JP2010193995A - Game machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a game machine including a board case which has a fraudulent practice prevention configuration for blocking fraudulent practice that an unauthorized integrated circuit is attached on a reverse surface or a reverse side of a specific integrated circuit or the specific integrated circuit is exchanged to the unauthorized integrated circuit. <P>SOLUTION: A front end wall part 15a of a case side projection part 15 of a base case 14 is inserted in a board opening 7c of a main control board 7 and a front end surface abuts on or approximates to a reverse surface of the specific integrated circuit 22. The case side projection part 15 is fixed on the reverse surface of the specific integrated circuit 22 with a transparent adhesive 30 applied on the front end surface, so that it is possible to prevent the unauthorized integrated circuit from being attached to the reverse surface of the specific integrated circuit 22 by scraping the reverse surface of the specific integrated circuit 22 or another integrated circuit storing the unauthorized integrated circuit from being attached to the reverse surface side of the specific integrated circuit 22. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a gaming machine provided with a board case that accommodates a printed circuit board, and more particularly to a gaming machine that can prevent a fraudulent act of cheating on a specific integrated circuit mounted on a printed circuit board.

  Conventionally, in game machines such as pachinko machines and slot machines, a game control unit is provided on the back side of the board surface of the game board. The game control unit includes a board case that houses a control board (circuit board) that controls the gaming machine. Various electronic components such as a plurality of packaged integrated circuits, resistance elements, and capacitors are mounted on the control board. Among the plurality of integrated circuits, a specific integrated circuit incorporates a ROM that stores a game control program based on a preset game specification of the gaming machine, random data for jackpot lottery, and the like.

  When the IC package in which the integrated circuit is packaged is a dual inline package (DIP type), a plurality of lead terminals (electrode pins) are provided so as to protrude downward from both sides of the integrated circuit and be aligned in a straight line. An integrated circuit can be mounted on a printed circuit board directly via an electrode pin or via an integrated circuit socket. In addition to the DIP type, the IC package includes a single in-line package (SIP type) and a zigzag in-line package (ZIP type).

  By the way, in the game control unit, an illegal act of removing a specific integrated circuit from a printed circuit board and replacing it with an unauthorized integrated circuit by an unauthorized person or a hall side has been regarded as a problem. The illegal integrated circuit incorporates an illegal ROM (so-called back ROM) in which a game control program and random data for lottery lottery are remodeled, and the gaming machine is completely different from the game specifications set in advance by the illegal integrated circuit. Therefore, an unauthorized person or a hall side can obtain an unauthorized profit.

  Furthermore, in the recent sophisticated fraud, the back surface of the IC package is scraped and an illegal integrated circuit is attached to the back surface of the specific integrated circuit, or another IC package containing the illegal integrated circuit is attached to the back surface side of the IC package. It has been confirmed from the front side of the printed circuit board that it is impossible to know that the unauthorized work has been performed. Techniques have been disclosed in which various measures have been taken to prevent such fraud.

  In the control device described in Patent Document 1, a circular through hole is formed in a portion of the circuit board housed in the board box that faces the back surface of the specific integrated circuit, and the back surface of the specific integrated circuit is formed through the through hole from the outside. A circular window hole is formed in the substrate box so as to be visible.

JP 2004-160246 A

  In the technique of Patent Document 1, when the back surface of the IC package is scraped and an unauthorized integrated circuit is attached to the back surface of the specific integrated circuit, or another IC package containing the unauthorized integrated circuit is attached to the back surface side of the IC package. It is possible to visually recognize that the illegal act has been performed through the through hole of the circuit board and the window hole of the board box.

  However, the technique of Patent Document 1 is not a structure that can positively prevent the above-described fraud. In other words, since the through-hole formed in the portion of the circuit board that faces the back surface of the IC package provides a space that allows the unauthorized integrated circuit to be attached, the above-described fraud can be easily performed. Furthermore, the specific integrated circuit can be easily removed from the front side of the printed circuit board and replaced with an unauthorized integrated circuit.

  An object of the present invention is to provide a gaming machine provided with a substrate case having an anti-fraud structure that can prevent an illegal act of attaching an illegal integrated circuit to the back side of the specific integrated circuit or replacing the specific integrated circuit with an illegal integrated circuit. It is.

The present invention has the following configuration. The reference numerals in parentheses show an example of the correspondence between the constituent elements of the present invention and the constituent elements shown in the drawings, and do not limit the technical scope of the present invention in any way.
A gaming machine according to claim 1 is a gaming machine (1) including a printed circuit board (7) on which a plurality of integrated circuits (22 to 25) are mounted, and a circuit board case (11) for accommodating the printed circuit board (7). ), The board case (11) includes a box-shaped first case (13) covering the outside of the integrated circuit mounting surface (7a) of the printed circuit board (7), and a back surface opposite to the integrated circuit mounting surface (7a). A second case (14) disposed in proximity to (7b) and covering the outer surface of the back surface (7b), and a printed circuit board (7) having a substrate opening in a portion facing the specific integrated circuit (22) ( 7c) is a case-side protruding portion (15, 15A, 15C-15E, 38) provided on the second case (14) so as to protrude toward the specific integrated circuit (22), A case-side protrusion (15, 15A, 15C to 15E, 38) is provided which is inserted into (7c) and whose front end surface abuts on or is close to the back surface of the specific integrated circuit (22).

