JP2010167110A - Ultrasonic diagnostic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic diagnostic apparatus which has less power source connection wires, is hardly affected by other circuits, and has an effect that power sources with less noise are supplied. <P>SOLUTION: The ultrasonic diagnostic apparatus includes: a plurality of printed substrates; a power source circuit part 5 for supplying a plurality of power sources to the printed substrates; stacking connectors 6 for connecting the printed substrates while stacked. The plurality of power sources supplied from the power source circuit part 5 are distributed to the plurality of printed substrates by way of the stacking connectors 6. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a multilayer substrate structure using a plurality of power supplies, and more particularly to an ultrasonic diagnostic apparatus that performs image diagnosis using ultrasonic waves.

  As the medical image diagnostic apparatus, an ultrasonic diagnostic apparatus, an X-ray CT apparatus, an MRI apparatus, and the like are well known. Among them, the ultrasonic diagnostic apparatus irradiates an ultrasonic pulse signal generated from an ultrasonic probe into a living body and constructs a tomographic image based on the ultrasonic signal reflected in the living body to perform diagnosis. Therefore, it has a feature that it can be inspected non-invasively and in real time.

  Since a tomographic image can be displayed more easily than other image diagnostic apparatuses, there is an increasing demand for a portable ultrasonic diagnostic apparatus with good image quality.

  Therefore, there is a demand for downsizing and weight reduction of the apparatus while improving functions for improving image quality.

  However, in order to achieve miniaturization, since the circuit board configuration is mounted with high density, it is impossible to provide a sufficient distance between circuits and between boards. As a result, problems such as generation of electrical noise and crosstalk between signals occur.

  As a result, circuit design and pattern design are required so as not to be affected by peripheral portions as much as possible in signal transmission on and between substrates.

  Therefore, the influence from other circuits is reduced as much as possible by separating analog signals and digital signals that are vulnerable to noise into different board arrangements or mounting them on the board for each circuit function.

  Each circuit of the ultrasonic diagnostic apparatus requires different power sources. A power source for generating ultrasonic waves is a high voltage power source of 100 to 150 V, and a digital signal processing circuit for processing received signals and a circuit for controlling signals use a power source of about several volts. In the analog signal processing circuit, a power supply of about 5 to 12V is used.

  Thus, since the voltage used in each circuit is different, different power supply is required for each substrate.

A conventional ultrasonic diagnostic apparatus has a configuration in which a plurality of printed circuit boards are vertically connected to a mother board having a plurality of connectors as shown in FIG. In this configuration, signal transmission and power supply between substrates are performed via a mother board and a cable (for example, see Patent Document 1).
JP 2001-137220 A

  However, since the conventional ultrasonic diagnostic apparatus has a large number of power supplies, when power is supplied from the power supply circuit to each board by a cable, the number of cables is large, and the connection distance becomes long, so noise is likely to be carried. There was a problem. In addition, when signal transmission and power supply between boards are performed via a mother board, wiring concentrates on one side of the board (side to be connected to the mother board), which reduces the degree of freedom in pattern design.

  The present invention solves the conventional problems, it is not necessary to supply power to each board from the power supply circuit, the number of cables is reduced as much as possible, noise is reduced, and the degree of freedom in pattern design is high. Furthermore, it aims at providing the ultrasonic diagnosing device which can determine the arrangement | positioning of a connection connector comparatively freely.

The ultrasonic diagnostic apparatus of the present invention includes a plurality of printed circuit boards, a power supply unit that supplies a plurality of power supplies to the printed circuit board, a plurality of power supplies that connect the printed circuit boards and that are supplied from the power supply unit. And a board-to-board connector for distributing to a plurality of printed boards.
A stacking structure in which a plurality of substrates are connected horizontally and a necessary voltage is sent from a substrate supplied with power to another substrate via a stacking connector.

  With this configuration, by connecting multiple boards horizontally with a board-to-board connector (for example, a stacking structure connector), the connection distance from the power supply circuit to the board can be shortened, and is not easily affected by other circuits. A power supply with less noise can be supplied. In addition, since the stacking structure is used, the connector position can be determined between adjacent boards, so that restrictions on circuit design and pattern design for noise suppression are reduced.

