JP2010087521A - Method of manufacturing multi-layer ceramic substrate, and pedestal sheet applied to the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic substrate adapted to continue to use a pedestal sheet as it is, which has been used to fix a ceramic green sheet of a lowest layer to a pedestal in a stacking step, until a cutting step finishes, while ensuring a stacking stability of the ceramic green sheet in the stacking step and a cutting stability of a stack in the cutting step. <P>SOLUTION: In the pedestal sheet with an adhesive layer 110 formed on one side of a base sheet 100, the adhesive layer 110 is formed by applying a composition for an adhesive layer onto one side of the base sheet 100, the composition containing: (A) as a solvent, and (B) as an adhesive, at least one selected from the group consisting of polyvinyl butyral, polyvinyl alcohol, polyacrylate, polymethacrylate, and celluloseacetate; and (C) plasticizer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing a multilayer ceramic substrate and a pedestal sheet used in the production method, and more specifically, in a laminating step of sequentially laminating a plurality of unfired ceramic green sheets to obtain a laminate of unfired ceramic green sheets. Multilayer ceramic substrate manufacturing method capable of improving the manufacturing efficiency and the like while ensuring the stacking stability and the cutting stability in the cutting step of cutting the laminated body of the unfired ceramic green sheets in the stacking direction, and the manufacturing The present invention relates to a pedestal sheet used in the method.

  In general, a multilayer ceramic substrate is used as an LCR composite high-frequency component in the field of mobile communication terminal equipment, and in the field of a computer, an active element such as a semiconductor IC chip and a passive element such as a capacitor, inductor, or resistor. Is used as a composite component or as a simple semiconductor IC package (see Patent Document 1).

  As a method for manufacturing such a multilayer ceramic substrate, for example, there is a method as shown in FIG. First, a raw material is prepared by mixing a glass ceramic powder or the like with a binder and an aqueous or organic solvent, and the prepared raw material is mixed and dispersed using a ball mill or the like to obtain a slurry. Next, the slurry is formed into a green sheet by tape forming, and the formed green sheet is cut into a predetermined size to obtain an unfired ceramic green sheet.

  Next, via holes are formed in the green ceramic green sheet in the punching process, and a wiring pattern is printed on the green ceramic green sheet using a thick film conductor paste or the like in the printing process.

  Next, in the laminating step, a plurality of unfired ceramic green sheets are sequentially laminated to produce a laminated body. In the pressing step, the unfired ceramic green sheet laminate is subjected to, for example, warm isostatic pressing (WIP) : Pressure is integrated by a warm isostatic press) method, and in the cutting step, the laminated body of the unfired ceramic green sheets is cut into a predetermined size in the laminating direction to obtain a laminated piece.

  Next, in the degreasing step (binder removal), organic components such as the binder remaining in the cut laminate pieces are removed (degreasing) by heating or the like, and then the degreased laminate pieces are fired and ceramics in the firing step. And a multilayer ceramic substrate in which the metal wiring is integrated.

  Thereafter, the multilayer ceramic substrate is provided with a surface electrode on the lower surface and / or upper surface thereof, undergoes inspection and measurement, and is finally subjected to a taping process or the like before shipment.

  In such a multilayer ceramic substrate manufacturing method, in the laminating step, a plurality of green sheets are laminated with the via holes and wiring patterns formed in each unfired ceramic green sheet being aligned without shifting (lamination stability). ) Is required. Therefore, conventionally, a pedestal sheet having an adhesive layer formed on one side of the base sheet is fixed to the stacking work table with the adhesive layer facing upward using a technique such as suction or gripping. A plurality of unfired ceramic green sheets are sequentially laminated. According to this, since the lowermost green sheet adheres to the adhesive layer of the pedestal sheet and is fixed to the work table, the subsequent green sheet is aligned with the via hole and wiring pattern on the lowermost green sheet. Sequential lamination can be easily performed.

JP 2001-291955 A (paragraph 0005)

  However, the conventional pedestal seat has the following problems to be solved.

  (1) Since the decomposition temperature of the pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer is high and the pressure-sensitive adhesive cannot be removed in the degreasing step (for example, at 300 to 500 ° C. for 24 to 72 hours in atmospheric pressure), any one before the degreasing step When separating the unfired ceramic green sheet laminate and pedestal sheet at the stage, it is necessary not to leave the adhesive layer on the surface of the laminate (if left, the adhesive will carbonize in the firing process, and the multilayer ceramic Affects the characteristics of the board.) As a result, it takes time to separate the laminate and the pedestal sheet, which hinders improvement in the production efficiency of the multilayer ceramic substrate.

  (2) When the next pressurizing step is performed with the pedestal sheet attached to the lower surface of the unfired ceramic green sheet laminate obtained in the lamination step, the pedestal sheet adheres firmly to the integrated laminate. Therefore, it becomes difficult to separate the integrated laminate and the pedestal sheet, and the adhesive layer is likely to remain on the surface of the laminate, so that the pedestal sheet used in the lamination process is separated from the laminate before the pressing process. Need to be removed. As a result, in the warm isostatic pressurization method of the pressurization process, it is necessary to sandwich a spacer between the laminated body and the support plate (for example, a metal support plate) so that they are not in direct contact with each other. As a result, the pedestal sheet used in the laminating process cannot be used, and it is necessary to prepare a separate spacer for the pressurizing process. This also hinders improvement in the production efficiency of the multilayer ceramic substrate.

  (3) Further, in the cutting step, the integrated laminate is fixed to the cutting work table in order to achieve good cutting of the integrated laminate to a predetermined size with good precision (cutting stability). However, since the pedestal sheet used in the laminating process is separated from the laminate before the pressing process, the pedestal sheet used in the laminating process is also used as a pedestal sheet for the cutting process. Therefore, it is necessary to prepare a pedestal sheet dedicated to the cutting process. This also hinders improvement in the production efficiency of the multilayer ceramic substrate.

  (4) The conventional pedestal sheet contains a foaming agent in the adhesive layer, and when separating the pedestal sheet and the laminate, the adhesive force of the adhesive layer is reduced by foaming the foaming agent by heating or the like. In some cases, the pedestal sheet is easily separated from the laminate. In such a pedestal sheet, traces of foaming of the adhesive layer remain on the surface of the laminate after the pedestal sheet is separated (see FIG. 2).

  (5) Some conventional pedestal sheets have an adhesive layer thickness of 25 μm or more. In such a pedestal sheet, the pressure-sensitive adhesive layer easily shakes, and there is a possibility that lamination stability and cutting stability are impaired.

  The object of the present invention is to solve these problems, and sequentially laminate a plurality of unfired ceramic green sheets to obtain a laminated body of unfired ceramic green sheets. It is to provide a manufacturing method of a multilayer ceramic substrate and a pedestal sheet used in the manufacturing method that can improve the manufacturing efficiency while ensuring the cutting stability in the cutting process of cutting the laminate of green sheets in the stacking direction. .

  Another object of the present invention is to provide a surface electrode on the lower surface and / or upper surface of the laminate through a conventional process without a separate printing process (surface electrode wiring pattern printing process: see FIG. 16). It is to form a wiring pattern.