  When the printed circuit board (7) is housed in the circuit board case (11), the case-side protrusions (15, 15A, 15C to 15E, 38) of the second case (14) are connected to the substrate opening (7c ) And the second case (14) is in close proximity to the back surface (7b) of the printed circuit board (7) with its front end surface in contact with or close to the back surface of the specific integrated circuit (22). The outer surface of the integrated circuit mounting surface (7a) of the printed circuit board (7) is covered with the first case (13).

In the gaming machine of claim 2, in the invention of claim 1, the second case (14) is a transparent synthetic resin molded body, and the case side protrusions (15, 15D, 15E, 38) are the second case (14 ) Is integrally formed.
The gaming machine according to claim 3 is the invention according to claim 1 or 2, wherein the front end surface of the case-side protruding portion (15, 15A, 15D, 15E, 38) is bonded to the back surface of the specific integrated circuit (22). ).

According to a fourth aspect of the present invention, in the invention of the third aspect, the case-side protruding portion (15D, 15E) is weaker than the other portions of the case-side protruding portion (15D, 15E) in the middle in the protruding direction. It is characterized by providing vulnerable parts (36, 37).
The gaming machine according to claim 5 is characterized in that, in the invention according to claim 4, the fragile portion (36) is composed of a small-diameter column portion whose width in the direction parallel to the printed circuit board (7) is reduced.

The gaming machine according to claim 6 is the base-side projecting portion (38b) connected to the base end portion on the second case (14) side of the case-side projecting portion (38) according to the invention of claim 3, A feature is that a base end side protruding portion (38b) having a tip end portion (38t) close to the back surface (7b) in the vicinity of the outer edge of the substrate opening (7c) of (7) is provided.
The gaming machine according to claim 7 is the integrated circuit (22) or integrated circuit projecting to the back side of the printed circuit board (7) at the distal end portion (38t) of the base end side projecting portion (38b) in the invention of claim 6. An electrode pin retracting hole (38e) is provided to prevent contact of the socket (39) with the electrode pins (22a, 39a).

  According to the first aspect of the present invention, the substrate case includes the first and second cases for accommodating the printed circuit board, and the substrate opening is formed in a portion of the printed circuit board facing the specific integrated circuit. Since the case-side protrusion provided to protrude toward the integrated circuit, the case-side protrusion that is inserted into the substrate opening and the front end surface is in contact with or close to the back surface of the specific integrated circuit is provided. The effect of.

  Since the front end surface of the case-side protruding portion of the second case is in contact with or close to the back surface of the specified integrated circuit, there is no space on the back surface or back surface side of the specified integrated circuit to allow attachment of an unauthorized integrated circuit. Actions can be reliably prevented. That is, the front end surface of the case-side protruding portion is in contact with or close to the back surface of the specific integrated circuit, and the back surface of the IC package containing the specific integrated circuit is shaved to attach the unauthorized integrated circuit to the back surface of the specific integrated circuit. Can not. In addition, another IC package containing an illegal integrated circuit cannot be attached to the back side of the IC package.

  According to invention of Claim 2, since the 2nd case is a transparent synthetic resin molding and the case side protrusion part was integrally formed in the 2nd case, the presence or absence of a fraudulent act can be visually recognized through a case side protrusion part. Can do. In addition, if the case-side protruding portion is destroyed, it is possible to easily confirm the presence or absence of fraud from the damage of the second case.

  According to the third aspect of the present invention, since the tip end surface of the case-side protruding portion is fixed to the back surface of the specific integrated circuit with the adhesive, it is difficult to remove the specific integrated circuit from the case-side protruding portion.

According to the invention of claim 4, since the weak part weaker than the other part of the case side protruding part is provided in the middle part in the protruding direction of the case side protruding part, the weak part is broken and the illegal integrated circuit When is attached, fraudulent acts can be easily confirmed from the presence or absence of breakage of the fragile portion.
According to the invention of claim 5, since the fragile portion is formed of a small-diameter column portion whose width in the direction parallel to the printed circuit board is reduced, the same effect as that of claim 4 is obtained.

  According to the sixth aspect of the present invention, the base-side projecting portion connected to the base-end portion on the second case side of the case-side projecting portion, the distal end portion close to the back surface near the outer edge of the substrate opening of the printed circuit board. Since the base end side protrusion part which has is provided, when trying to remove the case side protrusion part, the base end side protrusion part becomes obstructive and cannot remove the case side protrusion part. In addition, the same effects as in the second and third aspects are obtained.

