JP2010211203A - Fixing member and method for manufacturing the member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fixing member including an interface layer, and a method for forming the fixing member. <P>SOLUTION: The fixing member includes: a substrate; an elastic layer disposed on the substrate; an interface layer disposed on the elastic layer, the interface layer containing a plurality of diamond-containing particles dispersed in a polymer matrix; and a surface layer disposed on the interface layer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates generally to interfacial layers, and more particularly to diamond-containing interfacial layers and related members used in electrophotographic devices, and methods for making diamond-containing interfacial layers and related members.

  In electrophotography (also known as xerography, electrophotographic imaging, or electrostatographic imaging), the imaging process involves forming a visible toner image on a support surface (eg, a sheet of paper). Including. This visible toner image is often transferred from a photoreceptor containing an electrostatic latent image and is typically fixed or melt-fixed on a support surface using a fuser to form a permanent image. Is done. For example, the fuser can include a surface release layer made of a fluoroplastic (eg, fluoroalkoxy (PFA) or polytetrafluoroethylene (PTFE)) covering an elastic silicone rubber layer. Fluoroplastic surfaces can enable oilless melt fusing, and conformable silicone rubber layers can allow rough paper fusing, low mottle and good uniformity. it can. In some fusers, a primer layer such as a tie layer is used between the silicone rubber layer and the surface release layer to facilitate adhesion between them.

  Fluoroplastics are often crystalline materials and require high firing temperatures (typically above 300 ° C.) to form a film. However, problems arise because the underlying silicone rubber begins to decompose at about 250 ° C. Therefore, even if the formation process conditions such as the firing temperature, the temperature rise, and the type and thickness of the primer layer can be adjusted as desired, it is difficult to obtain a uniform fixing film without defects.

US Patent Application Publication No. 2008/0152405

  Accordingly, there is a need to overcome these and other problems of the prior art and to provide an interfacial composite layer in a fuser member and a method for forming the interfacial composite layer and the fuser member. Has been.

  According to various embodiments, the present teachings include a fuser member. In one embodiment, the fuser member can include a substrate, an elastic layer, an interface layer, and a surface layer. A surface layer can be disposed on the elastic layer disposed on the substrate. An interfacial layer can be disposed between the surface layer and the elastic layer, and the elastic layer can include a plurality of diamond-containing particles dispersed within a polymer matrix.

  According to various embodiments, the present teachings also include a method for manufacturing a fuser member. In this method, the composite dispersion can be formed to include a plurality of diamond-containing particles and a polymer. The composite dispersion can then be deposited on the elastic layer to form an interface layer, which is formed on the substrate. A second dispersion can be applied to the formed interfacial layer and it can be treated at a temperature of about 250 ° C. or higher to form a surface layer on the interfacial layer.

  Additional objects and advantages of the invention will be set forth in part in the description that follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objects and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the appended claims.

  Both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

According to the present invention, a substrate, an elastic layer disposed on the substrate, an interfacial layer including a plurality of diamond-containing particles dispersed in a polymer matrix disposed on the elastic layer, A fuser member is provided that includes a surface layer disposed over the interface layer.
The polymer matrix of the interface layer is one or more selected from the group consisting of silicone elastomers, fluoropolymers, polyperfluoroethers, fluorinated polyethers, fluorinated polyimides, fluorinated polyether ketones, fluorinated polyamides or fluorinated polyesters. The polymer may be included.
The plurality of diamond-containing particles may include at least 60% by weight of diamond, and the diamond may include natural diamond, synthetic diamond, or a combination thereof.
According to the present invention, there is also provided a method for manufacturing a member, wherein a composite dispersion including a plurality of diamond-containing particles and a polymer is formed, and the composite dispersion is formed on a substrate. Depositing on the elastic layer to form an interface layer; applying a second dispersion on the interface layer; and applying the applied second dispersion at a temperature of 250 ° C. or higher. Treating to form a surface layer on the interfacial layer.

