JP2010203778A - Connection device and connection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To speedily and certainly detect leakage of gas or liquid by a relatively simple inspection unit independent from a piping system of a semiconductor production apparatus even when piping for supplying or discharging with relatively less importance or risk on human bodies and environment. <P>SOLUTION: The connection device 1 includes a pipe support 10 which has an easily breakable conductive part 11 and forms a continuity loop of the conductive part by supporting connected piping and a breakage detection part 20 which is electrically connected to the conductive part 11 and electrically detects a breakage of the conductive part 11 based on disconnection of the continuity loop. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a connection device and a connection method that have a plurality of pipes and are used in a pipe system in which the pipes are connected to each other at a connection portion and support the connection between the pipes.

  2. Description of the Related Art A semiconductor device manufacturing apparatus is provided with a piping system having a wide variety of piping for supplying gas, water, chemicals, and the like, and exhausting and discharging. In the piping system, the pipes are connected by a connecting portion such as a flange portion. The sealing performance of pipes responsible for supply and discharge, etc., which are important for semiconductor manufacturing, or for supply and discharge with high risk, is strictly controlled. For example, in a metal pipe, a seal connection with a metal gasket is performed. Such a pipe is designed to detect immediately when a leak occurs in the gas or liquid inside the pipe.

  Specifically, in the case of gas piping, the pressure in the manufacturing apparatus is monitored to check for gas leaks, and when a gas leaks, the leak is detected by a gas detector provided in the vicinity of the manufacturing apparatus. Detect. In the case of liquid piping, a leakage sensor is installed on the floor near the piping so that the leakage can be detected.

On the other hand, piping that is responsible for supply and discharge, etc., which is not so important for semiconductor manufacturing in the device configuration, or piping that is responsible for supply and discharge with low risk (for example, piping for air exhaust, N ₂ , Ar, etc.) In the case of gas pipes that do not have this, the sealing performance is not so important. For example, a method of fixing the pipes by tightening a sleeve with a nut is adopted. In many cases, such pipes are not provided with a detection function for leakage of gas and liquid in consideration of installation costs.

JP 2004-309379 A JP-A-5-126960 Japanese Patent Laid-Open No. 9-425747 JP-A-7-294497

  In piping that is responsible for supply and discharge, etc. that are not so important for semiconductor manufacturing, or that is responsible for supply and discharge that is low in risk, there is little concern that the supply or discharge of gas or liquid adversely affects the human body and the environment. However, when a pipe drops out and a gas or liquid leaks, the quality may gradually deteriorate over a long time even if the abnormality does not immediately become apparent. In such cases, it can cause enormous damage. Therefore, it is considered necessary to detect gas or liquid leaks in these pipes from the standpoint of ensuring product quality assurance as well as consideration for the human body and environment when manufacturing semiconductors. It has been.

As an example of providing a gas or liquid leak detection mechanism in a pipe, the following technique is disclosed.
Patent Document 1 discloses a method of installing a gas detection function in a flange portion in order to detect a gas leak from the flange portion which is a joint between pipes. A material that changes color in response to gas is placed, or a gas detection prober is installed, and the detector signal is sent to the monitoring device for automatic detection.
Patent Document 2 discloses a method of monitoring exhaust pipe dropout using a magnet sensor.
Patent Document 3 discloses a method of preventing a nut from loosening by providing a hole in a nut portion of a pipe joint and fixing it through a wire.
Patent Document 4 discloses a method of detecting looseness of a pipe joint by a change in ultrasonic conduction. A transmitter and a receiver are attached to the pipe to monitor changes in transfer characteristics.

However, the technique as described above is to install a mechanism for detecting or preventing leakage of gas or liquid in the pipe itself.
As described above, in the piping system of the semiconductor manufacturing apparatus, piping that does not have a mechanism for detecting or preventing leakage of gas or liquid is provided in part. In a semiconductor manufacturing apparatus equipped with such a piping system, it is difficult to additionally install complicated mechanisms such as Patent Documents 1 to 4 as a retrofit, both on the software and hardware sides of the apparatus configuration. Cost is also expensive.

  The present invention has been made in view of the above-described problems, and constitutes a relatively simple inspection unit independent of an existing piping system, which is relatively less important, or relatively to the human body and the environment. To provide a highly convenient connection device and connection method that enables quick and reliable gas or liquid leak detection even when targeting piping that is responsible for supply and discharge of low risk Objective.