  According to the seventh aspect of the present invention, the electrode pin retracting hole for preventing contact with the electrode pin of the integrated circuit or integrated circuit socket protruding to the back side of the printed circuit board is provided at the distal end of the base end side protruding portion. The specific integrated circuit can be stably mounted on the printed circuit board through the electrode pins or the electrode pins of the socket.

1 is a schematic front view of a pachinko gaming machine according to an embodiment of the present invention. It is a schematic rear view of a pachinko gaming machine. It is a disassembled perspective view of a main board unit. It is a perspective view which shows the state which rotated the substrate case. It is a perspective view which shows a main board | substrate unit. It is a principal part expansion longitudinal cross-sectional view of the main board | substrate unit. It is a longitudinal cross-sectional view of the main board | substrate unit which shows the state which test | inspects a back surface. FIG. 7 is a diagram corresponding to FIG. 6 according to the second embodiment. FIG. 7 is a diagram corresponding to FIG. 6 according to the third embodiment. FIG. 6 is a diagram corresponding to FIG. 6 according to the fourth embodiment. FIG. 6 is a diagram corresponding to FIG. 6 according to the fifth embodiment. FIG. 6 is a diagram corresponding to FIG. 6 according to the sixth embodiment. FIG. 10 is a view corresponding to FIG. 6 according to the seventh embodiment. FIG. 9 is a diagram corresponding to FIG. 6 according to an eighth embodiment.

  Hereinafter, modes for carrying out the present invention will be described based on examples.

  As shown in FIG. 1, the pachinko gaming machine 1 is provided with an open / close frame 2 that can be opened and closed on an outer frame attached to an island structure of a pachinko hall, and an open / close door 3 that can be opened and closed on the open / close frame 2. Yes. A game board (not shown) is mounted on the open / close frame 2, and a game area (not shown) is formed on the front side of the game board. A window 3a is formed in the opening / closing door 3, and a transparent glass plate 3b is attached to the window 3a, and the front side of the game area is covered with the glass plate 3b. The game area can be seen from the outside through the glass plate 3b.

  A storage tray 4 for storing game balls and a launch handle 5 operated by the player are provided below the window 3a of the open / close door 3. When the firing handle 5 is rotated, the game ball introduced from the storage tray 4 to the firing position is launched. Here, when a plurality of game balls exist in the storage tray 4, for example, the plurality of game balls are continuously fired at intervals of about 0.6 seconds.

  As shown in FIG. 2, a back mechanism board 6 is provided on the back side of the game board. The back mechanism board 6 includes a main board unit 8 having a main control board 7, an image board unit 9 having an image control board, Each power supply board unit 10 having a power supply board is attached at a predetermined position. On the surface of the cover case 9a of the image board unit 9 and the surface of the cover case 10a of the power board unit 10, a plurality of small-diameter heat radiation holes 9b and 10b for releasing heat generated inside are formed.

Next, the main board unit 8 will be described.
As shown in FIGS. 3 to 7, the main board unit 8 includes a main control board 7, a board case 11 that houses the main control board 7, and a holder case 12 that supports the board case 11 in a swingable manner. ing.

  As shown in FIGS. 3 to 5, the substrate case 11 includes a cover case 13 (first case) that covers the outer surface 7 a of the main control board 7 on the integrated circuit mounting side, and an integrated circuit mounting side of the main control board 7. The base case 14 (2nd case) which covers the outer side of the back surface 7b on the opposite side to the front surface 7a is provided.

  The cover case 13 is formed in a box shape that opens to the rear of a horizontally long rectangle having a depth of about 20 mm, and is made of a transparent synthetic resin material. Inside the cover case 13 is formed a boss portion (not shown) that protrudes from the back surface of the main body plate portion of the cover case 13 to the base case 14 side. A screw hole is formed in the boss portion, and the main control board 7 is inserted into the cover case 13 by inserting a fixing screw into the pin hole of the main control board 7 and screwing it into the screw hole of the boss part. Fixed.

  A plurality of openings 31 a to 31 f for exposing the plurality of board-side connectors 28 a to 28 f mounted on the main control board 7 are formed in the upper end portion and the lower end portion of the cover case 13, respectively. A reset pin cover 32 is pivotally supported at the left end portion of the front surface (front surface) of the main body plate portion of the cover case 13.

  A pair of upper and lower groove forming portions 13 a and 13 b facing the pair of upper and lower engaging pieces 14 a and 14 b of the base case 14 are formed at the upper end and the lower end of the cover case 13. The groove forming portions 13a and 13b are formed with engaging grooves for inserting the engaging pieces 14a and 14b of the base case 14 and sliding the base case 14, respectively.

