JP2010137499A - Bending device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bending device which can sharply bend a resin panel at a target angle without generating damage or whitening. <P>SOLUTION: The bending device 3 includes a bending mold 31 which protrudes the bending end of the flexible resin panel to fix it and a bending mechanism 32 which bends the resin panel at a prescribed angle along the wedge 35a of the bending mold 31 to deform the panel plastically. The bending mechanism 32 has a bending head facing the wedge 35a in parallel, a bending motion mechanism 34 which moves the bending head to follow the wedge 35a and makes the bending head perform a bending motion, and a cushioning sheet which is installed between the bending head and the resin panel and makes one side of the sheet adhere to the resin panel and the other side be contacted with the bending head slidably in a bending motion. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a bending apparatus that bends a resin plate such as a flexible substrate at a predetermined angle uniformly and with high accuracy.

This type of sheet bending apparatus has been improved for the purpose of bending to a predetermined bending angle (angle formed by the resin sheet after bending) with a small bending diameter (large curvature), for example, fixing a resin sheet There is known an apparatus that bends a folding member along one side of a mold. This sheet folding apparatus includes a fixed mold composed of an upper mold and a lower mold, and a folding member. One end of a resin sheet is sandwiched between the fixed mold and the folding member is moved up and down relative to the fixed mold. A step of driving and bending the bent portion along one side of the fixed mold by a shearing force until the angle between the planes before and after the bending reaches approximately 90 ° (first stage); The resin sheet can be efficiently bent at an acute angle with one apparatus by continuously performing the step of bending up to an angle exceeding 90 ° (second stage) by rotating along the axis ( Patent Document 1).
JP 2006-255953 A

  However, in the above conventional bending apparatus, when the bending member is subjected to a series of bending operations from the first stage to the second stage with respect to the resin sheet, the bending member directly contacts the resin sheet. . For this reason, there is a problem that the surface of the resin sheet is likely to be damaged, and a non-uniform tensile force acts on the resin sheet, resulting in thinning of the bent portion and whitening or partial spots.

  An object of the present invention is to provide a bending apparatus that can bend a resin plate sharply at a target angle without causing damage or whitening.

  The bending apparatus of the present invention includes a bending die that protrudes and fixes a bent end portion of a flexible resin plate, and a bending portion that bends the resin plate at a predetermined angle along the wedge portion of the bending die. A bending mechanism having a member, wherein the bending mechanism includes a bending head that faces the wedge portion in parallel, and the bending head is moved along the wedge portion to bend the bending device. A bending operation mechanism that is operated, and a buffer sheet that is interposed between the bending head and the resin plate and in which one surface is in close contact with the resin plate and the bending head is in sliding contact with the other surface in the bending operation. It is characterized by that.

  According to this configuration, since the bending head is in contact with the resin plate via the buffer sheet, it is possible to avoid the surface of the resin plate from being scratched during the bending operation or from being subjected to uneven tensile force. Can do. Accordingly, a bending force can be applied uniformly to the width direction of the resin plate, and the bending angle and the bending curvature in the width direction of the resin plate can be made uniform.

  In this case, the buffer sheet is preferably made of an elastic sheet, and the elastic sheet is preferably a polytetrafluoroethylene (Teflon (registered trademark)) sheet.

  According to these configurations, in the bending operation of the resin plate, the buffer sheet can be uniformly pressed and bent with high accuracy without generating a pulling force due to the bending mold and friction.

  In this case, the sheet supply mechanism further includes a sheet supply mechanism that supplies the buffer sheet between the bending head and the resin plate. The sheet supply mechanism winds the buffer sheet and rolls the buffer sheet out of the buffer sheet. It is preferable to have a winding unit that winds up the used portion and a winding motor that drives the winding unit to wind up.

  According to these configurations, since a new buffer sheet is always sent between the bending head and the bending die at the time of the bending operation, the dirt or the like of the buffer sheet that has been used once slidably contacts the resin plate and causes damage. Can be prevented.

  In this case, it is preferable that the bending head is composed of a free rotating roller.

  According to this configuration, the frictional resistance can be further reduced by freely rotating.

