JP2010177289A - Drive control apparatus, jet solder tank, and automatic soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent solder from overflowing out of a jet solder tank. <P>SOLUTION: When an adjustment request D4 is received by a manual jet adjustment button displayed on an operation panel 9, a controller 20 calculates a solder jet amount that is set by rotary encoders 8A and 8B to a solder jet amount that is preliminarily set in the operation panel 9 to output the calculated solder jet amount to motors M1 and M2. Thereby, if the adjustment request D4 by the manual jet adjustment button is not received by the controller 20, and even when the rotary encoders 8A and 8B are wrongly operated in a direction that the rotation number of the motors M1 and M2 is increased to raise the solder jet amount, overflow of the solder from a jet solder tank can be prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a drive control device that controls drive means such as a motor, a jet solder bath, and an automatic soldering device.

  In general, soldering of a printed circuit board to be incorporated into a home appliance such as a display device such as a television device and a recording / reproducing device such as a video deck is performed by a flow method in order to produce the printed circuit board in large quantities and at low cost. There are many.

  Since the flow method can perform soldering on the entire surface of the printed circuit board at once, it is a soldering method that is superior in mass production as compared with other soldering methods. An automatic soldering apparatus that performs soldering by a flow method is provided with various processing devices such as a preheater, a jet solder bath, and a cooler. Further, these processing apparatuses are provided with a conveyor for conveying the printed circuit board. Such an automatic soldering apparatus performs preheating with a preheater while conveying a printed circuit board coated with flux by a fluxer or the like with a conveyor, adheres solder in a solder bath, and cools the printed circuit board with a cooling machine. Solder can be formed on a predetermined portion of the printed circuit board.

  A jet solder bath is mentioned as the most important component in each processing apparatus of this automatic soldering apparatus. A jet solder bath is a device for soldering by spraying molten solder onto a printed circuit board, and the molten solder is pumped into a duct by a pump, etc., flows from the duct into the nozzle body, and then jets from the nozzle tip. ing. The jet solder bath is used for the purpose of removing the primary jet nozzle used for the purpose of securely soldering electronic components and the like, and the solder attached to other than the predetermined locations attached by the primary jet nozzle. A secondary jet nozzle.

  The amount of solder to be attached to the printed circuit board is determined by the height of the solder jetted from the primary jet nozzle and the secondary jet nozzle of the jet solder tank. It is determined whether or not there is an unsoldering defect in which solder does not adhere to the location. The solder jet height is set with a gauge or the like while adjusting the solder jet flow with the jet volume provided in the jet solder bath after setting the solder jet flow with an input display device such as a touch panel display. The jet height is set.

  Patent Document 1 discloses a soldering apparatus that manually adjusts the height of solder jets. According to this automatic soldering apparatus, the jet volume for manually adjusting the solder jet height is provided in the jet solder tank.

Japanese Patent No. 3398538 (Fig. 4)

  By the way, according to Patent Document 1, if the jet volume provided in the jet solder bath is mistakenly moved before the solder height is adjusted and the power of the jet solder bath is turned on, a large solder jet is generated. The problem is that the solder overflows.

  Therefore, the present invention solves the above-described problems, and an object thereof is to provide an automatic soldering apparatus that can prevent solder from overflowing from a solder bath.

  The drive control device according to the present invention includes a drive unit that drives with a predetermined drive amount, a first setting unit that sets a drive amount that is driven by the drive unit, and a drive amount that is set by the first setting unit. An adjustment reception unit that receives an adjustment request that is a request for adjustment, a second setting unit that sets the drive amount of the drive unit based on the adjustment request received by the adjustment reception unit, and an adjustment request received by the adjustment reception unit A controller that calculates the driving amount set by the second setting unit to the driving amount set by the first setting unit and outputs the calculated driving amount to the driving unit when received. It is a feature.

  According to the drive control device of the present invention, the drive unit is driven with a predetermined drive amount, the first setting unit sets the drive amount of the drive unit, and the adjustment receiving unit is set by the first setting unit. The adjustment request, which is a request for adjusting the drive amount, is received, and the second setting unit sets the drive amount of the drive unit based on the adjustment request received by the adjustment reception unit.

  Based on this assumption, when the adjustment request is received by the adjustment receiving unit, the control unit calculates the driving amount set by the second setting unit to the driving amount set by the first setting unit, and The calculated drive amount is output to the drive unit.

  Thus, when an adjustment request is received by the adjustment receiving unit, the drive amount set by the second setting unit is calculated to the drive amount set by the first setting unit, and the calculated drive amount is driven. If the control unit does not accept an adjustment request from the adjustment accepting unit, even if the second setting unit is erroneously operated in a direction to increase the driving amount of the driving unit, the operation is performed by the first setting unit. It is possible to prevent the drive unit from being driven with a drive amount that is greater than the set drive amount.

  The jet solder bath according to the present invention is set by a jet part for jetting solder at a predetermined jet flow rate, a first setting part for setting the jet flow rate of solder jetted by the jet part, and a first setting part. An adjustment receiving unit that receives an adjustment request that is a request for adjusting the solder jet flow rate, and a second setting unit that sets the solder flow rate of the jet unit based on the adjustment request received by the adjustment receiving unit; When the adjustment request is received by the adjustment receiving unit, the solder jet flow set by the second setting unit is calculated to the solder jet flow set by the first setting unit, and the calculated solder flow rate is calculated. It has a control part which outputs a jet flow to a jet part.

