JP2010150524A - Ethylenic resin for wire covering or for sheath, and electric wire and cable - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ethylenic resin for wire covering or for sheath excellent in impulse resistance and thermal deformation resistance. <P>SOLUTION: The ethylenic resin for wire covering or for sheath satisfies all of the following conditions: (a) a density of 890-930 kg/m<SP>3</SP>; (b) a melt flow rate (MFR) of 0.1-10 g/10 min; (c) an energy of activation for fluidity (Ea) of <50 kJ/mol; (d) Mz/Mw ≥3.5; (e) (Mz/Mw)/(Mw/Mn)≥0.9; and (f) a quantitative proportion of eluted resin at ≥100°C, measured by temperature rising elution fractionation, of <1 wt.% (provided that the weight of the ethylenic resin is considered to be 100 wt.%). <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to an ethylene-based resin for covering an electric wire or a sheath, an electric wire and a cable.

  Ethylene-based resins including high-density polyethylene and low-density polyethylene are used for covering electric wires. For example, Patent Document 1 describes a blend polymer composition containing at least high-density polyethylene and low-density polyethylene. Patent Document 2 discloses a density, MFR, and fish eye obtained by copolymerizing ethylene and α-olefin by vapor phase polymerization in the presence of a chromium-containing catalyst as an electric wire coating or insulating ethylene resin. A composition of linear low density polyethylene with a number in a specific range and a polyolefin resin is described.

JP 2004-71250 A JP 2006-111668 A

However, conventional ethylene-based resin compositions are not always satisfactory in terms of impulse strength and heat distortion resistance.
Under such circumstances, the present invention solves the problems as described above, and is excellent in impulse strength and heat distortion resistance. A cable is provided.

  INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide an electric wire covering or sheathing ethylene-based resin excellent in impulse strength and heat distortion resistance, and an electric wire or cable using the resin as a covering layer.

The first of the present invention relates to an ethylene-based resin for covering an electric wire or a sheath that satisfies all of the following conditions.
(A) Density is 890-930 kg / m ³
(B) Melt flow rate (MFR) is 0.1 to 10 g / 10 min (c) Flow activation energy (Ea) is less than 50 kJ / mol (d) Mz / Mw is 3.5 or more (e) (Mz /Mw)/(Mw/Mn)≧0.9
(F) The ratio of the amount of the eluted resin at 100 ° C. or higher measured by the temperature rising elution fractionation method is less than 1% by weight (provided that the weight of the ethylene resin is 100% by weight)

The second aspect of the present invention relates to the above-described ethylene-based resin for wire coating or sheath that further satisfies the following conditions.
(G) The melt tension at 150 ° C. is 4 to 30 cN.

  The third aspect of the present invention relates to an electric wire or cable using the above-described ethylene-based resin as a coating layer.

  The ethylene resin of the present invention is a copolymer resin containing a monomer unit based on ethylene and a monomer unit based on an α-olefin. Examples of the α-olefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 4-methyl-1-pentene, 4 -Methyl- 1-hexene etc. are mention | raise | lifted and these may be used independently and 2 or more types may be used together. The α-olefin is preferably an α-olefin having 3 to 20 carbon atoms, more preferably an α-olefin having 4 to 8 carbon atoms, and still more preferably 1-butene and 1-hexene. , At least one α-olefin selected from 4-methyl-1-pentene.

  In addition to the above-mentioned monomer units based on ethylene and monomer units based on α-olefin, the ethylene-based resin has monomer units based on other monomers within a range not impairing the effects of the present invention. You may do it. Examples of other monomers include conjugated dienes (for example, butadiene and isoprene), non-conjugated dienes (for example, 1,4-pentadiene), acrylic acid, acrylic acid esters (for example, methyl acrylate and ethyl acrylate), and methacrylic acid. Methacrylic acid esters (for example, methyl methacrylate and ethyl methacrylate), vinyl acetate and the like.

  Examples of the ethylene resin include an ethylene-1-butene copolymer resin, an ethylene-1-hexene copolymer resin, an ethylene-4-methyl-1-pentene copolymer resin, and an ethylene-1-octene copolymer. Resin, ethylene-1-butene-1-hexene copolymer resin, ethylene-1-butene-4-methyl-1-pentene copolymer resin, ethylene-1-butene-1-octene copolymer resin, etc. It is done. Preferably, ethylene-1-butene copolymer resin, ethylene-1-hexene copolymer resin, ethylene-4-methyl-1-pentene copolymer resin, ethylene-1-butene-1-hexene copolymer resin It is.

  The content of monomer units based on ethylene in the ethylene-based resin is usually 50 to 99.5% by weight, preferably 80 to 99%, based on the total weight (100% by weight) of the ethylene-based resin. % By weight. The content of monomer units based on α-olefin is usually 0.5 to 50% by weight, preferably 1 to 20% by weight based on the total weight (100% by weight) of the ethylene-based resin. %.

The density of the ethylene-based resin is 890 to 930 kg / m ³ (condition (a)). The density of the ethylene-based resin is preferably 890 kg / m ³ or more, more preferably 900 kg / m ³ or more, from the viewpoint of increasing rigidity. Further, from the viewpoint of increasing the impulse resistance, it is preferably 925 kg / m ³ or less, more preferably 920 kg / m ³ or less. The density is measured according to an underwater substitution method defined in JIS K7112-1980 after annealing described in JIS K6760-1995.

  The melt flow rate (MFR) of the ethylene-based resin is 0.1 to 10 g / 10 minutes (condition (b)). The MFR of the ethylene-based resin is preferably 0.5 g / 10 minutes or more, more preferably 0.7 g / 10 minutes or more, from the viewpoint of reducing the extrusion load during the molding process. Further, from the viewpoint of enhancing the impulse resistance, it is preferably 5 g / 10 min or less, more preferably 2 g / 10 min or less. The melt flow rate is a value measured by the A method under the conditions of a temperature of 190 ° C. and a load of 21.18 N according to the method defined in JIS K7210-1995.

