JP2010129281A - Method for producing illumination device and lighting system produced by using the same - Google Patents
Method for producing illumination device and lighting system produced by using the same Download PDFInfo
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- JP2010129281A JP2010129281A JP2008300964A JP2008300964A JP2010129281A JP 2010129281 A JP2010129281 A JP 2010129281A JP 2008300964 A JP2008300964 A JP 2008300964A JP 2008300964 A JP2008300964 A JP 2008300964A JP 2010129281 A JP2010129281 A JP 2010129281A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
Description
本発明は、リング状の照明装置の製造方法であって、組み立てが効率的に行え、かつ、ＬＥＤを半田付けした箇所に歪みが生じにくい製造方法に関する。 The present invention relates to a manufacturing method of a ring-shaped lighting device, and relates to a manufacturing method in which assembling can be efficiently performed and distortion is hardly generated at a location where an LED is soldered.
従来、製品等のワークの表面検査等を行う方法として、底面より発光する照明装置を用いてワークに照光し、目視又は撮影等を行って検査する方法が一般的に行われている。 Conventionally, as a method for inspecting the surface of a workpiece such as a product, a method of inspecting the workpiece by illuminating the workpiece using a lighting device that emits light from the bottom and performing visual inspection or photographing is generally performed.
近時、このような表面検査を行なう照明装置として、特許文献１に示すような、切頭円錐形状に湾曲されたフレキシブル配線基板の内側凹面に複数のＬＥＤが実装されているリング状照明装置が多用されている。 Recently, as an illuminating device that performs such surface inspection, a ring-shaped illuminating device in which a plurality of LEDs are mounted on the inner concave surface of a flexible wiring board that is curved in a truncated conical shape as shown in Patent Document 1. It is used a lot.
このようなリング状照明装置は、所定幅を有した部分円環状をなすフレキシブル配線基板に、複数のＬＥＤを半田付けにより固定した後、そのフレキシブル配線基板を端辺同士が付き合うように湾曲させることにより組み立てられている。
しかし、フレキシブル配線基板にＬＥＤを半田付けして固定した後で、当該基板を切頭円錐形状に湾曲させると、ＬＥＤを半田付けした箇所に歪みが生じ、電気的接続が絶たれる等の不具合が起こりやすく、歩留まり低下の原因となっている。 However, after soldering and fixing the LED to the flexible wiring board, if the board is bent into a truncated conical shape, the location where the LED is soldered may be distorted and the electrical connection may be broken. It is likely to occur and causes a decrease in yield.
更に、近時では砲弾型ＬＥＤに代わって、表面実装型ＬＥＤが主流になりつつあり、そのような表面実装型ＬＥＤを、従来どおりフレキシブル配線基板に半田付けすると、半田の固定力でフレキシブル配線基板が曲げられなくなり、切頭円錐形状に湾曲できないという不具合が生じる。 Further, in recent years, surface-mounted LEDs are becoming the mainstream instead of bullet-type LEDs, and when such surface-mounted LEDs are soldered to a flexible wiring board as in the past, the flexible wiring board can be fixed with the solder. Cannot be bent and cannot be bent into a truncated cone shape.
本発明はかかる問題点に鑑みなされたものであって、リング状照明装置を高い歩留まりで効率的に製造することができる照明装置の製造方法を提供することをその主たる所期課題としたものである。 The present invention has been made in view of such problems, and it is a main aim of the present invention to provide a method for manufacturing a lighting device that can efficiently manufacture a ring-shaped lighting device with a high yield. is there.
すなわち本発明に係る照明装置の製造方法は、平面状態において所定幅を有する部分円環状のフレキシブル配線基板を、その端辺同士を近接又は接触させて切頭円錐形状にする工程と、切頭円錐形状に湾曲された前記フレキシブル配線基板の内側凹面の１部であって、平面状態において概略部分円環状をなす所定領域に、複数のＬＥＤを同心円状に配設する工程と、を備えていることを特徴とする。 That is, the manufacturing method of the lighting device according to the present invention includes a step of forming a partial annular flexible wiring board having a predetermined width in a planar state into a truncated conical shape by bringing its ends close to or in contact with each other, and a truncated cone And a step of arranging a plurality of LEDs concentrically in a predetermined region which is a part of the inner concave surface of the flexible wiring board curved into a shape and has a substantially partial annular shape in a planar state. It is characterized by.