  A fitting hole 13c into which the fitting portion 14c of the base case 14 is fitted is formed in the left end wall portion of the cover case 13 so as to penetrate in the left-right direction. A U-shaped cover side guard wall 13d is formed at the right end portion. A square tongue 13e protrudes rightward from the upper front end of the cover side guard wall 13d, and a QR code (two-dimensional code) is recorded on the surface of the tongue 13e. As shown in FIG. 5, the engagement piece 13f protrudes rightward from the center part of the right end surface of the cover side guard wall 13d. Four cylindrical sealing portions 13g are provided inside the cover-side guard wall 13d, and small holes for fitting the lock pins 16 are formed in the back end walls of these sealing portions 13g.

Next, the base case 14 will be described with reference to FIGS. 3, 4, and 6.
For convenience of explanation, as shown in FIG. 3, “front and rear, left and right” are defined and viewed from the back of the pachinko gaming machine 1. The base case 14 is formed of a horizontally long and shallow box-shaped transparent synthetic resin molded body, and includes a narrow upper end wall, a lower end wall, and a right end wall that rise perpendicularly from the main body plate portion of the base case 14 to the near side. In addition, a case-side protruding portion 15 that protrudes from the main body plate portion toward the back surface 7b of the main control board 7 is provided. Details of the case-side protrusion 15 will be described later.

  The base case 14 is disposed in proximity to the back surface 7 b of the main control board 7. A pair of engaging pieces 14 a and 14 b that can engage with engaging grooves of a pair of upper and lower groove forming portions 13 a and 13 b of the cover case 13 are formed on the upper and lower walls of the base case 14. In the engagement pieces 14a and 14b, three L-shaped slits 18a to 18c are formed for introducing and sliding the connecting portions of the cover case 13 on the groove forming portions 13a and 13b side. A pair of hinge bearing portions 14d and 14e hinged to the holder case 12 are provided on the upper end wall so as to protrude upward.

  A fitting portion 14c that fits into the fitting hole 13c of the cover case 13 is provided at the left end portion of the base case 14 so as to protrude leftward. Projecting outward from the right end wall of the base case 14, the panel surface external terminal board cover 14f is positioned below the panel surface external terminal board cover 14f and has a width in the front-rear direction and outside the cover side card wall 13d. A base-side guard wall 14g protruding in a U-shape to be engaged is provided.

  When the base case 14 is engaged with the cover case 13 to which the main control board 7 is fixed and is slid through the L-shaped slits 18a to 18c, the fitting portion 14c is fitted into the fitting hole 13c of the cover case 13. At the same time, the engagement piece 13f of the cover case 13 engages with the engagement hole of the base side guard wall 14g, so that the cover case 13 is not separated from the base case 14. Thus, the main control board 7 is housed in the housing space formed between the cover case 13 and the base case 14.

  Four boss portions 14h located on the inner side of the base-side guard wall 14g are integrally formed in the vicinity of the outer side of the right end wall of the base case 14. Each boss portion 14h is formed so as to face the four sealing portions 13g of the cover case 13 coaxially. Each boss portion 14h includes a short columnar boss main body portion, a rib connecting the boss main body portion to the base side guard wall 14g, a shelf portion connected to the front end of the boss main body portion, and upper and lower right side portions of the shelf portion. And a U-shaped portion integral with the shelf. A small hole for engaging the tip of the lock pin 16 is formed in the boss body, and the lock pin 16 cannot be removed by this boss body.

  Four sets of lock mechanisms 19 are provided to fix the cover case 13 with the main control board 7 fixed to the base case 14 in an inseparable manner. The lock mechanism 19 includes the boss portion 14 h, the sealing portion 13 g of the cover case 13, the lock pin 16, and the caulking cap 20. The four sets of lock mechanisms 19 are provided at the right end of the substrate case 11.

  When the base case 14 is overlaid on the cover case 13 and slid through the L-shaped slits 18a to 18c, the small hole of the boss portion 14h and the small hole of the sealing portion 13g face each other. In this state, the lock pin 16 is inserted into the sealing portion 13g, and the caulking cap 20 is pushed into the lock pin 16 so that the tip of the lock pin 16 is inserted into the small hole in the boss main body portion of the boss portion 14h. The caulking cap 20 is pushed into the cylindrical hole of the sealing portion 13g so that the caulking cap 20 cannot be removed from the outside, and the cover case 13 and the base case 14 are brought into the caulking state by the four lock mechanisms 19.

Next, the holder case 12 will be described.
As shown in FIGS. 3 to 5, the holder case 12 is a horizontally long transparent synthetic resin molded body in a front view, and is disposed on the rear side of the base case 12 so as to overlap the base case 12. A pair of hinge shaft attachment portions 12 a and 12 b are provided on the upper end wall portion so as to correspond to the pair of hinge bearing portions 14 d and 14 e of the base case 14. The pair of hinge shaft attachment portions 12a and 12b and the pair of hinge bearing portions 14d and 14e are connected by a pair of metal hinge pins 21, respectively. At the center of the lower end wall portion of the holder case 12, a locking hook 12 c that can be engaged with and detached from the groove forming portion 13 b at the lower end portion of the cover case 13 is provided.

