JP2010129702A - Inductor component array, and method of manufacturing thin-film common mode filter array capable of reducing crosstalk between components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce crosstalk between components in an inductor component array. <P>SOLUTION: The common mode filter array 10 includes common mode filters F1 and F2 which are arranged in parallel, and a magnetic body base 12 coupling one-end portions of the common mode filters F1 and F2, and the magnetic body base 12 has a loop coil R formed at a part positioned between the common mode filters F1 and F2. Consequently, leakage magnetic flux passing through the magnetic body base is cut off by the loop coil R, so the crosstalk between the components is reducible. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an inductor component array and a method of manufacturing a thin film common mode filter array that can reduce crosstalk between components.

  An inductor component array in which inductor components such as a common mode filter are arrayed is known. However, in such an inductor component array, crosstalk between components becomes a cause of characteristic deterioration.

  A thin film common mode filter array will be described as an example. FIG. 14 is a cross-sectional view of the thin film common mode filter array 1 according to the background art. As shown in the figure, the thin film common mode filter array 1 has a shape in which two thin film common mode filters 2 and 3 each having two planar spiral conductors are sandwiched between common magnetic substrates 4 and 5. is doing. For example, when a current flows through the planar spiral conductor of the thin film common mode filter 2, a magnetic flux is generated by electromagnetic induction. A part of the magnetic flux leaks to the thin film common mode filter 3 side through the magnetic bases 4 and 5 (magnetic flux along the arrow A in FIG. 14), and an induced current is generated in the planar spiral conductor of the thin film common mode filter 3. This is crosstalk.

Patent Documents 1 and 2 disclose techniques for preventing such characteristic deterioration due to crosstalk. In the technique disclosed in Patent Document 1, the number of turns of each planar spiral conductor is set so that the number of turns on the adjacent side is less than the number of turns on the non-adjacent side, and each planar spiral conductor on the same plane is used. The crosstalk is reduced by reversing the winding directions of each other. In the technique disclosed in Patent Document 2, the distance between the terminal electrode of one thin film common mode filter (the terminal electrode formed on the side surface of the thin film common mode filter array) and the terminal electrode of the other thin film common mode filter is set as follows. By increasing the size, crosstalk is reduced.
JP 2003-217932 A JP 2006-286886 A

  Accordingly, one of the objects of the present invention is to provide an inductor component array capable of reducing crosstalk between components and a method of manufacturing a thin film common mode filter array capable of reducing crosstalk between components.

  In order to achieve the above object, an inductor component array according to the present invention comprises first and second inductor components arranged in parallel, and a magnetic substrate connecting one end portions of the first and second inductor components. The magnetic substrate is characterized in that a loop coil is substantially formed in a portion located between the first and second inductor components.

  According to the present invention, since the leakage magnetic flux passing through the magnetic base is blocked by the loop coil, it is possible to reduce crosstalk between components.

  In the inductor component array, the loop coil may be constituted by a conductor formed over the entire circumference of a portion of the magnetic substrate located between the first and second inductor components. . According to this, since a complete loop coil is used, crosstalk can be reduced regardless of the signal frequency band.

  In the inductor component array, the magnetic substrate includes a first surface in contact with the first and second inductor components, a second surface located on the opposite side of the first surface, and the first surface. And third and fourth side surfaces parallel to the arrangement direction of the first and second inductor components, and the loop coil includes the third and fourth side surfaces, and the first and second surface sides. It is good also as being comprised by the conductor formed in any one side. Even if the loop coil is formed by a conductor that is not connected, if the signal is relatively high frequency, the disconnected portion is capacitively coupled. Therefore, a loop coil is substantially formed, and crosstalk between components can be reduced.

  In each of the inductor component arrays, both the first and second inductor components may be common mode filters. According to this, it becomes possible to reduce crosstalk between the common mode filters constituting the common mode filter array.

  In the inductor component array, the inductor component array includes an element body having a multilayer structure, and first and second planar spiral conductors are formed on a first layer of the element body, and Third and fourth planar spiral conductors are formed in the second layer, the first inductor component is constituted by the first and third planar spiral conductors, and the second inductor component is the second inductor component. It is good also as being comprised by the 2nd and 4th plane spiral conductor, and the said magnetic body base | substrate being adhere | attached on the surface perpendicular | vertical to the lamination direction of the said element | base_body. According to this, it becomes possible to reduce the crosstalk between the thin film common mode filters constituting the thin film common mode filter array.

