JP2010124004A - Light-emitting device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which emits uniform light with high power. <P>SOLUTION: The light-emitting device includes: a container (1) which has a concave; a light-emitting chip (2) which is arranged at the bottom of the concave of the container (1); reflecting plates which are arranged on the side surfaces of the concave of the container (1); and a fluorescent layer (3) which extends to the side surfaces of the concave of the container (1), is arranged on the top of the light-emitting chip (2) and is made of a resin including fluorescent particles. The fluorescent layer (3) has asperity reflecting the shape of the fluorescent particles and has a height of 500 μm or less at the side surfaces of the concave. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  In a conventional light emitting device, a light emitting element such as an LED chip is mounted on the bottom surface of a concave cup formed on a part of a support such as a mounting substrate, and further, a fluorescent material is applied to a translucent member filled in the cup. A wavelength conversion member is formed by containing a substance, and the wavelength conversion member is configured to cover a light emitting element. Such a wavelength conversion material, for example, contains a fluorescent substance in a material of a translucent member such as silicone resin or glass, and then drops and injects it into a concave portion in which a light emitting element is mounted by a dispenser or the like. (See, for example, Patent Document 1).

  Since the specific gravity of the phosphor is several times as large as that of the liquid resin before heat curing, most of the phosphor in the resin will aggregate and settle around the LED chip. Although the phosphor located in the vicinity of the LED chip surface efficiently absorbs light from the LED chip, many phosphors do not absorb it, but conversely block light and attenuate light energy. As a result, the light emission output of the light emitting diode is reduced. Although the use of a phosphor having a small particle size can suppress the sedimentation of the phosphor, the phosphor having a small particle size has lower light extraction efficiency and light absorption efficiency than a large particle size phosphor. Further, when the small particle size phosphor is aggregated, the light scattering mechanism is increased.

  Generally, the phosphor has a higher light conversion efficiency as the particle size is larger. However, the larger the particle size, the easier it is to settle, and it is difficult to form a phosphor layer in which the phosphor is uniformly dispersed.

  A light emitting device having a structure in which a phosphor is intentionally deposited has also been proposed. (For example, refer to Patent Document 2). Even in such a structure, there are many phosphors that do not contribute to light emission, and these phosphors block light, so that the light output decreases. Further, since the density distribution of the phosphor differs depending on the chip, cup shape, and wiring position, the problem of color unevenness arises. If the dispersibility of the phosphor cannot be controlled, variations in optical characteristics such as chromaticity and light output occur for each light emitting device, and the manufacturing yield of the light emitting device decreases.

  Furthermore, since the amount of resin used in the conventional coating structure is large, air bubbles are likely to be generated in the package cup, causing uneven color and disconnection cracks. At present, a method for applying an appropriate amount of a phosphor having a large particle diameter around the chip with a uniform density distribution has not yet been established.

JP-A-7-99345 JP 2004-186488 A

  An object of this invention is to provide the light-emitting device which emits uniform light with high output, and its manufacturing method.

  A light emitting device according to an aspect of the present invention includes a container having a recess, a light emitting chip disposed on a bottom of the recess of the container, a reflector disposed on a side surface of the recess of the container, and a side surface of the recess of the container. A light-emitting device that extends and is provided on the upper surface of the light-emitting chip and includes a phosphor layer made of a resin containing phosphor particles, the phosphor layer having irregularities reflecting the shape of the phosphor particles on the surface The height of the side surface of the recess is 500 μm or less.

  A method for manufacturing a light-emitting device according to an aspect of the present invention is the above-described method for manufacturing a light-emitting device, the step of housing a light-emitting chip in a container having a recess, and dispersing phosphor particles in a resin. A step of obtaining a phosphor layer raw material, a step of lowering the viscosity of the phosphor layer raw material and dropping the phosphor layer raw material on the light emitting chip in the container, and providing a coating layer extending on the side surface of the recess; and heating the coating layer And a step of solidifying to form a phosphor layer having a height of 500 μm or less on the side surface of the concave portion.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which emits uniform light with high output, and its manufacturing method are provided.

