JP2010136472A - Rotating electrical machine drive controller and method of controlling the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately determine the existence of occurrence of abnormal deterioration of a solder joint between a semiconductor element and a board, in a rotating electrical machine drive controller. <P>SOLUTION: A rotating electrical machine drive controller 10 includes an inverter 14, which includes an IGBT soldered to a board, an IGBT temperature sensor 20, which detects the temperature of the IGBT, and a motor controller 18. The motor controller 18 includes a map memory 48, and a determinator 50. The map memory 48 stores a map that shows the relation between the tolerable rise temperature of the IGBT to the temperature of cooling water and the temporal integrated value of torque commands or current commands. The determinator 50 outputs an abnormality signal when determined that the detected value of the rise temperature to the cooling water temperature of the IGBT is larger than the tolerable rise temperature obtained from the map, from the temporal integrated value of the torque commands or the current commands and the map stored in the map memory 48. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a rotary electric machine drive device including a semiconductor element solder-bonded to a substrate, a temperature detection means for detecting the temperature of the semiconductor element, and a rotary electric machine control unit that controls the rotary electric machine drive device. The present invention relates to an electric drive control device and a control method thereof.

  2. Description of the Related Art Conventionally, for example, in a motor drive control device provided in an electric vehicle equipped with a motor that is a rotating electric machine such as an electric vehicle or a hybrid vehicle, an inverter that is a driving device for the rotating electric machine and a rotating electric machine between the motor and the power supply device It is known to provide a motor control unit that is a control unit and send a motor current as a driving signal to the motor by an inverter to drive the motor. The inverter converts the DC power from the power supply device into an AC current determined according to the torque command value, and sends the motor current to the motor. The motor control unit sends a control signal for generating a motor current to the inverter to control the inverter.

  In such a motor drive control device, a plurality of power semiconductor elements such as IGBTs are mounted on a substrate in an inverter. Each power semiconductor element is soldered to the substrate.

  Further, for cooling power semiconductor elements such as IGBTs, a cooler junction structure in which a substrate having a power semiconductor element joined thereto is joined to a cooler having a cooling fin structure.

  Patent Document 1 discloses a power circuit including a protection circuit that suppresses a voltage between the gate terminal of the IGBT and a current sense terminal when an abnormal voltage is input to the gate terminal and protects the IGBT, and a temperature sensor circuit. A semiconductor device is described. The temperature sensor circuit is for detecting a temperature abnormality due to the IGBT and includes a temperature detection diode. One end of the temperature detection diode on the anode side is connected to the anode terminal A, and the other end is connected to the cathode terminal K. The connection point P of the diode and the cathode terminal K are electrically connected.

JP 2008-153615 A

  Whether the solder joint between the power semiconductor element and the substrate or the like is in a failure state that deteriorates with time in any of the conventional motor drive control devices and the cooler joint structure as described above. Is difficult to accurately determine. That is, when solder is used in the joint, the power semiconductor element and the substrate to which the power semiconductor element is joined may be thermally expanded due to a temperature rise accompanying energization of the power semiconductor element. There is a possibility that stress is applied to the solder joint due to the difference in thermal expansion coefficient between the substrate and the substrate, cracks occur in the solder due to long-term use, and the solder joint deteriorates abnormally. For this reason, conventionally, the usable temperature range is limited or the material properties of the component parts are adjusted (adapted) so that cracks and the like do not occur in the solder joints. In contrast, the present invention simplifies these designs. In addition, it is technically difficult to directly detect (sense) the presence or absence of abnormal deterioration.

  Further, in the power semiconductor device described in Patent Document 1, the temperature sensor circuit is merely a means for detecting a temperature abnormality due to the IGBT, and if the temperature of the IGBT is simply high, what is the cause of the temperature increase? It is difficult to identify whether For this reason, it is difficult to accurately determine whether or not an abnormal deterioration of the solder joint portion of the IGBT has occurred.

  An object of the present invention is to accurately determine whether or not an abnormal deterioration of a solder joint between a semiconductor element and a substrate has occurred in a rotating electrical machine drive control device.

Among the rotating electrical machine drive control devices according to the present invention, the rotating electrical machine drive control device according to the first invention includes a rotating electrical machine drive device including a semiconductor element solder-bonded to a substrate, and a temperature at which the temperature of the semiconductor element is detected. A rotating electric machine control unit that controls the driving device for the rotating electric machine, the rotating electric machine control unit including an allowable rise temperature of the semiconductor element with respect to a reference temperature and a time integrated value or current of a torque command value of the rotating electric machine. A storage means for storing a map representing the relationship between the command value and the time integrated value, and a time integrated value of the torque command value input from the torque command calculating unit or a time integrated value of the current command value based on the torque command value. Based on the time integrated value calculation means, the time integrated value of the torque command value or the time integrated value of the current command value, and the map stored in the storage means, the temperature rise detection with respect to the reference temperature of the semiconductor element is detected. And determining means for determining that an abnormal deterioration of the solder joint portion of the semiconductor element has occurred when it is determined that the value is higher than the allowable rise temperature obtained from the map, and outputting an abnormal signal. The rotating electrical machine drive control device.
Preferably, the time integrated value of the torque command value or the time integrated value of the current command value is determined, for example, that the torque command value has increased to a predetermined value or more when the torque command value has increased. This is the time integrated value of the torque command value or current command value from the point in time until the point of time when a predetermined time has elapsed in advance (the same applies in the following description).

  According to said structure, the presence or absence of generation | occurrence | production of abnormal deterioration of the solder joint part of a semiconductor element and a board | substrate can be determined accurately. That is, abnormal deterioration occurs because the temperature rise of the semiconductor element with respect to the reference temperature becomes abnormally higher than normal, which increases as the time integrated value of the torque command value or the time integrated value of the current command value increases. Therefore, the determination accuracy of occurrence of abnormal deterioration can be increased. In other words, if cracks occur in the solder joints and abnormal deterioration occurs, the heat dissipation from the semiconductor element will be abnormally reduced, so that abnormal deterioration of the solder joints will occur based on abnormally high temperatures. Judgment can be made with high accuracy.

  In the rotating electrical machine drive control device according to the first invention, preferably, the rotating electrical machine control unit outputs a torque command value or a current command value according to the rotational speed of the rotating electrical machine when an abnormal signal is output, Limiting means for limiting the torque command value to a limit value obtained by multiplying the maximum value of the torque command value or the maximum value of the current command value corresponding to the maximum value of the torque command value by a predetermined ratio set in advance is included.

  According to said structure, failure of the drive device for rotary electric machines can be prevented more effectively beforehand.

  In the rotating electrical machine drive control device according to the first aspect of the present invention, preferably, the rotating electrical machine control unit includes a temperature rise of the semiconductor element relative to a reference temperature, a time integrated value of a torque command value, or a time integrated value of a current command value. Limiting ratio changing means for changing a predetermined ratio to be multiplied when the limiting means obtains the limit value is included according to the temperature rise degree which is a ratio to the increase.

  In addition, among the rotating electrical machine drive control devices according to the present invention, the control method of the rotating electrical machine drive control device according to the first invention includes a rotating electrical machine drive device including a semiconductor element solder-bonded to a substrate, A temperature detecting means for detecting the temperature and a rotating electric machine control unit for controlling the driving device for the rotating electric machine. The rotating electric machine control unit includes an allowable temperature rise of the semiconductor element with respect to a reference temperature and a torque command value of the rotating electric machine. A method for controlling a rotating electrical machine drive control device including a storage means for storing a map representing a relationship between a time integrated value or a time integrated value of a current command value, and a time integration of a torque command value input from a torque command calculation unit A time integrated value calculating step for calculating a time integrated value of a current command value based on a value or a torque command value; a time integrated value of a torque command value or a time integrated value of a current command value; If the detected value of the rising temperature relative to the reference temperature of the semiconductor element is determined to be larger than the allowable rising temperature obtained from the map, it is determined that abnormal deterioration of the solder joint portion of the semiconductor element has occurred. And a determination step of outputting an abnormal signal. A control method for a rotating electrical machine drive control device.

