JP2010149295A - Method and apparatus for manufacturing carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a carrier tape which can manufacture simply in a short time. <P>SOLUTION: The projecting piece forming projection 52 of a lower mold 5 is heated at a prescribed temperature in advance by a mold heating means. From this state, an upper mold 6 is descended and the lower mold 5 is ascended, and a tape material 10 is drawn by a projecting piece forming recess 62 of the upper mold 6 and a projecting piece forming projection 52 of the lower mold 5. The drawing is carried out while the excess tape material 10 manufactured in the drawing is made to escape to material releasing recesses 8a and 8b formed at the lower mold 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a carrier tape manufacturing method and manufacturing apparatus that are optimal for housing articles such as electronic parts such as chip size packages (CSP) of semiconductor devices.

  2. Description of the Related Art Conventionally, there is known a carrier tape in which a plurality of storage recesses having projecting pieces for storing electronic components such as a chip size, a package, and the like of a semiconductor device are formed. For example, as shown in FIG. 3, the electronic component 100 housed in the housing recess having such a projecting piece protrudes from the electronic component main body 101 and the electronic component main body 101 so as to be curved outward and downward. And a lead terminal 102 provided. When such a lead terminal 102 comes into contact with the inner wall surface or the like of the housing recess, the lead terminal 102 is damaged. For this reason, the electronic component main body 101 is held by the protruding piece so that the lead terminal 102 does not come into contact with the inner wall surface of the housing recess. However, if the thickness of the protruding piece is increased, the protruding piece may come into contact with the lead terminal 102 when the electronic component main body 101 is held.

In order to solve this problem, the following carrier tape manufacturing method has been proposed (see Patent Document 1). In this method, first, an embossed portion (housing recess) is formed on a long thermoplastic resin sheet, and at the same time, a rib (projecting piece) is integrally formed on the upper surface of the bottom portion. And the protruding piece of the obtained molded product is crushed into a plate shape so as to be sandwiched by molds from both sides. As a result, the protruding piece has a small thickness (width).
JP-A-8-207132

  However, in the method described in Patent Document 1, two molds and two molding steps are necessary since the molded recess is further crushed by a mold after the housing recess and the projecting piece are molded. As a result, a long time is required for manufacturing and the manufacturing cost is high. In addition, since the formed protruding piece is thin and is further embossed, it is difficult to position the formed protruding piece and the mold, for example, during the embossing.

  An object of this invention is to provide the manufacturing method and manufacturing apparatus of the carrier tape which can be manufactured easily in a short time.

  In order to solve the above-mentioned problem, claim 1 of the present invention includes a long plate-like tape material, and a protruding piece protruding from the bottom wall by pushing up the bottom wall and a part of the bottom wall from the back side. A method of manufacturing a carrier tape for forming a storage recess having a lower mold body having a wall forming lower mold body and a protruding piece forming projection, and a wall forming upper surface facing the wall forming lower mold body A mold body and an upper mold having a projecting piece forming concave portion having an inner peripheral surface facing an outer peripheral surface of the projecting piece forming convex portion, wherein the upper mold is movable up and down relative to the lower mold, and molding the storage concave portion At the time, the outer peripheral surface and the inner peripheral surface are configured so that the tape material can be ironed, and the boundary portion between the wall forming lower mold body and the protruding piece forming convex portion in the lower mold And the boundary between the upper mold body for wall formation and the concave part for projecting piece formation in the upper mold Using a material provided with a material escape recess in at least one of the parts, the upper mold is moved downward relative to the lower mold in a state where the tape material is disposed between the lower mold and the upper mold. The tape material disposed between the outer peripheral surface of the projecting piece forming convex portion and the inner peripheral surface of the projecting piece forming concave portion is subjected to ironing processing, and surplus generated due to the ironing processing. A method of manufacturing a carrier tape, wherein the protruding piece is formed while releasing a tape material into the material escape recess, and the bottom wall is formed by the wall forming lower mold main body and the wall forming upper mold main body. I will provide a.

  A tape material disposed between the outer peripheral surface and the inner peripheral surface using a lower mold configured to heat the protruding piece forming convex portion by a mold heating means. A method of manufacturing a carrier tape, wherein ironing is performed while applying heat from a protruding portion for forming a protruding piece heated by the mold heating means.

