JP2010090260A - Molded article for handling glass plate, and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molded article for handling a glass plate, having excellent charge separation-preventing properties and slidability. <P>SOLUTION: The molded article for handling the glass plate composed of a resin composition comprising a silicone resin (A) and a resin (B) except the silicone resin (A) is regulated so that the molded article may directly contact with the glass plate, and particles of the silicone resin (A) are dispersed in a matrix of the resin (B). The molded article for conveying the glass plate, selected from the group consisting of a conveying roller, a vacuum stage and a vacuum chuck is a preferable embodiment. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a molded product for handling glass plates, which is made of a resin composition containing a silicone resin and other resins. Moreover, it is related with the manufacturing method of such a molded article, and the handling method of the glass plate using such a molded article.

  In the manufacturing process of a liquid crystal display panel or an organic EL panel, a glass plate is handled by being transferred or transported. At that time, in order to prevent contamination due to adhesion of particles due to the charging of the glass, and to prevent electrostatic breakdown of the electric circuit formed on the glass plate, it is required to prevent the glass plate from being charged.

Patent Document 1 discloses a method for transporting a cathode ray tube glass component in which the glass component is automatically transported by a transport device having a resin guide roller in a cathode ray tube manufacturing process, wherein the resin guide roller is used as a conductive resin material. The cathode ray tube glass component conveying method is characterized in that the cathode ray tube glass component is conveyed in a state in which the cathode ray tube glass component is not contact-charged by the guide roller made of the conductive resin material. At this time, it is also described that the conductive resin material is made of an engineering plastic containing a carbon filler, and that the volume resistivity of the conductive resin material is 10 ⁶ Ω · cm or less. And it is described that contact charging of the conveyed glass component can be prevented by using the guide roller. However, the antistatic property was insufficient only by blending the carbon filler and imparting conductivity. In particular, it has not been possible to meet the high antistatic properties required when handling glass plates used in liquid crystal display panels, organic EL panels, and the like.

  Patent Document 2 discloses a liquid crystal display device that uses a material having a composition equal to or substantially equal to the composition of the insulating substrate as a material of a member that contacts the insulating substrate in the step of forming a liquid crystal element on the insulating substrate. The manufacturing method of is described. At this time, the use of a substance having a relative dielectric constant equal to that of the insulating substrate or a substance having a small difference in relative dielectric constant from the insulating substrate can prevent static electricity from being generated on the insulating substrate. ing. Examples of such substances include compounds containing silicon such as silicon nitride, silicon oxide, and silicon carbide. Further, a glass substrate or the like is described as an insulating substrate, and it is described that it is less likely to be charged when a substance containing silicon, which is also included in the glass substrate, is used as a material for the plate. Specifically, it is described that the surface of a member that contacts an insulating substrate is coated with a compound containing silicon. However, it is not easy to coat the surface of the member in contact with the insulating substrate with the inorganic compound containing silicon, and the cost is high. In particular, it has been difficult to coat a member having a three-dimensional shape.

  Patent Document 3 describes a package in which a coating material made of a resin composition containing a thermoplastic resin such as a poly (meth) acrylate resin and a silicone resin is applied. It is described that the charge amount of the resin composition or the frictional object generated by contact or friction can be adjusted by changing the mixing ratio of the thermoplastic resin and the silicone resin in accordance with the charging tendency of the frictional object. Yes. At this time, it is described that a conductive filler is added in order to impart conductivity, and examples thereof include electron conductive materials such as conductive titanium oxide and conductive tin oxide. However, there is no description about handling glass plates.

  In Patent Document 4, when a material such as a plastic film, a plastic sheet, a surface resin-coated paper, a plate, or a metal is transported by a rubber roller, a resin roller, a metal roller, or the like, the same charged train as that of the material to be transported In addition, a method for preventing the generation of static electricity on the surface of a material to be conveyed by containing a charge control agent in a roller or the like or fixing the charge control agent on the surface is described. In this case, examples of the charge control agent include azo-chromium complex compounds and fatty acid metal salts. However, there is no description about handling glass plates.

JP 2002-15669 A JP-A-10-253935 JP 2005-146070 A Japanese Patent Laid-Open No. 5-94895

  The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a molded product for handling a glass plate that is excellent in antistatic properties against peeling and slidability. Moreover, it aims at providing the manufacturing method of such a molded article, and the handling method of the glass plate using such a molded article.

  The above-mentioned problem is a molded product for handling a glass plate comprising a resin composition containing a silicone resin (A) and a resin (B) other than the silicone resin (A), and the molded product is in direct contact with the glass plate, and The problem is solved by providing a molded article for handling a glass plate, wherein the particles of the silicone resin (A) are dispersed in the matrix of the resin (B).

At this time, the silicone resin (A) is preferably crosslinked. The silicone resin (A) is more preferably polyorganosilsesquioxane or a crosslinked dialkylpolysiloxane, and 3 or more oxygen atoms are bonded to each other among silicon atoms contained in the silicone resin (A). It is also more preferable that the ratio of what is is 20% or more. The resin (B) is at least one resin selected from the group consisting of polyolefin, polyamide, polyimide, polyphenylene sulfide, polyoxymethylene, polyester, polystyrene, styrene copolymer, polycarbonate, polyether ether ketone, and fluororesin. It is preferable that the resin (B) is a cyclic olefin polymer. It is also preferable that the resin composition contains 0.1 to 50 parts by weight of the silicone resin (A) with respect to 100 parts by weight of the total of the silicone resin (A) and the resin (B). It is also preferred that the resin composition further contains a conductive filler (C). Moreover, it is also preferable that the surface resistivity of the molded product is 10 ⁰ to 10 ¹² Ω / □.

  A preferred embodiment of the present invention is a molded article for conveying a glass plate, and particularly preferred embodiments are a conveying roller, a vacuum stage, and a vacuum chuck.