  Of the rotating electrical machine drive control device according to the present invention, the rotating electrical machine drive control device according to the second invention detects the temperature of the rotating electrical machine drive device including the semiconductor element solder-bonded to the substrate and the temperature of the semiconductor element. And a rotating electrical machine control unit for controlling the rotating electrical machine drive device, the rotating electrical machine control unit being a time integrated value or a torque command value of the torque command value of the rotating electrical machine input from the torque command calculating unit. Time integrated value calculating means for calculating the time integrated value of the current command value based on the value, the detected value of the rising temperature of the semiconductor element relative to the reference temperature, and the time integrated value of the torque command value or the time integrated value of the current command value The temperature rise degree calculating means for calculating the temperature rise degree, which is a ratio of the temperature rise degree, and the calculated temperature rise degree are obtained by multiplying the initial temperature rise degree by a predetermined value. A rotating electrical machine drive control device comprising: a determination unit that determines that an abnormal deterioration of a solder joint portion of a semiconductor element has occurred when it is determined that the degree of temperature increase is greater than a degree of temperature increase, and outputs an abnormal signal It is.

  According to said structure, the presence or absence of generation | occurrence | production of abnormal deterioration of the solder joint part of a semiconductor element and a board | substrate can be determined accurately. That is, the temperature rise degree, which is the temperature rise of the semiconductor element with respect to the rise of the time cumulative value of the torque command value or the time cumulative value of the current command value, is obtained by multiplying the initial temperature rise degree by a predetermined value. When it is determined that the degree of increase in allowable temperature rise is greater, it is determined that abnormal deterioration of the solder joint has occurred, so that the determination accuracy of the occurrence can be increased. In addition, the degree of temperature rise in the initial state may vary greatly depending on the product, but even if there is a variation, the allowable temperature rise will vary accordingly. The determination accuracy of occurrence of abnormal deterioration can be increased.

  In the rotating electrical machine drive control device according to the second invention, preferably, the rotating electrical machine control unit outputs a torque command value or a current command value according to the rotational speed of the rotating electrical machine when an abnormal signal is output. Limiting means for limiting the torque command value to a limit value obtained by multiplying the maximum value of the torque command value or the maximum value of the current command value corresponding to the maximum value of the torque command value by a predetermined ratio set in advance is included.

  According to said structure, failure of the drive device for rotary electric machines can be prevented beforehand.

  Further, in the rotating electrical machine drive control device according to the second invention, preferably, the rotating electrical machine control unit changes a predetermined ratio that is multiplied when the limiting means obtains the limit value according to the temperature rise degree. including.

  In addition, among the rotating electrical machine drive control devices according to the present invention, the control method of the rotating electrical machine drive control device according to the second invention includes a drive device for a rotating electrical machine including a semiconductor element solder-bonded to a substrate, A method for controlling a rotating electrical machine drive control device comprising temperature detecting means for detecting a temperature and a rotating electrical machine control unit for controlling the rotating electrical machine drive device, wherein the torque command for the rotating electrical machine is input from a torque command calculating unit. A time integrated value calculation step for calculating a time integrated value of a current command value based on a time integrated value or a torque command value, a detected value of the rising temperature of the semiconductor element relative to a reference temperature, and a time integrated value or current of a torque command value The temperature rise degree calculating step for calculating the temperature rise degree, which is a ratio of the command value to the time integrated value rise, and the calculated temperature rise degree are set in advance in the initial temperature rise degree. A determination step of determining that abnormal deterioration of the solder joint portion of the semiconductor element has occurred and outputting an abnormal signal when it is determined that the degree of increase in the allowable temperature obtained by multiplying the predetermined value is greater. This is a control method of a rotating electrical machine drive control device.

  According to the rotating electrical machine drive control device and the control method thereof according to the present invention, it is possible to accurately determine whether or not the abnormal deterioration of the solder joint portion between the semiconductor element and the substrate has occurred.

[First Embodiment]
Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. 1 to 6 show a first embodiment of the present invention. FIG. 1 is a block diagram showing a rotating electrical machine drive control device of the present embodiment. FIG. 2 is a schematic diagram showing an IGBT soldered to a substrate constituting the inverter shown in FIG. FIG. 3 is a schematic diagram showing a state where the solder joint portion is cracked in the IGBT shown in FIG. 2 soldered to the substrate. FIG. 4 is a diagram showing the relationship between the time integrated value of the torque command value and the temperature rise of the IGBT represented by the map stored in the map storage means shown in FIG. FIG. 5 is a diagram showing the relationship between the torque after the torque limiting process of the motor, which is a rotating electrical machine, and the rotational speed of the motor when the temperature of the IGBT shown in FIG. 2 rises. FIG. 6 is a flowchart for explaining a first example of a method of executing a torque command or current command limiting process by the rotating electrical machine drive control device of the present embodiment. FIG. 7 is a flowchart for explaining a second example of a method of executing a torque command or current command limiting process by the rotating electrical machine drive control device of the present embodiment.

  The rotating electrical machine drive control device according to the present embodiment is used by being mounted on an electric vehicle such as a hybrid vehicle or an electric vehicle, for example. In the following, a case where the rotating electrical machine is a three-phase AC motor for a vehicle will be described, but it may be a rotating electrical machine such as a motor other than the vehicle. Further, the case where the rotating electrical machine is a motor having a function of only a motor will be described. However, the rotating electrical machine may have a function of only a motor generator and a motor generator having both functions of a motor and a generator. it can. The number of phases of the rotating electrical machine can be other than three phases. The control of the rotating electrical machine is described as being performed by feeding back the drive current of the rotating electrical machine to the current command value, but other controls may be used.

  FIG. 1 shows a motor that is a rotating electrical machine that is a target of drive control, and a motor control unit that controls the drive of the motor. As shown in FIG. 1, the rotating electrical machine drive control device 10 includes a battery 12 that supplies DC power, an inverter 14 that is a rotating electrical machine drive device that converts DC power from the battery 12 into AC power, and an inverter 14 includes: The three-phase AC motor 16 for driving the vehicle, which is driven by using the generated AC current (U-phase current ium, V-phase current ivm, W-phase current iwm), and the inverter 14 are driven. A motor control unit 18 for controlling the inverter 14, a temperature detection means, and a semiconductor element temperature sensor IGBT temperature sensor 20, a cooling water temperature sensor 22, a rotation angle sensor 24, an accelerator And an accelerator opening sensor 26 that detects an accelerator opening that is an operation amount of the pedal. The motor 16 is, for example, a synchronous motor provided with a permanent magnet, but may be a motor other than that.

  The inverter 14 is a plurality of semiconductor elements connected to the positive electrode and the negative electrode of the battery 12, and includes a plurality of IGBTs that are switching elements and protective diodes that are connected corresponding to the respective IGBTs. The plurality of IGBTs are respectively connected to three-phase (U-phase, V-phase, W-phase) windings of the motor 16. For example, three inverter arms each composed of two IGBTs connected in series are provided between a pair of power supply lines extending from the positive electrode and the negative electrode of the battery 12, and the midpoint of each two IGBTs is a three-phase coil of the motor 16. Connect to each. And on / off of IGBT is controlled and the connection of the motor 16 and the battery 12 is controlled. As shown in FIG. 2, the chip 25 on which the IGBT is formed is soldered to the substrate 27 by a solder joint portion 28. Returning to FIG. 1, for example, a smoothing capacitor (not shown) and a boost converter are connected between the motor 16 and the battery 12. Note that the semiconductor element constituting the inverter 14 is not limited to the IGBT, but may be a transistor, a MOS-FET, or the like.

