JP2010164664A - Liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal display device that is free from causing a path in a sealing agent for sealing the filling port of a liquid crystal. <P>SOLUTION: The liquid crystal display device includes: first and second substrates arranged oppositely to each other while holding the liquid crystal between them; and a sealing material which is arranged between the first and second substrates and used for filling the liquid crystal. The filling port to be sealed by the sealing agent is formed in a part of the sealing material. An insulation film is formed on the liquid crystal-side of the first substrate, so that the insulation film is formed beyond a sealing material-formed area and is separated from the end of the first substrate by a value of >0 mm and <0.5 mm. The insulation film consists of the laminate of a plurality of insulation films containing an organic insulation film. The organic insulation film, at least, has ≥2 μm thickness and is formed such that the organic insulation film is receded from the end of the first substrate by a value of ≥0.5 mm in a portion where the filling port of the sealing material is formed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a liquid crystal display device, and more particularly, to an insulating film formed on the liquid crystal side of a substrate opposed to and sandwiching liquid crystal, and to the structure of the insulating film in a liquid crystal sealing port.

  In a liquid crystal display device (panel), an envelope is configured by a pair of substrates opposed to each other with a liquid crystal sandwiched between them and a sealing material that encloses the liquid crystal between these substrates.

  The image display unit of the liquid crystal display device includes a plurality of pixels arranged in a matrix, and an insulating film, a conductive film, a semiconductor film, and the like having a predetermined pattern are arranged in a predetermined order on the liquid crystal side surface of each substrate. It is comprised by laminating | stacking.

  In addition, a liquid crystal sealing port is formed in a part of the sealing material, and after the liquid crystal is sealed in the envelope through the liquid crystal sealing port, the liquid crystal sealing port is sealed by application of a sealing agent. It is configured.

  FIG. 9 is a diagram showing a configuration of a liquid crystal sealing port in a sealing material in a conventional liquid crystal display device. 9A is a plan view, FIG. 9B is a sectional view taken along line IXb-IXb in FIG. 9A, and FIG. 9C is a sectional view taken along line IXc-IXc in FIG. 9A. FIG. 9D is a cross-sectional view taken along the line IXd-IXd in FIG. FIG. 9 is drawn corresponding to FIG. 1 showing the embodiment of the present invention. For this reason, the detailed configuration other than the following description in FIG. 9 is referred to the description in FIG.

  In FIG. 9A, there are substrates SUB1 and SUB2. The substrates SUB1 and SUB2 are obtained by cutting a pair of multi-piece substrates after pasting them together via a seal material SL. For this reason, the side wall surfaces at the edges of the substrates SUB1 and SUB2 are formed in the same plane (indicated by reference numeral α in FIGS. 9B, 9C, and 9D).

  Insulating films GI, PAS1, PAS2, and LI for forming the image display portion AR are sequentially stacked on the surface of the substrate SUB1 on the liquid crystal side, in front of the end of the substrate SUB1 (indicated by a distance w in the drawing). ) To be formed. The insulating film GI is a gate insulating film of a thin film transistor (not shown) formed in the image display part AR, and the insulating films PAS1 and PAS2 are formed in the upper layer of the thin film transistor to avoid contact with the liquid crystal of the thin film transistor. It is a protective film. The insulating film PAS1 is made of an inorganic insulating film, and the insulating film PAS2 is made of, for example, an organic insulating film coated with resin or the like. The insulating film PAS2 is formed, for example, to flatten the surface, and the film thickness thereof is relatively large (film thickness of 2 μm or more). In addition, the insulating film LI is an interlayer insulating film that provides electrical insulation between the pixel electrode and the counter electrode for applying an electric field to the liquid crystal in each pixel. Here, each of the insulating films GI, PAS1, PAS2, and LI is formed to extend to the front of the end of the substrate SUB1 (indicated by a distance w in the drawing), and the formation to reach the end is avoided. The reason is that when the substrate SUB1 is cut from the multi-piece substrate, the cutting is facilitated.

  The sealing material SL is disposed in the vicinity of the periphery of the substrates SUB1 and SUB2, and is formed on the insulating film LI. And the part interrupted in a part of sealing material SL is comprised as the liquid-crystal enclosure port ECL. Further, each of the end portions of the sealing material SL formed by the intermittent portions extends so as to be directed toward the end portions of the substrates SUB1 and SUB2 (indicated by reference sign SLe in the drawing), and in the liquid crystal sealing port ECL, the liquid crystal Is configured as a pattern that can be easily guided into the image display portion AR.

  In FIG. 9, a plurality of dot-shaped sealing materials (indicated by reference numeral SLd in the figure) are arranged in parallel on the extended line of the sealing material SL formed along the periphery of the substrates SUB1 and SUB2 in the liquid crystal sealing port ECL. Is formed. This is to prevent the height of the liquid crystal sealing port ECL (the gap between the substrate SUB1 and the substrate SUB2) from being reduced when the width of the liquid crystal sealing port ECL is large.

  In addition, there exist the patent documents 1, 2, and 3 shown below as literature relevant to this invention.