  One aspect of the present invention is a method for manufacturing a multilayer ceramic substrate, wherein a base sheet having an adhesive layer formed on one side of a base sheet is fixed to a work table with the adhesive layer facing upward, and the adhesive layer is formed on the adhesive layer. A laminating step of sequentially laminating a plurality of unfired ceramic green sheets, and a warm isotropic pressure method with a base sheet attached to the lower surface of the obtained unfired ceramic green sheets A pressing step for pressing and integrating by means of a step, and fixing the pedestal sheet adhering to the lower surface of the laminated body of the unfired ceramic green sheets to the work table to fix the integrated stack to the work table In this state, a cutting step of cutting the integrated laminate into a predetermined size in the stacking direction, a separation step of separating the cut laminate piece from the pedestal sheet, and an organic component remaining in the separated laminate piece The A degreasing step to leave, and a firing step to fire the degreased laminate, and the adhesive layer of the pedestal sheet comprises (A) a solvent, (B) a polyvinyl butyral, polyvinyl alcohol, and a polyacrylate as an adhesive. The adhesive layer composition containing at least one selected from the group consisting of polymethacrylate and cellulose acetate, and (c) a plasticizer, is formed by being applied to one side of a base sheet. A method for manufacturing a multilayer ceramic substrate.

  Another aspect of the present invention is a pedestal sheet used in a method for producing a multilayer ceramic substrate, wherein an adhesive layer is formed on one side of a base sheet, and the adhesive layer is used as (A) a solvent and (B) an adhesive. An adhesive layer composition containing at least one selected from the group consisting of polyvinyl butyral, polyvinyl alcohol, polyacrylate, polymethacrylate, and cellulose acetate, and (c) a plasticizer is applied to one side of the base sheet. It is a base sheet used for the manufacturing method of the multilayer ceramic substrate characterized by the above-mentioned.

  According to these configurations, since the (B) pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer is at least one of polyvinyl butyral, polyvinyl alcohol, polyacrylate, polymethacrylate, and cellulose acetate, these are those of the multilayer ceramic substrate. It is the same kind of compound as the binder used for the first raw material preparation in the manufacturing method. That is, this (B) pressure-sensitive adhesive can be removed in the degreasing step (for example, at atmospheric pressure, 300 to 500 ° C., 24 to 72 hours) as with the binder. Therefore, even when the base sheet and the laminate (piece) are separated, even if the adhesive layer remains on the lower surface of the laminate (piece) (see FIG. 3), the (B) adhesive contained in the adhesive layer is In the degreasing process, it is surely removed.

  Therefore, it is not necessary to separate the pedestal sheet used in the laminating process from the laminated body before the pressurizing process, and the pressurizing process and the cutting process can be performed with the pedestal sheet attached to the lower surface of the laminated body. It becomes possible. As a result, in the warm isostatic pressing method of the pressurizing step, the pedestal sheet used in the laminating step can also be used as a spacer sandwiched between the laminate and the support plate. In the cutting process, the pedestal sheet used in the laminating process can also be used as a pedestal sheet for fixing the laminate to the cutting work table. Thereby, the manufacturing efficiency of the multilayer ceramic substrate is improved.

  And even if the adhesive layer remains on the lower surface of the laminate piece when the laminate piece and the pedestal sheet are separated in the separation step after the cutting step, the adhesive (B) contained in the remaining adhesive layer is a degreasing step Therefore, the characteristics of the multilayer ceramic substrate are not affected. Further, it is not necessary to take time to separate the laminate (piece) and the pedestal sheet so that the adhesive layer does not remain on the surface of the laminate, and this also improves the production efficiency of the multilayer ceramic substrate. .

  Further, since the pedestal sheet is used in both the lamination process and the cutting process, the lamination stability in the lamination process and the cutting stability in the cutting process are ensured.

  In addition, since the adhesive layer is not foamed to separate the pedestal sheet and the laminate, the adhesive layer does not leave foam marks on the surface of the laminate after the pedestal sheet is separated.

  In this invention, the composition for adhesion layers contains 100 mass parts of (A) solvents, (B) 5-30 mass parts of adhesives, and (C) 1-10 mass parts of plasticizers, for example. The adhesive effect is sufficiently exhibited, the viscosity of the adhesive layer composition is appropriate, and the adhesive layer composition is preferably applied to one side of the base sheet.

Moreover, in this invention, it is 0.001-0.5 g / cm < ² > that the application quantity to the base sheet of the composition for adhesion layers is 0.001-0.5 g / cm < ² >, and the adhesion effect is fully exhibited, It is preferable from the viewpoints that the thickness does not become excessively thick, the shaking of the adhesive layer is suppressed, and the lamination stability and cutting stability are maintained.

  In the present invention, the adhesive layer composition further includes, for example, (D) a colorant, so that it can be easily determined on which side of the base sheet the adhesive layer is formed. To preferred.

  In the present invention, the thickness of the pressure-sensitive adhesive layer is, for example, 5 μm or less. The thickness of the pressure-sensitive adhesive layer does not become excessively thick, the vibration of the pressure-sensitive adhesive layer is suppressed, and lamination stability and cutting stability are maintained. It is preferable from the point of being.

  In the present invention, the wiring pattern for the surface electrode of the multilayer ceramic substrate may be printed on the upper surface of the adhesive layer.

  According to this configuration, when the lowermost green sheet is adhered on the adhesive layer in the laminating step, the surface electrode wiring pattern contacts the lower surface of the green sheet, and the base sheet and the laminate are separated in the separating step. Is separated, the surface electrode wiring pattern is transferred to the lower surface of the lowermost green sheet. As a result, the surface electrode wiring pattern can be formed on the lower surface of the multilayer body through only the conventional process without separately performing a dedicated printing process (surface electrode wiring pattern printing process: see FIG. 16).

  In addition, in the laminating step, after the unfired ceramic green sheet laminate is completed, when the pedestal sheet is placed with the adhesive layer facing down on the top surface of the uppermost green sheet, When the electrode wiring pattern comes into contact and the pedestal sheet and the laminate are separated in the separation step, the surface electrode wiring pattern is transferred to the upper surface of the uppermost green sheet. As a result, the surface electrode wiring pattern can be formed on the upper surface of the multilayer body only through the conventional process without separately performing a dedicated printing process (surface electrode wiring pattern printing process: see FIG. 16).

  In these cases, the adhesive layer is preferably formed on one side of the base sheet via the release layer.

  According to this configuration, when the pedestal sheet and the laminate are separated in the separation step, the adhesive layer is easily separated from the base sheet, and the adhesive layer and the surface electrode wiring pattern are easily moved to the laminate. In addition, transferability of the surface electrode wiring pattern to the laminate is improved.

  ADVANTAGE OF THE INVENTION According to this invention, the improvement of the manufacturing efficiency of a multilayer ceramic substrate, etc. are achieved, ensuring the lamination stability in a lamination process, and the cutting stability in a cutting process.