  The IGBT temperature sensor 20 detects the temperature of the IGBT that constitutes the inverter 14. For example, as shown in FIG. 2, the IGBT temperature sensor 20 is incorporated as a part of the circuit in the chip 25 on which the IGBT is formed. For example, a temperature detecting diode constituting the IGBT temperature sensor 20 is built in the chip 25 as a part of the circuit, and the current-voltage characteristic with respect to the temperature of the diode is used, for example, by using an external circuit (not shown). The temperature of 25 is detected as the temperature of the IGBT. The cooler 30 is bonded to the substrate 27 to which the chip 25 is bonded. The cooling water temperature sensor 22 (FIG. 1) detects the temperature of the cooling water that cools the cooler 30. For example, as shown in FIG. 2, the element including the chip 25 is joined to the substrate 27 by the solder joint portion 28, and the substrate 27 is joined to the cooler 30 by another solder joint portion 32. A plurality of fins 34 are provided on the side opposite to the substrate 27 of the cooler 30 (the lower side in FIG. 2), and the cooler 30 is cooled by flowing cooling water to the fins 34 side of the cooler 30. The cooling water temperature sensor 22 detects the temperature of this cooling water, which is a reference temperature. As shown in FIG. 1, the detected temperature of the IGBT temperature sensor 20 and the detected temperature of the cooling water temperature sensor 22 are input to an abnormality determination unit 36 (to be described later) of the motor control unit 18. The temperature rise with respect to the cooling water temperature is calculated.

  Although the cooling water temperature sensor 22 is provided in the present embodiment, the cooling water temperature sensor 22 may be omitted, and only the detection value of the IGBT temperature sensor 20 may be input to the abnormality determination unit 36 as the detection temperature. In this case, for example, the reference temperature is set to a predetermined value, for example, 0 ° C., and the “rising temperature of the semiconductor element with respect to the reference temperature” is, for example, the temperature of the IGBT. Moreover, the IGBT temperature sensor 20 may be provided only in one IGBT which comprises the inverter 14, and may detect and output the temperature rise part about one IGBT. However, the IGBT temperature sensor 20 may be provided in some or all of the plurality of IGBTs constituting the inverter 14, and the highest temperature may be output as the representative value of the detection value. The rotation angle sensor 24 is, for example, a resolver, and detects the rotation angle θ of the motor 16 and inputs it to the motor control unit 18.

  The motor control unit 18 includes a microcomputer having a CPU, a memory, etc., and includes a torque command calculation unit 38, a current command calculation unit 40, a current command / control signal conversion unit 42, a feedback conversion unit 44, an abnormality And a determination unit 36. The feedback conversion unit 44 converts the motor drive currents ium, ivm, iwm detected by the U-phase current sensor, the V-phase current sensor, and the W-phase current sensor into a three-phase / 2-phase conversion using the rotation angle θ of the motor 16. It converts into d-axis current id and q-axis current iq and inputs to current command / control signal converter 42. The current command calculation unit 40 has previously created a d-axis current command value id * and a q-axis current command value iq *, which are current command values based on the output torque command value input from the torque command calculation unit 38. It is calculated according to a table or the like and input to the current command / control signal converter 42.

  The torque command calculation unit 38 calculates an output torque command value based on the accelerator opening input from the accelerator opening sensor 26 and the determination result of the abnormality determination unit 36 and inputs the output torque command value to the current command calculation unit 40.

  Further, the current command / control signal conversion unit 42 uses the d-axis current command value id *, the q-axis current command value iq *, the d-axis current id and the q-axis current iq input from the feedback conversion unit 44, and d After generating the voltage command value for the axis and the q axis, the voltage command value is converted into a three-phase AC voltage command value using the rotation angle θ of the motor 16, and further, each IGBT constituting the inverter 14 is turned on / off. PWM control signals vu, vud, vvu, vvd, vwu, vwd to be controlled are generated and input to the inverter 14. As a result, the inverter 14 outputs a drive signal to the motor 16 to drive the motor 16.

  On the other hand, the abnormality determination unit 36 receives detection signals from the IGBT temperature sensor 20 and the cooling water temperature sensor 22, and the torque command calculation unit 38 (or current command calculation unit 40) receives the IGBT solder joint 28 (FIG. 2). When it is determined that abnormal deterioration has occurred, an abnormal signal is output. For this purpose, the abnormality determination unit 36 includes a map storage unit 48, a time integrated value calculation unit 49, and a determination unit 50. The map storage means 48 stores a map representing the relationship between the allowable rise temperature of the IGBT of the inverter 14 relative to the coolant temperature and the time integrated value of the torque command value (or the time integrated value of the current command value).

  That is, as shown in FIG. 2, the chip 25 and the substrate 27 are thermally expanded due to a temperature rise or the like accompanying the energization of the IGBT in a configuration in which the chip 25 and the substrate 27 on which the IGBT is formed are joined by the solder joint portion 28. there's a possibility that. In this case, when the stress is applied to the solder joint portion 28 due to the difference in the thermal expansion coefficient between the chip 25 and the substrate 27, when cracks are generated in the solder joint portion 28 as shown in FIG. Thus, the solder joint portion 28 may be abnormally deteriorated. When the crack 52 is generated in the solder joint portion 28 in this way, the thermal resistance of the path that radiates heat from the chip 25 to the cooler 30 via the substrate 27 increases, and heat dissipation is hindered. For this reason, the temperature of the chip 25 tends to rise. On the other hand, a time integrated value of the torque command value of the motor 16 (FIG. 1) or a current command value corresponding to the torque command value of the motor 16, for example, a d-axis current command value id * and a q-axis current command value iq * The temperature rise of the chip 25 increases as the time integration value of the total or root mean square increases. Therefore, when the temperature rise of the IGBT becomes excessively large with respect to the time integrated value at the preset time of the torque command value or the time integrated value at the preset time of the current command value, the solder It is possible to determine that a crack 52 (FIG. 3) is generated in the joint portion 28 and the solder joint portion 28 is abnormally deteriorated. In the present embodiment, based on such a principle, the map storage means 48 (FIG. 1) stores, for example, a map representing the relationship indicated by the solid line a1 in FIG. 4, and the IGBT is abnormal based on this map. Whether or not the temperature has increased is determined.

  In FIG. 4, when a desired torque request is generated on the horizontal axis, for example, a torque command from when the output torque command value becomes equal to or greater than a predetermined value until a predetermined time elapses. The time integrated value of the value is represented, and the vertical axis represents the temperature rise of the IGBT with respect to the cooling water temperature. Note that the cooling water temperature is normally used as a stable value, and the temperature rise of the IGBT due to abnormal deterioration of the solder joint portion 28 (FIG. 2) is considered as the temperature rise of the IGBT due to the temperature rise of the cooling water. This is to make it possible to distinguish and judge. Further, the solid line a1 represents an allowable rise temperature line that is the upper limit of the IGBT design prediction range, and the broken line a2 represents the lower limit line of the IGBT design prediction range. For this reason, by design, it is estimated that the temperature rise with respect to the cooling water temperature of IGBT exists in the A1 area | region which is an area | region between the continuous line a1 and the broken line a2 which are shown by the arrow h. On the other hand, when the temperature increase with respect to the cooling water temperature of the IGBT is in the A2 region exceeding the solid line a1, it can be determined that the temperature of the IGBT has abnormally increased and the solder joint portion 28 has abnormally deteriorated. The map storage means 48 (FIG. 1) stores map data representing the allowable rise temperature line, which is the solid line a1 shown in FIG.

