JP2010075990A - Spatter deposition preventive agent - Google Patents
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- JP2010075990A JP2010075990A JP2008250389A JP2008250389A JP2010075990A JP 2010075990 A JP2010075990 A JP 2010075990A JP 2008250389 A JP2008250389 A JP 2008250389A JP 2008250389 A JP2008250389 A JP 2008250389A JP 2010075990 A JP2010075990 A JP 2010075990A
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Abstract
Description
本発明は、鋼材等を溶接する際に飛散するスパッタが、溶接箇所の周辺部に付着するのを防止するための溶接スパッタ付着防止剤に関する。 TECHNICAL FIELD The present invention relates to a welding spatter adhesion preventive agent for preventing spatter scattered when welding a steel material or the like from adhering to a peripheral portion of a welding location.
溶接を行う際に発生する溶接スパッタが製品、または治具に付着し、溶接後にスパッタを剥離する作業が必要となる。
特許文献１にはケイ酸のアルカリ金属塩から選択される１種または２種以上の塩；フッ化物イオン、炭酸水素イオン；および不可溶のアルコール類またはその誘導体を水に配合し、適宜その他の添加物を加えた溶接スパッタ付着防止剤が提供されている。
特許文献２には無機物又は無機化合物の微粉末を含む溶接スパッタ付着防止剤で、更に、水；ジカルボン酸；金属水素化物；トリアゾール類、キレート剤、飽和脂肪酸、及び不飽和脂肪酸からなる群より選択される１以上の物質を含んで成る混合液を含む溶接スパッタ付着防止剤が提案されている。
The welding spatter generated during welding adheres to the product or jig, and it is necessary to peel off the spatter after welding.
In Patent Document 1, one or more salts selected from alkali metal salts of silicic acid; fluoride ions, hydrogen carbonate ions; and insoluble alcohols or derivatives thereof are blended in water, and other types are appropriately added. Weld spatter adhesion inhibitors with additives are provided.
Patent Document 2 discloses a weld spatter adhesion inhibitor containing fine powders of inorganic substances or inorganic compounds, and further selected from the group consisting of water; dicarboxylic acids; metal hydrides; triazoles, chelating agents, saturated fatty acids, and unsaturated fatty acids. There has been proposed a weld spatter deposition inhibitor comprising a mixed liquid comprising one or more of the above-described substances.
アーク溶接、スポット溶接、レーザー溶接などを行う際に、スパッタが飛び散り、製品及び周辺部材へ付着し、後工程にて付着したスパッタを取り除かなくてはならない。特に製品に付着しては、製品としての外観が損なわれるだけでなく、その製品を組み込んで最終製品として使用の際に付着したスパッタにより不具合の原因となり安定した製品製造ができない可能性がある。また、周辺部材に付着した際は、特に位置決めをする治具へ付着した場合、溶接の際に正確な位置決めができず、不良品を出す可能性が高くなる。したがって、ある程度溶接を行った後、タガネ等を用いて手作業にてスパッタを取り除く作業が実施されており、その除去作業に費やされる工数は甚大なものとなっているのが現状である。
特許文献１では製品への溶接スパッタの付着防止には効果があるが、周辺部材への付着防止効果には持続性がそれ程無いため、連続した塗布が必要となる。
特許文献２では特許文献１よりもスパッタの付着防止効果に対してより強化されているものの、周辺部材への付着防止効果には持続性に関しては特に変わらない。
When performing arc welding, spot welding, laser welding, etc., spatter scatters and adheres to the product and peripheral members, and the spatter adhered in the subsequent process must be removed. In particular, when the product adheres to the product, not only the appearance of the product is impaired, but there is a possibility that the product may not be stably manufactured due to the spatter that is attached when the product is incorporated and used as a final product. Moreover, when adhering to a peripheral member, especially when adhering to a jig for positioning, accurate positioning cannot be performed at the time of welding, and the possibility of producing a defective product increases. Therefore, after performing welding to some extent, an operation of removing spatters manually using a chisel or the like is performed, and the number of man-hours spent for the removal operation is enormous.
Although Patent Document 1 is effective in preventing adhesion of weld spatter to products, the effect of preventing adhesion to peripheral members is not so durable, so that continuous application is required.