It is the whole process figure of the manufacturing method of a multilayer ceramic substrate. It is explanatory drawing of the problem of the conventional base sheet (adhesion layer foaming type). It is explanatory drawing of the characteristic of the base seat of this invention. It is sectional drawing which shows the structure of the base sheet which concerns on the 1st Embodiment of this invention. It is explanatory drawing of a specific example of the composition ratio of the slurry before tape shaping | molding. It is explanatory drawing of a specific example of the composition ratio of the unbaking ceramic green sheet with which a lamination process is provided. It is explanatory drawing of the relationship between the content of a plasticizer, and the glass transition temperature of an adhesive. It is a drawing substitute photograph replacing the perspective view of the pedestal sheet of the present invention. It is sectional drawing which shows the structure of the base sheet which concerns on the 2nd Embodiment of this invention by which the wiring pattern for surface electrodes was printed on the upper surface of the adhesion layer. It is a drawing substitute photograph which replaces explanatory drawing of the characteristic of the unbaking ceramic green sheet laminated body produced using the base sheet of this invention. It is explanatory drawing of the specific example (PET film lower surface lamination | stacking system) of a lamination process. It is explanatory drawing of the concrete other example (PET film upper surface lamination | stacking system) of a lamination process. It is explanatory drawing of the problem of the conventional base sheet (adhesive tape) used at a cutting process. When the laminate is cut in the laminating direction in the cutting process using the pedestal sheet of the present invention, (a) a photograph substituted for a drawing instead of an explanatory diagram showing that the laminate can be cut well vertically, and (b) exactly in line with the cutting instruction line It is a drawing substitute photograph replacing the explanatory drawing of being able to cut | disconnect. (A) Drawing substitute photograph replacing the enlarged view showing the state where the surface electrode wiring pattern is printed on the upper surface of the adhesive layer of the base sheet of the present invention, (b) The surface electrode wiring pattern on the surface of the unfired ceramic green sheet It is a drawing substitute photograph which replaces the enlarged view which shows the printed state. It is a process figure in the case of passing through the printing process of the surface electrode wiring pattern in order to form the surface electrode wiring pattern in the upper surface and / or lower surface of a laminated body. It is explanatory drawing that the wiring pattern for surface electrodes of mirror image symmetry is required by the upper surface and lower surface of a laminated body. FIG. 5 is a process diagram in the case of forming a surface electrode wiring pattern on the upper surface and / or the lower surface of a laminated body without going through a surface electrode wiring pattern printing process.

<First Embodiment>
In the first embodiment, as shown in FIG. 4, the base sheet used in the method for manufacturing a multilayer ceramic substrate has an adhesive layer (reference numeral 110) formed on one side of a base sheet (reference numeral 100). It is a configuration. And the said adhesion layer is formed when the composition for adhesion layers containing (A) solvent, (B) adhesive, and (c) plasticizer was apply | coated to the single side | surface of a base sheet.

  In the first embodiment, the method for manufacturing a multilayer ceramic substrate includes fixing the pedestal sheet having an adhesive layer formed on one side of a base sheet to a work table with the adhesive layer facing upward, Laminating step of sequentially laminating a plurality of unfired ceramic green sheets on top, and warm isostatic pressing of the obtained unfired ceramic green sheet laminate with a pedestal sheet attached to the lower surface of the laminate A pressure process for pressurizing and integrating by a pressure method, and fixing the pedestal sheet attached to the lower surface of the laminated body of the unfired ceramic green sheets to the work table, In this state, the integrated laminate is cut into a predetermined size in the stacking direction, the separation step of separating the cut laminate piece from the pedestal sheet, and the separated laminate piece remains A degreasing step of removing the machine component, and a firing step of firing the degreased laminate piece.

  For example, as described above with reference to FIG. 1, first, a glass ceramic powder or the like is mixed with a binder and an aqueous or organic solvent to prepare a raw material, and the prepared raw material is mixed using a ball mill or the like. Disperse to obtain a slurry. Next, the slurry is formed into a green sheet by tape forming, and the formed green sheet is cut into a predetermined size to obtain an unfired ceramic green sheet. Next, via holes are formed in the green ceramic green sheet in the punching process, and a wiring pattern is printed on the green ceramic green sheet using a thick film conductor paste or the like in the printing process. Next, in the laminating step, a plurality of unfired ceramic green sheets are sequentially laminated to produce a laminate, and in the pressurizing step, the unfired ceramic green sheet laminate is subjected to a warm isostatic pressing method (WIP). In the cutting step, the laminated body of the unfired ceramic green sheets is cut into a predetermined size in the laminating direction to obtain a laminated body piece. Next, in the degreasing step, after removing organic components such as binder remaining in the cut laminate pieces by heating or the like (for example, treatment conditions at 300 to 500 ° C. for 24 to 72 hours in atmospheric pressure) In the firing step, the degreased laminate is fired to obtain a multilayer ceramic substrate in which the ceramic and the metal wiring are integrated. Thereafter, the multilayer ceramic substrate is provided with a surface electrode on the lower surface and / or upper surface thereof, undergoes inspection and measurement, and is finally subjected to a taping process or the like before shipment.

  In the present embodiment, the (A) solvent may be an aqueous solvent or an organic solvent. Examples of the organic solvent include alcohols such as methanol, ethanol, 2-propanol, 1-butanol and 1-hexanol; ketones such as acetone and 2-butanone; aliphatic hydrocarbons such as pentane, hexane and heptane; benzene, And aromatic hydrocarbons such as toluene, xylene, and ethylbenzene; and acetates such as methyl acetate, ethyl acetate, and butyl acetate; These may be used alone or in combination of two or more. Further, a mixture of an aqueous solvent and an organic solvent may be used. The amount of the solvent used is preferably such an amount that the composition has a viscosity suitable for application when the adhesive layer composition is applied to one side of the base sheet. From such a viewpoint, the preferable amount of the solvent used is preferably such that the viscosity of the adhesive layer composition is 1 Pa · s to 50 Pa · s, and more preferably 1 Pa · s to 20 Pa · s.

  In this embodiment, the same type of compound as the binder used for the first raw material preparation in the manufacturing method of a multilayer ceramic substrate is used for (B) adhesive. For example, ethylene copolymer, styrene copolymer, acrylate copolymer, methacrylate copolymer, vinyl acetate copolymer, maleic acid copolymer, vinyl butyral resin, vinyl acetal resin, Vinyl formal resins, vinyl alcohol resins, waxes such as paraffin wax, celluloses such as ethyl cellulose, and the like can be preferably used. In particular, polyvinyl butyral, polyvinyl alcohol, polyacrylate, polymethacrylate and cellulose acetate can be used more preferably. Among these, polyvinyl butyral (PVB) is more preferable. However, these may be used alone or in combination of two or more. Since these (B) adhesives are the same type of compounds as the binder used for the initial raw material preparation in the manufacturing method of a multilayer ceramic substrate, they are degreasing processes (for example, 300-500 degreeC, 24-72 in atmospheric pressure). Time), it can be removed in the same manner as the binder. Therefore, even when the base sheet is separated from the laminate (piece), even if the adhesive layer containing these (B) adhesives remains on the surface of the laminate (piece), it is included in the adhesive layer (B). An adhesive will be removed favorably in a degreasing process.

  In the present embodiment, (C) plasticizer is preferably, for example, sucrose acetate isobutyrate (SAIB), diisodecyl phthalate, dibutyl phthalate, glycerin and the like. These may be used alone or in combination of two or more. These are also preferably the same type of compounds as the plasticizer used for the initial raw material preparation in the method for producing a multilayer ceramic substrate.