2 illustrates a portion of an exemplary fuser member in the present teachings. 2 is a schematic diagram illustrating an exemplary interface layer used in the fuser member of FIG. 1 in the present teachings. 1 is a schematic diagram illustrating an exemplary diamond structure. 2 illustrates an exemplary method for forming the fuser member of FIG. 1 in the present teachings.

  A fuser member containing an interfacial layer and a method for forming the interfacial layer and the fuser member are provided. In one embodiment, the fixing member can include a substrate, an elastic layer, a surface layer, and an interface layer disposed between the elastic layer and the surface layer. The elastic layer can include, for example, a silicone rubber layer, and the surface layer can include, for example, a fluoropolymer such as PFA or PTFE fluoroplastic. The interfacial layer can include a diamond-containing polymer composite. Therefore, the surface layer and the fixing member can be processed at a temperature of about 250 ° C. or higher.

  The term “fuser member” is used herein for purposes of explanation, but the term “fusing member” includes a fixing member, a pressure member, a heating member, and / or a donor member. Other members useful in (but not limited to) electrostatographic printing processes are also included in the scope. The “fuse member” may be in the form of, for example, a belt, plate, sheet, or roll.

  For example, various embodiments may also include an image drawing device that uses a fixing apparatus comprising a fixing member and a pressure member, wherein at least one of the fixing member and the pressure member is a polymer matrix. A single layer formed by dispersing a plurality of diamond-containing particles therein may be included. The image drawing apparatus receives an image applying member (for example, a photoconductor) for applying an image to a copy base material (paper sheet) and a copy base material having an image applied from the image applying member. And a fixing device for fixing the image to the copy substrate more permanently. A fuser member and a pressure member of the fuser device may define a nip between them for receiving a copy substrate therethrough.

  FIG. 1 illustrates a portion of an exemplary fuser member 100 in the present teachings. 1 represents a generalized schematic and other members / layers / coats / particles can be added, or existing members / layers / coats / particles can be removed or modified Those skilled in the art will readily understand that this is possible.

  As shown, the fixing member 100 can include a substrate 110, an elastic layer 120, an interface layer 130, and a surface layer 140. The surface layer 140 can be formed on the elastic layer 120, and the elastic layer 120 can be formed on the substrate 110. The disclosed interface layer 130 is formed between the elastic layer 120 and the surface layer 140 to provide desirable properties, such as thermal stability, for forming and / or using the fuser member 100 at a temperature of about 250 ° C. or higher. Can bring.

  The substrate 110 for the fixing member 100 of the present disclosure can be in the form of, for example, a belt, a plate, and / or a cylindrical drum. In various embodiments, the substrate 110 can include a variety of materials, such as metals, metal alloys, rubber, glass, ceramics, plastics, or fabrics. In additional examples, the metals used can include, for example, aluminum, anodized aluminum, steel, nickel, copper and mixtures thereof, and the plastics used can be polyimide, polyester, polyether ether, etc. Mention may be made of ketones (PEEK), poly (arylene ethers), polyamides and mixtures thereof. In certain embodiments, the substrate 110 can be, for example, an aluminum cylinder or aluminum fuser roll having a silicone rubber formed thereon.

  Elastic layer 120 can include, for example, a silicone rubber layer, and surface layer 140 can include, for example, a fluoroplastic such as PFA and / or PTFE, depending on the specific application. In various embodiments, materials and / or methods known to those skilled in the art for elastic and / or surface layers of conventional fuser members can be used for the fuser member 100 of the present disclosure. . In various embodiments, the surface layer 140 is made of, for example, polytetrafluoroethylene, a copolymer of tetrafluoroethylene and hexafluoropropylene, a copolymer of tetrafluoroethylene and perfluoro (propyl vinyl ether), a tetrafluoroethylene and perfluoro (ethyl vinyl ether). It may be a fluoropolymer including, but not limited to, a copolymer, a copolymer of tetrafluoroethylene and perfluoro (methyl vinyl ether), and a copolymer of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride.

