JP2010087271A - Carrier, substrate processing apparatus, and manufacturing method of image display apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for controlling the temperature of a carrier having a permanent electromagnet. <P>SOLUTION: The carrier holds a mask and a substrate by magnetic attraction of the mask containing a magnetic material through the substrate. The carrier has a holding body, the permanent electromagnet assembled in the holding body, a temperature regulation channel arranged in the holding body, a joint for connecting the temperature regulation channel to a pipe duct of an external temperature regulation apparatus, and a valve which is arranged inside or near the joint, and closes the temperature regulation channel in the state in which the temperature regulation channel is filled with a temperature regulation medium. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a carrier, a substrate processing apparatus, and a method for manufacturing an image display apparatus.

  In the manufacture of flat panel displays, a pattern is formed on a substrate such as a glass substrate. As a pattern formation method, for example, there are a vacuum deposition method, a sputtering method, a photolithography method, a screen printing method, and the like.

  Patent Documents 1 and 2 disclose a method in which a mask is brought into close contact with a substrate using magnetic force and vapor deposition is performed in that state. In order to form a fine pattern on a substrate, it is required to make the pattern portion of the mask thin, to improve the adhesion between the pattern portion and the substrate, and to prevent the pattern portion from being bent or wrinkled. In relation to such an object, Patent Document 2 discloses a method of fixing a metal mask to a frame while applying tension to the metal mask having a thickness of 500 μm or less.

  On the other hand, an in-line method (Patent Document 3) and an improved inter-back method are known as methods for improving the substrate processing capability of the substrate processing apparatus. In either method, the substrate is processed while being transferred through a plurality of processing chambers separated from each other. In such a system, the substrate can be transferred by being held by a carrier.

  In order to form a pattern on the substrate, the substrate can be transported while being held by a carrier with a mask. Patent Document 4 discloses a configuration in which a plate for holding a substrate is provided with a permanent magnet and an electromagnet, and the substrate is held by magnetically attracting a mask made of a magnetic material through the substrate. In this configuration, the mask is held by the magnetic force of the permanent magnet, and the holding of the mask is released by offsetting the magnetic force generated by the permanent magnet with the magnetic force generated by the electromagnet.

Patent Document 5 discloses a permanent electromagnetic chuck incorporating a permanent electromagnet as a mold fixing device. This permanent electromagnetic chuck has a neodymium magnet, an alnico magnet, and a coil wound around the alnico magnet. The polarity of the alnico magnet is controlled by the direction of the current flowing through the coil, and the polarity is maintained even when the current flowing through the coil is interrupted. When trying to attract the mold, the polarity of the alnico magnet is controlled so that the magnetic flux formed by the neodymium magnet and the alnico magnet passes through the attracting surface, and when trying to release the mold adsorption, The polarity of the alnico magnet is controlled so that the magnetic flux formed by the magnet and the alnico magnet does not pass through the attracting surface.
Japanese Patent Laid-Open No. 10-41069 Japanese Patent No. 3539125 Japanese Patent Laid-Open No. 2002-203885 Japanese Patent Application Laid-Open No. 10-152776 JP 2005-246634 A

  The permanent electromagnetic chuck for fixing the mold described in Patent Document 5 is excellent in that the attracted state or the non-sucked state is maintained even when the coil is turned off. However, when adopting a configuration in which the permanent electromagnetic chuck is separated and freely moved from the control unit for controlling the permanent electromagnetic chuck, it becomes a problem how to manage the temperature. In Patent Document 5, no consideration is given to the temperature control of the permanent electromagnetic chuck.

  The present invention has been made based on the recognition of the above problems, and an object thereof is to provide a technique for controlling the temperature of a carrier having a permanent electromagnet, for example.

A first aspect of the present invention relates to a carrier that holds the mask and the substrate by magnetically attracting a mask containing a magnetic material through the substrate, and the carrier is incorporated into the support and the support. A permanent electromagnet, a temperature control channel provided in the support, a joint for connecting the temperature control channel to a pipe of an external temperature control device, and provided in or near the joint. A valve for closing the temperature control channel in a state where the temperature control channel is filled with the temperature control medium, the permanent electromagnet includes a polarity variable magnet having a variable polarity, and a polarity variable magnet. Including a coil that generates a magnetic field for changing the polarity, and a polarity-fixed magnet having a fixed polarity,
The carrier is in a first state in which the mask and the substrate are held by the magnetic field generated by the polarity variable magnet and the polarity fixed magnet by controlling the polarity of the polarity variable magnet by the magnetic field generated by the coil. And a second state in which the mask and the substrate are not held.

  A second aspect of the present invention relates to a substrate processing apparatus for processing a substrate, and the substrate processing apparatus includes a carrier that holds the mask and the substrate by magnetically attracting a mask containing a magnetic material through the substrate. And a temperature control device for adjusting the temperature of the carrier, the carrier comprising a support, a permanent electromagnet incorporated in the support, a temperature control channel provided in the support, and the temperature control. A joint for connecting the flow path to the pipe of the temperature control device; and provided in or near the joint, the temperature control flow path is filled with a temperature control medium. The permanent magnet includes a variable polarity magnet having a variable polarity, a coil for generating a magnetic field for changing the polarity of the polarity variable magnet, and a fixed polarity magnet having a fixed polarity. Including the state of the carrier A first state in which the mask and the substrate are held by the magnetic field generated by the polarity variable magnet and the polarity fixed magnet by controlling the polarity of the polarity variable magnet by the magnetic field generated by the coil; The temperature adjustment device is set to any one of the second states in which the substrate is not held, and the temperature adjustment device connects the pipe line to the joint when the carrier is disposed at a predetermined position. The temperature control medium is supplied to or collected from the temperature control flow path.

