JP2010060360A - Angular velocity sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently produce high-reliability angular velocity sensors by always preventing a change in characteristic of a semiconductor element on a circuit board due to incident light from an explosion-preventing through hole provided in a cap for protecting vibrators and an internal circuit, in a process for mounting the cap on the circuit board, without adjusting the direction of the cap. <P>SOLUTION: An angular velocity sensor wherein a substantially rectangular cap 110 whose adjoining two sides are different in length, is mounted to perform sealing, on a substantially rectangular circuit board 20 to which tuning fork vibrators 70 and 72 and components such as an IC 50 for constituting an internal circuit for driving these vibrators and detecting angular velocity signals are fixed. In the sensor, the IC is arranged at any one of the corners of the circuit board, and a through hole 114 in the cap is arranged at either one of the corners adjoining the corner corresponding to the corner where the IC is arranged. Moreover, by performing arrangement so that the through hole is always disposed on the base section of either one of the vibrators, incident light from the through hole is always interrupted by the vibrators. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an angular velocity sensor that detects a rotational angular velocity, and more particularly to an angular velocity sensor used in, for example, a camera shake detection device or a car navigation system.

  Conventionally, as such an angular velocity sensor, a vibrator and a semiconductor element or a passive component constituting an internal circuit that drives the vibrator and detects an angular velocity signal are fixedly connected to a circuit board and detected by the internal circuit. There is one in which an angular velocity signal is extracted from an external electrode as an output signal.

In such an angular velocity sensor, in order to mechanically and electrically protect the vibrator and the internal circuit fixed to the circuit board, a vessel-shaped cap covering them may be mounted on the circuit board and sealed. Done. In this case, if heat is applied by reflow after the cap is sealed with respect to the circuit board, there is a risk that the internal air expands and the cap is removed.
For this reason, in the conventional angular velocity sensor, a small through hole for explosion prevention is provided in the cap as used in a semiconductor device or the like (for example, see Patent Document 1).

JP-A 63-150948

  However, since the angular velocity sensor includes a semiconductor element as an internal circuit, there is a problem in that output characteristics fluctuate when light mixed from a through hole provided for explosion prevention is irradiated onto the semiconductor element on the circuit board. For this reason, when the cap is mounted on the circuit board, the through hole of the cap is provided so that light mixed from the through hole of the cap is not irradiated to the semiconductor element on the circuit board. In the case of a cap having a substantially rectangular planar outline with different lengths, the cap can be mounted on the circuit board in a direction rotated 180 degrees in addition to the normal mounting direction. There is a problem that the light mixed from the through hole is irradiated to the semiconductor element on the circuit board and the output characteristics may change.

  In order to avoid such a problem, in the process of mounting the cap on the circuit board, the direction of the cap is recognized, and the cap is aligned in a direction in which the light incident from the through hole is not irradiated on the semiconductor element on the circuit board. Although the problem can be solved by mounting it on the circuit board after it has been carried out, providing such a step of aligning the cap causes a reduction in productivity and an increase in manufacturing cost.

  Therefore, the main object of the present invention is to use the explosion-proof through hole provided in the cap without aligning the cap in the process of mounting the cap on the circuit board to protect the vibrator and the internal circuit. It is to be able to always prevent the characteristic change of the semiconductor element on the circuit board due to the mixed light and to efficiently produce a highly reliable angular velocity sensor.

  In order to solve the above-described problems, an angular velocity sensor according to the present invention includes a vibrator, an internal circuit that drives the vibrator and detects an angular velocity signal, and a component that includes the vibrator and a semiconductor element that forms the internal circuit. And electrically connecting each surface electrode of the vibrator and the components constituting the internal circuit, and having an external electrode for taking out an angular velocity detection signal, the output electrode of the internal circuit and the external electrode A substantially rectangular circuit board formed so as to be electrically connected to each other, and a substantially rectangular planar outline in which the lengths of two adjacent sides are different, and a vibrator fixed to the circuit board and an internal A cap mounted on the circuit board so as to cover the circuit and sealed, and a cap having an explosion-proof through hole, and a semiconductor element constituting the internal circuit, Circuit base The through hole of the cap is disposed between two corners adjacent to the corner of the cap corresponding to the corner of the circuit board on which the semiconductor element is disposed. It is arranged in the vicinity of one of the corners.

