JP2010218796A - Ultrasonic bonding method and device therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic bonding method and a device for surely bonding each of core wires in a plurality of electric wires, without limiting the number of electric wires that are bonded once. <P>SOLUTION: The ultrasonic bonding device 1 includes a chip 9 vibrated in an ultrasonic mode, and an anvil 10 holding the chip 9 a core wire with a part of the covered portions removed and exposed in each of a plurality of wires. The device 1 includes a rotating mechanism 7 to relatively rotate the chip 9, the anvil 10, and a plurality of wires around an axial core passing through the center in a plurality of electric wires. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an ultrasonic bonding method and an apparatus therefor, and more particularly to an ultrasonic bonding method and an apparatus for ultrasonic bonding the exposed core wires by peeling off a part of a covering portion of each of a plurality of electric wires. .

  As the conventional ultrasonic bonding method described above, for example, a method using the ultrasonic bonding method of Patent Document 1 in which a plurality of core wires constituting a stranded wire are bonded to each other has been proposed.

  In the ultrasonic bonding method disclosed in Patent Document 1, first, a part of a covering portion of each of a plurality of electric wires is peeled to expose a core wire, and the exposed core wire is inserted between a pair of pressing dies to insert a chip and an anvil. The chip is ultrasonically vibrated while pressing the chip toward the anvil, and the core wires are ultrasonically bonded to each other.

JP 2004-95293 A

  However, in the conventional ultrasonic bonding method described above, when the number of the above-described electric wires increases, the tip and the anvil are arranged in a direction facing each other (a direction in which the tip and the anvil sandwich the core wires of a plurality of electric wires). The core wires are securely joined to each other by the above-described chip pressing force. However, the core wires arranged along the direction orthogonal to the direction in which the tip and the anvil face each other have the chip pressing force described above. Since it does not act, the joining is often incomplete.

  For this reason, the interval between the pressing dies mentioned above is set to be an interval narrower than twice the outer diameter of the core wire of the electric wire, and the core wires of the plurality of electric wires are orthogonal to the direction in which the tip and the anvil face each other. It is proposed not to line up along. In this case, when the number of electric wires increases, the core wires of many electric wires are arranged along the direction in which the tip and the anvil face each other, and the vibration of the tip becomes difficult to be transmitted to the anvil side. In some cases, the bonding between the core wires is incomplete. For this reason, there existed a tendency for the number of the electric wires which can be joined at a time to be limited.

  Therefore, the present invention provides an ultrasonic bonding method and apparatus capable of reliably bonding the core wires of a plurality of electric wires without limiting the number of electric wires that can be bonded at a time, focusing on the above problems. The purpose is to do.

  In order to solve the problems and achieve the object, the ultrasonic bonding method according to the first aspect of the present invention ultrasonically vibrates the exposed core wire by removing a part of the covering portions of each of the plurality of electric wires. In the method of joining electric wires in which the core wires of the plurality of electric wires are joined to each other by being sandwiched between the tip and the anvil, ultrasonic waves are obtained by sandwiching the core wires of the plurality of electric wires between the tip and the anvil along one direction. After applying vibration, ultrasonic vibration is applied by sandwiching core wires of the plurality of electric wires between the tip and the anvil along the other direction intersecting the one direction. It is characterized by joining core wires together.

  The ultrasonic bonding apparatus according to the second aspect of the present invention includes a tip that is ultrasonically vibrated, and an anvil that sandwiches an exposed core wire from which the covering portion of each of the plurality of electric wires is removed. In the ultrasonic bonding apparatus comprising: a rotation mechanism that relatively rotates the tip and the anvil and the plurality of electric wires around an axis passing through the center between the plurality of electric wires. Yes.

  The ultrasonic bonding apparatus according to a third aspect of the present invention is the ultrasonic bonding apparatus according to the second aspect, wherein the rotating mechanism rotates the plurality of electric wires.

  The ultrasonic bonding apparatus according to a fourth aspect of the present invention is the ultrasonic bonding apparatus according to the third aspect, wherein the rotating mechanism rotates the tip and the anvil.

  An ultrasonic bonding apparatus according to a fifth aspect of the present invention includes a tip that is ultrasonically vibrated, and an anvil that sandwiches an exposed core wire from which the covering portion of each of the plurality of electric wires is removed. , A second chip that is vibrated ultrasonically, and a part of each of the plurality of electric wires is removed and exposed between the second chip and the first chip. A second anvil sandwiching a core wire sandwiched between the tip and the anvil, and the direction in which the second tip and the second anvil sandwich the core wires of the plurality of electric wires is The tip and the anvil include a second joining device that intersects with a direction in which core wires of the plurality of electric wires are sandwiched.

  According to the first aspect of the present invention, after applying ultrasonic vibration by sandwiching the core wires of the plurality of electric wires between the tip and the anvil along one direction, the other direction intersecting with one direction is applied. Since the ultrasonic vibration is applied by sandwiching the core wires of the plurality of electric wires between the tip and the anvil, the core wires of the plurality of electric wires arranged along both the one direction and the other direction are surely joined. can do.