  In the inductor component array, the loop coil may include a conductor pattern formed in the element body. According to this, it is possible to form a part of the loop coil in the same manner as the formation of the planar spiral conductor or the like.

  In the inductor component array, each of the first and second inductor components has a drum core having a core portion around which a coil is wound and two flange portions formed at both ends of the core portion. The magnetic base is bonded to the flange of the first inductor component and the flange of the second inductor component, and the loop coil is one of the first and second inductor components. It is good also as forming in the part located between parts. According to this, it becomes possible to reduce crosstalk between inductor components using a drum core.

  The method of manufacturing a thin film common mode filter array according to the present invention includes a multilayer structure element, and a thin film common in which a first common mode filter conductor and a second common mode filter conductor are formed in the element body. A method for manufacturing a mode filter array, comprising: forming a conductor pattern between the first common mode filter conductor and the second common mode filter conductor; and magnetizing a surface perpendicular to the stacking direction of the element bodies. Bonding a body substrate, and forming a conductor pattern electrically connected to the conductor pattern on a side surface of the magnetic substrate parallel to the arrangement direction of the first and second common mode filter conductors. It is characterized by including.

  As described above, according to the present invention, the leakage magnetic flux passing through the magnetic base is blocked by the loop coil, so that crosstalk between components can be reduced.

  Hereinafter, preferred first and second embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIGS. 1A and 1B are perspective views of a common mode filter array 10 according to a first preferred embodiment of the present invention. 1A is a perspective view seen from the front, and FIG. 1B is a perspective view seen from the back. As shown in FIGS. 1A and 1B, a common mode filter array 10 includes a rectangular parallelepiped laminated body 14 in which a layer structure (element body) 13 is sandwiched between two magnetic base bodies 11 and 12, and a laminated structure. The external electrodes P1 to P8 formed on the surface of the body 14 and the conductor patterns R1 to R3 formed on the surface of the magnetic substrate 12 are configured.

  The magnetic substrates 11 and 12 physically protect the layer structure 13 and serve as a magnetic path for the common mode choke coil. As a material for the magnetic bases 11 and 12, it is preferable to use sintered ferrite or composite ferrite (resin containing powdered ferrite). In particular, it is preferable to use a material having a relatively high magnetic permeability such as Ni—Cu—Zn ferrite and Mn—Zn ferrite. This is because by using a magnetic material having a high magnetic permeability, magnetic characteristics originally required for a common mode filter can be enhanced.

  The external electrodes P1 to P8 are provided from the upper surface to the lower surface on the side surfaces 14a and 14b (side surfaces parallel to the arrangement direction of thin film common mode filters F1 and F2 to be described later, that is, long side surfaces). It is a linear conductor pattern with a predetermined width. The external electrodes P1 to P4 are arranged on the side surface 14a, and the external electrodes P5 to P8 are arranged on the side surface 14b in this order from one end side in the long side direction of the stacked body 14, respectively.

  The conductor pattern R1 is a linear conductor pattern having a predetermined width provided on the side surface 14a side of the magnetic substrate 12, more specifically, a portion of the surface of the side surface 14a located between the external electrodes P2 and P3. The conductor pattern R3 is a linear conductor pattern having a predetermined width provided on the side surface 14b side of the magnetic substrate 12, more specifically, on a portion of the surface of the side surface 14b located between the external electrodes P6 and P7. . The conductor patterns R1 and R3 are mainly provided on the side surface of the magnetic substrate 12, but are formed so as to protrude slightly from the side surface of the layer structure 13. This is for connection with a conductor pattern R4 (described later) provided in the layer structure 13. The conductor pattern R2 is provided on the upper surface (the surface opposite to the surface in contact with the layer structure 13) side of the magnetic substrate 12, more specifically, on the portion of the upper surface located between the external electrodes P6 and P7. A linear conductor pattern having a predetermined width is connected to the conductor patterns R1 and R3 at both ends.