  In the present embodiment, the base sheet is preferably made of resin, for example, PET, polypropylene, and the like are preferable. The thickness is preferably about 0.3 to 1.5 mm, and it is important to select one that does not dissolve in the solvent for the adhesive layer composition.

  In this embodiment, the composition for adhesion layers can contain a various additive as needed other than the said (A) solvent, (B) adhesive, and (c) plasticizer. However, in the degreasing step (for example, in atmospheric pressure, 300 to 500 ° C., 24 to 72 hours), it is preferable to use a material that can be removed in the same manner as the binder. Examples of the additive include a dispersion accelerator, a surfactant, and an antifoaming agent. As will be described later, it is preferable to further contain (D) a colorant from the viewpoint of easily determining which side of the base sheet the adhesive layer is formed.

  In the present embodiment, the thickness of the pressure-sensitive adhesive layer is, for example, 5 μm or less, preferably 3 μm or less, more preferably 2 μm or less. From the standpoint of maintaining lamination stability and cutting stability.

  On the other hand, the ceramic green sheet can be obtained by forming a raw material mixture into a sheet and drying it. The raw material mixture is prepared by mixing ceramic particles, a solvent, and a binder.

  The material of the ceramic particles used in the present embodiment is not particularly limited. For example, metal oxides such as aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, cerium oxide, chromium oxide; complex oxides such as cordierite, β sponge sponge, aluminum titanate, mullite, spinel; silicon carbide, etc. Examples thereof include metal carbides; metal nitrides such as aluminum nitride and boron nitride; transition metal oxides such as nickel oxide and iron oxide; perovskite structure oxides such as lanthanum manganate, lanthanum cobaltite and lanthanum chromite. Moreover, it is arbitrary whether these 1 type illustrated is used for a ceramic particle material, or 2 or more types are mixed and used for a ceramic particle material.

  There is no restriction | limiting in the kind of binder, A well-known organic binder can be selected suitably and can be used. Examples of organic binders include ethylene copolymers, styrene copolymers, acrylate copolymers, methacrylate copolymers, vinyl acetate copolymers, maleic acid copolymers, vinyl butyral resins, Examples thereof include vinyl acetal resins, vinyl formal resins, vinyl alcohol resins, waxes such as paraffin wax, and celluloses such as ethyl cellulose. Preferably, it is a (meth) acrylate copolymer having thermoplasticity and a number average molecular weight of 5,000 to 250,000 (more preferably 10,000 to 100,000). The (meth) acrylate copolymer is obtained by roughening the surface of the ceramic green sheet; binder removal when the ceramic green sheet is heated at 200 ° C. to 500 ° C .; moldability, punching workability, strength of the ceramic green sheet, Good suppression of variation in shrinkage during degreasing and sintering.

  The usage-amount of the binder with respect to 100 mass parts of ceramic particles is good in it being 5 mass parts-30 mass parts, Preferably it is 10 mass parts-20 mass parts. When the amount of the binder used is insufficient, the formability of the ceramic green sheet is deteriorated and the strength and flexibility are insufficient. On the other hand, when the amount used is too large, there is a problem that it is difficult to control the viscosity of the raw material mixture, and the ceramic sheet size variation due to severe decomposition and release of the binder component from the ceramic green sheet during degreasing and sintering. The problem that it becomes large and the problem that carbon which is a binder residue easily remains on the ceramic sheet easily occur.

  In addition to the ceramic particles, the solvent, and the binder, the raw material mixture can contain additives as necessary. Additives for raw material mixture include polymer electrolytes such as polyacrylic acid and ammonium polyacrylate; organic acids such as citric acid and tartaric acid; α-olefin and maleic anhydride to promote peptization and dispersion of ceramic particles A partial ester of a copolymer with isobutylene or a copolymer of styrene and maleic anhydride; an ammonium salt or an amine salt of the copolymer; a copolymer of butadiene and maleic anhydride and an ammonium salt thereof A dispersant; As other additives, phthalates such as dibutyl phthalate and dioctyl phthalate for imparting flexibility to ceramic green sheets; plasticizers composed of glycols such as propylene glycol and glycol ethers; surface activity Agents; antifoaming agents; and the like.

  The raw material mixture is prepared by mixing appropriate amounts of the respective components. At that time, for the purpose of pulverizing the particles or making the particle size of the particles uniform, the particles may be mixed using a ball mill or the like. In addition, in mixing, the order of addition of each component is not particularly limited, and a conventional method may be followed.

  The ceramic green sheet is produced by removing the solvent from the raw material mixture after forming the raw material mixture into a sheet by a conventional method such as a doctor blade method or an extrusion molding method. The removal of the solvent here is a simple method of drying the raw material mixture. The drying conditions are not particularly limited, and may be dried at a constant temperature of, for example, room temperature to 150 ° C., and the raw material mixture atmosphere is sequentially heated to 50 ° C., 80 ° C., 120 ° C. and dried. May be.

  The obtained ceramic green sheet may be wound and collected without being cut as it is, or may be punched or cut into an appropriate size by any method. The shape of the ceramic green sheet at the time of punching or cutting may be any of a circle, an ellipse, a square, a square with R (R), etc., and the same circle, ellipse, square, R in these sheets. It may have one or two or more holes such as a square having a shape. Further, the sheet thickness is not particularly limited, but can be, for example, about 50 μm to 1000 μm.

  The composition ratio (mass%) of the slurry after ball milling and before tape molding shown in FIG. 1 is 51.15% for ceramic, 1.07% for surfactant, and solvent A as shown in FIG. (For example, water) is 25.06%, solvent B (for example, ethanol) is 17.39%, PVB (polyvinyl butyral) as a binder is 4.09%, and a plasticizer is 1.23%. When this slurry is made into a green sheet by tape forming and made into an unfired ceramic green sheet by cutting the sheet, most of the solvent component contained in the slurry is volatilized. The composition ratio (mass%) of the unfired ceramic green sheet used in the lamination process when the solvent component is completely volatilized is, for example, 88.89% for ceramic and 1 for surfactant as shown in FIG. .87%, PVB is 7.11%, plasticizer is 2.13%, and the like. Therefore, a general unfired ceramic green sheet contains about 6 to 8% of PVB, and contains about 30 parts by mass of a plasticizer for imparting plasticity to the green sheet with respect to 100 parts by mass of PVB (2 .13 / 7.11 = about 30%).

  The composition for an adhesive layer according to this embodiment approximates the composition ratio of the slurry, (A) 100 parts by mass of the solvent, (B) 5-30 parts by mass of the adhesive corresponding to the binder, (C) 1 to 10 parts by mass of a plasticizer is contained. Thereby, it is easy to obtain advantages such that the adhesive effect is sufficiently exhibited, the viscosity of the adhesive layer composition is appropriate, and the adhesive layer composition is easily applied to one side of the base sheet. (A) Content of (B) adhesive with respect to 100 mass parts of solvent becomes like this. More preferably, it is 10-25 mass parts, More preferably, it is 15-20 mass parts. (A) Content of (C) plasticizer with respect to 100 mass parts of solvent becomes like this. More preferably, it is 3-8 mass parts, More preferably, it is 5-6 mass parts.