  According to the second aspect of the present invention, since the rotation mechanism that relatively rotates the tip and the anvil and the plurality of wires around the core wires of the plurality of wires is provided, the tip and the anvil along one direction. And applying ultrasonic vibration by sandwiching the core wires of the plurality of electric wires between them, and then ultrasonicating the core wires of the plurality of electric wires between the tip and the anvil along the other direction intersecting with one direction. Vibration can be applied. For this reason, the core wires of a plurality of electric wires arranged along both the one direction and the other direction described above can be reliably joined.

  According to this invention of Claim 3, since a rotation mechanism rotates a some electric wire, compared with the case where a chip | tip and an anvil are rotated, size reduction of the said rotation mechanism can be achieved.

  According to the fourth aspect of the present invention, since the rotating mechanism rotates the tip and the anvil, ultrasonic vibration can be applied to the core wires of the plurality of electric wires along both one direction and the other direction. .

  According to this invention of Claim 5, since the direction which pinches | interposes the core wire of a some electric wire cross | intersects between a chip | tip and an anvil is provided, since it comprises the 1st joining apparatus and the 2nd joining apparatus, By sequentially applying ultrasonic vibration to the core wires of the plurality of electric wires described above, ultrasonic vibration can be applied to the core wires of the plurality of electric wires along two different directions.

  As described above, according to the first aspect of the present invention, since the core wires of a plurality of electric wires arranged along both one direction and the other direction can be reliably joined, the electric wires are arranged only in one direction. There is no need, and the core wires of a large number of wires can be joined at a time. Therefore, the core wires of a plurality of electric wires can be reliably bonded without limiting the number of electric wires that can be bonded at a time.

  In the present invention according to claim 2, since the core wires of the plurality of electric wires arranged along both one direction and the other direction can be surely joined, there is no need to arrange the electric wires only in one direction. The core wires of a large number of wires can be joined together. Therefore, the core wires of a plurality of electric wires can be reliably bonded without limiting the number of electric wires that can be bonded at a time.

  According to the third aspect of the present invention, the rotation mechanism can be downsized and the cost can be reduced as compared with the case where the tip and the anvil are rotated.

  According to the fourth aspect of the present invention, since ultrasonic vibration can be applied to the core wires of the plurality of electric wires along both one direction and the other direction, both the one direction and the other direction can be applied. Since the core wires of the plurality of electric wires arranged can be reliably joined and there is no need to arrange the wires in only one direction, the core wires of a large number of wires can be joined at a time. Therefore, the core wires of a plurality of electric wires can be reliably bonded without limiting the number of electric wires that can be bonded at a time.

  According to the fifth aspect of the present invention, since ultrasonic vibration can be applied to the core wires of the plurality of electric wires along two different directions, the plurality of electric wires arranged along both one direction and the other direction. Since the core wires can be reliably joined to each other and there is no need to arrange the wires only in one direction, the core wires of a large number of wires can be joined at a time. Therefore, the core wires of a plurality of electric wires can be reliably bonded without limiting the number of electric wires that can be bonded at a time.

It is a perspective view of the electric wire joined by the ultrasonic bonding apparatus concerning a 1st embodiment of the present invention. FIG. 2 is a perspective view showing a state where a plurality of core wires of the electric wire shown in FIG. 1 are joined. It is explanatory drawing which shows typically the ultrasonic bonding apparatus concerning the 1st Embodiment of this invention. FIG. 4 is an explanatory view schematically showing a state in which the ultrasonic bonding apparatus shown in FIG. 3 applies ultrasonic vibration along the arrow T with the core wires of a plurality of electric wires being sandwiched between a chip and an anvil. It is explanatory drawing which shows typically the state from which the chip | tip and anvil of the ultrasonic bonding apparatus shown by FIG. It is explanatory drawing which shows typically the state which the rotation mechanism of the ultrasonic bonding apparatus shown by FIG. 5 rotated the some electric wire 90 degree | times. FIG. 7 is an explanatory view schematically showing a state in which the ultrasonic bonding apparatus shown in FIG. 6 applies ultrasonic vibration along the arrow Y with the core wires of a plurality of wires sandwiched between a chip and an anvil. It is explanatory drawing which shows typically the ultrasonic bonding apparatus concerning the 2nd Embodiment of this invention. FIG. 10 is an explanatory diagram schematically showing a state in which the ultrasonic bonding apparatus shown in FIG. 9 applies ultrasonic vibrations with a core wire of a plurality of electric wires sandwiched between a chip and an anvil along an arrow T. It is explanatory drawing which shows typically the state from which the chip | tip and the anvil of the ultrasonic bonding apparatus shown by FIG. It is explanatory drawing which shows typically the state which the rotation mechanism of the ultrasonic bonding apparatus shown by FIG. 10 rotated the tip | tip and the anvil, and a pair of pressing die 90 degree | times. FIG. 12 is an explanatory view schematically showing a state in which the ultrasonic bonding apparatus shown in FIG. 11 is applying ultrasonic vibration along the arrow Y with the core wires of a plurality of wires sandwiched between a tip and an anvil. It is explanatory drawing which shows typically the ultrasonic bonding apparatus concerning the 3rd Embodiment of this invention. The ultrasonic bonding apparatus shown in FIG. 13 applies ultrasonic vibration along the arrow T with the core wires of the plurality of wires sandwiched between the tip and the anvil and between the second tip and the second anvil. It is explanatory drawing which shows a state typically.

