JP2010073549A - Connector, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector capable of securely soldering a built-in contact to a wiring pattern formed on a substrate, and to provide a method of manufacturing the connector. <P>SOLUTION: An adaptor 11 to separate the contact 5 from the wiring pattern 7 by relative movement of the substrate 6 to push up the contact 5 and elastically deform it before the substrate 6 reaches the mounting position to a subassembly 10 is provided. Thereby, a cement for soldering such as cream solder which has been applied on the wiring pattern 7 in advance is prevented from being shaved off by the contact 5, and the contact 5 can be securely joined to the wiring pattern 7 by the cement. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a connector and a manufacturing method thereof.

As a conventional connector, a housing in which a plurality of contacts are attached and a substrate on which a wiring pattern for electrically connecting the plurality of housings is built-in, and each contact is connected to the inside of the cable via the wiring pattern of the substrate. A device that is electrically connected to a conducting wire is known (for example, Patent Document 1).
JP 2002-42940 A

  However, in this type of connector, in order to solder the wiring pattern and the corresponding contact, if a soldering bonding agent such as cream solder is applied in advance to the bonding position of the wiring pattern contact, As the substrate is moved relative to the housing toward a predetermined mounting position, the bonding agent may be scraped off by each contact.

  Therefore, an object of the present invention is to obtain a connector and a method for manufacturing the same that can more reliably solder contacts and a wiring pattern formed on a substrate.

  The invention according to claim 1 includes a subassembly having a housing and a plurality of contacts fixed to the housing, and a substrate on which a wiring pattern for electrically connecting the plurality of contacts is formed. The substrate is moved relatively close to the subassembly and moved to a mounting position with respect to the subassembly, and the contact is soldered to the corresponding wiring pattern in a state where the substrate is in the mounting position. The connector is characterized in that a pressing mechanism is provided that temporarily pushes up the contact and elastically deforms it away from the wiring pattern by relative movement of the board before the board reaches the mounting position.

  The invention according to claim 2 includes an adapter that functions as the pressing mechanism, and is configured such that the adapter is relatively pushed toward the subassembly by the substrate that moves relative to the attachment position. The pressing portion provided in the pushed-in adapter is characterized in that, before the substrate reaches the mounting position, the contact is temporarily pushed up to be elastically deformed and separated from the wiring pattern. To do.

  The invention according to claim 3 is characterized in that the subassembly is provided with a temporary holding mechanism that temporarily holds the adapter at a standby position that is on the near side of the innermost position where the adapter is pushed in by the substrate.

  According to a fourth aspect of the present invention, the contact is provided with a pressure reducing portion that reduces a force in a direction away from the wiring pattern acting on the contact from the pressing portion when the adapter is in the standby position. It is provided.

  The invention according to claim 5 is characterized in that at least one of the sub-assembly and the adapter is provided with a guide mechanism for guiding the adapter pushed by the substrate.

  The invention according to claim 6 is characterized in that the sub-assembly and the adapter are concavo-convexly fitted in a state where the adapter is in the innermost position to be pushed in by the substrate.

  The invention according to claim 7 is characterized in that a pressing protrusion functioning as the pressing mechanism is provided on the substrate.

  The invention according to claim 8 is provided with an attachment that is fitted to and mounted on the substrate, and the pressing protrusion is formed on the attachment.

  The invention according to claim 9 is characterized in that a recess is formed at a position of the substrate where the contact is joined to the wiring pattern.

  In the invention of claim 10, a step of forming a sub-assembly by integrating a plurality of contacts with a housing, and a contact of the wiring pattern formed on the substrate and electrically connecting the plurality of contacts, respectively A step of applying a soldering bonding agent to the bonding position, a step of moving the substrate relative to the subassembly and moving the substrate relative to the subassembly, and a step of moving the substrate to the subassembly. Heating and cooling the bonding agent in a state where it is in the mounting position, and soldering and bonding the contact to the bonding position of the wiring pattern in the connector manufacturing method. In the step of relatively moving the contact, the contact is pushed away from the wiring pattern by relative movement of the substrate. By the pressing mechanism to raise, before the substrate reaches the mounting position, characterized in that so as to separate from the wiring pattern is elastically deformed by pushing up the contact temporarily.

  According to the first aspect of the present invention, by moving the substrate relative to the housing toward the mounting position on the housing, the contact is temporarily pushed up using the pressing mechanism to be elastically deformed. Since the wiring pattern is separated from the wiring pattern, it is possible to prevent the soldering bonding agent such as cream solder previously applied on the wiring pattern from being scraped off by the contact. It can be reliably joined.

  According to the second aspect of the present invention, when the board is moved toward the mounting position, the contact can be temporarily elastically deformed and separated from the wiring pattern simply by pushing the adapter by the board. The operation of assembling the housing and the substrate can be performed more easily while operating the pressing mechanism.

  According to the invention of claim 3, since the adapter can be temporarily held in the sub-assembly at the standby position, the adapter can be handled more easily than when the adapter is originally separated from the sub-assembly. Since the adapter is set in the standby position in advance, the work of assembling the housing and the substrate can be performed more easily.

  According to the fourth aspect of the present invention, it is possible to suppress the contact from sagging due to the force received from the pressing portion while the adapter is in the standby position.