Moreover, as for the composition for adhesion layers which concerns on this embodiment, it is the thickness of the adhesion layer that the adhesion effect is fully exhibited that the application quantity to a base sheet is 0.001-0.5 g / cm < ² >. Is preferable from the viewpoints that the thickness of the adhesive layer does not become excessively thick, the shaking of the adhesive layer is suppressed, and the lamination stability and cutting stability are maintained. The amount of the adhesive layer composition applied to the base sheet is more preferably 0.005 to 0.3 g / cm ² , and still more preferably 0.01 to 0.1 g / cm ² .

  As shown in FIG. 7, the plasticizer has a function of adjusting the glass transition temperature (Tg) of an adhesive such as PVB. As the plasticizer decreases, the glass transition temperature of the pressure-sensitive adhesive increases, and as the plasticizer increases, the glass transition temperature of the pressure-sensitive adhesive decreases. In consideration of this, it is also preferable to select the content of the plasticizer (C).

  Since the base sheet according to the present embodiment includes polyvinyl butyral, which is the same compound as the binder contained in the ceramic green sheet, in the adhesive layer, as shown in FIG. Even if the adhesive layer of the pedestal sheet remains on the surface of the laminate after completion, the residual adhesive layer is the same as the organic components such as the binder remaining in the laminate in the degreasing step after the separation step. It will be pyrolyzed. Therefore, while ensuring the lamination stability of the ceramic green sheet by using the pedestal sheet in the lamination process and the cutting stability of the laminate by using the pedestal sheet in the cutting process, the lowermost ceramic green sheet is used as the work table in the lamination process. It becomes possible to continue using the pedestal sheet used for fixing until the cutting process is completed.

  Further, in the base sheet according to the present embodiment, since a transparent adhesive layer such as PVB is formed, in order to easily determine which side of the base sheet the adhesive layer is formed, the adhesive layer (D) It is preferable to further contain a colorant. As the colorant, inorganic pigments, organic pigments, and dyes can be used, and organic pigments are particularly preferable. Although content of a coloring agent is based also on the kind and color of a coloring agent, it is 3 mass parts or less with respect to 100 mass parts adhesive, More preferably, by containing a coloring agent of 2 mass parts or less, for example. The adhesive layer is colored so as to be sufficiently distinguishable.

  In the pedestal sheet according to the present embodiment, as shown in FIG. 8, the adhesive layer is uniformly applied on one side of the base sheet with a thickness of 5 μm or less and dried to form a very thin and flexible resin coating. .

  Further, in the pedestal sheet according to the present embodiment, the thickness of the adhesive layer is such that the adhesive layer of the conventional adhesive layer foam type pedestal sheet or a conventional adhesive tape described later (“Intellimer (registered trademark)” tape or the like) is used. Compared to the thickness of the adhesive material layer being 25 μm or more, it is as thin as 5 μm or less, so the vibration of the adhesive layer is suppressed, and the ceramic green sheet is difficult to shift in the lamination process (for example, with respect to the work table), In the cutting process, the integrated laminate becomes difficult to shift (for example, with respect to the work table), and it is possible to further secure the ceramic sheet lamination stability in the lamination process and the cutting stability of the integrated laminate in the cutting process. It becomes possible.

  In the present embodiment, the adhesive layer 110 of the pedestal sheet is formed on the non-coated surface (see FIG. 4 and FIG. 9 for comparison) where the release layer 100a (see FIG. 9) is not provided. It is formed by coating (this first embodiment is FIG. 4). When the release layer 100a (see FIG. 9) is applied and formed on the coating surface, the adhesive layer generally tends to be displaced from the base sheet. Therefore, in this embodiment, since the adhesive layer is formed on the non-coating surface where the release layer 100a is not provided, the adhesive layer is difficult to be displaced from the base film. The green sheet becomes difficult to shift, and the integrated laminate becomes difficult to shift in the cutting process, and it is possible to further secure the lamination stability of the ceramic green sheet in the lamination process and the cutting stability of the integrated laminate in the cutting process. It becomes.

  In the pedestal sheet according to the present embodiment, the pressure-sensitive adhesive layer such as PVB in the pressure-sensitive adhesive layer is thermally cured to have a relatively solidified characteristic. As a result, in the cutting process, when the integrated laminate is cut with a blade (see FIG. 3), the solidified adhesive layer formed on the non-coated surface of the base sheet is physically disassembled and separated. The separability from the integrated laminate is improved.

  The pedestal sheet according to the present embodiment adheres to the lower surface of the lowermost ceramic green sheet in the lamination step, and the adhesive layer containing PVB or the like favorably fixes the base sheet and the lowermost ceramic green sheet. As illustrated in FIG. 10, it is possible to satisfactorily laminate a plurality of unfired ceramic green sheets without causing a phenomenon that an internal circuit (wiring pattern) printed and formed using a thick film conductor paste is shifted. .

  In general, the laminating step in the method for manufacturing a multilayer ceramic substrate is more specifically performed in the following manner. The first method is a PET (polyethylene terephthalate) film lower surface lamination method as shown in FIG. That is, the green sheet is directly adsorbed to the press with the PET film positioned on the lower surface of the ceramic green sheet. The PET film is a carrier film that supports the slurry in the tape molding method, supports the slurry until it dries, and supports the sheet cutting, punching, or printing process in the subsequent process.

  Next, the PET film on the lower surface of the ceramic green sheet is removed. Next, when the press machine descends, the adsorbed green sheet is thermocompression bonded to the green sheet already laminated below. That is, a base sheet having an adhesive layer formed on one side of the base sheet is fixed to the laminating work table with the adhesive layer facing upward by using a technique such as suction or gripping, and a plurality of sheets are placed on the base sheet. The green ceramic green sheets are sequentially laminated. This method is preferably applied to, for example, a product having an MLCC (multilayer ceramic capacitor) structure in which a via hole or the like is not formed in a ceramic green sheet.

  As shown in FIG. 12, the second method is a PET film upper surface lamination method. That is, the green sheet is adsorbed to the press machine via the PET film in a state where the PET film is positioned on the upper surface of the ceramic green sheet. Next, when the press machine descends, the adsorbed green sheet is thermocompression bonded to the green sheet already laminated below. That is, a base sheet having an adhesive layer formed on one side of the base sheet is fixed to the laminating work table with the adhesive layer facing upward by using a technique such as suction or gripping, and a plurality of sheets are placed on the base sheet. The green ceramic green sheets are sequentially laminated. Next, the PET film on the upper surface of the ceramic green sheet is removed. This method is preferably applied to a product such as a laminated circuit product or a module in which a via hole or the like is formed in a ceramic green sheet, for example.

  In these systems, PVB or the like, which is a binder contained in the ceramic green sheet, is activated under high temperature and high pressure, and an adhesive force is generated between the green sheets, whereby the green sheets can be bonded to each other.