  Hereinafter, an ultrasonic bonding apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 7.

  First, the ultrasonic bonding apparatus 1 shown in FIG. 3 used for the ultrasonic bonding method of the present invention is an apparatus for bonding exposed core wires 4 from which a part of the covering portion 3 of the electric wire 2 shown in FIG. 1 is removed. is there. The electric wire 2 is, of course, a so-called covered electric wire provided with a conductive core wire 4 and an insulating covering portion 3 covering the core wire 4. Of course, the core wire 4 is formed by bundling a plurality of strands made of metal. In the illustrated example, the electric wire 2 has a portion of the core 4 positioned at the terminal exposed, with the covering 3 positioned at the terminal as a part removed. As shown in FIG. 2, the ultrasonic bonding apparatus 1 shown in FIG. 3 has the core wires 4 of the plurality of electric wires 2 in a state where the same number or substantially the same number of the core wires 4 exposed at the terminals of the plurality of electric wires 2 are arranged vertically and horizontally. It is a device for joining together.

  As shown in FIG. 3, the ultrasonic bonding apparatus 1 includes an apparatus main body 5, an electric wire holding jig 6, a rotating mechanism 7, a piezoelectric vibrator 8 as a drive source, and a chip 9 (also referred to as a tool horn). An anvil 10 opposed to the tip 9, a pair of pressing molds 11, a pair of hydraulic cylinders 12 as pressurizing means, a pair of displacement sensors 13, and a control circuit 14 as control means are provided.

  The apparatus main body 5 is installed on a factory floor or the like. The electric wire holding jig 6 is provided with a wide slit 15 that holds the plural electric wires 2 stacked vertically and horizontally. The slit 15 is inserted inside the plurality of electric wires 2 in the vertical and horizontal directions, and holds the plurality of electric wires 2. Further, the electric wire holding jig 6 is supported by the apparatus main body 5 so as to be rotatable around an axis P (shown by a dot in FIG. 3) that passes through the center between the plurality of electric wires 2 and extends in the longitudinal direction of the electric wires 2. Has been. Further, the outer edge of the electric wire holding jig 6 is formed in a circular shape centering on the shaft core P described above.

  The rotating mechanism 7 includes teeth 16 provided on the outer edge of the electric wire holding jig 6 and a motor 17 for rotating the electric wire holding jig 6. The main body of the motor 17 is fixed to the apparatus main body 5, and a gear 18 that meshes with the aforementioned teeth 16 is attached to the output shaft. The motor 17 rotates the output shaft to rotate the electric wire holding jig 6 around the axis P. The rotating mechanism 7 causes the motor 17 to rotate the electric wire holding jig 6 so that the electric wire holding jig 6, the chip 9, and the anvil 10 are relatively rotated around the axis P described above.

  The piezoelectric vibrator 8 is applied by a power source (not shown) or the like, and vibrates (ultrasonic vibration) at a frequency of 10 kHz to 80 kHz, for example. The chip 9 is attached to the piezoelectric vibrator 8. For this reason, the piezoelectric vibrator 8 vibrates the chip 9 (ultrasonic vibration). The ultrasonic vibration refers to vibration obtained by applying a voltage to the piezoelectric vibrator 8 and causing the piezoelectric vibrator 8 to vibrate to convert electrical energy into mechanical vibration.

  In FIG. 3, the anvil 10 is provided to face the chip 9 along the vertical direction. Further, the chip 9 and the anvil 10 are supported by the apparatus body 5 so as to be slidable along the vertical direction, and can be brought into and out of contact with each other. Moreover, the mutually opposing surface of the chip | tip 9 and the anvil 10 is formed flat along the direction orthogonal to the direction where these mutually oppose. The chip 9 and the anvil 10 can sandwich the core wire 4 exposed at the above-described end of the plurality of electric wires 2 held by the electric wire holding jig 6 as a bonding object. For this reason, the chip 9 and the anvil 10 sandwich the core wires 4 of the plurality of electric wires 2 between each other along the vertical direction in the illustrated example.