  The interface layer 130 may be formed between the elastic layer 120 and the surface layer 140 to improve the film quality of the elastic layer 120 or the surface layer 140 and / or promote adhesion between them. In addition, interfacial layer 130 can provide improved thermal / electrical / mechanical properties due to the use of diamond-containing composites. Therefore, the service life of the fixing member 100 can be improved.

  In various embodiments, the interfacial layer 130 includes a plurality of diamond-containing particles dispersed within a polymer matrix to provide improved thermal stability, mechanical robustness and / or conductivity of the fuser member 100. be able to. In various embodiments, the interfacial layer 130 can thermally and / or mechanically protect the elastic layer 120 during formation and / or use of the member 100. For example, when the member 100 such as the surface layer 140 formed on the interface layer 130 is processed at a temperature of about 250 ° C. or more, the occurrence of defects in the elastic layer 120 is reduced due to the interface layer 130 thereover. And / or can be eliminated.

  As used herein, the “polymer matrix” used for the interfacial layer 130 is one or more chemically or physically cross-linked polymers such as thermoplastics, thermoelastomers, resins, polyperfluoroether elastomers, silicone elastomers. , Thermosetting polymers or other cross-linked materials. In various other embodiments, the polymer can be, for example, a fluoroelastomer (eg, Viton), a fluorinated thermoplastic (eg, fluorinated polyether, fluorinated polyimide, fluorinated polyetherketone, fluorinated polyamide, or fluorine). Fluorinated polymers (ie, fluoropolymers), including but not limited to fluorinated polyesters. In various embodiments, one or more crosslinked polymers may be semi-soft and / or melted for mixing with diamond-containing particles.

  In various embodiments, the polymer matrix can be, for example, from the group consisting of tetrafluoroethylene, perfluoro (methyl vinyl ether), perfluoro (propyl vinyl ether), perfluoro (ethyl vinyl ether), vinylidene fluoride, hexafluoropropylene, and mixtures thereof. Mention may be made of fluoroelastomers having a monomer repeating unit selected.

  Examples of commercially available fluoroelastomers include Viton A (registered trademark) (a copolymer of hexafluoropropylene (HFP) and vinylidene fluoride (VDF or VF2)), Viton (registered trademark) -B (tetrafluoroethylene (TFE) and fluorine. Terpolymer of vinylidene fluoride (VDF) and hexafluoropropylene (HFP)), and Viton®-GF (a terpolymer comprising TFE, VF2, HFP, and brominated peroxide crosslinking site), and Viton Examples include E (registered trademark), Viton E60C (registered trademark), Viton E430 (registered trademark), Viton 910 (registered trademark), Viton GH (registered trademark), and Viton GF (registered trademark). The designation Viton (registered trademark) is E.I. I. DuPont de Nemours, Inc. Trademark. Still other commercially available fluoroelastomers can include, for example, Dyneon ™ fluoroelastomer from 3M Company. Further commercially available materials include Aflas® poly (propylene-tetrafluoroethylene) and Fluorel II® (LII900) poly (propylene-tetrafluoroethylene vinylidene fluoride) (both of which are available from 3M Company) And For-60KIR®, For-LHF®, NM®, For-THF®, For-TFS®, TH® available from Solvay Solexis And technoflon certified as TN505®.

  In one embodiment, the polymer matrix includes effective curing agents including, but not limited to, bisphenol compounds, diamino compounds, aminophenol compounds, amino-siloxane compounds, amino-silanes and phenol-silane compounds. Mention may be made of vinylidene fluoride-containing fluoroelastomers cross-linked with (also referred to herein as cross-linking agents, binders or cross-linking agents).