  According to a third aspect of the present invention, there is provided a carrier tape for forming a storage recess having a bottom plate and a projecting piece projecting from the bottom wall by pushing up a part of the bottom wall from the back side. An apparatus comprising a lower mold and an upper mold movable up and down relative to the lower mold, the lower mold projecting upward from the wall forming lower mold body and the wall forming lower mold body Protruding piece forming convex portions, the upper mold is a wall forming upper mold main body facing the wall forming lower mold main body, and the protruding piece forming convex portions are recessed from the wall forming upper mold main body. A projecting piece forming concave portion having an inner peripheral surface facing the outer peripheral surface of the projecting piece forming convex portion, and the projecting piece forming concave portion and the inner peripheral surface of the projecting piece forming concave portion at the time of molding the storage recess It is configured so that the tape material can be ironed by them, and the wall formation in the lower mold At least one of a boundary part between the lower mold body and the protruding piece forming convex part and a boundary part between the wall forming upper mold body and the protruding piece forming concave part in the upper mold is provided with a material escape concave part. An apparatus for manufacturing a carrier tape is provided.

  According to a fourth aspect of the present invention, there is provided the carrier tape manufacturing apparatus, wherein the protruding piece forming convex portion is configured to be heatable by a mold heating means.

  According to Claims 1 and 3 of the present invention, the upper die is moved downward relative to the lower die, and the outer peripheral surface of the protruding piece forming convex portion and the inner peripheral surface of the protruding piece forming concave portion are between them. A protruding piece is formed by squeezing the tape material disposed on the wall, and a bottom wall is formed on the tape material by the wall forming lower mold body and the wall forming upper mold body.

  Thereby, a thin plate-shaped protruding piece can be formed in the same step of forming the bottom wall. Therefore, the carrier tape can be easily manufactured in a short time. Further, when the ironing process is performed, excess tape material is released into the recesses, so that the protruding pieces can be ironed smoothly.

  According to Claims 2 and 4, the tape material disposed between the outer peripheral surface and the inner peripheral surface is used by using the lower mold configured to heat the protruding piece forming convex portion by the mold heating means. Then, ironing is performed while applying heat from the protrusions for forming the protruding pieces. Thereby, in the ironing process, the material flow of the tape material can be improved, and the process can be performed without causing cracks or the like.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view of a main part of a carrier tape according to an embodiment obtained by the manufacturing method of the present invention, FIG. 2 is an enlarged sectional view taken along line II-II in FIG. 1, and FIG. It is an expanded sectional view of the state where electronic parts were stored in a storage recess.

  First, it demonstrates from the carrier tape 1 of embodiment obtained by the manufacturing method of this invention. The carrier tape 1 of this embodiment is composed of a long one. The length in the front-rear direction (width direction) orthogonal to the longitudinal direction is about 16 mm.

  Further, the carrier tape 1 of this embodiment is formed by using a long plate-like tape material having a thickness of about 0.25 mm. The carrier tape 1 is made of a synthetic resin such as polycarbonate, polyester, or polyethylene.

  The carrier tape 1 is provided with a plurality of storage recesses 2 near the center in the width direction. A plurality of feed holes 3 are provided on one end side in the width direction.

  The housing recesses 2 are for housing the electronic component 100 (shown in FIG. 3), and are arranged at equal intervals along the longitudinal direction. The storage recess 2 includes left and right side walls 21 and 22, front and rear side walls 23 and 24, and a bottom wall 25. Further, a rectangular opening 20 is provided on the upper surface side of the housing recess 2, and the electronic component 100 can be inserted into the inside through the opening 20.

  In addition, two protruding pieces 3 protruding upward from the bottom wall 25 are provided inside the storage recess 2. These projecting pieces 3 are arranged substantially parallel to each other at a distance from each other, forming a pair of left and right. Each of the protruding pieces 3 is formed in a portion from the front side wall 23 to the rear side wall 24, whereby the inside of the storage recess 2 is formed on each of the main body storage recess 2 a and the left and right sides of the main body storage recess 2 a. And a terminal housing recess 2b.