  A third aspect of the present invention relates to a manufacturing method for manufacturing an image display device, and the manufacturing method includes a step of forming a film on a substrate by the substrate processing apparatus according to claim 9.

  According to the present invention, for example, a technique for controlling the temperature of a carrier having a permanent electromagnet is provided.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1A is a schematic diagram showing a configuration of a substrate holding device according to a preferred embodiment of the present invention. The substrate holding device 500 includes a carrier 410 that holds the mask 200 and the substrate 300 by magnetically attracting the mask 200 containing a magnetic material through the substrate 300, and a control unit 420 that controls the carrier 410. The carrier 410 may include a support 400 having a holding surface 400S that holds the substrate 300, permanent electromagnets 101, 102X, and 102Y embedded in the support 400, and first contacts 120 (120a, 120b, and 120c). .

  As illustrated in FIG. 7, each of the permanent electromagnets 101, 102X, and 102Y includes a magnetic body 102a, a variable polarity magnet (for example, an alnico magnet) 102c having a variable polarity, and a first contact 120 (120a, 120b, 120c) and a coil 102d that generates a magnetic field for changing the polarity of the variable polarity magnet 102c by the current supplied through the first contact 120 (120a, 120b, 120c), and the polarity is And a fixed polarity fixed magnet (for example, a rare earth magnet such as a neodymium magnet) 102b. Here, the variable polarity magnet 102c is a kind of permanent magnet, and the polarities of the two poles (N pole and S pole) are reversed according to the direction of the magnetic field applied from the outside, and the magnetic field applied from the outside is removed. It is a magnet that maintains its polarity even if it is. When the direction of the current flowing through the coil 102d is reversed, the direction of the magnetic field generated by the coil 102d is reversed, so that the polarity of the polarity variable magnet 102c can be controlled by the direction of the current flowing through the coil 102d. The first contact 120 (120a, 120b, 120c) is electrically connected to the coil 102d.

  The carrier 410 is in a first state in which the mask 200 and the substrate 300 are held by a magnetic field generated by the polarity variable magnet 102c and the polarity fixed magnet 102b (attraction state or holding state), and in the first state in which the mask 200 and substrate 300 are not held. Two states (non-suction state or non-holding state) are set (controlled). The state of the carrier 410 is set (controlled) by the control unit 420 controlling the direction of current flowing through the coil 102d (the direction of the magnetic field generated by the coil 102d).

  The controller 420 contacts the first contact 120 (120a, 120b, 120c) of the carrier 410 and supplies a current to the coil 102d via the first contact 120 (120a, 120b, 120c). (121a, 121b, 121c), a first contact 120 (120a, 120b, 120c) and a second contact 121 (121a, 121b, 121c) detecting the contact state (described later), and the contact state A current supply unit 151 that supplies current to the coil 102d through the first contact 120 (120a, 120b, 120c) and the second contact 121 (121a, 121b, 121c) when the determination criterion is satisfied is included.

  FIG. 1A illustrates the state of the carrier 410, the mask 200, and the substrate 300 when the alignment between the mask 200 and the substrate 300 is completed. The substrate 300 is disposed on the holding surface 400S, and the mask 200 is disposed thereon. When a pattern is formed on the substrate 300 by a film formation method (film formation method) such as vapor deposition, the pattern is generally rotated 180 degrees so that the top of the carrier 410 is inverted while the mask 200 and the substrate 300 are held. It can be left in a state.

  In this embodiment, a plurality of sets of permanent electromagnets, specifically, three sets of permanent electromagnets 101, 102 </ b> X, and 102 </ b> Y are provided and can be controlled independently from each other by the control unit 420. The first set of permanent electromagnets 101 is arranged to magnetically attract the mask frame 200a. The second set of permanent electromagnets 102X is arranged so as to magnetically attract the central portion in the region within the mask pattern portion 200b. The third set of permanent electromagnets 102Y is arranged so as to magnetically attract the peripheral portion (outside of the central portion) in the region within the mask pattern portion 200b. The current supply unit 151 of the control unit 420 includes a first unit 151c that supplies current to the first set of permanent electromagnets 101, a second unit 151a that supplies current to the second set of permanent electromagnets 102X, and a third set of And a third unit 151b for supplying a current to the permanent electromagnet 102Y.

  The mask 200 includes a mask pattern portion 200b and a mask frame 200a that supports the mask pattern portion 200b. The mask pattern portion 200b is a sheet-like member having a mask pattern. The mask pattern portion 200b and the mask pattern portion 200b are configured to include a magnetic material (for example, a material containing iron as a main component). As the magnetic material, for example, a low thermal expansion material such as an invar material (an alloy composed of 64% iron and 36% nickel) is suitable in order to reduce thermal expansion due to radiation input heat during vapor deposition. A mask pattern is formed on the mask pattern portion 200b by a method such as etching. The mask pattern portion 200b is required to have a reduced thickness as the mask pattern becomes higher in definition.

  FIG. 1B is an exemplary plan view of mask 200. In this example, the mask 200 is a 36-chamfer mask. Each rectangular area surrounded by the mask frame 200a corresponds to one surface (for example, one display device). If the thickness of the mask pattern portion 200b, which is a pattern region, is thick, there is a problem that the film thickness of the periphery in the fine opening portion becomes thin. Therefore, the mask pattern portion 200b is made thinner than the mask frame 200a. May be less than 0.05mm thick. By making the mask pattern portion 200b thin, it is possible to cause film formation particles that enter the fine opening from an oblique direction to reach the substrate. The mask pattern portion 200b can be fixed to the mask frame 200a by a method such as welding so as to be surrounded by the mask frame 200a in a state where tension is applied in advance.