  Patent Document 1 has a configuration in which the insulating film formed on the liquid crystal side surface of one substrate and the insulating film formed on the liquid crystal side surface of the other substrate are removed from the liquid crystal sealing port of the sealing material. . In this case, in the substrate on which the thin film transistor is formed (the substrate corresponding to the substrate SUB1 in FIG. 9), the insulating film (protective film) formed by covering the thin film transistor is formed by, for example, the CVD (Chemical Vapor Deposition) method. An inorganic insulating film such as silicon oxide or silicon nitride is used, and its film thickness is as small as about 1 μm. In other words, a relatively large protective film corresponding to the insulating film PAS2 shown in FIG. 9 is not formed.

  Patent Document 2 discloses a liquid crystal display device using a thermosetting or infrared curable resin mixed with solid particles such as glass fiber as a sealing agent for sealing a liquid crystal sealing port. Thereby, the shrinkage at the time of hardening of sealing agent is made small. There is no mention of the configuration of an insulating film or the like formed on the liquid crystal side surface of the pair of substrates sandwiching the liquid crystal.

  Patent Document 3 discloses a liquid crystal display device using a resin mixed with conductive particles as a sealing agent for sealing a liquid crystal sealing port. Thus, the pair of substrates sandwiching the liquid crystal is set as a designed gap, and the conductivity between the electrodes formed on each substrate is maintained. In the surface of each substrate on the liquid crystal side, only the description on which the electrodes are arranged is limited.

JP-A-6-175141 JP-A-8-304838 JP-A-8-62607

  However, in the configuration shown in FIG. 9, when the liquid crystal sealing port ECL is sealed with the sealing agent ESL after the liquid crystal is sealed through the liquid crystal sealing port ECL of the sealing material SL, the sealing agent ESL is penetrated. A pass occurred, and bubbles or contaminants entered the liquid crystal in the envelope through this pass.

  As a result of investigating the cause, the following was found. That is, in the configuration shown in FIG. 9, a plurality of insulating films GI, insulating films PAS1, insulating films PAS2, and insulating films LI formed on the liquid crystal side surface of the substrate SUB1 are stacked, and the end portion of the substrate SUB1 is stacked. (Distance w from the end in the figure). For this reason, in the liquid crystal sealing port ECL, a stepped portion with the substrate SUB1 at the end sides (indicated by E in the drawing) of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI starts from the end of the substrate SUB1. It will be positioned slightly separated. For this reason, at the time of sealing with the sealing agent ESL, the sealing agent ESL is formed on the stepped portion.

  In this case, as shown in FIGS. 9C and 9D, the liquid crystal LC remains at the stepped portion with the substrate SUB1 at the edge E of the insulating films GI, PAS1, PAS2, and LI because the step is high. A part of the liquid crystal LC is pushed inward or outward of the sealant ESL due to the sealant ESL entering the image display part AR when the sealant ESL is sealed. As a result, the path of the liquid crystal LC in the sealant ESL is formed as the path.

  This problem occurs when the level difference is high in the liquid crystal filling port ECL, for example, when the film thickness of the insulating film PAS2 made of an organic insulating film is 2 μm or more. There is no problem because it does not remain much in the stepped portion. Further, this problem occurs when the stepped portion is relatively close to the end of the substrate SUB1 in the liquid crystal sealing port ECL, for example, when the distance w is larger than 0 mm and smaller than 0.5 mm.

  An object of the present invention is to provide a liquid crystal display device in which no path is generated in the sealant that seals the liquid crystal sealing port.

  In the liquid crystal display device of the present invention, the step of the insulating film on which the sealing agent that seals the liquid crystal sealing port rides is eliminated from the liquid crystal sealing port, or the height of the step is greatly reduced. It is made into composition.

  The configuration of the present invention can be as follows, for example.

(1) A liquid crystal display device of the present invention includes a first substrate and a second substrate that are disposed to face each other with a liquid crystal interposed therebetween,
A sealing material disposed between the first substrate and the second substrate and enclosing the liquid crystal;
The sealing material is configured by forming a sealing port sealed with a sealant in a part thereof,
An insulating film is formed on the liquid crystal side surface of the first substrate, and the insulating film is separated from the edge of the first substrate by a value greater than 0 mm and less than 0.5 mm beyond the sealing material formation region. A liquid crystal display device formed,
The insulating film is composed of a stack of a plurality of insulating films including an organic insulating film, and at least the organic insulating film has a thickness of 2 μm or more, and in the portion where the sealing port of the sealing material is formed, It is formed by retreating from the end portion of the first substrate by a value of 0.5 mm or more.

(2) In the liquid crystal display device according to the present invention, in (1), at least the organic insulating film may be formed on the first substrate without crossing an imaginary line that connects the inner circumferences of the sealing material in a plan view. It is formed by retreating from the end portion.

(3) The liquid crystal display device according to the present invention is the liquid crystal display device according to (1), wherein at least the organic insulating film exceeds the virtual line connecting the inner periphery of the sealing material when viewed in a plan view. It is formed by retreating from the part.

(4) The liquid crystal display device according to the present invention is characterized in that, in (1), a thin film transistor is formed on the liquid crystal side surface of the first substrate, and the organic insulating film is formed on an upper layer of the thin film transistor. To do.

(5) The liquid crystal display device of the present invention is characterized in that, in (1), the sealing agent is mixed with insulating fine particles.