According to the present invention, the semiconductor element constituting the internal circuit is disposed in the vicinity of one of the corners of the circuit board, and the through hole of the cap is the corner of the cap corresponding to the corner of the circuit board on which the semiconductor element is disposed. Since the cap is disposed in the vicinity of one of the two corners adjacent to the part, even if the cap is mounted in a direction rotated 180 degrees with respect to the circuit board, the through hole of the cap and the circuit board The separation distance from the semiconductor element fixed to is maintained, and the characteristic change of the semiconductor element on the circuit board due to light mixed from the through hole of the cap is always prevented.
Here, the vicinity of the corner means a position at least from the center of the circuit board toward the corner.

  The angular velocity sensor according to the present invention fixes two vibrators, an internal circuit that drives the two vibrators and detects two angular velocity signals, and fixes the two vibrators in directions orthogonal to each other. An external for fixing a part including the semiconductor element constituting the internal circuit, electrically connecting each surface electrode of the two vibrators and the part constituting the internal circuit, and taking out two angular velocity detection signals A substantially rectangular circuit board having electrodes and formed so as to electrically connect the output electrode of the internal circuit and the external electrode, and a substantially rectangular planar outline in which two adjacent sides have different lengths A cap that is mounted and sealed on the circuit board so as to cover the two vibrators fixed to the circuit board and the internal circuit, and has a cap having an explosion-proof through hole, With The speed sensor, the semiconductor element constituting the internal circuit is disposed in the vicinity of any corner of the circuit board, and the two vibrators are corners of the circuit board on which the semiconductor element is disposed. Each base portion is disposed in the vicinity of two corner portions adjacent to the portion, and the through hole of the cap is adjacent to the corner portion of the cap corresponding to the corner portion of the circuit board on which the semiconductor element is disposed. Even when the cap is mounted on the circuit board in any rotation direction, the through hole of the cap is formed in the circuit board. The position of the through hole of the cap and the base part of the two vibrators on the circuit board so as to be always provided on the base part of the vibrator of either of the two fixed vibrators The position of is set

  According to the present invention, the semiconductor element constituting the internal circuit is disposed in the vicinity of one of the corners of the circuit board, and the two vibrators are provided at two corners adjacent to the corner of the circuit board on which the semiconductor element is disposed. Each base portion is disposed in the vicinity of the portion, and the through hole of the cap is a corner of one of the two corner portions adjacent to the corner portion of the cap corresponding to the corner portion of the circuit board on which the semiconductor element is disposed. Even if the cap is mounted on the circuit board in any rotation direction, the base of one of the two vibrators with the through hole of the cap fixed to the circuit board is arranged. Since the position of the through hole of the cap and the position of the base part of the two vibrators of the circuit board are set so as to be always provided on the base part, the cap is rotated 180 degrees with respect to the circuit board. The through hole of the cap The distance from the semiconductor element fixed to the circuit board is maintained, and light penetration is blocked by the base part of one of the vibrators located under the through hole of the cap. Changes in the characteristics of the semiconductor elements are always prevented.

  In this case, the semiconductor element is provided with a recess at any corner of the circuit board and fixed in the recess, and the two vibrators are adjacent to the corner of the circuit board on which the semiconductor element is installed. It may be arranged in the vicinity of one side, and the respective vibration parts may be arranged on the recesses. Thereby, the vibration part of the vibrator is arranged on the semiconductor element, and the angular velocity sensor can be further downsized.

  According to the present invention, in the step of mounting the cap for protecting the vibrator and the internal circuit on the circuit board, the light is incident from the through-hole for explosion-proof provided in the cap without aligning the direction of the cap. It is possible to always prevent a change in characteristics of the semiconductor element on the circuit board and to efficiently produce a highly reliable angular velocity sensor.

  The above object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.