  4 shows a map showing the relationship between the time integrated value of the torque command value and the temperature rise of the IGBT, the map storage means 48 shows the time integrated value of the current command value on the horizontal axis in FIG. A map representing the relationship between the time integrated value of the current command value and the allowable increase temperature of the IGBT can be stored. In the map in this case, the temperature rise with respect to the cooling water temperature of the IGBT increases as the time integrated value of the current command value increases. In this case, the map storage means 48 stores map data representing the allowable rise temperature line in the relationship between the temperature rise of the IGBT coolant temperature and the time integrated value of the current command value.

  Further, as shown in FIG. 1, the time integration value calculation means 49 calculates the time integration value of the torque command value input from the torque command calculation unit 38 or the time integration value of the current command value based on the torque command value. . Further, the determination unit 50 calculates the cooling water temperature of the IGBT from the time integration value of the torque command value or the time integration value of the current command value input from the time integration value calculation unit 49 and the map stored in the map storage unit 48. When it is determined that the detected value of the rising temperature is higher than the allowable rising temperature obtained from the map (for example, the solid line a1 in FIG. 4), it is determined that abnormal deterioration of the solder joint 28 has occurred, and an abnormal signal Is output. The abnormal signal is input to the torque command calculation unit 38 or the current command calculation unit 40.

  For example, when the abnormality signal output from the determination unit 50 is configured to be input to the torque command calculation unit 38, the torque command calculation unit 38 includes a torque command limitation unit 54. When an abnormality signal is output from the determination unit 50, the torque command limiting unit 54 multiplies the output torque command value corresponding to the rotation speed of the motor 16 by a predetermined ratio set in advance to the maximum value of the torque command value. The torque is limited to a value less than the limit torque obtained by In the following description, the same elements as those shown in FIGS. 1 and 2 are denoted by the same reference numerals. For example, as shown in FIG. 5, when the relationship between the rotational speed N of the motor 16 and the maximum value of the motor torque Tm is defined, the torque command limiting means 54 sets the maximum value of the torque command at the time of non-limitation. That is, the torque is changed to a limit torque (solid line b2 in FIG. 5) obtained by multiplying the normal maximum value (broken line b1 in FIG. 5) by a predetermined ratio set in advance according to the rotational speed N, for example, 80%. The output torque command value output from the torque command calculation unit 38 is limited to the limit torque or less. Thereby, the temperature rise of IGBT of the inverter 14 can be suppressed.

  Further, when the abnormality signal output from the determination unit 50 is configured to be input to the current command calculation unit 40, the current command calculation unit 40 includes a current command limitation unit 56. When an abnormality signal is output from the determination unit 50, the current command limiting unit 56 converts an output torque command value that is not limited to a current command value, and then converts the current command value to the maximum value of the torque command value. Is limited to a limit current or less, which is a limit value obtained by multiplying the maximum value of the current command value corresponding to 1 by a predetermined ratio set in advance. For example, in the current command calculation unit 40, a predetermined ratio in which the maximum value of the current command values id * and iq * calculated according to the maximum value of the torque command is set in advance to the maximum value of the current command values id * and iq *. To the limit current obtained by multiplying each of them, the calculated current command value is limited to the limit current or less, and is output to the current command / control signal converter 42. Thereby, the temperature rise of IGBT of the inverter 14 can be suppressed. Such a function of the motor control unit 18 can be realized by software in addition to being partially executed by hardware, for example, by executing a corresponding motor control program.

  FIG. 6 is a flowchart for explaining a first example of a method for executing a torque command or current command limit process by the rotating electrical machine drive control device 10. In the following description, the same elements as those shown in FIGS. 1 and 2 are denoted by the same reference numerals. First, as step S10, the torque command calculation unit 38 calculates a required torque command value corresponding to the accelerator opening based on the signal from the accelerator opening sensor 26. Next, in step S12, the torque command calculation unit 38 determines whether or not the required torque command value is equal to or greater than a predetermined value corresponding to the acceleration state. This predetermined value may be simply a value exceeding 0. Here, if it is determined that the required torque command value is not equal to or greater than the predetermined value, the process proceeds to step S14, and the normal control process is executed without executing the torque command or current command limiting process. That is, the torque command calculation unit 38 outputs the required torque command value as an output torque command value, and the current command calculation unit 40 outputs a current command value corresponding to the output torque command value, which is a d-axis current command value id * and a q-axis. The current command value iq * is output, and thereafter the motor 16 is driven by the inverter 14 as described above.

  On the other hand, if it is determined in step S12 that the required torque command value is equal to or greater than the predetermined value, that is, a predetermined acceleration state, in step S16, the determination means 50 determines the torque command value at a preset predetermined time. A time integrated value calculating step for calculating the time integrated value is performed. While the time integrated value of the torque command value is calculated, the normal control process can be executed based on the torque command value. Next, while the time integrated value of the torque command value is calculated in step S18, the detected value of the IGBT temperature by the IGBT temperature sensor 20 and the detected value of the cooling water temperature by the cooling water temperature sensor 22 are continued, for example, predetermined Detection is performed every time, and the detected value is stored in the memory of the motor control unit 18. At the same time, the determination unit 50 sets the detected value of the highest IGBT temperature among the detected values of the IGBT temperature stored in the memory as Tpeak. Further, a detection value detected by the cooling water temperature sensor 22, for example, a detection value of the cooling water temperature when the maximum IGBT temperature Tpeak is detected is defined as a cooling water temperature Tw. Then, the rising temperature ΔT of the IGBT with respect to the cooling water temperature Tw is calculated from the equation: ΔT = Tpeak−Tw.

  Next, in step S20, the determination means 50 is a map showing the relationship between the time integrated value of the torque command value stored in advance in the map storage means 48 and the allowable increase temperature ΔTa of the IGBT, that is, a solid line a1 in FIG. While referring to the map representing the relationship, the increase temperature ΔT, which is the detected value for the time integrated value of the torque command value, is the allowable increase temperature for the time integrated value of the torque command value in the map represented by the solid line a1 in FIG. A determination step is performed to determine whether or not it is greater than ΔTa. In the determination step, the determination result by this determination is negative, that is, the increase temperature ΔT, which is a detection value for the time integrated value of the torque command value, is equal to or lower than the allowable increase temperature ΔTa for the time integrated value of the torque command value in the map ( If it is determined that (ΔT ≦ ΔTa), the process proceeds to step S14, and the normal control process is executed.

  On the other hand, in the determination step, the determination result in step S20 is affirmative, that is, the increase temperature ΔT, which is a detected value for the time integrated value of the torque command value, is an allowable increase temperature for the time integrated value of the torque command value in the map. If it is determined that it is greater than ΔTa (ΔT> ΔTa), the process proceeds to step S22, and the determination unit 50 outputs an abnormal signal to the torque command calculation unit 38 or the current command calculation unit 40. When an abnormal signal is output to the torque command calculation unit 38, the torque command limiter 54 included in the torque command calculation unit 38 sets the torque command value corresponding to the rotation speed of the motor 16 to the maximum value of the torque command value in advance. A torque command limiting process is performed for limiting the torque to a value equal to or less than a limit torque obtained by multiplying the set predetermined ratio. The motor control unit 18 drives the motor 16 based on the limited output torque command.