  Exemplary bisphenol crosslinking agents include E.I. I. du Pont de Nemours, Inc. Viton® Curative No. available from 50 (VC-50). Curative VC-50 can contain Bisphenol-AF as a crosslinking agent and diphenylbenzylphosphonium chloride as an accelerator. Bisphenol-AF is also known as 4,4 '-(hexafluoroisopropylidene) diphenol.

  Crosslinked fluoropolymers can form elastomers that are relatively soft and elastic. In certain embodiments, the polymer matrix used in the interfacial layer includes Viton-GF (including tetrafluoroethylene (TFE), hexafluoropropylene (HFP), vinylidene fluoride (VF2), and brominated peroxide crosslinking points. (Registered trademark) (EI du Pont de Nemours, Inc.).

  In various embodiments, the polymer matrix for the interfacial layer 130 includes polytetrafluoroethylene, a copolymer of tetrafluoroethylene and hexafluoropropylene, a copolymer of tetrafluoroethylene and perfluoro (propyl vinyl ether), tetrafluoroethylene and perfluoro ( Mention may be made of fluororesins including but not limited to copolymers of ethyl vinyl ether) and copolymers of tetrafluoroethylene and perfluoro (methyl vinyl ether). In various embodiments, the polymer matrix can include a cured silicone elastomer.

  FIG. 2 is a schematic diagram illustrating an exemplary interface layer 130A used in the fuser member in FIG. 1 of the present teachings. 2 represents a generalized schematic and that other particles / fillers / layers can be added, or existing particles / fillers / layers can be removed or modified Will be readily apparent to those skilled in the art.

  In FIG. 2, a plurality of diamond-containing particles 135 can be dispersed in an exemplary polymer matrix 132. In various embodiments, a plurality of diamond-containing particles 135 can be dispersed in a uniform and spatially controlled manner throughout the polymer matrix 132 of the interface layer 130A.

  In various embodiments, the matrix polymer material 132 can comprise at least 60% by weight of the interfacial layer 130 (A), and in one embodiment at least about 80% by weight or at least about 90% by weight. The plurality of diamond-containing particles 135 is at least about 0.01% by weight of the interface layer 130 (A), and in some embodiments, at least about 0.5% or at least about 1% of the interface layer 130 (A). It can be weight percent. In various embodiments, the diamond-containing particles 135 can be present in the interface layer 130 at about 20% by weight or less, for example, about 10% by weight or less of the interface layer 130.

  In various embodiments, the diamond-containing particles 135 can include nanodiamond particles, diamond particles having a size in the nanometer range. It should be noted that the size range may vary depending on the individual application or the configuration of the individual members. However, in one embodiment, the nanodiamond particles can be sized in the range of about 1000 nm (1 micrometer) or less. In another embodiment, the nanodiamond particles can be sized in the range of about 1 nm to about 100 nm. In yet another embodiment, the nanodiamond particles can be sized in the range of about 10 nm to about 500 nm.

As used herein, the average particle size may be any inherent dimension of the diamond-containing particles (or other filler particles) based on their particle shape, eg, median by weight as known to those skilled in the art. It refers to the average size of the particle size (d ₅₀ ). For example, the average particle size may be given by the diameter of a substantially spherical particle, or for irregularly shaped particles by the nominal diameter. Further, the shape of the particles is not limited to any shape. Such nanoparticles can take a variety of cross-sectional shapes including circular, oval, square, euhedral and the like.

  In various embodiments, the diamond-containing particles 135 are, for example, nanospheres, nanotubes, nanofibers, nanoshafts, nanopillars, nanowires, nanorods and nanoneedles and their various functionalized and derivatized fibril forms (threads). , Including nanofibers having typical forms such as yarns, fabrics, and the like. In various other embodiments, the diamond-containing particles can be, for example, in the form of spheres, whiskers, rods, filaments, cage structures, buckyballs (eg, Buckminsterfullerene), and mixtures thereof.