  One aspect of the connection device is a connection device used in a piping system having a plurality of pipes and in which the pipes are connected by a connection portion. The connection device includes an easily-breakable conductive part, supports the pipes around the connection part, and forms a conduction loop of the conductive part by the support, and the conductive part. A breakage detection unit that is electrically connected and electrically detects a breakage of the conductive part as a breakage of the conduction loop.

  One aspect of the connection method is a connection method used for a piping system that includes a plurality of pipes and in which the pipes are connected to each other at a connection portion. In this connection method, the pipes are supported around the connection part by a pipe support part having an easily breakable conductive part, and a conductive loop of the conductive part is formed by the support, and the connection part is connected. When the state changes and the pipes are separated from each other, the conductive portion is broken, and the break is electrically detected as a breakage of the conduction loop.

  According to the connection device or connection method described above, a relatively simple inspection unit is configured independently of the existing piping system, and is relatively low in importance or relatively low in danger to the human body and the environment. Even when the piping for supplying and discharging is targeted, it is possible to quickly and reliably detect a leak of gas or liquid.

It is a schematic diagram which shows the conventional connection method in piping which carries out the supply and discharge | emission etc. with comparatively low importance or comparatively low danger to a human body and an environment. It is a schematic diagram which shows an example of the condition where dropout arises in piping. It is a schematic diagram showing the structure principle of the connection apparatus by this embodiment. It is a schematic diagram showing the structure principle of the connection apparatus by this embodiment. It is a schematic diagram which shows the other example of the connection apparatus by this embodiment. It is a schematic diagram which shows the other example of the connection apparatus by this embodiment. It is a schematic diagram which shows a mode that piping is connected using the piping support part which is a component of the connection apparatus of 1st Embodiment. It is a schematic diagram which shows a mode that piping is connected using the piping support part which is a component of the connection apparatus of 1st Embodiment. It is a schematic diagram which shows the main structures of the connection apparatus which has a piping support part of FIG. It is a schematic diagram which shows the main structures of the connection apparatus by 2nd Embodiment. It is a schematic diagram which shows the main structures of the connection apparatus by 3rd Embodiment.

-Basic outline of this embodiment-
In describing this embodiment, first, the problems of the prior art were specifically considered.
FIG. 1 is a schematic diagram showing a conventional connection method in piping that is relatively low in importance or relatively responsible for supply and discharge with a low risk to the human body and the environment.
The pipe 101 a and the pipe 101 b are connected using a joint 102. The pipe 101a is fixed by a nut 104a through one end 102a of the joint 102 and a sleeve 103a, and the pipe 101b is fixed by a nut 104b through the other end 102b of the joint 102 and a sleeve 103b.

However, in this case, there is a concern that the connection of the pipes 101a and 101b by the joint 102 may be loosened and fall off due to various external factors such as vibration generated in the semiconductor manufacturing apparatus and thermal contraction of a predetermined part of the semiconductor manufacturing apparatus. Must be considered.
FIG. 2 is a schematic diagram illustrating an example of a situation in which a pipe is dropped. Pipes 101 a and 101 b connected by a joint 102 are provided in a vertical furnace 111 which is a part of a semiconductor manufacturing apparatus. For example, when the pipes 101a and 101b are installed perpendicular to the floor surface, it is apparent that the pipe 101b may fall out of the pipe 101a due to its own weight.
For example, if the pipes 101a and 101b are pipes that do not require strict pressure management, there is no need for strict sealing performance, so there is no interlock function on the device configuration, and pipe dropout is detected. It is difficult.

  In the present embodiment, a retrofit mechanism for a pipe in an apparatus including a pipe system in which a pipe that does not have a gas or liquid leak detection or prevention mechanism is already provided, for example, a semiconductor manufacturing apparatus. Thus, a simple connection device that reliably detects the dropout occurring in the pipe is presented.

3 and 4 are schematic views showing the configuration principle of the connection device according to the present embodiment.
FIG. 3A is a schematic plan view of the connection device, FIG. 3B is a side view showing a situation in which the connection device is used, FIG. 4A is a side view showing the structure of the connection device, and FIG. b) is a plan view showing the structure of the connection device in perspective.