このようなものであれば、まず、前記フレキシブル配線基板を切頭円錐形状に湾曲させて、その後で、前記フレキシブル配線基板の内側凹面にＬＥＤを配設することによって、半田の固定力によってフレキシブル配線基板の湾曲が妨げられることがないので、照明装置の組み立てが効率的に行なえ、また、ＬＥＤを半田付けした箇所に歪みが生じることがないので、電気的接続を確保することができ、歩留まりを向上することができる。 If this is the case, first, the flexible wiring board is bent into a truncated cone shape, and then an LED is disposed on the inner concave surface of the flexible wiring board, so that the flexible wiring is made by the fixing force of the solder. Since the bending of the substrate is not hindered, the assembly of the lighting device can be performed efficiently, and since there is no distortion at the location where the LED is soldered, the electrical connection can be ensured and the yield can be increased. Can be improved.
本発明に係る製造方法においては、更に、前記切頭円錐形状の回転軸を中心にして、前記所定領域にＬＥＤが配設されたフレキシブル配線基板を回転する工程を備えていることが好ましい。前記フレキシブル配線基板を回転させながらその内側凹面にＬＥＤを配設することによって、例えば、大きさが異なるフレキシブル配線基板を用いて、直径が異なるリング状照明装置を量産する場合においても、回転軸の高さや角度を調節さえすれば同一のＬＥＤ配設装置を用いて同様にＬＥＤを配設することが可能となり、同一の生産ラインで多様な大きさのリング状照明装置を生産することができる。 The manufacturing method according to the present invention preferably further includes a step of rotating a flexible wiring board in which the LEDs are arranged in the predetermined region around the truncated cone-shaped rotation axis. By arranging the LEDs on the inner concave surface while rotating the flexible wiring board, for example, in the case of mass production of ring-shaped lighting devices having different diameters using flexible wiring boards having different sizes, As long as the height and angle are adjusted, it is possible to arrange LEDs in the same manner using the same LED arrangement device, and it is possible to produce ring illumination devices of various sizes on the same production line.
前記ＬＥＤが表面実装型のものである場合、前記フレキシブル配線基板上のＬＥＤ配設予定箇所に半田ペーストを塗布する工程と、前記ＬＥＤを前記フレキシブル配線基板に配設した後、前記ＬＥＤを前記フレキシブル配線基板に堅固に固定するために、前記半田ペーストを溶融する工程を備えていることが好ましい。 When the LED is of a surface-mount type, a step of applying a solder paste to a place where the LED is to be arranged on the flexible wiring board, and after the LED is arranged on the flexible wiring board, the LED is flexible In order to firmly fix the wiring board to the wiring board, it is preferable to include a step of melting the solder paste.
このようなものであれば、前記切頭円錐形状に湾曲したフレキシブル配線基板の内側凹面に、半田ペーストの粘性を利用して表面実装型ＬＥＤを一旦仮止めし、その後、当該ＬＥＤを半田付けによって堅固に固定することができるので、多数のＬＥＤの半田付けを効率的に行うことができる。 If this is the case, the surface-mounted LED is temporarily fixed to the inner concave surface of the flexible wiring board curved into the truncated cone shape by using the viscosity of the solder paste, and then the LED is soldered. Since it can fix firmly, soldering of many LED can be performed efficiently.
前記ＬＥＤが砲弾型のものである場合、例えば、前記フレキシブル配線基板のスルーホールに当該ＬＥＤのリードを差し込むことによって、前記ＬＥＤを前記フレキシブル配線基板に配設した後、前記ＬＥＤを前記フレキシブル配線基板に堅固に固定するために、例えば、前記スルーホールと前記リードとの間隙に溶融した半田を充填し、冷却して、前記ＬＥＤを当該基板に半田付けする工程を備えていることが好ましい。 When the LED is of a bullet type, for example, the LED is disposed on the flexible wiring board by inserting a lead of the LED into a through hole of the flexible wiring board, and then the LED is placed on the flexible wiring board. For example, it is preferable to include a step of filling the gap between the through hole and the lead with melted solder, cooling, and soldering the LED to the substrate.