  As shown in FIGS. 4 and 5, the pair of hinge bearing portions 14 d and 14 e of the base case 14 are engaged with the hinge pins 21 of the pair of hinge shaft mounting portions 12 a and 12 b of the holder case 12 to be hinge-coupled. By this hinge connection, the substrate case 11 is pivotally attached to the holder case 12 so as to be able to swing forward about the hinge pin 21, and the locking hook 12 c is engaged with the groove forming portion 13 b at the lower end portion of the cover case 13. By doing so, the holder case 12 is locked.

  As shown in FIG. 7, the holder case 12 is fixed to the back mechanism plate 6 in a vertical posture by a fixing pin (not shown). As shown in FIG. 5, when the substrate case 11 is in use, the surface 7 a of the main control substrate 7 can be directly observed through the transparent cover case 13. On the other hand, as shown in FIGS. 4 and 7, when it is desired to inspect the back surface 7b of the main control board 7, the locking hook 12c is detached from the cover case 13 and the board case 11 is swung forward. The back surface 7b of the main control board 7 becomes visible.

  3, 6, and 7, the main control board 7 fixed inside the cover case 13 is a printed board in which wiring is formed of a conductive material on a copper foil or the like, and the surface 7 a is an electron. A component mounting surface (integrated circuit mounting surface) is used, and a back surface 7b opposite to the front surface 7a is a solder surface. On the surface 7a, various electronic components such as a plurality of packaged integrated circuits 22 to 25, a plurality of resistor elements 26, a plurality of capacitors 27, and a plurality of board-side connectors 28a to 28f to which external connectors are connected, and reset pins are provided. 29 is implemented.

  As shown in FIG. 3, the plurality of integrated circuits 22 to 24 are packaged in a DIP type IC package (dual in-line package), and a plurality of electrode pins bend at right angles from the upper and lower ends of the integrated circuit and protrude backward. Are aligned on the left and right. Each of these integrated circuits 22 to 24 is a one-chip integrated circuit in which a CPU, a ROM, and the like are incorporated.

  The integrated circuit 25 is packaged in a SIP-type IC package (single in-line package). In the integrated circuit 25, a plurality of electrode pins 25a protrude rearward from the rear end surface of the package body and are arranged in two rows in the left-right direction. It is out.

Next, the fraud prevention structure S unique to the present application will be described.
As shown in FIG. 6, the fraud prevention structure S is a structure for preventing fraud on the specific integrated circuit 22 among the plurality of integrated circuits 22 to 24 mounted on the main control board 7.
The specific integrated circuit 22 incorporates at least a game control ROM in which a game control program based on a preset game specification of the pachinko gaming machine 1 and a big hit lottery random number data are stored. However, the specific integrated circuit 22 may be a one-chip microcomputer including the ROM and CPU as described above.

The fraud prevention structure S includes a substrate opening 7c as described below and a case-side protrusion 15 formed integrally with the base case 14.
A portion of the main control board 7 that faces the back surface of the specific integrated circuit 22 is formed with a rectangular substrate opening 7 c that is formed in a penetrating shape in the front-rear direction and slightly larger than the back surface of the specific integrated circuit 22. Yes. In the specific integrated circuit 22, the electrode pins 22 a are inserted into electrode pin mounting holes formed in the vicinity of the upper and lower outer edges of the substrate opening 7 c of the main control board 7, and the tip portion protruding to the back side of the main control board 7 is soldered. This is mounted on the surface 7a of the main control board 7. Thereby, the specific integrated circuit 22 is electrically connected to the circuit of the main control board 7.

  The other integrated circuits 23 to 25 are mounted on the surface 7a of the printed circuit board 7 by the same mounting structure as described above, and the integrated circuits 23 to 25 are electrically connected to the circuit of the main control board 7. However, the substrate opening facing the integrated circuits 23 to 25 is not formed.

  As shown in FIGS. 6 and 7, the case-side protruding portion 15 is formed on the portion of the main body plate portion of the base case 14 that faces the substrate opening 7 c of the main control board 7 from the main body plate portion to the specific integrated circuit 22. The base case 14 is integrally formed in a substantially rectangular parallelepiped shape so as to protrude toward the back surface, and its tip is inserted into the substrate opening 7c.

  As shown in FIG. 6, the case-side protruding portion 15 includes a rectangular tip wall portion 15 a whose tip surface abuts on or close to the back surface of the specific integrated circuit 22, and a rear side from the four sides of the tip wall portion 15 a. A quadrangular cylindrical side wall portion 15 b that extends and has a rear end integrally connected to the main body plate portion of the base case 14 is provided.