  FIG. 1 is an internal perspective view showing an example of the angular velocity sensor of the present invention, and FIG. 2 is an exploded perspective view thereof. The angular velocity sensor 10 includes a circuit board 20. The circuit board 20 is formed in a shape such as a rectangular plate. A recess 22 is formed on one surface of the circuit board 20. For example, the recess 22 is formed at a position that is offset toward one corner of the circuit board 20. In FIG. 2, the recess 22 is formed in a bowl shape, but may be any shape as long as an IC described later can be mounted.

  In the recess 22 of the circuit board 20, a plurality of electrodes 24 are formed so as to be arranged in a square shape, for example. In addition, on the outside of the recess 22 of the circuit board 20, three rectangular electrodes 26a, 26b, and 26c are formed side by side in the vicinity of the short side close to the recess 22. These electrodes 26 a to 26 c are arranged so that the longitudinal direction thereof is in the same direction as the short side of the circuit board 20 close to the recess 22. Further, three rectangular electrodes 28 a, 28 b, and 28 c are formed side by side on the outside of the recess 22 of the circuit board 20 in the vicinity of the long side close to the recess 22. These electrodes 28 a to 28 c are arranged so that the longitudinal direction thereof is in the same direction as the long side of the circuit board 20 close to the recess 22.

  Further, a plurality of pairs of counter electrodes 30 are formed between the recess 22 and the short side of the circuit board 20 at a position away from the recess 22. Each counter electrode 30 is formed so as to face each other in the longitudinal direction of the circuit board 20. A plurality of pairs of counter electrodes 30 are arranged along the short side of the circuit board 20. Further, a plurality of electrodes 32 are formed between the counter electrode 30 and the short side of the circuit board 20. A plurality of electrodes 34 are formed adjacent to the electrodes 26 a to 26 c formed in the vicinity of the short side of the circuit board 20 close to the recess 22. These electrodes 34 are arranged along the long side of the circuit board 20 away from the recess 22.

  As shown in FIG. 3, a plurality of external electrodes 40 and eight inspection electrodes 42 a to 42 h are formed on the other surface of the circuit board 20. The external electrodes 40 are formed side by side along the opposing long sides of the circuit board 20. Further, the inspection electrodes 42 a to 42 h are formed side by side inside the external electrode 40. The four inspection electrodes 42 a to 42 d and the other four inspection electrodes 42 e to 42 h are formed along each of the opposing long sides of the circuit board 20. Center points (center of gravity positions) C of the eight inspection electrodes 42 a to 42 h are arranged on the other surface of the circuit board 20 so as to coincide with a position G corresponding to the center of gravity of the angular velocity sensor 10 as a whole.

  The circuit board 20 is made of alumina, for example. Further, the electrodes 24, 26a to 26c, 28a to 28c, 30, 32, 34, 40, 42a to 42h, etc. formed on the circuit board 20 are made of, for example, nickel and gold sequentially on the electrodes formed of tungsten. It is formed by plating. The circuit board 20 is formed with a number of conductive wiring members (not shown) such as via holes and patterns.

  The IC 50 is fitted into the recess 22 of the circuit board 20. The IC 50 is used to drive a tuning fork vibrator described later and process an output signal of the tuning fork vibrator. A plurality of external electrodes (not shown) are formed on the IC 50, and the external electrodes of the IC 50 are connected to the electrodes 24 in the recess 22, respectively. At this time, for example, a gold bump 52 is formed on the electrode 24, and the electrode 24 and the external electrode of the IC 50 are connected by the gold bump 52. The IC 50 is fixed to the circuit board 20 by an underfill 54 made of an epoxy adhesive or the like.

  A chip capacitor 60 is connected to the counter electrode 30 formed on the circuit board 20. As the chip capacitor 60, for example, a multilayer ceramic capacitor is used, and external electrodes formed at both ends thereof are connected to the counter electrode 30 by solder 62 or the like.

  Further, the first tuning fork vibrator 70 and the second tuning fork vibrator 72 are attached to the electrodes 26 a to 26 c and 28 a to 28 c formed outside the recess 22, respectively. The first tuning fork type vibrator 70 and the second tuning fork type vibrator 72 include a substantially rectangular base part 74 and are formed such that two leg parts 76a and 76b extend from one end in the longitudinal direction thereof. . These leg portions 76 a and 76 b are formed so as to extend in parallel with each other on the inner side from both ends of the base portion 74 in the width direction.