  For forming the external electrodes P1 to P8 and the conductor patterns R1 to R3, it is preferable to use a mask sputtering method and electroplating. That is, first, a Cr / Cu film or a Ti / Cu film is formed on the side surfaces 14a and 14b of the laminated body 14 by mask sputtering, and then electroplating is performed using Ni / Sn. P8 and conductor patterns R1 to R3 are formed.

  Next, FIG. 2 is a schematic exploded perspective view of the common mode filter array 10. As shown in FIG. 2, the layer structure 13 of the common mode filter array 10 is formed by laminating resin layers S1 to S5 and magnetic layers S6a to S6d and S7 in this order. In FIG. 2, the external electrodes P1 to P8 are omitted.

  Four through holes Ha to Hd are formed in the resin layers S2 to S5. Further, planar spiral conductors C1 and C3 are formed on the surface of the resin layer S2, and planar spiral conductors C2 and C4 are formed on the surface of the resin layer S3. Of these, the planar spiral conductors C1 and C2 are magnetically coupled to form a thin film common mode filter F1. The planar spiral conductors C3 and C4 are magnetically coupled to form a thin film common mode filter F2. Since the layer structure 13 has such a configuration, the magnetic bases 11 and 12 are magnetic bases that connect one ends of the thin film common mode filters F1 and F2, respectively.

  Conductive patterns for electrically connecting the respective planar spiral conductors to the external electrodes P1 to P8 are formed on the surfaces of the resin layers S1 to S4. The resin layer S5 is provided to separate the conductor pattern and the magnetic layer S7, and no conductor pattern is formed on the surface thereof.

  In each of the resin layers S <b> 1 to S <b> 4, lead electrodes E <b> 1 to E <b> 8 are formed at positions corresponding to the external electrodes P <b> 1 to P <b> 8, and the corresponding electrodes are electrically connected to each other on the side surface of the layer structure 13. .

  The outer end of the planar spiral conductor C1 is connected to the extraction electrode E5 on the resin layer S2 via the extraction electrode D1 formed on the resin layer S2. The inner end of the planar spiral conductor C1 is connected to the extraction electrode D2 formed on the resin layer S1 through the through-hole conductor T1. The extraction electrode D2 is connected to the extraction electrode E1 of the resin layer S1.

  The outer end of the planar spiral conductor C2 is connected to the extraction electrode E6 on the resin layer S3 via the extraction electrode D3 formed on the resin layer S3. The inner end of the planar spiral conductor C2 is connected to the extraction electrode D4 formed on the resin layer S4 through the through-hole conductor T2. The extraction electrode D4 is connected to the extraction electrode E2 of the resin layer S4.

  The outer end of the planar spiral conductor C3 is connected to the extraction electrode E8 on the resin layer S2 via the extraction electrode D5 formed on the resin layer S2. The inner end of the planar spiral conductor C3 is connected to the extraction electrode D6 formed on the resin layer S1 through the through-hole conductor T3. The extraction electrode D6 is connected to the extraction electrode E4 of the resin layer S1.

  The outer end of the planar spiral conductor C4 is connected to the extraction electrode E7 on the resin layer S3 via the extraction electrode D7 formed on the resin layer S3. The inner end of the planar spiral conductor C4 is connected to the extraction electrode D8 formed on the resin layer S4 through the through-hole conductor T4. The extraction electrode D8 is connected to the extraction electrode E3 of the resin layer S4.

  Each of the resin layers S1 to S5 is formed by spin-coating an insulating nonmagnetic resin (for example, photosensitive polyimide resin) having photosensitivity, and exposing, developing, and thermosetting it. A dip method or a spray method may be used. The through holes Ha to Hd of the resin layers S2 to S5 are formed by etching. The through-hole conductors T1 to T4 are formed by first forming through holes in each resin layer by etching and filling a conductive material therein. Each conductor pattern is formed by forming a base conductive layer on a resin layer by vapor deposition or sputtering, and performing plating using this as a power feeding body.

  The magnetic layers S6a to S6d are layers that serve as the magnetic path of the common mode choke coil, and are embedded in the through holes Ha to Hd, respectively. The magnetic layers S6a to S6d are formed by flowing a magnetic material mixed with resin and having fluidity on the resin layer S5. The magnetic layer S7 is a layer formed when a magnetic material is flowed on the resin layer S5.