(6) The liquid crystal display device of the present invention includes a first substrate and a second substrate that are opposed to each other with a liquid crystal interposed therebetween,
A sealing material disposed between the first substrate and the second substrate and enclosing the liquid crystal;
The sealing material is configured by forming a sealing port sealed with a sealant in a part thereof,
An insulating film is formed on the liquid crystal side surface of the first substrate, and the insulating film is separated from the edge of the first substrate by a value greater than 0 mm and less than 0.5 mm beyond the sealing material formation region. A liquid crystal display device formed,
The insulating film is composed of a stacked body of a plurality of insulating films including an organic insulating film, the organic insulating film has a thickness of 2 μm or more, and the stacked body is formed with the sealing port of the sealing material. The portion is formed so as to recede from the end of the first substrate by a value of 0.5 mm or more.

(7) The liquid crystal display device according to the present invention is the liquid crystal display device according to (6), wherein the stacked body has an end portion of the first substrate in a plan view without crossing an imaginary line connecting the inner periphery of the sealing material. It is characterized by being formed by retreating.

(8) The liquid crystal display device according to the present invention is the liquid crystal display device according to (6), wherein the laminate is viewed from a plan view, beyond an imaginary line connecting the inner periphery of the sealing material, from the end of the first substrate. It is formed by retreating.

(9) The liquid crystal display device according to the present invention is characterized in that, in (6), a thin film transistor is formed on the liquid crystal side surface of the first substrate, and the organic insulating film is formed on an upper layer of the thin film transistor. To do.

(10) A liquid crystal display element device of the present invention includes a first substrate and a second substrate that are disposed to face each other with a liquid crystal interposed therebetween,
A sealing material disposed between the first substrate and the second substrate and enclosing the liquid crystal;
The sealing material is configured by forming a sealing port sealed with a sealant in a part thereof,
An insulating film is formed on the liquid crystal side surface of the first substrate, and the insulating film is separated from the edge of the first substrate by a value greater than 0 mm and less than 0.5 mm beyond the sealing material formation region. A liquid crystal display device formed,
The insulating film is composed of a stacked body of a plurality of insulating films including an organic insulating film, the organic insulating film has a thickness of 2 μm or more, and the stacked body is formed with the sealing port of the sealing material. In the portion, the side wall surface is formed in the same plane as the side wall surface of the end portion of the first substrate.

(11) The liquid crystal display device of the present invention is characterized in that, in (10), a thin film transistor is formed on a surface of the first substrate on the liquid crystal side, and the organic insulating film is formed on an upper layer of the thin film transistor. To do.

  The above-described configuration is merely an example, and the present invention can be modified as appropriate without departing from the technical idea. Further, examples of the configuration of the present invention other than the above-described configuration will be clarified from the entire description of the present specification or the drawings.

  According to the liquid crystal display device described above, it is possible to prevent a path from being generated in the sealant that seals the liquid crystal sealing port.

  Other effects of the present invention will become apparent from the description of the entire specification.

It is a principal part block diagram which shows Example 1 of the liquid crystal display device of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a whole block diagram which shows Example 1 of the liquid crystal display device of this invention. It is a block diagram of the pixel of Example 1 of the liquid crystal display device of this invention. It is a principal part block diagram which shows Example 2 of the liquid crystal display device of this invention. It is a principal part block diagram which shows Example 3 of the liquid crystal display device of this invention. It is a principal part block diagram which shows Example 4 of the liquid crystal display device of this invention. It is a principal part block diagram which shows Example 5 of the liquid crystal display device of this invention. It is a principal part block diagram which shows Example 6 of the liquid crystal display device of this invention. It is a principal part block diagram which shows an example of the conventional liquid crystal display device.

  Embodiments of the present invention will be described with reference to the drawings. In each drawing and each example, the same or similar components are denoted by the same reference numerals and description thereof is omitted.

(Overall schematic configuration)
FIG. 2 is a schematic plan view showing Example 1 of the liquid crystal display device of the present invention. The liquid crystal display device shown in FIG. 2 is a liquid crystal display device for mobile phones, for example.

  In FIG. 2, a substrate SUB1 and a substrate SUB2 made of glass, for example, are arranged facing each other. The substrate SUB1 and the substrate SUB2 are arranged on the other three sides except one side so that the side wall surfaces of these sides are in the same plane. This is because the substrates SUB1 and SUB2 are obtained by bonding a pair of multi-piece substrates through a sealing material (indicated by reference numeral SL in FIG. 2) and then cutting them. The substrate SUB2 is configured to expose the substrate SUB1 on one side on the lower side in the drawing, and a pixel driving semiconductor device (chip) SEC is mounted face down on the exposed surface of the substrate SUB1. Yes.

  A liquid crystal LC (see FIGS. 1B, 1C, and 1D) is sandwiched between the substrate SUB1 and the substrate SUB2. The liquid crystal LC is sealed between the substrate SUB1 and the substrate SUB2 by the sealing material SL. The sealing material SL is formed in an annular pattern along the periphery of the substrate SUB2, and serves to fix the substrate SUB1 and the substrate SUB2. The sealing material SL is formed on the surface on the substrate SUB2 side by printing or application by a dispenser, for example. The area surrounded by the sealing material SL is configured to constitute an image display portion AR composed of a set of a plurality of pixels having the liquid crystal LC as one constituent element.

  Note that the sealing material SL has a liquid crystal sealing port ECL formed by an intermittent portion of the sealing material SL, for example, at a part of the side opposite to the side where the semiconductor device SEC is disposed. The liquid crystal sealing port ECL is sealed with a sealant ESL after the liquid crystal LC is sealed between the substrate SUB1 and the substrate SUB2. The configuration near the liquid crystal sealing port ESL will be described in detail later.