  As shown in FIG. 3 (a), the connecting device includes a flexible belt-like portion 11 and a fixing portion 12 through which the tip portion 11A of the belt-like portion 11 is inserted and fixed, such as a belt. Part 10A is configured. A conductive member 11a is provided in the band 11 (or the band 11 itself). 4A and 4B show a state in which the belt-like portion 11 includes the conductive member 11a and the insulating member 11b that covers the conductive member 11a.

  For example, perforations are formed in a plurality of portions on the conductive member 11a, and the easily breakable portion 11C is formed. The insulating member 11b is formed to be strong enough not to be easily cut even if the conductive member 11a is broken and separated. In addition, instead of forming perforations and providing easily breakable portions, the conductive member may be formed in an easily breakable thin film state.

  As the conductive member 11a, for example, a conductive material containing one or more of aluminum (Al), iron (Fe), copper (Cu), titanium (Ti), tungsten (W), and carbon (C) is used. It is done. As the insulating member 11b, an insulating material having excellent heat resistance, for example, an insulating material mainly composed of one or more of Teflon (registered trademark), polyethylene, nylon, and rubber is used.

  As shown in FIG. 4A, the conductive member 11a of the band-like portion 11 is formed with a mountain-shaped engagement portion 11c at a predetermined distance from the tip portion 11A. Similarly, the fixing portion 12 is formed with an engagement portion 12a having a mountain shape. The other end portion of the belt-like portion 11 has an end portion 11B of the conductive member 11a, and the end portion 11B is connected to the engaging portion 12a. As shown in FIG. 3B, the belt-like portion 11 and the fixing portion 12 are fixed by being engaged with the engaging portions 11c and 12a shown in FIG. When the belt-like portion 11 is inserted into the fixed portion 12, the belt-like portion 11 enters in the tightening direction (forward direction), but does not come off due to the engagement of the engaging portions 11c and 12a in the releasing direction (reverse direction). ing. When the belt-like portion 11 and the fixing portion 12 are engaged and fixed, a conductive loop is formed by the conductive member 11 a and the fixing portion 12 of the belt-like portion 11. This conduction loop constitutes an electric circuit.

  5 and 6 are schematic views showing another example of the connection device according to the present embodiment. The connection device shown in FIG. 5 and FIG. 6 has a configuration that appropriately corresponds to the shape of the pipe to be connected, the connection state, and the like.

In the connection device of FIG. 5, the pipe support portion 10 </ b> B includes the other belt-like portion 13 and the fixing portion 15 so as to branch from a part of the belt-like portion 11 in addition to the belt-like portion 11 and the fixing portion 12. 15 is further provided with a belt-like portion 14.
The belt-like portions 13, 14 are configured to include the conductive members 13 a, 14 a and the insulating members 13 b, 14 b covering the conductive members 13 a, 14 a similarly to the belt-like portion 11, but the engagement portions 14 c are formed only in the belt-like portion 14. Is formed. The fixed portion 15 is made of a conductive material, and has an engaging portion 15 a similar to the fixed portion 12.

In the belt-like portion 13, the conductive member 13a is connected to the conductive member 11a of the belt-like portion 11 at the tip portion 13A, and the conductive member 13a is connected to the fixing portion 15 at the tip portion 13B. As for the strip | belt-shaped part 14, the electrically-conductive member 14a is connected to the fixing | fixed part 15 in the front-end | tip part 14B.
When the pipe support portion 10B is used, the belt-like portions 11 and 14 are inserted into the fixing portions 12 and 15, and are engaged and fixed by the engaging portions 11c and 12a and the engaging portions 14c and 15a, respectively.

The connecting device of FIG. 6 includes a pipe support portion 10 </ b> C having a fixing portion 12 formed of a conductive material on both end portions 11 </ b> A and 11 </ b> B of the belt-like portion 11. The engaging portion 12a of the fixing portion 12 is connected to the conductive member 11a of the belt-like portion 11 at the tip portions 11A and 11B.
When the pipe support 10C is used, it is appropriately connected to other pipe supports 10A, 10B and the like.

  The connection device further includes a breakage detection unit described later, which is electrically connected to the pipe support units 10A to 10C. When the breakage due to external force occurs in the conductive members 11a, 13a, and 14a of the pipe support portions 10A to 10C and the electric circuit is divided, the breakage detection unit has a mechanism that generates an electrical signal indicating that and electrically detects the breakage. ing.