  The melt flow rate ratio (MFRR) of the ethylene resin is preferably 22 to 55. The MFRR of the ethylene-based resin is more preferably 24 or more and further preferably 26 from the viewpoint of reducing the extrusion load during the molding process. Further, from the viewpoint of increasing the impulse resistance, it is more preferably 45 or less, and further preferably 40 or less. The melt flow rate ratio was obtained by dividing the value measured under the condition of a temperature of 190 ° C. and a load of 211.82N by the value measured under the condition of a temperature of 190 ° C. and a load of 21.18N according to the method defined in JIS K7210-1995. Value.

  The flow activation energy (Ea) of the ethylene-based resin is less than 50 kJ / mol (condition (c)). The Ea of the ethylene-based resin is preferably 40 kJ / mol or less, more preferably 35 kJ / mol or less, from the viewpoint of increasing the impulse resistance.

The flow activation energy (Ea) is a master curve showing the dependence of the melt complex viscosity (unit: Pa · sec) at 190 ° C. on the angular frequency (unit: rad / sec) based on the temperature-time superposition principle. Is a numerical value calculated by the Arrhenius equation from the shift factor (a _T ) at the time of creating the value, and is a value obtained by the following method. That is, an ethylene-α-olefin copolymer at each temperature (T, unit: ° C.) for four temperatures including 190 ° C. among temperatures of 130 ° C., 150 ° C., 170 ° C., 190 ° C., and 210 ° C. Based on the temperature-time superposition principle, the melt complex viscosity-angular frequency curve of the ethylene copolymer at 190 ° C. is obtained for each melt complex viscosity-angular frequency curve at each temperature (T). The shift factor (a _T ) at each temperature (T) obtained when superposed on the angular frequency curve is obtained, and the respective temperature (T) and the shift factor (a _T ) at each temperature (T) From the above, a first-order approximate expression (formula (I) below) of [ln (a _T )] and [1 / (T + 273.16)] is calculated by the method of least squares. Next, Ea is obtained from the slope m of the linear expression and the following expression (II).
ln (a _T ) = m (1 / (T + 273.16)) + n (I)
Ea = | 0.008314 × m | (II)
a _T : Shift factor Ea: Activation energy of flow (unit: kJ / mol)
T: Temperature (unit: ° C)
For the calculation, commercially available calculation software may be used. As the calculation software, Rheos V. manufactured by Rheometrics is used. 4.4.4.

The shift factor (a _T ) is obtained by moving the logarithmic curve of the melt complex viscosity-angular frequency at each temperature (T) in the log (Y) = − log (X) axis direction (however, the Y axis Is the complex viscosity of the melt, and the X axis is the angular frequency.), And the amount of movement when superposed on the melt complex viscosity-angular frequency curve at 190 ° C., in the superposition, melting at each temperature (T) The logarithmic curve of complex viscosity-angular frequency shifts the angular frequency _aT times and the melt complex viscosity 1 / _aT times.

  In addition, when obtaining the linear approximation formula (I) obtained from the shift factors and temperatures at four temperatures including 190 ° C. from 130 ° C., 150 ° C., 170 ° C., 190 ° C., and 210 ° C. by the method of least squares. The correlation coefficient is usually 0.99 or more.

  The above-mentioned melt complex viscosity-angular frequency curve is measured using a viscoelasticity measuring apparatus (for example, Rheometrics Mechanical Spectrometer RMS-800 manufactured by Rheometrics). Usually, geometry: parallel plate, plate diameter: 25 mm, plate interval: It is performed under the conditions of 1.2 to 2 mm, strain: 5%, angular frequency: 0.1 to 100 rad / sec. The measurement is performed in a nitrogen atmosphere, and it is preferable that an appropriate amount of an antioxidant (for example, 1000 ppm) is blended in advance with the measurement sample.

  The ratio (hereinafter, “Mz / Mw”) of the Z-average molecular weight (hereinafter sometimes referred to as “Mz”) and the weight-average molecular weight (hereinafter sometimes referred to as “Mw”) of the ethylene-based resin. Is 3.5 or more (condition (d)). From the viewpoint of impulse resistance, Mz / Mw is preferably 4.5 or more. Further, from the viewpoint of workability and impulse strength, Mz / Mw is preferably 25 or less, more preferably 20 or less, and even more preferably 15 or less.

  Ratio (hereinafter, “Mw / Mn”) of weight average molecular weight (hereinafter sometimes referred to as “Mw”) and number average molecular weight (hereinafter sometimes referred to as “Mn”) of the ethylene-based resin. Is preferably 3 or more, more preferably 4 or more from the viewpoint of improving processability. Further, from the viewpoint of the impulse strength of the resulting coating, Mw / Mn is preferably 15 or less, more preferably 10 or less, and even more preferably 8 or less. Mw / Mn and Mz / Mw are obtained from the number average molecular weight (Mn), weight average molecular weight (Mw) and Z average molecular weight (Mz) measured by gel permeation chromatography (GPC) method. Value.

  Mw / Mn and Mz / Mw of the ethylene-based resin can be controlled by the following method. For example, when the ethylene resin of the present invention is produced by continuously performing a process for producing a component having a high molecular weight and a process for producing a component having a low molecular weight, the hydrogen concentration or polymerization temperature in each production process. It is a method to change. Specifically, when the conditions for producing a component having a high molecular weight are the same, the Mw / Mn of the resulting ethylene resin increases when the hydrogen concentration or the polymerization temperature in producing the component having a low molecular weight is increased. Similarly, the Mz / Mw of the ethylene-based resin can be increased by lowering the hydrogen concentration when producing a component having a high molecular weight or lowering the polymerization temperature. The Mz / Mw of the ethylene resin can also be increased by increasing the time of the step of producing a component having a high molecular weight and increasing the content of the ultrahigh molecular weight component in the ethylene resin.