  The above-described problem can also be solved by providing a method for producing the molded product, in which the silicone resin (A) powder and the resin (B) are melt-kneaded and then molded.

  Moreover, the said subject is also solved by making the glass plate contact the said molded article directly, and providing the handling method of the glass plate which handles a glass plate.

  The molded product for handling a glass plate of the present invention is excellent in peeling antistatic property and sliding property. Therefore, it is suitable for handling a glass plate having a large area that does not like contamination due to charging or electrostatic breakdown, such as a glass substrate for liquid crystal. Moreover, according to the manufacturing method of the molded product of this invention, such a molded product can be manufactured easily. Furthermore, according to the method for handling a glass plate of the present invention, it is possible to handle the glass plate while suppressing peeling charge and preventing contamination.

  The molded product for handling glass plates of the present invention comprises a resin composition containing a silicone resin (A) and a resin (B) other than the silicone resin (A).

  The silicone resin (A) used in the present invention is a resin having an organic group bonded to a silicon atom and containing a polysiloxane structure. By using such a silicone resin (A), the peeling antistatic property and slidability of the molded product are improved. Since the silicone resin (A) is located between the resin (B) and the glass in the charging row, the position of the resin composition in the charging row is changed from the position of the resin (B) to the glass by blending the silicone resin (A). Approach the position. Therefore, it is considered that the peeling antistatic property is improved. Although the resin composition of the present invention has such a morphology that the particles of the silicone resin (A) are dispersed in the matrix of the resin (B), it is remarkably excellent in antistatic properties and slidability. It is surprising to be effective.

The silicone resin (A) is represented by the following formula (I).
(R ₃ SiO _0.5 ) _a (R ₂ SiO) _b (RSiO _1.5 ) _c (SiO ₂ ) _d (I)
(In Formula (I), R is an organic group. A, b, c and d are each a number of 0 or more and 1 or less, and a + b + c + d = 1, provided that d = 1 is not satisfied.)

In the formula (I), the organic group R is not particularly limited. Examples thereof include alkyl groups such as methyl group and ethyl group; cycloalkyl groups such as cyclohexyl group; alkenyl groups such as vinyl group and allyl group; aryl groups such as phenyl group; aryl-alkyl groups such as benzyl group. The organic group R may be one type of organic group or a plurality of types of organic groups. For the values of a, b, c and d, for example, when the silicone resin (A) is analyzed by solid ²⁹ Si-NMR, one, two, three or four oxygen atoms are bonded to each other among silicon atoms. It can be obtained by obtaining the atomic ratio of each.

  Examples of the silicone resin (A) include linear diorganopolysiloxane, cross-linked diorganopolysiloxane, polyorganosilsesquioxane and the like. The molecular weight of the silicone resin (A) is not particularly limited.

  In the silicone resin (A), the proportion of silicon atoms contained in the silicone resin (A) in which one, two, or three oxygen atoms are bonded is 30% or more, that is, the above formula In (I), it is preferable that a + b + c is 0.3 or more because affinity with the resin (B) is improved. More preferably, the ratio is 60% or more, that is, a + b + c is 0.6 or more, and more preferably 80% or more, that is, a + b + c is 0.8 or more.

  The silicone resin (A) used in the present invention is more preferably crosslinked. The crosslinked silicone resin (A) is a polysiloxane compound in which the polymer chains constituting the silicone resin (A) are bonded to each other by chemical bonds to have a higher molecular weight. By using such a crosslinked silicone resin (A), the strength of the obtained molded product is ensured. Moreover, contamination of the glass plate is prevented by eliminating the bleeding out of the silicone resin (A) from the molded product.

  The crosslinked silicone resin (A) may be crosslinked by any bond. For example, a Si—O—Si bond, a Si—C—Si bond, a Si—C—O—Si bond, a Si—C—C—Si bond, a Si—C—C—C—Si bond, and the like can be given. The cross-linking method and cross-linking density are not particularly limited. Of the silicon atoms contained in the cross-linked silicone resin (A), three or more oxygen atoms are bonded to form a cross-linking bond. The ratio is preferably 0.1% or more, that is, in the above formula (I), c + d is preferably 0.001 or more. More preferably, the ratio is 1% or more, that is, c + d is 0.01 or more.

  The crosslinked silicone resin (A) is preferably a polyorganosilsesquioxane or a crosslinked dialkylpolysiloxane in terms of easy availability of commercially available powders.

The polyorganosilsesquioxane used in the present invention is a compound having a structure in which c in the above formula (I) is crosslinked in a three-dimensional network having a value exceeding 0.5. It is preferable that c is 0.8 or more, and it is particularly preferable that it is substantially composed only of structural units represented by “RSiO _1.5 ”. Since polyorganosilsesquioxane is close to the position of the glass in the charge train, the molded article containing it has particularly good antistatic properties for peeling.

  Examples of the polyorganosilsesquioxane include polyalkylsilsesquioxanes such as polymethylsilsesquioxane and polyethylsilsesquioxane; polycycloalkylsilsesquioxanes such as polycyclohexylsilsesquioxane; polyphenylsilsesquioxane; Examples include polyarylsilsesquioxanes such as oxane. Of these, polyalkylsilsesquioxane is preferable and polymethylsilsesquioxane is particularly preferable because it is easily available.

The crosslinked dialkylpolysiloxane used in the present invention has a structure in which, in the above formula (I), the organic group R is an alkyl group, and b is more than 0.5, a linear dialkylpolysiloxane is crosslinked. It has something. It is preferable that b is 0.8 or more, and it is particularly preferable that it is substantially composed only of structural units represented by “R ₂ SiO”.

  Examples of the crosslinked dialkylpolysiloxane include a crosslinked dialkylpolysiloxane such as a crosslinked dimethylpolysiloxane and a crosslinked diethylpolysiloxane; a crosslinked diarylpolysiloxane such as a crosslinked diphenylpolysiloxane, and the like. . Among these, a crosslinked dialkylpolysiloxane is more preferable, and a crosslinked dimethylpolysiloxane is particularly preferable in that a commercially available powder is easily available.