Sectional drawing of an example of the light-emitting device concerning one Embodiment of this invention. Sectional drawing of an example of the light-emitting device concerning other embodiment of this invention. Sectional drawing of an example of the light-emitting device concerning other embodiment of this invention. Sectional drawing of the light-emitting device produced in the Example. The expansion schematic diagram of a fluorescent substance layer.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a light emitting device according to an embodiment of the present invention.

  The illustrated light-emitting device is a light-emitting diode in which an LED chip 2 is disposed on the bottom of a package cup 1 as a container, and a translucent material in which phosphors (not shown) are dispersed on the upper surface of the LED chip 2. A phosphor layer 3 made of a member is disposed. Reference numeral 4 is a bonding wire.

  In the example shown in FIG. 1, the phosphor layer 3 has the same thickness as the LED chip 2 and is also provided on the bottom of the recess of the package cup 1, but is not limited thereto. For example, the phosphor layer 3 may be arranged so as to extend on the side surface of the recess of the package cup 1 as shown in FIG. In this case, the effect that the reflector on the side surface is effectively used is obtained, but it is desirable that the height located on the side surface of the concave portion is limited to about 500 μm. Furthermore, as shown in FIG. 3, the phosphor layer 3 can be provided only on the LED chip 2. Such a structure is advantageous in that the application shape does not depend on the package structure.

  As LED chip 2, what emits the light of the emission wavelength which can excite the fluorescent substance contained in fluorescent substance layer 3 is used. For example, a nitride semiconductor can be used, and in order to emit white light, the emission wavelength of the LED chip is set to 400 nm or more and 550 nm or less in consideration of a complementary color relationship with the emission wavelength from the phosphor. It is preferable to do. More preferably, the light emission wavelength of the LED chip is 420 nm or more and 490 nm or less. Moreover, you may obtain the light which applied the LED chip which light-emits the light of a 400 nm or less ultraviolet region.

  The phosphor layer 3 is composed of a translucent member in which phosphors are dispersed. As the translucent member, for example, various resins such as silicone resin, acrylic resin, and epoxy resin can be used. In some cases, an insulating adhesive (for example, a light-transmitting inorganic member such as glass) for fixing the LED chip to the package can be used as the light-transmitting member.

  In the light emitting device according to the embodiment of the present invention, the thickness of the phosphor layer 3 is defined in the range of 80 μm to 240 μm. When the thickness is less than 80 μm, high light conversion efficiency cannot be ensured. On the other hand, if it exceeds 240 μm, the light extraction efficiency may decrease. The thickness of the phosphor layer 3 is more preferably in the range of 100 μm to 150 μm.

  As the phosphor, various types of phosphors that are excited by the light emitted from the semiconductor LED chip to emit light can be used. In the present invention, white light can be obtained when a blue LED chip and a yellow phosphor are used. Such phosphors may be mixed with a red phosphor or a yellow-green phosphor, and the color rendering is improved by mixing these phosphors. Also, an ultraviolet LED chip can be used depending on the type of phosphor. The light emitting device according to the embodiment of the present invention can be applied to any phosphor having various emission wavelengths.

Examples of phosphors that can be used include the following.
Examples of phosphors capable of emitting yellow light include yttrium aluminum garnet oxide phosphors containing Y and activated with Ce or Pr, and europium represented by (Ba, Ca, Sr) ₂ SiO ₄ : Eu. Examples include activated alkaline earth metal silicate phosphors.