なお、本発明に係る製造方法を用いて製造されてなる照明装置もまた、本発明の１つである。 In addition, the illuminating device manufactured using the manufacturing method which concerns on this invention is also one of this invention.
このような構成の本発明によれば、複数のＬＥＤがフレキシブル配線基板の内側凹面に設置されたリング状照明装置を、高い歩留まりで効率的に製造することができる。 According to the present invention having such a configuration, a ring-shaped illumination device in which a plurality of LEDs are installed on the inner concave surface of the flexible wiring board can be efficiently manufactured with a high yield.
以下に、本発明の一実施形態に係る照明装置の製造方法について、図面を参照して説明する。 Below, the manufacturing method of the illuminating device which concerns on one Embodiment of this invention is demonstrated with reference to drawings.
まず、本実施形態で製造される照明装置１００について説明する。照明装置1００は、製品（ワーク）の表面検査等に用いられるもので、図１及び図２に示すように、中央に観測孔１００ａを有した概略リング状をなすもので、複数のＬＥＤ１と、複数のＬＥＤ１が実装された切頭円錐形状をなすフレキシブル配線基板２と、一端が開口した概略円筒形状をなし、フレキシブル配線基板２を保持する保持枠たる照明ケース３と、を備えたものである。 First, the illuminating device 100 manufactured by this embodiment is demonstrated. The illumination device 100 is used for surface inspection of a product (work), and as shown in FIGS. 1 and 2, the illumination device 100 has a substantially ring shape having an observation hole 100 a in the center, and a plurality of LEDs 1, A flexible wiring board 2 having a truncated conical shape on which a plurality of LEDs 1 are mounted, and a lighting case 3 having a substantially cylindrical shape with one end opened and serving as a holding frame for holding the flexible wiring board 2 are provided. .
ＬＥＤ１は、表面実装型又は砲弾型のいずれであってもよく、切頭円錐形状をなすフレキシブル配線基板２の内側凹面に、同心円状に複数列、等間隔に並べて実装されている。 The LED 1 may be either a surface-mounted type or a shell type, and is mounted on the inner concave surface of the flexible wiring board 2 having a truncated cone shape in a plurality of concentric rows at equal intervals.
フレキシブル配線基板２は、予め配線がプリントされた厚み方向に湾曲可能なものであり、図３に示すように、平面状態において所定幅を有する部分円環状をなすものである。そして、ＬＥＤ１を実装する側の面が内側凹面になるように、厚み方向に湾曲され、中空の切頭円錐形状をなしている。このフレキシブル配線基板２には、その両端部に、端辺同士を突き合わせて切頭円錐形状に湾曲したときに、その形状を保持するための一対の引っ掛け部材４が設けてある。この一対の引っ掛け部材４は照明装置１００として組み立てるときに、接着剤等の他の方法で接合した後に切り落としてしまってもよく、そのままの状態で残しておいてもよい。 The flexible wiring board 2 can be bent in the thickness direction on which the wiring is printed in advance, and forms a partial annular shape having a predetermined width in a planar state as shown in FIG. And it is curved in the thickness direction so that the surface on which LED 1 is mounted becomes an inner concave surface, and has a hollow truncated cone shape. The flexible wiring board 2 is provided with a pair of hooking members 4 for holding the shape of the flexible wiring board 2 when both ends are brought into contact with each other and curved into a truncated cone shape. When assembling the lighting device 100, the pair of hook members 4 may be cut off after being joined by another method such as an adhesive, or may be left as it is.
照明ケース３は、厚肉円筒状をなすもので、その中央には貫通孔１００ａが形成してあり、図２に示すように、照明ケース３の上面をなし、中心に貫通孔１００ａが形成された蓋部材３１と、その蓋部材３１に取り付けられ、照明ケース３の側面をなし、蓋部材３１とともにフレキシブル配線基板２を保持する保持体３２と、から構成されている。 The lighting case 3 has a thick cylindrical shape, and a through hole 100a is formed at the center thereof. As shown in FIG. 2, the upper surface of the lighting case 3 is formed, and the through hole 100a is formed at the center. The lid member 31 and the holder 32 attached to the lid member 31, forming the side surface of the lighting case 3, and holding the flexible wiring board 2 together with the lid member 31.