  The tip wall portion 15 a is formed in a rectangular shape having the same vertical and horizontal length as the back surface of the integrated circuit 22. The front end wall portion 15a is inserted into the substrate opening 7c of the main control board 7 so that the flat front end surface is in contact with or close to the back surface of the integrated circuit 22, and the adhesive 30 applied on the front end surface is used to attach the front end wall portion 15a. It is fixed to the back side. The adhesive 30 is an adhesive mainly composed of a transparent epoxy-based, acrylic-based, or ethylene-based synthetic resin.

  As shown in FIG. 7, when inspecting whether the rear surface of the specific integrated circuit 22 has been tampered with, the locking hook 12 c is detached from the cover case 13, and the substrate case 11 is swung to the near side. It is possible to see through the base case 14 and the case side protrusion 15.

The operational effects of the fraud prevention structure S described above will be described.
When the main control board 7 is accommodated in the storage space between the cover case 13 and the base case 14 of the board case 11, the tip wall portion 15 a of the case side protruding portion 15 is inserted into the board opening 7 c of the main control board 7, The front end surface comes into contact with the back surface of the specific integrated circuit 22. The case-side protruding portion 15 is fixed to the back surface of the integrated circuit 22 with a transparent adhesive 30 applied on the front end surface thereof. The base case 14 is disposed in close proximity so as to cover the outside of the back surface 7 b of the main control board 7, the outside of the front surface 7 a of the main control board 7 is covered with the cover case 13, and the cover case 13 is covered by a plurality of lock mechanisms 19. The base case 14 is fixed so as not to be separated.

  Since the tip surface of the tip wall portion 15a of the case-side protruding portion 15 is fixed to the back surface of the specific integrated circuit 22 by the transparent adhesive 30, the back surface of the specific integrated circuit 22 is shaved to modify the game illegally. An illegal integrated circuit incorporating a ROM cannot be attached, or an illegal integrated circuit cannot be attached to the back side of the specific integrated circuit 22. Therefore, it is possible to reliably prevent fraudulent acts by unauthorized persons and the hall side.

Since the distal end surface of the distal end wall portion 15a of the case side protruding portion 15 is fixed to the back surface of the specific integrated circuit 22 with the transparent adhesive 30, it is difficult to remove the specific integrated circuit 22 from the case side protruding portion 15. In particular, the specific integrated circuit 22 cannot be removed unless the case-side protruding portion 15 is destroyed. The presence or absence of fraud can be easily confirmed from the damage of the base case 14 accompanying the destruction of the case side protrusion 15.
Moreover, since the case side protrusion 15 is integrally formed with the base case 14 made of transparent synthetic resin, the presence or absence of fraud can be visually recognized through the case side protrusion 15.

The fraud prevention structure SA of the second embodiment will be described. However, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different components are described.
In the first embodiment, the case-side protruding portion 15 is integrally formed with the base case 14, but the case-side protruding portion 15 </ b> A is configured as a separate member from the base case 14 as shown in FIG. 8. The case-side protruding portion 15A is formed of a transparent synthetic resin material in a hollow body or a solid body, and the front end surface of the case-side protruding portion 15A is fixed to the back surface of the specific integrated circuit 22 with a transparent adhesive 30. The rear end of the case side protruding portion 15 </ b> A is bonded to the main body plate portion of the base case 14 with a transparent adhesive 33. The same operations and effects as those of the first embodiment can be obtained.

The fraud prevention structure SB of the third embodiment will be described. However, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different components are described.
In the first embodiment, the front end surface of the case-side protruding portion 15 is fixed to the back surface of the specific integrated circuit 22 with the transparent adhesive 30, but the transparent adhesive 30 is omitted as shown in FIG. The front end surface of the protruding portion 15 is in close proximity to the back surface of the specific integrated circuit 22. Since there is no space between the back surface of the specific integrated circuit 22 and the case-side protruding portion 15, fraud such as incorporating an unauthorized integrated circuit on the back surface side of the specific integrated circuit 22 can be prevented.

A mounting structure of the specific integrated circuit 22 according to the fourth embodiment will be described. In the fourth embodiment, a fraud prevention structure S similar to that in the first embodiment is employed. However, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different components are described. As shown in FIG. 10, the specific integrated circuit 22 is mounted on the main control board 7 via an integrated circuit socket 39 (IC socket).
The socket body of the IC socket 39 is provided with a plurality of connection holes for receiving a plurality of electrode pins, and the electrode pins 22a of the specific integrated circuit 22 are inserted into the connection holes.

  The electrode pin 22a of the specific integrated circuit 22 is inserted into the connection hole of the IC socket 39, the electrode pin 39a of the IC socket 39 is inserted into the electrode pin mounting hole of the main control board 7, and the electrode pin 39a protruding to the back side of the main control board 7 Solder the tip of the. By mounting the electrode pins 39 a on the main control board 7, the specific integrated circuit 22 is electrically connected to the circuit of the main control board 7 via the IC socket 39. Since the back surface of the specific integrated circuit 22 is fixed to the front end surface of the case-side protruding portion 15 via the transparent adhesive 30, the specific integrated circuit 22 is removed and an unauthorized integrated circuit is incorporated as in the first embodiment. Can be prevented.