  Each of the protruding pieces 3 protrudes by pushing up a part of the bottom wall 25 from the back side of the bottom wall 25. As shown in FIGS. 2 and 5, the inner layer wall 31 and the outer layer wall 32 are protruded. It is comprised from the two-layer wall which consists of.

  The inner layer wall 31 and the outer layer wall 32 are each formed with a thickness t1 thinner than a thickness t2 of the bottom wall 25 by ironing as described later. In this embodiment, the inner layer wall 31, the outer layer wall 32, and the thickness t1 are about 0.1 mm, respectively.

  Further, thick portions 34 a and 34 b are provided between the inner layer wall 31 and the bottom wall 25 and at the boundary portions between the outer layer wall 32 and the bottom wall 25, respectively. As shown in FIG. 5, the thick portions 34a and 34b are formed such that the maximum thicknesses t3 and t4 are larger than the thickness t2 of the bottom wall 25, respectively.

  Further, as shown in FIGS. 1 and 2, a suction hole 26 is provided in the bottom wall 25 of the storage recess 2 of this embodiment, and this suction is performed when the electronic component is stored in the storage recess 2. An electronic component can be sucked into the housing recess 2 from the use hole 26.

  The feed holes 3 are for, for example, mechanically feeding the storage recesses 2 when electronic components are stored in the storage recesses 2, and are formed in a line at substantially equal intervals.

  Next, the manufacturing apparatus 7 for carrier tape used for the manufacturing method of the carrier tape 1 of this invention is demonstrated. As shown in FIG. 4, the carrier tape manufacturing apparatus 7 includes a lower die 5 and an upper die 6 that is disposed on the upper side of the lower die 5 and is movable up and down relative to the lower die 5. Yes. In this embodiment, the lower mold 5 and the upper mold 6 are configured to move upward and downward, respectively.

  The lower mold 5 of the manufacturing apparatus 7 includes a wall forming lower mold main body 51 and a protruding piece forming convex portion 52 protruding from the wall forming lower mold main body 51.

  In this embodiment, the wall forming lower mold main body 51 includes a bottom wall forming portion 51a and side wall forming portions 51b integrally formed on the entire front, rear, left and right peripheral portions of the bottom wall forming portion 51a. .

  In this embodiment, the protruding piece forming convex portion 52 is formed at the tip of the protruding piece 50 attached to the bottom wall forming portion 51a of the wall forming lower mold main body 51. Specifically, the projecting piece 50 is formed of a plate-like shape, has a protruding piece forming convex portion 52 at the distal end portion, and is attached to the lower die main body 51 for wall formation on the base end side so as to be detachable. The part 50b is provided.

  The protruding piece forming convex portion 52 is formed so that the thickness gradually decreases toward the distal end side. In addition, the thickness of the front-end | tip of the protrusion 52 for protruding piece formation of this embodiment is about 0.08 mm.

  The lower die main body attaching portion 50b is fitted into a fitting concave portion 50c provided in the wall forming lower die main body 51, whereby the protruding piece forming convex portion 52 is moved upward from the wall forming lower die main body 51. Projected.

  In addition, as shown in FIG. 5, excess portions generated by ironing the protruding pieces 3 at the left and right boundary portions of the lower mold body 51 and the protruding piece forming convex portions 52 in the lower mold 5, respectively. The material escape recesses 8a and 8b (portions indicated by a two-dot chain line in FIG. 5) are provided for releasing the sheet material. The material escape recesses 8 a and 8 b form a part of the thick portion 34 of the protruding piece 3.

  Next, the upper mold 6 will be described. As shown in FIG. 4, the upper mold 6 includes a wall forming upper mold main body 61 and a pair of left and right protruding piece forming recesses 62 formed on the lower surface of the wall forming upper mold main body 61 so as to be recessed from the lower surface. It has. The wall forming upper mold main body 61 is formed in substantially the same shape as the wall forming lower mold main body 51 and is of a size that can enter the wall forming lower mold main body 51.