次いで、本実施形態に係る照明装置１００の製造方法について説明するが、初めにＬＥＤ１が表面実装型のものである場合について説明し、続いてＬＥＤ１が砲弾型のものである場合について説明する。 Next, a method for manufacturing the lighting device 100 according to the present embodiment will be described. First, the case where the LED 1 is of a surface mount type will be described, and then the case of the LED 1 of a bullet type will be described.
ＬＥＤ１が表面実装型のものである場合、まず、フレキシブル配線基板２を平面状態に保持した上で、該基板２の一方の面に設定したＬＥＤ実装面２ａ上のＬＥＤ配設予定箇所に半田ペーストを印刷する。半田ペーストの印刷は、ＬＥＤ配設予定箇所に穴の開いたステンレス製の型紙を、フレキシブル配線基板２上に載置して、当該型紙上でスキージを使って半田ペーストをしごくことによって、ＬＥＤ配設予定箇所に一定の厚さで半田ペーストを塗布することによる。 When the LED 1 is of the surface mounting type, first, the flexible wiring board 2 is held in a flat state, and then solder paste is applied to the planned LED placement location on the LED mounting surface 2a set on one surface of the board 2 To print. The solder paste is printed by placing a stainless steel pattern with holes in the locations where the LEDs are planned to be placed on the flexible wiring board 2 and squeezing the solder paste on the pattern using a squeegee. By applying solder paste to the planned location at a certain thickness.
しかる後に、ＬＥＤ実装面２ａが内側凹面に位置するようにフレキシブル配線基板２の端辺同士を近接又は接触させて当該基板２を湾曲させる。これにより、フレキシブル配線基板２は切頭円錐形状となり、ＬＥＤ実装面２ａが切頭円錐の内側凹面となる。 Thereafter, the edges of the flexible wiring board 2 are brought close to or in contact with each other so that the LED mounting surface 2a is located on the inner concave surface, and the board 2 is curved. Thereby, the flexible wiring board 2 becomes a truncated cone shape, and the LED mounting surface 2a becomes an inner concave surface of the truncated cone.
次いで、図４に示すように、切頭円錐形状をなすフレキシブル配線基板２の内側凹面２ａの１部であって、平面状態において概略部分円環状をなす所定領域２ｂに、複数のＬＥＤ１を同心円状に配設する。この時点では、ＬＥＤ１は半田ペーストの粘性を利用して仮止めされた状態である。 Next, as shown in FIG. 4, a plurality of LEDs 1 are concentrically arranged in a predetermined region 2 b which is a part of the inner concave surface 2 a of the flexible wiring board 2 having a truncated conical shape and has a substantially partial annular shape in a planar state. It arranges in. At this time, the LED 1 is temporarily fixed using the viscosity of the solder paste.
この後、切頭円錐形状の回転軸Ａを中心にしてフレキシブル配線基板２を回転する。そして、引き続き平面状態において概略部分円環状をなし、所定領域２ｂに隣接する所定領域２ｂ´に、複数のＬＥＤ１を同心円状に配設し、フレキシブル配線基板２の回転とＬＥＤ１の配設を交互に繰り返す。 Thereafter, the flexible wiring board 2 is rotated about the rotation axis A having a truncated cone shape. Then, in the planar state, a substantially partial annular shape is formed, and a plurality of LEDs 1 are arranged concentrically in a predetermined area 2b ′ adjacent to the predetermined area 2b, and rotation of the flexible wiring board 2 and arrangement of the LEDs 1 are alternately performed. repeat.