  Next, the pressurizing step in the method for manufacturing a multilayer ceramic substrate is generally performed in the following manner. That is, since the unfired ceramic green sheet laminate obtained in the lamination step is only uniaxially pressed in the vertical direction, the adhesive force between the green sheets is still relatively weak. Therefore, in the pressurization step, warm isostatic pressurization (WIP: warm isostatic) is used to ensure that the entire ceramic green sheet of the laminate is firmly bonded from all directions with uniform pressure (isotropic pressure). The sheet laminate is additionally pressure-molded and integrated by a press method.

  In the WIP system, a heated fluid or liquid such as warm water is used as a pressure medium, and a high pressure isotropic pressure is applied to the sheet laminate through this pressure medium, so that the laminated green sheets are brought to equal pressure from all directions. It is to be crimped.

  In the WIP method, first, a sheet laminate is placed on a support plate (for example, a metal support plate). At this time, a spacer such as a PET film is sandwiched between the sheet laminated body and the metal support plate so that they are not in direct contact with each other. Next, this is put in a resin bag for vacuum packaging, vacuum packaged, and the resin bag is put in a pressure vessel. The pressure vessel is sealed, and the pressure vessel is immersed in a hot water tank filled with water heated to 60 to 80 ° C. In this state, the internal pressure of the pressure vessel is increased and maintained at a pressure of 25 to 35 MPa for several minutes to several tens of minutes. Then, the internal pressure of the pressure vessel is released, the resin bag is taken out of the pressure vessel, and the sheet is laminated from the resin bag. Remove body.

  In such a pressurized environment, if the pedestal sheet used in the previous laminating step is left attached to the sheet laminate, the pedestal sheet adheres firmly to the integrated laminate, and the pedestal sheet As described above, the base sheet used in the laminating process is separated from the sheet laminate before the pressurizing process because it becomes difficult to separate from the integrated laminate and the adhesive layer tends to remain on the surface of the laminate. It has been customary to remove them.

  Next, the cutting step in the method for manufacturing a multilayer ceramic substrate is generally performed in the following manner. That is, the integrated laminated body obtained in the pressurizing step has a shape of a multilayer electronic component called a multilayer ceramic substrate only when it is precisely cut into a minute size. In recent years, chip sizes as small as 0603 (0.6 mm × 0.3 mm) and 0402 (0.4 mm × 0.2 mm) have been required. In the case of such a micro-sized product, the product value is lost if the integrated laminate is displaced in the cutting process. Therefore, in order to achieve cutting stability, the lower surface of the integrated laminate is supported and a cutting work table is provided. The selection of the pedestal seat to be fixed to is very important.

  In general, in the cutting process, a pedestal sheet capable of supporting an integrated laminated body integrated in the pressurizing process is provided on a cutting work table made in a porous shape, and integrated lamination is performed on the pedestal sheet. The body is attached and fixed. The pedestal sheet on the work table is sucked or held and fixed to the work table through the hole of the work table. And in this state, an integrated laminated body is heated to the temperature of 50 degreeC or more so that the cutter for a cutting | disconnection advances smoothly. Therefore, the pedestal sheet that supports the laminate must be capable of stably adhering and fixing the laminate even at a temperature of 50 ° C. or higher (in the pedestal sheet of the present invention, the plasticizer contained in the adhesive layer is contained). This requirement is achieved by adjusting the glass transition temperature of the adhesive as a function of the amount). In addition, the cutting blade cuts the laminated body by repeatedly accelerating and decelerating, but it must not cut the laminated body alone and damage the pedestal sheet. And if cutting is completed, a base sheet and a laminated body will be removed from a work bench | platform, and the cut | disconnected laminated body piece will be removed from a base sheet, and will be isolate | separated.

  Conventionally, in such a cutting process, an adhesive tape called “Intellimer (registered trademark)” tape is sometimes used as a base sheet. This adhesive tape has a configuration in which a heat-variable adhesive substance having a characteristic that adhesive strength increases at a switching temperature or higher, adhesive performance increases, adhesive strength decreases below the switching temperature, and becomes easy to peel off is applied to the base sheet. It has the feature that it can be reused multiple times.

  However, as shown in FIG. 13, when the cut laminate piece is removed from the “Intellimer (registered trademark)” tape, there is a problem that the uneven shape of the heat-variable adhesive substance remains on the surface of the laminate piece. In addition, since the thickness of the heat-variable adhesive substance layer is 25 μm or more, there is also a problem that the laminated body is liable to be displaced when the laminated body is cut, and the cutting stability is lowered.

  As described above, in the conventional method for producing a multilayer ceramic substrate, the pedestal sheet used for the lamination stability in the lamination process must be removed from the sheet laminate before the pressure process. In the isostatic pressing (WIP) method, a special spacer must be used to place the sheet laminate on the metal support plate, and a special pedestal sheet must be used for cutting stability in the cutting process. There was a problem such as having to.

  In the pressurizing step, the base sheet according to the present embodiment can maintain a good adhesive relationship with the sheet laminate while remaining attached to the lower surface of the lowermost green sheet. Therefore, for example, in the WIP method, the pedestal sheet attached to the sheet laminate can also be used as a spacer, and the sheet laminate attached to the pedestal sheet can be placed on the metal support plate as it is.

  And in the state where the pedestal sheet according to the present embodiment remains attached to the laminate, the pedestal sheet used in the lamination process can be used as the pedestal sheet for the cutting process in the cutting process, so that the cutting stability is improved. As shown in FIG. 14A, a vertical cut surface can be obtained satisfactorily. Further, as shown in FIG. 14 (b), the laminated body can be cut accurately in line with the cutting instruction line without causing a phenomenon of deviation.

  In the method for manufacturing a multilayer ceramic substrate according to the present embodiment, a pedestal sheet having an adhesive layer formed on one side of a base sheet is fixed to a work table with the adhesive layer facing upward, and a plurality of uncoated sheets are placed on the adhesive layer. A laminating step of sequentially laminating fired ceramic green sheets, and pressurizing the obtained unfired ceramic green sheet laminate by a warm isostatic pressing method with a base sheet attached to the lower surface of the laminate The integrated laminated body is fixed to the work table by fixing the pressure sheet to be integrated and the pedestal sheet adhering to the lower surface of the integrated unfired ceramic green sheet laminate to the work table. Cutting the integrated laminate into a predetermined size in the stacking direction, separating the cut laminate pieces from the base sheet, and removing organic components remaining in the separated laminate pieces In the case of having a degreasing step and a firing step of firing the degreased laminate piece, in the laminating step, a pedestal sheet according to the present embodiment is used, and a plurality of ceramic green sheets are provided on the adhesive layer of the pedestal sheet. After the layers are stacked, the pedestal sheet does not have to be separated from the stacked body until the cutting step is completed.

  That is, the pedestal sheet according to the present embodiment includes, in its adhesive layer, polyvinyl butyral, which is the same type of compound as the binder contained in the unfired ceramic green sheet, as an adhesive, as shown in FIG. Even if the adhesive layer of the pedestal sheet remains on the surface of the laminate piece after the cutting process is completed, the remaining adhesive layer is an organic component such as a binder remaining in the laminate in the degreasing process after the cutting process. As is the case with thermal decomposition. Therefore, the process of cutting the pedestal sheet used to fix the ceramic sheet of the lowest layer to the pedestal in the lamination process while securing the lamination stability of the ceramic green sheet in the lamination process and the cutting stability of the laminate in the cutting process It can be used as it is until it is completed. Thereby, in the manufacturing method of a multilayer ceramic substrate, there exists an advantage which improves the efficiency and economical efficiency on a process remarkably.