  Here, the operation of the thin film common mode filter F1 will be described. The same applies to the thin film common mode filter F2.

  FIG. 3 is a circuit diagram of a general differential transmission circuit.

  The differential transmission circuit shown in FIG. 3 includes a pair of signal lines 51 and 52, an output buffer 53 that supplies a differential signal to the signal lines 51 and 52, and an input buffer that receives the differential signal from the signal lines 51 and 52. 54. With this configuration, the input signal IN given to the output buffer 53 is transmitted to the input buffer 54 via the pair of signal lines 51 and 52 and reproduced as the output signal OUT. Such a differential transmission circuit has a feature that the radiated electromagnetic field generated from the signal lines 51 and 52 is small, but when common noise (common mode noise) is superimposed on the signal lines 51 and 52, Generates a relatively large radiated electromagnetic field. In order to reduce the radiated electromagnetic field generated by the common mode noise, it is effective to insert a thin film common mode filter F1 into the signal lines 51 and 52 as shown in FIG.

  In the thin film common mode filter F1, the planar spiral conductors C1 and C2 wound in the same direction are magnetically coupled. Therefore, the impedance (characteristic impedance) for the differential component (signal) transmitted through the signal lines 51 and 52 is low, and the impedance for the in-phase component (common mode noise) is high. Therefore, the thin film common mode filter F1 cuts off the common mode noise transmitted through the signal lines 51 and 52 without substantially attenuating the differential signal supplied to the signal lines 51 and 52.

  Now, as shown in FIG. 2, a conductor pattern R4 is formed on the surface of the resin layer S4 at a position between the thin film common mode filters F1 and F2. The conductor pattern R4 is located on the lower surface (surface in contact with the layer structure 13) side of the magnetic substrate 12. The conductor pattern R4 is connected to the conductor patterns R1 and R3 at both ends. Thereby, conductor pattern R1-R3 and conductor pattern R4 comprise the loop coil R formed over the perimeter of the part located between the thin film common mode filters F1 and F2 of the magnetic body base 12.

  FIG. 4 is a cross-sectional view of the common mode filter array 10 shown in FIG. As already described with reference to FIG. 14, for example, when a current flows through the thin film common mode filter F2, a magnetic flux leaks to the thin film common mode filter F1 via the magnetic bases 11 and 12 (arrows in FIG. 4). Magnetic flux along M). As described above, this is crosstalk between the common mode filters, but in the common mode filter array 10, the leakage magnetic flux is blocked by the loop coil R.

  That is, when a leakage magnetic flux is generated, a current flows through the loop coil R due to the electromagnetic induction, and a magnetic flux in a direction that cancels the leakage magnetic flux is generated. Therefore, the leakage magnetic flux is interrupted. Thereby, in the common mode filter array 10, it is possible to reduce crosstalk between the common mode filters. Further, crosstalk can be reduced regardless of the frequency of the signal flowing through the common mode filter.

  Next, a method for manufacturing the common mode filter array 10 will be described.

  FIG. 5 is a diagram showing a manufacturing flow of the common mode filter array 10. As shown in the figure, first, a magnetic substrate 11 is prepared, and a resin layer S1 is formed thereon by a method such as spin coating (Step 1). Subsequently, the formation of the conductor pattern including the conductor pattern R4 and the lamination of the resin layers S2 to S5 are repeatedly performed (Step 2).

  Next, through holes Ha to Hd of the resin layers S2 to S5 are formed by etching (Step 3), and a magnetic material is poured onto the resin layer S5 to form the magnetic layers S6a to S6d and S7 (Step 4). ).

  Next, the magnetic substrate 12 is bonded onto the magnetic layer S7 (Step 5), and the external electrodes P1 to P8 and the conductor patterns R1 to R3 are applied to the side surface and the upper surface of the laminate 14 by mask sputtering and electroplating. Are formed (Step 6).

  As described above, in the common mode filter array 10, the portion of the loop coil R located on the lower surface of the magnetic substrate 12 is configured by the conductor pattern R4 formed on the surface of the resin layer S4. It is possible to form a part of the loop coil in the same way as forming.

  Hereinafter, variations of the loop coil will be described.

