JP2010080682A - Multilayer electronic component manufacturing method and ceramic green sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily form a lateral conductor layer in a multilayer electronic component. <P>SOLUTION: The electronic component includes a body including a plurality of laminated dielectric layers, and a lateral conductor layer arranged on the lateral part of the body. The body and the lateral conductor layer are formed using a ceramic green sheet 101 having a plurality of slits 120. The ceramic green sheet 101 includes a plurality of planned dielectric layer portions 110 set in array. Each planned dielectric layer portion 110 has an upper surface and a side that faces the slit 120. In each planned dielectric layer portion 110, an unbaked conductor layer 150 is formed from the upper surface to the side. After the unbaked conductor layer 150 is formed, an unbaked laminated body, which serves as the body and the lateral conductor layer, is formed using a plurality of ceramic green sheets including ceramic green sheets 101. After this unbaked laminated body is baked, the body and the lateral conductor layer are completely manufactured. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a multilayer electronic component including a main body including a plurality of stacked dielectric layers, and a side conductor layer disposed on a side portion of the main body, and manufacturing of the multilayer electronic component. The present invention relates to a ceramic green sheet used in the method.

  Bluetooth (registered trademark) standard communication devices, wireless LAN (local area network) communication devices, WiMAX (Worldwide Interoperability for Microwave Access) standard communication devices, and wireless communication devices such as cellular phones Since there is a strong demand for downsizing and thinning, there is a demand for downsizing and thinning of electronic components used therefor. As an electronic component capable of meeting this requirement, there is an electronic component using a multilayer substrate such as a low temperature co-fired ceramic multilayer substrate.

  An electronic component using a laminated substrate includes, for example, a plurality of laminated dielectric layers, and first and second end faces located at both ends in the lamination direction of the plurality of dielectric layers, and the first and second And a side conductor layer provided on the side portion of the main body. The side conductor layer is used as a terminal, for example. Here, an example of the manufacturing method of the electronic component using a laminated substrate is demonstrated. In this manufacturing method, first, a main body is produced by laminating and firing a plurality of ceramic green sheets in which conductor layers and through holes are formed, if necessary. Next, a side conductor layer is formed on the main body. The side conductor layer is formed, for example, by applying a conductor paste to the main body and firing the conductor paste.

  Patent Document 1 describes a manufacturing method of a chip electronic component as follows. In this manufacturing method, first, a plurality of green sheets in which a plurality of through holes are formed along a virtual cutting line to be cut later is formed. Next, in each green sheet, the terminal electrode paste is filled in the through holes. Next, in each green sheet, a pattern for the internal electrode layer is formed by an electrode paste. Next, a plurality of green sheets are stacked to form a stacked body. Next, this stacked body is cut along virtual cutting lines to form individual green chip bodies. Next, the green chip body is fired to form a chip electronic component. In this manufacturing method, the terminal electrode paste filled in the through hole along the virtual cutting line of the green sheet is baked to form the terminal electrode.

Japanese Patent Laid-Open No. 6-181141

  As described above, as a method for forming the side conductor layer on the side portion of the main body made of the laminated substrate, there is a method in which a conductor paste is applied to the main body and the conductor paste is baked. However, this method has a problem that the process for forming the side conductor layer is complicated.

  Moreover, in the method of forming the terminal electrode described in Patent Document 1, it is necessary to accurately define the positions and lengths of the plurality of through holes for the terminal electrode in the direction in which the virtual cutting line extends, and the green sheet In addition, there is a problem that the process of forming a plurality of through holes for terminal electrodes is complicated.

  The present invention has been made in view of such problems, and an object thereof is a multilayer type including a main body including a plurality of laminated dielectric layers and a side conductor layer disposed on a side portion of the main body. It is an object of the present invention to provide a method for manufacturing a multilayer electronic component capable of easily forming a side conductor layer in the electronic component, and a ceramic green sheet used in the method for manufacturing the multilayer electronic component.

  The method for manufacturing a multilayer electronic component according to the present invention includes a plurality of laminated dielectric layers and one or more internal conductor layers disposed between adjacent dielectric layers, A main body having first and second end faces located at both ends in the stacking direction, and a side part connecting the first and second end faces, and a side conductor layer disposed on the side part of the main body. This is a method for manufacturing a laminated electronic component.

The manufacturing method of the multilayer electronic component of the present invention includes:
Among the plurality of dielectric layer planned portions arranged in a line along at least two of the first and second directions orthogonal to each other, and among the plurality of dielectric layer planned portions, It extends along the second direction through the boundary between two adjacent dielectric layer portions adjacent in the direction, and has a length equal to or longer than the length of one dielectric layer portion in the second direction. One or more slits, each dielectric layer planned portion is a step of producing a slit-containing ceramic green sheet having an upper surface and a side surface facing the slit;
A step of forming a pre-firing conductor layer from the upper surface to the side surface in at least one dielectric layer planned portion of the ceramic green sheet with slits;
Using a plurality of ceramic green sheets including a slit-containing ceramic green sheet after the pre-firing conductor layer is formed, a step of producing a pre-firing laminate that later becomes a main body and side conductor layers;
And firing the laminate before firing to complete the main body and the side conductor layers.

  In the method for manufacturing a multilayer electronic component of the present invention, in the step of completing the main body and the side conductor layer, a portion of the pre-fired conductor layer that is disposed outside the outer edge of the upper surface of the dielectric layer planned portion is fired. And becomes at least a part of the side conductor layer.

  In the method for manufacturing a multilayer electronic component of the present invention, the slit may extend over the entire length of the ceramic green sheet with slits in the second direction.

  Further, in the method for manufacturing a multilayer electronic component according to the present invention, the step of producing the laminate before firing includes laminating a plurality of ceramic green sheets including a slitted ceramic green sheet after the pre-fired conductor layer is formed. The step of producing a green sheet laminate including the laminate before firing and the step of cutting the green sheet laminate so that the laminate before firing is cut out may be included. In this case, the step of manufacturing the slitted ceramic green sheet is performed by preparing the slitted ceramic green sheet so as to be disposed on the carrier film, and the step of preparing the green sheet laminate is the process of manufacturing the slitted ceramic green sheet by another type. After superposing on the ceramic green sheet, the carrier film may be peeled from the slit ceramic green sheet.

  The ceramic green sheet of the present invention includes a plurality of laminated dielectric layers and one or more internal conductor layers arranged between adjacent dielectric layers, and both ends of the plurality of dielectric layers in the lamination direction. A multilayer electronic device comprising: a main body having first and second end faces located on each other; a main body having a side portion connecting the first and second end faces; and a side conductor layer disposed on the side of the main body. It is used to form at least one dielectric layer in the body when manufacturing a part.

  The ceramic green sheet of the present invention includes a plurality of dielectric layer planned portions arranged so as to be aligned in at least two of the first and second directions orthogonal to each other, and a plurality of dielectric layers Of the planned portion, the first dielectric layer extends in the second direction through the boundary between two adjacent dielectric layer planned portions adjacent to each other in the first direction. And one or more slits having a length equal to or greater than the length. Each dielectric layer planned portion has an upper surface and a side surface facing the slit.

  In the ceramic green sheet of the present invention, the slit may extend over the entire length of the ceramic green sheet in the second direction.

  In the multilayer electronic component manufacturing method of the present invention, a conductor layer before firing is formed from the upper surface to the side surface in at least one dielectric layer planned portion of the slitted ceramic green sheet. A portion disposed outside the outer edge of the upper surface of the layer predetermined portion is fired to become at least a part of the side conductor layer. Therefore, according to the method for manufacturing a multilayer electronic component of the present invention, it is possible to easily form the side conductor layer disposed on the side portion of the main body.