Examples of the phosphor capable of emitting red light include a europium-activated alkaline earth metal silicate phosphor represented by (Ba, Ca, Sr) ₂ SiO ₄ : Eu. Replacing part of Sr with Ba shifts the emission spectrum to the lower wavelength side, and replacing part of Sr with Ca shifts the emission spectrum to the longer wavelength side. By changing the composition in this way, it is possible to continuously adjust the emission color. Or at least one element selected from C, Si, Ge, Sn, Ti, Zr, and Hf, and at least one element selected from Be, Mg, Ca, Sr, Ba, and Zn. And a nitride phosphor activated by at least one element selected from rare earth elements. In addition, it is composed of fractured particles having a red fracture surface and emits light in the red region (Mg, Ca, Sr, Ba) ₂ Si ₅ N ₈ : Europium activated alkaline earth silicon nitride system represented by Eu Europium activated rare earth oxy represented by (Y, La, Gd, Lu) ₂ O ₂ S: Eu, which is composed of phosphors and growing particles having a substantially spherical shape as a regular crystal growth shape, and emits light in the red region. Examples include chalcogenite phosphors.

Examples of those capable of emitting green light include europium activation represented by (Mg, Ca, Sr, Ba) Si ₂ O ₂ N ₂ : Eu that is composed of fractured particles having a fracture surface and emits light in the green region. Europium-activated alkaline earth magnesium silicate composed of alkaline earth silicon oxynitride phosphors, ruptured particles having fractured surfaces, and emitting in the green region (Ba, Ca, Sr) ₂ SiO ₄ : Eu System phosphors and the like.

  The phosphors as described above may be used alone or in combination of two or more. In addition, an arbitrary color tone can be obtained in combination with the light emitting chip. For example, a light emitting device that emits white light can be obtained by combining a semiconductor light emitting element that emits blue light and a yellow phosphor. When the phosphor is changed to a mixture of yellow phosphor and red phosphor, warm white light is obtained.

  By mixing and adjusting two or more kinds of phosphors, a desired white mixed color light or the like can be obtained. Specifically, by adjusting the amount of phosphors having different chromaticity points according to the emission wavelength of the light emitting chip and including them, any point on the chromaticity diagram connected between the phosphors and the light emitting chip can be obtained. Can emit light.

Considering the excitation intensity by the blue light source, among the phosphors as described above, the yellow phosphor is based on a silicate compound and a composition formula (Sr, Ca, Ba) ₂ SiO ₄ : Eu. It is preferable. As other types of yellow phosphors, for example, yttrium / aluminum oxide phosphors, YAG: Ce, and phosphors such as sulfides can be used to produce white.

In the light emitting device according to the embodiment of the present invention, the particle size of the phosphor contained in the phosphor layer is regulated to 20 μm or more and 45 μm or less. The particle size of 20 μm or more and 45 μm or less means that when the phosphor layer is observed with a microscope or the like, the particle size of the phosphor particles of one third or more of the number of phosphors in an area of 0.04 mm ² is 20 μm or more and 45 μm or less. This means that it is distributed.

  If the particle size of the phosphor is out of the above-mentioned range, there arises a disadvantage that scattering or sedimentation becomes significant, and the light conversion efficiency is also lowered.

  Further, by arranging the particle size distribution, an effect of preventing color unevenness can be obtained. The particle size distribution can be made uniform by a method such as classification.

  The phosphor having such a particle size range is dispersed in the translucent member at a concentration of 40 wt% or more and 60 wt% or less. If it is less than 40 wt%, it is difficult to whiten the blue light emitting portion because it is too strong. On the other hand, if it exceeds 60 wt%, there is a risk of shielding light. The concentration of the phosphor is more preferably in the range of 50 wt% or more and 60 wt% or less.

  As described above, the phosphor layer in the light emitting device according to the embodiment of the present invention contains a phosphor having a specific particle diameter at a specific concentration. Moreover, since the thickness of the phosphor layer is also defined within a specific range, the light emission output can be increased. Furthermore, by defining the phosphor and the phosphor layer, irregularities reflecting the shape of the phosphor are generated on the surface of the phosphor layer in the semiconductor device according to the embodiment of the present invention. Due to the presence of such irregularities, light is effectively diffused at the interface with the outside of the translucent member. As a result, it is possible to prevent uneven color emission and obtain uniform light emission.