  When an abnormal signal is output to the current command calculation unit 40, the current command calculation unit 40 converts the output torque command value that is not limited to a current command value, and then the current command limiter 56 determines the current command. A current command limit process is executed to limit the value to a limit current or less obtained by multiplying the maximum value of the current command value corresponding to the maximum value of the torque command value by a predetermined ratio set in advance. The motor control unit 18 drives the motor 16 based on the limited current command.

  For example, as indicated by a point P1 in FIG. 4, the rise temperature ΔT, which is a detected value for the time integrated value of the torque command value, is equal to or less than the allowable rise temperature ΔTa for the time integrated value of the torque command value, which is represented by a solid line a1. In some cases, normal control processing is performed. On the other hand, as indicated by a point P2 in FIG. 4, an increase in temperature ΔT, which is a detected value corresponding to the time integrated value of the torque command value, is allowed with respect to the time integrated value of the torque command value represented by the solid line a1. If the temperature is higher than the rise temperature ΔTa, torque command limiting processing or current command limiting processing is executed.

  FIG. 7 shows a flowchart for explaining a second example of a method for executing a torque command or current command limiting process by the rotating electrical machine drive control device 10, unlike the case of FIG. 6. First, in step S30, the torque command calculation unit 38 calculates a required torque command value corresponding to the accelerator opening based on a signal from the accelerator opening sensor 26. Next, in step S32, the torque command calculation unit 38 determines whether the required torque command value is equal to or greater than a predetermined value corresponding to the acceleration state. This predetermined value may be simply a value exceeding 0. Here, if it is determined that the required torque command value is not equal to or greater than the predetermined value, the process proceeds to step S34, and the normal control process described above is executed.

  On the other hand, if it is determined in step S32 that the required torque command value is greater than or equal to the predetermined value, in step S36, the torque command calculation unit 38 outputs the required torque command value as an output torque command value, and step S38. Thus, the current command calculation unit 40 calculates a current command value corresponding to the output torque command value. In step S40, the determination unit 50 performs a time integrated value calculation step of calculating a time integrated value of the current command value at a predetermined time set in advance. While this time integration value is calculated, the normal control process can be executed based on the current command value. Next, in step S42, while the current command value integrated value is calculated, the detected value of the IGBT temperature by the IGBT temperature sensor 20 and the detected value of the cooling water temperature by the cooling water temperature sensor 22 are continued, for example, every predetermined time. And the detected value is stored in the memory of the motor control unit 18. At the same time, the determination unit 50 sets the detected value of the highest IGBT temperature among the stored detected values of the IGBT temperature as Tpeak. Further, a detection value detected by the cooling water temperature sensor 22, for example, a detection value of the cooling water temperature when the maximum IGBT temperature Tpeak is detected is defined as a cooling water temperature Tw. Then, the rising temperature ΔT of the IGBT with respect to the cooling water temperature Tw is calculated from the equation: ΔT = Tpeak−Tw.

  Next, in step S44, the determination unit 50 refers to a time map of the current command value while referring to a map representing the relationship between the current integrated value of the current command value stored in the map storage unit 48 and the allowable increase temperature ΔTa of the IGBT. A determination step is performed to determine whether or not the increase temperature ΔT, which is a detection value for the integrated value, is greater than the allowable increase temperature ΔTa for the time integrated value of the current command value in the map. In the determination step, the determination result by this determination is negative, that is, the rise temperature ΔT, which is a detected value for the time integrated value of the current command value, is equal to or less than the allowable rise temperature ΔTa for the time integrated value of the current command value in the map ( If it is determined that [Delta] T≤ [Delta] Ta), the process proceeds to step S34, and the normal control process is executed.

  On the other hand, in the determination step, the determination result in step S44 is affirmative, that is, the increase temperature ΔT, which is a detection value for the time integration value of the current command value, is an allowable increase temperature for the time integration value of the current command value in the map. If it is determined that it is greater than ΔTa (ΔT> ΔTa), the process proceeds to step S46, and the determination means 50 outputs an abnormal signal to the torque command calculation unit 38 or the current command calculation unit 40, and the above-described FIG. As in the case shown, the torque command limiting means is executed by the torque command limiting means, or the current command calculation unit 40 is caused to execute the current command limiting process. In the flowchart shown in FIG. 7, other control processes are the same as those in the flowchart shown in FIG.

  According to the present embodiment as described above, it is possible to accurately determine whether or not the abnormal deterioration of the solder joint portion 28 between the IGBT and the substrate 27 has occurred. In other words, abnormal deterioration occurs when the temperature rise of the IGBT with respect to the reference temperature such as the cooling water temperature becomes abnormally higher than normal, which increases as the time integrated value of the torque command value or the time integrated value of the current command value increases. Therefore, it is possible to increase the accuracy of determining the occurrence of abnormal deterioration. That is, if a crack 52 (FIG. 3) occurs in the solder joint portion 28 and abnormal deterioration occurs, the heat dissipation from the IGBT is abnormally reduced. Therefore, the solder joint portion 28 is based on the abnormal rise in temperature. The occurrence of abnormal deterioration can be accurately determined.

  In addition, when an abnormality signal is output from the determination unit 50, the motor control unit 18 sets a torque command value or a current command value corresponding to the rotation speed of the motor 16 to the maximum value of the torque command value or the torque command value. Torque command limiting means 54 or current command limiting means 56 is included that limits the maximum value of the current command value corresponding to the maximum value to a limit value or less obtained by multiplying a predetermined ratio set in advance. For this reason, the failure of the inverter 14 can be prevented more effectively.

  In the present embodiment, a torque command limiting process or a current command limiting process is executed in accordance with the output of the abnormal signal from the determination means 50, and a warning lamp (not shown) provided in the periphery of the driver's operation unit is provided. It can also be lit. In the present embodiment, the warning lamp can be turned on without executing the torque command limiting process or the current command limiting process in accordance with the output of the abnormal signal from the determination unit 50. In this case, although the torque of the motor 16 is not automatically limited, it becomes possible for the driver to reduce the amount of operation of the accelerator pedal by confirming the lighting of the warning lamp, and the excessive temperature of the IGBT. The rise can be suppressed.

  Next, referring to FIG. 8, in the present embodiment, when the torque command limiting process or the current command limiting process is executed, the ratio of limiting the torque command or the current command is determined according to the degree of deterioration of the solder joint portion 28. A configuration that can be changed will be described. FIG. 8 shows a ratio of the rising temperature of the IGBT with respect to the reference temperature and the increase in the time integrated value of the torque command value as the predetermined ratio set when the maximum motor torque is limited in the motor control unit shown in FIG. It is a figure showing the map used when changing according to a temperature rise degree. In FIG. 8, the horizontal axis indicates the ratio between the rising temperature of the IGBT with respect to the cooling water temperature Tw, for example, the maximum value Tpeak of the detected temperature of the IGBT when the torque request is generated, and the increase of the time integrated value Treq of the torque command value. The initial value of the degree of increase is ΔT1 (for example, ΔT1 = (Tpeak−Tw) / Treq), and the degree of temperature increase after a predetermined time has elapsed is ΔTbi (= ΔTb1, ΔTb2...) (For example, ΔT1 = (Tpeak−Tw) ) / Treq), ΔTbi / ΔT1 is represented, and the vertical axis represents a predetermined ratio K set when the maximum motor torque is limited.