  First, FIG. 6A is a cross-sectional view of the common mode filter array 10 shown in FIG. The loop coil in FIG. 6A is the loop coil R described above, which is a complete loop coil formed over the entire circumference of the magnetic substrate 12. In the above embodiment, the conductor pattern R4 formed on the surface of the resin layer S4 is used as a part of the loop coil R. However, it may be formed directly on the lower surface of the magnetic substrate 12, for example. Moreover, although the example which uses a mask sputtering method and electroplating was demonstrated about the manufacturing method of conductor pattern R1-R3 in the said embodiment, for example, it manufactures by fitting metal fittings, such as metal rings, in the magnetic body base | substrate 12. It is also possible.

  Next, FIG. 6B is a cross-sectional view of the common mode filter array 10 having the loop coil Rx manufactured without using the conductor pattern R4. The loop coil Rx is not a complete loop coil like the loop coil R, but is substantially a loop coil provided between the thin film common mode filters F1 and F2. That is, when the signal input to the common mode filter is a high-frequency signal, the portion where the loop coil Rx is not connected is coupled by capacitive coupling as shown in FIG. Therefore, the loop coil Rx acts in the same manner as the loop coil R and has an effect of blocking leakage magnetic flux.

  Next, FIG.6 (c) is sectional drawing of the common mode filter array 10 which has the loop coil Ry produced without using the conductor pattern R2. The loop coil Ry is not a perfect loop coil like the loop coil R, but is substantially a loop coil provided between the thin film common mode filters F1 and F2. That is, when the signal input to the common mode filter is a high-frequency signal, the portion where the loop coil Ry is not connected is coupled by capacitive coupling as shown in FIG. Therefore, the loop coil Ry also acts in the same manner as the loop coil R and has a leakage magnetic flux blocking effect.

  Further, when the loop coil Ry is used, it is not necessary to form a conductor pattern on the upper surface of the multilayer body 14. Therefore, the man-hour at the time of forming a conductor pattern in the side surface and upper surface of the laminated body 14 by a mask sputtering method and electroplating can be reduced.

  Next, FIG. 6D is a cross-sectional view showing an example in which a loop coil R is also provided on the magnetic substrate 11. Thus, the loop base R may be provided on each of the magnetic bases 11 and 12.

  FIG. 7 is a perspective view of a common mode filter array 20 according to a second preferred embodiment of the present invention. FIG. 8 is a plan view of the common mode filter array 20 viewed from the back side. FIG. 9 is a cross-sectional view taken along the line CC ′ of the common mode filter array 20 shown in FIG.

  As shown in FIGS. 7 and 8, the common mode filter array 20 includes drum core type common mode filters F3 and F4. The common mode filter F3 includes a drum core DR1 including a core portion O1 provided with flanges FR1 and FR2 at both ends, and wires L1 and L2 wound around the core portion O1. The common mode filter F4 includes a drum core DR2 composed of a winding core portion O2 provided with flanges FR3 and FR4 at both ends, and wires L3 and L4 wound around the winding core portion O2.

  Terminal electrodes G1 and G2 are formed on the lower surface of the flange FR1. Similarly, terminal electrodes G3 and G4 are formed on the lower surface of the flange FR2, terminal electrodes G5 and G6 are formed on the lower surface of the flange FR3, and terminal electrodes G7 and G8 are formed on the lower surface of the flange FR4, respectively. The wire L1 is connected to the terminal electrode G1 and the terminal electrode G3. Similarly, the wire L2 is connected to the terminal electrode G2 and the terminal electrode G4, the wire L3 is connected to the terminal electrode G5 and the terminal electrode G7, and the wire L4 is connected to the terminal electrode G6 and the terminal electrode G8. The wires L1 to L4 are wound in the same direction with the same number of turns, and each constitutes a common mode filter coil.

  The common mode filter array 20 also includes a plate-like core B bonded to each upper surface of the flange portions FR1 to FR4.

  The drum cores DR1 and DR2 and the plate-like core B are made of a magnetic material having a relatively high magnetic permeability, for example, a sintered body of Ni—Zn ferrite or Mn—Zn ferrite.