The light emitting device according to the embodiment of the present invention is manufactured by the following method.
First, a phosphor layer raw material is prepared by dispersing a phosphor of 20 μm or more and 45 μm or less in a predetermined concentration in a material of a translucent member such as silicone resin or epoxy resin. The particle size of the phosphor is previously adjusted within a predetermined range by classification. The density | concentration of the fluorescent substance in a fluorescent substance layer raw material is prescribed | regulated to 40 wt% or more and 60 wt% or less.

  On the other hand, a semiconductor light emitting element such as an LED chip is mounted in the recess of the package cup by a conventional method, and connected by a bonding wire.

  Thereafter, the phosphor layer raw material is heated, and dropped onto the upper surface of the LED chip mounted on the package cup with a dispenser or the like to form a coating film. The LED chip or the package cup may be heated to reduce the viscosity of the phosphor layer material.

  The heating temperature can be selected according to the thermosetting temperature of the translucent member, and it is necessary to heat to at least a temperature at which the phosphor layer material is cured. For example, when a silicone resin is used as the translucent member, it is desired to heat to 150 ° C. or higher.

  In coating, a small amount is dropped by adjusting the amount so that the thickness of the phosphor layer after solidification is 80 μm or more and 240 μm or less. Since the specific gravity of the phosphor is larger than that of the translucent member such as a liquid resin, the phosphor easily aggregates and settles. In order to obtain a phosphor layer in which the phosphor is uniformly present by preventing sedimentation of the phosphor, it is desired that the amount of the phosphor layer material to be dropped is a minimum amount.

  In addition, the fluorescent substance layer of the shape as shown in FIG. 1 thru | or FIG. 3 can be formed by changing the quantity of the fluorescent substance layer raw material to dripped.

  Then, for example, it is placed in an oven, and the translucent member is heated and solidified at 80 to 200 ° C. for 30 minutes to 3 hours. If the phosphor aggregates around the LED chip, the light output is reduced. In order to prevent aggregation, it is necessary to immediately cure the translucent member after dropping. As a result, the phosphors are dispersed around the LED chip without overlapping.

  The conditions for heat solidification can be selected according to the heat curing temperature of the translucent member. For example, when using a silicone resin as a translucent member, it can be solidified by heating at 80 ° C. to 200 ° C. for 30 minutes to 3 hours.

  Thus, the light emitting device according to the embodiment of the present invention is obtained.

  Specific examples of the present invention are shown below.

Example 1
A yellow phosphor having a composition represented by (Sr _1.84 Ba _0.12 ) ₂ SiO ₄ : Eu was prepared as a phosphor, and a silicone resin was prepared as a light transmissive member material. The particle size of the phosphor used was 20 μm or more and 45 μm or less. The range of the particle size is a range in which one third or more of the phosphor particles are distributed when the number of phosphors in an area of 0.04 mm ² is observed with a microscope. That is, the particle size of 20 μm or more and 45 μm or less means that when the phosphor is observed with a microscope, the particle size of the phosphor particles that are one third or more of the number of phosphors in an area of 0.04 mm ² is 20 μm or more and 45 μm or less. This means that it is distributed. In the following examples, a phosphor having the same particle size is used. This phosphor was dispersed in a silicone resin at a concentration of 40 wt% to obtain a phosphor layer raw material.

  On the other hand, a GaN blue LED having a light emitting layer made of InGaN or the like was prepared as an LED chip and mounted on the bottom of the package cup. Furthermore, the LED chip electrode and the electrode provided in the package cup were connected by a bonding wire to produce a light emitting device.

  The aforementioned phosphor layer material was applied on the LED chip using a dispenser while heating. Thereafter, it was immediately placed in an oven and left to stand at 150 ° C. for 3 hours to complete the light emitting device of this example. When the cross section of the obtained light emitting device was observed with a microscope, the phosphor layer 3 was disposed so as to cover the LED chip 2 as shown in FIG. The thickness of the phosphor layer 3 on the upper and side surfaces of the LED chip 2 was about 120 μm.