  The ceramic green sheet of the present invention includes a plurality of dielectric layer planned portions and one or more slits, and each dielectric layer planned portion has an upper surface and a side surface facing the slit. . According to the ceramic green sheet of the present invention, when a multilayer electronic component is manufactured using the ceramic green sheet, a conductor layer before firing is formed on the side surface of the dielectric layer preliminary portion, whereby the side portion of the main body is formed. It is possible to easily form the side conductor layer disposed on the substrate.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, a ceramic green sheet according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a perspective view showing a ceramic green sheet according to the present embodiment.

  The ceramic green sheet according to the present embodiment is used when manufacturing a multilayer electronic component having the following configuration. The multilayer electronic component includes a plurality of stacked dielectric layers and one or more internal conductor layers disposed between adjacent dielectric layers, and is positioned at both ends in the stacking direction of the plurality of dielectric layers. A main body having first and second end surfaces and side portions connecting the first and second end surfaces, and a side conductor layer disposed on the side portion of the main body. The ceramic green sheet according to the present embodiment is used to form at least one dielectric layer in the main body when manufacturing the multilayer electronic component.

  As shown in FIG. 1, the ceramic green sheets 101 according to the present embodiment include a plurality of ceramic green sheets 101 that are arranged so that two or more are aligned along at least the first direction among the first and second directions orthogonal to each other. A dielectric layer planned portion 110 is provided. In FIG. 1, the first direction is indicated by an arrow with the symbol A1, and the second direction is indicated by an arrow with the symbol A2. In the example illustrated in FIG. 1, the plurality of planned dielectric layer portions 110 are arranged so that two or more are arranged in each of the first direction A1 and the second direction A2. In FIG. 1, the positions of the boundaries of the plurality of dielectric layer planned portions 110 arranged along the second direction A2 are indicated by a plurality of broken lines.

  The ceramic green sheet 101 according to the present embodiment further passes through the boundary between two planned dielectric layer portions 110 adjacent in the first direction A1 among the plurality of planned dielectric layer portions 110. One or more slits 120 extending along the two directions A2 are provided. In the example shown in FIG. 1, in particular, the ceramic green sheet 101 includes a plurality of slits 120. The slit 120 has a length equal to or longer than the length of one dielectric layer planned portion 110 in the second direction A2. In the example shown in FIG. 1, in particular, the slit 120 extends over the entire length of the ceramic green sheet 101 in the second direction A2. In this case, the ceramic green sheet 101 has a plurality of strip portions 102 separated from each other by one or more slits 120. Accordingly, in the example shown in FIG. 1, the ceramic green sheet 101 includes a plurality of strip portions 102 and one or more slits 120 that separate the plurality of strip portions 102 from each other. It can also be said that the above-described dielectric layer planned portion 110 is included. Each dielectric layer planned portion 110 has an upper surface 110 a and a side surface 110 b facing the slit 120.

  In the following description, it is necessary to distinguish the ceramic green sheet 101 according to the present embodiment having one or more slits 120 as described above from a general ceramic green sheet without the slits 120. Accordingly, it is referred to as a slitted ceramic green sheet 101.

  The portions other than the slit 120 in the ceramic green sheet 101 are formed of a mixture containing an additive, an organic binder, an organic solvent, and the like in addition to the ceramic raw material powder.

  As described above, the ceramic green sheet 101 shown in FIG. 1 includes a plurality of strip-like portions 102 separated from each other, and is used by being disposed on the carrier film 100. The carrier film 100 is peeled off from the ceramic green sheet 101 when a laminated electronic component is manufactured later. The carrier film 100 is formed of a resin such as polyethylene terephthalate (PET).

  Next, an example of a method for producing the ceramic green sheet 101 shown in FIG. 1 will be described with reference to FIG. In this method, a long carrier film 140 is conveyed along the outer peripheral surface of the back roll 131, and the slurry 133 for the ceramic green sheet 101 is provided by a nozzle 132 disposed at a position facing the outer peripheral surface of the back roll 131. Is discharged onto the carrier film 140. The nozzle 132 has a plurality of nozzle openings 132 a arranged at predetermined intervals and arranged in a direction parallel to the central axis of the back roll 131. By discharging the slurry 133 onto the traveling carrier film 140 from the plurality of nozzle openings 132a, a plurality of strip portions 134 each made of the slurry 133 and extending in the traveling direction of the carrier film 140 are formed on the carrier film 140. It is formed. In FIG. 2, the traveling direction of the carrier film 140 is indicated by an arrow. Next, the plurality of strip portions 134 on the carrier film 140 are dried, and the carrier film 140 and the plurality of strip portions 134 are cut at a plurality of cutting positions set at predetermined intervals in the traveling direction of the carrier film 140. Thus, the ceramic green sheet 101 and the carrier film 100 shown in FIG. 1 are formed. The carrier film 100 shown in FIG. 1 is formed by cutting the carrier film 140, and the plurality of strip portions 102 shown in FIG. 1 are formed by cutting the plurality of strip portions 134. is there. A first direction A1 shown in FIG. 1 is the width direction of the carrier film 140, and a second direction A2 shown in FIG.

  The method for producing the ceramic green sheet 101 is not limited to the example shown in FIG. For example, after a slurry for the ceramic green sheet 101 is uniformly applied on a carrier film to form a slurry film, for example, a plurality of jigs having a comb-shaped blade are used to extend the slurry film in one direction. Alternatively, the ceramic green sheet 101 may be formed. In this case, the plurality of grooves become the plurality of slits 120, and the plurality of strip portions 102 are formed by the portions of the slurry film remaining after the formation of the plurality of grooves.

  Next, a method for manufacturing a multilayer electronic component using the ceramic green sheet 101 according to the present embodiment will be described. First, with reference to FIG. 3 thru | or FIG. 9, the multilayer electronic component 1 which concerns on this Embodiment manufactured using the ceramic green sheet 101 is demonstrated. The multilayer electronic component 1 is an example of a multilayer electronic component manufactured using the ceramic green sheet 101. The multilayer electronic component manufactured using the ceramic green sheet 101 is the multilayer electronic component. It is not limited to 1.

  FIG. 3 is a perspective view showing an appearance of a multilayer electronic component (hereinafter simply referred to as an electronic component) 1. The electronic component 1 includes a main body 20 for integrating the components of the electronic component 1. As will be described in detail later, the main body 20 includes a plurality of stacked dielectric layers and one or more inner conductor layers disposed between adjacent dielectric layers.

  The main body 20 has a rectangular parallelepiped shape having an upper surface 20A, a bottom surface 20B, and four side surfaces 20C to 20F as outer surfaces. The four side surfaces 20C to 20F connect the upper surface 20A and the bottom surface 20B. The top surface 20A and the bottom surface 20B face opposite sides, the side surfaces 20C and 20D also face opposite sides, and the side surfaces 20E and 20F also face opposite sides. The side surfaces 20C to 20F are perpendicular to the top surface 20A and the bottom surface 20B. In the main body 20, the direction perpendicular to the top surface 20A and the bottom surface 20B is the stacking direction of the plurality of dielectric layers. In FIG. 3, the stacking direction of the plurality of dielectric layers is indicated by an arrow with a symbol T. The top surface 20A and the bottom surface 20B are located at both ends of the main body 20 in the stacking direction of the plurality of dielectric layers. The upper surface 20A corresponds to the first end surface in the present invention, and the bottom surface 20B corresponds to the second end surface in the present invention. The side surfaces 20C to 20F correspond to the side portions in the present invention.