  In the above embodiment, in the present embodiment, when executing the torque command limiting process when the abnormality signal is output by the determination means 50 using the flowchart as shown in FIG. 6 or FIG. A case has been described in which the torque command limiting means 54 limits the torque command value to a limit torque or less obtained by multiplying the maximum value of the torque command value by a predetermined ratio set in advance. On the other hand, in the case of the configuration of another example described below, in the same case, the predetermined ratio K to be multiplied when the torque command limiting means 54 obtains the limiting torque is set to the temperature rise of the IGBT with respect to the reference temperature and the torque. The command value is changed in accordance with the degree of temperature rise, which is the ratio of the command value to the rise in time integration value. For this reason, in the configuration of another example, the torque command calculation unit 38 is configured to include the limit ratio changing means 58 (see FIG. 1). The limit ratio changing means 58 is configured to change a predetermined ratio K by which the torque command value is multiplied by the maximum value of the torque command value when the torque command limit means 54 obtains the limit torque into an IGBT with respect to an increase in the time integrated value at a preset predetermined time of the torque command value. The temperature is changed according to the temperature increase degree, that is, is decreased. For example, FIG. 8 shows a straight line (solid line C1 in FIG. 8) and a curve (one-dot chain line C2 and two-dot chain line C3 in FIG. 8) representing three types of relationships. A predetermined ratio K is set using a map representing one of these relationships. As shown in FIG. 8, in the maps representing the three types of relationships representing the predetermined ratio K, the predetermined ratio K decreases as ΔTbi / ΔT1 increases. Here, ΔT1 is a calculated value of an initial value of the degree of temperature rise, which is a temperature rise of the IGBT with respect to a rise in the time integrated value of the torque command value. For example, the rotating electrical machine drive control device 10 or a vehicle equipped with the rotating electrical machine drive control device 10 is mounted at the time of an inspection process after manufacturing in the factory, or the rotating electrical machine drive control device 10 or the rotating electrical machine drive control device 10 is mounted. After the vehicle is sold, the calculated value ΔT1 is stored in the memory when a predetermined time has elapsed in an initial stage. In this state, normally, deterioration at the solder joint portion 28 between the IGBT and the substrate 27 does not occur. Therefore, the temperature rise of the IGBT with respect to the increase in the time integrated value of the torque command value becomes a relatively small value. On the other hand, the deterioration of the solder joint portion 28 may gradually progress as the elapsed time from the storage of the calculated value ΔT1 becomes longer. For this reason, when a predetermined time has elapsed since the calculated value ΔT1 is stored, a calculated value ΔTi of the temperature increase degree, which is an increase temperature of the IGBT with respect to an increase in the time integrated value of the torque command value, is calculated and stored in the memory. The calculated value ΔTi gradually increases according to the degree of deterioration of the solder joint portion 28. In the configuration of another example of the present embodiment, the motor maximum value is calculated by using the calculated value ΔTi and the initial calculated value ΔT1 and using the map representing the relationship 1 shown in FIG. A predetermined ratio K at the time of torque limitation is obtained.

  When the determination unit 50 outputs an abnormal signal, the torque command limiting unit 54 reduces the predetermined ratio K to a limit torque or less obtained by multiplying the maximum value of the torque command value according to the number of rotations of the motor 16. Limit the torque command value. For example, when the set ratio K obtained by the limit ratio changing means 58 is 50%, 0.5 Tm obtained by multiplying 0.5 by the maximum value Tm of the torque command value corresponding to the rotation speed of the motor 16. Is determined as the limit torque, and the output torque command value is limited to 0.5 Tm or less.

  According to the configuration of such another example, when the degree of deterioration of the solder joint portion 28 is small, the degree of restriction of the torque command value is reduced to effectively reduce the power performance of the vehicle driven by the motor 16. Can be prevented. Note that the motor control unit 18 may be provided with a selection means for selecting which of the three types of maps shown in FIG. In FIG. 8, three types of relationships are shown as maps. However, the relationship selected by the selection unit is not limited to one of the three, but is selected from two or four or more maps. It can also be configured as follows.

  Further, in the above, when the torque command limiting process is executed when the abnormality signal is output by the determination unit 50, the predetermined ratio K to be multiplied when the torque command limiting unit 54 obtains the limiting torque is set to the reference temperature. The change is made according to the temperature rise degree, which is a ratio 8 of the temperature rise of the IGBT and the rise of the time integrated value of the torque command value. However, in the configuration of another example, in the same case, the predetermined ratio to be multiplied when the current command limiting means 56 obtains the limited current is the ratio of the rising temperature of the IGBT to the reference temperature and the increase of the time integrated value of the current command value. It can also be configured to change according to the temperature rise degree. In this case, the current command calculation unit 40 is configured to include a current command limit ratio changing unit 60. The current command limit ratio changing unit 60 calculates a predetermined ratio K ′ by which the current command value is multiplied by the maximum value of the current command value when the current command limit unit 56 obtains the limit current as the temperature rise of the IGBT with respect to the increase of the time integrated value of the current command value. Change according to the temperature rise. In this case, the current command limit ratio changing means 60 obtains the predetermined ratio K ′ by using a map that represents the relationship between the predetermined ratio K ′ and the temperature rise degree that is the temperature rise of the IGBT with respect to the increase in the current command value. . Further, in this map, the predetermined ratio K ′ is decreased as the temperature increase degree, which is the temperature increase of the IGBT with respect to the increase in the time integrated value of the current command value, increases. Even in the case of such another configuration, if the degree of deterioration of the solder joint portion 28 is small, the degree of restriction of the current command value is reduced to effectively reduce the power performance of the vehicle driven by the motor 16. Can be prevented. Note that, as a map used in such another configuration, a map representing a plurality of types of relationships is stored, and selection means for selecting which map is to be used is provided in the motor control unit 18. You can also.

[Second Embodiment]
FIG. 9 is a block diagram showing a rotary electric machine drive control device according to the second embodiment of the present invention. FIG. 10 is a flowchart for explaining a method of executing a torque command or current command limit process by the rotating electrical machine drive control device of the present embodiment. FIG. 11 is a flowchart showing in detail the processing when a predetermined period has elapsed in the flowchart shown in FIG. FIG. 12 shows an example of the relationship between the number of years elapsed from the start of use of the electric vehicle equipped with the rotating electrical machine drive control device of the present embodiment and the degree of temperature increase of the IGBT with respect to the increase in the time integrated value of the torque command value. FIG.

  In the case of the present embodiment, unlike the case of the first embodiment described above, the abnormality determination unit 36a does not use a map. Instead, the abnormality determination unit 36 a includes a time integrated value calculation unit 49, a temperature rise degree calculation unit 62, and a second determination unit 64. The function of the time integrated value calculation means 49 is the same as in the case of the first embodiment. Further, the temperature rise degree calculating means 62 is a detection value of the temperature rise of the IGBT detected by the IGBT temperature sensor 20 which is a temperature detecting means with respect to the cooling water temperature which is a reference temperature, and a time integrated value or current command of a torque command value. The degree of temperature rise, which is the ratio of the value to the rise in time integrated value, is calculated. Further, the second determination means 64 has a calculated temperature increase degree ΔTbi larger than an allowable temperature increase degree α · ΔT1 obtained by multiplying the initial temperature increase degree ΔT1 by a predetermined value α (ΔTbi). If it is determined that> α · ΔT1), it is determined that an abnormal deterioration of the solder joint 28 between the IGBT and the substrate 27 has occurred, and an abnormal signal is output.