なお、円錐形状の母線に従ってＬＥＤ１を配設すると、外周側ほどＬＥＤ１間に隙間があいてしまい、ＬＥＤ１を密に配設できないが、概略部分円環状をなす所定領域を区切りとしてＬＥＤ１を配設すれば、ＬＥＤ１を密に配設することが容易になる。 If the LEDs 1 are arranged according to the conical bus bar, there is a gap between the LEDs 1 toward the outer peripheral side, and the LEDs 1 cannot be densely arranged. However, the LEDs 1 are arranged with a predetermined region having a substantially partial annular shape as a partition. In this case, it becomes easy to arrange the LEDs 1 densely.
そして、切頭円錐形状をなすフレキシブル配線基板２の内側凹面２ａの全体にＬＥＤ１を配設した後で、内側凹面２ａに印刷された半田ペーストを溶融する。当該溶融工程は、予熱工程と、本加熱工程に分かれ、予熱工程においては、１５０〜１７０℃程度の比較的低温でフレキシブル配線基板２とＬＥＤ１とを予熱し、本加熱工程においては、２２０〜２６０℃程度の高温で短時間に半田ペーストを溶融する。 And after arrange | positioning LED1 to the whole inner concave surface 2a of the flexible wiring board 2 which makes a truncated cone shape, the solder paste printed on the inner concave surface 2a is melted. The melting step is divided into a preheating step and a main heating step. In the preheating step, the flexible wiring board 2 and the LED 1 are preheated at a relatively low temperature of about 150 to 170 ° C., and in the main heating step, 220 to 260. The solder paste is melted in a short time at a high temperature of about ℃.
その後、ＬＥＤ１が実装されたフレキシブル配線基板２を室温で放置して冷却すると、電気的接続が確保された状態でＬＥＤ１がフレキシブル配線基板２に堅固に固定される。そして、ＬＥＤ１が実装されたフレキシブル配線基板２を照明ケース３に保持させることによって、照明装置１が得られる。 Thereafter, when the flexible wiring board 2 on which the LED 1 is mounted is left to cool at room temperature, the LED 1 is firmly fixed to the flexible wiring board 2 in a state where electrical connection is ensured. And the illuminating device 1 is obtained by making the lighting case 3 hold | maintain the flexible wiring board 2 in which LED1 was mounted.
一方、ＬＥＤ１が砲弾型のものである場合は、半田ペーストの印刷工程は不要であり、ただちにフレキシブル配線基板２を切頭円錐形状になるように湾曲する。 On the other hand, when the LED 1 is of a bullet type, the solder paste printing process is not required, and the flexible wiring board 2 is immediately curved so as to have a truncated cone shape.
次いで、図５に示すように、切頭円錐形状をなすフレキシブル配線基板２の内側凹面２ａの１部であって、平面状態において概略部分円環状をなす所定領域２ｂに、ＬＥＤ１のリード１１がフレキシブル配線基板２のスルーホール２１に差し込まれるように、複数のＬＥＤ１を同心円状に配設する。 Next, as shown in FIG. 5, the lead 11 of the LED 1 is flexible in a predetermined region 2 b which is a part of the inner concave surface 2 a of the flexible wiring board 2 having a truncated conical shape and has a substantially partial annular shape in a planar state. A plurality of LEDs 1 are arranged concentrically so as to be inserted into the through holes 21 of the wiring board 2.
そして、フレキシブル配線基板２のスルーホール２１とＬＥＤ１のリード１１との間隙に溶融した半田５を充填し、引き続き冷却して、ＬＥＤ１をフレキシブル配線基板２に半田付けする。 Then, the melted solder 5 is filled in the gap between the through hole 21 of the flexible wiring board 2 and the lead 11 of the LED 1, followed by cooling, and the LED 1 is soldered to the flexible wiring board 2.
所定領域２ｂにおいて半田付けが終了した後、切頭円錐形状の回転軸Ａを中心にしてフレキシブル配線基板２を回転する。そして、引き続き平面状態において概略部分円環状をなし、所定領域２ｂに隣接する所定領域２ｂ´に、複数のＬＥＤ１を同心円状に配設し、配設されたＬＥＤ１をフレキシブル配線基板２に半田付けする。このように、フレキシブル配線基板２の回転、ＬＥＤ１の配設、ＬＥＤ１の半田付けを繰り返す。 After the soldering is completed in the predetermined region 2b, the flexible wiring board 2 is rotated about the frustoconical rotation axis A. Subsequently, in a planar state, the device is substantially partially annular, and a plurality of LEDs 1 are disposed concentrically in a predetermined region 2b ′ adjacent to the predetermined region 2b, and the disposed LEDs 1 are soldered to the flexible wiring board 2. . In this way, the rotation of the flexible wiring board 2, the arrangement of the LEDs 1, and the soldering of the LEDs 1 are repeated.