  As shown in FIG. 4, each of the first tuning fork type vibrator 70 and the second tuning fork type vibrator 72 includes two tuning fork type piezoelectric substrates 80 and 82, and these piezoelectric substrates 80 and 82. The intermediate electrode 84 is sandwiched between them. The piezoelectric substrates 80 and 82 are formed of a piezoelectric material such as lead zirconate titanate (PZT), for example, and are polarized in opposite thickness directions, for example.

  Three surface electrodes 86, 88 and 90 are formed on the surface of one piezoelectric substrate 80. The surface electrodes 86 and 88 are divided from each other at the central portion in the width direction of one leg portion 76a, and the surface electrode 86 on the end side is formed to extend from the base portion 74 to the leg portion 76a. Further, the surface electrodes 88 and 90 are divided from each other at the center portion in the width direction of the other leg portion 76b, and the surface electrode 90 on the end side is formed to extend from the base portion 74 to the leg portion 76b. Further, the central surface electrode 88 is formed so as to extend from the base portion 74 to both the leg portions 76a and 76b. Here, the division width between the surface electrodes 86, 88, 90 is formed so as to be wide at the base portion 74 and narrow at the legs 76a, 76b. A full-surface electrode 92 is formed on the surface of the other piezoelectric substrate 82.

  The first tuning fork type vibrator 70 and the second tuning fork type vibrator 72 are attached to the electrodes 26 a to 26 c and the electrodes 28 a to 28 c formed outside the recess 22 of the circuit board 20. At this time, using the bonding material 100, the surface electrodes 86, 88, 90 of the two tuning fork vibrators 70, 72 are connected to the electrodes 26a, 26b, 26c and the electrodes 28a, 28b, 28c, respectively. As the bonding material 100, for example, an anisotropic conductive adhesive, a conductive adhesive, a resin-metal composite material, a gold bump, or the like is used. Since it is necessary to ensure insulation between the surface electrodes 86, 88, 90, when an anisotropic conductive adhesive or a resin-metal composite material is used as the bonding material 100, the base portion 74 has 3 The bonding material 100 can be applied to the entire surface of the two electrodes 86, 88, and 90, but when other materials are used, the bonding material 100 is divided into the respective surface electrodes 86, 88, and 90. It is necessary to grant.

  The first tuning fork type vibrator 70 and the second tuning fork type vibrator 72 are arranged in a substantially orthogonal direction, but have different resonance frequencies so that each vibration does not affect other vibrators. Things are used. The leg portions 76 a and 76 b of the first tuning fork vibrator 70 are formed longer than the leg portions 76 a and 76 b of the second tuning fork vibrator 72. Thereby, the first tuning fork vibrator 70 has a lower resonance frequency than the second tuning fork vibrator 72.

  The first tuning fork vibrator 70 having a low resonance frequency is connected to electrodes 26 a to 26 c formed in the vicinity of the short side of the circuit board 20. The second tuning fork vibrator 72 having a high resonance frequency is connected to electrodes 28 a to 28 c formed in the vicinity of the long side of the circuit board 20. The leg portions 76a and 76b of the first tuning fork vibrator 70 and the second tuning fork vibrator 72 are arranged so as to extend toward the recess 22 along the short side and the long side of the circuit board 20. Is done.

  A necessary part of the circuit formed by the IC 50 and the chip capacitor 60 is connected to the external electrode 40 formed on the other surface of the circuit board 20 via the electrode 24, the counter electrode 30 and a wiring member (not shown). Is done. Further, the surface electrodes 86, 88, 90 of the first tuning fork vibrator 70 and the second tuning fork vibrator 72 are connected to the IC 50 via the electrodes 26a to 26c, 28a to 28c and a wiring member (not shown). And the test electrodes 42 a to 42 h formed on the other surface of the circuit board 20. At this time, the surface electrodes 86, 88, and 90 of the first tuning fork vibrator 70 and the second tuning fork vibrator 72 are, respectively, four inspection electrodes 42a to 42d and four inspection electrodes arranged in two rows. The electrodes 42e to 42h are connected.