The fraud prevention structure SC of the fifth embodiment will be described. However, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different components are described.
As shown in FIG. 11, the case-side protruding portion 15 </ b> C is formed in a rectangular parallelepiped box shape with a member made of a thin metal plate such as aluminum. The case-side protruding portion 15C includes a tip wall portion 15c, a side wall portion 15d, and a mounting piece 15e formed over the entire circumference at the rear end of the side wall portion 15d.

  The front end wall portion 15 c of the case side protruding portion 15 C is inserted into the substrate opening 7 c of the main control board 7, and the front end surface is in contact with the back surface of the specific integrated circuit 22. The attachment piece 15e is fixed to the main body plate portion of the base case 14 by a fixing screw inserted into the screw hole of the attachment piece 15e. The attachment piece 15e may be fixed to the main body plate portion of the base case 14 with an adhesive. As in the first embodiment, the electrode pins 22a of the specific integrated circuit 22 are directly connected to the main control board 7 and soldered. Since the aluminum case-side protrusion 15C is provided, fraudulent acts can be prevented in substantially the same manner as in the first embodiment, and heat generated inside the specific integrated circuit 22 is radiated through the aluminum case-side protrusion 15C. Can be made.

A fraud prevention structure SD according to the sixth embodiment will be described. However, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different components are described.
As shown in FIG. 12, the case side protruding portion 15 </ b> D is integrally formed with the base case 14 and protrudes upward from the main body plate portion of the base case 14. The case-side protruding portion 15D includes a distal end wall portion 34 whose distal end surface is in contact with or close to the back surface of the specific integrated circuit 22, a proximal end wall portion 35 integrally connected to the main body plate portion of the base case 14, and a case side A fragile portion 36 formed between the distal end wall portion 34 and the proximal end wall portion 35 is provided in the middle of the protruding portion 15D in the protruding direction.

  The tip wall portion 34 is formed in a rectangular cross section having a predetermined thickness, and has the same vertical length and horizontal length as the back surface of the specific integrated circuit 22. The front end wall portion 34 is inserted into the substrate opening 7 c of the main control board 7, and the flat front end surface is in contact with or close to the back surface of the specific integrated circuit 22, and the transparent adhesion applied to the front end surface of the front end wall portion 34. The adhesive 30 is fixed to the back surface of the specific integrated circuit 22 by the agent 30.

  The fragile portion 36 is formed to be more fragile than the distal end wall portion 34 and the proximal end wall portion 35, extends vertically downward from the central portion of the back surface of the distal end wall portion 34, and has a lower end at the central portion of the proximal end wall portion 35. The column portion is connected to the upper end surface of the main control board 7 and has a small-diameter cross-sectional rectangular or circular column portion in which the vertical and horizontal widths in the direction parallel to the main control board 7 are reduced.

The operation and effect of the fraud prevention structure SD described above will be described.
Since the fragile portion 36 that is more fragile than the other portions of the case side protruding portion 15D is provided in the middle of the protruding direction of the case side protruding portion 15D, the fragile portion 36 is broken and the tip wall portion 34 is removed, When the illegal integrated circuit is attached by scraping the back surface of the specific integrated circuit 22 or when the authorized specific integrated circuit 22 is replaced with another integrated circuit that accommodates the illegal integrated circuit, the fraudulent portion 36 is broken or not. It can be easily detected.

  The fraud prevention structure SE of the seventh embodiment will be described. However, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different components are described. As shown in FIG. 13, the case side protruding portion 15E is substantially the same as the case side protruding portion 15 of the first embodiment, and includes a tip wall portion 15a and a side wall portion 15b, but the side wall portion 15b is fragile. A portion 37 is formed. The distal end surface of the distal end wall portion 15 a is bonded to the rear surface of the specific integrated circuit 2 with a transparent adhesive 30. In the vicinity of the lower end of the side wall portion 15b of the case side protruding portion 15E, a fragile portion 37 cut out in a wedge shape is formed over the entire circumference. The fragile portion 37 is not limited to the wedge shape shown in FIG. 13 and may be, for example, a fragile portion including a cutout portion cut out in a U-shaped cross section. The same operation and effect as the fraud prevention structure SD of the sixth embodiment can be obtained.

  The fraud prevention structure SE of the eighth embodiment will be described. However, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different components are described. As shown in FIG. 14, the case-side protruding portion 38 is formed in a step-down manner in a crank shape downward from the front and rear ends of the front end surface toward the base case 14, and is integrally formed with the base case 14. The case side protruding portion 38 includes a distal end wall portion 38 a whose distal end surface abuts on the back surface of the specific integrated circuit 22, and a proximal end side protruding portion 38 b integrally connected to the main body plate portion of the base case 14.