  Among the crosslinked silicone resins (A), the proportion of silicon atoms contained in the silicone resin (A) in which three or more oxygen atoms are bonded is 20% or more, that is, the above formula (I) ), C + d is preferably 0.2 or more. This is because such a crosslinked silicone resin (A) is close to the glass position at the position of the charge train, and therefore the antistatic property of the molded article containing it is particularly good. More preferably, the ratio is 50% or more, that is, c + d is 0.5 or more, and more preferably 80% or more, that is, c + d is 0.8 or more.

  The silicone resin (A) used in the present invention is preferably in the form of powder before mixing with the resin (B). Thereby, the dispersibility of the silicone resin (A) in a resin composition becomes favorable. The shape of the powder particles is not particularly limited, but a spherical shape is preferable for uniform dispersion. The particle size of the powder particles is not particularly limited, but the average particle size is preferably 0.1 to 100 μm. If the particle size is less than 0.1 μm, the particles are likely to aggregate and difficult to handle. The particle size is more preferably 0.5 μm or more, and further preferably 1 μm or more. When the particle size exceeds 100 μm, the dispersibility of the silicone resin (A) in the resin composition may be deteriorated. More preferably, it is 10 μm or less.

  As the silicone resin (A), one type of resin may be used, or a plurality of types of resins may be used. When a plurality of types of resins are used, a powder composed of a plurality of types of particles may be used, or a powder composed of particles obtained by combining a plurality of types of resins may be used. Among these, it is preferable to use particles combined with a core-shell structure. Since the antistatic property of the molded article containing particles having such a structure is easily influenced by the type of the silicone resin (A) covering the particle surface, the silicone having the excellent antistatic property described above is used for the shell layer. It is preferable to arrange the resin (A).

  The resin (B) other than the silicone resin (A) used in the present invention is not particularly limited as long as it is a resin other than the silicone resin (A). A thermoplastic resin or a thermosetting resin may be used, but a thermoplastic resin is preferable because it can be easily melt kneaded with the silicone resin (A) and the resin composition can be easily molded. Examples of the thermoplastic resin include polyolefin; polyamide such as polyamide 66 and polyamide 6; polyimide; polyphenylene sulfide; polyoxymethylene; polyester such as polyethylene terephthalate and polybutylene terephthalate; polystyrene; styrene such as acrylonitrile-butadiene-styrene copolymer. Examples include copolymers; polycarbonates; polyether ether ketones and fluororesins.

  The resin (B) used in the present invention is preferably an amorphous resin because the dimensional accuracy of the molded product is good. Examples of the amorphous resin include a cyclic olefin polymer, polycarbonate, polystyrene, and a styrene copolymer.

  The resin (B) is preferably a polyolefin. This is because polyolefin does not contain heteroatoms and thus has excellent stain resistance. Further, the position of the polyolefin and the glass are largely separated from each other in the charged column, and the effect obtained by blending the silicone resin (A) is great. Examples of the polyolefin include high density polyethylene, low density polyethylene, linear low density polyethylene, polypropylene, polybutene, and cyclic olefin polymer. When high wear resistance is required, it is preferable to use ultrahigh molecular weight polyethylene.

  A cyclic olefin polymer which is an amorphous polyolefin is particularly preferably used as the resin (B). By using a cyclic olefin polymer, a molded product having excellent chemical resistance, heat resistance, dimensional accuracy, contamination resistance and mechanical properties can be obtained.

  The cyclic olefin polymer is obtained by polymerizing an olefin monomer having an aliphatic cyclic skeleton, and any polymer having an aliphatic cyclic skeleton in the obtained polymer may be used. The polymer is preferably a polymer obtained by polymerizing a cyclic olefin represented by the following formula (II) or (III).

(In the formula (II), n is 0 or 1, m is 0 or a positive integer, q is 0 or 1, and R ^{1 to} R ¹⁸ and R ^a and R ^b are each independently, A hydrogen atom, a halogen atom or a hydrocarbon group, R ^{15 to} R ¹⁸ may be bonded to each other to form a monocycle or polycycle, and the monocycle or polycycle has a double bond; And R ¹⁵ and R ¹⁶ , or R ¹⁷ and R ¹⁸ may form an alkylidene group.)

(In the formula (III), p and q are 0 or an integer of 1 or more, m and n are 0, 1 or 2, and R ^{1 to} R ¹⁹ are each independently a hydrogen atom, a halogen atom or an aliphatic carbonization. A hydrogen atom, an alicyclic hydrocarbon group, an aromatic hydrocarbon group or an alkoxy group, and a carbon atom to which R ⁹ (or R ¹⁰ ) is bonded, and a carbon atom to which R ¹³ or R ¹¹ is bonded May be bonded directly or via an alkylene group having 1 to 3 carbon atoms, and when n = m = 0, R ¹⁵ and R ¹² or R ¹⁵ and R ¹⁹ are bonded to each other to form a single ring or (A polycyclic aromatic ring may be formed.)

As the polymer obtained by polymerizing the cyclic olefin represented by the above formula (II) or (III), the following (a1), (a2), (a3) and (a4) are exemplified as preferable examples. .
(A1): Random copolymer of ethylene and a cyclic olefin represented by the above formula (II) or (III) (ethylene-cyclic olefin random copolymer)
(A2): Ring-opening polymer or ring-opening copolymer of cyclic olefin represented by the above formula (II) or (III) (a3): hydride of (a2) (a4): (a1), (a2 ) Or (a3) graft modified product

  Among these, an ethylene-cyclic olefin random copolymer (a1), that is, a random copolymer of ethylene and a cyclic olefin represented by the above formula (II) or (III) is preferably used. Such an ethylene-cyclic olefin random copolymer (a1) is preferably used because it provides a resin composition having excellent abrasion resistance and a small amount of volatile components released.