そして、切頭円錐形状をなすフレキシブル配線基板２の内側凹面２ａの全体にＬＥＤ１を実装した後、ＬＥＤ１が実装されたフレキシブル配線基板２を照明ケース３に保持させることによって、照明装置１が得られる。 And after mounting LED1 to the whole inner concave surface 2a of the flexible wiring board 2 which makes a truncated cone shape, the lighting apparatus 3 is obtained by making the lighting case 3 hold | maintain the flexible wiring board 2 with which LED1 was mounted. .
したがってこのようなものであれば、まず、フレキシブル配線基板２を切頭円錐形状に湾曲させて、その後で、フレキシブル配線基板２を回転させながらその内側凹面２ａにＬＥＤ１を配設することによって、半田の固定力によってフレキシブル配線基板２の湾曲が妨げられることがないので、照明装置１００の組み立てが効率的に行なえ、また、ＬＥＤ１を半田付けした箇所に歪みが生じることがないので、電気的接続を確保することができ、歩留まりを向上することができる。 Accordingly, in such a case, first, the flexible wiring board 2 is bent into a truncated cone shape, and then the LED 1 is disposed on the inner concave surface 2a while rotating the flexible wiring board 2, thereby soldering. Since the bending of the flexible wiring board 2 is not hindered by the fixing force, the assembly of the lighting device 100 can be performed efficiently, and there is no distortion at the location where the LED 1 is soldered. Can be ensured, and the yield can be improved.
また、フレキシブル配線基板２を回転させながらその内側凹面２ａにＬＥＤ１を配設することによって、例えば、大きさが異なるフレキシブル配線基板２を用いて、直径が異なるリング状照明装置１００を量産する場合においても、回転軸の高さや角度を調節さえすれば同一のＬＥＤ配設装置を用いて同様にＬＥＤ１を配設することが可能となり、同一の生産ラインで多様な大きさのリング状照明装置１００を生産することが可能となる。 In addition, when the LED 1 is disposed on the inner concave surface 2a while rotating the flexible wiring board 2, for example, when the ring-shaped lighting device 100 having different diameters is mass-produced using the flexible wiring board 2 having different sizes. However, if the height and angle of the rotating shaft are adjusted, the LED 1 can be similarly arranged using the same LED arranging device, and the ring-shaped lighting device 100 of various sizes can be formed on the same production line. It becomes possible to produce.
また、ＬＥＤ１が表面実装型のものである場合、切頭円錐形状に湾曲したフレキシブル配線基板２の内側凹面に、半田ペーストの粘性を利用してＬＥＤ１を一旦仮止めし、その後、半田ペーストを溶融・冷却することによって、ＬＥＤ１をフレキシブル配線基板２に堅固に固定することができるので、多数のＬＥＤ１の半田付けを効率的に行うことができる。 Further, when the LED 1 is of a surface mount type, the LED 1 is temporarily fixed to the inner concave surface of the flexible wiring board 2 curved in a truncated cone shape by using the viscosity of the solder paste, and then the solder paste is melted. By cooling, the LED 1 can be firmly fixed to the flexible wiring board 2, so that many LEDs 1 can be soldered efficiently.
一方、ＬＥＤ１が砲弾型のものである場合は、切頭円錐形状に湾曲したフレキシブル配線基板２のスルーホール２１にＬＥＤ１のリード１１を差し込むことによってＬＥＤ１をフレキシブル配線基板２に配設した後、スルーホール２１とリード１１との間隙に溶融した半田５を充填することによって半田付けを行うので、半田付けをした箇所に歪みを発生させずに、ＬＥＤ１をフレキシブル配線基板２に堅固に固定することができる。 On the other hand, when the LED 1 is of a bullet type, after the LED 1 is disposed on the flexible wiring board 2 by inserting the lead 11 of the LED 1 into the through hole 21 of the flexible wiring board 2 curved in a truncated cone shape, Soldering is performed by filling the melted solder 5 in the gap between the hole 21 and the lead 11, so that the LED 1 can be firmly fixed to the flexible wiring board 2 without causing distortion in the soldered portion. it can.