  The front wall 38 a is formed in a rectangular cross section having a predetermined vertical width and horizontal width, and has the same vertical length and horizontal length as the back surface of the specific integrated circuit 22. The front end wall portion 38a is inserted into the substrate opening 7c of the main control board 7 so that the flat front end surface comes into contact with the back surface of the specific integrated circuit 22, and the transparent adhesive 30 applied on the front end surface allows the specific integrated circuit 22 to It is fixed to the back side.

  As shown in FIG. 14, the base end side protruding portion 38 b is connected to the rear end portion of the front end side protruding portion 38 a at the inner peripheral end and the back surface 7 b in the vicinity of the outer edge of the entire periphery of the substrate opening 7 c of the main control board 7. A middle step wall portion 38c that is adjacently opposed to each other and a base end wall portion 38d that extends rearward from the outer end portion of the back surface of the middle step wall portion 38c toward the main body plate portion of the base case 14 are provided.

  A portion of the front end portion 38t of the middle wall portion 38c facing the plurality of electrode pin mounting holes of the main control board 7 is in contact with the electrode pins 22a of the specific integrated circuit 22 protruding to the back side of the main control board 7. A plurality of electrode pin retraction holes 38e are formed for prevention.

The operation and effect of the fraud prevention structure SF described above will be described.
Since the base-side protruding portion 38b having the tip portion 38t close to the back surface 7b in the vicinity of the outer edge of the substrate opening 7c of the main control board 7 is provided, in order to destroy the case-side protruding portion 38, the main control board 7 Since the base end side projecting portion 38b on the back surface 7b side of the first integrated circuit 22 must be destroyed, it becomes difficult to remove the specific integrated circuit 22, and the fraud prevention function can be enhanced.

  Since the electrode pin retracting hole 38e for preventing contact with the electrode pin 22a of the specific integrated circuit 22 protruding to the back side of the main control board 7 is provided at the distal end portion 38t of the base end side protruding portion 38b, the specific integrated circuit 22 The electrode pins 22a can be mounted on the main control board 7 in a stable state.

A modified example in which the first to eighth embodiments are partially modified will be described.
1] When a plurality of specific integrated circuits 22 are mounted on the integrated circuit mounting surface 7a of the main control board 7, a substrate opening 7c is formed in a portion of the main control board 7 facing the plurality of specific integrated circuits 22. Also good.

  The present invention can be applied to various gaming machines such as various pachinko gaming machines other than the pachinko gaming machines disclosed in the embodiments and slot machines other than pachinko gaming machines.

DESCRIPTION OF SYMBOLS 1 Pachinko machine 7 Main control board 7a Integrated circuit mounting surface 7b Back surface 7c Board opening 11 Board case 13 Cover case 14 Base case 15, 15A, 15C-15E Case side protrusion part 22 Specific integrated circuit 22a Electrode pins 23-25 Integrated circuit 30 Adhesive 36, 37 Fragile portion 38 Case side protruding portion 38b Base end protruding portion 38e Electrode pin retracting hole 38t Tip portion 39 Integrated circuit socket 39a Electrode pin

Claims (7)

In a gaming machine comprising a printed circuit board on which a plurality of integrated circuits are mounted, and a substrate case that accommodates the printed circuit board,
The board case includes a box-shaped first case that covers the outside of the integrated circuit mounting surface of the printed circuit board, and a second case that is disposed close to the back surface opposite to the integrated circuit mounting surface and covers the outside of the back surface. With a case,
A substrate opening is formed in a portion of the printed circuit board facing the specific integrated circuit,
A case-side protrusion provided in the second case so as to protrude toward the specific integrated circuit, the case-side protrusion being inserted into the substrate opening and having a front end surface in contact with or close to the back surface of the specific integrated circuit A gaming machine characterized by providing a section.   The gaming machine according to claim 1, wherein the second case is a transparent synthetic resin molded body, and the case-side protruding portion is integrally formed with the second case.   The gaming machine according to claim 1, wherein a front end surface of the case side protruding portion is fixed to a back surface of the specific integrated circuit with an adhesive.   The gaming machine according to claim 3, wherein a fragile portion that is more fragile than other portions of the case-side protruding portion is provided at a middle portion in the protruding direction of the case-side protruding portion.   The gaming machine according to claim 4, wherein the fragile portion includes a small-diameter column portion whose width in a direction parallel to the printed circuit board is reduced.   Providing a base end side projecting portion that is a base end side projecting portion that is continuous with the base end portion on the second case side of the case side projecting portion, and that has a front end portion close to the back surface of the vicinity of the outer edge of the substrate opening of the printed circuit board. The gaming machine according to claim 3, wherein:   7. An electrode pin retraction hole for preventing contact with an electrode pin of an integrated circuit or integrated circuit socket protruding to the back side of the printed circuit board is provided at a distal end portion of the base end side protruding portion. The gaming machine described.