At this time, as the cyclic olefin represented by the above formula (II) or (III) used as a raw material of the ethylene-cyclic olefin random copolymer (a1), those suitable from the viewpoint of heat resistance and availability. as, tetracyclo [4.4.0.1 ^2,5 .1 ^7,10] -3- dodecene and derivatives hydrocarbon group substituted thereto is illustrated, tetracyclo [4.4.0.1 ^2,5 .1 ⁷ as particularly suitable ^{, 10} ] -3-dodecene.

  The ethylene content in the ethylene-cyclic olefin random copolymer (a1) is preferably 40 to 85 mol% from the viewpoints of heat resistance and rigidity. The ethylene content is more preferably 50 mol% or more. Further, the ethylene content is more preferably 75 mol% or less. On the other hand, the cyclic olefin content is preferably 15 to 60 mol%. The content of the cyclic olefin is more preferably 25 mol% or more. Moreover, the content rate of a cyclic olefin is 50 mol% or less more suitably.

  The cyclic olefin polymer used in the present invention preferably has a glass transition temperature of 60 to 200 ° C. In order to satisfy the heat resistance as a molded product for handling glass plates, the glass transition temperature needs to be 60 ° C. or higher, preferably 80 ° C. or higher, and more preferably 100 ° C. or higher. Moreover, since there exists a possibility of decomposition | disassembly when a shaping | molding temperature becomes high too much, it is necessary for a glass transition temperature to be 200 degrees C or less. The glass transition temperature in the present invention is a glass transition start temperature measured at a heating rate of 10 ° C./min using a differential scanning calorimeter (DSC).

  The MFR (melt flow rate: measured at 230 ° C. under a load of 2.16 kg based on ASTM D1238) of the cyclic olefin polymer is preferably 0.1 to 500 g / 10 minutes. When MFR is less than 0.1 g / 10 min, the melt viscosity is too high, and the melt moldability of the resulting resin composition may be deteriorated. MFR is more preferably 0.5 g / 10 min or more, and even more preferably 1 g / 10 min or more. On the other hand, when the MFR exceeds 500 g / 10 min, the mechanical strength of the resulting resin composition may be reduced. MFR is more preferably 200 g / 10 min or less, and even more preferably 100 g / 10 min or less.

  As the resin (B) of the present invention, one kind of resin may be used, or a resin composition comprising a plurality of kinds may be used. Among them, the cyclic olefin polymer used as the resin (B) of the present invention comprises at least two monomers selected from the group consisting of 100 parts by weight of a cyclic olefin polymer, olefin, diene and aromatic vinyl hydrocarbon. Polymerized and having 1 to 150 parts by weight of a soft copolymer having a glass transition temperature of 0 ° C. or less, 0.001 to 1 part by weight of a radical initiator, and two or more radical polymerizable functional groups in the molecule A resin composition obtained by melt-kneading 0 to 1 part by weight of a polyfunctional compound is particularly preferable. Thereby, a molded article excellent in wear resistance can be obtained.

At this time, preferred examples of the soft copolymer include (b1), (b2), (b3) and (b4) shown below.
(B1): Amorphous or low crystalline soft copolymer (b2) obtained by polymerizing at least two monomers selected from the group consisting of ethylene and an α-olefin having 3 to 20 carbon atoms ): A soft copolymer obtained by polymerizing ethylene, an α-olefin having 3 to 20 carbon atoms and a cyclic olefin (b3): a non-conjugated diene, ethylene and an α-olefin having 3 to 20 carbon atoms A soft copolymer (b4) obtained by polymerizing at least two monomers selected from the group consisting of: a random or block copolymer of an aromatic vinyl hydrocarbon and a conjugated diene, or a hydride thereof. A soft copolymer

  The radical initiator is not particularly limited as long as it can be thermally decomposed by heating during melt kneading to generate radicals. A peroxide, an azo compound, a redox initiator, etc. are mentioned. However, those containing metal are not necessarily preferable as molded products for handling glass plates because metal residues are mixed in the molded products. Moreover, the thing containing a nitrogen element like an azo compound has a possibility that a nitrogen-containing compound may volatilize from a molded article, and may be unpreferable. Therefore, an organic peroxide is preferably employed. The radical initiator is preferably decomposed at an appropriate rate during melt-kneading, and its one-minute half-life temperature is preferably 30 to 250 ° C. The 1-minute half-life temperature is more preferably 50 ° C. or more and 200 ° C. or less.

  The resin composition is obtained by melt-kneading a cyclic olefin polymer, a soft copolymer, and a radical initiator. At this time, it can bridge | crosslink more efficiently by further adding the polyfunctional compound which has 2 or more of radically polymerizable functional groups in a molecule | numerator with respect to these raw materials, and melt-kneading. Thereby, it is considered that the wear resistance of the molded product can be improved. The details of the resin composition as described above are described in WO2006 / 25294.

  In the resin composition constituting the molded article of the present invention, the silicone resin (A) particles are dispersed in the matrix of the resin (B), that is, the silicone resin ( It is important that A) is present as a dispersed phase. By dispersing the particles of the silicone resin (A) in the matrix of the resin (B), a molded product with good dimensional accuracy and excellent mechanical properties can be obtained. And it is a surprise that peeling antistatic property with respect to a glass plate is greatly improved while having such a morphology. The dispersion state of the silicone resin (A) particles in the resin (B) can be confirmed by observing the cross section of the resin composition with a microscope.