  The electronic component 1 is further disposed on the ground conductor layer 21 disposed on the upper surface 20A, the input conductor layer 22 and ground conductor layers 24 and 25 disposed on the side surface 20C, and the side surface 20D. An output conductor layer 23 and ground conductor layers 26 and 27 are provided. On the side surface 20 </ b> C, the input conductor layer 22 is disposed between the ground conductor layers 24 and 25. On the side surface 20D, the output conductor layer 23 is disposed between the ground conductor layers 26 and 27. The ground conductor layer 21 is connected to the ground conductor layers 24 to 27. The conductor layers 22-27 are arrange | positioned at the side part of the main body 20, and respond | correspond to the side part conductor layer in this invention.

  FIG. 4 is a circuit diagram showing a circuit configuration of the electronic component 1. The electronic component 1 has a band-pass filter function. As shown in FIG. 4, the electronic component 1 includes an input terminal 2 used for signal input, an output terminal 3 used for signal output, and a second terminal electrically connected to the input terminal 2. 1 resonator 4, a second resonator 5 electrically connected to the output terminal 3, and a capacitor 15. The input terminal 2 is constituted by the input conductor layer 22 shown in FIG. The output terminal 3 is constituted by the output conductor layer 23 shown in FIG.

  The first resonator 4 includes a first inductor 11 and a first capacitor 13 that are electrically connected to each other. The second resonator 5 includes a second inductor 12 and a second capacitor 14 that are electrically connected to each other. The resonators 4 and 5 are inductively coupled to each other. Inductors 11 and 12 are also inductively coupled to each other. In FIG. 4, inductive coupling between the inductors 11 and 12 is represented by a curve with a symbol M attached thereto.

  One end of the inductor 11 and one end of each of the capacitors 13 and 15 are electrically connected to the input terminal 2. The other end of the inductor 11 and the other end of the capacitor 13 are electrically connected to the ground. One end of the inductor 12, one end of the capacitor 14, and the output terminal 3 are electrically connected to the other end of the capacitor 15. The other end of the inductor 12 and the other end of the capacitor 14 are electrically connected to the ground.

  The resonators 4 and 5 are provided between the input terminal 2 and the output terminal 3 in terms of circuit configuration, and realize the function of a bandpass filter. Each of the resonators 4 and 5 is a quarter wavelength resonator in which one end is opened and the other end is short-circuited, and the physical lengths of the inductors 11 and 12 are made shorter than the quarter wavelength by the capacitors 13 and 14. This is a quarter wavelength resonator using the effect.

  In the electronic component 1, when a signal is input to the input terminal 2, a signal having a frequency within a predetermined frequency band is selectively passed through a band pass filter configured using the resonators 4 and 5. Output from the output terminal 3.

  Next, the configuration of the electronic component 1 will be described in detail with reference to FIGS. 5A to 5C respectively show the top surfaces of the first to third dielectric layers from the top. 6A to 6C respectively show the top surfaces of the fourth to sixth dielectric layers from the top. 7A to 7C show the top surfaces of the seventh to ninth dielectric layers from the top, respectively. 8A and 8B respectively show the top surfaces of the tenth and eleventh dielectric layers from the top. 9A and 9B respectively show the top surfaces of the 12th and 13th dielectric layers from the top.

  The first dielectric layer 31 shown in FIG. 5A has an upper surface 31A, a lower surface (not shown), and four side surfaces 31C to 31F connecting the upper surface 31A and the lower surface. The side surfaces 31C to 31F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. A conductor layer 311 is formed for the dielectric layer 31. The conductor layer 311 is formed from the upper surface 31A to the side surfaces 31C and 31D. The conductor layer 311 includes a first portion 311a disposed on the upper surface 31A and second to fifth portions 311b to 311e disposed on the outer side of the outer edge of the upper surface 31A. The first portion 311a is the ground conductor layer 21 shown in FIG. The second portion 311b and the third portion 311c are in contact with the side surface 31C. The fourth portion 311d and the fifth portion 311e are in contact with the side surface 31D. The second to fifth parts 311b to 311e are part of the conductor layers 24 to 27, respectively.

  The second dielectric layer 32 shown in FIG. 5B has an upper surface 32A, a lower surface (not shown), and four side surfaces 32C to 32F connecting the upper surface 32A and the lower surface. The side surfaces 32C to 32F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 321 to 324 are formed for the dielectric layer 32. The conductor layers 321 and 322 are formed from the upper surface 32A to the side surface 32C. The conductor layers 323 and 324 are formed from the upper surface 32A to the side surface 32D.

  The conductor layer 321 has a first portion 321a disposed on the upper surface 32A and a second portion 321b disposed on the outer side of the outer edge of the upper surface 32A. The second portion 321 b is in contact with the side surface 32 </ b> C and is connected to the second portion 311 b of the conductor layer 311. The second portion 321 b becomes a part of the conductor layer 24. The conductor layer 322 has a first portion 322a disposed on the upper surface 32A and a second portion 322b disposed on the outer side of the outer edge of the upper surface 32A. The second portion 322b is in contact with the side surface 32C and is connected to the third portion 311c of the conductor layer 311. The second portion 322 b becomes a part of the conductor layer 25.

  The conductor layer 323 has a first portion 323a disposed on the upper surface 32A and a second portion 323b disposed outside the outer edge of the upper surface 32A. The second portion 323b is in contact with the side surface 32D and is connected to the fourth portion 311d of the conductor layer 311. The second portion 323 b becomes a part of the conductor layer 26. The conductor layer 324 has a first portion 324a disposed on the upper surface 32A and a second portion 324b disposed on the outer side of the outer edge of the upper surface 32A. The second portion 324b is in contact with the side surface 32D and is connected to the fifth portion 311e of the conductor layer 311. The second portion 324 b becomes a part of the conductor layer 27.

  The third dielectric layer 33 shown in FIG. 5C has an upper surface 33A, a lower surface (not shown), and four side surfaces 33C to 33F connecting the upper surface 33A and the lower surface. The side surfaces 33C to 33F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 331 to 334 are formed for the dielectric layer 33. The conductor layers 331 and 332 are formed over the upper surface 33A and the side surface 33C. The conductor layers 333 and 334 are formed from the upper surface 33A to the side surface 33D. The conductor layer 331 has first and second portions 331a and 331b. The conductor layer 332 has first and second portions 332a and 332b. The conductor layer 333 has first and second portions 333a and 333b. The conductor layer 334 has first and second portions 334a and 334b. The configuration of the conductor layers 331 to 334 is the same as that of the conductor layers 321 to 324 shown in FIG.

  The fourth dielectric layer 34 shown in FIG. 6A has an upper surface 34A, a lower surface (not shown), and four side surfaces 34C to 34F connecting the upper surface 34A and the lower surface. The side surfaces 34C to 34F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 341 to 344 are formed for the dielectric layer 34. The conductor layers 341 and 342 are formed from the upper surface 34A to the side surface 34C. The conductor layers 343 and 344 are formed from the upper surface 34A to the side surface 34D. The conductor layer 341 has first and second portions 341a and 341b, the conductor layer 342 has first and second portions 342a and 342b, and the conductor layer 343 has first and second portions 343a and 343b. The conductor layer 344 has first and second portions 344a and 344b. The configuration of the conductor layers 341 to 344 is the same as that of the conductor layers 321 to 324 shown in FIG.