  In various embodiments, the diamond-containing particles, ie nanodiamond particles, can have a particle hardness of at least about 9 on a Mohs hardness scale, and in some embodiments, from at least about 9.7 to pure diamond. Can have a particle hardness of 10 (this is the maximum value on a Mohs hardness scale).

  In addition to having a Mohs hardness greater than 9, the nanodiamond particles can have a thermal conductivity that facilitates heat transfer through the interface layer 130 (A) of the member 100. Specifically, the diamond-containing particles 135 can increase the thermal conductivity of that layer compared to a layer without diamond particles. Where heat conduction depends only on the temperature gradient, the thermal conductivity is the amount of heat conducted due to the temperature gradient in a direction perpendicular to the surface of the unit area under steady conditions per unit time. The increase in the thermal conductivity of this interface layer 130 (A) compared to that of the conventional layer of the fixing member allows the fixing member 100 to warm up more quickly. For example, silicone rubber and Teflon® generally have a relatively low thermal conductivity of about 0.002 W / cm · K, but the thermal conductivity of diamond is at room temperature, depending on its purity, It can vary from about 6 to about 50 W / cm · K. The amount by which the diamond particles increase the thermal conductivity of the interfacial layer 130 can depend on the concentration and size of the particles and the purity of the particles. In this way, the thermal conductivity of the interface layer 130 can be increased over that of the comparative layer utilizing conventional materials of similar loading and particle size.

Diamond-containing particles 135 can be formed from natural or synthetic diamond or combinations thereof. In general, natural diamond has a face-centered cubic crystal structure in which carbon atoms are tetrahedrally bonded, known as sp ³ bonds. Specifically, each carbon atom can be surrounded and bonded to other four carbon atoms, each located at the tip of a regular tetrahedron. Furthermore, the bond length between any two carbon atoms is 1.54 angstroms at ambient temperature conditions, and the angle between any two bonds is 109 degrees. The density of natural diamond is about 3.52 g / cm ³ . A diagram of carbon atoms bonded in a regular or tetrahedral structure is shown in FIG. In one embodiment, nanodiamonds can be produced, for example, by detonation of a diamond blend followed by chemical purification.

  Synthetic diamonds are industrially produced diamonds formed by chemical or physical processes such as chemical vapor deposition or high pressure. Similar to naturally occurring diamonds, synthetic diamonds can include three-dimensional carbon crystals. It should be noted that synthetic diamond is not the same as diamond-like carbon, which is an amorphous form of carbon.

  Examples of synthetic diamond that may be useful in exemplary embodiments may include polycrystalline diamond and metal bonded diamond. Polycrystalline diamond can be grown by chemical vapor deposition, for example, as a flat wafer having a thickness of about 5 mm or less and a diameter of about 30 cm, or in some cases as a three-dimensional shape. Polycrystalline diamond can have a popcorn-like structure. The diamond can be completely transparent but is usually black. The crystal structure may be octahedral. Synthetic diamond in metal bonded form can be formed by pressing a mixture of graphite and metal powder at high pressure for a long period of time. For example, nickel / iron-based metal bonded diamond is produced by placing graphite and nickel iron blend powder in a high pressure high temperature (HPHT) press for a period sufficient to form a product resembling natural diamond. . Other metals such as cobalt can also be used. After the diamond is removed from the press, it is subjected to a grinding process. Chemical and thermal cleaning processes can be utilized to polish the surface. It can then be micronized to produce the desired size range. The particles thus formed can be flakes or small debris that do not have a consistent shape. The crystal structure may be a single crystal, similar to natural diamond.

  Diamond-containing particles 135 can be formed primarily from diamond, natural or synthetic diamond. That is, the diamond-containing particles can comprise at least 50% diamond, generally can comprise at least 80%, or at least 90% diamond, and in some embodiments can comprise at least 95% diamond, others In this embodiment, it may contain more than 99% diamond, such as pure diamond. Specifically, the diamond-containing particles can include at least about 50% by weight crystalline carbon, and in some embodiments can include at least 80% or at least 90% or at least 95% crystalline carbon.