  Mz / Mw represents the molecular weight distribution of the high molecular weight component contained in the ethylene-based resin. Mz / Mw smaller than Mw / Mn means that the molecular weight distribution of the high molecular weight component is narrow and the molecular weight is very low. This means that the component ratio of the high molecular weight is small, and that Mz / Mw is larger than Mw / Mn means that the molecular weight distribution of the high molecular weight component is wide and the ratio of the component having a very high molecular weight is large. The ethylene-based resin of the present invention satisfies (Mz / Mw) / (Mw / Mn) ≧ 0.9 (condition (e)). From the viewpoint of improving the impulse strength and heat distortion resistance, preferably (Mz / Mw) / (Mw / Mn) ≧ 1. More preferably, (Mz / Mw) / (Mw / Mn) ≧ 1.5.

In the ethylene-based resin of the present invention, when the weight of the ethylene-based resin is 100% by weight, the ratio of the amount of the eluted resin at 100 ° C. or higher measured by the temperature rising elution fractionation method is less than 1% by weight (provided that The sum of the weights of the ethylene-based resins eluted up to 140 ° C. is 100% by weight) (condition (f)).
The elution resin component at 100 ° C. or higher in the temperature rising elution fractionation method for ethylene resin means a high-density component. Since the high-density component has a high crystal fraction and is hard, it has poor impulse resistance. From the viewpoint of improving impulse resistance, the ratio of the amount of the eluted resin at 100 ° C. or higher in the temperature rising elution fractionation method is preferably less than 0.3% by weight, more preferably less than 0.1% by weight.

  The ratio of the amount of the eluted resin at 100 ° C. or higher of the ethylene resin measured by the temperature rising elution fractionation method can be controlled as follows. For example, when the ethylene-based resin of the present invention is produced by continuously performing a process for producing a component having a high molecular weight and a process for producing a component having a low molecular weight, α for the ethylene concentration in each production process. -A method of changing the olefin concentration. Specifically, the ratio of the short chain branched structure introduced into the polymer chain can be increased by increasing the ratio of the α-olefin concentration to the ethylene concentration in the polymerization reactor. Since a polymer having a molecular structure with a high proportion of short chain branches has a thin crystal structure, it can be dissolved at a lower temperature. In addition to controlling the ratio of the α-olefin concentration to the ethylene concentration, the ethylene resin of the present invention can also be produced by producing a component having a high molecular weight and a component having a low molecular weight using two types of complexes. In this case, an ethylene-based resin that melts at a lower temperature can be provided by selecting a complex having a higher copolymerization property of α-olefin with respect to ethylene.

The ethylene resin of the present invention preferably has a melt tension at 150 ° C. of 4 to 30 cN (condition (g)).
The melt tension in the ethylene-based resin means some degree of molecular entanglement in the molten state, and the higher the entanglement, the higher the melt tension. When the molecular weight of the ethylene-based resin is large, it is easy to be entangled, and when the molecular weight is low, the entanglement is small.
The melt tension of the ethylene-based resin can be controlled by the following method. For example, when the ethylene-based resin of the present invention is produced by continuously performing a process for producing a component having a high molecular weight and a process for producing a component having a low molecular weight, the hydrogen concentration and polymerization temperature in each production process. This is a method of changing the polymerization time. Specifically, when producing a component having a high molecular weight, the melt tension of the ethylene-based resin obtained by lowering the hydrogen concentration, lowering the polymerization temperature, and lengthening the polymerization time can be increased. When producing low components, it is possible to increase the melt tension of the ethylene-based resin obtained by lowering the hydrogen concentration, lowering the polymerization temperature, and shortening the polymerization time. Moreover, the melt tension of ethylene resin can be made high by making the ratio of the component with a high molecular weight contained in ethylene resin larger than the component with a low molecular weight.
If the melt tension is too low, the resin hangs down due to gravity when the conductor is covered with molten resin or when the core is covered with a sheath, so the thickness of the coating resin is not constant, and insulation and impulse resistance as a sheath There is a tendency for strength to decrease. Therefore, the ethylene-based resin of the present invention preferably has a melt tension at 150 ° C. of 4 cN or more, more preferably 4.5 cN or more, and further preferably 5 cN or more.
On the other hand, when the melt tension is too high, the adhesion of the melted resin to the conductor and the wire core tends to be lowered, causing moisture to enter and increasing the possibility of causing dielectric breakdown due to the water tree. Therefore, the ethylene-based resin of the present invention preferably has a melt tension at 150 ° C. of 30 cN or less, more preferably 20 cN or less, and even more preferably 15 cN or less.

  The ethylene resin of the present invention is a polymer obtained by polymerizing ethylene and α-olefin under the same polymerization conditions using any catalyst selected from Ziegler catalysts, metallocene catalysts, etc. When the molecular weights are compared, it can be produced by combining two or more known olefin polymerization catalysts whose molecular weights are greatly different. In addition, a process for producing a high molecular weight ethylene / α-olefin copolymer using one known olefin polymerization catalyst capable of producing a high molecular weight ethylene / α-olefin copolymer, By a known polymerization method such as a liquid phase polymerization method, a slurry polymerization method, a gas phase polymerization method, a high pressure ion polymerization method using a plurality of reactors including a step of producing a molecular weight ethylene / α-olefin copolymer, It can also be produced by copolymerizing ethylene and an α-olefin. These polymerization methods may be either batch polymerization methods or continuous polymerization methods.

When the ethylene-based resin of the present invention is produced using a plurality of reactors, the high molecular weight component and the low molecular weight component are successively produced in different reactors. When polymerizing in such a continuous process, polymerized particles that pass through some reactors in a very short time (hereinafter sometimes referred to as short-pass polymerized particles) exist in the polymerized particles. To do. In order to prevent the occurrence of such short path polymerized particles, when the ethylene resin of the present invention is produced in a continuous process using a plurality of reactors, a high molecular weight component is produced in the first polymerization reactor. Then, it is preferable to connect two or more reactors to produce a low molecular weight component. On the other hand, when producing the ethylene-based resin of the present invention by batch polymerization, a low molecular weight component and a high molecular weight component can be produced in two reactors, respectively.

When producing the ethylene-based resin of the present invention by batch polymerization, a single reactor is used instead of a plurality of reactors, and the hydrogen concentration in the reactor is changed over time, so that a high molecular weight component and a low molecular weight are obtained. The components can also be manufactured sequentially.