  The fifth dielectric layer 35 shown in FIG. 6B has an upper surface 35A, a lower surface (not shown), and four side surfaces 35C to 35F connecting the upper surface 35A and the lower surface. The side surfaces 35C to 35F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 351 to 354 are formed for the dielectric layer 35. The conductor layers 351 and 352 are formed from the upper surface 35A to the side surface 35C. The conductor layers 353 and 354 are formed from the upper surface 35A to the side surface 35D. The conductor layer 351 has first and second portions 351a and 351b, the conductor layer 352 has first and second portions 352a and 352b, and the conductor layer 353 has first and second portions 353a and 353b. The conductor layer 354 has first and second portions 354a and 354b. The configuration of the conductor layers 351 to 354 is the same as that of the conductor layers 321 to 324 shown in FIG.

  The sixth dielectric layer 36 shown in FIG. 6C has an upper surface 36A, a lower surface (not shown), and four side surfaces 36C to 36F connecting the upper surface 36A and the lower surface. The side surfaces 36C to 36F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 361 to 364 are formed for the dielectric layer 36. The conductor layers 361 and 362 are formed from the upper surface 36A to the side surface 36C. The conductor layers 363 and 364 are formed from the upper surface 36A to the side surface 36D.

  The conductor layer 361 has a first portion 361a disposed on the upper surface 36A and a second portion 361b disposed on the outer side of the outer edge of the upper surface 36A. The first portion 361a constitutes a part of the capacitor 13 shown in FIG. The second portion 361b is in contact with the side surface 36C and is connected to the second portion 351b of the conductor layer 351. The second portion 361 b becomes a part of the conductor layer 24. The conductor layer 363 has a first portion 363a disposed on the upper surface 36A and a second portion 363b disposed on the outer side of the outer edge of the upper surface 36A. The first portion 363a constitutes a part of the capacitor 14 shown in FIG. The second portion 363b is in contact with the side surface 36D and is connected to the second portion 353b of the conductor layer 353. The second portion 363 b becomes a part of the conductor layer 26. The conductor layer 362 has first and second portions 362a and 362b, and the conductor layer 364 has first and second portions 364a and 364b. The configuration of the conductor layers 362 and 364 is the same as that of the conductor layers 322 and 324 shown in FIG.

  The seventh dielectric layer 37 shown in FIG. 7A has an upper surface 37A, a lower surface (not shown), and four side surfaces 37C to 37F connecting the upper surface 37A and the lower surface. The side surfaces 37C to 37F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 371 to 374 are formed for the dielectric layer 37.

  The conductor layer 371 is formed from the upper surface 37A to the side surface 37C. The conductor layer 371 includes a first portion 371a disposed on the upper surface 37A, and second and third portions 371b and 371c disposed outside the outer edge of the upper surface 37A. The first portion 371a constitutes a part of the capacitor 13 shown in FIG. 4 and the inductor 11 shown in FIG. The second portion 371b is in contact with the side surface 37C. The second portion 371 b becomes a part of the conductor layer 22. The third portion 371c is in contact with the side surface 37C and is connected to the second portion 362b of the conductor layer 362. The third portion 371 c becomes a part of the conductor layer 25.

  The conductor layer 372 is formed from the upper surface 37A to the side surface 37D. The conductor layer 372 includes a first portion 372a disposed on the upper surface 37A, and second and third portions 372b and 372c disposed on the outer side of the outer edge of the upper surface 37A. The first portion 372a constitutes a part of the capacitor 14 shown in FIG. 4 and also constitutes the inductor 12 shown in FIG. The second portion 372b is in contact with the side surface 37D. The second portion 372 b becomes a part of the conductor layer 23. The third portion 372c is in contact with the side surface 37D and is connected to the second portion 364b of the conductor layer 364. The third portion 372 c becomes a part of the conductor layer 27.

  The conductor layer 373 has first and second portions 373a and 373b, and the conductor layer 374 has first and second portions 374a and 374b. The configuration of the conductor layers 373 and 374 is the same as that of the conductor layers 321 and 323 shown in FIG.

  The eighth dielectric layer 38 shown in FIG. 7B has an upper surface 38A, a lower surface not shown, and four side surfaces 38C to 38F connecting the upper surface 38A and the lower surface. The side surfaces 38C to 38F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 381 to 387 are formed for the dielectric layer 38.

  The conductor layer 381 is disposed on the upper surface 38A. The conductor layer 381 faces the conductor layers 371 and 372 with the dielectric layer 37 interposed therebetween. The conductor layers 371, 372, 381 and the dielectric layer 37 constitute the capacitor 15 shown in FIG.

  The conductor layers 382, 384, and 385 are formed from the upper surface 38A to the side surface 38C. The conductor layers 383, 386, and 387 are formed from the upper surface 38A to the side surface 38D. The conductor layer 382 has a first portion 382a disposed on the upper surface 38A and a second portion 382b disposed on the outer side of the outer edge of the upper surface 38A. The second portion 382b is in contact with the side surface 38C and is connected to the second portion 371b of the conductor layer 371. The second portion 382 b becomes a part of the conductor layer 22. The conductor layer 383 has a first portion 383a disposed on the upper surface 38A and a second portion 383b disposed on the outer side of the outer edge of the upper surface 38A. The second portion 383b is in contact with the side surface 38D and is connected to the second portion 372b of the conductor layer 372. The second portion 383 b becomes a part of the conductor layer 23.

  The conductor layer 384 has a first portion 384a disposed on the upper surface 38A and a second portion 384b disposed on the outer side of the outer edge of the upper surface 38A. A part of the first portion 371 a of the conductor layer 371 is disposed between the first portion 361 a of the conductor layer 361 and the first portion 384 a of the conductor layer 384. The first portion 361a, the conductor layer 371, the first portion 384a, and the dielectric layers 36 and 37 constitute the capacitor 13 shown in FIG. The second portion 384b is in contact with the side surface 38C and is connected to the second portion 373b of the conductor layer 373. The second portion 384 b becomes a part of the conductor layer 24.

  The conductor layer 386 has a first portion 386a disposed on the upper surface 38A and a second portion 386b disposed on the outer side of the outer edge of the upper surface 38A. A part of the first portion 372 a of the conductor layer 372 is disposed between the first portion 363 a of the conductor layer 363 and the first portion 386 a of the conductor layer 386. The first portion 363a, the conductor layer 372, the first portion 386a, and the dielectric layers 36 and 37 constitute the capacitor 14 shown in FIG. The second portion 386b is in contact with the side surface 38D and is connected to the second portion 374b of the conductor layer 374. The second portion 386 b becomes a part of the conductor layer 26.

  The conductor layer 385 has a first portion 385a disposed on the upper surface 38A and a second portion 385b disposed on the outer side of the outer edge of the upper surface 38A. The second portion 385b is in contact with the side surface 38C and is connected to the third portion 371c of the conductor layer 371. The second portion 385b becomes a part of the conductor layer 25.

  The conductor layer 387 has a first portion 387a disposed on the upper surface 38A and a second portion 387b disposed on the outer side of the outer edge of the upper surface 38A. The second portion 387b is in contact with the side surface 38D and is connected to the third portion 372c of the conductor layer 372. The second portion 387 b becomes a part of the conductor layer 27.