In Patent Document 2, although the effect of preventing spatter adhesion is strengthened compared to Patent Document 1, the effect of preventing adhesion to peripheral members is not particularly changed with respect to sustainability.
上記問題点を解決するため、本発明は、無機系被膜形成液を含む、スパッタ付着防止剤を提供する。 In order to solve the above-mentioned problems, the present invention provides a spatter adhesion preventing agent containing an inorganic film forming liquid.
本発明において用いられる無機系被膜形成液としては、式（１）で表される化合物の加水分解・重縮合物を含む無機系被膜形成液が含まれる。
Ｍm+（ＯＲ1）nＲ2 m-n （１）
（式中、Ｍは、Ｓｉ、Ａｌ、Ｚｒ及びＴｉからなる群から選択される少なくとも１種の元素であり；Ｒ1は炭素数１〜５個の炭化水素基、アルコキシアルキル基、又はアシル基であり；Ｒ2はビニル、アミノ、イミノ、エポキシ、アクリロイルオキシ、メタクリロイルオキシ、フェニル、メルカプト及びアルキル基からなる群から選択される少なくとも１種の有機基であり；ｍはＭの価数を表し；ｎはＯＲ1基の数を表し；ｍ及びｎはいずれも整数であり；ｍ≧ｎである。）
The inorganic film forming liquid used in the present invention includes an inorganic film forming liquid containing a hydrolysis / polycondensate of the compound represented by the formula (1).
M m + (OR 1 ) n R 2 mn (1)
(In the formula, M is at least one element selected from the group consisting of Si, Al, Zr and Ti; R 1 is a hydrocarbon group having 1 to 5 carbon atoms, an alkoxyalkyl group, or an acyl group. R 2 is at least one organic group selected from the group consisting of vinyl, amino, imino, epoxy, acryloyloxy, methacryloyloxy, phenyl, mercapto and alkyl groups; m represents the valence of M N represents the number of OR 1 groups; m and n are both integers; m ≧ n.
上記Ｍm+（ＯＲ1）nＲ2 m-nで表される化合物のうち、ＭがＳｉである化合物としては、例えば、ジメチルジメトキシシラン、ジメチルジエトキシシラン、ジフェニルジメトキシシラン、ジフェニルジエトキシシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリアセトキシシラン、γ−アミノプロピルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、γ−（３，４−エポキシシクロヘキシル）エチルトリエトキシシラン、γ−（メタ）アクリロキシプロピルトリメトキシシラン、フェニルトリメトキシシラン、フェニルトリアセトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−クロロプロピルトリメトキシシラン、β−シアノエチルトリエトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、メチルトリプロポキシシラン、メチルトリブトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、テトラメトキシシラン、テトラエトキシシラン、テトラプロポキシシラン、テトラブトキシシランなどが挙げられ、ＭがＡｌである化合物としては、アルミニウムトリイソプロポキシド、アルミニウムｎ−ブトキシド、アルミニウムトリｔ−ブトシキド、アルミニウムトリエトキシドなどが挙げられ、ＭがＺｒである化合物としては、ジルコニウムｎ−プロポキシド、ジルコニウムｎ−ブトキシド、ジルコニウムｉ−ブトキシド、ジルコニウムｔ−ブトキシド、ジルコニウムジメタクリレートジブトキシドなどが挙げられ、ＭがＴｉである化合物としては、チタンテトライソプロポキシド、チタンテトラｎ−ブトキシド、チタンテトラｉ−ブトキシド、チタンメタクリレートトリイソプロポキシド、チタンテトラメトキシプロポキシド、チタンテトラｎ−プロポキシド、チタンテトラエトキシドなどが挙げられる。これらの化合物のうち１種類だけを用いてよいが、二種類以上を混合してもかまわない。
式（１）の化合物の加水分解・重縮合反応は、例えば特開２００１−２１４０９３に記載されているような公知の方法によって行うことができる。
加水分解・重縮合反応を行うために添加する水の量は、式（１）の化合物１モルに対して０．１モル以上が好ましい。
式（１）の化合物を加水分解・縮重合する際には、既知の触媒などを添加して加水分解・縮重合を促進しても良い。この場合、添加する触媒としては、酢酸、プロピオン酸、酪酸などの有機酸や、硝酸、塩酸、リン酸、硫酸などの無機酸を用いることができる。
Among the compounds represented by M m + (OR 1 ) n R 2 mn , examples of the compound in which M is Si include dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, vinyltri Methoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, γ-aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, β- (3,4-epoxycyclohexyl) ) Ethyltrimethoxysilane, γ- (3,4-epoxycyclohexyl) ethyltriethoxysilane, γ- (meth) acryloxypropyltrimethoxysilane, phenyltrimethoxysilane, phenyltriacetoxysilane, γ-mercaptopropyltrimeth Sisilane, γ-chloropropyltrimethoxysilane, β-cyanoethyltriethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, methyltributoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, tetramethoxysilane , Tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane and the like, and examples of the compound in which M is Al include aluminum triisopropoxide, aluminum n-butoxide, aluminum tri-t-butoxide, aluminum triethoxide and the like. Examples of the compound in which M is Zr include zirconium n-propoxide, zirconium n-butoxide, zirconium i-butoxide, zirconium t-butoxide, zirconium Examples of the compound in which M is Ti include titanium tetraisopropoxide, titanium tetra n-butoxide, titanium tetra i-butoxide, titanium methacrylate triisopropoxide, titanium tetramethoxypropoxide, and titanium. Examples include tetra n-propoxide and titanium tetraethoxide. Only one of these compounds may be used, but two or more may be mixed.