  Here, the surface electrode 88 at the center of the first tuning-fork vibrator 70 is connected to the two outer inspection electrodes 42a and 42d out of the four inspection electrodes 42a to 42d arranged side by side. The surface electrodes 86, 90 on both sides of the first tuning fork vibrator 70 are connected to the two inspection electrodes 42b, 42c. The surface electrode 88 at the center of the second tuning-fork vibrator 72 is connected to the two outer inspection electrodes 42e and 42h among the other four inspection electrodes 42e to 42h arranged side by side. The surface electrodes 86 and 90 on both sides of the second tuning fork vibrator 72 are connected to the two inspection electrodes 42f and 42g.

  On one surface of the circuit board 20, a cap 110 is attached so as to cover the IC 50, the chip capacitor 60, the first tuning fork vibrator 70 and the second tuning fork vibrator 72. The cap 110 is made of, for example, a material such as alumina or white and white, and is formed in a rectangular container shape that matches the outer shape of the circuit board 20.

  In order to attach the cap 110 to the circuit board 20, a cap adhesive 112 is applied between the end of the cap 110 and the circuit board 20. As the cap adhesive 112, for example, an epoxy adhesive or the like is used when an insulating cap 110 such as alumina is attached, and an epoxy adhesive is used when a conductive cap 110 such as white is attached. In addition, an epoxy conductive adhesive or the like is used.

  The cap 110 is formed with an explosion-proof through hole 114. The through hole 114 is formed in the vicinity of the corner of the cap 110 at a position corresponding to the base portion 74 of the first tuning fork vibrator 70. The through hole 114 may be formed in the vicinity of the corner portion of the cap 110 at a position corresponding to the base portion 74 of the second tuning fork type vibrator 72. That is, the through hole 114 is formed at a position where the cap 110 is not disposed on the IC 50 even if the cap 110 is rotated 180 ° and attached to the circuit board 20.

  Next, the circuit configuration of the angular velocity sensor 10 will be described with reference to FIG. Here, in the angular velocity sensor 10, the circuit configuration related to the first tuning fork type vibrator 70 and the circuit configuration related to the second tuning fork type vibrator 72 are the same circuit configuration. The circuit configuration related to the tuning fork type vibrator 70 will be described in detail, and then the circuit configuration related to the second tuning fork type vibrator 72 will be briefly described.

  In the angular velocity sensor 10, the surface electrodes 86 and 90 of the first tuning fork vibrator 70 are input to two inputs of an input buffer 200 included in the IC 50 via electrodes 24, 26 a and 26 c and a wiring member (not shown). Connected to the end. This input buffer 200 has one output end and the other two output ends, and one output end is for outputting a signal that is the sum of the signals input to the two input ends. These two output terminals are for outputting signals input to the two input terminals. In the IC 50, one output terminal of the input buffer 200 is connected to an input terminal of an amplitude control circuit 202 for controlling the amplitude of the signal, and the output terminal of the amplitude control circuit 202 is used to make the phase of the signal appropriate. Connected to the input terminal of the phase shift circuit 204. The output terminal of the phase shift circuit 204 in the IC 50 is connected to the surface electrode 88 of the first tuning fork vibrator 70 via the electrodes 24 and 26b and a wiring member (not shown). In this way, a driving feedback loop is formed in the first tuning fork vibrator 70. The surface electrodes 86, 88, 90 of the first tuning fork vibrator 70 are connected to predetermined ones of the four inspection electrodes 42a to 42d as described above.