  According to the jet soldering bath according to the present invention, the jet portion jets solder at a predetermined jet flow rate, the first setting portion sets the jet flow rate of the solder jetted by the jet portion, and the adjustment receiving portion is the first The second setting unit sets the solder jet flow rate of the jet part based on the adjustment request received by the adjustment receiving unit.

  Based on this assumption, when an adjustment request is received by the adjustment receiving unit, the control unit calculates the solder jet flow set by the second setting unit to the solder jet flow set by the first setting unit. Then, the calculated solder jet flow rate is output to the jet section.

  Thus, when an adjustment request is received by the adjustment receiving unit, the solder jet flow set by the second setting unit is calculated to the solder jet flow set by the first setting unit, and the calculation is performed. If the control unit does not accept the adjustment request from the adjustment receiving unit, even if the second setting unit is operated in error in the direction of increasing the solder jet flow rate, It becomes possible to prevent the solder from overflowing from the jet solder bath.

  An automatic soldering apparatus according to the present invention is provided in a jet solder bath for jetting solder, and a first jet that sets a jet flow rate of solder jetted by the jet portion and a jet flow portion that jets solder at a predetermined jet flow rate. A setting unit, an adjustment receiving unit that receives an adjustment request that is a request for adjusting the jet flow rate of the solder set by the first setting unit, and provided near the jet solder bath and received by the adjustment receiving unit When the adjustment request is received by the second setting unit that sets the solder jet flow rate of the jet portion based on the adjustment request, and the adjustment receiving unit, the second setting unit sets the second flow rate to the solder jet flow rate set by the first setting unit. The apparatus includes a control unit that calculates the solder jet flow set by the setting unit and outputs the calculated solder jet flow to the jet unit.

  According to the automatic soldering apparatus of the present invention, the jet portion is provided in the jet solder bath for jetting the solder, the solder is jetted at a predetermined jet flow rate, and the first setting portion is a solder jet jetted by the jet portion. The jet flow rate is set, the adjustment acceptance unit accepts a request for adjusting the solder jet flow rate set by the first setting unit, and the second setting unit is provided in the vicinity of the jet solder bath, and the adjustment acceptance unit The solder jet flow rate of the jet part is set based on the adjustment request accepted by the above.

  Based on this assumption, when an adjustment request is received by the adjustment receiving unit, the control unit calculates the solder jet flow set by the second setting unit to the solder jet flow set by the first setting unit. Then, the calculated solder jet flow rate is output to the jet section.

  Thus, when an adjustment request is received by the adjustment receiving unit, the solder jet flow set by the second setting unit is calculated to the solder jet flow set by the first setting unit, and the calculation is performed. If the control unit does not accept the adjustment request from the adjustment receiving unit, even if the second setting unit is mistakenly operated in the direction of increasing the solder jet flow rate, the jet flow is output to the jet unit. It becomes possible to prevent the solder from overflowing from the solder bath.

  According to the drive control device of the present invention, if the control unit does not accept the adjustment request from the adjustment accepting unit, the first setting unit may be operated in the direction of increasing the drive amount of the drive unit by mistake. Since it is possible to prevent the driving unit from being driven by a driving amount operated by the setting unit, it is possible to prevent the driving unit from being overloaded. As a result, it is possible to prevent the drive control device from being destroyed and extend its life.

  According to the jet solder bath of the present invention, if the adjustment request is not accepted by the adjustment accepting portion, even if the second setting portion is erroneously operated in the direction of increasing the solder jet flow rate, the solder from the jet solder bath As a result, it is possible to prevent the jet solder bath and its surroundings from being contaminated with solder.

  According to the automatic soldering apparatus of the present invention, if the control unit does not accept an adjustment request from the adjustment accepting unit, even if the second setting unit is erroneously operated in the direction of increasing the solder jet flow rate, the solder bath Therefore, it is possible to prevent the automatic soldering apparatus and its surroundings from being contaminated with solder.

It is a front view which shows the structural example of the automatic soldering apparatus 1 which concerns on this Embodiment. It is a top view which shows the structural example of the jet soldering tank 5. FIG. FIG. 10 is an explanatory diagram illustrating a display example (part 1) of the operation panel 9; FIG. 11 is an explanatory diagram illustrating a display example (No. 2) of the operation panel 9 It is a block diagram which shows the structural example of the control system of the automatic soldering apparatus. 3 is a block diagram illustrating a configuration example of a control unit 20. FIG. 3 is a flowchart showing an operation example of the automatic soldering apparatus 1.

Hereinafter, an example of an embodiment of an automatic soldering apparatus according to the present invention will be described with reference to the drawings.
The automatic soldering apparatus 1 according to the present embodiment is provided in a jet solder bath 5 that jets solder, and is pumped by a pump unit 56 that is a jet unit that jets solder at a predetermined jet flow rate. A manual jet that is an adjustment receiving unit that receives an operation panel 9 that is a first setting unit for setting the jet flow rate of solder and an adjustment request D4 that is a request for adjusting the jet flow rate of the solder set by the operation panel 9 A first rotary that is a second setting unit that is provided in the adjustment button A9 and the jet solder tank 5 and sets the solder jet flow rate of the pump unit 56 based on the adjustment request D4 received by the manual jet adjustment button A9. Encoder (hereinafter referred to as rotary encoder 8A), second rotary encoder (hereinafter referred to as rotary encoder 8B), and manual jet adjustment button A When the adjustment request D4 is accepted, the solder jet flow set by the rotary encoders 8A and 8B is calculated to the solder jet flow set by the operation panel 9, and the calculated solder jet flow is calculated by the pump unit. The control part 20 output to 56 is provided.