The hydrolysis and polycondensation reaction of the compound of the formula (1) can be performed by a known method as described in, for example, JP-A-2001-214093.
The amount of water added to perform the hydrolysis / polycondensation reaction is preferably 0.1 mol or more per 1 mol of the compound of the formula (1).
When the compound of formula (1) is subjected to hydrolysis / condensation polymerization, a known catalyst or the like may be added to promote hydrolysis / condensation polymerization. In this case, as the catalyst to be added, organic acids such as acetic acid, propionic acid and butyric acid, and inorganic acids such as nitric acid, hydrochloric acid, phosphoric acid and sulfuric acid can be used.
上記Ｍm+（ＯＲ1）nＲ2 m-nの加水分解・重縮合物は、好ましくは液状である。しかし、固体状の加水分解・重縮合物でも溶媒添加により液状となるものであれば使用することができる。Ｍは好ましくはＳｉである。
上記スパッタ付着防止剤に別途シリコーン化合物を添加しても良い。シリコーン化合物とはSi-O-Si結合骨格を持った分子量100000以下の化合物である。あまりに分子量が大きいと粘性が高くなったり固体化してしまい、逆に分子量が小さいと発揮しやすいため、より好ましくは分子量1000〜50000の範囲の化合物である。
The hydrolysis / polycondensation product of M m + (OR 1 ) n R 2 mn is preferably liquid. However, solid hydrolyzate / polycondensate can be used as long as it becomes liquid by addition of a solvent. M is preferably Si.
A silicone compound may be separately added to the spatter adhesion preventing agent. A silicone compound is a compound having a Si—O—Si bond skeleton and a molecular weight of 100,000 or less. If the molecular weight is too large, the viscosity becomes high or solidifies. Conversely, if the molecular weight is small, it tends to be exerted. Therefore, a compound having a molecular weight in the range of 1,000 to 50,000 is more preferable.