  In a region on the liquid crystal side of the substrate SUB1 and surrounded by the sealing material SL, gate signal lines GL extending in the x direction in the drawing and arranged in parallel in the y direction, and extending in the y direction in the drawing and x Drain signal lines DL arranged in parallel in the direction are formed. The pixel region is configured by a region surrounded by a pair of adjacent gate signal lines GL and a pair of adjacent drain signal lines DL, and the image display unit AR is configured by a set of pixel regions arranged in a matrix. It has become so. The liquid crystal display device shown in this embodiment is called, for example, an IPS (In Plane Switching) or a horizontal electric field system, and a common signal line CL is formed between a pair of adjacent gate signal lines GL. A counter electrode CT is formed on the substrate SUB1 side together with a pixel electrode PX to be described later, and the counter electrode CT is connected to the common signal line CL.

  In the image display portion AR, for example, an equivalent circuit of a pixel region indicated by a dotted circle is shown by a solid circle (indicated by A in the figure). In the pixel region, a thin film transistor TFT which is turned on by a signal (scanning signal) from the gate signal line GL, a pixel electrode PX to which a signal (video signal) from the drain signal line DL is supplied through the turned on thin film transistor TFT, A counter electrode CT that generates an electric field is provided between the pixel electrode PX and the pixel electrode PX. A signal (reference signal) serving as a reference for the video signal is supplied to the counter electrode CT through the common signal line CL.

  Each gate signal line GL is connected to the output electrode of the semiconductor device SEC, for example, with a lead wire WG drawn from one end thereof. In the case of this embodiment, for example, the gate signal line GL formed above the image display portion AR is drawn from the left end in the drawing, and the gate signal line GL formed below is drawn from the right end in the drawing. It is drawn out by the wiring WG. However, the present invention is not limited to this, and all may be configured to be pulled out from the end in the same direction. Each drain signal line DL is connected to the output electrode of the semiconductor device SEC with a lead wire WD drawn from the lower end in the drawing. Each of the common signal lines CL is led out by a common lead wire WC at the right end portion in the drawing, for example, and the lead wire WC is connected to the output electrode of the semiconductor device SEC.

  The liquid crystal display device shown in FIG. 2 is configured such that a signal from the semiconductor device SEC is directly input to each gate signal line GL. However, a scanning signal driving circuit including a thin film transistor made of polysilicon, for example, may be formed on the substrate SUB1, and a signal may be supplied to each gate signal line GL through the scanning signal driving circuit.

(Pixel configuration)
FIGS. 3A and 3B are diagrams showing the configuration of pixels formed on the liquid crystal side surface of the substrate SUB1, and the configuration of the portion in the solid line circle frame A shown in FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along line IIIb-IIIb in FIG. 3A.

  First, on the liquid crystal side surface of the substrate SUB1, gate signal lines GL extending in the x direction and arranged in parallel in the y direction are formed. An insulating film GI is formed on the surface of the substrate SUB1 so as to cover the gate signal line GL, and this insulating film GI functions as a gate insulating film in a formation region of a thin film transistor TFT described later.

  A semiconductor layer AS made of, for example, amorphous Si is formed in an island shape in the formation region of the thin film transistor TFT that overlaps a part of the gate signal line GL on the surface of the gate insulating film GI. In the thin film transistor TFT, a drain electrode DT and a source electrode ST arranged opposite to each other are formed on the surface of the semiconductor layer AS, so that a part of the gate signal line GL has an inverted stagger structure MIS ( Metal Insulator Semiconductor) type transistors are constructed.

  A drain signal line DL extending in the y direction in the drawing and arranged in parallel in the x direction is formed on the surface of the substrate SUB1, and a part of the drain signal line DL extends to the surface of the semiconductor layer AS. Thus, the extended portion is used as the drain electrode DT of the thin film transistor TFT. In addition, when the drain signal line DL is formed, the source electrode ST of the thin film transistor TFT is formed, and the source electrode ST includes a pad portion PD that extends to the pixel region beyond the formation region of the semiconductor layer AS. Has been. The pad portion PD is configured as a portion that is electrically connected to a pixel electrode PX described later.

  An insulating film PAS is formed on the surface of the substrate SUB1 so as to cover the drain signal line DL and the like. The insulating film PAS is made of a protective film for avoiding direct contact with the liquid crystal of the thin film transistor TFT. For example, the insulating film PAS1 made of an inorganic insulating film (for example, a film thickness of 300 nm) and the protective film PAS2 made of an organic insulating film ( For example, it is composed of a laminated structure having a film thickness of 2 μm or more. The reason why the organic insulating film is used in the insulating film PAS2 is to provide an effect of flattening the surface of the insulating film PAS, for example.

  A common signal line CL formed along the traveling direction of the gate signal line GL is formed between the pair of adjacent gate signal lines GL on the surface of the insulating film PAS. The common signal line CL is formed so as to cover substantially the entire area of each pixel region arranged in parallel in the x direction in the drawing, and has a configuration in which the counter electrode CT is also provided in each pixel region. The common signal line CL (counter electrode CT) is made of a translucent conductive film made of ITO (Indium Tin Oxide), for example.