  The content of the silicone resin (A) in the present invention is not particularly limited as long as the particles of the silicone resin (A) can be dispersed in the matrix of the resin (B). A preferable content is 0.1 to 50 parts by weight with respect to 100 parts by weight of the total of the silicone resin (A) and the resin (B). If the content is less than 0.1 parts by weight, the molded article may have insufficient antistatic properties and slidability. The content is more preferably 0.5 parts by weight or more, further preferably 1 part by weight or more, and particularly preferably 2 parts by weight or more. When content exceeds 50 weight part, there exists a possibility that the dispersibility of the silicone resin (A) in a resin composition may deteriorate. The content is more preferably 20 parts by weight or less, further preferably 15 parts by weight or less, and particularly preferably 10 parts by weight or less.

It is preferable that the resin composition of the present invention further contains a conductive filler (C). Thereby, it is possible to prevent the molded product itself made of the resin composition from being charged, and good antistatic properties can be obtained. As the conductive filler (C) used in the present invention, various known fillers can be used. Metal oxide fillers such as SnO ₂ , ZnO, In ₂ O ₃ , and TiO ₂ ; metal fillers; carbon fillers such as graphite, carbon black, carbon fibers, and carbon nanotubes are used as the conductive filler (C). Can do. A carbon-based filler is preferable because contamination by metal ions can be prevented, and among them, carbon fiber is more preferable because it can improve the mechanical properties and wear resistance of a molded product and can suppress dust generation. Among the carbon fibers, PAN-based carbon fibers and pitch-based isotropic carbon fibers are particularly preferable.

  Although the dimension of the said carbon fiber is not specifically limited, It is preferable that a fiber diameter is 1-20 micrometers, and it is preferable that fiber length is 0.1-10 mm.

  Although content of the said conductive filler (C) is not specifically limited, It is preferable that it is 0.5-30 weight part with respect to a total of 100 weight part of a silicone resin (A) and resin (B). If the content is less than 0.5 parts by weight, the antistatic property to peeling may be deteriorated. The content is more preferably 2 parts by weight or more, and further preferably 5 parts by weight or more. When the content exceeds 30 parts by weight, the moldability is lowered and the dispersibility of the conductive filler (C) in the resin composition may be deteriorated. The content is more preferably 20 parts by weight or less, and further preferably 15 parts by weight or less.

  As the conductive filler (C), one type of filler or a plurality of types of fillers may be used. When a filler having a fiber length of 1 to 10 mm and a filler having a fiber length of 0.1 to 1 mm are used in combination, the uniformity of the surface resistivity of the molded product is preferably increased.

  The resin composition in the present invention is a filler other than the conductive filler (C) (glass fiber, organic fiber, natural fiber, glass flake, glass bead, ceramic fiber, ceramic bead, Talc, clay, mica, zeolite, bentonite, dolomite, kaolin, finely divided silicic acid, feldspar powder, potassium titanate, calcium carbonate, magnesium carbonate, barium sulfate, etc.), stabilizer (antioxidant, UV absorber, etc.), lubricant Various additives such as a release agent, a flame retardant, a colorant (dye, pigment, etc.), a nucleating agent, and an antistatic agent may be included.

  The molded product for handling a glass plate of the present invention is produced by molding after mixing the silicone resin (A) and the resin (B). The method of mixing is not particularly limited. For example, a method of melt-kneading the silicone resin (A) and the resin (B), a method of drying and removing the solvent from a solution or dispersion containing the silicone resin (A) and the resin (B), and the like can be mentioned. From the viewpoint of productivity, a melt kneading method is preferred. The method of melt-kneading is not particularly limited, and a known method such as a method performed by an extruder such as a single screw extruder or a twin screw extruder is employed.

  The method for molding the molded product of the present invention is not particularly limited, and for example, a known melt molding method such as injection molding or extrusion molding is employed. After the melt molding, the molded product can be ground and finished.

It is preferable that the surface resistivity of the molded product for handling glass sheets of the present invention is 10 ⁰ to 10 ¹² Ω / □. When the surface resistivity is 10 ⁰ to 10 ⁶ Ω / □, it can be used as an ESA (Electrostatic Attraction) countermeasure product. A molded product suitable for use in a clean room with less particle adhesion is provided. The surface resistivity is more preferably 10 ¹ Ω / □ or more. When the surface resistivity is 10 ⁶ to 10 ¹² Ω / □, it can be used as an ESD (Electrostatic Discharge) countermeasure product. It is possible to prevent the electronic circuit formed on the glass plate from being damaged due to the flow of electricity too easily. When the surface resistivity exceeds 10 ¹² Ω / □, the molded product itself is easily charged. The surface resistivity is more preferably 10 ¹¹ Ω / □ or less.

  The material of the glass plate handled by this invention is not specifically limited. Examples include soda lime glass, borosilicate glass, alkali-free glass, and quartz glass.

Although the area of the glass plate handled by this invention is not specifically limited, The profit which employ | adopts the molded article of this invention is large when handling the glass plate of a large area of 1 m < ² > or more. Since the molded article of the present invention is excellent in slidability, it is suitable for handling a large area and large weight glass plate while preventing peeling electrification. The area of the glass plate is more preferably 2 m ² or more. The upper limit of the area of the glass plate is usually about 20 m ² .

  Although the thickness of the glass plate handled by this invention is not specifically limited, Usually, it is 0.3-5 mm. If it is a glass substrate of a liquid crystal display panel or an organic EL panel, it is 0.3-1 mm. The shape of the glass plate is not particularly limited, and may be square, circular, or other shapes. Although the use of a glass plate is not specifically limited, As a suitable use, the glass substrate of a liquid crystal display panel, an organic electroluminescent panel, etc. are illustrated.

  Moreover, the surface which contacts the molded article of this invention should just be glass, the other raw material may be coated by the other surface, and the electronic circuit etc. may be formed in the other surface.