  Thus, when the adjustment request D4 is received by the manual jet flow adjustment button A9, the solder jet flow set by the rotary encoders 8A and 8B is calculated to the solder jet flow set by the operation panel 9, and the calculation is performed. Therefore, if the control unit 20 does not accept the adjustment request D4 by the manual jet adjustment button A9, the rotary encoders 8A and 8B are erroneously operated in the direction of increasing the solder jet flow rate. Even so, it is possible to prevent the solder from overflowing from the jet solder bath 5.

[Configuration example of automatic soldering apparatus 1]
As shown in FIG. 1, an automatic soldering apparatus 1 includes a main body case 2, a first conveyor (referred to as a conveyor 7), a second conveyor (hereinafter referred to as a conveyor 3), a preheater 4, a jet solder bath 5, and a cooler. 6 and an operation panel 9 are provided.

  The main body case 2 is a functional cover that covers the conveyor 3, the preheater 4, the jet solder tank 5, and the cooler 6 and protects the printed circuit board W <b> 1 from being contaminated by particles such as dust from the outside. An operation panel 9 is provided on the main body case 2. The operation panel 9 sets the conveying speed of the conveyors 3, 7, the temperature of the preheater 4, the temperature of the jet solder tank 5, and the solder jet flow rate.

  The conveyor 7 conveys the printed circuit board W <b> 1 into the main body case 2, is connected to the conveyor 3 in the main body case 2, and conveys the printed circuit board W <b> 1 to the conveyor 3. The conveyor 3 receives the printed circuit board W <b> 1 conveyed from the conveyor 7, conveys the printed circuit board W <b> 1 to the preheater 4, the jet solder bath 5, and the cooler 6 and carries it out of the automatic soldering apparatus 1.

  The preheater 4 dries the printed circuit board W1 to which the flux has been applied in the fluxer process, which is a process before the printed circuit board W1 is put into the automatic soldering apparatus 1, and performs soldering in a jet solder bath 5 described later. When performing, the printed circuit board W1 is heated in order to improve the adhesion force of the solder, which is the degree to which the solder is adhered to the printed circuit board W1. The preheater 4 includes a first preheater (hereinafter referred to as preheater 4a), a second preheater (hereinafter referred to as preheater 4b), a third preheater (hereinafter referred to as preheater 4c), and a fourth preheater (hereinafter referred to as preheater 4d). ) And four preheaters 4a, 4b, 4c, and 4d are provided side by side in the transport direction of the printed circuit board W1, and each of the preheaters 4a, 4b, 4c, and 4d can be adjusted in temperature.

  A jet solder bath 5 is provided adjacent to the preheater 4. The jet solder bath 5 sprays solder onto the printed circuit board W1 dried by the preheater 4 to form solder at a predetermined location on the printed circuit board W1. The jet solder bath 5 is a rotary encoder 8A provided in the jet solder bath 5 in which the solder jet flow rate is set by an operation panel 9 to be described later in order to spray molten solder on the conveyed printed circuit board W1 at a uniform height. , 8B finely adjust the solder jet flow set on the operation panel 9. When the rotary encoders 8A and 8B are turned clockwise, the solder jet flow rate can be increased, and when the rotary encoders 8A and 8B are turned counterclockwise, the solder jet flow rate can be reduced.

  A cooling machine 6 is provided adjacent to the jet solder bath 5. The cooler 6 sends air blown by a fan (not shown) constituting the cooler 6 to the printed circuit board W1 to cool the printed circuit board W1 heated in the preheater 4 and the solder bath 5. By cooling the printed circuit board W1 with the cooler 6, it is possible to prevent cracks and the like generated in the solder attached to the printed circuit board W1.

  An operation panel 9 is provided on the upper part of the conveyor 7 in the jet solder bath. The operation panel 9 displays the conveying speed of the conveyors 3 and 7, the temperature of the preheater 4, the temperature of the jet solder tank 5, the jet flow rate, and the like, and can set them. For the operation panel 9, for example, a touch panel display formed of a liquid crystal panel and a touch panel is used.

[Configuration Example of Jet Solder Tank 5]
Next, a configuration example of the jet solder bath 5 according to the present embodiment will be described. As shown in FIG. 2, the jet solder bath 5 includes a solder accommodating part 51, a first nozzle (hereinafter referred to as nozzle 52 </ b> A), a second nozzle (hereinafter referred to as nozzle 52 </ b> B), a pump part 56, and a rotary encoder 8 </ b> A. 8B.

  Solder is accommodated in the solder accommodating portion 51. The solder is, for example, lead-free solder, which is composed of tin-silver-copper, tin-zinc-bismuth, or the like, and has a melting point of about 180 ° C. to 220 ° C.

  The nozzle 52A is referred to as a primary jet nozzle, and in order to securely solder an electronic component or the like to the printed circuit board W1, the jet flow rate of the solder fed by the pump unit 56 is increased to increase the momentum. A certain molten solder is jetted. The nozzle 52B is referred to as a secondary jet nozzle, and is stable by reducing the jet flow rate of the solder pumped by the pump unit 56 in order to remove the solder adhered to a portion other than the predetermined location by the nozzle 52A. The molten solder is jetted.