  In the IC 50, the other two output terminals of the input buffer 200 are connected to two input terminals of the differential amplifier circuit 206, and the output terminal of the differential amplifier circuit 206 is synchronously detected via the amplitude adjustment circuit 208. The circuit 210 is connected to one input terminal, and one output terminal of the input buffer 200 is connected to the other input terminal of the synchronous detection circuit 210 via the detection clock generation circuit 212. The synchronous detection circuit 210 detects a signal input to one input terminal thereof in synchronization with a signal (detection clock) input to the other input terminal. The output terminal of the synchronous detection circuit 210 is connected to one external electrode (electrode 24) of the IC 50, and this external electrode and another external electrode (another electrode 24, external electrode 40 (REF) of the IC 50 to which a reference voltage is applied. )) Is connected to a capacitor C1 (chip capacitor 60) via an electrode 30 and a wiring member (not shown).

  Further, in the IC 50, the output terminal of the synchronous detection circuit 210 is connected to one input terminal of the adjustment circuit 214. This adjustment circuit 214 is for temperature compensation of the output signal of the synchronous detection circuit 210. Therefore, a serial interface 216, a logic circuit 218, a memory 220, and a temperature sensor 222 are provided in the IC 50. The serial interface 216 has three input terminals connected to three external electrodes (three electrodes 24) and three external electrodes 40 (ACS, ACLK, and ASDIO) of the IC 50, respectively, and an output terminal connected to the input of the logic circuit 218. Connected to the end. The input / output terminal of the logic circuit 218 is connected to the input / output terminal of the memory 220. Further, the VPP voltage terminal of the memory 220 is connected to the external electrode (electrode 24) and the external electrode 40 (VPP) of the IC 50. Therefore, various data such as data relating to impedance change characteristics with respect to temperature changes of the first tuning-fork vibrator 70 actually measured are transferred from the external electrode 40 to the memory 220 via the serial interface 216 and the logic circuit 218. Can be remembered. The output terminal of the logic circuit 218 is connected to another input terminal of the adjustment circuit 214. Therefore, data stored in the memory 220 can be supplied to the adjustment circuit 214 via the logic circuit 218. Further, the output terminal of the temperature sensor 222 is connected to another input terminal of the adjustment circuit 214. Therefore, the adjustment circuit 214 can compensate the temperature of the input signal, that is, the output signal of the synchronous detection circuit 210 based on the data stored in the memory 220 and the output signal of the temperature sensor 222.

  Although not shown, the memory 220 is also connected to the amplitude adjustment circuit 208 described above. Based on the gain-related data stored in the memory 220, the amplitude adjustment circuit 208 outputs an output signal of the differential amplifier circuit 206. Can be adjusted.

  In the IC 50, the output terminal of the adjustment circuit 214 is connected to the input terminal of the low-pass filter 224. The low-pass filter 224 is for passing a low frequency band including an angular velocity frequency detected by the angular velocity sensor 10, for example, 10 Hz to 50 Hz. The output end of the low-pass filter 224 is connected to the external electrode (electrode 24), electrode 30 and external electrode 40 (OUTx) of the IC 50. The low-pass filter 224 also has another output terminal that passes and outputs the input signal, and the other output terminal is connected to another external electrode (electrode 24) and another electrode 30 of the IC 50. A capacitor C2 (chip capacitor 60) is connected between the output end of the low-pass filter 224 and another output end (between the electrodes 30).

  The output end of the low-pass filter 224, that is, the external electrode 40 (OUTx) is connected to the input end of a high-pass filter 226 provided outside. The high pass filter 226 is for cutting a DC component in the signal. The high pass filter 226 includes a capacitor C3 and a resistor R1, and the capacitor C3 is connected between the input terminal and the output terminal thereof, and another external electrode 40 (REF) to which the reference voltage of the IC 50 is applied. Is connected to the resistor R1.