また、上記スパッタ付着防止剤へ助剤として金属酸化物フィラー及び金属酸化物ゾルなどの無機材料粒子を適宜添加しても良い。金属酸化物フィラーとしてシリカ、アルミナ、チタニア、ジルコニア、チタン酸アルミニウム、などがあり、１種以上組み合わせて添加してもよい。フィラーは単体で添加しても良いし、分散液（スラリー）の状態で添加しても良い。また、金属酸化物フィラーの分散性を向上させるため、界面活性剤などの分散剤を添加しても良い。金属酸化物ゾルとしてはシリカゾル、アルミナゾル、チタニアゾル、ジルコニアゾル等があり、１種以上組み合わせて添加してもよい。この中で、特にアルミナ粒子が好ましい。
また、スパッタ付着防止剤の溶媒としては、特に指定されるものではないが、塗布した後の乾燥性を考慮し、エタノール、イソプロピルアルコール、ｎ−プロピルアルコール、アルコキシエタノール類、エチレングリコールモノアルキルエーテル類、プロピレングリコール類、等が好ましい。また乾燥性に関しては若干劣るものの安全性を考慮し水が好ましい。
スパッタ付着防止剤の塗布方法は特に指定されるものではないが、必要な箇所へ刷毛塗り、スプレー塗布等が好ましい。また、このスパッタ付着防止剤はエアゾール化も可能であり、前もってエアゾール化することにより溶接機の設置環境によらず塗布が可能となる。
また上記スパッタ付着防止剤に着色を施してもよい。溶接現場での注意喚起や製造工程上の識別等のために、塗布した部分に着色を施し区別する必要がある際にコート被膜に着色してあると識別とスパッタ付着防止の２つの効果を同時に付与することができる。例えば、着色を施す方法として着色剤を添加し所望の色を加える。着色剤として無機顔料、有機顔料及び有機染料などが挙げられる。有機顔料や有機染料ではスパッタにより一部燃焼してしまい色褪せや焦げ付きなどが発生するが、再度塗布するタイミングを計る上での参考となる。
In addition, inorganic material particles such as metal oxide fillers and metal oxide sols may be appropriately added as an auxiliary agent to the spatter adhesion preventing agent. Examples of the metal oxide filler include silica, alumina, titania, zirconia, and aluminum titanate, which may be added in combination of one or more. The filler may be added alone or in the form of a dispersion (slurry). Moreover, in order to improve the dispersibility of a metal oxide filler, you may add dispersing agents, such as surfactant. Examples of the metal oxide sol include silica sol, alumina sol, titania sol, zirconia sol, and the like. Among these, alumina particles are particularly preferable.
In addition, the solvent for the spatter adhesion inhibitor is not particularly specified, but in consideration of the drying property after coating, ethanol, isopropyl alcohol, n-propyl alcohol, alkoxyethanols, ethylene glycol monoalkyl ethers , Propylene glycols and the like are preferable. Water is preferable in consideration of safety although it is slightly inferior in terms of drying.
The method for applying the spatter adhesion preventing agent is not particularly specified, but brushing, spraying, etc. are preferably applied to the necessary portions. Further, the spatter adhesion preventing agent can be aerosolized, and can be applied regardless of the installation environment of the welding machine by aerosolizing in advance.
Further, the spatter adhesion preventing agent may be colored. When it is necessary to color and distinguish the applied part for alerting at the welding site or identification in the manufacturing process, the coating film is colored and the two effects of identification and spatter adhesion prevention are simultaneously achieved. Can be granted. For example, as a method of coloring, a colorant is added and a desired color is added. Examples of the colorant include inorganic pigments, organic pigments, and organic dyes. Organic pigments and organic dyes burn partly due to spattering and cause fading or scorching. This is useful for measuring the timing of re-application.
本発明のスパッタ付着防止剤を用いれば、溶接にて発生するスパッタの製品及び周辺部材へ付着を防止することができる。
本発明のスパッタ付着防止剤を製品及び周辺部材へ塗布・乾燥することにより、金属酸化物被膜を形成し、溶接スパッタが付着しにくくなる。そのため、金属酸化物被膜が破壊され取り除かれない限り、スパッタ付着防止効果が持続する。
しかしながら、この金属酸化物被膜は乾燥しているが焼き付け工程を通してないため、アルコール類やケトン類、グルコールエーテル類などの有機溶剤により簡単に除去できる。したがって、製品へスパッタ付着防止剤を塗布してもその後に除去が可能となり製品の後工程に影響を与えることがない。
したがって、溶接機の周辺部材だけでなく、製品への適用も可能であり、スパッタが飛来する箇所の部材全てに適している。
以上のように、本発明のスパッタ付着防止剤は上述の従来の問題点をすべて解決するものである。
If the spatter adhesion preventing agent of the present invention is used, it is possible to prevent adhesion to sputtered products and peripheral members generated by welding.
By applying and drying the spatter adhesion preventive agent of the present invention to the product and peripheral members, a metal oxide film is formed and welding spatter is less likely to adhere. Therefore, as long as the metal oxide film is not destroyed and removed, the effect of preventing spatter adhesion continues.
However, since this metal oxide film is dry but does not pass through the baking step, it can be easily removed with an organic solvent such as alcohols, ketones or glycol ethers. Therefore, even if the spatter adhesion preventing agent is applied to the product, it can be removed thereafter without affecting the subsequent process of the product.