  The mask frame 200a is provided with rigidity for keeping the deformation caused by the reaction force against the tension applied to the mask pattern portion 200b within an allowable value. As a result, the weight of the mask 200 as a whole increases. For example, the weight of a mask having a substrate size of about 1300 mm × 800 mm can reach 300 kg.

  Subsequently, a procedure for holding (magnetic attraction) and releasing the substrate 300 and the mask 200 will be described. FIG. 1A illustrates a state immediately before the control unit 420 is connected to the carrier 410 and the substrate 300 and the mask 200 are magnetically attracted to the carrier 410 at a working position (usually a position where the carrier 410 stops). The carrier 410 can be positioned at a predetermined working position of the substrate processing apparatus. Thereafter, the first contact 120 that is the contact on the carrier 410 side and the second contact 121 that is the contact on the control unit 420 side are connected. Here, the connection between the first contact 120 and the second contact 121 can be made by an operation mechanism (not shown). In FIG. 1A, the structure of the first contact 120 and the second contact 121 is not limited to a specific one. For example, the first contact 120 and the second contact 121 may be of a type in which a male connector is press-fitted into a female connector. It may be of a type that presses against the other, or may be of another type.

  In a state where the first contact 120 and the second contact 121 are connected, the coils of the permanent electromagnets 101, 102X, and 102Y from the current supply unit 151 (151a, 151b, 151c) via the first contact 120 and the second contact 121 A current for setting the state of the carrier 410 to the first state (suction state or holding state) is supplied to 102d. Accordingly, the mask 200 is magnetically attracted by the permanent electromagnets 101, 102 </ b> X, and 102 </ b> Y through the substrate 300, and the mask 200 and the substrate 300 are held on the holding surface 400 </ b> S of the carrier 410. Thereafter, the first state is maintained unless the current for setting the state of the carrier 410 to the second state (non-attraction state or non-holding state) is supplied to the coil 102d.

  After the mask 200 and the substrate 300 are held on the holding surface 400S of the carrier 410, the current supply to the coil 102d is cut off, and the connection between the first contact 120 and the second contact 121 is released. In this state, the carrier 410 is transported in the substrate processing apparatus, and a film (a pattern according to the mask pattern portion 200b) can be formed on the substrate 300.

  When releasing the holding of the mask 200 and the substrate 300, the first contact 120 and the second contact 121 are connected again, and in this state, the first contact 120 and the first contact 120 from the current supply unit 151 (151a, 151b, 151c). A current for setting the state of the carrier 410 to the second state (non-attraction state or non-holding state) may be supplied to the coils 102d of the permanent electromagnets 101, 102X, and 102Y via the two contact points 121.

  A configuration example of the permanent electromagnets 101, 101X, and 101Y will be described with reference to FIGS. As described above, the permanent magnet is electrically connected to the magnetic body 102a, the variable polarity magnet (for example, alnico magnet) 102c having a variable polarity, and the first contact 120 (120a, 120b, 120c). A coil 102d that generates a magnetic field for changing the polarity of the polarity variable magnet 102c by a current supplied through one contact 120 (120a, 120b, 120c), and a polarity fixed magnet (for example, a neodymium magnet) with a fixed polarity ) 102b. The conductive wire connecting the first contact 120 (120a, 120b, 120c) and the coil 102d can be accommodated in the space 102f. 7 and 8, L schematically shows the magnetic field lines of the magnetic field generated by the polar fixed magnet 102b. N indicates the N pole, and S indicates the S pole.

  When the control unit 420 applies a current (for example, 100 A) in the first direction to the coil 102d for a predetermined time (for example, about 0.5 seconds), the polarity of the polarity variable magnet 102c is changed as schematically illustrated in FIG. The polarity is reversed, and the polarity-fixed magnet 102b and the polarity-variable magnet 102c become the same polarity. As a result, a large amount of magnetic field (magnetic flux) leaks outside the permanent electromagnet holding surface 400S, and the mask 200 is magnetically attracted toward the holding surface 400S. This is the first state (suction state or holding state).

  On the other hand, when the control unit 420 applies a current (for example, 100 A) to the coil 102d in a direction opposite to the first direction for a predetermined time (for example, about 0.5 seconds), the polarity of the polarity variable magnet 102c is reversed and the polarity is fixed. The magnet 102b and the variable polarity magnet 102c are attracted, that is, the magnetic lines of force are not leaked outside the holding surface 400S, and the magnetic attraction of the mask 200 is stopped. This is the second state (non-suction state or non-holding state).

  In such a carrier 410, a current is supplied to the coil 102d in the change from the first state to the second state and in the change from the second state to the first state. There is no need to supply current to 102d. For this reason, heat generation due to current supply to the coil 102d can be ignored. Therefore, such a carrier 410 is advantageous when used in a reduced pressure environment or a vacuum environment.

  FIG. 2A is a view exemplarily showing a connection method between the first contact 120 and the second contact 121. In order to pass a current through a coil of one permanent electromagnet, two first contacts 120 electrically connected to one terminal and the other terminal of the coil are necessary, and 2 correspondingly. Two second contacts 121 are required. In FIG. 2A, only one first contact 120 and one second contact 121 are shown. In the example shown in FIG. 2A, the first contact 120 is supported by a contact support portion 120a and connected to one terminal of the coil 102d via a conductive wire 102k.