-Specific Embodiment-
Hereinafter, specific embodiments will be described in detail with reference to the drawings based on the basic outline described above. In each of the following embodiments, a connection device for a pipe connected by, for example, the connection method shown in FIG. 1 among the piping system of the semiconductor manufacturing apparatus is disclosed. In each of the following embodiments, a case where a connection device is applied to piping of a piping system of a semiconductor manufacturing apparatus is illustrated. However, in an apparatus unit other than the semiconductor manufacturing apparatus, a pipe for supplying and discarding liquid or gas is used. The connecting device can be applied as long as it is installed.

(First embodiment)
7 and 8 are schematic diagrams illustrating a state in which pipes are connected to each other using a pipe support portion that is a component of the connection device according to the first embodiment. FIG. 9 is a schematic diagram showing a main configuration of a connection device having the pipe support portion of FIG.

  As an example, as shown in FIG. 7, a substantially T-shaped pipe 101 c and a straight pipe 101 d are connected by a connection method of FIG. 1 using a joint 102. 7A is a side view showing a state in which the pipes are connected to each other by the connecting device, and FIG. 7B is a plan view showing a state when the pipes are connected to each other by the connecting device (part of the pipes). Is shown in cross section).

In the example of FIG. 7, two pipe support parts 10B (referred to as pipe support parts 10B1 and 10B2) of FIG. 5 are used. In the pipe 101d, the belt-like part 11 of the pipe support part 10B1 is engaged with the fixing part 12 of the pipe support part 10B2, and the belt-like part 11 of the pipe support part 10B2 is engaged with the fixing part 12 of the pipe support part 10B1 as indicated by arrows A and B. Fixed. The belt-like portions 14 of the pipe support portions 10B1 and 10B2 are engaged and fixed to the pipe 101c by the fixing portions 15, respectively.
In the entire pipe support portions 10B1 and 10B2, in the belt-like portions 11, 13, and 14 fixed by the fixing portions 12 and 15, a conductive loop is formed by the conductive members 11a, 13a, and 14a and the fixing portions 12 and 15. This conduction loop constitutes an electric circuit.

  In the case of FIG. 7, when the joint 102 is loosened and the pipe 101d is displaced downward, and further, when the joint 102 is detached and the pipe 101d is dropped downward, the strip portion 13 or 14 is expanded. Thereby, a breakage occurs at the easily breakable portion 13 </ b> C of the conductive member 13 a in the belt-shaped portion 13 or at the easily breakable portion 14 </ b> C of the conductive member 14 a in the belt-shaped portion 14. Even when the pipe 101d is dropped, the insulating members 13b and 14b of the strips 13 and 14 are not cut, so that the pipe 101d is prevented from dropping.

As another example, as shown in FIG. 8, pipes 101 e and 101 f that are straight pipes are connected by a connection method of FIG.
In the example of FIG. 8, four pipe support portions 10A in FIG. 3 (FIG. 4) (referred to as pipe support portions 10A1, 10A2, 10A3, and 10A4) and one pipe support portion 10C in FIG. 6 are used.

In the pipe 101e, the belt-like portion 11 of the pipe support portion 10A1 is engaged and fixed by the fixing portion 12 of the pipe support portion 10A2, and the belt-like portion 11 of the pipe support portion 10A2 is engaged and fixed by the fixing portion 12 of the pipe support portion 10A1. In the pipe 101f, the belt-like part 11 of the pipe support part 10A3 is engaged and fixed by the fixing part 12 of the pipe support part 10A4, and the belt-like part 11 of the pipe support part 10A4 is engaged and fixed by the fixing part 12 of the pipe support part 10A3.
For example, the distal end portion 11A of the belt-like portion 11 of the pipe support portion 10A1 on the pipe 101e side and the distal end portion 11A of the belt-like portion 11 of the pipe support portion 10A3 on the pipe 101f side, for example, are fixed to the belt-like portion 11 of the pipe support portion 10C. Each part 12 is engaged and fixed.
In the entire pipe support portions 10A1 to 10A4 and 10C, in the belt-like portion 11 fixed by the fixing portion 12, a conductive loop is formed by the conductive member 11a and the fixing portion 12. This conduction loop constitutes an electric circuit.