  In this case, a head holder that supports the bending head, and a universal support mechanism that is interposed between the head holder and the bending operation mechanism and supports the bending head so as to maintain the following posture with respect to the wedge portion in the bending operation. And are preferably further provided.

  According to this configuration, the bending head behaves in a swingable manner in the tangential direction of the wedge portion, that is, the pressing direction with the resin plate interposed between the buffer sheets, and presses the resin plate uniformly in the width direction. Thereby, the resin plate can be made to follow the bending mold with high accuracy. That is, it is possible not only to be bent at a target angle, but also to enable sharp bending with a small bending diameter at the bending line.

  In this case, the bending mechanism includes an advancing / retracting mechanism that moves relative to the wedge portion, and a lateral movement mechanism that moves the bending member relative to the bending direction perpendicular to the advancing / retreating direction via the advancing / retracting mechanism. It is preferable to further have.

  According to this configuration, the free rotation roller can be arranged at an appropriate position for bending to the target angle by the forward / backward movement mechanism, and the lateral movement mechanism can be bent at a sharp bending angle uniformly at the position of the folding line. Can be bent.

  In this case, the resin plate is preferably a circuit board.

  According to this configuration, it is possible to provide a circuit board that is partially bent at a sharp bending angle.

  Hereinafter, a bending apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings. In this bending apparatus, for example, in manufacturing an inkjet head, two COF substrates (Chip On Film) on which a driving circuit for driving a piezoelectric element is mounted are bonded to both side portions of a plate-like member. In addition, it is bent at a predetermined angle (90 °). First, the configuration of the inkjet head will be briefly described.

  As shown in FIGS. 1 and 2, the inkjet head 1 protects a nozzle plate 11 in which a discharge nozzle 16 is formed, a flow path forming substrate 12 in which a plurality of pressure chambers 11 a are formed, and a piezoelectric element 19. A protective substrate 13, a flow path forming substrate 12, a seal substrate 14 that seals the common chamber 17 that communicates with the protective substrate 13, and a head case 15 that forms the exterior of the inkjet head 1 are stacked in order from the bottom. Has been. In addition, the head substrate 2 is incorporated in the inkjet head 1 so as to penetrate the head case 15 and the protective substrate 13 and to stand on the flow path forming substrate 12. The head substrate 2 is formed by bonding a pair of COF substrates 22 (film substrates) on which a drive circuit 25 for driving the piezoelectric element 19 is mounted to both side surfaces of the base plate 21. The bent portion (conducting portion 27 described later) is electrically connected to an electrode (lead electrode 18 described later) on the flow path forming substrate 12.

  The nozzle plate 11 is formed of stainless steel or the like, and is bonded to one surface of the flow path forming substrate 12 with an adhesive or the like. In addition, a plurality of discharge nozzles 16 are formed at equal pitches on the nozzle surface of the nozzle plate 11, and the plurality of discharge nozzles 16 constitute two nozzle rows arranged in parallel to each other. Yes.

  In the flow path forming substrate 12, a plurality of pressure chambers 11 a partitioned by partition walls are arranged in parallel in two rows in the width direction so as to correspond to the plurality of discharge nozzles 16. A common chamber 17 for storing functional liquid supplied from a functional liquid supply device (not shown) is formed in a region on the outer side in the longitudinal direction of the flow path forming substrate 12, and each pressure chamber 11a and common chamber 17 are: Each communicates via a supply path 11b. The common chamber 17 communicates with the protective substrate 13 and receives supply of the functional liquid from the functional liquid supply device via the functional liquid introduction port 14 a provided in the head case 15.

  The protective substrate 13 is connected to the flow path forming substrate 12 via the elastic film 12a and the insulator film 12b in this order from the flow path forming substrate 12 side. A number of piezoelectric elements 19 corresponding to the plurality of pressure chambers 11a are formed on the insulator film 12b, and through holes 12c penetrating in the thickness direction are formed in the protective substrate 13, and each piezoelectric element is formed. A mechanism portion 12d for accommodating the element 19 is recessed inward. One end of the lead electrode 18 is connected to each piezoelectric element 19, and the other end of the lead electrode 18 extends so as to be exposed in the through hole 12 c. The other end portion of the lead electrode 18 is connected to the head substrate 2 (more precisely, the conductive portion 27 of each COF substrate 22). Then, by applying a voltage to the piezoelectric element 19 to deform the insulator film 12b (and the elastic film 12a), the functional liquid is introduced from the common chamber 17 using the volume change of the pressure chamber 11a, and the discharge nozzle 16 ejects functional droplets.