  Next, a method for executing a torque command or current command limiting process by the rotating electrical machine drive control device 10 (FIG. 9) will be described with reference to FIGS. In the following description, the same elements as those shown in FIG. First, in step S50 of FIG. 10, the temperature rise degree calculation means 62 determines whether or not an initial condition corresponding to a new vehicle is satisfied. The initial conditions include the rotating electrical machine drive control device 10 and the inspection process after manufacturing the vehicle on which the rotating electrical machine drive control device 10 is mounted at the factory, the rotating electrical machine drive control device 10, and the rotating electrical machine drive control device 10. It means that a predetermined time has elapsed in the initial stage after the vehicle equipped with is sold. If it is determined that the initial condition is established, in step S52, the temperature increase degree calculation means 62 causes the torque command value to be accumulated in a predetermined time period Treq or the current command value in a predetermined time period. A time integrated value calculating step for calculating the time integrated value Ireq is performed. In step S54, the temperature increase degree calculation means 62 uses the detected values of the IGBT temperature sensor 20 and the coolant temperature sensor 22 to increase the time integrated value Treq of the torque command value or the time integrated value Ireq of the current command value. Rise temperature relative to the cooling water temperature Tw, which is the reference temperature of the IGBT, for example, the initial temperature rise degree ΔT1 (eg, ΔT1 = (Tpeak−Tw) / Treq), which is the degree of the maximum value Tpeak of the temperature when the torque request is generated. Alternatively, an initial temperature rise degree calculation step of calculating (Tpeak−Tw) / Ireq) is performed. A predetermined value, for example, 0 ° C. can be used without using the cooling water temperature Tw as the reference temperature. In step S56, the temperature increase degree calculation means 62 stores the calculated initial temperature increase degree ΔT1. Next, in step S58, normal control processing similar to that in the first embodiment is executed. If the normal control process is executed, the process returns to step S50.

  If it is determined in step S50 that the initial condition is not satisfied, in step S60, when the initial condition is satisfied, or when processing is performed when a predetermined period of time elapses, which will be described later, is executed, by the temperature increase degree calculation means 62. It is determined whether a predetermined period set in advance has elapsed. Here, if the determination result of step S60 is negative, the process proceeds to step S64, the above-described normal control process is executed, and the process returns to step S50.

  On the other hand, if the determination result of step S60 is affirmative, the process proceeds to the process at the elapse of a predetermined period of step S62. FIG. 11 is a flowchart showing in detail the processing when a predetermined period has elapsed. That is, if the process proceeds to the process when the predetermined period has elapsed, in step S62, as in the case of step S52 described above, the temperature increase degree calculation means 62 performs the time integration value Treq at a predetermined time set in advance, Alternatively, a temperature increase degree calculation step when a predetermined period of time is calculated to calculate the time integrated value Ireq at a predetermined time set in advance for the current command value. In step S64, as in the case of step S54 described above, the temperature rise degree calculation means 62 uses the detected values of the IGBT temperature sensor 20 and the cooling water temperature sensor 22 to calculate the time integrated value Treq of the torque command value or A temperature rise degree ΔTbi when a predetermined period has elapsed, which is a degree of a rise temperature with respect to the coolant temperature Tw that is the reference temperature of the IGBT, for example, a maximum value Tpeak of the temperature when the torque request is generated, with respect to a rise in the time integrated value Ireq of the current command value. (= ΔTb1, ΔTb2,...) (For example, ΔTbi = (Tpeak−Tw) / Treq or (Tpeak−Tw) / Ireq) is calculated. Here, a predetermined value, for example, 0 ° C. can be used without using the cooling water temperature Tw as the reference temperature. In step S66, the second determination means 64 calculates the allowable temperature increase degree α · bi obtained by multiplying the calculated temperature increase degree ΔTbi when the predetermined period has elapsed by multiplying the initial temperature increase degree ΔT1 by a predetermined value α. A determination step is performed to determine whether ΔT1 is greater than ΔT1 (ΔTbi> α · ΔT1). In the determination step, if this determination result is negative, that is, if it is determined that ΔTbi ≦ αΔT1, it is determined that no abnormal deterioration has occurred in the solder joint portion 28 of the IGBT, and the normal control process described above is performed in step S68. 10 is returned to step S50 of FIG. 10, and when the predetermined period has elapsed since the previous execution of the predetermined period of time in step S60, the processing of steps S62 to S68 is performed again, and the determination result in step S66 is affirmative. Repeat until

  On the other hand, in the determination step, when the determination result in step S66 is affirmative, that is, when it is determined that ΔTbi> α · ΔT1, abnormal deterioration of the solder joint portion 28 between the IGBT and the substrate 27 has occurred. Thus, it is determined that the temperature of the IGBT has abnormally increased, and the second determination unit 64 outputs an abnormal signal in step S70.

  If an abnormal signal is output by the second determination means 64, a torque command or current command limiting process is executed in step S72 as in the case of the first embodiment, and the process returns to step S50.

  For example, in FIG. 12, the temperature rise degree, which is the number of years elapsed from the start of use of the electric vehicle equipped with the rotating electrical machine drive control device of the present embodiment and the temperature rise of the IGBT with respect to the rise of the time integrated value of the torque command value. An example of the relationship is shown. In FIG. 12, the white rhombus indicates the initial temperature rise degree ΔT1. In addition, the black rhombus portions represent the degree of temperature increase ΔTbi (= ΔTb1, ΔTb2,...) When a plurality of predetermined periods have elapsed. In the example shown in FIG. 12, since ΔTbi> αΔT1 is established after the fifth calculation of the temperature increase degree ΔTbi at the predetermined period, the torque command or current command limiting process is executed at the time of calculation. Is done.

  Also in the case of this embodiment, it is possible to accurately determine whether or not the abnormal deterioration of the solder joint portion 28 between the IGBT and the substrate 27 has occurred. That is, the temperature rise degree ΔTbi, which is the temperature rise of the IGBT with respect to the rise of the time cumulative value of the torque command value or the time cumulative value of the current command value, is obtained by multiplying the initial temperature rise degree ΔT1 by a predetermined value α. When it is determined that the allowable temperature increase degree α · ΔT1 is larger (ΔTbi> α · ΔT1), it is determined that abnormal deterioration has occurred in the solder joint portion 28, so that the determination accuracy of the occurrence can be increased. In addition, the initial temperature rise degree ΔT1 may vary greatly depending on the product of the rotating electrical machine drive control device 10, but even if there is a variation, the allowable temperature rise degree α · ΔT1 changes accordingly. Therefore, it is possible to increase the determination accuracy of occurrence of abnormal deterioration regardless of the presence of variation.

  Also in the case of the present embodiment, when an abnormal signal is output, the motor control unit 18 sets the torque command value or current command value corresponding to the rotation speed of the motor 16 to the maximum value of the torque command value or Torque command limiting means 54 or current command limiting means 56 for limiting the maximum value of the current command value corresponding to the maximum value of the torque command value to a limit value or less obtained by multiplying a predetermined ratio set in advance is included. For this reason, failure of the inverter 14 can be prevented in advance.

  Also in the present embodiment, similarly to the first embodiment described above, the motor control unit 18 uses the temperature rise of the IGBT with respect to the increase in the time integrated value of the torque command value or the time integrated value of the current command value. A limit ratio changing means 58 (or 60) for changing a predetermined ratio K, K ′ to be multiplied when the torque command limiting means or the current command limiting means obtains the limit torque or the limit current according to a certain temperature rise degree is included. It can also be configured. Since other configurations and operations are the same as those in the first embodiment, the same parts are denoted by the same reference numerals and redundant description is omitted.