  According to the invention of claim 5, since the adapter can be moved along a predetermined path when the adapter is pushed by the substrate, each contact can be pushed up more reliably.

  According to invention of Claim 6, the position shift between a subassembly and an adapter can be suppressed.

  According to the invention of claim 7, the pressing mechanism can be obtained as a relatively simple structure as the pressing protrusion provided on the substrate.

  According to invention of Claim 8, the said press mechanism can be obtained more easily compared with the case where a press protrusion is formed in board | substrate itself.

  According to the ninth aspect of the present invention, by locking the contact with the concave portion provided in the substrate, the concave portion can function as a retaining between the substrate and the subassembly.

  According to the invention of claim 10, by moving the substrate relative to the housing toward the mounting position on the housing, the contact is temporarily pushed up using the pressing mechanism to be elastically deformed. Since the wiring pattern is separated from the wiring pattern, it is possible to prevent the soldering bonding agent such as cream solder previously applied on the wiring pattern from being scraped off by the contact. It can be reliably joined.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that similar components are included in the following embodiments. Therefore, below, the same code | symbol is provided about these similar components, and the overlapping description is abbreviate | omitted.

  (First Embodiment) FIGS. 1 to 15 show a first embodiment of the present invention. Among these, FIG. 1 is a perspective view of the connector according to the present embodiment, FIG. 2 is a front view of the connector as viewed from the insertion protrusion side, and FIG. 3 is a perspective view showing the internal configuration of the connector.

  As shown in FIGS. 1 and 2, the connector 1 includes a body 2 covered with an insulating synthetic resin material, an insertion protrusion 3 protruding from one side of the body 2, and an opposite side of the insertion protrusion 3. And a cord 4 connected to the body 2. A plurality of contacts 5 made of a conductor such as metal are arranged inside the insertion protrusion 3 in an aligned manner. The connector 1 is a plug provided at the tip of the cord 4 and is inserted into a receptacle (not shown) so that the contact 5 in the plug (connector 1) and the contact in the receptacle are elastic. The conductors in the cord 4 and the contacts in the receptacle are electrically connected. In addition, the insertion protrusion 3 is formed in the flat rectangular parallelepiped shape. In the following, for the sake of convenience, as shown in each figure, the insertion direction is the X direction (the direction in which the insertion protrusion 3 is inserted into the receptacle) and the thickness direction is the Z direction (the difference), with reference to the shape of the insertion protrusion 3. The thickness direction of the insertion protrusion 3) and the width direction are defined as the Y direction (width direction of the insertion protrusion 3). Further, for the insertion direction (X direction), the front side and the front side (back side) are defined according to the insertion operation.

  As shown in FIG. 3, a substrate 6 is provided in the body 2, and a contact 5 and a conductor (not shown) in the cord 4 form a wiring pattern 7 formed on the surface of the substrate 6. Are electrically connected to each other. Each wiring pattern 7 has a small interval on the side in contact with the contact 5 (left side in FIG. 3), but is wide on the side in contact with the cord 4 (right side in FIG. 3). That is, by interposing the substrate 6 between the contact 5 and the cord 4, even when the interval between the plurality of contacts 5 is narrow, the interval between the wiring patterns 7 formed on the substrate 6 is increased, and the code The operation of electrically connecting each conductor in 4 and the conductor in connector 1 (that is, wiring pattern 7) can be performed more easily and more reliably. That is, the connector 1 according to the present embodiment is effective for a narrow pitch connector such as a microHDMI (trademark) connector. Note that the conductive wire in the cord 4 is soldered to the pad portion 7 a of the wiring pattern 7.

  The connector manufacturing process and the detailed structure of each part will be described below with reference to FIGS. FIG. 15 is a flowchart showing a connector manufacturing process.

  As shown in FIGS. 3 and 6, the connector 1 includes a subassembly 10 including a plurality of contacts 5, a housing 8 made of an insulating synthetic resin, and a shell 9 made of a metal conductor. Built-in.

  First, the process S1 (FIG. 15) which comprises this subassembly 10, and the detailed structure of the component in connection with process S1 are demonstrated, referring FIGS. 4-6. 4 is an exploded perspective view of the housing and the contact included in the connector, FIG. 5 is an exploded perspective view of the housing, the contact, and the shell, and FIG. 6 is an exploded perspective view of the subassembly and the adapter.

  As shown in FIG. 4, the housing 8 has a base portion 8a formed in a flat rectangular parallelepiped shape. A plurality of accommodation holes 8b for accommodating the contacts 5 are formed in the base portion 8a. The accommodation holes 8b are formed as two through holes extending in the insertion direction (X direction) in the thickness direction (Z direction) of the base portion 8a, and the width direction ( They are arranged at regular intervals (pitch) in the Y direction). The upper accommodation holes 8b and the lower accommodation holes 8b are alternately arranged in the width direction (Y direction).

  A guide projection 8c that functions as a guide and positioning for the shell 9, the substrate 6, the adapter 11 (to be described later), and the like is formed on the cord 4 side (the front side in the X direction, the right side in FIG. 4) of the base body 8a. . A pair of guide protrusions 8c are provided on both ends in the Y direction, and both have protrusions 8d and 8e protruding on both sides in the Z direction and on the front side in the X direction (right side in FIG. 4). The pair of guide protrusions 8c and the base portion 8a form a cutout portion 8f that has a substantially rectangular shape when viewed from the Z direction. Further, the guide projection 8c is formed with concave grooves 8g, 8h, 8i for accommodating the respective parts.