  The molded product for handling a glass plate of the present invention is not particularly limited as long as the molded product is used in direct contact with the glass plate. Here, that the molded product is in direct contact with the glass plate means that the resin composition of the present invention is in contact with the glass plate to be handled. A preferred embodiment of the molded product for handling glass plates is a molded product for conveying glass plates. The molded product for conveying a glass plate of the present invention is not particularly limited as long as it is used for moving the glass plate. Suitable examples of the molded product for conveying the glass plate include a conveyance roller, a vacuum stage, and a vacuum chuck. Among them, a particularly preferable one is a conveyance roller. Since peeling electrification easily occurs due to the friction between the rotating roller and the glass plate, the benefit of adopting the molded product of the present invention is particularly great. Further, since wear resistance against contact with the edge of the glass plate is required and dimensional accuracy is also required, the advantage of adopting the molded product of the present invention is great from these points.

  The handling method of the glass plate using the molded product of the present invention is not particularly limited as long as the molded product is a method of directly contacting the glass plate. It is preferable to handle the glass plate in a clean room from the viewpoint of preventing contamination due to adhesion of particles. Moreover, the method of conveying a glass plate is preferable. The conveyance method of the glass plate using the molded article of this invention should just be a method to move a glass plate, and is not specifically limited. For example, a conveyance method using a roller or a vacuum chuck may be used. A particularly preferred embodiment is a transport method using a roller. A glass plate is conveyed by rotating a roller mounted on a rotating shaft. When the rotating shaft is conductive such as metal and the roller contains a conductive filler (C), the charge can be released via the rotating shaft, and the roller itself can be prevented from being charged. it can.

  The molded product of the present invention having excellent anti-peeling property and sliding property is a glass that requires high anti-peeling property and stain resistance, such as a glass substrate of a liquid crystal display panel or an organic EL panel. Suitable for handling boards.

  Hereinafter, the present invention will be described in more detail with reference to examples. Analysis and evaluation in the following examples were performed according to the following methods.

(1) Stripping voltage The test piece obtained by injection molding was conditioned at a temperature of 23 ° C. and a humidity of 30% RH for 6 hours or more. The glass plate was washed with isopropyl alcohol and then dried at 110 ° C. for 30 minutes or more. Before the measurement, the glass plate and the test piece were neutralized. At a temperature of 23 ° C. and a humidity of 30% RH, the glass plate was reciprocated by a distance of 3 cm in a state where the test piece was pressed against the glass plate with a load of 2 kg. Thereafter, A. manufactured by Trek Japan KK C. Using a feedback surface potentiometer “MODEL 520-1”, the distance between the detector and the glass plate was set to 5 mm, and the peeling voltage of the glass plate was measured. Measurement was performed 10 times, and an average value was obtained. When the measured value exceeded the measurement limit of 2000V, the average value was calculated as 2000V.

(2) Surface resistivity After the test piece obtained by injection molding was allowed to stand at room temperature for 24 hours, it was subjected to measurement after being conditioned for 6 hours or more at a temperature of 23 ° C. and a humidity of 50% RH. First, a surface resistivity was measured by applying an applied voltage of 100 V with an insulation meter “ULTRA MEGOHMMETER SM-8220” manufactured by TOA DK Corporation. At this time, a 10 mm square copper plate with a thickness of 0.1 ± 0.02 mm was placed between the positive and negative terminals and the test piece surface, and the distance between the copper plates was 10 mm. . The resistance value of the copper plate used here is much smaller than the molded product to be evaluated, and the resistance value derived from it can be ignored. As a result of the measurement, when the surface resistivity was below the measurement limit (5 × 10 ⁵ Ω / □), a low resistivity meter “Loresta AP MCP-T400” manufactured by Mitsubishi Oil Chemical Co., Ltd. was used. Accordingly, the surface resistivity was measured at an applied voltage of 1V. Measurement was performed 5 times, and an average value was obtained.

(3) Coefficient of dynamic friction and coefficient of static friction A glass plate and a test piece obtained by injection molding were set in a Tensilon universal testing machine “RTC-1325A” manufactured by Orientec Corporation. Under a temperature of 20 ° C. and a humidity of 65% RH, a load of 199.4 g was applied to the test piece, and the test piece was moved 50 mm on the surface of the glass plate at a moving speed of 100 mm / min. The resistance force accompanying the movement of the test piece was measured, and the friction coefficient was calculated from the equation: resistance force = friction coefficient × vertical load. The resistance force when the test piece started to slide was measured four times, and the static friction coefficient was obtained from the average value. Moreover, the dynamic friction coefficient was calculated | required from the average value of the resistance force when the test piece was sliding.

(4) Taber wear amount Taber wear amount was measured according to JIS K7204. The wear tester is manufactured by Toyo Tester Kogyo Co., Ltd., the wear wheel is CS17, the load is 1000 g (one arm 500 g), and the rotation speed is 1000 times. As a test piece, a disk-shaped injection molded product having a diameter of 150 mm and a thickness of 3 mm was used. Three measurements were taken and the average value was determined.

Example 1
The raw materials used in this example are as follows.

[Silicone resin (A)]
Silicone resin powder “KMP-590” manufactured by Shin-Etsu Chemical Co., Ltd. It is a powder composed of spherical particles of polyorganosilsesquioxane. The average particle size is 2.0 μm and the particle size distribution is 1 to 4 μm. The resin constituting the particles is substantially composed only of a structural unit represented by “RSiO _1.5 ”.