  The wall forming upper mold body 61 includes an upper mold bottom wall forming part 61a and an upper mold side wall forming part 61b integrally formed on the entire front, rear, left and right peripheral parts of the upper mold bottom wall forming part 51a. ing. When forming the storage recess 2, the upper mold bottom wall forming portion 61a faces the lower mold bottom wall forming portion 51a of the wall forming lower mold body 51 with a predetermined distance L2 as shown in FIG. The upper mold bottom wall forming portion 61a and the lower mold bottom wall forming portion 51a form the bottom wall 25 of the storage recess 2.

  The distance L2 between the upper mold bottom wall forming portion 61a and the lower mold bottom wall forming portion 51a constitutes substantially the thickness t2 of the bottom wall 25 of the storage recess 2 in the carrier tape 1.

  The upper mold side wall forming portion 61b is opposed to the lower mold side wall forming portion 51b of the wall forming lower mold main body 51 when the housing recess 2 is formed, and the upper mold side wall forming portion 61b and the lower mold side wall forming portion 51b are Side walls 21 to 24 of the housing recess 2 are formed.

  The protruding piece forming recess 62 is formed in such a size that the protruding piece forming protrusion 52 can enter when the storage recess 2 is formed. Further, the inner peripheral surface 62a of the protruding piece forming concave portion 62 faces the outer peripheral surface 52a of the protruding piece forming convex portion 52 that has entered.

  Further, the distance L1 between the inner peripheral surface 62a of the protruding piece forming concave portion 62 and the outer peripheral surface 52a of the protruding piece forming convex portion 52 when entering the protruding piece forming concave portion 62 is a tape material disposed therebetween. The thickness is set to be smaller than 10, and the tape material 10 can be ironed.

  Specifically, the tape material 10 disposed between the inner peripheral surface 62a and the outer peripheral surface 52a is formed by drawing to be thinner than the thickness of the raw material before drawing, and the inner peripheral surface 62a. The distance L1 between the outer peripheral surface 52a and the outer peripheral surface 52a is set smaller than the thickness of the drawn tape material 10.

  In this embodiment, the tape material 10 disposed between the inner peripheral surface 62a and the outer peripheral surface 52a has a thickness of about 0.15 to 0.20 mm by drawing. Therefore, the distance L1 between the inner peripheral surface 62a and the outer peripheral surface 52a is set to about 0.1 mm.

  The distance L1 between the inner peripheral surface 62a and the outer peripheral surface 52a constitutes substantially the thickness t1 of each of the inner layer wall 31 and the outer layer wall 32 of the storage recess 2 in the carrier tape 1.

  Further, in a state where the protruding piece forming convex portion 52 enters the protruding piece forming concave portion 62, the boundary portion 63 between the protruding piece forming concave portion 62 and the wall forming upper mold body 61, and the protruding piece forming convex portion 52. And the maximum distances L3 and L4 between the material escape recesses 8a and 8b formed at the boundary between the wall forming lower mold body 51 and the upper mold bottom wall forming part 51a. It is set to be larger than L2.

  The maximum distances L3 and L4 constitute the maximum thicknesses t3 and t4 of the thick portions 34a and 34b of the storage recess 2.

  In this embodiment, the lower mold 5 is provided with a mold heating means for heating the protruding piece forming convex portion 52. This mold heating means is for improving the material flow of the tape material during the ironing process so that the ironing process can be performed smoothly. In this embodiment, the die heating means covers the entire length from the front end to the rear end of the projecting piece 50. Thus, a carbon wire 9 is provided so as to be energized. Then, the protruding piece-forming convex portion 52 can be heated by heating the wire 9.

  Further, the temperature at which the protruding piece forming convex portion 52 is heated is not particularly limited, but in this embodiment, it is in the range of 100 ° C. to the melting temperature of the tape material 10 or less.

  The mold heating means is not limited to the form in which the carbon wire 9 is provided in the protruding piece forming convex portion 52, but may be a nichrome wire, for example. Further, the mold heating means is not limited to the form in which the wire 9 is provided in the protruding piece forming convex portion 52, and for example, the protruding piece forming convex portion 52 may be directly energized and heated. Can change.

  Next, the manufacturing method of the carrier tape 1 using the manufacturing apparatus 7 for carrier tapes is demonstrated. First, the protruding piece forming convex portion 52 is heated in advance by a mold heating means. Further, the tape material 10 is preheated to a suitable temperature between 100 ° C. and the melting temperature of the tape material 10 by a material heating means.