  As shown in FIG. 4, the contacts 5 are each formed in an elongated strip shape or a rod shape, and are bent at a plurality of locations. On the front side in the X direction (left side in FIG. 4), a contact portion 5a that is in contact with the contact of the receptacle is formed by being bent in a substantially U shape, while on the near side in the X direction (right side in FIG. 4). The bent portion 5b is formed by being bent into a substantially U-shape having a flat bottom that extends slightly longer. Note that the contact portion 5a and the joint portion 5b of the contact 5 arranged on the upper stage (upper side in FIG. 4) are both protruded downward (lower side in FIG. 4) and arranged on the lower stage (lower side in FIG. 4). Both the contact portion 5a and the joint portion 5b of the contact 5 are projected upward (upward in FIG. 4). Further, for each of the upper stage and the lower stage, the long ones and the short ones are alternately arranged so that the positions of the joint portions 5b in the insertion direction are alternately arranged.

  A saw-tooth portion 5 c that is uneven in the width direction is formed at a substantially central portion in the longitudinal direction of the contact 5. In the present embodiment, each contact 5 is inserted into the housing hole 8 b of the housing 8, and the saw-tooth portion 5 c is press-fitted into the housing 8 so that the contact 5 is fixed to the housing 8. In the state in which the contact 5 is fixed to the housing 8, as shown in FIG. 5, the forward side in the X direction (left side in FIG. 5) from the center in the longitudinal direction of the contact 5 is accommodated in the housing 8, and the front side in the X direction ( The right side in FIG. 5 is in a state of protruding from the housing 8. The contact 5 may be integrated with the housing 8 by insert molding.

  As shown in FIG. 5, the shell 9 has a substantially rectangular tube-shaped surrounding portion 9a that surrounds the periphery of the base portion 8a by opening both sides in the X direction of the base portion 8a, and side walls on both sides in the Y direction of the surrounding portion 9a. And a pair of arm portions 9b extending from the end on the near side in the X direction in FIG. 5 (right side in FIG. 5) further toward the near side in the X direction. An elongated slit 9c is formed in the insertion direction at the distal end of the arm portion 9b, whereby the arm portion 9b is formed in a substantially U shape. In addition, the side wall on both sides in the thickness direction of the surrounding portion 9a is bent toward the front side in the X direction (right side in FIG. 5) while being bent in a substantially S shape so as to be separated from each other. Projecting wall portions 9d and 9e projecting toward the surface are provided.

  6 is formed by press-fitting the base portion 8a of the housing into the cylinder of the surrounding portion 9a of the shell 9 from the front side in the X direction (right side in FIG. 5). At this time, the housing 8 and the shell 9 are positioned in the X direction by abutting the end surface 9f on the near side in the X direction (right side in FIG. 5) of the surrounding portion 9a and the guide protrusion 8c. Further, the arm portion 9b of the shell 9 is accommodated in a concave groove 8g provided on an end face on the outer side in the width direction of the guide protrusion 8c.

  Next, with reference to FIGS. 6 to 9, the process S2 (FIG. 15) for temporarily holding the adapter 11 in the subassembly 10 and the detailed structure of the parts related to the process S2 will be described. 7 is a perspective view showing a state in which the adapter is held in the sub-assembly at the temporary holding position, FIG. 8 is a view of the configuration of FIG. 7 viewed from the front side in the X direction (right side of FIG. 7), and FIG. It is IX-IX sectional drawing of FIG.

  As shown in FIGS. 6, 3, and the like, the connector 1 according to the present embodiment allows the substrate 6 to be moved by the substrate 6 when the substrate 6 is moved relative to the subassembly 10 to a predetermined mounting position Pa (FIG. 3). An adapter 11 is provided to push in the direction close to the assembly 10. In this embodiment, the adapter 11 is temporarily moved in a direction in which the contact 5 is separated from the wiring pattern 7 formed on the surface of the substrate 6 before the substrate 6 reaches the predetermined mounting position Pa (FIG. 3). It functions as a pressing mechanism that pushes it up. In the present embodiment, the relative movement (proximity) direction of the substrate 6 with respect to the subassembly 10 coincides with the insertion direction (that is, the X direction) of the connector 1.

  As shown in FIG. 6, the adapter 11 includes ridges 11b and 11c extending on both sides in the Z direction and ridges 11d and 11e extending on both sides in the X direction. It is formed in a cross shape. A plurality of through-holes 11f extending substantially along the X direction are formed corresponding to each contact 5 from the protruding line part 11d to the protruding line part 11e. As shown in FIGS. When approaching in the X direction toward the subassembly 10, the contact 5 relatively penetrates the corresponding through hole 11f.