An insulating film LI (for example, a film thickness of 300 nm) made of an inorganic insulating film is formed on the surface of the substrate SUB1 so as to cover the common signal line CL (counter electrode CT), and each pixel region is formed on the upper surface of the insulating film LI. A pixel electrode PX is formed. The insulating film LI functions as an interlayer insulating film that provides interlayer insulation between the pixel electrode PX and a counter electrode CT described later. The pixel electrode PX is composed of, for example, a plurality of (for example, three in the figure) linear electrodes extending in the y direction in the drawing and arranged in parallel in the x direction. The connection part JN connected mutually is provided. The pixel electrode PX is made of a translucent conductive film made of ITO (Indium Tin Oxide), for example. A part of the connection portion JN of the pixel electrode PX is electrically connected to the pad portion PD of the source electrode ST through a through hole TH formed in the interlayer insulating film LI and the insulating film PAS. In this case, in the common signal line CL (counter electrode CT), an opening OP that is substantially coaxial with the through hole TH and has a diameter sufficiently larger than the through hole TH is formed in advance, and the pixel electrode PX is opposed to the pixel electrode PX. An electrical short-circuit with the electrode CT is avoided.

(Configuration of liquid crystal sealing port ECL)
FIG. 1 is a configuration diagram showing the liquid crystal sealing port ECL. 1A is an enlarged plan view of a portion in the dashed-dotted line frame B in FIG. 2, FIG. 1B is a sectional view taken along line Ib-Ib in FIG. 1A, and FIG. Is a cross-sectional view taken along line Ic-Ic in FIG. 1A, and FIG. 1D is a cross-sectional view taken along line Id-Id in FIG.

  First, on the surface of the substrate SUB1 on the liquid crystal side, the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI formed in the image display unit AR are sequentially stacked, and the substrate SUB1 is formed. It is formed until it comes close to the end.

  In this case, the laminated body of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI is separated from the end of the substrate SUB1 by a distance w (greater than 0 mm and from 0.5 mm) except for the liquid crystal sealing port ECL. (Small value) is formed. As described above, the substrate SUB1 and the substrate SUB2 are obtained by cutting a pair of multi-piece substrates after bonding them through the sealant SL. The formation of a stacked body of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI is avoided. In particular, since it is the organic insulating film (insulating film PAS2) having a large film thickness that affects the cutting, at least the organic insulating film (insulating film PAS2) is avoided from being formed at the cutting position, and other inorganic insulating films (Insulating films GI, PAS1, and LI) may be formed at the cut portions.

  In this case, the insulating film GI and the insulating film PAS1 are formed so as to be separated from the edge of the substrate SUB1 by a distance w (a value larger than 0 mm and smaller than 0.5 mm) in the liquid crystal sealing port ECL. The insulating film PAS2 and the insulating film LI are formed so as to be separated from the end portion of the substrate SUB1 by a distance W (> w). This distance W is set to a value greater than or equal to the penetration distance from the end of the substrate SUB1 when the liquid crystal sealing port ECL is sealed with a sealant ESL to be described later. Specifically, the distance W is set to a value of 0.5 mm or more. The reason why the insulating film PAS2 is retracted from the end of the substrate SUB1 toward the image display portion AR in the liquid crystal sealing port ECL is that the insulating film PAS2 is formed to be relatively thick with a thickness of 2 μm or more. This is because the sealant ESL does not ride over the large step formed by the PAS2.

  In Example 1, the sequential laminated body of the insulating film PAS2 and the insulating film LI in the liquid crystal filling port ECL has an inner periphery (an inner periphery on the image display unit AR side) of the sealing material SL in plan view. It is formed so as to recede from the end of the substrate SUB1 without exceeding the connecting virtual line (two-dot chain line γ in the figure).

  Here, the reason why the insulating film PAS2 and the insulating film LI are largely retracted from the end portion of the substrate SUB1 in the liquid crystal sealing port ECL portion and not so much retracted from the end portion of the substrate SUB1 in the other portions is the substrate SUB1. This is because the wiring (for example, the lead-out wiring WG, WD, WC shown in FIG. 2), the terminal, etc. formed in the vicinity of the end of the insulating film PAS2 and the insulating film LI are protected by the extension. is there. In this case, there is a method in which the insulating film PAS2 and the insulating film LI are left only in portions where the wirings, terminals, and the like are formed. In this case, the insulating film is formed in the formation region of the sealing material SL described later. This is because irregularities due to the presence / absence of PAS2 are formed, resulting in inconvenience in adjusting the height of the sealing material SL. Accordingly, at least the insulating film PAS2 is formed to extend to the outside beyond the formation region of the sealing material SL over almost the entire circumference except for the liquid crystal sealing port ECL.

  Also, the insulating film LI, like the insulating film PAS2, is set back from the end of the substrate SUB1 by a distance W because the insulating film L1 is disposed above the insulating film PAS2 and the insulating film PAS2 is selected. This is because the insulating film LI is also performed simultaneously with the etching. However, the insulating film LI may be formed in the same pattern as the insulating film GI and the insulating film PAS1, and may be formed so as to be separated from the end portion of the substrate SUB1. This is because the insulating film LI is made of an inorganic insulating film such as silicon oxide or silicon nitride, and has a relatively thin film thickness. Even in this case, the effect of the present invention can be obtained.

  A sealing material SL is formed around the substrate SUB1 by, for example, printing or a dispenser. The seal material SL can be formed on the surface with few irregularities on the laminated body of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI in a portion excluding the liquid crystal sealing port ECL, and the height thereof is almost the same. Can be constant.