In various embodiments, the nanodiamond particles may be commercially available in the form of a powder or dispersion (eg, from NANOBLOX, Inc. (Boca Raton, FL)). For example, raw nanodiamond black (NB50) may have 50% sp ³ carbon and 50% sp ² carbon (sp ³ core and sp ² envelope, BET ˜460 m ² / g); and nano diamond gray (NB90) may have 90% sp ³ carbon and 10% sp ² carbon.

In various embodiments, a plurality of diamond-containing particles 135, namely nanodiamonds, can be surface modified to provide a functional surface. That is, the diamond surface can be chemically adjusted to improve the characteristics. In some embodiments, the nanodiamond particles can comprise a chemically inert diamond hard core having a chemically active surface. The active diamond surface contains a series of functional chemical groups including but not limited to methyl, —OH, —COOH, —NH ₂ or quaternized amino groups that can be directly linked to the carbon structure. be able to. In one embodiment, the active surface can include about 76% C, about 6% O, and about 10% N. In various embodiments, metal modified nanodiamonds may also be commercially available, see, for example, Nanoblox, Inc. of Boca Raton, Florida. Is supplied by Examples of metals that can be used to modify the diamond-containing particles include, but are not limited to, Cu, Fe, Ag, Au, and AI.

  With reference to FIG. 2, using diamond-containing particles 135 as a filler material dispersed in a polymer matrix 132, physical properties such as, for example, thermal conductivity / conductivity and / or mechanical robustness of the resulting polymer matrix. The physical properties can be substantially controlled, for example enhanced. The resulting material can be used, for example, as a fusing material in various fusing subsystems and embodiments.

  In various embodiments, the interfacial layer 130 can further include other fillers, such as inorganic particles, in the diamond-containing composite dispersion. In various embodiments, the inorganic particles can include, but are not limited to, metal oxides, non-metal oxides, metals or other suitable particles. Specifically, as the metal oxide, for example, silicon oxide, aluminum oxide, chromium oxide, zirconium oxide, zinc oxide, tin oxide, iron oxide, magnesium oxide, manganese oxide, nickel oxide, copper oxide, antimony pentoxide, Mention may be made of indium tin oxide and mixtures thereof. Examples of the nonmetal oxide include boron nitride and silicon carbide (SiC). Examples of the metal include nickel, copper, silver, gold, zinc, and iron. In various embodiments, other additives known to those skilled in the art can also be included in the diamond-containing coating composite.

  In various embodiments, a diamond / polymer composite dispersion can be used to form the interface layer 130 of the present disclosure. The composite dispersion may be, for example, a plurality of diamond-containing particles, one or more polymers and / or solvents effective to disperse the corresponding curing agent, and possibly inorganic filler particles or It can be prepared to include a surfactant.

  Effective solvents can include, but are not limited to, methyl isobutyl ketone (MIBK), acetone, methyl ethyl ketone (MEK), and mixtures thereof. Other solvents that can form suitable dispersions can be within the scope of the embodiments herein.

  Accordingly, various embodiments can include a method for forming a fuser member 100 in accordance with the present teachings. During formation, various layer forming techniques, such as coating techniques, extrusion techniques, and / or molding techniques, may be used to form the elastic layer 120 on the substrate 110 and elastic to form the interfacial layer 130. It can be applied to the layer 120 and / or to the interface layer 130, respectively, to form the surface layer 140.

  As used herein, the term “coating technique” refers to a technique or process for applying, forming, or depositing a dispersion on a material or surface. Therefore, the term “coating” or “coating technique” is not particularly limited to this technique, and dip coating, painting, brush coating, roll coating, danpozuri, spray coating, spin coating, casting or casting. A fill may be used. For example, the composite dispersion for forming the interface layer 130 and the second dispersion for forming the surface layer 140 are applied onto the elastic layer 120 and the formed interface layer 130 by spray coating with an air brush. Each can be applied. In various embodiments, gap coating can be used to apply a flat substrate such as a belt or plate, whereas flow coating is applied to a drum or fuser roll or fuser member base. It can be used for coating cylindrical substrates such as materials.