  A pair of presser dies 11 are provided. In the illustrated example, the pair of pressing dies 11 are provided to be opposed to each other at an interval in the horizontal direction. Each of the pair of presser dies 11 is supported by the apparatus body 5 so as to be slidable along the horizontal direction, and can be brought into and out of contact with each other. Moreover, the mutually opposing surfaces of the pair of pressing dies 11 are formed flat along a direction orthogonal to the direction in which they oppose each other. The pair of holding dies 11 are held between the ends of the plurality of electric wires 2 held between the chips 9 and the anvil 10 while being held by the electric wire holding jig 6 as an object to be joined. 4 can be sandwiched. For this reason, the pair of pressing dies 11 sandwich the core wires 4 of the plurality of electric wires 2 between each other along the horizontal direction in the illustrated example.

  Each of the hydraulic cylinders 12 includes a cylinder main body 19 attached to the apparatus main body 5, and a telescopic rod 20 provided to extend and retract from the cylinder main body 19. In one hydraulic cylinder 12, the telescopic rod 20 is disposed in parallel with the vertical direction, and the telescopic rod 20 is attached to the anvil 10. The hydraulic cylinder 12 pressurizes the anvil 10 in a direction approaching the tip 9 as the telescopic rod 20 extends. Further, the position of the chip 9 can be regulated by a fixing member (not shown).

  In the other hydraulic cylinder 12, the telescopic rod 20 is arranged in parallel with the horizontal direction, and the telescopic rod 20 is attached to one holding die 11. The hydraulic cylinder 12 pressurizes one holding die 11 in a direction approaching the other holding die 11 as the telescopic rod 20 extends. Further, the other pressing die 11 can be in a state in which its position is regulated by a fixing member (not shown).

  Each of the pair of displacement sensors 13 includes an anvil 10 based on a movable iron core 21, a coil 22 fixed to the apparatus body 5 and wound around the movable iron core 21, and an induced voltage corresponding to the movement of the movable iron core 21 generated in the coil 22. And a detection circuit 23 for detecting the amount of movement of the presser die 11.

  In one displacement sensor 13, the movable iron core 21 is arranged in parallel with the vertical direction, and the movable iron core 21 is attached to the anvil 10. The displacement sensor 13 measures the relative displacement between the anvil 10 and the chip 9 when the movable iron core 21 moves relative to the coil 22 and the detection circuit 23 detects the amount of movement of the movable iron core 21.

  In the other displacement sensor 13, the movable iron core 21 is arranged in parallel with the horizontal direction, and the movable iron core 21 is attached to one holding die 11. The displacement sensor 13 measures the relative displacement of the pair of presser dies 11 when the movable iron core 21 moves with respect to the coil 22 and the detection circuit 23 detects the amount of movement of the movable iron core 21. In the present invention, as the displacement sensor 13, not only the above-described contact type displacement sensor but also various conventionally known displacement sensors such as a non-contact type may be used.

  The control circuit 14 is connected to the piezoelectric vibrator 8, the hydraulic cylinder 12, the displacement sensor 13, and the motor 17, and controls these operations, thereby controlling the entire ultrasonic bonding apparatus 1.

  The ultrasonic bonding apparatus 1 having the above-described configuration bonds the core wires 4 of the plurality of electric wires 2 as described below. First, the chip 9 and the anvil 10 are moved away from each other, the pair of holding dies 11 are moved away from each other, and the electric wires 2 are held on the electric wire holding jig 6 in the same or substantially the same number. Then, the core wires 4 exposed at the ends of the plurality of electric wires 2 are positioned between the pair of pressing molds 11 and between the chip 9 and the anvil 10, and the pair of pressing molds 11 and the chip 9 and the anvil 10 are mutually connected. Move closer.

  Then, the movement of the tip 9 and the other pressing die 11 is regulated by the fixing member, and as shown in FIG. 4, in this state, the telescopic rod 20 of the hydraulic cylinder 12 is vibrated, and the tip 9 and the anvil 10 are moved. The core wires 4 of the plurality of electric wires 2 are sandwiched therebetween, and the core wires 4 of the plurality of electric wires 2 are sandwiched between the pair of holding dies 11. In this way, the piezoelectric vibrator 8 is vibrated in a state where the tip 9 and the anvil 10 are pressed in the direction to approach each other by the hydraulic cylinder 12, and this vibration is applied to the core wire 4 through the tip 9.

  In this way, first, ultrasonic vibration is performed by sandwiching the core wire 4 between the tip 9 and the anvil 10 along the direction in which the core wires 4 of the electric wires 2 indicated by arrows T as one direction in FIG. Is granted. Then, since the core wires 4 made of metal are in contact with each other along the arrow T, the core wires 4 that overlap each other along the arrow T are gradually joined to each other in a solid state without being melted. To do. Thus, the core wires 4 are joined to each other by so-called ultrasonic bonding (also referred to as ultrasonic welding).

  The control circuit 14 extends the telescopic rod 20 of the hydraulic cylinder 12 with a predetermined pressure, vibrates the piezoelectric vibrator 8 for a predetermined time, and the displacement sensor 13 has a predetermined displacement amount. When it is detected that the anvil 10 or the like has moved, the vibration of the piezoelectric vibrator 8 is stopped, the restriction on the movement of the fixing member is released, and the tip 9 and the anvil 10 are moved away from each other as shown in FIG. The holding dies 11 are moved away from each other. Then, the motor 17 is driven to rotate the electric wire holding jig 6 by 90 degrees about the axis P as shown in FIG.