  Further, in the present embodiment, when the adapter 11 pushed by the substrate 6 is moved to the innermost position Pb (FIG. 3) toward the subassembly 10, the ridges 11 b, 11 c, 11 d of the adapter 11 are moved to the housing 8. It is inserted into the formed notch 8f (see FIG. 4), and the leading end of the ridge 11d is inserted into the cylinder of the surrounding portion 9a of the shell 9 (see FIG. 5). Further, the ridges 11b and 11c are gently sandwiched between a pair of protruding wall portions 9d and 9e (see FIG. 5) of the shell 9. That is, with such a configuration, the subassembly 10 and the adapter 11 are concavo-convexly fitted with the adapter 11 in the innermost position Pb (see FIG. 3).

  Further, a pair of protruding strips 11g extending along the X direction is formed on both end faces of the adapter 11 in the width direction. When the adapter 11 is moved relative to the subassembly 10 in the X direction, each protrusion 11g is formed on the inner side in the width direction of the guide protrusion 8c and extends in the X direction along the groove 8h ( (See FIGS. 4 and 8) and is guided and moved along the concave groove 8h. That is, in this embodiment, the guide mechanism 12 of the adapter 11 is constructed by the protruding strip portion 11g and the concave groove 8h.

  And in this embodiment, as shown in FIG. 9, the protrusion part 11a provided in the through-hole 11f, and the substantially U-shaped bending part 5d provided in the contact 5 corresponding to this protrusion part 11a, Thus, a temporary holding mechanism 13 for temporarily holding the adapter 11 with respect to the subassembly 10 is configured. When the adapter 11 is relatively approached to the subassembly 10 from the front side in the X direction (right side in FIG. 9) and each contact 5 is inserted into the corresponding through hole 11f, the contact 5 The joint 5b gets over the protrusion 11a relatively, and then reaches the position (Pc) where the protrusion 11a is just accommodated in the bent part 5d as shown in FIG. At this position (Pc), the protruding portion 11a and the bent portion 5d are engaged, thereby restricting relative movement of the adapter 11 to both sides in the X direction with respect to the subassembly 10. That is, in this embodiment, the position of the adapter 11 shown in FIGS. 7 to 9 is the standby position Pc. In this embodiment, in the state where the adapter 11 is in the standby position Pc, the protrusions 11b, 11c, and 11d are sandwiched between the pair of guide protrusions 8c so that the movement in the Y direction is restricted, and the protrusions The movement in the Z direction is restricted by 11g being inserted into the concave groove 8h.

  Further, from FIG. 9, in the temporary holding state of the adapter 11 by the subassembly 10, the bending portion 5 d reduces the force in the direction of separating from the wiring pattern 7 acting on the contact 5 from the protruding portion 11 a as the pressing portion. You can understand that. That is, in the present embodiment, the bent portion 5d corresponds to the pressing reduction portion.

  Next, with reference to FIGS. 10 to 14, steps S3 to S6 (FIG. 15) after the step S2 and the detailed structure of parts related to these steps S3 to S6 will be described. 10 is a perspective view of the substrate, FIG. 11 is a perspective view showing a state in which the substrate is brought into contact with the adapter (a perspective view corresponding to FIG. 9), and FIG. 12 is a diagram of wiring the contacts by pushing the adapter with the substrate. FIG. 13 is a cross-sectional view of FIG. 12 in the same cross section as the IX-IX cross section of FIG. 8, and FIG. 14 is a cross section of the IX-IX cross section of FIG. FIG. 4 is a cross-sectional view of FIG. 3 in the same cross section.

  First, the configuration of the substrate 6 will be described with reference to FIG. Here, a description will be given of a posture in which the substrate 6 is disposed along the XY plane (that is, a posture in which the substrate 6 is moved toward the subassembly 10). As shown in FIG. 10, the substrate 6 is formed in a substantially rectangular flat plate shape, and a substantially rectangular notch 6a wide in the Y direction is formed on the front side in the X direction (left side in FIG. 10). Protrusions 6b and 6b extending in the X direction forward side are formed at both ends in the Y direction. A wiring pattern 7 corresponding to each contact 5 is formed on the front surface 6c and the back surface 6d. The wiring pattern 7 is provided with a pad portion 7a for soldering the lead wire of the cord and a pad portion 7b for soldering the joint portion 5b of the contact 5. The pad portions 7b are provided in correspondence with the positions of the joint portions 5b of the contacts 5, are provided at regular intervals in the width direction, and are alternately arranged in the X direction. The pad portion 7 b corresponds to a bonding position with the bonding portion 5 b in the wiring pattern 7. Each wiring pattern 7 includes an extending portion 7c that connects the pad portions 7a and 7b. The extending portion 7c extends in the width direction from the front side in the X direction (from the left side to the right side in FIG. 10). It arrange | positions so that the space | interval may spread. In addition, ground electrodes 7d are disposed on both ends in the Y direction of the formation region of the pad portion 7b.

  The pad portion 7 b is formed on the bottom surface of the recess 6 e formed in the substrate 6. Thus, by providing the concave portion 6e, it becomes easy to fasten a bonding agent such as cream solder in the concave portion 6e, and it can function as a retaining stopper for locking the joint portion 5b of the contact 5. In addition, although the structure of the said board | substrate 6 has shown only the surface 6c side in FIG. 10, the back surface 6d side is also the substantially the same structure.