  In various embodiments, the fuser member 100 of the present disclosure includes an interface layer 130 having a thickness of about 0.1 micrometer to about 100 micrometers, a surface layer 140 having a thickness of about 1 micrometer to about 200 micrometers, And an elastic layer 120 having a thickness of about 2 micrometers to about 10 millimeters.

  FIG. 4 illustrates an exemplary method 200 for forming the fuser member 100 of FIG. 1 in accordance with the present teachings. Although the method 200 of FIG. 4 is illustrated as a series of operations or events and described below, it will be understood that the invention is not limited to the described order of such operations or events. For example, some operations may be performed in a different order and / or concurrently with other operations or events in addition to those described and / or described herein. Moreover, not all described steps may be required to implement a methodology in accordance with one or more aspects or embodiments of the invention. Further, one or more of the operations described herein can be performed in one or more separate operations and / or phases.

  At 210 in FIG. 4, a composite dispersion comprising a plurality of diamond-containing particles and a polymer can be formed. For example, the composite dispersion may include a fluoropolymer (eg, Viton), diamond-containing particles, a curing agent (eg, bisphenol curing agent VC-50), and optionally an inorganic filler (eg, MIBK) in an inorganic solvent (eg, MIBK). , MgO).

  At 220, the diamond / polymer composite dispersion can be deposited, coated, or extruded over the elastic layer. In various embodiments, an elastic layer (see also 120 in FIG. 1) can be formed on a substrate of a conventional fuser member (see also 110 in FIG. 1), for example illustrated on that substrate. It can be formed by molding a typical silicone rubber. The disclosed composite dispersion can then be flow-coated, for example, over the exemplary silicone rubber layer and allowed to partially or fully evaporate over a period of time before being subjected to a curing process to provide an interfacial layer. (See also 130 in FIGS. 1-2). This curing process can be determined by the polymer and curing agent used.

  Examples of the curing process for forming the interface layer 130 include a stepwise curing process. In an exemplary embodiment, the coated / extruded / formed diamond / polymer composite dispersion can be placed in a convection oven at about 49 ° C. for 2 hours, and this temperature is increased to about 177 ° C. And can be further cured for about 2 hours, the temperature can be raised to about 204 ° C., the coating can be further cured at this temperature for about 2 hours, and finally the The temperature can be raised to about 232 ° C. and the coating can be cured for an additional 6 hours. Other cure schedules may be possible. Curing schedules known to those skilled in the art may be within the scope of the embodiments herein.

  At 230, the surface layer (see also 140 in FIG. 1) is applied by applying a second dispersion to the deposited and / or hardened diamond / polymer composite, followed by a heat treatment at 240 in FIG. Can be formed. For example, after a curing process to form an interfacial layer, a fluoroplastic dispersion prepared from PFA can be deposited on the formed interfacial layer, for example, by spraying or powder coating techniques. The surface layer can then be fired at a high temperature of about 250 ° C. or higher, for example, about 350 ° C. to about 360 ° C.

  In various embodiments, during the creation of the interfacial layer 130, for example, at operation 220 of FIG. 4, the solvent or dispersion of the diamond / polymer composite and / or the deposits on the underlying elastic layer 120 The residence time can be controlled to obtain a high film-forming quality for the interface layer 130 and to obtain the desired interface adhesion between the layers of the fuser member 100.

  In various embodiments, the interfacial layer 130 and surface layer 140 firing (or curing) processes can be combined in creating the interfacial layer 130 and the surface layer 140 on the elastic layer 120.