  The output end of the high-pass filter 226, that is, the connection point between the capacitor C3 and the resistor R1 is connected to the external electrode 40 (AINx). The external electrode 40 (AINx) is connected to the positive input terminal of the operational amplifier 228 used for the subsequent amplifier in the IC 50 through the electrode 24 and the like. The post-stage amplifier is for amplifying the amplitude of the signal input to the external electrode 40 (AINx) by about 50 times, for example. The operational amplifier 228 has a negative input terminal connected to the external electrode 40 (AFBx) via the electrode 24 and the like, and an output terminal connected to another external electrode 40 (APOx) via the other electrode 24 and the like. Further, a low-pass filter 230 provided outside is connected to these external electrodes 40 (AFBx, APOx). The low-pass filter 230 includes a resistor R2 and a capacitor C4, and the resistor R2 and the capacitor C4 are connected in parallel between the external electrodes 40 (AFBx, APOx). A resistor R3 is connected between the external electrode 40 (AFBx) and another external electrode 40 (REF) to which the reference voltage is applied. Therefore, the amplitude of the signal input to the external electrode 40 (AINx) is amplified by, for example, about 50 times by a post-stage amplifier including the operational amplifier 228, and output from the output terminal of the op amp 228, that is, the external electrode 40 (APOx). it can.

  Further, a switch SW is provided in the IC 50. The switch SW is connected to the external electrode (electrode 24) of the IC 50 connected to the external electrode 40 (AINx) and another external electrode of the IC 50 connected to another external electrode 40 (REF) to which the reference voltage of the IC 50 is applied. Connected to another electrode 24). The switch SW is connected to the external electrode (electrode 24) of the IC 50 connected to the external electrode 40 (SCT). Further, the switch SW is configured to be turned on or off by a control signal input to the external electrode 40 (SCT). If the capacitor C3 of the high-pass filter 226 is charged by turning on the switch SW for 0.2 seconds, for example, the output terminal of the low-pass filter 224, that is, the signal of the external electrode 40 (OUTx) can be transmitted in a short time to the positive input terminal of the operational amplifier 228. The rise time of the output signal at the output terminal of the operational amplifier 228, that is, the external electrode 40 (APOx) can be shortened.

  The external electrode 40 (VCC) is connected to the electrode 24 connected to VCC and VDD of the IC 50 via a wiring member (not shown), and the external electrode 40 (GND) is connected to the wiring member (not shown). To the electrode 24 connected to the GND of the IC 50. The external electrode 40 (SLP) is connected to the electrode 24 connected to the sleep control terminal of the IC 50 via a wiring member (not shown).

  In the angular velocity sensor 10, as with the first tuning fork vibrator 70, the surface electrodes 86 and 90 of the second tuning fork vibrator 72 are connected via the electrodes 24, 28a and 28c and a wiring member (not shown). Are connected to two input terminals of an input buffer 200 ′ similar to the input buffer 200 included in the IC 50. One output terminal of the input buffer 200 ′ includes an amplitude control circuit 202 ′ similar to the amplitude control circuit 202, a phase shift circuit 204 ′ similar to the phase shift circuit 204, electrodes 24 and 28 b and a wiring member (not shown). To the surface electrode 88 of the second tuning-fork vibrator 72. In this manner, a feedback loop for driving is also formed in the second tuning fork vibrator 72. However, the driving feedback loop is formed such that the driving frequency of the second tuning fork vibrator 72 is higher than the driving frequency of the first tuning fork vibrator 70.

  The other two output terminals of the input buffer 200 ′ are also synchronized with the synchronous detection circuit 210 through the differential amplification circuit 206 ′ and the amplitude adjustment circuit 208 ′ similar to the differential amplification circuit 206 and the amplitude adjustment circuit 208. It is connected to one input terminal of the detection circuit 210 ′, and one output terminal of the input buffer 200 ′ is connected to the synchronous detection circuit 210 ′ via a detection clock generation circuit 212 ′ similar to the detection clock generation circuit 212. Connected to the other input end. Although not shown, the memory 220 is also connected to the adjustment circuit 208 ′, and the amplitude of the output signal of the differential amplifier circuit 206 ′ is adjusted by the amplitude adjustment circuit 208 ′ based on the gain-related data stored in the memory 220. Can be adjusted. In addition, the detection clock generation circuit 212 ′ generates a detection clock having a shorter period corresponding to the higher driving frequency of the second tuning-fork vibrator 72 than the detection clock generation circuit 212, and the synchronous detection circuit 210 ′ The detection cycle is also shorter than the detection cycle in the synchronous detection circuit 210.