  As shown in the figure, the phosphor layer 3 is also disposed at the bottom of the recess of the package cup 1 with the same thickness, and further disposed at the same thickness up to a height of 500 μm on the side surface of the recess of the package cup 1. It was.

  The fluorescent substance layer 3 arrange | positioned on the LED chip 2 is observed with a microscope, The result is shown in the enlarged view of FIG. As shown in the figure, in the phosphor layer 3, two phosphor particles 5 are laminated as shown in the figure, and a translucent member exists between the phosphor particles 5. On the surface of the phosphor layer 3, there were fine irregularities reflecting the shape of the phosphor particles 5.

A phosphor layer material was prepared in the same manner as described above except that the particle size of the phosphor was changed to 10 to 19 μm and the concentration was changed to 61 wt%. As already described, the particle size of 10 μm or more and 19 μm or less means that when the phosphor is observed with a microscope, the particle size of the phosphor particles having a size of 1/3 or more of the number of phosphors in an area of 0.04 mm ² is 10 μm or more. It means 19 μm or less. The particle size of the phosphor was adjusted by classification. Using this phosphor layer raw material, a phosphor layer having a thickness of 60 μm was provided on an LED chip arranged in the same package cup as described above, and a light emitting device of Comparative Example 1 was fabricated. The height of the phosphor layer was adjusted by a dispenser.

  The outputs of the light emitting devices of Example 1 and Comparative Example 1 were measured with a light flux measuring device. As a result, when the output of the light emitting device of Comparative Example 1 was 1, the output of the light emitting device of Example 1 was 1.9.

  In addition, it was confirmed from the light distribution distribution measurement that uniform light emission was obtained from the light emitting device of Example 1. On the other hand, the light emission in the light emitting device of Comparative Example 1 was non-uniform.

  Furthermore, a light emitting device was manufactured by changing the particle size and concentration of the phosphor and the thickness of the phosphor layer, and the output was examined. The results are summarized in Tables 1 and 2 below.

Next, a light emitting device was produced in the same manner as described above except that the phosphor was changed to (Y, Gd) ₃ (Al, Gd) ₅ O ₁₂ : Ce, and the output was examined. The results are summarized in Table 3 below.

A light emitting device was produced in the same manner as described above except that the light transmissive member raw material was changed to an epoxy resin, and the output was examined. The results are summarized in Table 4 below.

  It is clear from the above table that the light emitting devices of the examples all emit light with a high relative output. In particular, when a phosphor layer containing a phosphor having a particle size of 20 μm or more and 45 μm or less at a concentration of 50 wt% is formed with a thickness of 150 μm, the relative output is increased to 2.3. 1.

DESCRIPTION OF SYMBOLS 1 ... Package cup; 2 ... LED chip; 3 ... Phosphor layer 4 ... Bonding wire; 5 ... Phosphor.

Claims (5)

A container having a recess;
A light emitting chip disposed on the bottom of the recess of the container;
A reflector disposed on the side of the recess of the container;
A light emitting device comprising a phosphor layer made of a resin containing phosphor particles, provided on an upper surface of the light emitting chip, extending to the concave side surface of the container,
The phosphor layer has irregularities reflecting the shape of the phosphor particles on the surface, and the height of the side surface of the recess is 500 μm or less.   The light emitting device according to claim 1, wherein the phosphor particles have a particle size of 20 μm to 45 μm.   3. The light emitting device according to claim 1, wherein a thickness of the phosphor layer on an upper surface of the light emitting chip is 80 μm or more and 240 μm or less.   The light emitting device according to claim 2 or 3, wherein the phosphor particles are dispersed in the resin at a concentration of 40 wt% or more and 60 wt% or less. A method of manufacturing a light emitting device according to claim 1,
Storing the light emitting chip in a container having a recess;
A step of dispersing phosphor particles in a resin to obtain a phosphor layer raw material;
Dropping the phosphor layer raw material on the light emitting chip in the container and providing a coating layer extending on the side surface of the recess;
And a step of solidifying the coating layer by heating to form a phosphor layer having a height of 500 μm or less on the side surface of the concave portion.

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