  The pump unit 56 includes a first screw (hereinafter referred to as a screw 53A), a second screw (hereinafter referred to as a screw 53B), a first belt (hereinafter referred to as a belt 54A), a second belt (hereinafter referred to as a belt 54B). First pulley (hereinafter referred to as pulley 55A), second pulley (hereinafter referred to as pulley 55B), first motor (hereinafter referred to as motor M1) and second motor (hereinafter referred to as motor M2). Is provided.

  The motors M1 and M2 constituting the pump unit 56 are rotationally driven at a predetermined rotational speed. The motors M1 and M2 are provided with pulleys 55A and 55B, respectively. The pulleys 55A and 55B rotate as the motors M1 and M2 are driven to rotate. A belt 54A is wound around the pulley 55A and the screw 53A, and a belt 54B is wound around the pulley 55B and the screw 53B. The pulleys 55A and 55B rotate and the screws 53A and 53B rotate through the belts 54A and 54B to feed the molten solder accommodated in the solder accommodating portion 51 and jet the molten solder from the nozzles 52A and 52B.

  The jet solder bath 5 is provided with rotary encoders 8A and 8B. The rotary encoder 8A adjusts the flow rate of solder jetted from the nozzle 52A. The rotary encoder 8B adjusts the flow rate of the solder jetted from the nozzle 52B. When the manual jet flow adjustment button A9 displayed on the operation panel 9 to be described later is pressed to enable the operation of the rotary encoders 8A and 8B, the flow rate of the solder jetted from the nozzles 52A and 52B set on the operation panel 9 increases. Alternatively, the flow rate of solder can be finely adjusted to be reduced. That is, when the rotary encoders 8A and 8B are rotated clockwise and counterclockwise, adjustment amount information D1A and D1B are output from the rotary encoders 8A and 8B according to the rotational displacement amount. A control unit 20 (described later) receives adjustment amount information D1A and D1B output from the rotary encoders 8A and 8B, and increases or decreases the rotational speeds of the motors M1 and M2 from the adjustment amount information D1A and D1B. Adjust the jet flow rate of the solder to be jetted.

  In the present embodiment, the rotary encoders 8A and 8B are provided in the jet solder bath 5, but within a range in which the user can visually adjust the height of the solder jetted from the jet solder bath 5. If there is, it may be provided in the vicinity of the jet solder bath 5.

[Display example of operation panel 9]
Next, a display example of the operation panel 9 will be described. As shown in FIG. 3, an operation screen for driving the automatic soldering apparatus 1 is displayed on the operation panel 9. The operation panel 9 includes a conveyor setting button A1, preheater setting buttons A2, A3, A4, A5, a solder bath setting button A6, a primary jet setting button (hereinafter referred to as a jet setting button A7), and a secondary jet setting button (hereinafter referred to as a jet setting button). , A jet setting button A8), a manual jet adjustment button A9, a data selection button A10, and a jet flow enable / disable jet display A11.

  The values set on the operation panel 9 are displayed on the upper values of the conveyor setting button A1, the preheater setting buttons A2, A3, A4, A5 and the solder bath setting button A6. Indicates a measured value that is an actual value measured by various sensors or the like.

  The conveyor setting button A1 is a button that can set the conveyance speed of the conveyors 3 and 7. In the present embodiment, as an example, the conveyors 3 and 7 are set to convey at a conveyance speed of 1.0 m / min. When the "conveyor" displayed on the upper part of the conveyor setting button A1 is pressed, the conveyors 3 and 7 are turned on and are driven at the set conveyance speed.

  The preheater setting button A2 is a button that can set the temperature of the preheater 4a. In the present embodiment, as an example, the temperature of the preheater 4a is set to be 250 ° C. When “PH1” displayed at the top of the preheater setting button A2 is pressed, the preheater 4a is turned on and heated at the set temperature.

  The preheater setting button A3 is a button that can set the temperature of the preheater 4b. In the present embodiment, as an example, the temperature of the preheater 4b is set to be 250 ° C. When “PH2” displayed on the upper part of the preheater setting button A3 is pressed, the preheater 4b is turned on and heated at the set temperature.

  The preheater setting button A4 is a button that can set the temperature of the preheater 4c. In the present embodiment, as an example, the temperature of the preheater 4c is set to be 300 ° C. When "PH3" displayed on the upper part of the preheater setting button A4 is pressed, the preheater 4c is turned on and heated at the set temperature.

  The preheater setting button A5 is a button that can set the temperature of the preheater 4d. In the present embodiment, as an example, the preheater 4d is set to be 300 ° C. When "PH4" displayed on the upper part of the preheater setting button A5 is pressed, the preheater 4d is turned on and heated at the set temperature.

  The solder bath setting button A6 is a button that can set the temperature of the solder accommodated in the jet solder bath 5. In this embodiment, as an example, the temperature of the solder is set to 255 ° C. When the “solder tank” displayed on the upper part of the solder tank setting button A6 is pressed, the jet solder tank 5 is turned on to heat the solder at the set temperature.