  In addition, the ultrasonic diagnostic apparatus of the present invention has a configuration in which power is supplied from a power supply board to a printed circuit board with a large current consumption, and a necessary voltage is distributed from the printed circuit board to another printed circuit board via a stacking connector. Yes.

  With this configuration, it is not necessary to supply power to each printed circuit board, and the number of cables for supplying power from the power supply circuit can be reduced.

  Furthermore, the ultrasonic diagnostic apparatus of the present invention has a configuration in which power is supplied to a substrate with a high usage rate for each voltage value, and power is supplied from the substrate to another substrate.

  With this configuration, since the current flowing through the stacking connector can be reduced, the number of wires between the connectors can be reduced.

  The present invention has a stacked (stacking) structure in which a plurality of boards are connected horizontally by a connector, and a power supply is provided by sending a necessary voltage from a board supplied with power to another board via a (stacking) connector. Since the connection distance from the circuit to the substrate is shortened, it is possible to provide an ultrasonic diagnostic apparatus having an effect of being able to supply a power source with less noise and less affected by other circuits.

  Hereinafter, an ultrasonic diagnostic apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  An ultrasonic diagnostic apparatus according to a first embodiment of the present invention is shown in FIG.

In FIG. 1, an ultrasonic diagnostic apparatus includes an ultrasonic probe (not shown), a transmission circuit unit 1 connected to the ultrasonic probe and transmitting ultrasonic waves, and a receiving circuit unit 2 receiving. A signal control circuit unit 3 for controlling the reception signal and the transmission signal, a digital signal processing circuit unit 4 for creating image data from the reception signal, a power supply circuit unit 5 for supplying power to the circuits, For example, a stacking connector 6 as a connector for connecting the circuit unit, an operation unit (not shown) as an input interface unit, and an image display unit (not shown) for displaying a synthesized image on a monitor are provided. .

  The ultrasonic probe includes a piezoelectric vibrator at the tip, converts an electric signal from the transmission circuit unit 1 into an ultrasonic wave, and transmits the ultrasonic signal into the living body. The transmitted ultrasonic waves are partially reflected in the living body at interfaces having different acoustic impedances. This reflection is detected by the ultrasonic probe and sent to the receiving circuit unit 2 as a voltage.

  The received signal sent to the receiving circuit unit 2 is amplified by a preamplifier, and subjected to delay control and addition. Thereafter, the signal digitized by A / D conversion is imaged by the digital signal processing circuit unit 4 and displayed as an ultrasonic tomographic image on the image display unit.

  The operation of the ultrasonic diagnostic apparatus configured as described above will be described with reference to FIGS. 1 and 2.

  2 corresponds to the circuit units 1 to 5 shown in FIG. 1 and the substrates configured by the circuit units described above are the substrates 7 to 11, respectively.

  As shown in FIG. 2, the ultrasonic diagnostic apparatus has a stacking structure in which a transmission circuit board 7, a reception circuit board 8, a signal control circuit board 9 and a digital signal processing circuit board 10 are horizontally connected by a stacking connector 12. is there.

  In the ultrasonic diagnostic apparatus, it is necessary to apply a high voltage of 100 to 150 V to the transmission circuit board 7 in order to generate ultrasonic waves from the ultrasonic probe. However, since the signal control circuit board 9 and the digital signal processing circuit board 10 handle digital signals, a voltage of several volts is used, and the receiving circuit board 8 performs analog signal processing using a voltage of about 5 to 12V. . In this way, the use voltage value is different for each circuit.

  In this configuration, in order to supply power of different voltage values to each circuit unit, power is first supplied from the power supply circuit board 11 to the transmission circuit board 7 with large current consumption. Then, a necessary voltage is supplied from the transmission circuit board 7 to another board via the stacking connector.

  According to the ultrasonic diagnostic apparatus of the first embodiment of the present invention as described above, the power supply from the power circuit board 11 to each board is limited to the board a having a large current consumption, and the board a to another board b. By transmitting a necessary voltage to (a board whose power consumption is smaller than that of the board a), the power transmission capacity c up to the board a and the power transmission capacity d between the boards a and b are set as follows. Therefore, the capacity can be reduced, so that the number of wirings and cables from the power circuit board 11 to each board can be reduced in sequence, and the number of boards can be reduced. ) Is used to distinguish between the two.)