  The first contact 120 and the second contact 121 are required to have a reliability that allows a high current (about 100 A) necessary for exciting the permanent magnet coil to flow stably. If the electrical contact between the first contact 120 and the second contact 121 is insufficient, as described above, discharge (spark) occurs between them, and deterioration of the contact can proceed. In particular, care must be taken because discharge easily occurs in a vacuum environment.

  In this embodiment, the control unit 420 is provided with a detection unit that detects a contact state between the first contact 120 (120a, 120b, 120c) and the second contact 121 (121a, 121b, 121c).

  FIG. 11 is a diagram showing a schematic configuration of a preferred embodiment of the present invention regarding a portion related to detection of a contact state. In the control unit 420, one detection unit 220 may be provided for one second contact 121 (121a, 121b, 121c). The detection unit 220 is based on a resistance value or a voltage drop at a contact portion between the first contact 120 (120a, 120b, 120c) on the carrier 410 side and the second contact 121 (121a, 121b, 121c) on the control unit 420 side. A contact state between the first contact 120 (120a, 120b, 120c) and the second contact 121 (121a, 121b, 121c) is detected.

  The detection unit 220 includes, for example, an inspection contact 201, the second contact 121 contacts the first portion 120-1 of the first contact 120, and the inspection contact 201 contacts the second portion 120-2 of the first contact 120. In this state, the contact state can be detected based on a resistance value or a voltage drop in a path from the inspection contact 201 to the second contact 121 via the first contact 120. Here, in addition to the contact resistance R between the first contact 120 and the second contact 121, the path may include resistances r1, r2, and the like. The detection unit 220 may detect the entire resistance value or voltage drop of the path, or may extract the resistance value of the contact resistance R or the voltage drop caused by the resistance value or voltage drop. In this case, the resistances r1, r2, etc. may be obtained in advance.

  The current supply unit 151 of the control unit 420 is the first when the contact state (resistance value or voltage drop) detected by the detection unit 220 satisfies the determination criterion (for example, when the resistance value or voltage drop is less than a predetermined value). A current may be supplied to the coil 102 d through the first contact 120 and the second contact 121.

  FIG. 12 is a diagram showing a schematic configuration of another preferred embodiment of the present invention regarding a portion related to detection of a contact state. The embodiment shown in FIG. 12 is a modification of the embodiment shown in FIG. 11, and differs from the embodiment shown in FIG. 11 in that the carrier 410 includes a first inspection contact 120 ′. The inspection contact (second inspection contact) 201 on the control unit 420 side is configured to be able to contact the first inspection contact 120 ′ on the carrier 410 side when a contact state is detected. The first inspection contact 120 ′ of the carrier 410 is electrically connected to the first contact 120 via a conductive line having a resistance value r5.

  FIG. 3 is a diagram showing a schematic configuration of a substrate processing apparatus according to a preferred embodiment of the present invention. The substrate processing apparatus 30 can be configured as a vacuum processing apparatus, for example. First, loading and unloading of the substrate 300 will be described. The substrate processing apparatus 30 communicates with vacuum exhaust units 402a, 402b, and 402c such as vacuum pumps via valves 401a, 401b, and 401c.

  The steps of loading, positioning, and fixing (holding by the carrier 410) the substrate 300 are performed in the loading chamber (first processing chamber) 31. The substrate 300 is transferred to the carry-in chamber 31 by a substrate transfer system (not shown). The conveyed substrate 300 is placed on the holding surface of the carrier 410 by an operation mechanism (not shown). The mask 200 is transferred onto the carrier 410 so as to cover the substrate 300 by a mask transfer system (not shown).

  The substrate 300 and the mask 200 thus transported have a contact (first contact) 120 on the carrier 410 side and a contact (second contact) 121 on the current supply unit 151 side of the control unit in the loading chamber 31. By being connected and energizing the coil of the permanent electromagnet, the carrier 410 is magnetically attracted. Thus, preparation for forming a film on the substrate 300 is completed.

  After the connection between the contact (first contact) 120 on the carrier 410 side and the contact (second contact) 121 on the current supply unit 151 side of the control unit 420 is released, the rotation mechanism disposed in the carry-in chamber 31 is used. The top of the carrier 410 holding the substrate 300 and the mask 200 is inverted for film formation in the film formation chamber (second processing chamber) 32. In the film formation chamber 32, a film can be formed on the substrate 300 by a method such as vapor deposition, sputtering, chemical vapor deposition, or the like.

  Thereafter, the carrier 410 holding the substrate 300 and the mask 200 is transferred to a film forming chamber (second processing chamber) 32 by a transfer system (not shown), and a film is formed on the substrate 300 by vapor deposition or the like in the film forming chamber 32. Is done. The film can be formed, for example, while the carrier 410 holding the substrate 300 and the mask 200 is transported by a transport system (not shown). Further, the film can be formed by supplying a raw material to the substrate 300 from a material supply unit 34 such as a vapor deposition source.

  When the film formation is completed, the carrier 410 holding the substrate 300 and the mask 200 is transferred to the carry-out chamber (third processing chamber) 33 by a transfer system (not shown).

  Thereafter, the top and bottom of the carrier 410 holding the substrate 300 and the mask 200 is reversed by the rotation mechanism disposed inside the carry-out chamber 33. Next, in the carry-out chamber 33, the permanent electromagnet coil is energized by connecting the contact (first contact) 120 on the carrier 410 side and the contact (second contact) 121 on the current supply unit 151 side of the control unit. Thus, the magnetic attraction by the carrier 410 is released.

  Thereafter, the mask 200 and the substrate 300 are separated from the carrier 410 by an operation mechanism (not shown) and transferred to the respective transport systems. The substrate 300 is transferred to the next process apparatus.