It is a block diagram which shows the rotary electric machine drive control apparatus of the 1st Embodiment of this invention. 2 is a schematic diagram showing an IGBT solder-bonded to a substrate constituting the inverter shown in FIG. 1. FIG. 3 is a schematic diagram showing a state in which a solder joint portion is cracked in the IGBT solder-joined to the substrate shown in FIG. 2. It is a figure which shows the relationship between the time integrated value of a torque command value and the temperature rise of IGBT which the map which the map memory | storage means shown in FIG. 1 memorize | stores represents. It is a figure which shows the relationship between the torque after the torque limitation process of the motor which is a rotary electric machine, and the rotation speed of a motor at the time of the temperature rise of IGBT shown in FIG. It is a flowchart for demonstrating the 1st example of the method of performing the restriction | limiting process of a torque command or an electric current command with the rotary electric machine drive control apparatus of 1st Embodiment. It is a flowchart for demonstrating the 2nd example of the method of performing the restriction | limiting process of a torque command or an electric current command with the rotary electric machine drive control apparatus of 1st Embodiment. In the motor control unit shown in FIG. 1, the predetermined ratio set when the maximum motor torque is limited is set to a temperature increase degree, which is a ratio of the increase temperature of the IGBT to the reference temperature and the increase of the time integrated value of the torque command value. It is a figure showing the map used when changing according to it. It is a block diagram which shows the rotary electric machine drive control apparatus of the 2nd Embodiment of this invention. It is a flowchart for demonstrating the method to perform the limitation process of a torque command or an electric current command with the rotary electric machine drive control apparatus of 2nd Embodiment. It is a flowchart which shows in detail the process at the time of the predetermined period in the flowchart shown in FIG. The relationship between the number of years elapsed from the start of use of the electric vehicle equipped with the rotating electrical machine drive control device of the second embodiment and the degree of temperature rise, which is the temperature rise of the IGBT with respect to the rise in the time integrated value of the torque command value It is a figure which shows an example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Rotating electrical machinery drive control device, 12 Battery, 14 Inverter, 16 Motor, 18 Motor controller, 20 IGBT temperature sensor, 22 Cooling water temperature sensor, 24 Rotation angle sensor, 25 Chip, 26 Accelerator opening sensor, 27 Substrate, 28 Solder Joint part, 30 cooler, 32 solder joint part, 34 fin, 36, 36a abnormality determination part, 38 torque command calculation part, 40 current command calculation part, 42 current command / control signal conversion part, 44 feedback conversion part, 48 map Storage means, 49-hour integrated value calculation means, 50 determination means, 52 crack, 54 torque command limiting means, 56 current command limiting means, 58 limit ratio changing means, 60 current command limit ratio changing means, 62 temperature rise degree determining means, 64 Second determination means.

Claims (8)

A drive device for a rotating electrical machine including a semiconductor element solder-bonded to a substrate;
Temperature detecting means for detecting the temperature of the semiconductor element;
A rotating electrical machine control unit that controls the drive device for the rotating electrical machine,
The rotating electrical machine control unit
Storage means for storing a map representing the relationship between the allowable temperature rise of the semiconductor element relative to the reference temperature and the time integrated value of the torque command value of the rotating electrical machine or the time integrated value of the current command value;
A time integrated value calculating means for calculating a time integrated value of a torque command value input from a torque command calculating unit or a time integrated value of a current command value based on the torque command value;
When the detected value of the rising temperature with respect to the reference temperature of the semiconductor element is larger than the allowable rising temperature obtained from the map from the time integrated value of the torque command value or the time integrated value of the current command value and the map stored in the storage means A rotating electrical machine drive control device comprising: a determination unit that determines that an abnormal deterioration of a solder joint portion of a semiconductor element has occurred when determined, and outputs an abnormal signal. In the rotating electrical machine drive control device according to claim 1,
The rotating electrical machine control unit
When an abnormal signal is output, the torque command value or current command value corresponding to the rotational speed of the rotating electrical machine is changed to the maximum value of the torque command value or the maximum value of the current command value corresponding to the maximum value of the torque command value. A rotating electrical machine drive control device comprising limiting means for limiting to a limit value obtained by multiplying a predetermined ratio set in advance. In the rotating electrical machine drive control device according to claim 2,
The rotating electrical machine control unit
Multiplied when the limiting means obtains the limit value according to the temperature increase degree, which is the ratio of the temperature rise of the semiconductor element with respect to the reference temperature and the time integrated value of the torque command value or the time integrated value of the current command value. A rotating electrical machine drive control device comprising a limiting rate changing means for changing a predetermined rate. A drive device for a rotating electrical machine including a semiconductor element solder-bonded to a substrate;
Temperature detecting means for detecting the temperature of the semiconductor element;
A rotating electrical machine control unit that controls the drive device for the rotating electrical machine,
The rotating electrical machine control unit
Control method for rotating electrical machine drive control device including storage means for storing map representing relationship between allowable temperature rise of semiconductor element relative to reference temperature and time integrated value of torque command value or current command value of rotating electrical machine Because
A time integrated value calculating step of calculating a time integrated value of a torque command value input from a torque command calculating unit or a time integrated value of a current command value based on the torque command value;
When the detected value of the rising temperature with respect to the reference temperature of the semiconductor element is larger than the allowable rising temperature obtained from the map from the time integrated value of the torque command value or the time integrated value of the current command value and the map stored in the storage means And a determination step of determining that abnormal deterioration of the solder joint portion of the semiconductor element has occurred and outputting an abnormal signal when the determination is made. A drive device for a rotating electrical machine including a semiconductor element solder-bonded to a substrate;
Temperature detecting means for detecting the temperature of the semiconductor element;
A rotating electrical machine control unit that controls the drive device for the rotating electrical machine,
The rotating electrical machine control unit
A time integrated value calculating means for calculating a time integrated value of a torque command value of a rotating electrical machine input from a torque command calculating unit or a time integrated value of a current command value based on the torque command value;
A temperature rise degree calculating means for calculating a temperature rise degree, which is a ratio between a detected value of the rise temperature of the semiconductor element with respect to the reference temperature and a rise of the time integrated value of the torque command value or the time integrated value of the current command value;
When it is determined that the calculated temperature rise degree is larger than the allowable temperature rise degree obtained by multiplying the initial temperature rise degree by a predetermined value set in advance, abnormal deterioration of the solder joint portion of the semiconductor element may occur. A rotating electrical machine drive control device comprising: a determination unit that determines that the error has occurred and outputs an abnormal signal. In the rotating electrical machine drive control device according to claim 5,
The rotating electrical machine control unit
When an abnormal signal is output, the torque command value or current command value corresponding to the rotational speed of the rotating electrical machine is changed to the maximum value of the torque command value or the maximum value of the current command value corresponding to the maximum value of the torque command value. A rotating electrical machine drive control device comprising limiting means for limiting to a limit value obtained by multiplying a predetermined ratio set in advance. In the rotating electrical machine drive control device according to claim 6,
The rotating electrical machine control unit
A rotating electrical machine drive control device comprising: a limit ratio changing means for changing a predetermined ratio to be multiplied when the limit means obtains a limit value in accordance with a temperature rise degree. A drive device for a rotating electrical machine including a semiconductor element solder-bonded to a substrate;
Temperature detecting means for detecting the temperature of the semiconductor element;
A rotating electrical machine control unit that controls the rotating electrical machine drive device, and a control method of the rotating electrical machine drive control device,
A time integrated value calculating step of calculating a time integrated value of a torque command value of a rotating electrical machine input from a torque command calculating unit or a time integrated value of a current command value based on the torque command value;
A temperature rise degree calculating step for calculating a temperature rise degree, which is a ratio between a detected value of the rise temperature of the semiconductor element with respect to the reference temperature and a rise in the time integrated value of the torque command value or the time integrated value of the current command value;
When it is determined that the calculated temperature rise degree is larger than the allowable temperature rise degree obtained by multiplying the initial temperature rise degree by a predetermined value set in advance, abnormal deterioration of the solder joint portion of the semiconductor element may occur. A control method for a rotating electrical machine drive control device, comprising: a determination step of determining that the error has occurred and outputting an abnormal signal.

Images