  The jet setting button A7 is a button that can set the jet flow rate of the solder jetted from the nozzle 52A. Since the jet flow rate of the solder jetted from the nozzle 52A is determined by the number of rotations driven by the motor M1, the jet flow rate of the solder jetted from the nozzle 52A is set by the jet flow setting button A7 and the rotation of the motor M1. Number is set. In the present embodiment, as an example, the maximum jet flow rate of the solder jetted from the nozzle 52A is set to 40% when the maximum jet flow rate is 100%.

  An up arrow is displayed at the lower left of the jet flow setting button A7. When the up arrow is pressed, the value of the jet flow rate is increased by 0.1%. Further, a downward arrow is displayed at the lower right of the jet flow setting button A7, and when this downward arrow is pressed, the value of the jet flow rate is decreased by 0.1%. When the “primary jet” displayed on the upper part of the jet setting button A7 is pressed, if “jet available” is displayed on the jet flow possible / unflowable display A11 described later, soldering is performed from the nozzle 52A at the set jet flow rate. Is sprayed and “no jet flow” is displayed, solder is not jetted from the nozzle 52A.

  The jet setting button A8 is a button that can set the jet flow rate of the solder jetted from the nozzle 52B. Since the jet flow rate of the solder jetted from the nozzle 52B is determined by the number of revolutions driven by the motor M2, the jet flow rate of the solder jetted from the nozzle 52B is set by the jet flow setting button A8, and the rotation of the motor M2 is performed. Number is set. In the present embodiment, as an example, the maximum jet flow rate of the solder jetted from the nozzle 52B is set to 40% when the maximum jet flow rate is 100%.

  An up arrow is displayed at the lower left of the jet flow setting button A8. When the up arrow is pressed, the value of the jet flow rate is increased by 0.1%. Further, a downward arrow is displayed at the lower right of the jet flow setting button A8. When the downward arrow is pressed, the value of the jet flow rate is decreased by 0.1%. When “secondary jet” displayed on the upper part of the jet flow setting button A8 is pressed, if “jet flow is possible” is displayed in the jet flow enable / disable jet display A11, solder is jetted from the nozzle 52B at the set jet flow rate. If “no jet flow” is displayed, the solder is not jetted from the nozzle 52B.

  When the numerical values above the conveyor setting button A1, preheater setting buttons A2, A3, A4, A5, solder tank setting button A6, jet flow setting buttons A7, A8 are pressed, a numeric keypad B1 is displayed as shown in FIG. . By inputting predetermined numerical values with the numeric keypad B1, the conveying speed of the conveyors 3 and 7, the temperatures of the pre-heaters 4a, 4b, 4c, and 4d, the temperature of the jet solder bath 5, and the solder jet flow rate from the nozzles 52A and 52B can be set. .

  Returning to FIG. 3, the manual jet adjustment button A9 is a button that can enable or disable the operation of the rotary encoders 8A and 8B. When the manual jet adjustment button A9 is pressed, the operation of the rotary encoders 8A and 8B is switched between valid and invalid. Immediately after the power of the automatic soldering apparatus 1 is turned on, the operation of the rotary encoders 8A and 8B is invalid, and when the manual jet flow adjustment button A9 is pressed, the operation of the rotary encoders 8A and 8B is enabled. The flow rate of solder can be adjusted by the encoders 8A and 8B.

  The data selection button A10 is a storage unit which will be described later, in which data of the conveyance speed of the conveyors 3 and 7, the temperatures of the preheaters 4a, 4b, 4c, and 4d, the temperature of the solder bath 5, and the solder jet flow rate from the nozzles 52A and 52B are stored. 11 is a button that can be read from the button 11. For example, the storage unit 11 stores 30 pieces of data for each solder process.

  When the data selection button A10 is pressed, the transfer speed of the conveyors 3, 7; the temperatures of the preheaters 4a, 4b, 4c, 4d; the temperature of the solder tank 5; and the solder jet flow rate from the nozzles 52A, 52B are stored. 1-No. A table is displayed so that one of the 30 data items can be selected. No. 1-No. When one of 30 data of 30 is selected, the upper numerical values of the conveyor setting button A1, the preheater setting buttons A2, A3, A4, A5, the solder tank setting button A6, and the jet flow setting buttons A7, A8 are displayed. The set value is displayed, and the system is operated under the displayed conditions.

  For example, in FIG. 12 data is selected, the conveyors 3 and 7 are transported at 1.0 m / min, the preheater 4a is 250 ° C, the preheater 4b is 250 ° C, the preheater 4c is 300 ° C, and the preheater 4d is operated at a temperature of 300 ° C., the jet solder bath 5 is operated at a solder temperature of 255 ° C., and the nozzles 52A and 52B are respectively operated at a solder jet flow rate of 40%.

  Whether or not jetting of solder is possible from the nozzles 52A and 52B is displayed in the jettable / unjetable display A11. When the temperature of the solder is measured by a temperature sensor (not shown) provided in the jet solder bath 5 and a predetermined time has elapsed after reaching the temperature of the solder set by the solder bath setting button A6, “jet flow is possible” is displayed. Is done. If “jet flow is possible” is displayed, solder can be jetted from the nozzles 52A and 52B.

  If the solder temperature set by the solder bath setting button A6 has not been reached and the predetermined time has not elapsed since the solder temperature set by the solder bath setting button A6 has been reached, "no jet flow" Is displayed. If “no jet flow” is displayed, solder is not jetted from the nozzles 52A and 52B. Thereby, it is possible to visually determine whether or not the solder jet is possible.