  The liquid crystal sealing port ECL is formed at an intermittent location of the sealing material SL, and each end portion SLe of the sealing material SL formed by the intermittent portion is formed extending toward the end portion side of the substrate SUB1. Has been. As a result, the liquid crystal sealing port ECL has a pattern in which the liquid crystal can be easily guided into the image display part AR. In the liquid crystal sealing port ECL, a plurality of dot-shaped sealing materials (indicated by reference sign SLd in the drawing) are formed side by side on an extension line of the sealing material SL formed along the periphery of the substrate SUB1. This is to prevent the height (the gap between the substrate SUB1 and a substrate SUB2 described later) of the liquid crystal sealing port ECL from becoming small when the width of the liquid crystal sealing port ECL is large.

  Note that the sealing material SLd is arranged so that the center viewed in plan is substantially positioned at the step portion of the sequentially laminated body of the insulating film PAS2 and the insulating film LI. Thereby, the space between the substrate SUB1 and the substrate SUB2 in the region on the image display unit AR side and the region on the liquid crystal sealing port ECL side with the stepped portion of the stacked body as a boundary is matched by the sealing material SLd.

  In addition, there is a substrate SUB2 that is disposed to face the substrate SUB1 with the sealing material SL interposed therebetween. As described above, since the substrate SUB2 is formed by cutting a pair of multiple substrates together with the substrate SUB1, the side wall surface is the same plane as the side wall surface of the substrate SUB1 (FIG. 1B). , (C), and (d). On the surface of the substrate SUB2 on the liquid crystal side, for example, a black matrix (light-shielding film) BM provided with an opening for each effective area of the pixel, and a flattening film OC made of resin, for example, covers the black matrix BM. Is formed. In this embodiment, the planarization film OC is extended to the end of the substrate SUB2, for example. This is because the planarization film OC is formed to be relatively thin, and there is no inconvenience in cutting the substrate SUB2.

  The liquid crystal sealing port ECL is sealed by applying a sealing agent ESL after sealing the liquid crystal through the liquid crystal sealing port ECL. Here, the penetration of the sealing agent ESL into the liquid crystal sealing port ECL overcomes the step of the sequentially laminated body of the insulating film GI and the insulating film PAS1, and the step portion of the sequentially laminated body of the insulating film PAS2 and the insulating film LI (in the drawing) It is in a state of being stopped before (indicated by reference symbol E ′) (see FIGS. 1C and 1D). Usually, the penetration of the sealing agent ESL into the liquid crystal sealing port ECL is about 0.5 mm (≦ W) from the end of the substrate SUB1, and in the case of the configuration shown in FIG. 1, the insulating film PAS2 and the insulating film LI are sequentially formed. It is rare to get over the stepped portion E ′ of the laminate.

  Therefore, the liquid crystal remaining in the vicinity of the stepped portion E ′ of the insulating film PAS2 and the insulating film LI is not affected at all by the penetration of the sealing agent SEL, and causes a path in the sealing agent SEL. Also disappear. Therefore, according to the liquid crystal display device described above, it is possible to prevent a path from being generated in the sealing agent ESL that seals the liquid crystal sealing port ECL.

  FIG. 4 is a block diagram showing Embodiment 2 of the liquid crystal display device of the present invention. 4A is an enlarged plan view of a portion in the dashed-dotted line frame B in FIG. 2, FIG. 4B is a sectional view taken along line IVb-IVb in FIG. 4A, and FIG. Is a cross-sectional view taken along line IVc-IVc in FIG. 4A, and FIG. 4D is a cross-sectional view taken along line IVd-IVd in FIG. 4A, corresponding to FIG.

  In FIG. 4, the structure different from the case of FIG. 1 is that the sealing agent ESL is mixed with insulating fine particles BZ such as silica beads. In the configuration shown in FIG. 4, there is a stepped portion (indicated by symbol E ″ in the drawing) due to the sequential stack of the insulating film GI and the insulating film PAS1 in the liquid crystal sealing port ECL. The stepped portion E ″ has a relatively small height, and even if the stepped portion E ″ is climbed when the sealant ESL enters, it is extremely difficult for the sealant ESL to have a path that can be fatal. Become rare.

  However, in order to eliminate the occurrence of the above-described path in the sealing agent ESL, it is extremely effective to previously mix the insulating fine particles BZ such as silica beads in the sealing agent ESL. In such a case, the insulating fine particles BZ in the sealant ESL cause the liquid crystal to remain in the stepped portion E ″ even if the liquid crystal remains in the stepped portion E ″ when the sealant ESL enters. This is because the effect of extruding from "is obtained.

  FIG. 5 is a block diagram showing Embodiment 3 of the liquid crystal display device of the present invention. 5A is an enlarged plan view of a portion in the dashed-dotted line frame B in FIG. 2, FIG. 5B is a cross-sectional view taken along the line Vb-Vb in FIG. 5A, and FIG. Is a cross-sectional view taken along the line Vc-Vc in FIG. 5A, and FIG. 5D is a cross-sectional view taken along the line Vd-Vd in FIG. 5A, corresponding to FIG.