  The carry-in chamber 31, the film formation chamber 32, and the carry-out chamber 33 may constitute one space.

  As described above, the carrier 410 can be transported while holding the mask 200 and the substrate 300, or can be subjected to operations such as rotation. Therefore, it is important to ensure that the mask 200 and substrate 300 are held by the carrier 410. In addition, if the carrier 200 holds the mask 200 and the substrate 300 and tries to remove them from the carrier 410, excessive stress may be applied to the mask 200 and the substrate 300.

  Therefore, the substrate holding device 500 preferably includes a detection unit 185 that detects the state of the carrier 410. The detection unit 185 includes, for example, a magnetic sensor 180 that detects a magnetic field emitted from the permanent electromagnet 101, and the carrier 410 is in a first state (suction state or holding state) or a second state (non-suction) by the magnetic sensor 180. State or non-holding state).

  FIG. 10 is a diagram for explaining the principle of a method for detecting the state of the carrier 410 by the detection unit 185. FIG. 10A schematically shows the first state (suction state or holding state). In the first state, since the magnetic field (magnetic flux) is emitted from the support 400 of the carrier 410 to the outside, the carrier 410 is in the first state when the measured value by the magnetic sensor 180 is larger than the determination reference value. Can be determined. FIG. 10B schematically shows the second state (non-suction state or non-holding state). In the second state, since the magnetic field (magnetic flux) is not emitted from the support body 400 of the carrier 410 to the outside or is small, the carrier 410 has the first value when the measured value by the magnetic sensor 180 is smaller than the determination reference value. It can be determined that there are two states.

  The detection unit 185 preferably includes an operation mechanism 182 that operates the magnetic sensor 180. In this embodiment, as schematically shown in FIG. 3, a hole (preferably a through hole) 200 c is provided in the mask frame 200 a of the mask 200. The operating mechanism 182 is preferably configured to insert the magnetic sensor 180 into the hole 200c. The configuration in which the hole 200c is provided in the mask frame 200a and the hole 200c is inserted into the magnetic sensor 180 is such that the mask 200 exists on the carrier 410 (that is, the state in which the mask 200 can be magnetically attracted, or the mask This is useful for detecting the state of the permanent electromagnet 101 (the state of the carrier 410) in a state in which the magnet 200 is magnetically attracted).

  In the substrate processing apparatus 30 shown in FIG. 3, the detection unit 185 is preferably provided in the carry-in chamber 31 and the carry-out chamber 33. In the carry-in chamber 31, the detection unit 185 confirms that the permanent electromagnet 101 is in the first state after the procedure for setting the permanent electromagnets 101, 102X, and 102Y to the first state (attraction state or holding state) is executed. If it is determined that the mask 200 and the substrate 300 are fixed to the carrier 410, the carrier 410 can be transported or operated.

  In the carry-out chamber 33, after the procedure for setting the permanent electromagnets 101, 102X, and 102Y to the second state (non-attraction state or non-holding state) is executed, the detection unit 185 determines that the permanent electromagnet 101 is in the second state. The mask 200 and the substrate 300 can be removed from the carrier 410, provided that it has been confirmed.

  The detection unit 185 considers simplification of the configuration for power supply to the detection unit 185 and communication with the control unit 420, simplification of the configuration of the carrier 410, degassing from the magnetic sensor, or the like. Then, it is preferable that the carrier 410 is arranged separately. However, the detection unit 185 may be provided in the carrier 410 together with, for example, a battery and a wireless communication device.

  When forming a film on the substrate 300, the carrier 410 can be heated by, for example, radiant heat from a material supply unit 34 such as an evaporation source. Alternatively, the carrier 410 may have a non-uniform temperature distribution due to heating or subsequent heat release. Therefore, it is preferable to provide a temperature control flow path 230 for temperature adjustment on the support of the carrier 410. In addition, in order to avoid the movement of the temperature adjustment pipe along with the movement of the carrier 410, the temperature adjustment flow path 230 is connected to and disconnected from the pipes 132a and 132b (joint 131) of the external temperature adjustment device. It is preferable to provide a joint 130 for the purpose. Further, as illustrated in FIG. 2B, the carrier 410 includes a valve 140 for closing the temperature control channel 230 in a state where the temperature control channel 230 is filled with the temperature control medium. It is preferable to be provided in the vicinity.

  The temperature control channel 230 may be provided with a single connection port, and the joint 130 and the valve 140 may be provided at the connection port. However, the temperature control channel 230 may be provided with an inlet and an outlet, and the inlet and the outlet It is preferable to provide the joint 130 and the valve 140 on both sides. In the latter, while the two valves 140 are opened, the temperature control medium 230 is supplied to the temperature control channel 230 through the inlet and the temperature control medium 230 is recovered from the temperature control channel 230 through the outlet. The temperature control medium can be circulated through.

  The temperature control device 133 is configured by connecting the joint 131 of the pipe lines 132a and 132b to the joint 130 on the carrier 410 side and controlling the temperature controlled medium by the pipes 132a and 132b and the temperature control flow path 230 of the carrier 410. The temperature control medium is circulated through the circulation path. The connection between the joint 131 and the joint 130 can be made by an operation mechanism (not shown).

  The temperature adjustment device 133 has a control system that controls the temperature adjustment medium to a target temperature. The control system is, for example, a temperature controller (for example, including a cooler and / or a heater), a temperature sensor, a temperature control by calculating an operation amount based on a deviation between a target temperature and a measurement value by the temperature sensor. It may include a PID compensator for controlling the device. Here, the temperature sensor is disposed not only on the temperature control device 133 but also on the carrier 410 side, and a temperature measurement value by the temperature sensor disposed on the carrier 410 side may be provided to the temperature control device 133 by the wireless communication device. Good. The temperature sensor and the wireless communication device on the carrier 410 side can be driven by a battery. By measuring the temperature on the carrier 410 side and feeding it back to the temperature control device 133, the temperature of the carrier 410 can be controlled with high accuracy.