  Then, a bonding agent for soldering such as cream solder is applied to the pad portion 7b of the substrate 6 in advance, that is, before the substrate 6 is relatively moved toward the subassembly 10 in the X direction. (Step S3, FIG. 15). Then, with the adapter 11 temporarily held at the standby position Pc in the subassembly 10 as shown in FIG. 7, as shown in FIGS. 9 and 11, the substrate 6 is abutted against the adapter 11 from the front side in the X direction, The board 6 is moved relatively close to the subassembly 10 from the front side in the X direction toward the front side, and the board 6 is relatively moved to the mounting position Pa (FIG. 3) while pushing the adapter 11 (step S4, FIG. 15).

  In step S4, first, the substrate 6 is brought relatively close to the subassembly 10 from the front side in the X direction toward the front side, and as shown in FIGS. The end face 6f (the back face of the notch 6a) is abutted against the end face 11i on the near side in the insertion direction of the adapter 11. In this state, the joint 5b of the contact 5 is located near the front surface 6c and the back surface 6d of the substrate 6.

  When the substrate 6 is in contact with the adapter 11 as described above, the substrate 6 is inserted into a slit 9c (see FIG. 5) formed in the arm portion 9b of the shell 9, as shown in FIG. ing. That is, in the present embodiment, the arm portion 9b having the slit 9c serves as a guide for guiding the substrate 6 toward the mounting position Pa, and is positioned in the thickness direction between the subassembly 10 and the substrate 6. I understand.

  Here, as shown in FIG. 9 and the like, the contact 5 located on the surface 6c side of the substrate 6 (the contact 5 in contact with the wiring pattern 7 formed on the surface 6c) is approximately V toward the surface 6c. A bent portion 5e that is recessed in a letter shape is formed, and the contact 5 (the contact 5 that contacts the wiring pattern 7 formed on the back surface 6d) located on the back surface 6d side of the substrate 6 is substantially V toward the back surface 6d. A bent portion 5e that is recessed in a letter shape is formed.

  Therefore, in step S4, when the board 6 is further moved in the X direction ahead from the state shown in FIGS. 11 and 9 and the adapter 11 is pushed in by the board 6, the adapter 11 as shown in FIGS. The protrusion 11 a formed in the through hole 11 f pushes up the bent portion 5 e formed in the contact 5 in a direction away from the front surface 6 c and the back surface 6 d of the substrate 6, that is, in a direction away from the wiring pattern 7. Accordingly, each contact 5 is elastically deformed and separated from the wiring pattern 7. That is, in the present embodiment, the protrusion 11a corresponds to the pressing portion. In other words, it can be said that the contact 5 (the bent portion 5e thereof) relatively gets over the protruding portion 11a as the subassembly 10 and the adapter 11 approach each other.

  Further, when the adapter 11 is pushed in by the substrate 6, in the present embodiment, in the state shown in FIG. 11 and FIG. 9, that is, in the state where the adapter 11 is temporarily held at the standby position Pc by the temporary holding mechanism 13, 11 g is inserted into the recessed groove 8 h, and the adapter 11 is in a state of being guided to move by the guide mechanism 12. Therefore, even if the position and attitude of the abutted substrate 6 are slightly deviated, the adapter 11 can move the intended route from the beginning when it is pushed by the substrate 6.

  And as shown in FIG. 12, the width | variety of the notch part 6a formed in the board | substrate 6 is substantially corresponded with the outer width of a pair of arm part 9b, 9b of the shell 9, and a pair of protrusion part 6b, 6b and It will be understood that the pair of arm portions 9b, 9b serve as a guide for guiding the substrate 6 toward the mounting position Pa, and also serves to position the subassembly 10 and the substrate 6 in the width direction. In addition, the protrusion 6b of the substrate 6 is further extended, and the pair of arms 9b and 9b are accommodated between the pair of protrusions 6b and 6b before the substrate 6 hits the adapter 11 at the standby position Pc. Thus, the substrate 6 may be moved and guided with respect to the subassembly 10.

  In step S4, from the state shown in FIGS. 12 and 13, the board 6 is further moved in the X direction, the adapter 11 is further pushed by the board 6, and the adapter 11 is attached to the mounting position as shown in FIGS. Pa is reached. At this time, before reaching the mounting position Pa, the contact 5 (the bent portion 5e thereof) elastically deforms and relatively moves over the protruding portion 11a, and the protruding portion 11a moves in the X direction with respect to the bent portion 5e. It will be located on the other side. At this position, the protrusion 11a does not press the contact 5. Therefore, the pressing force in the direction separating the contact 5 from the wiring pattern 7 from the protrusion 11a to the contact 5 is released, and the joint 5b is made elastic by the elasticity of the contact 5, respectively. It is elastically pressed against the pad portion 7 b of the wiring pattern 7.

  As described above, in step S4, when the substrate 6 is moved relatively close to the subassembly 10 and moved from the standby position Pc to the mounting position Pa, the contact portion 5b of the contact 5 is in contact with the pad portion 7b. Thus, instead of approaching along the X direction, the substrate 6 is once separated in the normal direction (Z direction) of the front surface 6c and the back surface 6d of the substrate 6, and then approaches the normal direction. Therefore, according to the present embodiment, it is possible to avoid the problem of scraping off the bonding agent such as cream solder applied to the pad portion 7b by the bonding portion 5b of the contact 5 or the like.

