JP2010123355A5 - - Google Patents

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Publication number
JP2010123355A5
JP2010123355A5 JP2008295015A JP2008295015A JP2010123355A5 JP 2010123355 A5 JP2010123355 A5 JP 2010123355A5 JP 2008295015 A JP2008295015 A JP 2008295015A JP 2008295015 A JP2008295015 A JP 2008295015A JP 2010123355 A5 JP2010123355 A5 JP 2010123355A5
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JP
Japan
Prior art keywords
conductive
substance
ink according
carbon atoms
ion exchange
Prior art date
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Pending
Application number
JP2008295015A
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Japanese (ja)
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JP2010123355A (en
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Publication date
Application filed filed Critical
Priority to JP2008295015A priority Critical patent/JP2010123355A/en
Priority claimed from JP2008295015A external-priority patent/JP2010123355A/en
Priority to TW098139257A priority patent/TWI548708B/en
Publication of JP2010123355A publication Critical patent/JP2010123355A/en
Publication of JP2010123355A5 publication Critical patent/JP2010123355A5/ja
Pending legal-status Critical Current

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Description

また本発明は、１〜４個の水酸基を有する炭素数１０〜１８の化合物（Ｃ）が、炭素数１０〜１８の一価アルコール、多価アルコール、または、グリコールエーテルである上記導電性インキに関する。  Moreover, this invention relates to the said conductive ink whose C10-C18 compound (C) which has 1-4 hydroxyl groups is a C10-C18 monohydric alcohol, a polyhydric alcohol, or glycol ether. .

Claims (6)

保護物質（Ａ）によって被覆された導電性物質（Ｂ）と、１〜４個の水酸基を有する炭素数１０〜１８の化合物（Ｃ）とを含む導電性インキ。   A conductive ink comprising a conductive substance (B) coated with a protective substance (A) and a compound (C) having 10 to 18 carbon atoms and having 1 to 4 hydroxyl groups. １〜４個の水酸基を有する炭素数１０〜１８の化合物（Ｃ）が、炭素数１０〜１８の一価アルコール、多価アルコール、または、グリコールエーテルである請求項１記載の導電性インキ。The conductive ink according to claim 1, wherein the compound (C) having 10 to 18 carbon atoms having 1 to 4 hydroxyl groups is a monohydric alcohol, polyhydric alcohol or glycol ether having 10 to 18 carbon atoms. 導電性物質（Ｂ）が、平均粒子径０．００１〜１０μｍ の導電性微粒子である請求項The conductive substance (B) is conductive fine particles having an average particle diameter of 0.001 to 10 μm.
１または２記載の導電性インキ。The conductive ink according to 1 or 2. 請求項１〜３いずれかに記載の導電性インキから形成される導電層（Ｄ）と、保護物質（Ａ）に対するイオン交換能を有する物質（Ｅ）を含むイオン交換層（Ｆ）と、の積層によって、導電層（Ｄ）から形成されることを特徴とする導電性被膜。A conductive layer (D) formed from the conductive ink according to any one of claims 1 to 3, and an ion exchange layer (F) containing a substance (E) having an ion exchange capacity for the protective substance (A). A conductive film formed from a conductive layer (D) by lamination. 請求項１〜３いずれかに記載の導電性インキと、保護物質（Ａ）に対するイオン交換能を有する物質（Ｅ）とを含む組成物から形成されることを特徴とする導電性被膜。A conductive film formed from a composition comprising the conductive ink according to any one of claims 1 to 3 and a substance (E) having an ion exchange capacity for the protective substance (A). 基材上に、請求項４または５記載の導電性被膜が設けられてなる導電性積層体A conductive laminate comprising a conductive film according to claim 4 or 5 provided on a substrate.
JP2008295015A 2008-11-19 2008-11-19 Conductive ink and conductive coating Pending JP2010123355A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008295015A JP2010123355A (en) 2008-11-19 2008-11-19 Conductive ink and conductive coating
TW098139257A TWI548708B (en) 2008-11-19 2009-11-19 Conductive ink and conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008295015A JP2010123355A (en) 2008-11-19 2008-11-19 Conductive ink and conductive coating

Publications (2)

Publication Number Publication Date
JP2010123355A JP2010123355A (en) 2010-06-03
JP2010123355A5 true JP2010123355A5 (en) 2011-08-25

Family

ID=42324527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008295015A Pending JP2010123355A (en) 2008-11-19 2008-11-19 Conductive ink and conductive coating

Country Status (2)

Country Link
JP (1) JP2010123355A (en)
TW (1) TWI548708B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5688895B2 (en) * 2008-12-26 2015-03-25 Ｄｏｗａエレクトロニクス株式会社 Fine silver particle powder and silver paste using the powder
JP5689081B2 (en) * 2011-02-02 2015-03-25 日本特殊陶業株式会社 Ink and device
JP5973739B2 (en) * 2011-04-13 2016-08-23 株式会社ダイセル Solvent or solvent composition for producing multilayer ceramic parts
CN102508007B (en) * 2011-11-24 2013-07-10 西南大学 Dynamic method for measuring surface property parameters of substance
WO2014013557A1 (en) * 2012-07-17 2014-01-23 日油株式会社 Silver-containing composition, and base for use in formation of silver element
JP6115280B2 (en) * 2013-04-17 2017-04-19 東ソー株式会社 Conductive copper ink composition
WO2014208445A1 (en) * 2013-06-27 2014-12-31 東レ株式会社 Electroconductive paste, method for manufacturing an electroconductive pattern, and touch panel
EP3255657B1 (en) 2015-02-04 2020-11-18 Namics Corporation Thermally conductive paste and manufacturing method therefor
JP2017088734A (en) * 2015-11-10 2017-05-25 株式会社アルバック Conductive metal ink
JP6679957B2 (en) * 2016-02-01 2020-04-15 東洋インキＳｃホールディングス株式会社 Bonding agent and article bonded with the bonding agent
JP6905328B2 (en) * 2016-11-15 2021-07-21 株式会社ダイセル Composition for forming a metal plating layer
JP6546309B1 (en) * 2018-03-19 2019-07-17 株式会社ノリタケカンパニーリミテド Conductive paste with stable viscosity over time
JP2020053404A (en) * 2019-12-11 2020-04-02 三井金属鉱業株式会社 Copper paste and manufacturing method of sintered body of copper
CN113976881B (en) * 2021-11-01 2024-03-08 南通天盛新能源股份有限公司 Preparation method of high-tap-density silver-coated copper powder for synthesizing conductive paste in one pot
CN116864180B (en) * 2023-06-30 2024-08-13 南通天盛新能源股份有限公司 Front silver paste for N-type crystalline silicon solar cell and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4507750B2 (en) * 2004-08-05 2010-07-21 昭栄化学工業株式会社 Conductive paste
JP4839767B2 (en) * 2005-10-14 2011-12-21 東洋インキＳｃホールディングス株式会社 A method for producing a metal fine particle dispersion, a conductive ink using the metal fine particle dispersion produced by the method, and a conductive pattern.
US7981327B2 (en) * 2005-10-14 2011-07-19 Toyo Ink Mfg. Co. Ltd. Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film
JP4983150B2 (en) * 2006-04-28 2012-07-25 東洋インキＳｃホールディングス株式会社 Method for producing conductive coating

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