  In the case of FIG. 8, when the joint 102 is loosened and the pipes 101e and 101f are shifted downward, and further, when the joint 102 is detached and the pipes 101e and 101f are dropped downward, the strip portions 11 of the pipe support portions 10A1 and 10A3 are expanded. The Thereby, a fracture | rupture arises in 11 C of easy fracture parts of the electrically-conductive member 11a in the strip | belt-shaped part 11. FIG. It is also conceivable that the belt-like portion 11 of the pipe support portion 10 </ b> C is stretched and breaks at the easily breakable portion 11 </ b> C of the conductive member 11 a in the belt-like portion 11. In any case, since the insulating member 11b of the strip portion 11 is not cut, the pipes 101e and 101f are prevented from dropping.

FIG. 9 illustrates a main configuration of the connection device 1 including the pipe support portions 10B1 and 10B2 of FIG.
The connection device 1 includes pipe support portions 10B1 and 10B2 and a breakage detection portion 20. A conduction loop formed by the conductive members 11a, 13b, and 14c and the fixing portions 12 and 15 is indicated by a broken line in the figure as an electric circuit C1.
When the breakage due to external force occurs in the conductive member 11a of the pipe support part 10 and the electric circuit C1 is divided, the breakage detection part 20 has a mechanism for generating an electrical signal indicating that and electrically detecting it.

Specifically, the breakage detection unit 20 is configured by connecting resistors 21 a and 21 b having one end grounded and a MOS transistor 22. The MOS transistor 22 is a so-called depletion mode (normally on type) MOS transistor.
A lead wire 23 is connected to the fixed portion 15 of the pipe support portion 10A, and a lead wire 24 is connected to the fixed portion 15 of the pipe support portion 10B and the gate electrode G of the MOS transistor 22. The lead wire 23 is supplied with a voltage V1 from a power supply (not shown), and the source electrode S of the MOS transistor 22 is supplied with a voltage V2 from a power supply (not shown). The voltage V1 is applied to the gate electrode G of the MOS transistor 22 through the electric circuit C1, and becomes a gate voltage. A portion between the drain electrode D of the MOS transistor 22 and the resistor 21b is an output portion OP of an electric signal.

  In a state where the voltage V1 is applied to the gate electrode of the MOS transistor 22 through the electric circuit C, no current flows from the source electrode S of the MOS transistor 22 to the resistor 21b, and no electric signal is generated from the output unit OP. When the electric circuit C1 is divided and the gate voltage is changed from V1 to 0V, a current flows from the source electrode S of the MOS transistor 22 to the resistor 21b, and an electric signal is generated from the output unit OP. The output unit OP is provided with a mechanism (not shown) that converts an electrical signal into sound or light, for example.

The operation of the MOS transistor 22 will be described in detail. Here, a case where the source electrode S and the drain electrode D are N-type is taken as an example.
In a state where the pipe support portion 10 is connected to the pipe, a negative voltage V1 is always applied to the gate electrode D. Holes gather just below the gate insulating film and the channel portion becomes P-type, so that no current flows from the source electrode S to the drain electrode D.
When division occurs in the electric circuit C1 and the gate voltage changes from V1 to 0V, the holes immediately below the gate insulating film disappear (diffuse), and the channel portion becomes N-type similar to the source electrode S and drain electrode D, A current flows from the source electrode S to the drain electrode D.

  Instead of the break detection unit 20 using the normally-on type MOS transistor 22, for example, a relay circuit in which a B junction is connected to an output line of an electric signal may be used as the break detection unit.

  As described above, according to the present embodiment, by using the connection device 1 that constitutes a relatively simple inspection unit that is independent of the piping system of the semiconductor manufacturing apparatus, the degree of importance is relatively low, or relatively Even when the piping for supplying and discharging with low risk to the human body and the environment is targeted, it is possible to detect gas or liquid leak quickly and reliably.

(Second Embodiment)
In the present embodiment, the connection device having the breakage detection unit in FIG. 7 is disclosed as in the first embodiment, but the first embodiment is that the connection device has a pipe support unit having a configuration different from that in FIG. 9. Is different.
FIG. 10 is a schematic diagram illustrating a main configuration of the connection device according to the second embodiment.