  Moreover, as shown in FIG. 3, when the board | substrate 6 finally reaches | attains the attachment position Pa and the adapter 11 reaches the innermost position Pb, the protrusion 11j formed in the protruding item | line part 11b of the adapter 11 respond | corresponds. The adapter 9 is inserted into a through-hole 9g formed in the protruding wall portion 9d of the shell 9, so that the adapter 11 is restricted from coming out to the front side in the insertion direction.

  Thereafter, the internal structure shown in FIG. 3 and FIG. 14 is appropriately heated and cooled to melt the cream solder as a bonding agent previously applied to the concave portion 6e (pad portion 7b) of the substrate 6 and After solidifying, the joint 5b of the contact 5 and the pad 7b of the wiring pattern 7 are joined and electrically connected (step S5, FIG. 15).

  Next, a corresponding conductive wire (not shown) in the cord 4 is soldered and electrically connected to the pad portion 7a of the wiring pattern. The tip 9h of the arm 9b of the shell 9 has reached a position corresponding to the ground electrode 7d, and the tip 9h is soldered to the ground electrode 7d at a total of four locations on the front and back of the substrate 6, The assembly 10 and the substrate 6 are fixed and grounded (step S6, FIG. 15).

  And the connector 1 shown in FIG. 1 and FIG. 2 is formed by performing resin mold processing with respect to the internal structure shown in FIG. 3 and FIG. 14 using an insulating synthetic resin material. In this case, the resin molding may be performed in a plurality of times (step S7, FIG. 15).

  As described above, according to the present embodiment, before the substrate 6 reaches the mounting position Pa, the contact 5 is temporarily pushed up to be elastically deformed by the relative movement of the substrate 6, and the contact 5 is A pressing mechanism (adapter 11) for separating the wiring pattern 7 was provided. With this configuration, it is possible to suppress the soldering bonding agent such as cream solder applied in advance on the wiring pattern 7 from being scraped off by the contact 5, and the bonding agent can more reliably connect the contact 5 and the wiring pattern 7. Can be joined.

  In the present embodiment, the adapter 11 that functions as a pressing mechanism is provided, and the adapter 11 is pushed in by the substrate 6 that moves relative to the attachment position Pa. Therefore, when the substrate 6 is moved toward the mounting position Pa, the contact 5 can be temporarily pushed up in the direction away from the wiring pattern 7 and elastically deformed by simply pushing the adapter 11 by the substrate 6. The operation of assembling the housing 8 and the substrate 6 while operating the pressing mechanism can be performed more easily.

  Further, the adapter 11 as the pressing mechanism according to the present embodiment itself is not substantially elastically deformed or plastically deformed, and is close to the subassembly 10 (X direction in the present embodiment). The relative movement is simply performed, and the relative movement is linearly performed. That is, according to the configuration according to the present embodiment, by using the elastic deformation of the contact 5, the pressing mechanism itself can be simplified and more than a case where the pressing mechanism itself is deformed. It is easy to suppress the variation in the amount of push-up with respect to the contact 5.

  Further, since the adapter 11 is pushed together with the board 6, an additional work for operating the pressing mechanism in the assembling work of the board 6 and the subassembly 10 (separate from the relative movement operation of the board 6 with respect to the subassembly 10). No special work is required.

  Further, in the relative movement between the substrate 6 and the subassembly 10, the contact 5 is temporarily pushed up to be elastic only when the joint portion 5 b of the contact 5 has a relative positional relationship corresponding to the pad portion 7 b of the wiring pattern 7. Since it is to be deformed, the load on the contact 5 is small, and the contact 5 can be prevented from sagging.

  Furthermore, in the present embodiment, the subassembly 10 is provided with the temporary holding mechanism 13 that temporarily holds the adapter 11 at the standby position Pc that is on the near side of the innermost position Pb that is pushed by the substrate 6. Therefore, compared to the case where the adapter 11 is separated from the subassembly 10, the adapter 11 can be handled more easily, and the adapter 8 is set in the standby position Pc in advance, so that the housing 8 and the substrate 6 can be more easily performed. The temporary holding mechanism 13 can be provided in other parts of the subassembly 10 (for example, the housing 8 and the shell 9).

  Further, in the present embodiment, the pressure reducing portion that reduces the force in the direction in which the contact 5 is separated from the wiring pattern 7 acting on the contact 5 from the protruding portion 11a as the pressing portion when the adapter 11 is in the standby position Pc. The bending part 5d was provided. Therefore, it is possible to suppress the contact 5 from sagging due to the force received from the protrusion 11a when the adapter 11 is at the standby position Pc. Further, if the adapter 11 is temporarily held at the standby position Pc in a state where a force is applied to the contact 5 from the protrusion 11a, the adapter 11 may move unintentionally from the standby position Pc due to the elastic reaction force of the contact 5. However, according to the present embodiment, such a problem can be suppressed.

  In this embodiment, at least one of the subassembly 10 and the adapter 11 (both in this embodiment) is provided with a guide mechanism 12 that moves and guides the 11 adapter that is pushed in by the substrate 6. Therefore, the adapter 11 can be moved along the intended route, and the push-up with respect to each contact 5 can be performed more reliably and more accurately.