When the ethylene-based resin of the present invention is produced using two or more kinds of olefin polymerization catalysts, the olefin polymerization catalyst used is a polymer of ethylene and α-olefin under the same polymerization conditions using each catalyst. When the molecular weights of the obtained polymers are compared, it is preferable to use a combination of catalysts whose molecular weights are greatly different. In addition, as a catalyst for polymerization, both of a catalyst for producing a high molecular weight component and a catalyst for producing a low molecular weight component have a long activation energy of less than 50 kJ / mol. It is important to select a catalyst capable of producing an ethylene-based resin having a small chain branching structure. When there are many long chain branched structures, the impulse strength tends to be lowered.

When the ethylene resin of the present invention is produced with one kind of polymerization catalyst, suitable catalysts include, for example, 0.8 to 1.4% by weight of titanium atom, magnesium atom, halogen atom and 15-50% by weight ester. The solid catalyst component which contains a compound and whose specific surface area by BET method is 80 m < ² > / g or less can be mentioned. The ester compound contained in the solid catalyst component is preferably a dialkyl phthalate from the viewpoint of polymerization activity. The solid catalyst component is obtained by reducing a titanium compound (ii) represented by the following general formula [I] with an organomagnesium compound (iii) in the presence of an organosilicon compound (i) having a Si—O bond. It can be obtained as a contact product of the resulting solid component (a), halogenated compound (b) and phthalic acid derivative (c).

  In the case of using a single polymerization catalyst and performing multistage polymerization using a plurality of reactors, the polymerization conditions in at least one of the plurality of reactors are the polymerization conditions of the reactors. It is preferable from the viewpoints of melt tension, heat distortion resistance and impulse strength that the intrinsic viscosity of the ethylene-based resin obtained when the polymerization using the catalyst to be used is 3 or more. Polymerization is performed so that the proportion of the high molecular weight component polymerized under the polymerization reaction conditions that give the high molecular weight component in the ethylene resin of the present invention is 0.5 wt% or more and 10 wt% or less. Is preferable from the viewpoints of heat distortion resistance, impulse strength, and extrusion processability.

Furthermore, when multistage polymerization is performed using one kind of polymerization catalyst, the degree of short chain branching (the number of branches per 1000 carbons) of the resin component obtained in the polymerization tank giving the high molecular weight component is 6 or more and 20 or less. It is preferable from the viewpoint of impulse strength of a molded article obtained using the ethylene-based resin of the present invention.

［式中、Ｍ²は元素周期律表の第４族の遷移金属原子を表し、Ｘ²、Ｒ³およびＲ⁴は、それぞれ独立に、水素原子、ハロゲン原子、炭素原子数１〜２０の置換されていてもよいハイドロカルビル基、炭素原子数１〜２０の置換されていてもよいハイドロカルビルオキシ基、炭素原子数１〜２０の置換シリル基または炭素原子数１〜２０の置換アミノ基であり、複数のＸ²は互いに同じであっても異なっていてもよく、複数のＲ³は互いに同じであっても異なっていてもよく、複数のＲ⁴は互いに同じであっても異なっていてもよく、Ｑ²は、下記一般式（ＩＩＩ）で表される架橋基を表す。

（式中、ｎは１〜５の整数であり、Ｊ²は元素周期律表の第１４族の原子を表し、Ｒ⁵は、水素原子、ハロゲン原子、炭素原子数１〜２０の置換されていてもよいハイドロカルビル基、炭素原子数１〜２０の置換されていてもよいハイドロカルビルオキシ基、炭素原子数１〜２０の置換シリル基または炭素原子数１〜２０の置換アミノ基であり、複数のＲ⁵は互いに同じであっても異なっていてもよい。）］ When the ethylene-based resin of the present invention is produced with two or more kinds of polymerization catalysts including a polymerization catalyst that provides a high molecular weight component and a polymerization catalyst that provides a low molecular weight component, examples of suitable catalysts include the following. It is done.
Examples of the polymerization catalyst that gives a high molecular weight component include transition metal compound polymerization catalysts represented by the following general formula (II).

[Wherein, M ² represents a transition metal atom of Group 4 of the periodic table, and X ² , R ^3, and R ⁴ are each independently a hydrogen atom, a halogen atom, or a substitution of 1 to 20 carbon atoms. Optionally substituted hydrocarbyl group, optionally substituted hydrocarbyloxy group having 1 to 20 carbon atoms, substituted silyl group having 1 to 20 carbon atoms, or substituted amino group having 1 to 20 carbon atoms The plurality of X ² may be the same or different from each other, the plurality of R ³ may be the same or different from each other, and the plurality of R ⁴ may be the same or different from each other. Q ² represents a crosslinking group represented by the following general formula (III).

(In the formula, n is an integer of 1 to 5, J ² represents an atom of Group 14 of the periodic table, and R ⁵ is a hydrogen atom, a halogen atom, or a substituted carbon atom having 1 to 20 carbon atoms. An optionally substituted hydrocarbyl group, an optionally substituted hydrocarbyloxy group having 1 to 20 carbon atoms, a substituted silyl group having 1 to 20 carbon atoms, or a substituted amino group having 1 to 20 carbon atoms. The plurality of R ⁵ may be the same or different from each other.

On the other hand, as a polymerization catalyst that gives a low molecular weight component, for example, there are two groups having a cyclopentadiene type anion skeleton having a substituent, and the groups having this cyclopentadiene type anion skeleton are not bonded to each other. And transition metal compound polymerization catalysts in which the central metal is a Group 4 transition metal atom. When a polymerization catalyst component in which cyclopentazine type anion skeletons are bonded to each other is used, the resulting polymer has a long chain branch, and the strength tends to decrease.

Moreover, it is preferable that the following conditions are satisfied with respect to the mixing ratio Cat1: Cat2 = x: y of the polymerization catalyst (Cat1) that provides a high molecular weight component and the polymerization catalyst (Cat2) that provides a low molecular weight component. The polymerization activity (g / g) per gram of Cat1 and Cat2 when the polymerization was carried out using each catalyst alone under the same polymerization conditions as those used for polymerization using the mixed catalyst components was A _Cat1. When A _Cat2 is used, A _Cat1 · x / A _Cat2 · y is preferably 0.005 or more from the viewpoint of improving the impulse strength, heat distortion resistance and melt tension of the obtained ethylene-based resin. In view of extrudability, A _Cat1 · x / A _Cat2 · y is preferably 0.12 or less.