  The head case 15 is connected to the protective substrate 13 via a seal substrate 14 including a sealing film 13a and a fixing plate 13b in this order from the protective substrate 13 side. The common chamber 17 is sealed only by the sealing film 13a. The head case 15 is provided with a head substrate holding hole 14b that communicates with a through hole 12c provided in the protective substrate 13, and the head substrate 2 is inserted into the head substrate holding hole 14b to be bonded with an adhesive (anisotropic). Is connected to the lead electrode 18 via a conductive conductive paste).

  The head substrate 2 includes a base plate 21 that is a plate member made of stainless steel, and a pair of COF substrates 22 that are attached to both side surfaces of the base plate 21 with a double-sided adhesive tape 23. Each COF substrate 22 includes a drive circuit 25 for driving the piezoelectric element 19, a drive circuit 25 mounted thereon, a flat substrate body 26 bonded to the base plate 21, and an “L” shape from the substrate body 26. And a conducting portion 27 that bends in a shape. The pair of COF substrates 22 affixed to both side surfaces are arranged so that the front end portion of the conducting portion 27 faces inward and along the lower end surface of the base plate 21. The base plate 21 is abutted on the flow path forming substrate 12 with the front end portion of each COF substrate 22 facing down. In this state, the pair of COF substrates 22 are interposed via an adhesive (anisotropic conductive paste). Connected to the lead electrode 18.

Next, the bending apparatus 3 according to the present embodiment will be described with reference to FIGS. 3 and 4. As described above, the bending apparatus 3 is configured to bend the substrate body 26 and the conductive portion 27 of the COF substrate 22 into an L shape at the boundary portion (folding line). Specifically, the COF substrate This is an apparatus for accurately plastically deforming about 0.5 mm of the tip of 22 to 90 °.
The bending device 3 includes a bending die 31 that protrudes and fixes the front end portion (conduction portion 27) of the COF substrate 22, and a bending roller 37 that performs a copying operation so as to follow the wedge portion 35a of the bending die 31. The head unit 33, the bending operation mechanism 34 that performs the bending operation by moving the head unit 33 forward / backward and laterally, and polytetrafluoroethylene (Teflon) between the bending roller 37 (free rotating roller) and the COF substrate 22. (Registered Trademark)) and a sheet supply mechanism 60 for supplying a sheet 50 (buffer sheet). The bending mechanism portion 32 referred to in the claims includes a head unit 33, a bending operation mechanism 34, and a sheet supply mechanism 60. 3 and 4, the upper and lower sides of the drawing are the Z-axis direction (up-and-down direction), the left and right in FIG. 3, that is, the axial direction of the bending roller 37 is the X-axis direction, and the left and right in FIG. The explanation will be recommended.

  The bending die 31 includes an upper die 35 having a wedge portion 35a that makes an angle corresponding to a bending angle 57a (FIG. 5), and a lower die 36 installed in parallel to the upper die 35, and the upper die 35 and the lower die 36. Cooperate to hold and fix the COF substrate 22. The angle formed by the wedge portion 35a of the upper die 35 is determined by the target angle 57 (90 ° in the present embodiment) of the COF substrate 22. In order to plastically deform the flexible COF substrate 22 to 90 °, the wedge portion 35a needs to be formed at an acute angle with respect to 90 ° in anticipation of the elastic limit. On the other hand, the lower die 36 is provided with a drive circuit arrangement groove 36a through which the mounted drive circuit 25 escapes when the COF substrate 22 is clamped and fixed (FIG. 4). The COF substrate 22 has a boundary line between the substrate body 26 and the conducting portion 27 as a fold line, and a portion corresponding to the leading portion of the wedge portion 35a, that is, a portion corresponding to the conducting portion 27 extends in the Z-axis direction ( The lower die 36 is clamped and fixed between the upper die 35 and the lower die 36.