  Moreover, since the pedestal sheet according to the present embodiment is not a method in which the adhesive layer is foamed to separate the pedestal sheet and the laminate, the adhesive layer foam marks on the surface of the laminate after the pedestal sheet is separated. Will not remain.

  Moreover, in this embodiment, the composition for adhesion layers contains 100 mass parts of (A) solvents, (B) 5-30 mass parts of adhesives, and (C) 1-10 mass parts of plasticizers, for example. Therefore, there are obtained advantages such that the adhesive effect is sufficiently exhibited, the viscosity of the adhesive layer composition is appropriate, and the adhesive layer composition can be easily applied to one side of the base sheet.

Moreover, in this embodiment, since the application quantity to the base sheet of the composition for adhesion layers is 0.001-0.5 g / cm < ² >, for example, since the adhesion effect is fully exhibited, Advantages such as that the thickness does not become excessively thick, the shaking of the adhesive layer is suppressed, and the lamination stability and the cutting stability are maintained.

  In the present embodiment, the adhesive layer composition further contains, for example, (D) a colorant, so that it is possible to easily determine on which side of the base sheet the adhesive layer is formed. Is obtained.

  In the present embodiment, since the thickness of the adhesive layer is, for example, 5 μm or less, the thickness of the adhesive layer does not become excessively thick, the shaking of the adhesive layer is suppressed, and the lamination stability and the cutting stability are maintained. Advantages such as

<Second Embodiment>
Next, a second embodiment of the present invention will be described. However, only the characteristic part different from the first embodiment will be described, and the description of the same part as the first embodiment will be omitted. Moreover, the same code | symbol is used for the same or similar location as 1st Embodiment.

  In this second embodiment, as shown in FIG. 9, the base sheet used in the method for manufacturing a multilayer ceramic substrate has an adhesive layer (reference numeral 110) formed on one side of a base sheet (reference numeral 100). It is a configuration. And the wiring pattern for the surface electrodes (reference numeral 120) of the multilayer ceramic substrate is printed on the upper surface of the adhesive layer. Moreover, the said adhesion layer is formed in the single side | surface of a base sheet through the peeling layer (code | symbol 100a).

  For example, even if a surface electrode wiring pattern is printed on the surface of a general resin film (eg, PET film) using a thick film conductor paste, the resin film is wettable (familiar) with the thick film conductor paste. The printed wiring pattern easily peels off from the surface of the resin film when dried after printing.

  However, in this embodiment, the pressure-sensitive adhesive layer containing a pressure-sensitive adhesive such as PVB provided on one side of the base sheet has a relatively high wettability (familiarity) with the thick film conductor paste. When the wiring pattern is printed on the upper surface of the substrate using a thick film conductor paste or the like, the wiring pattern does not peel off from the adhesive layer even after drying, and adheres well. As a result, the base sheet according to the second embodiment It will be fulfilled satisfactorily.

  For example, the drawing substitute photograph of FIG. 15A is an enlarged view showing a state in which the wiring pattern for the surface electrode is printed using the thick film conductor paste on the upper surface of the adhesive layer of the base sheet according to the second embodiment of the present invention. FIG. 15 (b) is a drawing substitute photograph showing an enlarged view showing a state in which the same surface electrode wiring pattern is printed on the surface of the unfired ceramic green sheet laminated in the laminating process using the thick film conductor paste. As shown in the figure, it is clear that the wiring pattern can be printed and formed on the adhesive layer using the thick film conductor paste as clearly as the ceramic green sheet. Recognize.

  For example, in a product such as a ceramic probe, a LTCC (Low Temperature Co-fired Ceramics) module, a chip MLCC (Multi-Layer Ceramic Capacitor) or a chip inductor which is a general passive component. A surface electrode wiring pattern may be directly formed on the upper surface and / or lower surface of the substrate without using a cover or the like. In the conventional manufacturing method of such a product, as shown in FIG. 16, a surface electrode wiring pattern printing step is separately provided on the upper surface and / or lower surface of the sheet laminate between the laminating step and the pressing step. As shown in FIG. 17, there was a trouble in the process of separately printing a mirror image symmetric wiring pattern for the surface electrode on the upper surface and / or the lower surface of the sheet laminate using the thick film conductor paste.

  This will be further described with reference to FIG. FIG. 17A shows a state in which a surface electrode wiring pattern is formed on the upper surface of a ceramic green sheet on a carrier film such as a PET film (see FIGS. 11 and 12), and FIG. In the laminating step, the ceramic green sheet is turned upside down in the PET film upper surface laminating method (see FIG. 12) to form the lowest green sheet, and a plurality of green sheets are sequentially laminated thereon, FIG. 17C shows a state in which the surface electrode wiring pattern is formed on the upper surface of the uppermost ceramic green sheet after completion of the lamination. As a whole, it is shown that a mirror image symmetrical wiring pattern is necessary between the upper surface and the lower surface of the sheet laminate. In other words, in the conventional manufacturing method, it is necessary to print the mirror image symmetrical wiring pattern for the surface electrode on the upper surface and / or the lower surface of the sheet laminate between the lamination step and the pressurization step, which is complicated in the process. Met.

  That is, FIG. 17A shows one unfired ceramic green sheet in a state where the printing process is finished. This green sheet constitutes the lowermost layer of the laminate. The carrier film used at the time of tape molding remains on the lower surface of the green sheet, and the surface electrode wiring pattern printed by, for example, a normal printing process is formed on the upper surface of the green sheet. In addition, via holes are formed in the green sheet. Therefore, this green sheet is laminated by the PET film upper surface lamination method. That is, as shown in FIG. 17B, the green sheet is turned upside down, and in this state, the green sheet is attracted to the press through the carrier film and placed on the adhesive layer of the pedestal sheet (not shown).

  Then, ceramic green sheets on which internal circuits (wiring patterns) are printed in a normal printing process are sequentially laminated on the lowermost sheet. As a result, as shown in FIG. 17C, a laminate in which a plurality of unfired ceramic green sheets are laminated is obtained. At this time, when the carrier film is peeled off from the upper surface of the uppermost sheet, no wiring pattern is formed on the upper surface of the uppermost sheet. Therefore, in order to form a surface electrode wiring pattern on the upper surface of the uppermost sheet and obtain a laminate having surface electrode wiring patterns on both upper and lower surfaces of the laminate, the obtained laminate is used in the printing process. It is necessary to move and print the surface electrode wiring pattern on the upper surface of the laminate. This is very complicated. In addition, in order to correspond the wiring patterns for the surface electrodes on the upper and lower surfaces of the laminate to each other, the same wiring pattern on the lower surface is not printed on the upper surface, but the wiring pattern having a mirror image symmetry with the wiring pattern on the lower surface Must be printed on the top surface. This is also more troublesome.

  In the above example, the case where the PET film is laminated on the upper surface is described, but the same problem occurs when the PET film is laminated on the lower surface. The electrode wiring pattern is formed, but since the surface electrode wiring pattern is not formed on the lower surface of the lowermost sheet, it was obtained to form the surface electrode wiring pattern on the lower surface of the lowermost sheet. It is necessary to move the laminate to the printing process and print the surface electrode wiring pattern on the lower surface of the laminate.