The conditions for producing the ethylene-based resin of the present invention using the polymerization catalyst (Cat 1) that gives a high molecular weight component and the polymerization catalyst (Cat 2) that gives a low molecular weight component are the polymerization conditions for polymerizing using the mixed catalyst components. It is preferable that the intrinsic viscosity [η] of the ethylene-based resin obtained when the polymerization is carried out using Cat 1 under the same polymerization conditions is 3 or more.

When a metallocene catalyst is used as the polymerization catalyst component, a known activation promoter component, carrier and the like can be used in combination.

  The ethylene-based resin of the present invention can be used for various moldings with other resins as necessary. Examples of the other resin include an ethylene resin different from the ethylene resin of the present invention.

  In the polyethylene resin of the present invention, additives such as antioxidants, crosslinking additives, flame retardants, fillers, lubricants, antistatic agents, weathering stabilizers, pigments, processability improvers, metal soaps, etc., are optionally added. And two or more of these additives may be used in combination.

  Antioxidants, crosslinking additives, flame retardants, antistatic agents, fillers, lubricants, antistatic agents, weathering stabilizers, pigments, processability improvers, metal soaps, etc., added as necessary And other resins may be melt-kneaded in advance with the ethylene-based resin used in the present invention, each of them may be dry-blended with the ethylene-based resin and used for molding, or one or more master batches may be used. It may be prepared and used for molding by dry blending with an ethylene-based resin.

  As the antioxidant, generally used are a phenol-based antioxidant, a phosphorus-based antioxidant, a sulfur-based antioxidant, and the like.

  Examples of phenolic antioxidants include 2,6-di-t-butyl-4-methylphenol (BHT) and n-octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl). Propionate (trade name Irganox 1076, manufactured by Ciba Specialty Chemicals), pentaerythrityl-tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] (trade name Irganox 1010, manufactured by Ciba Specialty Chemicals) 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate (trade name Irganox 3114, manufactured by Ciba Specialty Chemicals), 1,3,5-trimethyl-2,4, 6-Tris (3,5-di-tert-butyl-4-hydroxybenzine ) Benzene, 3,9-bis [2- {3- (3-t-butyl-4-hydroxy-5-methylphenyl) propionyloxy} -1,1-dimethylethyl] -2,4,8,10- And tetraoxaspiro [5,5] undecane (trade name Sumilizer GA80, manufactured by Sumitomo Chemical Co., Ltd.).

  Examples of phosphorus antioxidants include distearyl pentaerythritol diphosphite (trade name ADK STAB PEP8), tris (2,4-di-tert-butylphenyl) phosphite (trade name Irgafos 168, manufactured by Ciba Specialty Chemicals). Bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, tetrakis (2,4-di-tert-butylphenyl) 4,4′-biphenylenediphosphonite (trade name Sandostab P-EPQ , Manufactured by Clariant Shapin Co., Ltd.), bis (2-t-butyl-4-methylphenyl) pentaerythritol diphosphite, and the like.

  As an antioxidant having both a phenol structure and a phosphate structure, for example, 6- [3- (3-tert-butyl-4-hydroxy-5-methyl) propoxy] -2,4,8,10 tetra-tert- And butyl dibenz [d, f] [1,3,2] -dioxaphosphabin (trade name Sumilizer GP, manufactured by Sumitomo Chemical Co., Ltd.).

  Examples of the sulfur-based antioxidant include 4,4′-thiobis (3-methyl-6-tert-butylphenol) (trade name Sumilizer WXR, manufactured by Sumitomo Chemical Co., Ltd.), 2,2-thiobis- (4-methyl- 6-tert-butylphenol) (trade name IRGANOX 1081, manufactured by Ciba Specialty Chemical Co., Ltd.).

  Examples of other antioxidants include vitamin E and vitamin A.

  Examples of the additive for crosslinking include an alkoxysilane compound having a double bond, a compound that accelerates condensation of the alkoxysilane compound, an organic peroxide, a crosslinking aid, and the like.

  Examples of the alkoxysilane compound having a double bond include vinyl alkoxysilane compounds and acrylic alkoxysilane compounds.

  Examples of vinyl-based alkoxysilane compounds include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, vinyltriisopropoxysilane, allyltrimethoxysilane, vinyltris (2-methoxyethoxy) silane, vinylmethyldimethoxysilane, etc. Can be raised

  Examples of the acrylic alkoxysilane compound include 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-acryloxypropyltrimethoxysilane, and the like.

  From the viewpoint of the reactivity of the condensation reaction of alkoxysilane with moisture, vinyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, allyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-acryloxypropyltrimethoxy Methoxysilane such as silane is preferred, and vinyltrimethoxylane is more preferred.

  These alkoxysilane compounds may be used alone or in combination of two or more.

  An alkoxysilane compound having a double bond is grafted onto a molecule such as an ethylene-α-olefin copolymer using an organic peroxide, and the alkoxysilane compound causes a condensation reaction with moisture, thereby producing an ethylene-α- Crosslinks molecules such as olefin copolymers.

  Examples of the compound for accelerating the condensation reaction between alkoxysilane compounds include organic tin compounds, such as tin tetraacetate, butyltin triacetate, butyltin tributylate, butyltin trihexylate, butyltin trioate. Octate, butyltin trilaurate, butyltin trimethyl maleate, octyltin triacetate, octyltin tributylate, octyltin trihexylate, octyltin trioctate, octyltin trilaurate Rate, octyltin trimethyl maleate, phenyltin tributylate, phenyltin trilaurate, dibutyltin diacetate, dibutyltin dibutyrate, dibutyltin dihexylate, dibutyltin dioctate , Dibutyltin dilaurate, dibutyltin diethyl Maleate, Dioctyltin diacetate, Dioctyltin dibutyrate, Dioctyltin dihexylate, Dioctyltin dioctate, Dioctyltin dilaurate, Dioctyltin diethyl maleate, Tributyltin acetate , Tributyltin butyrate, tributyltin hexylate, tributyltin octate, tributyltin laurate, tributyltin methyl maleate, trioctyltin acetate, trioctyltin butyrate, trioctyltin hex Examples thereof include silicate, trioctyltin octate, trioctyltin laurate, and trioctyltin methyl maleate.