  The ninth dielectric layer 39 shown in FIG. 7C has an upper surface 39A, a lower surface (not shown), and four side surfaces 39C to 39F connecting the upper surface 39A and the lower surface. The side surfaces 39C to 39F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 392 to 397 are formed for the dielectric layer 39. The conductor layers 392, 394, and 395 are formed from the upper surface 39A to the side surface 39C. The conductor layers 393, 396, 397 are formed from the upper surface 39A to the side surface 39D. The conductor layer 392 has first and second portions 392a and 392b. The conductor layer 393 has first and second portions 393a and 393b. The conductor layer 394 has first and second portions 394a and 394b. The conductor layer 395 has first and second portions 395a and 395b. The conductor layer 396 has first and second portions 396a and 396b. The conductor layer 397 has first and second portions 397a and 397b. The configuration of the conductor layers 394, 395, 396, and 397 is the same as that of the conductor layers 321, 322, 323, and 324 shown in FIG. 5B, and the configuration of the conductor layers 392 and 393 is shown in FIG. Since it is the same as the conductor layers 382 and 383 shown, detailed description thereof will be omitted.

  The tenth dielectric layer 40 shown in FIG. 8A has an upper surface 40A, a lower surface (not shown), and four side surfaces 40C to 40F connecting the upper surface 40A and the lower surface. The side surfaces 40C to 40F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 402 to 407 are formed for the dielectric layer 40. The conductor layers 402, 404, and 405 are formed from the upper surface 40A to the side surface 40C. The conductor layers 403, 406, and 407 are formed from the upper surface 40A to the side surface 40D. The conductor layer 402 has first and second portions 402a and 402b. The conductor layer 403 has first and second portions 403a and 403b. The conductor layer 404 has first and second portions 404a and 404b. The conductor layer 405 has first and second portions 405a and 405b. The conductor layer 406 has first and second portions 406a and 406b. The conductor layer 407 has first and second portions 407a and 407b. The configuration of the conductor layers 402 to 407 is the same as that of the conductor layers 392 to 397 shown in FIG.

  The eleventh dielectric layer 41 shown in FIG. 8B has an upper surface 41A, a lower surface (not shown), and four side surfaces 41C to 41F connecting the upper surface 41A and the lower surface. The side surfaces 41C to 41F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 412 to 417 are formed for the dielectric layer 41. The conductor layers 412, 414, and 415 are formed from the upper surface 41A to the side surface 41C. The conductor layers 413, 416, and 417 are formed from the upper surface 41A to the side surface 41D. The conductor layer 412 has first and second portions 412a and 412b. The conductor layer 413 has first and second portions 413a and 413b. The conductor layer 414 has first and second portions 414a and 414b. The conductor layer 415 has first and second portions 415a and 415b. The conductor layer 416 has first and second portions 416a and 416b. The conductor layer 417 has first and second portions 417a and 417b. The configuration of the conductor layers 412 to 417 is the same as that of the conductor layers 392 to 397 shown in FIG.

  The twelfth dielectric layer 42 shown in FIG. 9A has an upper surface 42A, a lower surface (not shown), and four side surfaces 42C to 42F that connect the upper surface 42A and the lower surface. The side surfaces 42C to 42F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 422 to 427 are formed for the dielectric layer 42. The conductor layers 422, 424, and 425 are formed from the upper surface 42A to the side surface 42C. The conductor layers 423, 426, 427 are formed from the upper surface 42A to the side surface 42D. The conductor layer 422 has first and second portions 422a and 422b. The conductor layer 423 has first and second portions 423a and 423b. The conductor layer 424 has first and second portions 424a and 424b. The conductor layer 425 has first and second portions 425a and 425b. The conductor layer 426 has first and second portions 426a and 426b. The conductor layer 427 has first and second portions 427a and 427b. The configuration of the conductor layers 422 to 427 is the same as that of the conductor layers 392 to 397 shown in FIG.

  The thirteenth dielectric layer 43 shown in FIG. 9B has an upper surface 43A, a lower surface (not shown), and four side surfaces 43C to 43F connecting the upper surface 43A and the lower surface. The side surfaces 43C to 43F are disposed on the side surfaces 20C to 20F of the main body 20, respectively. Conductive layers 431 to 433 are formed for the dielectric layer 43. The conductor layer 431 is formed from the upper surface 43A to the side surfaces 43C and 43D. The conductor layer 431 includes a first portion 431a disposed on the upper surface 43A and second to fifth portions 431b to 431e disposed on the outer side of the outer edge of the upper surface 43A. The second portion 431b and the third portion 431c are in contact with the side surface 43C. The fourth portion 431d and the fifth portion 431e are in contact with the side surface 43D. The second to fifth portions 431b to 431e are part of the conductor layers 24 to 27, respectively.

  The conductor layer 432 is formed from the upper surface 43A to the side surface 43C. The conductor layer 433 is formed from the upper surface 43A to the side surface 43D. The conductor layer 432 has first and second portions 432a and 432b. The conductor layer 433 has first and second portions 433a and 433b. The configuration of the conductor layers 432 and 433 is the same as that of the conductor layers 392 and 393 shown in FIG.

  The electronic components 1 shown in FIG. 3 are configured by laminating the dielectric layers 31 to 43 shown in FIGS. 5 to 9 and a plurality of conductor layers. The ground conductor layer 21 is constituted by the first portion 311a of the conductor layer 311 shown in FIG. The input conductor layer 22 is more than the outer edge of the upper surface of the dielectric layers 37 to 43 among the plurality of conductor layers formed on the dielectric layers 37 to 43 shown in FIGS. It is comprised by the part 371b, 382b, 392b, 402b, 412b, 422b, 432b arrange | positioned on the outer side. The output conductor layer 23 is more than the outer edge of the upper surface of the dielectric layers 37 to 43 among the plurality of conductor layers formed on the dielectric layers 37 to 43 shown in FIGS. It is comprised by the part 372b, 383b, 393b, 403b, 413b, 423b, 433b arrange | positioned on the outer side.

  The ground conductor layer 24 is more than the outer edge of the upper surface of the dielectric layers 31 to 43 among the plurality of conductor layers formed on the dielectric layers 31 to 43 shown in FIGS. It is comprised by the part 311b, 321b, 331b, 341b, 351b, 361b, 373b, 384b, 394b, 404b, 414b, 424b, 431b arrange | positioned on the outer side.

  The ground conductor layer 25 is more than the outer edge of the upper surface of the dielectric layers 31 to 43 among the plurality of conductor layers formed on the dielectric layers 31 to 43 shown in FIGS. It is comprised by the part 311c, 322b, 332b, 342b, 352b, 362b, 371c, 385b, 395b, 405b, 415b, 425b, 431c arrange | positioned on the outer side.

  The ground conductor layer 26 is more than the outer edge of the upper surface of the dielectric layers 31 to 43 among the plurality of conductor layers formed on the dielectric layers 31 to 43 shown in FIGS. It is comprised by the part 311d, 323b, 333b, 343b, 353b, 363b, 374b, 386b, 396b, 406b, 416b, 426b, 431d arranged outside.

  The ground conductor layer 27 is more than the outer edge of the upper surface of the dielectric layers 31 to 43 among the plurality of conductor layers formed on the dielectric layers 31 to 43 shown in FIGS. It is comprised by the part 311e, 324b, 334b, 344b, 354b, 364b, 372c, 387b, 397b, 407b, 417b, 427b, 431e arrange | positioned on the outer side.

  Of the plurality of conductor layers formed for the dielectric layers 32 to 43 shown in FIGS. 5B to 9B, the portion disposed on the upper surface of the dielectric layers 32 to 43 is the internal conductor layer. It becomes.

  Next, taking the case of manufacturing the electronic component 1 shown in FIGS. 3 to 9 as an example, a method for manufacturing the electronic component according to the present embodiment will be described. In the method of manufacturing an electronic component according to the present embodiment, first, the ceramic green sheet 101 shown in FIG. 1 is made to correspond to the dielectric layers 31 to 43 shown in FIGS. 5 (a) to 9 (b). 13 sheets are produced. Each ceramic green sheet 101 is disposed on the carrier film 100.