Therefore, it can be applied not only to the peripheral members of the welding machine but also to products, and is suitable for all members where spatters fly.
As described above, the spatter adhesion preventive agent of the present invention solves all the conventional problems described above.
以下に例を挙げるが、それらは本発明の説明を目的とするものであって、本発明をこれらの態様に限定することを意図するものではない。
＜実施例１＞
グリシドキシプロピルトリメトキシシラン９．５ｇにメチルトリエトキシシラン１７．８ｇ及びオルトケイ酸テトラエチル２０．８ｇを加え、その後酸性アルミナゾル（日産化学製）を４１．４ｇ加え、ボールミルにて２４時間攪拌・分散を実施した。こうして得られたスパッタ付着防止剤を溶接機周辺部材へ刷毛により塗布し、常温乾燥後溶接を実施した。溶接はアーク溶接を行い、１０日間連続にて溶接作業を実施したが、スパッタ付着防止剤を塗布した周辺部材へはスパッタの付着は無かった。また、水平面の部材上に乗っているスパッタは容易に掃き出すことができており、周辺部材への付着は見られなかった。
＜実施例２＞
メチルトリエトキシシラン２１．４ｇにオルトケイ酸テトラメチル３７．５ｇに水１５ｇ、触媒としてグルコール酸０．３ｇを加えた後、溶媒としてイソプロピルアルコールを加え、ボールミルにて２４時間攪拌・分散を実施した。こうして得られたスパッタ付着防止剤を溶接機周辺部材へスプレー塗布し、ドライヤーにて送風乾燥後溶接を実施した。溶接はＹＡＧレーザー溶接を行い、１０日間連続にて溶接作業を実施したが、スパッタ付着防止剤を塗布した周辺部材へはスパッタの付着は無かった。また、水平面の部材上に乗っているスパッタは容易に掃き出すことができており、周辺部材への付着は見られなかった。
＜実施例３＞
エチルトリエトキシシラン２１．４ｇにオルトケイ酸テトラエチル３７．５ｇに酸性アルミナゾル（日産化学製）を２０．７ｇ加えた後、溶媒としてエチレングリコールイソプロピルエーテル６７．５ｇを加え、ボールミルにて２４時間攪拌・分散を実施した。こうして得られたスパッタ付着防止剤にジメチルエーテル６７．５ｇによってエアゾール化を行い、それを用いて溶接機周辺部材へ塗布し、常温乾燥後溶接を実施した。溶接はアーク溶接を行い、１０日間連続にて溶接作業を実施したが、スパッタ付着防止剤を塗布した周辺部材へはスパッタの付着は無かった。また、水平面の部材上に乗っているスパッタは容易に掃き出すことができており、周辺部材への付着は見られなかった。
＜実施例４＞
チタンテトライソプロポキシド２１．３ｇ及びアルミニウムトリブトキシド１８．５ｇをジエタノールアミン４７．４ｇ中へ加え、溶媒としてｎ−プロピルアルコールを７５．８ｇ加えた。その後６０℃で加熱攪拌を３時間行った。冷却後、シリカ粒子（粒径１μｍ）２５．０ｇを添加してボールミルにて２４時間攪拌・分散を実施してスパッタ付着防止剤を得た。このスパッタ付着防止剤を溶接機周辺部材へ刷毛により塗布し、ドライヤーにて送風乾燥後溶接を実施した。溶接はアーク溶接を行い、１０日間連続にて溶接作業を実施したが、スパッタ付着防止剤を塗布した周辺部材へはスパッタの付着は無かった。また、水平面の部材上に乗っているスパッタは容易に掃き出すことができており、周辺部材への付着は見られなかった。
＜実施例５＞
実施例１のスパッタ付着防止剤に、白色化させるため無機顔料として酸化チタン20gを加え、ボールミルにて４時間分散を実施した。こうして得られたスパッタ付着防止剤を溶接機周辺部材へ刷毛により塗布し、常温乾燥後溶接を実施した。溶接はアーク溶接を行い、１０日間連続にて溶接作業を実施したが、スパッタ付着防止剤を塗布した周辺部材へはスパッタの付着は無かった。また、水平面の部材上に乗っているスパッタは容易に掃き出すことができており、周辺部材への付着は見られなかった。
＜比較例＞
市販のエアゾールタイプのスパッタ付着防止剤を周辺部材へ塗布し実施例３と同様に溶接を実施した。しかしながら、溶接し始めた最初の間はスパッタの付着を防止するものの１日と持たず付着防止効果は薄れていき周辺部材へのスパッタの付着が生じてしまい、物理的に除去する必要があった。
The following examples are given for the purpose of illustrating the invention and are not intended to limit the invention to these embodiments.