  As described above, the ultrasonic diagnostic apparatus of the present invention has a stacked (stacking) structure in which a plurality of boards are horizontally connected by connectors, and a necessary voltage is supplied from a power-supplied board to another board via a (stacking) connector. By providing a configuration that sends power to each board, it is not necessary to supply power to each board from the power supply circuit, the number of cables is reduced as much as possible, and the connection distance from the power supply circuit to the board is shortened. Therefore, it is possible to supply a power source that is less susceptible to noise and with less noise, has a high degree of freedom in pattern design, and can determine the arrangement of connection connectors relatively freely.

  Next, FIG. 3 shows an ultrasonic diagnostic apparatus according to the second embodiment of the present invention.

In the second embodiment, the substrate is connected in the same stacking connection structure as in the first embodiment of the present invention described above, and from the power supply circuit section via the stacking connector 12 to the substrate having a high usage rate first for each voltage value. In this configuration, power is supplied.

  The operation of the ultrasonic diagnostic apparatus configured as described above will be described with reference to FIGS.

  When power is supplied via the stacking connector 12, the connector has a limit on the current value that can be flown per pin. Therefore, if the required current is large, the number of wires between the connectors increases.

  Therefore, in the second embodiment of the present invention, as shown in FIG. 3, a high-voltage power source (for example, about 100 to 150 V) is sent to the transmitting circuit board 7, and a medium-voltage power source of 5 to 12 V is sent to the receiving circuit board 8. A low voltage power supply of about V is supplied to the control circuit board 9.

  As described above, power is first supplied from the power supply circuit unit to the substrate A having a high usage rate for each voltage value. The boards supplied with power supply use the same voltage value, but supply power to the board B having a lower usage rate than the board A via the stacking connector 12. The supply is sequentially performed in the same manner.

  As described above, according to the ultrasonic diagnostic apparatus of the second embodiment of the present invention, the current flowing through the stacking connector 12 can be reduced by supplying power to a board having a high usage rate for each voltage value. The number of wires between connectors can be reduced.

  In the above description, the board connection structure as shown in FIG. 2 is used. However, the connection order and circuit position are not established, and the board connection order and circuit arrangement are switched. Can be similarly implemented.

  In addition, although the transmission circuit board 7 is cited as a circuit board with a large current consumption, if the power consumption of the other board becomes larger due to the circuit configuration, the power is supplied to the board and the power is distributed to the other board. This configuration can also be implemented.

  Further, the arrangement of the stacking connector 12 can be arbitrarily determined on the printed circuit board, and not only a method of arranging the stacking connectors 12 in the same place up and down as shown in FIG. The structure can also be implemented.

As described above, the ultrasonic diagnostic apparatus according to the present invention has an effect of being able to supply a power source with less noise and less affected by other circuits, and relates to a multilayer substrate structure using a plurality of power sources. In particular, it is useful as an ultrasonic diagnostic apparatus that performs image diagnosis using ultrasonic waves.

The block diagram of the ultrasonic diagnostic apparatus in the 1st Embodiment of this invention Configuration diagram for explaining the operation of the ultrasonic diagnostic apparatus according to the first embodiment of the present invention Block diagram of an ultrasonic diagnostic apparatus in the second embodiment of the present invention Configuration diagram of conventional ultrasonic diagnostic equipment

DESCRIPTION OF SYMBOLS 1 Transmission circuit part 2 Reception circuit part 3 Signal control circuit part 4 Digital signal processing circuit 5 Power supply circuit part 6 Stacking connector 7 Transmission circuit board 8 Reception circuit board 9 Signal control circuit board 10 Digital signal processing circuit board 11 Power supply circuit board 12 Stacking connector

Claims (3)

A plurality of printed circuit boards, a power supply unit that supplies a plurality of power supplies to the printed circuit board, and a substrate that connects the printed circuit boards and distributes a plurality of power supplies supplied from the power supply unit to the plurality of printed circuit boards A connector,
An ultrasonic diagnostic apparatus comprising:   2. The ultrasonic diagnostic apparatus according to claim 1, wherein power is supplied from a power supply board to a printed circuit board having a large current consumption, and a necessary power supply is supplied from the printed circuit board having a large current consumption to another printed circuit board. The ultrasonic diagnostic apparatus according to claim 1, wherein power is supplied from a power supply board to a printed circuit board having a high usage rate for each voltage value, and power is supplied from the printed circuit board to another printed circuit board.