  Next, as shown in FIG. 10, in each ceramic green sheet 101, at least one pre-fired conductor layer 150 is formed in at least one dielectric layer planned portion 110. In FIG. 10, the positions of the boundaries of the plurality of dielectric layer planned portions 110 arranged along the second direction A2 are indicated by a plurality of broken lines. The pre-fired conductor layer 150 is fired later to become a conductor layer formed on the dielectric layer. Of the pre-firing conductor layer 150, the pre-firing conductor layer 150 corresponding to the conductor layer formed from the top surface to the side surface of the dielectric layer, in particular, includes a portion disposed on the top surface 110a of the dielectric layer planned portion 110, and a top surface. 110a and a portion disposed outside the outer edge of 110a. The portion disposed outside the outer edge of the upper surface 110 a is in contact with the side surface 110 b of the dielectric layer planned portion 110. The pre-firing conductor layer 150 is formed, for example, by printing a conductor paste. When simultaneously manufacturing a plurality of electronic components 1 having the same configuration, as shown in FIG. 10, in each ceramic green sheet 101, one or more of the same pattern is formed with respect to a plurality of dielectric layer planned portions 110. A pre-firing conductor layer 150 is formed.

  FIG. 10 shows a conductor layer 311 shown in FIG. 5A with respect to a plurality of dielectric layer planned portions 110 in the ceramic green sheet 101 corresponding to the dielectric layer 31 shown in FIG. In this example, the pre-fired conductor layer 150 is formed. Similarly to the example shown in FIG. 10, in the ceramic green sheet 101 corresponding to each of the dielectric layers 32 to 43, each of the plurality of planned dielectric layer portions 110 is formed for the corresponding dielectric layer. A pre-firing conductor layer 150 is formed to be a conductor layer to be formed.

  FIG. 11 shows an example of a cross section of the ceramic green sheet 101 and the carrier film 100 after the pre-firing conductor layer 150 is formed. The pre-fired conductor layer 150 shown in FIG. 11 is formed from the upper surface 110a to the side surface 110b in the dielectric layer planned portion 110. The thickness of the band-like portion 102 of the ceramic green sheet 101, that is, the thickness t1 of the dielectric layer planned portion 110 is, for example, in the range of 10 to 40 μm. The thickness t2 of the pre-firing conductor layer 150 is, for example, in the range of 5 to 15 μm. The width of the slit 120 is, for example, in the range of 250 to 500 μm.

  Next, the 13 ceramic green sheets 101 after the pre-firing conductor layer 150 is formed are laminated in accordance with the order of lamination of the dielectric layers 31 to 43. FIG. 12 shows a method of laminating a plurality of ceramic green sheets 101. In this method, first, the first ceramic green sheet 101 corresponding to the dielectric layer 31 placed on the carrier film 100 is placed on the film 160 so that the carrier film 100 is on top. Put. The film 160 is made of a resin such as polyethylene terephthalate (PET). Next, the carrier film 100 is peeled from the ceramic green sheet 101. As a result, the first ceramic green sheet 101 remains on the film 160. Next, the second ceramic green sheet 101 corresponding to the dielectric layer 32 placed on the carrier film 100 is placed on the first ceramic green sheet 101 so that the carrier film 100 faces up. After placing on top, press. Next, the carrier film 100 is peeled from the second ceramic green sheet 101. FIG. 12 shows the situation at this time. As a result, the second ceramic green sheet 101 is laminated on the first ceramic green sheet 101. Thereafter, the third to thirteenth ceramic green sheets 101 are sequentially laminated by the same method.

  FIG. 13 shows a green sheet laminate 161 composed of 13 ceramic green sheets 101 laminated by the above method. The green sheet laminated body 161 includes a plurality of pre-firing laminated bodies 1P arranged so that two or more are arranged in each of the first direction A1 and the second direction A2. In FIG. 13, the positions of the boundaries of the plurality of pre-firing laminates 1P arranged along the second direction A2 are indicated by a plurality of broken lines.

  Next, the green sheet laminated body 161 and the film 160 are cut | disconnected in the position of the several broken line shown in FIG. 13 so that the several laminated body 1P before baking may be cut out. Next, the film 160 is peeled from the laminate 1P before firing.

  FIG. 14 is a perspective view showing the pre-firing laminate 1P. The pre-firing laminate 1 </ b> P includes a main body planned portion 20 </ b> P that is fired later to become the main body 20, and a plurality of conductor layer planned portions that are fired later to become conductor layers 21 to 27. In FIG. 14, reference numerals 21 </ b> P, 22 </ b> P, 24 </ b> P, and 25 </ b> P are attached only to the conductor layer planned portions that will later become the conductor layers 21, 22, 24, and 25.

  Next, the laminate 1P before firing is fired. Thereby, the main body planned portion 20P is fired to become the main body 20, and the plurality of conductor layer planned portions are fired to become the conductor layers 21 to 27, whereby the electronic component 1 shown in FIGS. 3 to 9 is completed.

  In the electronic component 1 shown in FIGS. 3 to 9, in all the dielectric layers 31 to 43 included in the main body 20, a part of the conductor layer is disposed on the side surface of the dielectric layer. Therefore, in the description of the electronic component manufacturing method described above, all the dielectric layers 31 to 43 are formed using the slitted ceramic green sheet 101. However, when the electronic component includes a dielectric layer in which a part of the conductor layer is disposed on the side surface of the dielectric layer and a dielectric layer in which a part of the conductor layer is not disposed on the side surface of the dielectric layer. The dielectric layer in which a part of the conductor layer is disposed on the side surface of the dielectric layer is formed by using the ceramic green sheet 101 with slits. However, a part of the conductor layer is disposed on the side surface of the dielectric layer. The dielectric layer that is not formed may be formed using the ceramic green sheet 101 with slits, or may be formed using a general ceramic green sheet without slits.

  As described above, in the electronic component manufacturing method according to the present embodiment, the pre-fired conductor layer 150 is formed from the upper surface 110a to the side surface 110b in the at least one dielectric layer planned portion 110 of the slitted ceramic green sheet 101. Of the pre-fired conductor layer 150, the portion disposed outside the outer edge of the upper surface 110a of the dielectric layer predetermined portion 110 is fired to become at least a part of the side conductor layer. Therefore, according to the present embodiment, the side conductor layer can be formed simultaneously with the firing for manufacturing the main body 20. As described above, according to the present embodiment, it is possible to easily form the side conductor layer without using the complicated process of forming the side conductor layer on the main body 20 produced by firing. become.

  Further, according to the slitted ceramic green sheet 101 according to the present embodiment, when the electronic component is manufactured using the ceramic green sheet 101, the pre-fired conductor layer 150 is formed on the side surface 110b of the dielectric layer planned portion 110. By forming a part, the side conductor layer can be easily formed.

  Further, in the slitted ceramic green sheet 101 according to the present embodiment, the slit 120 has a length that is equal to or longer than the length of one dielectric layer planned portion 110 in the second direction A2. As described in Patent Document 1, when forming a plurality of through holes along a virtual cutting line of a green sheet, the positions and lengths of the plurality of through holes are accurately determined in the direction in which the virtual cutting line extends. It needs to be well defined. However, the slit 120 in the present embodiment does not require the accuracy required for a plurality of through holes with respect to the position and length in the longitudinal direction. In addition, the slit 120 in this embodiment can be easily formed as compared to a plurality of through holes. These effects are particularly remarkable when the slit 120 extends over the entire length of the ceramic green sheet 101 in the second direction A2. For these reasons, according to the present embodiment, the slitted ceramic green sheet 101 can be easily formed, and the manufacture of electronic components using the slitted ceramic green sheet 101 is facilitated.

