thin, the influence of the EUV light transmitted through the pattern film 16 can be suppressed, so that a particularly remarkable effect can be obtained in suppressing multiple exposure.

As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included. Further, the constituent elements shown in the above-described embodiments and modifications can be combined as appropriate.
For example, the structures characteristic of the above-described embodiments can be implemented by appropriately combining the embodiments.

1, 100, 200, 300 Extreme ultraviolet exposure mask 10 Substrate 12 Multi-layer reflective film 12a First layer 12b Second layer 14 High absorption film (buffer layer)
16 Pattern film (absorption pattern)
30 Mixed layer 31 First mixed layer 32 Second mixed layer 200a Mask blanks S20, S120, S220, S320 Pattern forming step S21 Film forming step S22, S123 Mixing step S23, S124 Etching step S122 Patterning step S223 Correction mixing step S323 Peripheral mixing Process L1, L2 Extreme ultraviolet light (EUV light)

Claims (9)

An absorption coefficient of the extreme ultraviolet light is higher than an absorption coefficient of the multilayer reflection film on the surface of the multilayer reflection film in a substrate having a multilayer reflection film capable of reflecting extreme ultraviolet light, and the multilayer reflection film has the highest absorption coefficient. A film forming step of forming a high absorption film whose etching rate is reduced by being mixed with the surface layer;
Irradiating the high absorption film with an ion beam, the first mixed layer in which the respective layers in the multilayer reflective film are mixed, and the outermost surface layer between the outermost surface layer and the high absorption film A mixing step for producing a mixed layer having a second mixed layer mixed with the superabsorbent film;
An etching step of removing components of the superabsorbent film excluding the mixed layer by etching following the mixing step to expose the outermost surface layer of the multilayer reflective film and the mixed layer;
A pattern forming method comprising:   2. The mixing process according to claim 1, wherein in the mixing step, the high-absorption film is scanned with a focused ion beam according to a predetermined pattern, and the mixed layer having the predetermined pattern is formed by the scanning process. The pattern formation method as described.   The pattern formation method of Claim 1 provided with the patterning process which forms the pattern film which has a predetermined pattern on the surface of the said high absorption film between the said film-forming process and the said mixing process.   4. The pattern forming method according to claim 1, wherein the outermost surface layer contains silicon as a main component.   The pattern forming method according to claim 1, wherein the high absorption film contains chromium as a main component.   The extreme ultraviolet exposure mask manufactured by the pattern forming method according to claim 1, wherein the multilayer reflective film can reflect extreme ultraviolet light, and the mixed layer can absorb the extreme ultraviolet light. A mask for extreme ultraviolet exposure. A method for producing an extreme ultraviolet exposure mask using mask blanks in which a buffer layer for pattern correction and an absorption layer for forming a transfer pattern are sequentially laminated on a multilayer reflective film,
An area where the buffer layer is exposed to the outside around the transfer pattern is irradiated with an ion beam to mix the outermost surface layer of the multilayer reflective film and the buffer layer, and an extreme in the outermost surface layer of the multilayer reflective film. A peripheral mixing step that produces a mixed layer having a reflectivity lower than that of ultraviolet light;
An etching step of removing the buffer layer by etching while leaving the mixed layer;
An extreme ultraviolet exposure mask manufacturing method comprising: A mask for extreme ultraviolet exposure formed using a mask blank formed by sequentially laminating a buffer layer for pattern correction and an absorption layer for forming a predetermined transfer pattern on the multilayer reflective film,
Around the transfer pattern, a mixed layer having a reflectance lower than the reflectance of extreme ultraviolet light in the outermost surface layer of the multilayer reflective film is mixed with the outermost surface layer of the multilayer reflective film and the buffer layer. An extreme ultraviolet exposure mask characterized by being formed. A method for correcting an extreme ultraviolet exposure mask using a mask blank in which a buffer layer for pattern correction and an absorption layer for forming a predetermined transfer pattern are sequentially laminated on a multilayer reflective film,
Irradiating an ion beam to the missing part where the absorbing layer forming the transfer pattern is missing and the buffer layer is exposed to mix the outermost surface layer of the multilayer reflective film and the buffer layer, and the multilayer reflective film A modified mixing step that produces a mixed layer having a reflectivity lower than the reflectivity of extreme ultraviolet light at the outermost layer;
Etching to remove the buffer layer exposed outside, leaving the mixed layer and the absorbing layer forming the transfer pattern, and exposing the outermost surface layer of the multilayer reflective film;
A method for correcting a mask for extreme ultraviolet exposure, comprising:

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