  Then, the pair of holding dies 11 and the tip 9 and the anvil 10 are brought close to each other, and the movement of the tip 9 and the other holding die 11 is restricted by the fixing member. In this state, as shown in FIG. 12 cores 4 of the plurality of electric wires 2 are sandwiched between the tip 9 and the anvil 10, and the core wires 4 of the plurality of electric wires 2 are sandwiched between the pair of holding dies 11. In this way, the piezoelectric vibrator 8 is vibrated in a state where the tip 9 and the anvil 10 are pressed in the direction to approach each other by the hydraulic cylinder 12, and this vibration is applied to the core wire 4 through the tip 9.

  In this way, the tip 9 and the anvil 10 are arranged along the direction in which the cores 4 of the electric wires 2 indicated by the arrow Y in FIG. 7 as other directions intersecting (orthogonal in the illustrated example) with respect to the arrow T described above overlap horizontally. Ultrasonic vibration is applied with the core wire 4 sandwiched therebetween. Then, since the core wires 4 made of metal overlap with each other along the arrow Y, the core wires 4 that overlap with each other along the arrow Y are gradually joined to each other in a solid state without melting. To do.

  Thus, the core wires 4 are joined to each other by so-called ultrasonic bonding (also referred to as ultrasonic welding). In this way, the ultrasonic bonding apparatus 1 imparts ultrasonic vibrations by sandwiching the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10 along the arrow T as one direction, and then the arrow T Ultrasonic vibration is applied across the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10 along an arrow Y as another direction that intersects (orthogonal in the illustrated example), and the plurality of electric wires 2 is applied. The core wires 4 are joined together.

  The control circuit 14 extends the telescopic rod 20 of the hydraulic cylinder 12 with a predetermined pressure, vibrates the piezoelectric vibrator 8 for a predetermined time, and the displacement sensor 13 has a predetermined displacement amount. When it is detected that the anvil 10 or the like has moved, the vibration of the piezoelectric vibrator 8 is stopped, the restriction on the movement of the fixing member is released, the tip 9 and the anvil 10 are moved away from each other, and the pair of holding dies 11 are moved away from each other. . Then, the motor 17 is driven to rotate the wire holding jig 6 by 90 degrees about the axis P to the initial position shown in FIG. In this way, the plurality of electric wires 2 in which the bonding between the core wires 4 is completed are removed from the electric wire holding jig 6, and the above-described configuration is repeated to bond the core wires 4 of the next plurality of electric wires 2.

  According to the present embodiment, the ultrasonic vibration is applied by sandwiching the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10 along the arrow T, and then along the arrow Y intersecting the arrow T. Since the ultrasonic vibration is applied by sandwiching the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10, the core wires 4 of the plurality of electric wires 2 arranged along both the arrows T and Y described above can be surely connected. Can be joined. For this reason, it is not necessary to arrange the electric wires 2 only in one direction, and the core wires 4 of many electric wires 2 can be joined at a time. Therefore, the core wires 4 of the plurality of electric wires 2 can be reliably bonded without limiting the number of the electric wires 2 that can be bonded at a time.

  Moreover, since the rotation mechanism 7 is provided, the ultrasonic vibration is applied along the arrow T between the tip 9 and the anvil 10 with the core wires 4 of the plurality of electric wires 2 being sandwiched, and then the arrow T is crossed. Ultrasonic vibration can be applied along the arrow Y by sandwiching the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10. For this reason, the core wires 4 of the plurality of electric wires 2 arranged along both the arrows T and Y described above can be reliably joined.

  Moreover, since the rotation mechanism 7 rotates the some electric wire 2, compared with the case where the chip | tip 9 and the anvil 10 are rotated, the said rotation mechanism 7 can be reduced in size. Therefore, the size and cost of the apparatus can be reduced.

  Next, an ultrasonic bonding apparatus according to the second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the same parts as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  In the present embodiment, the electric wire holding jig 6 is fixed to the apparatus main body 5, and the rotating mechanism 7, as shown in FIG. A rotating table 24 (shown by a two-dot chain line in FIG. 8) is provided. The rotary table 24 has a cylinder main body 19 of the hydraulic cylinder 12 and a coil 22 of the displacement sensor 13 attached thereto, and supports the tip 9 and the anvil 10 so as to be able to contact and separate from each other, and the pair of pressing dies 11 to each other. Supports contact and separation. Further, the teeth 16 of the rotation mechanism 7 are provided on the outer edge of the rotary table 24.

  In the present embodiment, the rotation mechanism 7 rotates the rotary table 24 around the axis P by the driving force of the motor 17. The rotation mechanism 7 rotates the electric wire holding jig 6, the tip 9, and the anvil 10 relative to each other about the axis P described above by causing the motor 17 to rotate the rotary table 24.