<Example 1>
Add 17.8 g of methyltriethoxysilane and 20.8 g of tetraethyl orthosilicate to 9.5 g of glycidoxypropyltrimethoxysilane, then add 41.4 g of acidic alumina sol (Nissan Chemical), and stir and disperse in a ball mill for 24 hours. Carried out. The spatter adhesion inhibitor thus obtained was applied to the peripheral members of the welding machine with a brush, and welding was performed after drying at room temperature. Welding was performed by arc welding, and the welding operation was carried out continuously for 10 days, but no spatter adhered to the peripheral member to which the spatter adhesion inhibitor was applied. Further, the spatter on the horizontal member could be easily swept out, and no adhesion to the peripheral members was observed.
<Example 2>
After adding 15 g of water to 37.5 g of tetramethyl orthosilicate to 21.4 g of methyltriethoxysilane, 0.3 g of glycolic acid as a catalyst, isopropyl alcohol was added as a solvent, and the mixture was stirred and dispersed in a ball mill for 24 hours. The spatter adhesion preventive agent thus obtained was spray-coated on the peripheral members of the welder, and was blown and dried with a drier to carry out welding. Welding was performed by YAG laser welding, and the welding operation was carried out continuously for 10 days. However, no spatter adhered to the peripheral member to which the spatter adhesion inhibitor was applied. Further, the spatter on the horizontal member could be easily swept out, and no adhesion to the peripheral members was observed.
<Example 3>
After adding 20.7g of acid alumina sol (Nissan Chemical) to 37.5g of tetraethylorthosilicate to 21.4g of ethyltriethoxysilane, 67.5g of ethylene glycol isopropyl ether was added as a solvent and stirred and dispersed in a ball mill for 24 hours. Carried out. The thus obtained spatter adhesion inhibitor was aerosolized with 67.5 g of dimethyl ether, applied to the peripheral member of the welding machine, dried at room temperature, and then welded. Welding was performed by arc welding, and the welding operation was carried out continuously for 10 days, but no spatter adhered to the peripheral member to which the spatter adhesion inhibitor was applied. Further, the spatter on the horizontal member could be easily swept out, and no adhesion to the peripheral members was observed.
<Example 4>
21.3 g of titanium tetraisopropoxide and 18.5 g of aluminum tributoxide were added to 47.4 g of diethanolamine, and 75.8 g of n-propyl alcohol was added as a solvent. Thereafter, heating and stirring were performed at 60 ° C. for 3 hours. After cooling, 25.0 g of silica particles (particle size: 1 μm) was added, and the mixture was stirred and dispersed in a ball mill for 24 hours to obtain a spatter adhesion inhibitor. This spatter adhesion preventing agent was applied to the peripheral member of the welding machine with a brush, and was blown and dried with a drier for welding. Welding was performed by arc welding, and the welding operation was carried out continuously for 10 days, but no spatter adhered to the peripheral member to which the spatter adhesion inhibitor was applied. Further, the spatter on the horizontal member could be easily swept out, and no adhesion to the peripheral members was observed.
<Example 5>
20 g of titanium oxide was added as an inorganic pigment to the spatter adhesion preventing agent of Example 1 for whitening, and dispersion was carried out for 4 hours with a ball mill. The spatter adhesion inhibitor thus obtained was applied to the peripheral members of the welding machine with a brush, and welding was performed after drying at room temperature. Welding was performed by arc welding, and the welding operation was carried out continuously for 10 days, but no spatter adhered to the peripheral member to which the spatter adhesion inhibitor was applied. Further, the spatter on the horizontal member could be easily swept out, and no adhesion to the peripheral members was observed.
<Comparative example>
A commercially available aerosol type spatter adhesion inhibitor was applied to the peripheral members, and welding was performed in the same manner as in Example 3. However, during the first time when welding was started, spatter adherence was prevented, but it did not last for a day, and the adhesion prevention effect diminished, resulting in spatter adherence to peripheral members, which had to be physically removed. .