  Examples of organic peroxides include di-t-butyl peroxide, t-butyl hydroperoxide, t-butyl-peroxy-2-ethylhexanate, dicumyl peroxide, t-butyl peroxyisopropyl carbonate, and t-butyl. Examples thereof include peroxybenzoate, di-t-amyl peroxide, cumyl hydroperoxide, t-butyl peroxybivalate, and the like.

  Examples of the crosslinking aid include triallyl cyanurate, triallyl isocyanurate, trimethylolpropane triacrylate, trimethylolpropane ethoxytriacrylate, polyether triacrylate, glycerin propoxytriacrylate, pentaerythritol triacrylate, and the like.

  Examples of the flame retardant include metal hydroxides, metal oxides, inorganic salts / inorganic hydrated compounds, silane compounds, phosphorus compounds, bromine compounds, and chlorine compounds.

  Examples of the metal hydroxide include magnesium hydroxide, aluminum hydroxide, calcium hydroxide, zirconium hydroxide, hydrotalcite and the like.

  Examples of the metal oxide include antimony pentoxide, antimony trioxide, zinc oxide, ferrocene, copper oxide, calcium oxide, nickel oxide, bismuth oxide, zinc stannate, and calcium aluminate.

  Examples of the inorganic salt / inorganic hydrated compound include calcium carbonate, barium metaborate, kaolin clay, wax stone clay, dosonite, calcium aluminate silicate, and the like.

  Examples of the silane compound include silicon oil, silicon gum, and those in which a functional group is introduced.

  Examples of phosphorus compounds include non-halogen phosphates such as triphenyl phosphate, tricresyl phosphate, and trixylenyl phosphate; trichloroethyl phosphate, trisdichloropropyl phosphate, tris β-chloropropyl phosphate, and the like. Examples thereof include halogenated phosphoric acid ester; polyphosphoric acid ammonium; polyphosphoric acid amide; polychlorophosphate; condensed phosphonic acid ester; aromatic condensed phosphoric acid ester;

  Examples of the bromine-based compound include decabromodiphenyl oxide, hexabromochlorodecane, ethylenebistetrabromophthalimide, hexapromobenzene, and the like.

  Examples of the chlorinated compound include perchlorocyclopentadecane, chlorinated paraffin, chlorinated polyolefin, and chlorinated polyethylene.

  As the flame retardant, the above compounds may be used alone or in combination.

  Since the ethylene-based resin of the present invention is excellent in impulse strength and heat distortion resistance, it is suitably used for wire coating or sheathing.

The electric wire of the present invention can be obtained by coating the conductor with a molten ethylene resin obtained by melting and kneading the ethylene resin.
Moreover, the cable of the present invention can be obtained by covering a wire bundle in which a plurality of electric wires whose conductors are coated with resin or ethylene resin are bundled with the sheath made of the above-described ethylene resin of the present invention. . As the resin or ethylene resin for covering the above-mentioned conductor, polyethylene resin, ethylene-acrylate resin, ethylene-methacrylate resin, ethylene-vinyl acetate resin, polyvinyl chloride, Olefin rubber such as ethylene propylene rubber, chloroprene rubber, butyl rubber, nitrile rubber, silicon rubber, styrene-butadiene rubber, natural rubber, ebonite and other rubber, phenol resin, polyurethane resin, epoxy resin, polyamide resin, polyimide Insulating resin such as resin or ethylene resin, or insulating paper impregnated with insulating oil such as mineral oil, alkylbenzene, polybutene, alkylnaphthalene or silicone oil can be used, and the ethylene resin of the present invention is suitable Used for.

Hereinafter, the present invention will be described with reference to examples and comparative examples.
The physical properties in Examples and Comparative Examples were measured according to the following methods.

(1) Density (Unit: Kg / m ³ )
The density was measured according to the underwater substitution method defined in JIS K7112-1980. The sample was annealed according to JIS K6760-1995.

(2) Melt flow rate (MFR, unit: g / 10 minutes)
The melt flow rate was measured by the A method under the conditions of a load of 21.18 N and a temperature of 190 ° C. according to the method defined in JIS K7210-1995.

(3) Melt flow rate ratio (MFRR)
It measured according to JIS K7210. The value obtained by dividing the value measured under the conditions of a test load of 211.82N (21.60 kgf) and a measurement temperature of 190 ° C by the value measured under the conditions of a test load of 21.18N (2.16 kgf) and a measurement temperature of 190 ° C is MFRR. It was.

(4) Intrinsic viscosity ([η], unit: dl / g)
A tetralin solution (hereinafter referred to as a blank solution) in which 2,6-di-t-butyl-p-cresol (BHT) is dissolved at a concentration of 0.5 g / L and the resin so that the concentration becomes 1 mg / ml. A solution dissolved in a blank solution (hereinafter referred to as a sample solution) was prepared. The falling time of the blank solution and the sample solution at 135 ° C. was measured with an Ubbelohde viscometer. The intrinsic viscosity [η] was determined from the falling time by the following formula.
[Η] = 23.3 × log (ηrel)
ηrel = sample solution fall time / blank solution fall time

(5) Flow activation energy (Ea, unit: kJ / mol)
Using a viscoelasticity measuring device (Rheometrics Mechanical Spectrometer RMS-800 manufactured by Rheometrics), melt complex viscosity-angular frequency curves at 130 ° C., 150 ° C., 170 ° C. and 190 ° C. were measured under the following measurement conditions. Next, from the obtained melt complex viscosity-angular frequency curve, calculation software Rhios V.R. manufactured by Rheometrics is used. Using 4.4.4, a master curve of the melt complex viscosity-angular frequency curve at 190 ° C. was created, and the activation energy (Ea) of the flow was determined.
<Measurement conditions>
Geometry: Parallel plate Plate diameter: 25mm
Plate spacing: 1.5-2mm
Strain: 5%
Angular frequency: 0.1 to 100 rad / sec Measurement atmosphere: Nitrogen