  Now, the plate-like core B has conductor patterns Q1 to Q3 on the upper surface, the side surface, and the lower surface of the portion located between the flange portions FR1 and FR3, respectively, and one end of the conductor pattern Q1 and the upper end of the conductor pattern Q2, The lower end of the conductor pattern Q2 and one end of the conductor pattern Q3 are electrically connected to each other. As shown in FIG. 9, the plate-like core B also has a through-hole conductor Q4 that connects the other end of the conductor pattern Q1 and the other end of the conductor pattern Q3.

  Conductor patterns Q1-Q3 and through-hole conductor Q4 constitute loop coil Q formed over the entire circumference of the portion located between common mode filters F3 and F4. When a magnetic flux (leakage magnetic flux) is generated between the flange portion FR1 and the flange portion FR3, a current flows in the loop coil Q due to the electromagnetic induction, and a magnetic flux in a direction to cancel the leakage magnetic flux is generated. Accordingly, since the leakage magnetic flux is cut off, the crosstalk between the common mode filters can be reduced even in the common mode filter array 20.

  Hereinafter, variations of the loop coil will be described.

  First, FIG. 10A is a cross-sectional view of a loop coil Qx produced without using the through-hole conductor Q4, and corresponds to FIG. The loop coil Qx is not a complete loop coil like the loop coil Q, but is substantially a loop coil provided between the common mode filters F3 and F4. That is, when the signal input to the common mode filter is a high-frequency signal, the portion where the loop coil Qx is not connected is coupled by capacitive coupling as shown in FIG. Therefore, the loop coil Qx acts in the same manner as the loop coil Q and has an effect of blocking leakage magnetic flux.

  Next, FIG. 10B is a cross-sectional view of the loop coil Qy produced without using the conductor pattern Q2, and corresponds to FIG. The loop coil Qy is not a complete loop coil like the loop coil Q, but is substantially a loop coil provided between the common mode filters F3 and F4. That is, when the signal input to the common mode filter is a high-frequency signal, the portion where the loop coil Qy is not connected is coupled by capacitive coupling as shown in FIG. Therefore, the loop coil Qy also acts in the same manner as the loop coil Q, and has a leakage magnetic flux blocking effect.

  Next, FIG. 11 is a cross-sectional view showing an example in which the loop coil Q is also provided in a portion located between the flange portions FR2 and R4. As described above, the loop coils Q may be provided on the flange portions FR1, FR3 side and the flange portions FR2, FR4 side, respectively.

  Next, FIG. 12 is a perspective view of the common mode filter array 20 according to an example in which a plate-like core Bx having a through hole H having substantially the same length as the cores O1 and O2 is used at the center. FIG. 13 is a cross-sectional view taken along the line DD ′ of the common mode filter array 20 shown in FIG.

  In the example shown in FIGS. 12 and 13, the conductor pattern Q5 that connects the other end of the conductor pattern Q1 and the other end of the conductor pattern Q3 is formed on the inner surface of the through hole H on the flanges FR1 and R3 side, Conductor patterns Q1-Q3 and conductor pattern Q5 constitute loop coil Qz. By doing in this way, it becomes possible to form the conductor patterns Q1-Q3, Q5 by the same method using the method using a mask sputtering method and electroplating.

  The preferred embodiments of the present invention have been described with reference to two examples. However, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the present invention. Of course, it can be implemented in an embodiment.

  For example, in each of the above embodiments, the case where the present invention is applied to the common mode filter array has been described. Even if the inductor component is other than the common mode filter, crosstalk between components becomes a problem when the array is formed. It is possible. In such a case, if the present invention is applied to the inductor component array and a loop coil is formed substantially in a portion located between the inductor components, crosstalk between the components can be reduced.