[Configuration example of control system of automatic soldering apparatus 1]
Next, a configuration example of the control system of the automatic soldering apparatus 1 will be described. As shown in FIG. 5, the automatic soldering apparatus 1 includes a storage unit 11, a control unit 20, a first inverter (hereinafter referred to as an inverter I1), and a second inverter (hereinafter referred to as an inverter I2). The control unit 20 is connected to the conveyors 3 and 7, the preheater 4, the cooler 6, the operation panel 9, the storage unit 11, the rotary encoders 8A and 8B, and the inverters I1 and I2.

  The storage unit 11 stores the conveyance speed of the conveyors 3, 7, the temperature of the preheater 4, the temperature of the jet solder tank 5, the solder jet flow data from the nozzles 52 </ b> A and 52 </ b> B, and the like. When the data selection button A10 (see FIG. 3) displayed on the operation panel 9 is pressed, the various data described above are called up.

  The control unit 20 reads various data stored in the storage unit 11 and displays the data on the operation panel 9. The control unit 20 controls the conveyors 3, 7 and the conveyor 3, 7 and the preheater 4 set at the conveying speed set by the conveyor setting button A 1 and the preheater setting buttons A 2, A 3, A 4, A 5 and the preheater 4 set temperature. The preheater 4 is driven.

  Further, the control unit 20 receives information on the solder flow rate set by the jet flow setting buttons A7 and A8 displayed on the operation panel 9, and the inverters I1 and I2 have an AC voltage having a frequency based on the jet flow rate. Is output. For example, the frequency of the AC voltage is 0 Hz to 50 Hz, and corresponds to 0% to 100% of the solder jet flow rate set by the jet flow setting buttons A7 and A8 described above. That is, when the solder flow rate set by the jet flow setting buttons A7 and A8 is 40%, the frequency of the AC voltage is 20 Hz.

  A motor M1 is connected to the inverter I1, and a motor M2 is connected to the inverter I2. Inverters I1 and I2 perform frequency conversion. Inverters I1 and I2 receive the AC voltage output from control unit 20, convert the AC voltage to an AC voltage having a frequency for driving motors M1 and M2, and then output the AC voltage to motors M1 and M2. The motors M1 and M2 are rotationally driven by the AC voltage output from the inverters I1 and I2, and jet solder from the nozzles 52A and 53B at the solder jet flow set by the jet flow setting buttons A7 and A8.

  When the manual jet adjustment button A9 displayed on the operation panel 9 is pressed on the premise that the solder is jetted from the nozzles 52A and 53B, the control unit 20 causes the solder jet set by the jet setting buttons A7 and A8. The adjustment request D4, which is a request for adjusting the flow rate, is accepted, and the operations of the rotary encoders 8A and 8B are validated. When the operation is validated and the rotary encoder 8A is operated, the rotary encoder 8A outputs adjustment amount information D1A to the control unit. When the operation is validated and the rotary encoder 8B is operated, the rotary encoder 8B outputs adjustment amount information D1B to the control unit.

  The control unit 20 receives the adjustment amount information D1A, D1B output from the rotary encoders 8A, 8B, and sets the frequency of the AC voltage corresponding to the rotation speed of the motors M1, M2 set by the jet flow setting buttons A7, A8. Then, AC voltages D2A and D2B are generated by calculating at a frequency corresponding to the adjustment amount information D1A and D1B. For example, when the jet flow rate of solder is set to 40% with the jet flow setting button A7, the control unit 20 generates an AC voltage having a frequency of 20 Hz. When the rotary encoder 8A is rotated clockwise to change the frequency by 2 Hz, the adjustment amount information D1A becomes information “+2 Hz”. The control unit 20 receives the information, performs a calculation process of 20 Hz + 2 Hz, and generates an AC voltage D2A having a frequency of 22 Hz.

  Control unit 20 outputs generated AC voltages D2A and D2B to inverters I1 and I2. The inverters I1 and I2 receive the AC voltages D2A and D2B output from the control unit 20 and convert the AC voltages D2A and D2B into AC voltages D3A and D3B having frequencies for driving the motors M1 and M2, respectively. Output to M1 and M2. The motors M1 and M2 are rotationally driven by the AC voltages D3A and D3B output from the inverters I1 and I2, and jet solder from the nozzles 52A and 53B at the solder jet flow adjusted by the rotary encoders 8A and 8B.

[Configuration Example of Control Unit 20]
Next, a configuration example of the control unit 20 will be described. The control unit 20 includes a CPU 21, a ROM 22, a RAM 23, a first I / O (hereinafter referred to as I / O 24), a second I / O (hereinafter referred to as I / O 25), and a system bus 26.

  The CPU 21 is connected to the I / O 24. The CPU 21 is connected to the ROM 22, RAM 23, and I / O 25 via the system bus 26. The I / O 24 is connected to the conveyors 3 and 7, the preheater 4, the cooler 6, the operation panel 9, the storage unit 11, and the inverters I1 and I2. The I / O 25 is connected to the rotary encoders 8A and 8B.