  Further, in the present embodiment, the subassembly 10 and the adapter 11 are concavo-convexly fitted in a state where the adapter 11 is at the innermost position Pb pushed by the substrate 6. Therefore, the position shift between the subassembly 10 and the adapter 11 can be suppressed. In addition, it is easy to ensure the rigidity of the configuration in which the subassembly 10, the adapter 11, and the substrate 6 are integrated, and the subsequent process can be performed more easily and accurately, and the configuration in which these are integrated is provided. It is easy to improve the rigidity of the built-in connector 1 itself.

  In the present embodiment, the recess 6 e is formed in the pad portion 7 b of the substrate 6 as a position where the contact 5 is joined to the wiring pattern 7. Therefore, by engaging the contact 5 with the recess 6 e, the recess 6 e can function as a stopper for preventing the contact 5 from coming off from the substrate 6, and as a result, preventing the substrate 5 from coming off from the subassembly 10.

  In the above embodiment, the shell 9 is integrated with the subassembly 10 in advance, but may be integrated after the adapter 11 and the substrate 6 are integrated with the housing 8. In addition, it is not essential that the relative movement direction of the board with respect to the subassembly and the assembly direction of each component coincide with the insertion direction of the connector 1.

  (Second Embodiment) FIG. 16 is an exploded perspective view of a substrate included in a connector according to this embodiment and an attachment functioning as a pressing mechanism, FIG. 17 is a perspective view showing a state in which they are integrated, and FIG. FIG. 5 is a perspective view showing a cross section in a state where the substrate with the attachment attached is moved relative to the subassembly and disposed at the attachment position.

  In the present embodiment, the adapter 11 is not provided, but instead, the board 6A is provided with a pressing protrusion 14a that functions as a pressing mechanism, which is different from the first embodiment. That is, when the board 6A is moved relatively to the subassembly 10A including the housing 8A (see FIG. 18) to approach the subassembly 10A (see FIG. 18), before the joint 5b reaches the pad 7b, the pressing protrusion 14a provided on the board 6A The contact 5A is temporarily pushed up to be elastically deformed and separated from the wiring pattern 7.

  And in this embodiment, this press protrusion 14a is provided in the attachment 14 which can be fitted and attached to the board | substrate 6A. Therefore, the pressing mechanism can be obtained more easily than when the pressing protrusion is formed on the substrate 6A itself.

  Specifically, a rectangular shallow recess (notch) 6j is formed on the inner surface 6k of the notch 6a of the substrate 6A. The attachment 14 is formed long and thin with a substantially U-shaped cross section by a relatively hard insulating synthetic resin material, is positioned in the Y direction by the notch 6j, and is formed in the notch portion of the substrate 6A by the pair of pressing protrusions 14a and 14a. It is mounted on the substrate 6A in a state where the back side of 6a is sandwiched in the front and back direction (Z direction). In the state in which the attachment 14 is attached to the substrate 6A, the back surface 14b of the attachment 14 and the back surface 6k of the notch 6a form a series of planes having almost no step.

  In such a configuration, when the substrate 6A is moved relative to the subassembly 10A from the front side in the X direction toward the front side, the pressing protrusion 14a pushes up the contact 5 in a direction away from the wiring pattern 7, The contact 5 is elastically deformed. At this time, with respect to the contact 5 having a short length, the joint portion 5b is pushed up by the pressing protrusion 14a. On the other hand, for the contact 5 having a long length, after the joint portion 5b is pushed up by the pressing projection 14a, the bent portion 5e adjacent to the longitudinal direction is pushed up by the pressing projection 14a. The bent portion 5e is recessed toward the same direction as the bonding portion 5b (side approaching the front surface 6c or the back surface 6d of the substrate 6A), and is formed with a relatively shallow step with respect to the bonding portion 5b. This level difference is set so that the bent portion 5e does not interfere with the front surface 6c or the back surface 6d of the substrate 6A when the joint portion 5b is inserted into the concave portion 6e.

  Then, when the substrate 6A is relatively moved to the attachment position Pa, the pressing protrusion 14a reaches a position where a bent portion 5f opposite to the bent portions 5e and 5f formed on the contact 5 is formed. The bent portion 5f is formed so that a force in a direction away from the wiring pattern 7 does not act on the contact 5 from the pressing protrusion 14a. Therefore, in this state, the joint portion 5 b of the contact 5 is pressed against the pad portion 7 b of the wiring pattern 7 due to the elasticity of the contact 5.

  Thus, also in this embodiment, when the substrate 6A is moved relatively close to the subassembly 10 and moved relatively to the mounting position Pa, the contact 5 is in the X direction with respect to the pad portion 7b. Instead of being close to each other along the normal direction of the front surface 6c and the back surface 6d of the substrate 6A. Therefore, it is possible to avoid the problem of scraping off the bonding agent such as cream solder applied to the pad portion 7b by the bonding portion 5b of the contact 5 or the like.

  In this embodiment, the pressing protrusion 14a that functions as a pressing mechanism is provided on the substrate 6A. Therefore, the pressing mechanism can be obtained as a relatively simple configuration. Further, in the present embodiment, the pressing protrusion 14a is formed on the attachment 14 that is fitted and attached to the substrate 6A. Therefore, compared with the case where the pressing protrusion is formed on the substrate itself, the pressing mechanism can be obtained relatively easily with a simpler configuration. Needless to say, even when the pressing protrusions are formed on the substrate itself, the above-described problems can be suppressed.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiments, and various modifications can be made.