  The ultrasonic bonding apparatus 1 of this embodiment bonds the core wires 4 of the plurality of electric wires 2 as shown below. First, the chip 9 and the anvil 10 are moved away from each other, the pair of holding dies 11 are moved away from each other, and the plurality of electric wires 2 are held vertically and horizontally on the electric wire holding jig 6. Then, the core wires 4 exposed at the ends of the plurality of electric wires 2 are positioned between the pair of pressing molds 11 and between the chip 9 and the anvil 10, and the pair of pressing molds 11 and the chip 9 and the anvil 10 are mutually connected. Move closer.

  Then, the movement of the tip 9 and the other pressing die 11 is restricted by the fixing member, and as shown in FIG. 9, the telescopic rod 20 of the hydraulic cylinder 12 is extended in this state, and the tip 9 and the anvil 10 are The core wires 4 of the plurality of electric wires 2 are sandwiched therebetween, and the core wires 4 of the plurality of electric wires 2 are sandwiched between the pair of holding dies 11. In this way, the piezoelectric vibrator 8 is vibrated in a state where the tip 9 and the anvil 10 are pressed in the direction to approach each other by the hydraulic cylinder 12, and this vibration is applied to the core wire 4 through the tip 9.

  Thus, first, ultrasonic vibration is performed by sandwiching the core wire 4 between the tip 9 and the anvil 10 along the direction in which the core wires 4 of the electric wires 2 indicated by arrows T as one direction in FIG. Is granted. Then, since the core wires 4 made of metal are in contact with each other along the arrow T, the core wires 4 that overlap each other along the arrow T are gradually joined to each other in a solid state without being melted. To do. Thus, the core wires 4 are joined to each other by so-called ultrasonic bonding (also referred to as ultrasonic welding).

  The control circuit 14 extends the telescopic rod 20 of the hydraulic cylinder 12 with a predetermined pressure, vibrates the piezoelectric vibrator 8 for a predetermined time, and the displacement sensor 13 has a predetermined displacement amount. When it is detected that the anvil 10 or the like has moved, the vibration of the piezoelectric vibrator 8 is stopped, the restriction on the movement of the fixing member is released, and the tip 9 and the anvil 10 are moved away from each other as shown in FIG. The holding dies 11 are moved away from each other. Then, the motor 17 is driven to rotate the rotary table 24, that is, the tip 9 and the anvil 10 and the pair of holding dies 11 by 90 degrees about the axis P as shown in FIG.

  Then, the pair of holding dies 11 and the tip 9 and the anvil 10 are brought close to each other, and the movement of the tip 9 and the other holding die 11 is restricted by the fixing member. In this state, as shown in FIG. 12 cores 4 of the plurality of electric wires 2 are sandwiched between the tip 9 and the anvil 10, and the core wires 4 of the plurality of electric wires 2 are sandwiched between the pair of holding dies 11.

  In this way, the piezoelectric vibrator 8 is vibrated in a state where the tip 9 and the anvil 10 are pressed in the direction to approach each other by the hydraulic cylinder 12, and this vibration is applied to the core wire 4 through the tip 9. In this way, the tip 9 and the anvil 10 are arranged along the direction in which the cores 4 of the electric wires 2 indicated by the arrow Y in FIG. 12 as other directions intersecting (orthogonal in the illustrated example) with respect to the arrow T described above overlap horizontally. Ultrasonic vibration is applied with the core wire 4 sandwiched therebetween. Then, since the core wires 4 made of metal overlap each other along the arrow Y, the core wires 4 that overlap each other along the arrow Y gradually move toward each other in a solid phase without being melted. Metal bond.

  Thus, the core wires 4 are joined to each other by so-called ultrasonic bonding (also referred to as ultrasonic welding). In this way, the ultrasonic bonding apparatus 1 imparts ultrasonic vibrations by sandwiching the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10 along the arrow T as one direction, and then the arrow T Ultrasonic vibration is applied across the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10 along an arrow Y as another direction that intersects (orthogonal in the illustrated example), and the plurality of electric wires 2 is applied. The core wires 4 are joined together.

  The control circuit 14 extends the telescopic rod 20 of the hydraulic cylinder 12 with a predetermined pressure, vibrates the piezoelectric vibrator 8 for a predetermined time, and the displacement sensor 13 has a predetermined displacement amount. When it is detected that the anvil 10 or the like has moved, the vibration of the piezoelectric vibrator 8 is stopped, the restriction on the movement of the fixing member is released, the tip 9 and the anvil 10 are moved away from each other, and the pair of holding dies 11 are moved away from each other. . Then, the motor 17 is driven to rotate the rotary table 24 about the axis P by 90 degrees to the initial position shown in FIG. In this way, the plurality of electric wires 2 in which the bonding between the core wires 4 is completed are removed from the electric wire holding jig 6, and the above-described configuration is repeated to bond the core wires 4 of the next plurality of electric wires 2.