  And the tape material 10 heated to the said temperature is arrange | positioned between the lower mold | type 5 and the upper mold | type 6, and while raising the lower mold | type 5 in that state, the upper mold | type 6 is lowered | hung, The wall forming upper die main body 61 and the wall forming lower die main body 51 are pushed in.

  Thereby, the tape material 10 enters between the wall forming upper mold main body 61 and the wall forming lower mold main body 51 while being drawn, that is, while reducing the plate thickness. In this embodiment, the tape material 10 having a thickness of about 0.25 mm has a drawn portion of about 0.15 to 0.20 mm.

  Then, when the tape material 10 is pushed into the protruding piece forming convex portion 52, the protruding piece forming convex portion 52 pushes a part of the tape material 10 so as to relatively push up the protruding piece forming concave portion 62. Go.

  At this time, the distance between the inner peripheral surface 62a of the protruding piece forming concave portion 62 and the outer peripheral surface 52a of the protruding piece forming convex portion 52 is set smaller than the thickness of the tape material 10 that has been drawn. Therefore, a part of the tape material 10 disposed between the inner peripheral surface 62a and the outer peripheral surface 52a is ironed by the inner peripheral surface 62a and the outer peripheral surface 52a.

  The surplus tape material 10 generated during the ironing process enters the material escape recesses 8a and 8b by the material flow. Moreover, since the protruding piece forming convex portion 52 is heated by the mold heating means, the tape material 10 smoothly flows and enters the material escape concave portions 8a and 8b.

  Therefore, ironing can be performed smoothly, and the protruding piece 3 including the inner layer wall 31 and the outer layer wall 32 can be formed as shown in FIG. In this embodiment, the protruding piece 3 having an overall thickness t5 of about 0.3 to 0.4 mm is formed.

  At the same time, the side walls 21 to 24 and the bottom wall 25 can be formed by the wall forming upper mold body 61 and the wall forming lower mold body 51. Thereafter, the lower mold 5 is lowered and the upper mold 6 is raised. Thereby, the tape material 10 in which the storage recess 2 is formed can be removed from the lower mold 5 and the upper mold 6. Hereinafter, similarly, the storage recesses 2 are sequentially formed.

  In this embodiment, after the storage recess 2 is formed, the feed hole 3 and the suction hole 26 are formed with reference to the storage recess 2.

  For example, as shown in FIG. 3, the electronic component 100 is stored in the storage recess 2 formed in this way. As described above, the electronic component 100 includes the electronic component main body 101 and the lead terminals 102 protruding from the electronic component main body 101.

  The electronic component body 101 is held by the protruding piece 3. Thereby, the electronic component main body 101 is accommodated in the main body accommodating recess 2a. The lead terminal 102 is housed in the terminal housing recess 2b.

  In this state, the lead terminal 102 does not hit the side wall or the bottom wall 25 of the storage recess 2 and the thickness of the protruding piece 3 is thin, so that the lead terminal 102 may come into contact with the protruding piece 3. Can be made less. Therefore, the lead terminal 102 of the electronic component 100 housed in the housing recess 2 can be made less likely to be deformed during transportation and handling.

  In the above embodiment, the mold heating means is provided. However, the mold heating means may not be provided and can be changed as appropriate.

  Moreover, in the said embodiment, although material escape recessed part 8a, 8b is provided in the boundary part of the right-and-left both sides of the lower mold body 51 for wall formation in the lower mold | type 5, and the convex part 52 for protrusion piece formation, It can change suitably not only in a thing.

  For example, the material escape concave portion is provided at one of the boundary portions of the lower mold body 51 for wall formation and the convex portion 52 for projecting piece formation in the lower mold 5. Alternatively, the upper die 6 may be provided at either one or both of the left and right boundary portions between the wall forming upper die main body 61 and the protruding piece forming concave portion 62.

  Moreover, in the said embodiment, although the protrusion piece 3 is provided in the both right and left sides in each of the storage recessed part 2, it is not restricted to the thing of this form, It can change suitably. For example, the protrusions 3 may be provided on either the left or right and front and rear sides of each of the storage recesses 2, or the protrusions 3 may be provided on the entire periphery of the storage recesses 2 on the left and right and front and rear.