  The head unit 33 includes a bending roller 37 facing parallel to the wedge portion 35 a of the bending die 31 (X-axis direction), a roller holder 38 that supports the bending roller 37 so as to freely rotate, and a roller holder 38. It comprises a free support mechanism 39 that supports the bending roller 37 so as to swing freely.

  The bending roller 37 includes a cylindrical roller body 37a installed in parallel with the wedge portion 35a of the bending die 31, and a pair of roller shafts 42 protruding from both ends of the roller body 37a. 42 is supported by the roller holder 38 so as to be rotatable. The bending roller 37 is preferably formed such that the length in the axial direction (X-axis direction) is longer than the width of the COF substrate 22 in order to uniformly press the COF substrate 22 in bending. The radius has a radius that does not affect the bending strength.

  The roller holder 38 includes a holder main body 38a extending in parallel along the bending roller 37, and a pair of roller bearings extending from both ends of the holder main body 38a and supporting the roller shaft 42 of the bending roller 37 with both ends. 43. The roller holder 38 is supported by a rotation support shaft 44 of a later-described universal support mechanism 39 at an intermediate position in the longitudinal direction of the holder main body 38a.

  The universal support mechanism 39 includes a rotation support shaft 44 extending in the Y-axis direction so as to pass through an intermediate position in the longitudinal direction of the holder main body 38a, a roller holder 38, and a head base 48 of the bending operation mechanism 34 described later. And a pair of return springs 46 passed between the roller holder 38 and the head base 48. The rotation support shaft 44 extends in the Y-axis direction so as to penetrate the holder main body 38a and the support member 45, and the roller holder 38 rotates about the rotation support shaft 44, that is, a bending roller. 37 is supported so as to move in an arc around the rotation support shaft 44.

The support member 45 extends in the Z-axis direction, has a rotation support shaft 44 fixed to the upper end portion, and is attached to the head base 48 so as to be rotatable about the Z axis at the lower end portion. As a result, the bending roller 37 moves in a circular arc around the Y axis around the rotation support shaft 44 and rotates forward and backward around the Z axis (generally “swinging operation”).
The pair of return springs 46 are constituted by tension springs (coil springs), and are installed so as to pass between the both ends of the roller holder 38 and the head base 48 via the support member 45. That is, the pair of return springs 46 are arranged so as to be line symmetric with respect to the support member 45 in the X-axis direction. The spring force of the pair of return springs 46 is antagonized and acts to return the bending roller 37 (and the roller holder 38) that swings in two directions to a neutral position whose axis is always directed in the X-axis direction. Yes.

  The bending roller 37 is swingable three-dimensionally by the rotation support shaft 44 and the support member 45 described above, and the COF substrate 22 is made to follow the bending die 31 with high accuracy (X-axis direction and Z-axis direction). Can be folded. Further, the pair of return springs 46 causes the bending roller 37 to start swinging from the neutral position and return to the neutral position at the end. Therefore, unnecessary wobbling of the swingable bending roller 37 can be prevented, and a pressing force suitable for bending can be applied to the COF substrate 22.

  The bending mechanism 34 includes an inverted “L-shaped” head base 48 that supports the head unit 33 at the lower end of the support member 45, a base frame 48 a that supports the head base 48 slidably in the Z-axis direction, A motor-driven Z-axis table (advancing / retracting mechanism) 49 for moving the head unit 33 in the Z-axis direction via the base 48 and the base frame 48 a and the Z-axis table 49 are supported, and the head is interposed via the Z-axis table 49. The driving of the Z-axis table 49 and the Y-axis table 51 is controlled according to a motor-driven Y-axis table (lateral movement mechanism) 51 for moving the unit 33 in the Y-axis direction and a control table prepared in advance. And a control mechanism 54 for bending the bending roller 37 with a predetermined pressing force.

  A buffer spring 56 is provided between the head base 48 and the base frame 48a to urge the head unit 33 upward in the Z-axis direction, and a bending roller 37 that acts on the COF substrate 22 in the bending operation. This prevents the excessive pressing force other than the bending force from being applied to the COF substrate 22.