  The ROM 22 stores in advance a start program that is a program for starting the automatic soldering apparatus 1. When the power of the automatic soldering apparatus 1 is turned on, the CPU 21 reads the activation program stored in the ROM 22 and activates the automatic soldering apparatus 1. The CPU 21 drives the conveyors 3, 7, the preheater 4, and the jet solder tank 5 with the conveying speed of the conveyors 3, 7 set on the operation panel 9, the temperature of the preheater 4, the temperature of the jet solder tank 5, and the solder jet flow rate. . When the manual jet adjustment button A9 displayed on the operation panel 9 is pressed, the CPU 21 receives the adjustment request D4 and permits the output from the I / O 25. The RAM 23 stores information on the solder jet flow set on the operation panel 9.

  The I / O 24 includes information on the conveyance speed measured by the speed sensors of the conveyors 3 and 7, information on the temperature measured by the temperature sensor of the preheater 4, information on the temperature measured by the temperature sensor of the jet solder bath 5, The setting information of each soldering process set on the operation panel 9 and the setting information of each soldering process stored in the storage unit 11 are input, and the I / O 24 outputs them to the CPU 21.

  Further, the I / O 24 outputs drive information for driving the conveyors 3 and 7 at a desired conveyance speed, drive information for heating the preheater 4 to a desired temperature, and a display for displaying various data on the operation panel 9. Information and setting data of each soldering process are output to the conveyors 3 and 7, the preheater 4, the operation panel 9, and the storage unit 11. The I / O 25 validates the operation of the rotary encoders 8A and 8B according to the adjustment request D4 output from the CPU 21. If the adjustment request D4 is not received, the I / O 25 disables the operation of the rotary encoders 8A and 8B.

[Example of operation of automatic soldering apparatus 1]
Next, an operation example of the automatic soldering apparatus 1 will be described. As shown in FIG. 7, in step ST <b> 1, when the automatic soldering apparatus 1 is turned on, the CPU 21 reads a program for starting the automatic soldering apparatus 1 stored in advance in the ROM 22. The CPU 21 outputs display information for displaying the display example shown in FIG. 3 on the operation panel 9 via the I / O 24 to display an operation screen on the operation panel 9.

  When the data selection button A10 on the operation panel 9 is pressed, various solder processing data stored in the storage unit 11 is read and displayed on the operation panel. When desired data is selected from the displayed data, the fact that the desired data has been selected is output to the CPU 21, and various desired solder processing data are read from the storage unit 11. The various solder processing data read out are numerical values on the upper side of the conveyor setting button A1, preheater setting buttons A2, A3, A4, A5, solder tank setting button A6, jet flow setting buttons A7, A8 of the operation panel 9 as setting values. Is displayed.

  When the process proceeds to step ST2 and the numerical value above the solder bath setting button A6 displayed on the operation panel 9 is pressed, the numeric keypad B1 is displayed as shown in FIG. For example, when “2”, “2”, “5”, and “ENT” are pressed with the numeric keypad B1, the temperature of the solder accommodated in the jet solder bath 5 is set to 225 ° C. After the set temperature of the solder is determined, when the “solder tank” on the upper side of the solder tank setting button A6 is pressed, the solder is heated at the set temperature (for example, 225 ° C.).

  Moving to step ST3, the CPU 21 determines whether the solder has reached the set temperature based on the output from the temperature sensor provided in the jet solder bath 5. If the solder reaches the set temperature and a predetermined time has passed, “jet flow is possible” is displayed in the jet flow possible / unflowable display A11 of the operation panel 9 (step ST4). If the solder has not reached the set temperature, “no jet flow” is displayed in the jet flow possible / unflowable display A11 on the operation panel 9, and the process returns to step ST3 again to continue monitoring the solder temperature.

  Moving to step ST5, the CPU 21 causes the RAM 23 to store information on the solder jet flow rate set by the jet flow setting buttons A7 and A8. When the CPU 21 presses the “primary jet” and “secondary jet” above the jet setting buttons A7 and A8 shown in FIG. 3, the CPU 21 pumps at the solder jet flow set by the jet setting buttons A7 and A8. The part 56 is driven and the solder is pumped. The solder sent by pressure is jetted from the nozzles 52A and 52B.

  When the process proceeds to step ST6 and the manual jet adjustment button A9 displayed on the operation panel 9 is pressed, an adjustment request D4 which is a request for adjusting the solder jet flow set by the jet setting buttons A7 and A8 is issued. It is output to the CPU 21. The CPU 21 determines whether or not the adjustment request D4 has been received. When the adjustment request D4 is received, the process proceeds to step ST7. If the adjustment request D4 is not received, the process proceeds to step ST10.

  In step ST7, the CPU 21 permits input from the I / O 25 to validate the operation of the rotary encoders 8A and 8B provided in the jet solder bath 5.

  When the process proceeds to step ST8 and the rotary encoders 8A and 8B are operated to adjust the solder jetted from the nozzles 52A and 52B, the adjustment amount information D1A and D1B output from the rotary encoders 8A and 8B are changed to I / I. It is input to the CPU 21 via O25. The CPU 21 converts the frequency into an AC voltage frequency corresponding to the adjustment amount information D1A and D1B output from the rotary encoders 8A and 8B via the I / O 25, and sets the converted frequency and the jet flow setting buttons A7 and A8. The AC voltages D2A and D2B are generated by calculating the frequency of the AC voltage corresponding to the solder jet flow.