  According to the present embodiment, as in the first embodiment described above, after applying ultrasonic vibration by sandwiching the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10 along the arrow T, Since ultrasonic vibration is applied along the arrow Y intersecting the arrow T with the core wires 4 of the plurality of electric wires 2 sandwiched between the chip 9 and the anvil 10, they are arranged along both the arrows T and Y described above. The core wires 4 of the plurality of electric wires 2 can be reliably bonded to each other. For this reason, it is not necessary to arrange the electric wires 2 only in one direction, and the core wires 4 of many electric wires 2 can be joined at a time. Therefore, the core wires 4 of the plurality of electric wires 2 can be reliably bonded without limiting the number of the electric wires 2 that can be bonded at a time.

  Moreover, according to this embodiment, since the rotation mechanism 7 rotates the chip 9 and the anvil 10, ultrasonic vibration can be applied to the core wires 4 of the plurality of electric wires 2 along both the arrows T and Y. . Therefore, the core wires 4 of the plurality of electric wires 2 arranged along both the arrows T and Y can be reliably joined.

  Next, an ultrasonic bonding apparatus according to the third embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the same parts as those in the first embodiment and the second embodiment described above are denoted by the same reference numerals, and description thereof is omitted.

  In the present embodiment, the ultrasonic bonding apparatus 1 includes a first bonding apparatus 25 that includes the above-described chip 9 and anvil 10 without the electric wire holding jig 6 fixed to the apparatus main body 5 and the rotation mechanism 7. And a second joining device 28 composed of a second tip 26 and a second anvil 27 facing each other. The second tip 26 and the second anvil 27 are disposed at a distance from each other along the horizontal direction and are provided so as to be able to contact and separate from each other. In addition, since the structure of the 2nd chip | tip 26 and the 2nd anvil 27 is the same as the structure of the chip | tip 9 and the anvil 10, description is abbreviate | omitted. The direction in which the tip 9 and the anvil 10 of the first joining device 25 sandwich the core wires 4 of the plurality of electric wires 2, and the second tip 26 and the second anvil 27 of the second joining device 28 are the core wires of the plurality of electric wires 2. 4 intersect with each other (in the example shown, orthogonal).

  The ultrasonic bonding apparatus 1 of this embodiment bonds the core wires 4 of the plurality of electric wires 2 as shown below. First, the chips 9 and 26 and the anvils 10 and 27 are kept away from each other, and a plurality of electric wires 2 are held vertically and horizontally on the electric wire holding jig 6. Then, the core wire 4 exposed at the ends of the plurality of electric wires 2 is positioned between the chips 9 and 26 and the anvils 10 and 27 so that the chips 9 and 26 and the anvils 10 and 27 are brought close to each other.

  Then, the movement of the tips 9 and 26 is restricted by the fixing member, the telescopic rod 20 of the hydraulic cylinder 12 is extended, and the core wires 4 of the plurality of electric wires 2 are sandwiched between the tips 9 and 26 and the anvils 10 and 27. . In this way, the piezoelectric vibrator 8 of the first joining device 25 is vibrated through the chip 9 in a state where the chips 9 and 26 and the anvils 10 and 27 are pressurized in the direction close to each other by the hydraulic cylinder 12. To the core wire 4.

  Thus, first, ultrasonic vibration is applied by sandwiching the core wire 4 between the tip 9 and the anvil 10 along the direction in which the core wires 4 of the electric wire 2 indicated by the arrow T vertically overlap each other. Then, since the core wires 4 made of metal are in contact with each other along the arrow T, the core wires 4 that overlap each other along the arrow T are gradually joined to each other in a solid state without being melted. To do. Thus, the core wires 4 are joined to each other by so-called ultrasonic bonding (also referred to as ultrasonic welding).

  The control circuit 14 extends the telescopic rod 20 of the hydraulic cylinder 12 with a predetermined pressure, vibrates the piezoelectric vibrator 8 for a predetermined time, and the displacement sensor 13 has a predetermined displacement amount. When it is detected that the anvil 10 or the like has moved, the vibration of the piezoelectric vibrator 8 of the first joining device 25 is stopped, and the tip 9, 26 and the anvil 10, 27 are added in the direction in which the hydraulic cylinder 12 approaches each other. In a pressed state, the piezoelectric vibrator 8 of the second bonding apparatus 28 is vibrated and this vibration is applied to the core wire 4 via the chip 9.

  Thus, the core wire 4 of the electric wire 2 indicated by the arrow Y intersecting (orthogonal in the illustrated example) with respect to the arrow T described above is disposed between the second tip 26 and the second anvil 27 along the direction in which the core wires 4 overlap each other. Ultrasonic vibration is applied across the core wire 4. Then, since the core wires 4 made of metal overlap and contact each other along the arrow Y, the core wires 4 that overlap each other along the arrow Y gradually move toward each other in a solid phase without being melted. Metal bond.