  In FIG. 5, the configuration different from the case of FIG. 1 is that, in the liquid crystal filling port ECL, the insulating film GI and the insulating film PAS1 are separated from the end of the substrate SUB1 by a distance W as in the case of the insulating film PAS2 and LI. It is that it is formed by retreating with the value of. That is, the sequential stack of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI recedes from the end of the substrate SUB1 by a value of W (> w) in the portion where the liquid crystal sealing port ECL is formed. To be formed.

  In this case, in the portion where the liquid crystal sealing port ECL is not formed, the sequential stack of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI is formed from the end portion of the substrate SUB1 as in the case of FIG. They are formed so as to be separated by a value of w (greater than 0 mm and smaller than 0.5 mm). As described above, this is because the wiring (for example, the lead-out wirings WG, WD, and WC shown in FIG. 2), terminals, and the like formed in the vicinity of the end portion of the substrate SUB1 are protected by the formation of the stacked body.

  According to such a configuration, it is possible to configure such that no step portion due to the insulating film is formed in the region where the sealing agent ESL enters on the surface on the liquid crystal side of the substrate SUB1 in the liquid crystal sealing port ECL. For this reason, the sealing agent ESL does not run on the step portion of the insulating film, and a path does not occur in the sealing agent ESL.

  FIG. 6 is a block diagram showing Embodiment 4 of the liquid crystal display device of the present invention. 6A is an enlarged plan view of a portion in the dashed-dotted line frame B in FIG. 2, FIG. 6B is a sectional view taken along line VIb-VIb in FIG. 6A, and FIG. Is a sectional view taken along the line VIc-VIc in FIG. 6A, FIG. 6D is a sectional view taken along the line VId-VId in FIG. 6A, and corresponds to FIG.

  In FIG. 6, the configuration different from the case of FIG. 5 is as follows. First, the sequential stacked body of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI in the liquid crystal sealing port ECL is viewed in plan view. That is, the seal material SL is formed so as to recede from the end of the substrate SUB1 beyond a virtual line (two-dot chain line γ in the figure) connecting the inner circumference of the seal material SL. Therefore, the retreating amount W ′ from the end of the substrate SUB1 of the sequentially laminated body of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI is larger than the case (W) shown in FIG. . Thereby, when sealing the liquid crystal sealing port ECL with the sealing agent ESL, the configuration in which the sealing agent ESL may enter the liquid crystal sealing port ECL more than necessary is considered.

  As the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI sequentially retreat as described above, the dot-shaped sealing material SLd is also retreated from the position shown in FIG. It comes to form. As described above, this is because the distance between the substrate SUB1 and the substrate SUB2 in the region on the image display unit AR side and the region on the liquid crystal sealing port ECL side with the stepped portion of the stacked body as a boundary is matched.

  In the fourth embodiment, the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI are further retracted in the liquid crystal sealing opening ECL. However, among these insulating films, only the insulating film PAS2 and the insulating film LI may be used. That is, the sequential stacked body of the insulating film PAS2 and the insulating film LI shown in FIG. 1 is viewed in plan, and exceeds the virtual line (two-dot chain line γ in the figure) connecting the inner periphery of the sealing material SL. You may make it retreat from the edge part of SUB1.

  FIG. 7 is a block diagram showing Embodiment 5 of the liquid crystal display device of the present invention. 7A is an enlarged plan view of a portion in the dashed-dotted line frame B in FIG. 2, FIG. 7B is a sectional view taken along line VIIb-VIIb in FIG. 7A, and FIG. Is a sectional view taken along line VIIc-VIIc in FIG. 7A, FIG. 7D is a sectional view taken along line VIId-VIId in FIG. 7A, and corresponds to FIG.

   In FIG. 7, the configuration different from that in FIG. 5 is that the sequential stack of the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI in the liquid crystal filling port ECL protrudes toward the end side of the substrate SUB1. The side wall surface of the laminate is formed in the same plane as the side wall surface of the substrate SUB1.

  That is, by sequentially forming the insulating film GI, the insulating film PAS1, the insulating film PAS2, and the insulating film LI in a region where the sealing agent ESL is formed in the liquid crystal sealing port ECL, the sealing agent In the region where the ESL penetrates, the step portion due to these insulating films is eliminated.

  Accordingly, even with such a configuration, the sealing agent ESL does not run on the stepped portion of the insulating film, so that no path is generated in the sealing agent ESL.

  In this case, when the substrate SUB1 and the substrate SUB2 are obtained by cutting after bonding a pair of multi-piece substrates, the insulating film GI, the insulating film PAS1, the insulating film PAS2, Although there is a region where the sequential laminated body of the insulating films LI exists, since this region is extremely small, there is no problem in cutting the substrate SUB1 and the substrate SUB2.

  FIG. 8 is a block diagram showing Embodiment 6 of the liquid crystal display device of the present invention. 8A is an enlarged plan view of the portion in the one-dot chain line frame B in FIG. 2, FIG. 8B is a cross-sectional view taken along the line VIIIb-VIIIb in FIG. 8A, and FIG. Is a cross-sectional view taken along line VIIIc-VIIIc in FIG. 8A, FIG. 8D is a cross-sectional view taken along line VIIId-VIIId in FIG. Yes.

  In FIG. 8, a different configuration from that in FIG. 1 is that the dot-shaped sealing material SLd arranged in parallel in the liquid crystal sealing port ECL is not provided. The dot-shaped sealing material SLd is for avoiding fluctuations in the height of the liquid crystal sealing port ECL (the gap between the substrate SUB1 and the substrate SUB2) as described above, and the present invention can be achieved without these sealing materials SLd. This is because it can be applied.