  Therefore, in this second embodiment, the surface electrode wiring pattern (reference numeral 120) of the multilayer ceramic substrate is printed and applied on the upper surface of the adhesive layer of the pedestal sheet, and the pedestal sheet is fixed to the ceramic green sheet and used for the surface electrode. A pedestal sheet with a surface electrode wiring pattern that can be used for both functions of wiring pattern transfer.

  For example, in the case of the PET film lower surface laminating method, when the pedestal sheet with the wiring pattern for the surface electrode is laid down and laminated as usual, the lowermost layer of the lowermost film comes into contact with the adhesive layer of the pedestal sheet. The lower surface of the film also contacts the wiring pattern applied to the upper surface of the adhesive layer. Then, after the cutting process, the base sheet is peeled off, degreased, and integrally fired, so that the remaining adhesive layer is decomposed, while the surface electrode wiring pattern made of a refractory metal thick film conductor paste is formed on the lower surface. It will remain in the transcribed state. That is, it is possible to obtain a multilayer body having a surface electrode wiring pattern on both upper and lower surfaces, that is, a multilayer ceramic substrate, without passing through a printing process of the surface electrode wiring pattern after the lamination process and without adding any special work. .

  On the other hand, in the case of the PET film upper surface lamination method, since the surface electrode wiring pattern has already been formed on the lower surface, the pedestal sheet to be laid down is not a pedestal sheet with a wiring pattern, but the normal structure described in the first embodiment. No pedestal seat. Then, after peeling the carrier film from the upper surface of the uppermost sheet, the base sheet with a wiring pattern according to the second embodiment is placed on the upper surface of the uppermost sheet so that the adhesive layer faces downward. . That is, the pedestal sheet adheres to both the upper and lower surfaces. In this state, the cutting process is started through the pressurizing process. In the cutting step, any pedestal sheet may be used for fixing at the time of cutting. That is, any pedestal sheet may be down and fixed to the cutting work table. The base sheet located on the other side may be peeled off or left depending on the situation. It may be preferable to peel from the viewpoint of easy cutting.

  According to the second embodiment, since the surface electrode wiring pattern is formed on the upper surface of the adhesive layer of the pedestal sheet with the wiring pattern, when the adhesive layer is brought into contact with the ceramic green sheet, the ceramic green sheet When the multilayer ceramic substrate having the surface electrode wiring pattern formed on the upper surface and / or the lower surface of the laminate is manufactured as shown in FIG. There is no need to separately provide a step of forming a surface electrode wiring pattern on the upper surface and / or the lower surface. As is clear from comparison between FIG. 16 and FIG. 18, in the second embodiment shown in FIG. 18, the surface electrode wiring pattern is formed on the upper surface of the multilayer body only through the conventional process. Therefore, there is an advantage that the process efficiency and economy are remarkably improved.

  As shown in FIG. 9, in the pedestal sheet with the surface electrode wiring pattern according to the second embodiment, the adhesive layer 110 is a coating surface on which the release layer 100 a is provided among the surfaces of the base sheet 100. It is preferable to be formed. Thereby, in this pedestal sheet with a wiring pattern, the adhesive layer 110 is easily peeled from the base sheet 100. When the adhesive layer 110 is brought into contact with the ceramic green sheet, the surface electrode wiring pattern is formed on the surface of the ceramic green sheet. 120 is easily transferred together with the adhesive layer 110, and a preferable advantage in manufacturing a multilayer ceramic substrate in which a wiring pattern for a surface electrode is formed on the upper surface and / or the lower surface of the laminate is obtained. That is, in this embodiment, when the base sheet and the laminate are separated in the separation step, the adhesive layer is easily separated from the base sheet, and the adhesive layer and the surface electrode wiring pattern are easily moved to the laminate. Therefore, transferability of the surface electrode wiring pattern to the laminate is improved.

  As described above in detail with reference to specific examples, according to the present invention, it is possible to improve the production efficiency of the multilayer ceramic substrate while ensuring the lamination stability in the lamination process and the cutting stability in the cutting process.

100 Base Sheet 100a Release Layer 110 Adhesive Layer 120 Surface Electrode Wiring Pattern

Claims (7)

A method for producing a multilayer ceramic substrate, comprising:
A stacking step in which a base sheet having an adhesive layer formed on one side of a base sheet is fixed to a work table with the adhesive layer facing upward, and a plurality of unfired ceramic green sheets are sequentially stacked on the adhesive layer;
A pressing step in which the laminate of the obtained unfired ceramic green sheets is pressed and integrated by a warm isotropic pressure pressing method with a pedestal sheet attached to the lower surface of the stack; and
The pedestal sheet adhering to the lower surface of the laminated body of the unfired ceramic green sheets is fixed to the work table to fix the integrated laminated body to the work table. A cutting step for cutting into a predetermined size;
A separation step of separating the cut laminate piece from the pedestal sheet;
A degreasing step for removing organic components remaining in the separated laminate pieces;
A firing step of firing the degreased laminate piece,
The adhesive layer of the pedestal sheet is at least one selected from the group consisting of (A) a solvent, (B) an adhesive, polyvinyl butyral, polyvinyl alcohol, polyacrylate, polymethacrylate, and cellulose acetate, and (c) plastic A method for producing a multilayer ceramic substrate, wherein the composition for an adhesive layer containing an agent is applied to one side of a base sheet. A pedestal sheet used in a method for producing a multilayer ceramic substrate,
An adhesive layer is formed on one side of the base sheet,
The pressure-sensitive adhesive layer comprises (A) a solvent, (B) pressure-sensitive adhesive, at least one selected from the group consisting of polyvinyl butyral, polyvinyl alcohol, polyacrylate, polymethacrylate, and cellulose acetate, and (c) a plasticizer. A pedestal sheet used in a method for producing a multilayer ceramic substrate, wherein the composition for an adhesive layer contained is applied on one side of a base sheet. The composition for the adhesive layer contains (A) 100 parts by mass of the solvent, (B) 5-30 parts by mass of the adhesive, and (C) 1-10 parts by mass of the plasticizer,
The application amount to the base sheet of the composition for adhesion layers is 0.001-0.5 g / cm < ² >, The base sheet used for the manufacturing method of the multilayer ceramic substrate of Claim 2 characterized by the above-mentioned.   The pedestal sheet used in the method for producing a multilayer ceramic substrate according to claim 2 or 3, wherein the composition for the adhesive layer further contains (D) a colorant.   The thickness of an adhesion layer is 5 micrometers or less, The base sheet used for the manufacturing method of the multilayer ceramic substrate of any one of Claims 2-4 characterized by the above-mentioned.   The pedestal sheet used in the method for producing a multilayer ceramic substrate according to any one of claims 2 to 5, wherein a wiring pattern for a surface electrode of the multilayer ceramic substrate is printed on an upper surface of the adhesive layer.   The base sheet used in the method for producing a multilayer ceramic substrate according to claim 6, wherein the adhesive layer is formed on one side of the base sheet via a release layer.