1 is a perspective view of a common mode filter array according to a first preferred embodiment of the present invention. (A) is the perspective view seen from the front, (b) has shown the perspective view seen from the back, respectively. 1 is a schematic exploded perspective view of a common mode filter array according to a first preferred embodiment of the present invention. It is a circuit diagram of a general differential transmission circuit. It is the sectional view on the AA 'line of the common mode filter array shown to Fig.1 (a). It is a figure which shows the manufacture flow of the common mode filter array by preferable 1st Embodiment of this invention. (A) is BB 'sectional view taken on the line of the common mode filter array shown to Fig.1 (a). (B) is sectional drawing of the common mode filter array by the modification of preferable 1st Embodiment of this invention. (C) is a cross-sectional view of a common mode filter array according to another modification of the first preferred embodiment of the present invention. (D) is sectional drawing of the common mode filter array by the further another modification of 1st Embodiment with preferable this invention. FIG. 6 is a perspective view of a common mode filter array according to a second preferred embodiment of the present invention. It is the top view which looked at the common mode filter array by preferable 2nd Embodiment of this invention from the back surface. It is CC 'sectional view taken on the line of the common mode filter array shown in FIG. (A) is sectional drawing of the common mode filter array by the modification of preferable 2nd Embodiment of this invention. (B) is a cross-sectional view of a common mode filter array according to another modification of the preferred second embodiment of the present invention. It is sectional drawing of the common mode filter array by the further another modification of preferable 2nd Embodiment of this invention. It is a perspective view of the common mode filter array by the further another modification of preferable 2nd Embodiment of this invention. FIG. 13 is a cross-sectional view taken along line DD ′ of the common mode filter array illustrated in FIG. 12. It is sectional drawing of the thin film common mode filter array by the background art of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Common mode filter array 11, 12 Magnetic body base | substrate 13 Layer structure 14 Laminate C1-C4 Planar spiral conductor D1-D8, E1-E8 Lead electrode F1, F2 Thin film common mode filter Ha-Hd Through-hole P1-P8 External electrode R, Rx, Ry Loop coil R1-R4 Conductor pattern S1-S5 Resin layer S6a-S6d, S7 Magnetic body layer T1-T4 Through-hole conductor 20 Common mode filter array B, Bx Plate core DR1, DR2 Drum core F3, F4 Drum core Type common mode filter FR1 to FR4 flange part G1 to G8 terminal electrode H through hole L1 to L4 wire O1, O2 core part Q, Qx, Qy, Qz loop coil Q1 to Q3, Q5 conductor pattern Q4 through-hole conductor

Claims (8)

First and second inductor components arranged in parallel;
A magnetic base that connects one end of the first and second inductor components;
An inductor component array, wherein a loop coil is substantially formed on a portion of the magnetic substrate located between the first and second inductor components.   2. The inductor according to claim 1, wherein the loop coil is configured by a conductor formed over an entire circumference of a portion of the magnetic base body located between the first and second inductor components. Parts array. The magnetic substrate includes a first surface in contact with the first and second inductor components, a second surface located on the opposite side of the first surface, and the first and second inductor components. And third and fourth side surfaces parallel to the arrangement direction,
The said loop coil is comprised by the conductor formed in the said 3rd and 4th side surface side and either at least one side of the said 1st and 2nd surface. Inductor component array.   The inductor component array according to any one of claims 1 to 3, wherein the first and second inductor components are both common mode filters. The inductor component array includes a multilayer structure element,
First and second planar spiral conductors are formed on the first layer of the element body,
Third and fourth planar spiral conductors are formed on the second layer of the element body,
The first inductor component is constituted by the first and third planar spiral conductors,
The second inductor component is constituted by the second and fourth planar spiral conductors,
5. The inductor component array according to claim 4, wherein the magnetic substrate is bonded to a surface perpendicular to the stacking direction of the element bodies.   6. The inductor component array according to claim 5, wherein the loop coil includes a conductor pattern formed in the element body. Each of the first and second inductor components has a drum core having a core portion around which a coil is wound and two flange portions formed at both ends of the core portion,
The magnetic base is bonded to a flange of the first inductor component and a flange of the second inductor component;
3. The inductor component array according to claim 1, wherein the loop coil is formed in a portion located between one flange portion of the first and second inductor components. 4. It has a laminated structure element,
A method of manufacturing a thin film common mode filter array in which a first common mode filter conductor and a second common mode filter conductor are formed in the element body,
Forming a conductor pattern between the first common mode filter conductor and the second common mode filter conductor;
A conductor pattern electrically connected to the conductor pattern is provided on a side surface parallel to the arrangement direction of the first and second common mode filter conductors of the magnetic substrate disposed on a plane perpendicular to the stacking direction of the element bodies. Forming the thin film common mode filter array.

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