  Thus, the core wires 4 are joined to each other by so-called ultrasonic bonding (also referred to as ultrasonic welding). Thus, in the ultrasonic bonding apparatus 1, the control circuit 14 ultrasonically vibrates the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10 along the arrow T as one direction to the first bonding apparatus 25. , The core wires of the plurality of electric wires 2 between the tip 9 and the anvil 10 along the arrow Y as another direction that intersects (orthogonally in the illustrated example) the arrow T with the second joining device 28. Ultrasonic vibration is applied across 4 and the core wires 4 of the plurality of electric wires 2 are joined together.

  The control circuit 14 extends the telescopic rod 20 of the hydraulic cylinder 12 with a predetermined pressure, vibrates the piezoelectric vibrator 8 for a predetermined time, and the displacement sensor 13 has a predetermined displacement amount. When it is detected that the second anvil 27 or the like has moved, the vibration of the piezoelectric vibrator 8 of the second joining device 28 is stopped, the restriction on the movement of the fixing member is released, and the second chip 26, the second anvil 27, Keep them away from each other. In this way, the plurality of electric wires 2 in which the bonding between the core wires 4 is completed are removed from the electric wire holding jig 6, and the above-described configuration is repeated to bond the core wires 4 of the next plurality of electric wires 2.

  According to the present embodiment, as in the first embodiment described above, after applying ultrasonic vibration by sandwiching the core wires 4 of the plurality of electric wires 2 between the chip 9 and the anvil 10 along the arrow T, Since ultrasonic vibration is applied along the arrow Y intersecting the arrow T with the core wires 4 of the plurality of electric wires 2 sandwiched between the chip 9 and the anvil 10, they are arranged along both the arrows T and Y described above. The core wires 4 of the plurality of electric wires 2 can be reliably bonded to each other. For this reason, it is not necessary to arrange the electric wires 2 only in one direction, and the core wires 4 of many electric wires 2 can be joined at a time. Therefore, the core wires 4 of the plurality of electric wires 2 can be reliably bonded without limiting the number of the electric wires 2 that can be bonded at a time.

  Moreover, according to this embodiment, the 1st joining apparatus 25 and the 2nd joining apparatus 28 with which the direction which pinches | interposes the core wire 4 of the some electric wire 2 are mutually orthogonally crossed between the chip | tips 9 and 25 and the anvils 10 and 28 are provided. Therefore, by applying ultrasonic vibration to the core wires 4 of the plurality of electric wires 2 described above in order by the joining devices 25 and 28, the core wires 4 of the plurality of electric wires 2 are aligned along the arrows T and Y intersecting each other. Ultrasonic vibration can be applied. For this reason, the core wires 4 of the plurality of electric wires 2 arranged along both the arrows T and Y can be reliably joined.

  In the above-described embodiment, the arrows T and Y are orthogonal to each other. However, in the present invention, the arrows T and Y may cross each other.

  Further, the above-described embodiments are merely representative forms of the present invention, and the present invention is not limited to the embodiments. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Ultrasonic bonding apparatus 2 Electric wire 3 Covering part 4 Core wire 7 Rotating mechanism 9 Tip 10 Anvil 25 First bonding apparatus 26 Second chip 27 Second anvil 28 Second bonding apparatus T One direction Y Other direction P Axis core

Claims (5)

In the wire joining method of joining the core wires of the plurality of wires, sandwiching the exposed core wire between the tip and the anvil which are ultrasonically vibrated by removing a part of the covering portion of each of the plurality of wires,
After applying ultrasonic vibration by sandwiching core wires of a plurality of electric wires between the tip and the anvil along one direction, the tip and the anvil along another direction intersecting the one direction A method for joining electric wires, wherein ultrasonic vibrations are applied between core wires of a plurality of electric wires to join the core wires of the plurality of electric wires. In an ultrasonic bonding apparatus comprising a chip that is ultrasonically vibrated and an anvil that sandwiches an exposed core wire from which a part of a covering portion of each of the plurality of electric wires is removed between the chip,
An ultrasonic bonding apparatus comprising: a rotation mechanism that relatively rotates the tip and anvil and the plurality of electric wires around an axis that passes through a center between the plurality of electric wires.   The ultrasonic bonding apparatus according to claim 2, wherein the rotation mechanism rotates the plurality of electric wires.   The ultrasonic bonding apparatus according to claim 2, wherein the rotation mechanism rotates the tip and the anvil. A first joining device comprising: a chip that is ultrasonically vibrated; and an anvil that sandwiches an exposed core wire from which a portion of the covering portion of each of the plurality of electric wires is removed between the chip and the chip;
A part of each of the plurality of electric wires is removed and exposed between the second chip which is ultrasonically vibrated and the second chip, and is sandwiched between the chip and the anvil of the first joining device. A second anvil that sandwiches the core wire, and the direction in which the second tip and the second anvil sandwich the core wire of the plurality of wires is such that the tip and the anvil of the first joining device are the plurality of An ultrasonic bonding apparatus comprising: a second bonding apparatus that intersects a direction in which the core of the electric wire is sandwiched.

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