[Second Embodiment]
Next, a method for manufacturing an electronic component according to the second embodiment of the present invention will be described. FIG. 15 is a perspective view showing an appearance of the electronic component 201 according to the present embodiment. Electronic component 201 according to the present embodiment functions as an inductor. The electronic component 201 includes a main body 220 for integrating the components of the electronic component 201. The main body 220 includes a plurality of laminated dielectric layers 231 to 244 and a plurality of internal conductor layers disposed between adjacent dielectric layers. The main body 220 has a top surface, a bottom surface, and side portions that connect the top surface and the bottom surface. The dielectric layers 231 to 244 are arranged in this order from the top.

  The electronic component 201 further includes a terminal conductor layer 210 bonded to the upper surface of the main body 220, a terminal conductor layer 280 bonded to the bottom surface of the main body 220, and a plurality of side portions disposed on the side portions of the main body 220. And a conductor layer.

  Hereinafter, the configuration of the main body 220 will be described in detail. First, with reference to FIG. 16, the dielectric layers 232 to 236 and the conductor layers formed thereon will be described. In FIG. 16, (a) to (d) indicate dielectric layers 232 to 235, respectively. As shown in FIG. 16, each of the dielectric layers 232 to 235 has an upper surface, a lower surface, and four side surfaces that connect the upper surface and the lower surface. Conductive layers 250 are formed for the dielectric layers 232 to 235, respectively.

  As shown in FIG. 16A, the conductor layer 250 formed on the dielectric layer 232 is formed from the upper surface of the dielectric layer 232 to one side surface. The conductor layer 250 has a first portion 250a that is disposed in the vicinity of one side of the upper surface of the dielectric layer 232 and extends in a direction parallel to the side. The first portion 250a has a first end and a second end located at both ends in the longitudinal direction. The conductor layer 250 further includes a second portion 250 b that is connected to the second end of the first portion 250 a and is disposed outside the outer edge of the upper surface of the dielectric layer 232. The second portion 250 b is in contact with one side surface of the dielectric layer 232. The second portion 250b constitutes a side conductor layer.

  As shown in FIGS. 16B to 16D, the dielectric layers 233 to 235 and the shape of the conductor layer 250 formed thereon are the same as the dielectric layer 232 shown in FIG. It is the same as the conductor layer 250 formed with respect to it. However, as shown in FIGS. 16A to 16D, the arrangement of the dielectric layers 223 to 235 and the conductor layer 250 formed thereon is parallel to the stacking direction of the dielectric layers 223 to 235. It differs by 90 degrees around the axis. The lower end portion of the second portion 250b in the conductor layer 250 formed on the dielectric layer 232 is a portion near the first end portion of the first portion 250a in the conductor layer 250 formed on the dielectric layer 233. It is connected to the. Similarly, the lower end portion of the second portion 250b in the conductor layer 250 formed on the dielectric layer 233 is in the vicinity of the first end portion of the first portion 250a in the conductor layer 250 formed on the dielectric layer 234. Connected to the part. Further, the lower end portion of the second portion 250b in the conductor layer 250 formed on the dielectric layer 234 is a portion in the vicinity of the first end portion of the first portion 250a in the conductor layer 250 formed on the dielectric layer 235. It is connected to the. In this way, the four conductor layers 250 formed on the dielectric layers 232 to 235 are connected in series, and a coil of one turn is formed by the four conductor layers 250.

  The shape and arrangement of the dielectric layers 236 to 239 and the conductor layer 250 formed thereon are the same as the dielectric layers 232 to 235 and the conductor layer 250 formed thereon. A lower end portion of the second portion 250b in the conductor layer 250 formed on the dielectric layer 235 is connected to a portion in the vicinity of the first end portion of the first portion 250a in the conductor layer 250 formed on the dielectric layer 236. Has been.

  The shape and arrangement of the dielectric layers 240 to 243 and the conductor layer 250 formed thereon are also the same as the dielectric layers 232 to 235 and the conductor layer 250 formed thereon. A lower end portion of the second portion 250b in the conductor layer 250 formed on the dielectric layer 239 is connected to a portion in the vicinity of the first end portion of the first portion 250a in the conductor layer 250 formed on the dielectric layer 240. Has been.

  In this way, the twelve conductor layers 250 formed on the dielectric layers 232 to 243 are connected in series, and the twelve conductor layers 250 form a three-turn coil.

  FIG. 17 is a perspective view showing the positional relationship between the dielectric layers 231 to 244 and the conductor layers formed thereon. As shown in FIG. 17, a conductor layer 260 is formed for the dielectric layer 231. The conductor layer 260 is formed from the upper surface of the dielectric layer 231 to one side surface. The conductor layer 260 includes a first portion 260a disposed on the top surface of the dielectric layer 231 and a second portion disposed outside the outer edge of the top surface of the dielectric layer 231 and connected to the first portion 260a. 260b. The second portion 260 b is in contact with one side surface of the dielectric layer 231. A lower end portion of the second portion 260 b is connected to a portion in the vicinity of the first end portion of the first portion 250 a in the conductor layer 250 formed in the dielectric layer 232. The second portion 260b constitutes a side conductor layer. The terminal conductor layer 210 shown in FIG. 15 is connected to the conductor layer 260.

  A conductor layer 270 is formed on the upper surface of the dielectric layer 244. A lower end portion of the second portion 250 b in the conductor layer 250 formed on the dielectric layer 243 is connected to the conductor layer 270. In addition, a through hole 271 connected to the conductor layer 270 is formed in the dielectric layer 244. The terminal conductor layer 280 shown in FIG. 15 is connected to the through hole 271.

  In this manner, the terminal conductor layers 210 and 280 are connected to both ends of the three-turn coil composed of the twelve conductor layers 250 formed in the dielectric layers 232 to 243.

  Next, with reference to FIG. 18, the manufacturing method of the electronic component 201 which concerns on this Embodiment is demonstrated. In the present embodiment, the dielectric layers 231 to 243 and the conductor layers formed thereon are formed using the ceramic green sheet 101 described in the first embodiment. FIG. 18 shows the ceramic green sheet 101 after a plurality of pre-fired conductor layers are formed. In the manufacturing method of electronic component 201 according to the present embodiment, 13 ceramic green sheets 101 for dielectric layers 231 to 243 are prepared. As for the twelve ceramic green sheets 101 for the dielectric layers 232 to 243, as shown in FIG. 18, a plurality of pre-fired conductor layers that later become the plurality of conductor layers 250 in the plurality of dielectric layer planned portions 110. 250P is formed. The pre-firing conductor layer 250P has a portion disposed on the upper surface 110a of the dielectric layer predecessor 110 and a portion disposed on the outer side of the outer edge of the upper surface 110a. The portion disposed outside the outer edge of the upper surface 110 a is in contact with the side surface 110 b of the dielectric layer planned portion 110. The pre-firing conductor layer 250P is formed, for example, by printing a conductor paste.

  Although not shown, with respect to one ceramic green sheet 101 for the dielectric layer 231, a plurality of pre-fired conductor layers that will later become the plurality of conductor layers 260 are formed in the plurality of dielectric layer planned portions 110.