(6) Molecular weight distribution (Mw / Mn, Mz / Mw)
Using gel permeation chromatograph (GPC) method, measure z-average molecular weight (Mz), weight-average molecular weight (Mw) and number-average molecular weight (Mn) under the following conditions (1) to (8) Mw / Mn and Mz / Mw were obtained. The baseline on the chromatogram is a stable horizontal region with a sufficiently long retention time than the appearance of the sample elution peak and a stable horizontal region with a sufficiently long retention time than the solvent elution peak was observed. A straight line formed by connecting the points.
(1) Equipment: Waters 150C manufactured by Waters
(2) Separation column: TOSOH TSKgelGMH6-HT 2
(3) Measurement temperature: 152 ° C
(4) Carrier: Orthodichlorobenzene
(5) Flow rate: 1.0 mL / min
(6) Injection volume: 500 μL
(7) Detector: Differential refraction
(8) Molecular weight reference material: Standard polystyrene

(7) Measurement of elution resin amount of 100 ° C. or higher measured by temperature rising elution fractionation method The measurement was performed under the following conditions using the following apparatus.
Apparatus: CFC T150A type manufactured by Mitsubishi Chemical Corporation Detector: Magna-IR550 manufactured by Nicole Japan Co., Ltd.
Wavelength: Data range 2982 to 2842 cm ^-1 Column: UT-806M manufactured by Showa Denko Co., Ltd. Solvent: Orthodichlorobenzene Flow rate: 60 ml / hour Sample concentration: 100 mg / 25 ml
Sample injection volume: 0.8ml
Loading conditions: The temperature was lowered from 140 ° C. to 0 ° C. at a rate of 1 ° C./1 minute, and then left for 30 minutes to start elution from the 0 ° C. fraction.
Data acquisition conditions: In the temperature range of 85 ° C. to 105 ° C., data on the amount of elution was acquired in increments of 1 ° C. Thereafter, the temperature was raised to 140 ° C. and then data on the amount of elution was acquired.

(8) Thermal deformation (unit:%)
Using a stress-controlled rheometer DSR manufactured by Rheometrics, the amount of strain was measured by changing the stress from low stress to high stress in a state where heat was applied to the sample under the following conditions. The strain amount (%) at a stress of 1000 Pa at this time was defined as the thermal deformation amount. The smaller this value, the better the heat denaturation property, and the shape can be maintained even during heat generation due to dielectric loss during use.
Measurement temperature: 100 ° C
Measurement jig: 25mmφ parallel plate Measurement thickness: 0.5mm
Measurement mode: Dynamic Stress Sweep Test
Frequency: 100 rad / sec
Measurement stress: 20 to 5000 Pa
Measurement interval: 20 points / decade

(9) Tensile impact strength (unit: kJ / m ² )
Measurement of tensile impact strength was performed at 23 ° C. in the form of an S-type dumbbell according to ASTM D1822-61T. The sample piece was molded by hot pressing at 150 ° C., stored in a temperature-controlled room at 23 ° C. and 50% humidity for 24 hours or more, and then used for measurement.
The higher this value, the higher the impulse resistance as an electric wire or cable.

(10) Melt tension (MT, unit: cN)
Using a melt tension tester manufactured by Toyo Seiki Seisakusho, an orifice with a diameter of 2.09 mmφ and a length of 8 mm is obtained by filling a molten resin filled in a 9.5 mmφ barrel at 150 ° C. with a piston descending speed of 5.5 mm / min. The molten resin thus extruded was wound up at a winding speed of 40 rpm / min using a winding roll having a diameter of 150 mmφ, and the tension value immediately before the molten resin broke was taken as the value of the melt tension.

Example 1
(1-1) Preparation of solid catalyst component 80 L of hexane, 20.6 kg of tetraethoxysilane and 2.2 kg of tetrabutoxytitanium were charged into a 200 L reactor equipped with a nitrogen-substituted stirrer and baffle plate and stirred. Next, 50 L of a dibutyl ether solution of butyl magnesium chloride (concentration: 2.1 mol / L) was added dropwise to the stirred mixture over 4 hours while maintaining the temperature of the reactor at 5 ° C. After completion of the dropwise addition, the mixture was stirred at 5 ° C. for 1 hour and further at 20 ° C. for 1 hour and filtered to obtain a solid component. Next, the obtained solid component was washed with 70 L of toluene three times, and 63 L of toluene was added to the solid component to obtain a slurry.
A reactor having an internal volume of 210 L equipped with a stirrer was replaced with nitrogen, a solid component toluene slurry was charged into the reactor, and 14.4 kg of tetrachlorosilane and 9.5 kg of di (2-ethylhexyl) phthalate were charged, The mixture was stirred at 105 ° C. for 2 hours. Subsequently, solid-liquid separation was performed, and the obtained solid was washed 3 times with 90 L of toluene at 95 ° C. 63 L of toluene was added to the solid, the temperature was raised to 70 ° C., 13.0 kg of TiCl ₄ was added, and the mixture was stirred at 105 ° C. for 2 hours. Next, solid-liquid separation was performed, and the obtained solid was washed 6 times with 90 L of toluene at 95 ° C., and further washed twice with 90 L of hexane at room temperature. The solid after washing was dried to obtain a solid catalyst component.