  In this manner, the interface layer 130 can provide high temperature thermal stability and mechanical robustness, so that the surface layer 140 can be fired or cured at high temperatures to provide, for example, the underlying elastic layer 120 and the formed surface layer 140. The fixing member 100 can be provided with high quality without causing any defects therein. In addition, due to the interface layer 130, the fuser member 100 can have, for example, improved interlayer adhesion, deposit stability, improved thermal conductivity, improved conductivity, and long lifetime. it can.

  Example 1-Preparation of interface layer containing diamond / Viton composite

A composite coating dispersion was made by grinding nanodiamonds and Viton in methyl isobutyl ketone (MIBK) organic solvent using a 2 mm stainless steel shot at 200 rpm for 18 hours. The diamond / Viton nanocomposite dispersion, 10 weight% of nanodiamonds NB90 (Florida, Boca Raton Nanoblox, available from Inc., 90% of sp ³ carbon and 10 percent of sp ² carbon atoms) and 89 wt% Viton® GF as well as 1 wt% bisphenol curing agent VC-50 (Viton® Curative No. 50 available from EI du Pont de Nemours, Inc., Wilmington, Del.). Included.

  After filtration through a 20 μm nylon cloth, uniform nanocomposite dispersions were obtained, which were then coated onto an exemplary glass plate by a draw bar coating process to form a film.

  About 2 hours, about 49 ° C., and about 2 hours, about 177 ° C., then about 2 hours, about 204 ° C., and then about 6 hours for post-curing after the nanocomposite dispersion application process The curing process was performed at a step temperature of about 232 ° C.

  As a result, a 20 μm thick nanocomposite film was obtained and examined to have a uniform surface.

  Example 2 Preparation of Fixing Member

  The interfacial layer was cast or dip coated on the conventional silicone rubber layer of the fuser roll and then cured. A PFA topcoat was used as the surface layer, which was placed on top of the interfacial layer formed in Example 1 with PFA (TE-7224 available from EI du Pont de Nemours, Inc., Wilmington, Del.). ) Prepared by spraying or powder-coating the aqueous dispersion followed by firing at a high temperature of about 350 ° C. for 10 minutes.

  Example 3-Surface resistivity of interface layer

Using a High Resistivity Meter (Hiresta-Up MCP-HT450, manufactured by Mitsubishi Chemical Co., Ltd. (Tokyo, Japan)), the surface resistivity of the interface layer formed in Example 1 was determined for various coatings. Measurements were made at various locations at a temperature of about 72 ° F. (about 22.2 ° C.) and a room humidity of about 65%. The results are shown in Table 1.

  As shown, the interfacial layer tested was about 6 orders of magnitude more conductive than the pure Viton layer.

DESCRIPTION OF SYMBOLS 100 Fixing member 110 Base material 120 Elastic layer 130, 130 (A) Interface layer 140 Surface layer 132 Polymer matrix 135 Exemplary diamond-containing particles

Claims (4)

A substrate;
An elastic layer disposed on the substrate;
An interfacial layer comprising a plurality of diamond-containing particles dispersed in a polymer matrix disposed on the elastic layer;
A surface layer disposed on the interface layer;
A fixing member.   One or more selected from the group consisting of silicone elastomers, fluoropolymers, polyperfluoroethers, fluorinated polyethers, fluorinated polyimides, fluorinated polyether ketones, fluorinated polyamides or fluorinated polyesters. The member according to claim 1, comprising:   The member of claim 1, wherein the plurality of diamond-containing particles comprises at least 60 wt% diamond, and the diamond comprises natural diamond, synthetic diamond, or combinations thereof. A method for manufacturing a member, comprising:
Forming a composite dispersion comprising a plurality of diamond-containing particles and a polymer;
Attaching the composite dispersion on an elastic layer formed on a substrate to form an interface layer;
Providing a second dispersion on the interface layer;
Treating the applied second dispersion at a temperature of 250 ° C. or higher to form a surface layer on the interface layer;
Including methods.

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