  In step ST9, the CPU 21 outputs the generated AC voltages D2A and D2B to the inverters I1 and I2 via the I / O 24. Inverters I1 and I2 convert AC voltages D2A and D2B to AC voltages D3A and D3B having a frequency at which motors M1 and M2 are driven, and output AC voltages D3A and D3B to motors M1 and M2. The motors M1 and M2 are rotationally driven by the AC voltages D3A and D3B output from the inverters I1 and I2, and jet solder from the nozzles 52A and 53B at the solder jet flow adjusted by the rotary encoders 8A and 8B.

  In step ST10, the CPU 21 prohibits input from the I / O 25 in order to invalidate the operation of the rotary encoders 8A and 8B provided in the jet solder bath 5. For this reason, even if the rotary encoders 8A and 8B are operated, the adjustment amount information D1A and D1B cannot be input to the I / O 25. Returning to step ST6 again, the CPU 21 waits for reception of the adjustment request D4.

  Thus, according to the automatic soldering apparatus 1 according to the present embodiment, the pump unit 56 is provided in the jet solder tank 5 that jets solder, and jets solder at a predetermined jet flow rate. The operation panel 9 sets the flow rate of solder jetted by the pump unit 56. The manual jet adjustment button A9 receives an adjustment request D4 that is a request for adjusting the solder jet flow set by the operation panel 9. The rotary encoders 8A and 8B are provided in the jet solder bath 5 and set the jet flow rate of the solder jetted by the pump unit 56 based on the adjustment request D4 received by the manual jet adjustment button A9.

  Based on this assumption, when the adjustment request D4 is received by the manual jet adjustment button A9, the control unit 20 sets the solder jet flow set by the rotary encoders 8A and 8B to the solder jet flow set by the operation panel 9. And the calculated solder jet flow rate is output to the pump unit 56.

  Thus, when the adjustment request D4 is received by the manual jet flow adjustment button A9, the solder jet flow set by the rotary encoders 8A and 8B is calculated to the solder jet flow set by the operation panel 9, and the calculation is performed. Therefore, if the control unit 20 does not accept the adjustment request D4 by the manual jet adjustment button A9, the rotary encoders 8A and 8B are erroneously operated in the direction of increasing the solder jet flow rate. Even so, it is possible to prevent the solder from overflowing from the jet solder bath 5. As a result, the automatic soldering apparatus 1 and its surroundings can be prevented from being contaminated with solder.

  In the present embodiment, the automatic soldering apparatus 1 has been described. However, the present invention can also be applied to a drive control apparatus that controls driving means such as a motor. In this embodiment, the rotary flow rate of the solder jetted from the nozzle 52A is adjusted using the rotary encoder 8A, and the jet flow rate of the solder jetted from the nozzle 52B is adjusted using the rotary encoder 8B. A changeover switch for switching the adjustment of the jet flow rate of the solder jetted from the nozzle 52A and the nozzle 52B may be provided in the jet solder bath 5 and adjusted by one rotary encoder.

  The present invention is extremely suitable when applied to a drive control device that controls drive means such as a motor, a jet solder bath, and an automatic soldering device.

DESCRIPTION OF SYMBOLS 1 Automatic soldering apparatus 2 Main body case 3 2nd conveyor 4 Preheater 5 Jet solder tank 6 Cooling machine 7 1st conveyor 8A 1st rotary encoder 8B 2nd rotary encoder 9 Operation panel 11 Memory | storage part 20 Control part

Claims (6)

A drive unit for driving with a predetermined drive amount;
A first setting unit for setting a driving amount driven by the driving unit;
An adjustment receiving unit that receives an adjustment request that is a request for adjusting the drive amount set by the first setting unit;
A second setting unit that sets a driving amount of the driving unit based on the adjustment request received by the adjustment receiving unit;
When the adjustment request is received by the adjustment receiving unit, the driving amount set by the second setting unit is calculated to the driving amount set by the first setting unit, and the calculated driving amount is A drive control device comprising a control unit that outputs to the drive unit.   The drive control apparatus according to claim 1, wherein a rotary encoder is used for the second setting unit. A jet part for jetting solder at a predetermined jet flow rate;
A first setting unit that sets a flow rate of solder jetted by the jet unit;
An adjustment receiving unit that receives an adjustment request, which is a request for adjusting the flow rate of solder set by the first setting unit;
A second setting unit that sets a jet flow rate of solder in the jet part based on the adjustment request received by the adjustment receiving unit;
When the adjustment request is received by the adjustment receiving unit, the solder jet flow set by the second setting unit is calculated to the solder jet flow set by the first setting unit, and the calculation is performed. A jet solder bath comprising a controller that outputs a jet flow of solder to the jet section.   The jet solder bath according to claim 3, wherein a rotary encoder is used for the second setting unit. Provided in a jet solder bath for jetting solder, and a jet section for jetting the solder at a predetermined jet flow rate;
A first setting unit that sets a flow rate of solder jetted by the jet unit;
An adjustment receiving unit that receives an adjustment request, which is a request for adjusting the flow rate of solder set by the first setting unit;
A second setting unit that is provided in the vicinity of the jet solder tank and sets a jet flow rate of solder in the jet unit based on the adjustment request received by the adjustment receiving unit;
When the adjustment request is received by the adjustment receiving unit, the solder jet flow set by the second setting unit is calculated to the solder jet flow set by the first setting unit, and the calculation is performed. An automatic soldering apparatus comprising a control unit that outputs a jet flow of solder to the jet unit.   The automatic soldering apparatus according to claim 5, wherein a rotary encoder is used for the second setting unit.

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