JP2010210544A5 - - Google Patents
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- JP2010210544A5 JP2010210544A5 JP2009058981A JP2009058981A JP2010210544A5 JP 2010210544 A5 JP2010210544 A5 JP 2010210544A5 JP 2009058981 A JP2009058981 A JP 2009058981A JP 2009058981 A JP2009058981 A JP 2009058981A JP 2010210544 A5 JP2010210544 A5 JP 2010210544A5
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- housing
- circuit board
- pressure sensor
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 230000010355 oscillation Effects 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims 2
- 238000009412 basement excavation Methods 0.000 description 3
- 239000003673 groundwater Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Description
本発明は、上述の課題を少なくとも一部を解決するためになされたものであり、以下の適用例として実現することが可能である。
［適用例１］ 開口を有しているハウジングと、前記ハウジングの前記開口を封止し、受圧面を有しているダイアフラムと、を備え、前記ハウジング内に、前記ダイアフラムに接続されている力伝達手段と、前記力伝達手段と前記ハウジングとに接続されている感圧素子と、前記受圧面側から平面視して、前記受圧面と重なる位置に配置されている回路基板と、を備えていることを特徴とする圧力センサー。
前記回路基板は、平板に切欠を有する形状とすることができる。また、前記回路基板は、回路基板に少なくとも一つの発振回路を含んでいればよい。更に、前記回路基板は、前記発振回路を含んでいる回路基板を複数備えている構成とすることができる。
前記発振回路は、前記感圧素子を駆動させるための発振回路、または、前記感圧素子の温度補償用温度センサーを駆動させるための発振回路とすればよい。前記ハウジング内の中間部に、前記中間部を封止している別のダイアフラムを備え、前記力伝達手段は前記ダイアフラムと前記別のダイアフラムとに接続されている構成とすることができる。加えて、前記感圧素子と前記力伝達手段とが同軸上に配置されていればよい。
SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
And Application Example 1 are closed the aperture housing, to seal the opening of said housing, comprising: a diaphragm having a pressure receiving surface, and within said housing, a force which is connected to the diaphragm A transmission means; a pressure-sensitive element connected to the force transmission means and the housing; and a circuit board disposed in a position overlapping the pressure receiving surface in plan view from the pressure receiving surface side. A pressure sensor characterized by
The circuit board may have a shape having a notch in a flat plate. The circuit board only needs to include at least one oscillation circuit in the circuit board. Furthermore, the circuit board may be configured to include a plurality of circuit boards including the oscillation circuit.
The oscillation circuit may be an oscillation circuit for driving the pressure-sensitive element or an oscillation circuit for driving a temperature compensation temperature sensor for the pressure-sensitive element. An intermediate portion in the housing may be provided with another diaphragm that seals the intermediate portion, and the force transmission means may be connected to the diaphragm and the another diaphragm. In addition, it is only necessary that the pressure sensitive element and the force transmission means are arranged on the same axis.
上記構成としたことにより、回路基板はダイアフラム受圧面と重なる位置に配置されるので、ハウジングの内径はダイアフラムにより規制されるだけとなり、ハウジングの細径化を実現することができる。この結果、例えば、地下水圧検知のために掘削管の内部に圧力センサーを配置した検査を行うことに適用すると、掘削管の直径寸法を小さくすることができるので掘削工事のためのコストの低減化が図れるものとなる。 With the above configuration, the circuit board is disposed at a position overlapping the diaphragm pressure receiving surface, so that the inner diameter of the housing is only restricted by the diaphragm, and the housing can be reduced in diameter. As a result, for example, when applied to an inspection in which a pressure sensor is arranged inside the excavation pipe for detecting groundwater pressure, the diameter dimension of the excavation pipe can be reduced, thereby reducing the cost for excavation work. Can be achieved.
［適用例４］前記発振回路基板は前記感圧素子を駆動する発振回路基板であることを特徴とする適用例２〜３のいずれか１に記載の圧力センサー。
これにより、駆動回路を有する圧力センサーとすることができる。
Application Example 4] The oscillator circuit board pressure sensor according to any one of the suitable examples 2-3, characterized in that the oscillator circuit board for driving the pressure-sensitive element.
Thereby, it can be set as the pressure sensor which has a drive circuit.
Claims (7)
前記ハウジングの前記開口を封止し、受圧面を有しているダイアフラムと、
を備え、
前記ハウジング内に、
前記ダイアフラムに接続されている力伝達手段と、
前記力伝達手段と前記ハウジングとに接続されている感圧素子と、
前記受圧面側から平面視して、前記受圧面と重なる位置に配置されている回路基板と、
を備えていることを特徴とする圧力センサー。 A housing which possess an opening,
And sealing the opening of the housing, the diaphragm having a pressure receiving surface,
Equipped with a,
In the housing ,
Force transmitting means connected to the diaphragm;
A pressure sensitive element connected to the force transmitting means and the housing ;
A circuit board disposed in a position overlapping the pressure receiving surface in plan view from the pressure receiving surface side;
A pressure sensor characterized by comprising:
前記力伝達手段は前記ダイアフラムと前記別のダイアフラムとに接続されていることを特徴とする請求項１に記載の圧力センサー。The pressure sensor according to claim 1, wherein the force transmission unit is connected to the diaphragm and the another diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009058981A JP2010210544A (en) | 2009-03-12 | 2009-03-12 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009058981A JP2010210544A (en) | 2009-03-12 | 2009-03-12 | Pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010210544A JP2010210544A (en) | 2010-09-24 |
| JP2010210544A5 true JP2010210544A5 (en) | 2012-04-26 |
Family
ID=42970859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009058981A Withdrawn JP2010210544A (en) | 2009-03-12 | 2009-03-12 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010210544A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014153335A (en) * | 2013-02-13 | 2014-08-25 | Seiko Epson Corp | Pressure sensor, liquid level gauge and alarm system |
| CN105606267B (en) * | 2015-12-31 | 2018-06-12 | 中国船舶重工集团公司第七○二研究所 | The measuring device and method of explosive underwater explosion power |
-
2009
- 2009-03-12 JP JP2009058981A patent/JP2010210544A/en not_active Withdrawn
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