In the present embodiment, the pipe support portion of the connection device 2 is configured by the lead wires 31 similar to the lead wires 23 and 24 of the first embodiment.
The lead wire 31 is formed by coating a conductive member such as Cu with an insulating member such as Teflon or polyethylene. The conductive member is made of an easily breakable thin wire. Here, a particularly thin portion may be formed in the conductive member to make it an easily breakable portion. The insulating member is formed to be strong enough not to be easily cut even if the conductive member is broken and separated.

  When the connecting device 2 is used, the lead wire 31 is wound around and fixed to the pipes 101c and 101d, for example. One end of the lead wire 31 is connected to a power source that supplies the voltage V 1, and the other end is connected to the gate electrode G of the MOS transistor 22. A conduction loop formed by the conductive member of the lead wire 31 is defined as an electric circuit C2.

  When the joint 102 is loosened and the pipe 101d is displaced downward, or when the joint 102 is detached and the pipe 101d is dropped downward, the lead wire 31 is extended. Thereby, the conductive member in the lead wire 31 is broken. Even when the pipe 101d is dropped, the insulating member of the lead wire 31 is not cut, so that the pipe 101d is prevented from dropping. When the conductive member in the lead wire 31 breaks and the electric circuit C2 is divided, the gate voltage changes from V1 to 0V, current flows from the source electrode S of the MOS transistor 22 to the resistor 21b, and the electric current is output from the output unit OP. A signal is emitted. The output unit OP is provided with a mechanism (not shown) that converts an electrical signal into sound or light, for example.

  As described above, according to the present embodiment, the connection device 2 constituting a relatively simple inspection unit independent of the piping system of the semiconductor manufacturing apparatus is appropriately used, so that the degree of importance is relatively low or compared. Even in cases where the pipes responsible for supply and discharge with low risk to the target human body and the environment are targeted, it is possible to detect gas or liquid leaks quickly and reliably.

(Third embodiment)
In the present embodiment, the connection device having the breakage detection unit in FIG. 7 is disclosed as in the first embodiment, but the first embodiment is that the connection device has a pipe support unit having a configuration different from that in FIG. 9. Is different.
FIG. 11 is a schematic diagram illustrating a main configuration of a connection device according to the third embodiment.

In this embodiment, the piping support part of the connection device 3 is composed of a conductive adhesive tape 41 made of a conductive material.
The conductive adhesive tape 41 is in the form of a thin sheet that is easy to break. Here, a perforation may be formed in the conductive adhesive tape 41 to make it an easily breakable portion.

  When the connecting device 5 is used, the conductive adhesive tape 41 is appropriately wound and fixed to, for example, the pipes 101c and 101d. One end of the lead wire 23 is connected to one end of the conductive adhesive tape 41, and a power source that supplies the voltage V <b> 1 is connected to the other end of the lead wire 23. One end of the lead wire 24 is connected to the other end of the conductive adhesive tape 41, and the gate electrode G of the MOS transistor 22 is connected to the other end of the lead wire 24. A conduction loop formed of a conductive adhesive tape is defined as an electric circuit C3.

  When the joint 102 is loosened and the pipe 101d is displaced downward, or further, when the joint 102 is detached and the pipe 101d is dropped downward, the conductive adhesive tape 41 is stretched. As a result, the conductive adhesive tape 41 is broken. Even when the pipe 101d is dropped, the conductive adhesive tape 41 is adhered to the pipes 101c and 101d substantially uniformly. Therefore, even if a predetermined part of the conductive adhesive tape 41 is broken, the pipes 101c and 101d are not used in other parts. The pipe 101d is prevented from dropping. When the conductive adhesive tape 41 breaks and the electric circuit C3 is divided, the gate voltage changes from V1 to 0V, current flows from the source electrode S of the MOS transistor 22 to the resistor 21b, and an electric signal is output from the output unit OP. Be emitted. The output unit OP is provided with a mechanism (not shown) that converts an electrical signal into sound or light, for example.

  As described above, according to the present embodiment, the connection device 3 constituting a relatively simple inspection unit independent of the piping system of the semiconductor manufacturing apparatus is appropriately used, so that the degree of importance is relatively low, or comparison is made. Even in cases where the pipes responsible for supply and discharge with low risk to the target human body and the environment are targeted, it is possible to detect gas or liquid leaks quickly and reliably.

  Hereinafter, various aspects of the present case will be collectively described as additional notes.