The sheet supply mechanism 60 includes a feeding unit 61 that feeds out a long polytetrafluoroethylene sheet 50 wound in a roll shape, and a winding unit 62 that winds up a used portion of the fed polytetrafluoroethylene sheet 50. And a winding motor 55 for driving the winding unit 62.
The feeding portion 61 includes a feeding reel 63, a braking mechanism 65 incorporated in the feeding reel 63, and a feeding-side tape guide 47a that guides the horizontal feeding of the polytetrafluoroethylene sheet 50. The winding unit 62 includes a winding reel 64, a winding motor 55 that winds and rotates the winding reel 64, and a winding-side tape guide 47 b that guides the horizontal feeding of the polytetrafluoroethylene sheet 50. I have. The feeding-side tape guide 47a and the winding-side tape guide 47b are preferably constituted by flanged guide pins or guide rollers that prevent the polytetrafluoroethylene sheet 50 from falling off.

  When the winding motor 55 is driven, the polytetrafluoroethylene sheet 50 is fed out from the feeding portion 61 in accordance with the winding operation of the winding portion 62. The polytetrafluoroethylene sheet 50 is fed by the feeding-side tape guide 47a. The path is changed and fed into the gap between the bending die 31 and the head unit 33. Here, the feeding of the polytetrafluoroethylene sheet 50 is stopped, and a bending operation in which the polytetrafluoroethylene sheet 50 is wound is performed by the head unit 33. When the bending operation is completed, the winding motor 55 is driven again, and the used portion of the polytetrafluoroethylene sheet 50 is wound around the winding portion 62. Further, in feeding the polytetrafluoroethylene sheet 50, the braking mechanism 65 functions to give a constant tension to the polytetrafluoroethylene sheet 50 and to make the head unit 33 face the polytetrafluoroethylene sheet 50 in a stretched state.

  In the bending operation, the feeding-side tape guide 47a and the winding-side tape guide 47b are configured to be slidable in the Z-axis direction so that the polytetrafluoroethylene sheet 50 does not sag, and each is provided with a spring (not shown). It is preferable to bias in the Z-axis direction.

Next, with reference to FIG. 5, the bending operation | movement by the bending apparatus 3 of this embodiment is demonstrated. As described above, the target angle 57 is 90 °.
First, with the folding line of the COF substrate 22 aligned with the tip of the wedge portion 35a of the upper die 35 and the bending position of the COF substrate 22 positioned, the upper die 35 or the lower die 36 is moved forward and backward by a pneumatic cylinder or the like. To hold and fix the COF substrate 22 (FIG. 5B). At this time, a positioning pin may be provided on the upper die 35 in order to prevent misalignment of the bending line.
Next, the Z-axis table 49 is driven and moved to the start position in the vicinity of the leading end portion (conduction portion 27) of the COF substrate 22 protruding from the bending roller 37 and the bending die 31 in the Z-axis direction (FIG. 5B). ). From this state, the Z-axis table 49 and the Y-axis table 51 are driven according to the control table for the bending operation, and the bending roller 37 is bent (FIG. 5C). At this time, the polytetrafluoroethylene sheet 50 fed from the feeding reel 63 is set between the bending roller 37 and the bending die 31.

  In this bending operation, the bending roller 37 moves following the wedge portion 35a while being in rolling contact with the COF substrate 22 via the polytetrafluoroethylene sheet 50. That is, the bending roller 37 in which the polytetrafluoroethylene sheet 50 is wound on the COF substrate 22 moves while drawing a “L” -shaped locus while applying a pressing force in the Y-axis direction and the Z-axis direction. At this time, the bending roller 37 takes a posture following the wedge portion 35a by performing a minute arc motion in the X-axis direction and a minute rotation around the Z-axis by the reaction force received from the COF substrate 22. Accordingly, the bending roller 37 performs a bending operation while applying a uniform pressing force to the COF substrate 22 in the width direction. That is, the COF substrate 22 is uniformly bent at an acute angle so as to follow the wedge portion 35a at the fold line (FIG. 5C).