  Further, in this embodiment, in order to form the dielectric layer 244, the conductor layer 270, and the through-holes 271, a plurality of pre-fired conductor layers that later become the plurality of conductor layers 270 and a plurality that become the plurality of through-holes 271 later. A ceramic green sheet having a through hole before firing is prepared. The ceramic green sheet used at this time may be a ceramic green sheet 101 with slits or a general ceramic green sheet without slits.

  Next, 14 ceramic green sheets corresponding to the dielectric layers 231 to 244 after the pre-firing conductor layers are formed are laminated in accordance with the lamination order of the dielectric layers 231 to 244, A green sheet laminate is prepared. At this time, the 14 ceramic green sheets are arranged so that the positional relationship of the pre-fired conductor layers formed thereon coincides with the positional relationship of the conductor layers formed on the dielectric layers 231 to 244. The method of laminating a plurality of ceramic green sheets is the same as in the first embodiment.

  The green sheet laminate includes a plurality of pre-fired laminates that are arranged in two or more in each of the first direction A1 and the second direction A2. The pre-fired laminate includes a main body planned portion that is fired later to become the main body 220 and a plurality of conductor layer planned portions that are each fired later to become a plurality of side conductor layers.

  Next, the green sheet laminate is cut so that a plurality of laminates before firing are cut out. Next, the laminate before firing is fired. Thereby, the main body planned portion is fired to become the main body 220, and the plurality of conductor layer planned portions are fired to become the plurality of side conductor layers.

  Next, the terminal conductor layer 210 is formed so as to be bonded to the upper surface of the main body 220, and the terminal conductor layer 280 is formed so as to be bonded to the bottom surface of the main body 220. The terminal conductor layers 210 and 280 are formed, for example, by performing conductor sheet pasting or conductor printing, baking the conductor, and further performing plating on the conductor. Thereby, the electronic component 201 shown in FIG. 15 is completed.

  Other configurations, operations, and effects in the present embodiment are the same as those in the first embodiment.

  In addition, this invention is not limited to said each embodiment, A various change is possible. For example, in the slitted ceramic green sheet of the present invention, the slit does not extend over the entire length of the ceramic green sheet in the second direction A2, and the slit is not present in the vicinity of both ends of the ceramic green sheet in the second direction A2. It may not be formed.

  In addition, the method for manufacturing a multilayer electronic component according to the present invention is not limited to the multilayer electronic component having the configuration shown in the first or second embodiment, and is generally applied to multilayer electronic components having side conductor layers. Can be applied.

It is a perspective view which shows the ceramic green sheet which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows an example of the production methods of the ceramic green sheet shown in FIG. 1 is a perspective view showing an external appearance of an electronic component according to a first embodiment of the present invention. It is a circuit diagram which shows the circuit structure of the electronic component which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the upper surface of the 1st layer thru | or 3rd dielectric layer in the electronic component which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the upper surface of the 4th thru | or 6th dielectric layer in the electronic component which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the upper surface of the 7th layer thru | or 9th dielectric layer in the electronic component which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the upper surface of the 10th layer and 11th dielectric layer in the electronic component which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the upper surface of the 12th layer and 13th dielectric layer in the electronic component which concerns on the 1st Embodiment of this invention. It is a top view which shows the ceramic green sheet after several conductor layers before baking are formed. It is sectional drawing which shows the cross section of the ceramic green sheet and carrier film after the conductor layer before baking is formed. It is explanatory drawing which shows the method of laminating | stacking a some ceramic green sheet. It is a perspective view which shows a green sheet laminated body. It is a perspective view which shows the laminated body before baking. It is a perspective view which shows the external appearance of the electronic component which concerns on the 2nd Embodiment of this invention. FIG. 16 is an explanatory diagram showing four dielectric layers in the electronic component shown in FIG. 15 and conductor layers formed for them. It is a perspective view which shows the positional relationship of the several dielectric material layer in the electronic component shown in FIG. 15, and the conductor layer formed with respect to them. It is a top view which shows the ceramic green sheet after the several pre-firing conductor layer in the 2nd Embodiment of this invention was formed.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Input terminal, 3 ... Output terminal, 20 ... Main body, 21 ... Ground conductor layer, 22 ... Input conductor layer, 23 ... Output conductor layer, 24-27 ... Ground conductor layer, 100 DESCRIPTION OF SYMBOLS ... Carrier film, 101 ... Ceramic green sheet, 102 ... Band-shaped part, 110 ... Dielectric layer planned part, 120 ... Slit.

Claims (6)

A plurality of dielectric layers stacked, and one or more internal conductor layers disposed between adjacent dielectric layers, the first and the second positioned at both ends in the stacking direction of the plurality of dielectric layers A main body having two end faces and a side portion connecting the first and second end faces;
A method of manufacturing a multilayer electronic component comprising a side conductor layer disposed on a side portion of the main body,
Among the first and second directions orthogonal to each other, among the plurality of dielectric layer planned portions arranged so as to be arranged at least two along the first direction, and among the plurality of dielectric layer planned portions, the first The length of the dielectric layer extends along the second direction by passing through the boundary between two adjacent dielectric layer portions along the direction of, and is longer than the length of one dielectric layer portion in the second direction. One or more slits having a thickness, each dielectric layer planned portion is a step of producing a slit-containing ceramic green sheet having an upper surface and a side surface facing the slit;
Forming a pre-fired conductor layer from the upper surface to the side surface in at least one dielectric layer pre-determined portion of the slit ceramic green sheet;
Using a plurality of ceramic green sheets including slit ceramic green sheets after the pre-firing conductor layer is formed, a step of producing a pre-firing laminate that will later become the main body and side conductor layers;
Firing the laminate before firing, and completing the main body and the side conductor layer,
In the step of completing the main body and the side conductor layer, a portion of the pre-fired conductor layer disposed outside the outer edge of the upper surface of the dielectric layer planned portion is fired, A method of manufacturing a multilayer electronic component, comprising at least a part.   2. The method for manufacturing a multilayer electronic component according to claim 1, wherein the slit extends over the entire length of the slit-containing ceramic green sheet in the second direction. The step of producing the laminate before firing includes
Laminating a plurality of ceramic green sheets including a slit-containing ceramic green sheet after the pre-firing conductor layer is formed, and producing a green sheet laminate including the pre-fired laminate;
The method for manufacturing a multilayer electronic component according to claim 1, further comprising a step of cutting the green sheet laminate so that the laminate before firing is cut out. The step of producing the slit ceramic green sheet produces the slit ceramic green sheet to be disposed on a carrier film,
4. The process for producing the green sheet laminate, wherein the carrier film is peeled from the slit ceramic green sheet after the slit ceramic green sheet is overlaid on another ceramic green sheet. Manufacturing method for multilayer electronic components. A plurality of dielectric layers stacked, and one or more internal conductor layers disposed between adjacent dielectric layers, the first and the second positioned at both ends in the stacking direction of the plurality of dielectric layers A main body having two end faces and a side portion connecting the first and second end faces;
A ceramic green sheet used for forming at least one dielectric layer in the main body when manufacturing a multilayer electronic component including a side conductor layer disposed on a side portion of the main body. ,
A plurality of pre-determined portions of the dielectric layers arranged so as to be aligned in at least two of the first and second directions orthogonal to each other;
Among the plurality of dielectric layer planned portions, the first dielectric layer extends along the second direction through a boundary between two dielectric layer planned portions adjacent to each other in the first direction. One or more slits having a length equal to or longer than the length of one dielectric layer pre-determined portion,
Each dielectric layer planned portion has a top surface and a side surface facing the slit, a ceramic green sheet.   6. The ceramic green sheet according to claim 5, wherein the slit extends over the entire length of the ceramic green sheet in the second direction.

Images