  The temperature control device 133 may be configured to cool the carrier 410 to a target temperature, or may be configured to heat to the target temperature, and may be configured to reduce a non-uniform distribution of temperature. Also good.

  When the temperature adjustment of the carrier 410 by the temperature adjustment device 133 is finished, the joint 131 on the temperature adjustment device 133 side is disconnected from the joint 130 on the carrier 410 side, and the carrier 410 can be transported. For example, the temperature control device 133 can be configured to adjust the temperature of the carrier 410 in the carry-in chamber 31 and / or the carry-out chamber 33 described above. The temperature adjustment device 133 can be configured to adjust the temperature of the carrier 410 in a temperature adjustment chamber provided for temperature adjustment.

  By connecting or disconnecting the joint 130 on the carrier 410 side and the joint 131 on the temperature control device 133 side, or operating the pipes 132a and 132b on the temperature control device 133 side, the liquid temperature control medium is changed to the carrier 410, particularly the contact 120. If attached to the holding surface 400S, there is a possibility of causing malfunction of the permanent electromagnet, poor adsorption, deterioration of the contact 120, or the like. Therefore, it is preferable that the temperature adjusting medium is removed from the joint 130 of the carrier 410 and the vicinity thereof by the removing unit 150 after the joint 131 on the temperature adjusting device 133 side is disconnected from the joint 130 on the carrier 410 side. The removal unit 150 removes the temperature control medium by, for example, a blower that blows air or the like around the joint 130 of the carrier 410 and / or a wiper that wipes the joint 130 and the periphery thereof.

  9A to 9D are diagrams schematically showing a procedure of holding (adsorption) of the mask 200 and the substrate 300 by the magnetic attraction by the carrier 410. FIG. Of the permanent electromagnets 101, 102X, and 102Y, a portion displayed in white indicates a non-attraction state (second state), and a portion displayed in black indicates an attraction state (first state).

  FIG. 9A schematically shows a process of aligning the mask 200 and the substrate 300. The substrate 300 is disposed on the holding surface 400S of the support 400, and the mask 200 is disposed thereon. The alignment apparatus (not shown) aligns the mask 200 and the substrate 300 in the state shown in FIG. 9A. The alignment may be performed by moving either the mask 200 or the substrate 300. The alignment is performed, for example, by observing alignment marks formed at a predetermined position on the substrate 300 and a predetermined position on the mask 200 with an optical observation device such as a CCD camera, and correcting the mutual displacement based on the result. Can be made. When the mask 200 and the substrate 300 are moved relative to each other, if the mask 200 and the substrate 300 are in contact with each other, the substrate 300 may be damaged. Therefore, as schematically shown in FIG. 9A, alignment is performed in a state where a gap is provided between the mask 200 and the substrate 300. If this gap is large, it may cause a positional shift when the mask pattern portion 200b and the substrate 300 are brought into close contact with each other in the next procedure. Therefore, the gap is preferably small, specifically 500 μm or less. Is preferred.

  9B, after the alignment is completed, only the first set of permanent electromagnets 101 for holding the mask frame 200a is controlled to the first state (attraction state or holding state) by the first unit 151c of the current supply unit 151. The state in which the mask frame 200a is fixed to the carrier 410 by magnetic attraction is schematically shown. As described above, the three sets of permanent electromagnets 101, 102X, and 102Y are controlled independently of each other by the first unit 151c, the second unit 151a, and the third unit 151b.

  FIG. 9C shows that the second set of permanent magnets 102X for fixing the central part of the mask pattern part 200b after the mask frame 200a is fixed to the carrier 410 is in a first state (attraction) by the second unit 151a of the current supply part 151. The state in which the central portion of the mask pattern portion 200b is fixed to the carrier 410 by magnetic attraction is shown schematically. In this state, the central portion of the substrate 300 is in contact with the central portion of the mask pattern portion 200b. By bringing the central portion of the mask pattern portion 200b into contact with the substrate 300 while tension is applied to the mask pattern portion 200b, the mask pattern portion is compared with the case where the entire surface of the mask pattern portion 200b is in contact with the substrate 300 at one time. The substrate 200b can be closely attached to the substrate 300 without causing wrinkles or positional deviation.

  FIG. 9D shows a third set of permanent electromagnets 102Y for fixing the peripheral part of the mask pattern part 200b after the central part of the substrate 300 and the central part of the mask pattern part 200b are in contact with the third part of the current supply part 151. The peripheral portion of the mask pattern portion 200b is fixed to the carrier 410 by magnetic attraction by controlling to the first state (attraction state or holding state) by the unit 151b. As a result, the mask frame 200a and the central portion and the periphery of the mask pattern portion 200b are fixed. A state in which the portion is fixed to the carrier 410 is schematically shown.

  4A and 4B are diagrams illustrating an example of an image display device manufactured using the substrate processing apparatus shown in FIG. 3 in a part of the manufacturing process. In a state where the electron source substrate 81 and the face plate 82 are horizontally arranged with a certain distance therebetween, a spacer (support member) 89 is made vertical between them and the outer periphery is surrounded by a support frame 86. Thereby, an airtight container 90 surrounded by the electron source substrate 81, the face plate 82, and the support frame 86 is configured. The face plate 82 has a structure in which a fluorescent film 84 and a metal back 85 are laminated on a glass substrate 83. The electron source substrate 81 has a structure in which conductive portions such as the Y-direction wiring 24, the X-direction wiring 26, and the conductive film (element film) 27 are laminated.