(1-2) Preparation of Preliminary Polymerization Catalyst (XA-1) An autoclave with a stirrer with an internal volume of 3 L was sufficiently dried, the autoclave was evacuated, 490 g of butane and 260 g of 1-butene were charged, and the temperature was raised to 55 ° C. Next, ethylene was added so that the partial pressure was 1.0 MPa. Polymerization was initiated by injecting 5.4 mmol of triethylaluminum and 326.4 mg of the solid catalyst component produced in Example 1 (1) with argon. Ethylene was continuously supplied from the cylinder so that the pressure was constant, and polymerization was carried out at 55 ° C. until the weight loss of the cylinder reached 48.9 g. After the polymerization, the supply of ethylene was stopped, the inside of the system was purged, and then pressurized with argon gas, and the prepolymerized powder was collected in an ampoule purged with nitrogen and sealed. When a limiting viscosity [η] was measured for a part of the recovered prepolymerized powder and the degree of short chain branching was examined by IR, [η] = 9.1, and the degree of short chain branching per 1000 carbons was 10.4. Met.

(1-3) Main polymerization The autoclave with a stirrer having an internal volume of 3 L was sufficiently dried, the autoclave was evacuated, 620 g of butane and 130 g of 1-butene were charged, and the temperature was raised to 70 ° C. Next, ethylene was added so that the partial pressure was 0.6 MPa, and hydrogen was added so that the partial pressure was 0.2 MPa. Polymerization was started by injecting 3.75 g of prepolymerized catalyst (XA-1) produced in 1.7 mmol of triethylaluminum and (1-2) with argon. Ethylene was continuously supplied from a cylinder so that the pressure was constant, and polymerization was carried out at 70 ° C. for 3 hours. By polymerization, 197 g of an ethylene-1-butene copolymer (hereinafter referred to as ethylene-based resin (A1)) was obtained. The physical property values of the polymer (A1) are shown in Tables 1 and 2.

Example 2
(2-1) Preparation of Preliminary Polymerization Catalyst (XA-2) An autoclave with an internal volume of 3 L and a stirrer was sufficiently dried, the autoclave was evacuated, 502 g of butane and 262 g of 1-butene were charged, and the temperature was raised to 70 ° C. Next, ethylene was added so that the partial pressure was 0.6 MPa. Polymerization was initiated by injecting 1.7 mmol of triethylaluminum and 223.3 mg of the solid catalyst component produced in Example 1 (1-1) with argon. Ethylene was continuously supplied from the cylinder so that the pressure was constant, and polymerization was performed at 70 ° C. until the weight reduction amount of the cylinder became 65.5 g. After the polymerization, the supply of ethylene was stopped, the inside of the system was purged, and then pressurized with argon gas, and the prepolymerized powder was collected in an ampoule purged with nitrogen and sealed. When a limiting viscosity [η] was measured for a part of the collected prepolymerized powder, it was [η] = 4.9.

(2-2) Main polymerization An autoclave with a stirrer having an internal volume of 3 L was sufficiently dried, the autoclave was evacuated, 620 g of butane and 130 g of 1-butene were charged, and the temperature was raised to 70 ° C. Next, ethylene was added so that the partial pressure was 0.6 MPa, and hydrogen was added so that the partial pressure was 0.2 MPa. Polymerization was initiated by injecting 6.9 g of prepolymerized catalyst (XA-2) produced in 1.7 mmol of triethylaluminum and (2-1) with argon. Ethylene was continuously supplied from a cylinder so that the pressure was constant, and polymerization was carried out at 70 ° C. for 3 hours. By polymerization, 144 g of ethylene-1-butene copolymer (hereinafter referred to as ethylene-based resin (A2)) was obtained. The physical property values of the ethylene-based resin (A2) are shown in Tables 1 and 2.

Comparative Example 1
(3-1) Preparation of Preliminary Polymerization Catalyst (XA-3) An autoclave with a stirrer with an internal volume of 3 L was sufficiently dried, the autoclave was evacuated, 750 g of butane was charged, and the temperature was raised to 70 ° C. Next, ethylene was added so that the partial pressure was 0.6 MPa. Polymerization was initiated by injecting 4.6 mmol of triethylaluminum and 296.4 mg of the solid catalyst component produced in Example 1 (1-1) with argon. Ethylene was continuously supplied from the cylinder so that the pressure was constant, and polymerization was performed at 70 ° C. until the weight reduction amount of the cylinder reached 36.0 g. After the polymerization, the supply of ethylene was stopped, the inside of the system was purged, and then pressurized with argon gas, and the prepolymerized powder was collected in an ampoule purged with nitrogen and sealed. When a limiting viscosity [η] was measured for a part of the recovered prepolymerized powder, it was [η] = 9.5.

(3-2) This polymerization internal volume 3 L autoclave with a stirrer was sufficiently dried, the autoclave was evacuated, butane 620 g and 1-butene 130 g were charged, and the temperature was raised to 70 ° C. Next, hydrogen was added so that the partial pressure was 0.6 MPa and hydrogen was 0.3 MPa. Polymerization was started by injecting 7.95 g of prepolymerized catalyst (XA-3) produced in 1.7 mmol of triethylaluminum and (3-1) with argon. Ethylene was continuously supplied from a cylinder so that the pressure was constant, and polymerization was performed at 70 ° C. for 75 minutes. 170 g of ethylene-1-butene copolymer (hereinafter referred to as ethylene resin (A3)) was obtained by polymerization. Tables 1 and 2 show physical property values of the ethylene-based resin (A3).

Comparative Example 2
Tables 1 and 2 show physical property values of linear low-density polyethylene (Sumikasen-L FS150 manufactured by Sumitomo Chemical Co., Ltd .; hereinafter referred to as ethylene resin (A4)).

Claims (3)

An ethylene resin for wire coating or sheath that satisfies all of the following conditions.
(A) Density is 890-930 kg / m ³
(B) Melt flow rate (MFR) is 0.1 to 10 g / 10 min (c) Flow activation energy (Ea) is less than 50 kJ / mol (d) Mz / Mw is 3.5 or more (e) (Mz /Mw)/(Mw/Mn)≧0.9
(F) The ratio of the amount of the eluted resin at 100 ° C. or higher measured by the temperature rising elution fractionation method is less than 1% by weight (provided that the weight of the ethylene resin is 100% by weight) The ethylene-based resin for coating an electric wire or sheath according to claim 1, further satisfying the following condition (g).
(G) Melt tension at 150 ° C. is 4 to 30 cN   The electric wire or cable which used the ethylene-type resin of Claim 1 or 2 for the coating layer.