  On the other hand, in this series of bending operations, the polytetrafluoroethylene sheet 50 is in close contact with the COF substrate 22 and allows the bending roller 37 to slide. That is, even if the bending roller 37 does not rotate smoothly, no tensile force acts on the COF substrate 22. For this reason, in the embodiment, the bending roller 37 is used, but instead of the bending roller 37, a fixed roller head or a bending head having a circular arc shape (semicircle or more) may be used.

  The bending operation is finished at the position (end position) where the bending roller 37 exceeds the tip of the wedge portion 35a, and the bending roller 37 together with the polytetrafluoroethylene sheet 50 from the COF substrate 22 and the bending die 31 in the Z-axis direction. Leave downwards. The bending angle 57a is restored to some extent by the remaining elasticity of the COF substrate 22 released from the pressing force, and finally the target angle 57 is 90 °. In a series of bending operations, the pressing force of the bending roller 37 against the COF substrate 22 and the moving speed of the bending roller 37 are controlled by the control mechanism 54. After the bending operation is completed, the used portion of the polytetrafluoroethylene sheet 50 is wound around the winding portion 62, and a new unused portion is newly set between the bending roller 37 and the bending die.

  As described above, the bending device 3 according to the present embodiment performs the bending operation by sliding the bending roller 37 that performs the bending operation following the wedge portion 35a to the bending die via the polytetrafluoroethylene sheet 50. Therefore, the COF substrate 22 can be sharply bent at the target angle 57 with a small bending diameter without causing damage or whitening of the COF substrate 22.

It is a disassembled perspective view of the inkjet head which concerns on this embodiment. It is a top view of the ink jet head concerning this embodiment. It is a schematic diagram of the front of the bending apparatus which concerns on this embodiment. It is a schematic diagram of the bending apparatus side surface which concerns on this embodiment. It is explanatory drawing which shows the bending method by the bending apparatus which concerns on this embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Inkjet head 2 ... Head board 3 ... Bending apparatus 22 ... COF board 31 ... Bending die 32 ... Bending mechanism part 34 ... Bending action mechanism 35a ... Wedge part 37 ... Freely rotating roller 38 ... Roller holder 39 ... Swivel support mechanism 50. Polytetrafluoroethylene sheet

Claims (8)

A bending die that protrudes and fixes a bent end portion of a flexible resin plate, and a bending mechanism portion that bends the resin plate so as to be plastically deformed at a predetermined angle along a wedge portion of the bending die. A folding device comprising:
The bending mechanism is
A bending head that faces the wedge portion in parallel;
A bending operation mechanism that moves the bending head along the wedge portion to perform a bending operation;
A buffer sheet interposed between the bending head and the resin plate, wherein one surface is in close contact with the resin plate and the bending head is in sliding contact with the other surface in the bending operation. Folding device characterized by.   The bending apparatus according to claim 1, wherein the buffer sheet is made of an elastic sheet.   The bending apparatus according to claim 2, wherein the elastic sheet is a polytetrafluoroethylene sheet. A sheet supply mechanism for supplying the buffer sheet between the bending head and the resin plate;
The sheet supply mechanism is
A pay-out portion that rolls out the buffer sheet in a roll shape;
A winding unit that winds up a used portion of the buffer sheet that has been unwound;
The bending apparatus according to claim 1, further comprising a winding motor that drives the winding unit to wind up.   The bending apparatus according to any one of claims 1 to 4, wherein the bending head includes a free rotating roller. A head holder for supporting the bending head;
A universal support mechanism that is interposed between the head holder and the bending operation mechanism and supports the bending head so as to maintain the following posture with respect to the wedge portion in the bending operation; The bending apparatus according to any one of claims 1 to 5. The bending mechanism is
An advancing / retreating mechanism for advancing / retreating relative to the wedge portion;
7. The apparatus according to claim 1, further comprising a lateral movement mechanism that relatively moves the bending member in a bending direction orthogonal to the forward / backward direction via the advance / retreat operation mechanism. The bending apparatus as described.   The bending apparatus according to claim 1, wherein the resin plate is a circuit board.

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