It is a perspective view of the connector concerning the embodiment of the present invention. It is the front view which looked at the connector concerning the embodiment of the present invention from the insertion projection side. It is a perspective view which shows the internal structure of the connector concerning 1st Embodiment of this invention. It is a disassembled perspective view of the housing and contact which are contained in the connector concerning a 1st embodiment of the present invention. FIG. 3 is an exploded perspective view of a housing, a contact, and a shell included in the connector according to the first embodiment of the present invention. FIG. 3 is an exploded perspective view of a subassembly and an adapter included in the connector according to the first embodiment of the present invention. It is a perspective view which shows the state which made the subassembly hold the adapter contained in the connector concerning 1st Embodiment of this invention in the temporary holding position. It is the figure which looked at the structure of FIG. 7 from the X direction near side. It is IX-IX sectional drawing of FIG. It is a perspective view of the board | substrate contained in the connector concerning 1st Embodiment of this invention. It is a perspective view (perspective view corresponding to Drawing 9) showing the state where the substrate contained in the connector concerning a 1st embodiment of the present invention was made to contact an adapter. It is a perspective view which shows the state which pushed up the contact temporarily in the direction spaced apart from a wiring pattern by pushing in an adapter with the board | substrate contained in the connector concerning 1st Embodiment of this invention. It is sectional drawing of FIG. 12 in the same cross section as the IX-IX cross section of FIG. It is sectional drawing of FIG. 3 in the same cross section as the IX-IX cross section of FIG. It is a flowchart which shows the manufacturing process of the connector concerning this embodiment. It is a disassembled perspective view of the board | substrate contained in the connector concerning 2nd Embodiment of this invention, and the attachment which functions as a press mechanism. It is a perspective view which shows the state which integrated the board | substrate and attachment which are contained in the connector concerning 2nd Embodiment of this invention. It is a perspective view which shows the cross section in the state which moved the board | substrate which attached the attachment of the connector concerning 2nd Embodiment of this invention relative to a subassembly, and has arrange | positioned in the attachment position.

Explanation of symbols

1 Connector 5, 5A Contact 5d Bent part (Pressure reduction part)
6, 6A Substrate 6e Concave part 7 Wiring pattern 7b Pad part (bonding position)
8,8A Housing 10,10A Subassembly 11 Adapter (Pressing mechanism)
11a Protruding part (pressing part)
12 Guide Mechanism 13 Temporary Holding Mechanism 14 Attachment 14a Pressing Protrusion (Pressing Mechanism)
Pa mounting position Pb innermost position Pc standby position

Claims (10)

A subassembly having a housing and a plurality of contacts fixed to the housing; and a substrate on which a wiring pattern for electrically connecting the plurality of contacts is formed, and the substrate is attached to the subassembly. In the connector that is relatively moved closer to the mounting position with respect to the subassembly and solders the contact to the corresponding wiring pattern in a state where the substrate is in the mounting position.
A connector provided with a pressing mechanism that temporarily pushes up the contact by the relative movement of the substrate and elastically deforms it so as to be separated from the wiring pattern before the substrate reaches the mounting position. An adapter that functions as the pressing mechanism,
The adapter is configured to be relatively pushed toward the subassembly by the board that moves relatively toward the attachment position, and the pressing portion provided on the pushed adapter includes the board at the attachment position. 2. The connector according to claim 1, wherein the contact is pushed up temporarily to be elastically deformed and separated from the wiring pattern before reaching the wiring pattern.   The connector according to claim 2, wherein the subassembly is provided with a temporary holding mechanism that temporarily holds the adapter at a standby position that is on the near side of the innermost position pushed by the board.   4. The contact is provided with a pressure reducing portion that reduces a force in a direction away from the wiring pattern acting on the contact from the pressing portion when the adapter is in the standby position. Connector described in.   The connector according to claim 2, wherein a guide mechanism that guides the adapter pushed by the board is provided in at least one of the subassembly and the adapter.   The sub-assembly and the adapter are adapted to be concavo-convexly fitted in a state where the adapter is in the innermost position pushed by the substrate. connector.   The connector according to claim 1, wherein a pressing protrusion that functions as the pressing mechanism is provided on the substrate. An attachment that is fitted to and mounted on the substrate,
The connector according to claim 7, wherein the pressing protrusion is formed on the attachment.   The connector according to claim 1, wherein a recess is formed at a position of the substrate where the contact is joined to the wiring pattern. Integrating a plurality of contacts into the housing to form a subassembly; and
Applying a soldering bonding agent to a bonding position of the wiring pattern formed on the substrate and electrically connecting the plurality of contacts to the contact;
Moving the substrate relative to the subassembly and moving it relative to a mounting position for the subassembly;
Heating and cooling the bonding agent in a state where the substrate is in the mounting position, and soldering and bonding the contact to the bonding position of the wiring pattern; and
In the manufacturing method of the connector provided with
In the step of relatively moving the board to the mounting position, the pressing mechanism that pushes the contact away from the wiring pattern by the relative movement of the board before the board reaches the mounting position. A method of manufacturing a connector, wherein the contact is temporarily pushed up to be elastically deformed and separated from the wiring pattern.

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