[Resin (B)]
-Cyclic olefin polymer Ethylene and tetracyclo [4.4.0.1 ^2,5 . A random copolymer (ethylene-TCD-3 random copolymer) with 1 ^7,10 ] -3-dodecene (hereinafter sometimes abbreviated as “TCD-3”). Ethylene content measured by ¹³ C-NMR is 62 mol%, intrinsic viscosity [η] measured in decalin at 135 ° C. is 0.60 dl / g, and glass transition temperature (Tg) is 105 ° C. The MFR (measured at 230 ° C. and 2.16 kg load based on ASTM D1238) is 8.2 g / 10 min. The structural formula of TCD-3 is as follows in the above formula (II): n = 0, m = 1 and R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , In this case, R ¹⁶ , R ¹⁷ and R ¹⁸ are hydrogen atoms.
-Soft copolymer Ethylene-propylene random copolymer "P-0880" manufactured by Mitsui Chemicals, Inc. The ethylene content is 80 mol%, the intrinsic viscosity [η] is 2.5 dl / g, and the glass transition temperature (Tg) is −54 ° C. MFR (measured based on ASTM D1238 at 230 ° C. and 2.16 kg load) is 0.4 g / 10 min, density is 0.867 g / cm ³ , and crystallinity measured by X-ray diffraction method is about 10%. is there.
-Radical initiator "Perhexine 25B" manufactured by NOF Corporation. 2,5-dimethyl-2,5-bis (t-butylperoxy) hexyne-3 is the main component (90% or more). The 1 minute half-life temperature is 194.3 ° C.
・ Polyfunctional compound divinylbenzene.

[Conductive filler (C)]
PAN-based carbon fiber “BETHFITE HTA-C6-UAL1” manufactured by Toho Tenax Co., Ltd. It is a chopped strand having a fiber diameter of 7 μm and a fiber length of 6 mm, and a volume resistivity value of 10 ⁻³ Ω · cm.

  The test piece of this example was produced as follows.

    2 kg of ethylene-TCD-3 random copolymer pellets and 2 kg of ethylene-propylene random copolymer pellets were thoroughly mixed and then melted at a cylinder temperature of 220 ° C. using a twin screw extruder “PCM45” manufactured by Ikekai Tekko Co., Ltd. Blended and pelletized with a pelletizer to obtain “pellet a”.

  4 g of “Perhexine 25B” and 4 g of divinylbenzene were added to 4 kg of the “pellet a” and mixed well. This mixture was put into the above twin screw extruder “PCM45” (cylinder temperature 230 ° C.), melted and kneaded to be reacted, and pelletized with a pelletizer to obtain “pellet b”.

  After sufficiently mixing 4 kg of the above “pellet b” and 16 kg of ethylene-TCD-3 random copolymer pellets, using the above twin screw extruder “PCM45”, melt blended at a cylinder temperature of 220 ° C., and using a pelletizer Pelletization was performed to obtain “pellet c”. The MFR (measured at 230 ° C. under a 2.16 kg load based on ASTM D1238) of the obtained “pellet c” was 4 g / 10 minutes. Moreover, the deflection temperature under load measured with a load of 1.82 MPa based on ASTM D648 was 94 ° C.

  The above-mentioned “pellet c” and PAN-based carbon fiber “Besfight HTA-C6-UAL1” are twin-screw extruded by Plastic Engineering Laboratory Co., Ltd. so that the weight ratio (pellet c / carbon fiber) is 90/10. It was supplied to a machine and melt-kneaded. The twin screw extruder used here is a meshing same direction twin screw extruder, having a screw diameter of 35 mm and L / D of 35. “Pellets c” were charged from the resin composition pellet supply port, and PAN-based carbon fibers were added from the carbon fiber supply port using a weight feeder. The cylinder set temperature was 250 ° C., and melt kneading was performed at a screw rotation speed of about 200 rpm. From the vent hole, it was forcibly devolatilized at a pressure reduced by 0.06 MPa from atmospheric pressure using a vacuum pump. Resin residence time in the extruder was about 3 minutes. A strand obtained by water-cooling the resin discharged from the extruder was cut with a pelletizer to obtain “pellet d”. The content of the conductive filler (C) in the “pellet d” is 11.11 parts by weight with respect to a total of 100 parts by weight of the silicone resin (A) and the resin (B).

  The above “pellet d” and polyorganosilsesquioxane (silicone resin powder “KMP-590”) are manufactured by Nippon Steel Works, Ltd. so that the weight ratio (pellet d / silicone resin) is 95/5. The mixture was supplied to a shaft kneading extruder (screw diameter: 32 mm, L / D = 31.5), and melt kneaded at a resin temperature of 230 ° C. A strand obtained by water-cooling the resin discharged from the extruder was cut with a pelletizer to obtain “pellet e”. The content of the silicone resin (A) in the “pellet e” is 5.52 parts by weight with respect to a total of 100 parts by weight of the silicone resin (A) and the resin (B). The content of the conductive filler (C) is 10.50 parts by weight with respect to a total of 100 parts by weight of the silicone resin (A) and the resin (B).

  The above “pellet e” is supplied to an injection molding machine “ROBSHOT α-50iA” manufactured by FANUC CORPORATION, molded under the conditions of a resin temperature of 240 ° C., a mold temperature of 70 ° C., and a clamping pressure of 50 t, a length of 65 mm, A rectangular test piece having a thickness of 30 mm and a thickness of 2 mm was obtained.

  Using the test pieces thus obtained, the stripping voltage and the surface resistivity were measured according to the above methods. The peeling voltage was measured using a soda lime glass plate (a square with a side of 100 mm, a thickness of 5 mm), and the glass plate was reciprocated once, three times, and three times. The obtained results are shown in Table 1.

Examples 2 and 3
In Example 1, a test piece was prepared and evaluated in the same manner as in Example 1 except that the type of the silicone resin (A) was changed as shown in Table 1. Here, as the crosslinked dialkylpolysiloxane, silicone rubber powder “KMP-597” manufactured by Shin-Etsu Chemical Co., Ltd. was used. The “KMP-597” is a powder composed of spherical particles of crosslinked dimethylpolysiloxane. The average particle size is 5 μm and the particle size distribution is 1 to 10 μm. The resin constituting the particles consists essentially of a structural unit represented by “R ₂ SiO”.

  As the polyorganosilsesquioxane-crosslinked dialkylpolysiloxane composite, silicone composite powder “KMP-600” manufactured by Shin-Etsu Chemical Co., Ltd. was used. The “KMP-600” is a powder made of spherical particles obtained by coating the surface of spherical particles made of crosslinked dimethylpolysiloxane with polyorganosilsesquioxane. The average particle size is 5 μm and the particle size distribution is 1 to 15 μm. The obtained results are summarized in Table 1.