  Moreover, in the said embodiment, although the protrusion 52 for protrusion piece formation is comprised from what can be removed to the lower mold main body 51 for wall formation, it is not restricted to the thing of this form, For example, the protrusion for protrusion piece formation 52 and the wall forming lower mold main body 51 may be integrally formed, and can be appropriately changed.

  Moreover, in the said embodiment, the bottom wall formation part 51a and the side wall formation part 51b are formed integrally, and the upper mold | type bottom wall formation part 61a and the upper mold | type side wall formation part 61b are formed integrally. However, either one or both of them may be configured separately and can be changed as appropriate.

It is a partial top view of the carrier tape of the state manufactured by the manufacturing method of the carrier tape of this invention. It is an expanded sectional view of the II-II line of FIG. It is an expanded sectional view of the state which stored the electronic component in the storage recessed part of a carrier tape. It is sectional explanatory drawing of the manufacturing apparatus of the carrier tape of one embodiment of this invention. It is expansion sectional explanatory drawing of the principal part of the manufacturing apparatus of the carrier tape.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Storage recessed part 3 Projection piece 5 Lower mold | type 6 Upper mold | type 25 Bottom wall 52 Projection part formation convex part 62 Projection piece formation recessed part 100 Electronic component

Claims (4)

A method of manufacturing a carrier tape that forms a housing recess having a long plate-like tape material having a bottom wall and a protruding piece protruding from the bottom wall by pushing up a part of the bottom wall from the back side,
A lower mold having a wall forming lower mold main body and a protruding piece forming convex portion, and a wall forming upper mold main body facing the wall forming lower mold main body and an outer peripheral surface of the protruding piece forming convex portion. An upper die having a protruding piece forming concave portion having an inner peripheral surface and movable up and down relative to the lower die, and when forming the storage concave portion, the outer peripheral surface and the inner peripheral surface, It is configured so that ironing can be performed, and a boundary portion between the lower mold body for wall formation and the projecting piece forming convex portion in the lower mold, and the upper mold body for wall formation and the projecting piece formation in the upper mold Using a material escape recess in at least one of the boundary with the recess for use,
In a state where the tape material is disposed between the lower mold and the upper mold, the upper mold is relatively moved downward with respect to the lower mold to form an outer peripheral surface of the protruding piece forming convex portion and the protruding piece. The inner peripheral surface of the concave portion is subjected to ironing processing on the tape material disposed therebetween, and the protruding piece is formed while surplus tape material generated by the ironing processing is released to the material escape concave portion. A method for producing a carrier tape, wherein the bottom wall is formed by the wall forming lower mold main body and the wall forming upper mold main body. Using a lower mold configured to be able to heat the protruding piece forming convex portion by a mold heating means,
2. The ironing process is performed on the tape material disposed between the outer peripheral surface and the inner peripheral surface while applying heat from the protruding portion for forming the protruding piece heated by the mold heating means. Manufacturing method of carrier tape. A carrier tape manufacturing apparatus for forming a storage recess having an elongated plate-like tape material and a protruding piece protruding from the bottom wall so as to push up a part of the bottom wall from the back side,
A lower mold and an upper mold that can move up and down with respect to the lower mold,
The lower mold includes a wall forming lower mold main body and a protruding piece forming convex portion protruding upward from the wall forming lower mold main body,
The upper mold has a wall forming upper mold main body facing the wall forming lower mold main body, and an inner peripheral surface that is recessed from the wall forming upper mold main body and faces the outer peripheral surface of the protruding piece forming convex portion. A recess for forming a protruding piece having
The outer peripheral surface of the projecting piece forming convex portion and the inner peripheral surface of the projecting piece forming concave portion are configured so that the tape material can be ironed by them when molding the storage concave portion,
A material for at least one of a boundary portion between the lower mold main body for wall formation and the protruding piece forming convex portion in the lower mold, and a boundary portion between the upper mold main body for wall formation and the protruding piece forming concave portion in the upper mold An apparatus for manufacturing a carrier tape, wherein a relief recess is provided.   4. The carrier tape manufacturing apparatus according to claim 3, wherein the protruding piece forming convex portion is configured to be heatable by a mold heating means.

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