  In FIG. 8, the dot-shaped sealing material SLd is not formed in the configuration shown in the first embodiment. However, it goes without saying that such a configuration may be performed for the configurations shown in the second to fifth embodiments.

  The present invention has been described using the embodiments. However, the configurations described in the embodiments so far are only examples, and the present invention can be appropriately changed without departing from the technical idea. Further, the configurations described in the respective embodiments may be used in combination as long as they do not contradict each other.

SUB1, SUB2 ... Substrate, SL ... Sealing material, AR ... Image display, ECL ... Liquid crystal sealing port, ESL ... Sealant, SEC ... Semiconductor device, GL ... Gate signal line, WG ... Lead wire (gate signal line), DL ... Drain signal line, WD ... Lead wire (drain signal line), CL ... Common signal line, WC ... Lead wire (common signal line), TFT ... Thin film transistor, DT ... Drain electrode, ST ... Source electrode, PD ... Pad part, PX ... Pixel electrode, CT ... Counter electrode, PD ... Pad part, TH ... Through hole, GI ... Insulating film ( Gate insulating film), PAS1 ... insulating film (protective film: inorganic insulating film), PAS2 ... insulating film (protective film: organic insulating film), LI ... insulating film (interlayer insulating film), SLe ... sealing material Edge, SLd ... G-shaped sealing material, BM: black matrix (light shielding film), OC: planarization film, BZ: insulating fine particles.

Claims (11)

A first substrate and a second substrate that are arranged opposite to each other with a liquid crystal sandwiched between them;
A sealing material disposed between the first substrate and the second substrate and enclosing the liquid crystal;
The sealing material is configured by forming a sealing port sealed with a sealant in a part thereof,
An insulating film is formed on the liquid crystal side surface of the first substrate, and the insulating film is separated from the edge of the first substrate by a value greater than 0 mm and less than 0.5 mm beyond the sealing material formation region. A liquid crystal display device formed,
The insulating film is composed of a stack of a plurality of insulating films including an organic insulating film, and at least the organic insulating film has a thickness of 2 μm or more, and in the portion where the sealing port of the sealing material is formed, A liquid crystal display device, wherein the liquid crystal display device is formed to recede at a value of 0.5 mm or more from an end portion of the first substrate.   The at least organic insulating film is formed so as to recede from an end portion of the first substrate without crossing an imaginary line connecting the inner periphery of the sealing material in a plan view. Item 2. A liquid crystal display device according to item 1.   The at least organic insulating film is formed so as to recede from an end portion of the first substrate across a virtual line connecting an inner periphery of the sealing material in a plan view. 2. A liquid crystal display device according to 1.   2. The liquid crystal display device according to claim 1, wherein a thin film transistor is formed on a surface of the first substrate on the liquid crystal side, and the organic insulating film is formed on an upper layer of the thin film transistor.   The liquid crystal display device according to claim 1, wherein the sealing agent is mixed with insulating fine particles. A first substrate and a second substrate that are arranged opposite to each other with a liquid crystal sandwiched between them;
A sealing material disposed between the first substrate and the second substrate and enclosing the liquid crystal;
The sealing material is configured by forming a sealing port sealed with a sealant in a part thereof,
An insulating film is formed on the liquid crystal side surface of the first substrate, and the insulating film is separated from the edge of the first substrate by a value greater than 0 mm and less than 0.5 mm beyond the sealing material formation region. A liquid crystal display device formed,
The insulating film is composed of a stacked body of a plurality of insulating films including an organic insulating film, the organic insulating film has a thickness of 2 μm or more, and the stacked body is formed with the sealing port of the sealing material. The liquid crystal display device is characterized by being formed to recede at a value of 0.5 mm or more from the end portion of the first substrate.   The laminated body is formed so as to recede from an end portion of the first substrate without crossing an imaginary line that connects the inner circumferences of the sealing material in a plan view. A liquid crystal display device according to 1.   7. The laminate according to claim 6, wherein the laminate is formed so as to recede from an end portion of the first substrate across a virtual line connecting the inner circumferences of the sealing material in a plan view. The liquid crystal display device described.   The liquid crystal display device according to claim 6, wherein a thin film transistor is formed on a surface of the first substrate on the liquid crystal side, and the organic insulating film is formed on an upper layer of the thin film transistor. A first substrate and a second substrate that are arranged opposite to each other with a liquid crystal sandwiched between them;
A sealing material disposed between the first substrate and the second substrate and enclosing the liquid crystal;
The sealing material is configured by forming a sealing port sealed with a sealant in a part thereof,
An insulating film is formed on the liquid crystal side surface of the first substrate, and the insulating film is separated from the edge of the first substrate by a value greater than 0 mm and less than 0.5 mm beyond the sealing material formation region. A liquid crystal display device formed,
The insulating film is composed of a stacked body of a plurality of insulating films including an organic insulating film, the organic insulating film has a thickness of 2 μm or more, and the stacked body is formed with the sealing port of the sealing material. The liquid crystal display device is characterized in that the side wall surface is formed in the same plane as the side wall surface of the end portion of the first substrate.   11. The liquid crystal display device according to claim 10, wherein a thin film transistor is formed on a surface of the first substrate on the liquid crystal side, and the organic insulating film is formed on an upper layer of the thin film transistor.

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