なお、本発明は前記実施形態に限られるものではない。 The present invention is not limited to the above embodiment.
例えば、ＬＥＤ１が砲弾型のものであっても、予めフレキシブル配線基板に半田ペーストを印刷し、半田ペーストの粘性を利用して仮止めして、フレキシブル配線基板の内側凹面全体にＬＥＤ１を配設してから、半田付けを行ってもよい。 For example, even if the LED 1 is of a bullet type, a solder paste is printed on the flexible wiring board in advance, temporarily fixed using the viscosity of the solder paste, and the LED 1 is disposed on the entire inner concave surface of the flexible wiring board. Then, soldering may be performed.
また、切頭円錐形状をなすフレキシブル配線基板２の内側凹面２ａに複数のＬＥＤ１を同心円状に配設する際に、回転軸Ａを中心にしてフレキシブル配線基板２を回転させずに、複数のＬＥＤ１を一斉に配設してもよく、又は、フレキシブル配線基板２を回転させずに、ＬＥＤ配設装置の配設部を可動にしてもよい。 Further, when the plurality of LEDs 1 are concentrically arranged on the inner concave surface 2a of the flexible wiring board 2 having a truncated cone shape, the plurality of LEDs 1 are not rotated around the rotation axis A. May be arranged all at once, or the arrangement part of the LED arrangement apparatus may be made movable without rotating the flexible wiring board 2.
その他、本発明は上記の各実施形態に限られず、本発明の趣旨を逸脱しない限り、前述した種々の構成の一部又は全部を適宜組み合わせて構成してもよい。 In addition, the present invention is not limited to the above-described embodiments, and may be configured by appropriately combining some or all of the various configurations described above without departing from the spirit of the present invention.
１００・・・照明装置
１・・・ＬＥＤ
２・・・フレキシブル配線基板
２ｂ・・・概略部分円環状をなす所定領域
３・・・照明ケース
Ａ・・・回転軸
100 ... Lighting device 1 ... LED
2 ... Flexible wiring board 2b ... Predetermined region 3 having a substantially partial annular shape ... Illuminating case A ... Rotating shaft
Claims (5)
切頭円錐形状に湾曲された前記フレキシブル配線基板の内側凹面の１部であって、平面状態において概略部分円環状をなす所定領域に、複数のＬＥＤを同心円状に配設する工程と、を備えていることを特徴とする照明装置の製造方法。 A step of forming a partially annular flexible wiring board having a predetermined width in a planar state by bringing the edges of the flexible wiring board into proximity or in contact with each other and forming a truncated cone shape;
And a step of arranging a plurality of LEDs concentrically in a predetermined region which is a part of the inner concave surface of the flexible wiring board curved in a truncated cone shape and has a substantially partial annular shape in a planar state. The manufacturing method of the illuminating device characterized by the above-mentioned.
前記ＬＥＤを前記フレキシブル配線基板に配設した後、前記半田ペーストを溶融する工程を備えている請求項１又は２記載の照明装置の製造方法。 A step of applying a solder paste to a place where LEDs are to be arranged on the flexible wiring board;
The manufacturing method of the illuminating device of Claim 1 or 2 provided with the process of fuse | melting the said solder paste, after arrange | positioning the said LED in the said flexible wiring board.
前記ＬＥＤを前記フレキシブル配線基板に配設した後、前記ＬＥＤを当該基板に半田付けする工程を備えている請求項１、２又は３記載の照明装置の製造方法。 The LED is of a bullet type,
The manufacturing method of the illuminating device of Claim 1, 2, or 3 provided with the process of soldering the said LED to the said board | substrate after arrange | positioning the said LED in the said flexible wiring board.
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