Comparative Example 1
In Example 1, a test piece was prepared and evaluated in the same manner as in Example 1 except that the silicone resin (A) was not blended and molding was performed using “pellet d”. The obtained results are shown in Table 1.

  From the results in Table 1, it can be said that the antistatic property against peeling against the soda lime glass plate is improved when the molded product contains the silicone resin (A). The release antistatic property can be said to be favorable in the order of polyorganosilsesquioxane, polyorganosilsesquioxane-crosslinked dialkylpolysiloxane composite, and crosslinked dialkylpolysiloxane.

Examples 4-7
In Example 1, the material of the glass plate was changed from soda lime glass to alkali-free glass for liquid crystal substrates (the shape and dimensions of the glass plate: a square with a side of 100 mm, a thickness of 0.7 mm), and the inclusion of the silicone resin (A) A test piece was prepared in the same manner as in Example 1 except that the amount was changed as shown in Table 2, and the peeling voltage (the number of reciprocations of the glass plate was 1) and the surface resistivity were measured. In Example 5, the kinetic friction coefficient and the static friction coefficient were further measured using a non-alkali glass plate for a liquid crystal substrate (a square with a side of 100 mm, a thickness of 0.7 mm) according to the above method, and the slidability of the molded product. Evaluated. The obtained results are summarized in Table 2.

Comparative Example 2
In Example 5, a test piece was prepared in the same manner as in Example 5 except that the silicone resin (A) was not blended and was molded using “pellet d”, and the stripping voltage, the surface resistivity, and the dynamic friction coefficient. And the coefficient of static friction was measured. The obtained results are shown in Table 2.

  From the results in Table 2, it can be said that when the molded article contains the silicone resin (A), the antistatic property against peeling with respect to the alkali-free glass is good and the slidability is also good. It can also be seen that, as the content of the silicone resin (A) increases, the antistatic property for peeling improves, but the antistatic property for peeling becomes a peak even when blending a certain amount or more.

Example 8
In Example 5, instead of “pellet d”, pellets of resin composition “e-mateX (registered trademark) FB-GP33” manufactured by Fuji Bakelite Co., Ltd. were used, and Shinetsu Chemical Industry Co., Ltd. was used for 95 parts by weight of the pellets. A test piece was prepared in the same manner as in Example 5 except that 5 parts by weight of silicone resin powder “KMP-590” was blended, and the stripping voltage, surface resistivity, dynamic friction coefficient, and static friction coefficient were measured. Here, “e-mateX (registered trademark) FB-GP33” is a conductive filler (C), PAN-based carbon fiber “Besfight HTA-C6-UAL1” manufactured by Toho Tenax Co., Ltd., and Donac Co., Ltd. pitch. It contains a mixture of system isotropic carbon fiber “Donna Carbo SL-242” and is mixed so that the weight ratio (pellet c / carbon fiber mixture) of the above “pellet c” and the mixture is 85/15. Is. The “Donna Carbo SL-242” has a fiber diameter of 13 μm, a fiber length of 0.37 mm, and a volume resistivity of 10 ² Ω · cm. Furthermore, the Taber abrasion amount was measured according to the above method. The obtained results are shown in Table 3.

Comparative Example 3
In Example 8, a test piece was prepared and evaluated in the same manner as in Example 8 except that the silicone resin (A) was not blended. The obtained results are shown in Table 3.

  From the results of Table 3, even when the molded product having a relatively high surface resistivity, which is an ESD (Electrostatic Discharge) countermeasure product, the antistatic property against peeling with respect to the alkali-free glass is obtained by containing the silicone resin (A). It can be said that the slidability is improved. Moreover, it turns out that the abrasion resistance of a molded article does not fall so much by the mixing | blending of a silicone resin (A).

Claims (13)

  A molded product for handling a glass plate comprising a resin composition containing a silicone resin (A) and a resin (B) other than the silicone resin (A), wherein the molded product is in direct contact with the glass plate, and the silicone resin (A ) Particles are dispersed in the resin (B) matrix.   The molded article according to claim 1, wherein the silicone resin (A) is crosslinked.   The molded article according to claim 2, wherein the silicone resin (A) is polyorganosilsesquioxane or a crosslinked dialkylpolysiloxane.   The molded article according to claim 2 or 3, wherein the proportion of silicon atoms contained in the silicone resin (A) in which three or more oxygen atoms are bonded is 20% or more.   The resin (B) is at least one resin selected from the group consisting of polyolefin, polyamide, polyimide, polyphenylene sulfide, polyoxymethylene, polyester, polystyrene, styrene copolymer, polycarbonate, polyether ether ketone, and fluororesin. The molded article according to any one of claims 1 to 4.   The molded article according to claim 5, wherein the resin (B) is a cyclic olefin polymer.   The molded article according to any one of claims 1 to 6, wherein the resin composition contains 0.1 to 50 parts by weight of the silicone resin (A) with respect to 100 parts by weight of the total of the silicone resin (A) and the resin (B). .   The molded article according to any one of claims 1 to 7, wherein the resin composition further contains a conductive filler (C). The molded article according to any one of claims 1 to 8, which has a surface resistivity of 10 ⁰ to 10 ¹² Ω / □.   The molded product according to any one of claims 1 to 9, which is a molded product for conveying a glass plate.   The molded product according to claim 10, wherein the molded product is at least one molded product for conveying a glass plate selected from the group consisting of a conveyance roller, a vacuum stage, and a vacuum chuck.   The method for producing a molded product according to any one of claims 1 to 11, wherein the molding is performed after melt-kneading the powder of the silicone resin (A) and the resin (B).   A method of handling a glass plate, wherein the glass plate is handled by bringing the glass plate into direct contact with the molded product according to claim 1.