Claims (6)
Ｍm+（ＯＲ1）nＲ2 m-n
（式中、ＭはＳｉ、Ａｌ、Ｚｒ及びＴｉからなる群から選択される少なくとも１種の元素であり；ｍはＭの価数を表わし；Ｒ1は炭素数１〜５の炭化水素基、アルコキシアルキル基またはアシル基であり；Ｒ2はビニル、アミノ、イミノ、エポキシ、アクリロイルオキシ、メタクリロイルオキシ、フェニル、メルカプト及びアルキル基からなる群から選択される少なくとも１種の有機基であり；ｎはＯＲ1基の数を表し；ｍ及びｎはいずれも整数であり；ｍ≧ｎである。）
で表わされる化合物の加水分解・重縮合物を含む、請求項１記載のスパッタ付着防止剤 Inorganic film forming liquid
M m + (OR 1 ) n R 2 mn
(Wherein M is at least one element selected from the group consisting of Si, Al, Zr and Ti; m represents the valence of M; R 1 is a hydrocarbon group having 1 to 5 carbon atoms; An alkoxyalkyl group or an acyl group; R 2 is at least one organic group selected from the group consisting of vinyl, amino, imino, epoxy, acryloyloxy, methacryloyloxy, phenyl, mercapto and alkyl groups; Represents the number of OR 1 groups; m and n are both integers; m ≧ n.)
The spatter adhesion preventing agent according to claim 1, comprising a hydrolyzate / polycondensate of the compound represented by the formula:
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012081492A (en) * | 2010-10-08 | 2012-04-26 | Tsuchiya Co Ltd | Spatter adhesion preventive agent |
| WO2015027003A1 (en) * | 2013-08-21 | 2015-02-26 | Nd Industries, Inc. | Coating composition and anti-spatter coating formed therefrom |
| KR20190129603A (en) * | 2018-05-11 | 2019-11-20 | 한국자재산업 주식회사 | Anti-spatter Composition for Laser Welding |
| CN111215774A (en) * | 2020-01-10 | 2020-06-02 | 汎宇化学（昆山）有限公司 | Method for preventing welding slag in welding process |
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| JPS62244580A (en) * | 1986-04-16 | 1987-10-24 | Ishihara Yakuhin Kk | Coater of sputter sticking preventive agent for torch |
| JPH01321095A (en) * | 1988-06-15 | 1989-12-27 | Evelyn Alice Grave | Welding auxiliary |
| JPH03258488A (en) * | 1990-03-06 | 1991-11-18 | Ishihara Chem Co Ltd | Agent for preventing sticking of welding spatter |
| JP2003290979A (en) * | 2002-03-29 | 2003-10-14 | Mitsui Eng & Shipbuild Co Ltd | Agent for preventing adhesion of spatter and method for preventing adhesion of spatter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62244580A (en) * | 1986-04-16 | 1987-10-24 | Ishihara Yakuhin Kk | Coater of sputter sticking preventive agent for torch |
| JPH01321095A (en) * | 1988-06-15 | 1989-12-27 | Evelyn Alice Grave | Welding auxiliary |
| JPH03258488A (en) * | 1990-03-06 | 1991-11-18 | Ishihara Chem Co Ltd | Agent for preventing sticking of welding spatter |
| JP2003290979A (en) * | 2002-03-29 | 2003-10-14 | Mitsui Eng & Shipbuild Co Ltd | Agent for preventing adhesion of spatter and method for preventing adhesion of spatter |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012081492A (en) * | 2010-10-08 | 2012-04-26 | Tsuchiya Co Ltd | Spatter adhesion preventive agent |
| WO2015027003A1 (en) * | 2013-08-21 | 2015-02-26 | Nd Industries, Inc. | Coating composition and anti-spatter coating formed therefrom |
| KR20190129603A (en) * | 2018-05-11 | 2019-11-20 | 한국자재산업 주식회사 | Anti-spatter Composition for Laser Welding |
| KR102049341B1 (en) | 2018-05-11 | 2019-11-28 | 한국자재산업 주식회사 | Anti-spatter Composition for Laser Welding |
| CN111215774A (en) * | 2020-01-10 | 2020-06-02 | 汎宇化学（昆山）有限公司 | Method for preventing welding slag in welding process |
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