  In order for the hermetic container 90 to operate with high reliability, the black conductor 91, the non-evaporable getter 87, and the evaporable getter 88 should be disposed in this inner space, and these are the face plate 82 before assembly. A film is formed on the substrate. Since the non-evaporable getter 87 and the evaporable getter 88 need to have a predetermined pattern, a film is formed by the substrate processing apparatus 30 using the carrier 410 that holds the mask 200 in a state of being overlaid on the substrate 300 as described above. It is preferable to carry out.

  In the completed image display apparatus, when a voltage is applied to the conductive film (element film) 27 through the Y-direction wiring 24 and the X-direction wiring 26 in a predetermined procedure on the electron source substrate 81, the electrons emitted from the surface are opposed to each other. An image is formed by colliding with the fluorescent film 84 of the plate 82.

  5 and 6 are diagrams illustrating a configuration and a manufacturing method of an organic fluorescent display (organic EL display) which is one of image display devices using the substrate processing apparatus shown in FIG. 3 in a part of the manufacturing process. .

  Reference numeral 501 denotes a glass substrate, 502 denotes an anode, 503 denotes an element isolation layer, 504a denotes a hole injection layer, 504b denotes a hole transport layer 504b, 505 denotes a light emitting layer, 506 denotes an electron transport layer, 507 denotes an electron injection layer, and 508 denotes a cathode. . In FIG. 6, a stacked structure of the hole injection layer 504 a and the hole transport layer 504 b is shown as 504.

  When a voltage is applied between the anode electrode 502 and the cathode electrode 508, holes are injected into the hole injection layer 504a by the anode electrode 502. On the other hand, electrons are injected from the cathode electrode 508 into the electron injection layer 507. The injected holes move through the hole injection layer 504a and the hole transport layer 504b, and the injected electrons move through the electron injection layer 507 and the electron transport layer 506 and reach the light emitting layer 505. The holes and electrons that reach the light emitting layer 505 recombine to emit light.

  By appropriately selecting the material of the light-emitting layer 505, it is possible to emit light of the three primary colors red (R), green (G), and blue (B). As a result, a full-color image display device can be obtained. Can be realized.

  Next, a manufacturing method of the structure shown in FIG. 5 will be described with reference to FIG. FIG. 6 shows one pixel composed of portions that emit R, G, and B. FIG. 6 is a process diagram showing a general method for manufacturing a light emitting portion of an organic EL display. First, in the previous step, a thin film transistor (TFT) and a wiring portion are formed, and then a highly reflective conductive film is formed on a substrate 501 such as a glass substrate that has been subjected to a film formation process for planarization. . The anode electrode 502 is formed by patterning the conductive film into a predetermined shape. Next, an element isolation film 503 made of a highly insulating material is formed so as to surround red, green, and blue light emitting portions on the anode electrode 502. Thus, the adjacent light emitting portions R, G, and B are partitioned by the element isolation film 503.

  Next, a layer 504 including a hole injection layer 504a and a hole transport layer 504b, a light emitting layer 505, an electron transport layer 506, and an electron injection layer 507 are sequentially formed on the anode electrode 502 by vapor deposition. By laminating a cathode electrode 508 made of a transparent conductive film on the electron injection layer 507, a light emitting portion of an organic EL display is formed on the substrate 501.

  Finally, the light emitting portion on the substrate is covered with a sealing layer (not shown) made of a material having low moisture permeability.

  Here, when the R, G, and B light emitting layers 105 are formed by vapor deposition, the substrate is covered with a mask 510 as illustrated in FIG. FIG. 6C shows a mask 510 for forming an R light emitting portion. Therefore, the G and B light emitting portions are covered with the mask 510 so that the red R light emitting material is not mixed in the G and B portions. Such a light emitting layer forming step is also performed for forming the G and B light emitting layers. Here, for example, in the case of a full color organic EL display with a diagonal size of 5.2 inches and 320 × 240 pixels, the pixel pitch is 0.33 mm (330 μm), and the sub-pixel pitch is 0.11 mm (110 μm). In such a case, an accuracy of several microns or less is required as the mask alignment accuracy. In addition, the hole transport layer 504b, the light emitting layer 505, the electron transport layer 506, and the electron injection layer 507 are formed in different chambers in order to prevent mixing of each organic material, and each dedicated mask is used. The Therefore, it is necessary to align the mask at the same position with high accuracy even in these film forming processes.

  Therefore, it is important to perform mask alignment quickly with high accuracy in order to improve the productivity and yield of the organic EL display.

  Further, it is considered that the use of large display screens will become more common in the future, and at that time, it is expected that there will be an increasing demand for rapid alignment of heavy, large masks with high accuracy.

  The substrate holding apparatus and the substrate processing apparatus described above meet the above requirements.

  The carrier of the present invention can also be used for a carrier that does not have a permanent electromagnet.