(Appendix 1) A connecting device used in a piping system having a plurality of pipes, wherein the pipes are connected to each other at a connecting portion,
A pipe support part that has an easily breakable conductive part, supports the pipes around the connection part, and forms a conduction loop of the conductive part by the support;
And a breakage detection unit that is electrically connected to the conductive part and electrically detects a breakage of the conductive part as a break of the conduction loop.

  (Additional remark 2) The said piping support part is a connection apparatus of Additional remark 1 characterized by the strip | belt-shaped said electroconductive part being coat | covered with the insulation part.

  (Supplementary note 3) The connection device according to supplementary note 2, wherein the insulating portion is harder to break than the conductive portion.

  (Additional remark 4) The said piping support part has an adhesive tape in which the said electroconductive part consists of an electroconductive material, The connection apparatus of Additional remark 1 characterized by the above-mentioned.

  (Supplementary Note 5) The connection device according to any one of Supplementary Notes 1 to 4, wherein the conductive portion is formed as a readily breakable portion by forming a perforation at a predetermined portion.

(Supplementary Note 6) A connection method used for a piping system having a plurality of pipes, wherein the pipes are connected to each other at a connection portion,
The pipes are supported around the connection part by a pipe support part having an easily breakable conductive part, and a conductive loop of the conductive part is formed by the support,
A connection method, wherein a connection state of the connection portion is changed to cause separation between the pipes, whereby the conductive portion is broken, and the break is electrically detected as a breakage of the conduction loop.

  (Additional remark 7) The said piping support part is a connection method of Additional remark 6 characterized by the strip | belt-shaped said electroconductive part being coat | covered with the insulation part.

  (Supplementary note 8) The connection method according to supplementary note 7, wherein the insulating portion is harder to break than the conductive portion.

  (Additional remark 9) The said piping support part has an adhesive tape in which the said electroconductive part consists of an electroconductive material, The connection method of Additional remark 6 characterized by the above-mentioned.

  (Supplementary Note 10) The connection method according to any one of Supplementary Notes 6 to 9, wherein the conductive portion is formed as a readily breakable portion by forming a perforation at a predetermined portion.

  According to the connection device or connection method described above, a relatively simple inspection unit is configured independently of the existing piping system, and is relatively low in importance or relatively low in danger to the human body and the environment. Even when the piping for supplying and discharging is targeted, it is possible to quickly and reliably detect a leak of gas or liquid.

C1 to C3 Electrical circuits 1 to 3 Connection devices 10A, 10A1 to 10A4, 10B, 10B1, 10B2, and 10C Pipe support portion 20 Break detection portions 11, 13, and 14 Strip portions 11A, 11B, 13A, 13B, 14A, and 14B 11C Easy breakable portions 11a, 13a, 14a Conductive members 11b, 13b, 14b Insulating members 11c, 12a, 15a, 14c Engaging portions 12, 15 Fixed portions 21a, 21b Resistances 23, 24, 31 Lead wire 22 MOS transistor 41 Conductivity Adhesive tape 101a-101f Pipe 102 Joint 102a One end 102b Other end 103a, 103b Sleeve 104a, 104b Nut 111 Vertical furnace

Claims (5)

A connecting device used for a piping system having a plurality of pipes, wherein the pipes are connected to each other at a connecting portion,
A pipe support part that has an easily breakable conductive part, supports the pipes around the connection part, and forms a conduction loop of the conductive part by the support;
And a breakage detection unit that is electrically connected to the conductive part and electrically detects a breakage of the conductive part as a break of the conduction loop.   The connection device according to claim 1, wherein the pipe support part is formed by covering the strip-shaped conductive part with an insulating part.   The connection device according to claim 1, wherein the pipe support part has an adhesive tape in which the conductive part is made of a conductive material.   The connection device according to any one of claims 1 to 3, wherein the conductive portion is formed by forming a perforation at a predetermined portion to be an easily breakable portion. It has a plurality of pipes, and is a connection method used for a pipe system in which the pipes are connected by a connection part,
The pipes are supported around the connection part by a pipe support part having an easily breakable conductive part, and a conductive loop of the conductive part is formed by the support,
A connection method, wherein a connection state of the connection portion is changed to cause separation between the pipes, whereby the conductive portion is broken, and the break is electrically detected as a breakage of the conduction loop.

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