It is a mimetic diagram showing composition of a substrate holding device of a suitable embodiment of the present invention. It is an exemplary top view of a mask. It is a figure which shows the connection method of the contact (1st contact) by the side of a carrier, and the contact (2nd contact) by the side of a current supply part (control part) exemplarily. It is a figure which shows typically the structure of the temperature control system of suitable embodiment of this invention. It is a figure which shows schematic structure of the substrate processing apparatus of suitable embodiment of this invention. It is a figure which shows the example of an image display apparatus manufactured using the substrate processing apparatus shown in FIG. 3 in a part of manufacturing process. It is a figure which shows the other example of the image display apparatus manufactured using the substrate processing apparatus shown in FIG. 3 in a part of manufacturing process. It is a figure which shows the example of the manufacturing process of the image display apparatus shown in FIG. It is a figure which shows the structural example of a permanent electromagnet. It is a figure which shows the structural example of a permanent electromagnet. It is a figure for demonstrating the procedure of the holding | maintenance (adsorption) by the magnetic attraction of the mask and board | substrate by a carrier. It is a figure for demonstrating the procedure of the holding | maintenance (adsorption) by the magnetic attraction of the mask and board | substrate by a carrier. It is a figure for demonstrating the procedure of the holding | maintenance (adsorption) by the magnetic attraction of the mask and board | substrate by a carrier. It is a figure for demonstrating the procedure of the holding | maintenance (adsorption) by the magnetic attraction of the mask and board | substrate by a carrier. It is a figure for demonstrating the principle of the method of detecting the state of a carrier by a detection part. It is a figure which shows schematic structure of suitable embodiment of this invention about the part relevant to the detection of a contact state. It is a figure which shows schematic structure of other suitable embodiment of this invention about the part relevant to the detection of a contact state.

Explanation of symbols

30 Substrate processing apparatus 101, 102X, 102Y Permanent electromagnet 102a Magnetic body 102b Polarity fixed magnet 102c Polarity variable magnet 102d Coil 102f Space 102k Conductive wire 120 Contact (first contact)
120 'inspection contact 121 contact (second contact)
130, 131 Joint 133 Temperature control device 140 Valve 151 Current supply unit 151a Second unit 151b Third unit 151c First unit 180 Magnetic sensor 182 Operation mechanism 185 Detection unit 200 Mask
200a Mask frame 200b Mask pattern part 201 Inspection contact 220 Detection part 300 Substrate 400 Support body 410 Carrier 420 Control part 500 Substrate holding device

Claims (10)

A carrier for holding the mask and the substrate by magnetically attracting a mask containing a magnetic material through the substrate,
A support;
A permanent electromagnet incorporated in the support;
A temperature control channel provided in the support;
A joint for connecting the temperature control channel with a pipe of an external temperature control device;
A valve for closing the temperature control flow path provided in or near the joint and filled with a temperature control medium in the temperature control flow path;
The permanent electromagnet includes a polarity variable magnet having a variable polarity, a coil that generates a magnetic field for changing the polarity of the polarity variable magnet, and a polarity fixed magnet having a fixed polarity.
The carrier is in a first state in which the mask and the substrate are held by the magnetic field generated by the polarity variable magnet and the polarity fixed magnet by controlling the polarity of the polarity variable magnet by the magnetic field generated by the coil. And a second state in which the mask and the substrate are not held,
A carrier characterized by the above. The temperature control channel includes an inlet and an outlet. The joint and the valve are provided at both the inlet and the outlet, and the temperature is controlled through the temperature control channel in a state where the two valves are opened. The preparation medium can be circulated,
The carrier according to claim 1. The mask includes a mask pattern part and a mask frame that supports the mask pattern part,
The permanent electromagnet is configured to magnetically attract the mask pattern portion;
The carrier further comprises another permanent electromagnet configured to be controlled independently of the permanent electromagnet to magnetically attract the mask frame.
The carrier according to claim 1 or 2, characterized by the above. A substrate processing apparatus for processing a substrate,
A carrier for holding the mask and the substrate by magnetically attracting a mask containing a magnetic material through the substrate;
A temperature control device for adjusting the temperature of the carrier,
The carrier is
A support;
A permanent electromagnet incorporated in the support;
A temperature control channel provided in the support;
A joint for connecting the temperature control flow path with a pipe of the temperature control device;
A valve for closing the temperature control flow path in a state where the temperature control flow path is filled with a temperature control medium provided in or near the joint;
The permanent electromagnet includes a polarity variable magnet having a variable polarity, a coil that generates a magnetic field for changing the polarity of the polarity variable magnet, and a polarity fixed magnet having a fixed polarity.
The carrier is in a first state in which the mask and the substrate are held by the magnetic field generated by the polarity variable magnet and the polarity fixed magnet by controlling the polarity of the polarity variable magnet by the magnetic field generated by the coil. And a second state in which the mask and the substrate are not held,
When the carrier is disposed at a predetermined position, the temperature control device connects the pipe line to the joint and supplies a temperature control medium to the temperature control flow path or controls the temperature from the temperature control flow path. Recover media,
A substrate processing apparatus. The temperature control flow path includes an inlet and an outlet, and both the inlet and the outlet are provided with the joint and the valve,
The temperature control device circulates a temperature control medium through the temperature control flow path when the carrier is disposed at a predetermined position.
The substrate processing apparatus according to claim 4.   The substrate processing apparatus according to claim 4, further comprising a removal unit that removes the temperature control medium from or near the joint. The removal unit includes at least one of a blower and a wiper.
The substrate processing apparatus according to claim 6. The mask includes a mask pattern part and a mask frame that supports the mask pattern part,
The permanent electromagnet is configured to magnetically attract the mask pattern portion;
The carrier further comprises another permanent electromagnet configured to be controlled independently of the permanent electromagnet to magnetically attract the mask frame.
The substrate processing apparatus according to claim 4, wherein the substrate processing apparatus is a substrate processing apparatus.   9. The substrate processing apparatus according to claim 4, further comprising a processing chamber for forming a film on the substrate held together with the mask by the carrier. A manufacturing method for manufacturing an image display device,
Including a step of forming a film on the substrate by the substrate processing apparatus according to claim 4.
The manufacturing method characterized by the above-mentioned.

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