  The output terminal of the synchronous detection circuit 210 ′ is connected to one external electrode (electrode 24) and electrode 30 of the IC 50, and this electrode 30 and another external electrode (another electrode 24, external electrode) of the IC 50 to which a reference voltage is applied. A capacitor C5 (chip capacitor 60) is connected between the electrode 40 (REF)).

  Further, in the IC 50, the output terminal of the synchronous detection circuit 210 ′ is connected to one input terminal of an adjustment circuit 214 ′ similar to the adjustment circuit 214. Further, the memory 220 and the temperature sensor 222 are connected to another input terminal and further another input terminal of the adjustment circuit 214 ′, respectively. Therefore, the data stored in the memory 220 can be given to the adjustment circuit 214 ′. Furthermore, the adjustment circuit 214 ′ can compensate the temperature of the output signal of the synchronous detection circuit 210 ′ based on the data related to the second tuning fork vibrator 72 stored in the memory 220 and the output signal of the temperature sensor 222. it can.

  In the IC 50, the output terminal of the adjustment circuit 214 ′ is connected to the input terminal of a low-pass filter 224 ′ that is similar to the low-pass filter 224. The output terminal of the low-pass filter 224 ′ is connected to the external electrode (electrode 24), the electrode 30 and the external electrode 40 (OUTy) of the IC 50, and another output terminal of the low-pass filter 224 ′ is connected to another external electrode (electrode) of the IC 50. 24) and another electrode 30. A capacitor C6 (chip capacitor 60) is connected between the output end of the low-pass filter 224 ′ and another output end (between the electrodes 30).

  The output end of the low-pass filter 224 ′, that is, the external electrode 40 (OUTy) is connected to the input end of a high-pass filter 226 ′ provided outside the same as the high-pass filter 226. The high-pass filter 226 ′ has a capacitor C7 connected between its input end and output end, and a resistor R4 between the output end and another external electrode 40 (REF) to which the reference voltage of the IC 50 is applied. Connected.

  The output terminal of the high-pass filter 226 ′, that is, the connection point between the capacitor C7 and the resistor R4 is connected to the external electrode 40 (AINy). The external electrode 40 (AINy) is connected to the positive input terminal of an operational amplifier 228 ′ used in another post-stage amplifier similar to the post-stage amplifier in the IC 50 via the electrode 24 and the like. This other post-stage amplifier is for amplifying the amplitude of the signal input to the external electrode 40 (AINy) by about 50 times, for example. The operational amplifier 228 ′ has a negative input terminal connected to the external electrode 40 (AFBy) via the electrode 24 and the like, and an output terminal connected to another external electrode 40 (APOy) via the other electrode 24 and the like. . The external electrodes 40 (AFBy, APOy) are connected to a low-pass filter 230 ′ provided outside the same as the low-pass filter 230. A resistor R5 and a capacitor C8 of the low-pass filter 230 ′ are connected in parallel between the external electrodes 40 (AFBy, APOy). A resistor R6 is connected between the external electrode 40 (AFBy) and another external electrode 40 (REF) to which the reference voltage is applied. Therefore, the amplitude of the signal input to the external electrode 40 (AINy) is amplified by, for example, about 50 times by another subsequent amplifier including the operational amplifier 228 ′, and the output terminal of the operational amplifier 228 ′, that is, the external electrode 40 (APOy) is amplified. Can be output.

  In addition, a switch SW ′ similar to the switch SW is provided in the IC 50. The switch SW ′ is another external electrode of the IC 50 connected to the external electrode (electrode 24) of the IC 50 connected to the external electrode 40 (AINy) and another external electrode 40 (REF) to which the reference voltage of the IC 50 is applied. It is connected between (another electrode 24). The switch SW ′ is also connected to the external electrode (electrode 24) and the external electrode 40 (SCT) of the IC 50. Further, the switch SW is also configured to be switched on or off by a control signal input to the external electrode 40 (SCT). Therefore, if the capacitor C7 of the high-pass filter 226 ′ is charged by turning on the switch SW ′ for 0.2 seconds, for example, the signal of the output terminal of the low-pass filter 224 ′, that is, the external electrode 40 (OUTy) can be obtained in a short time. It is transmitted to the positive input terminal of 228 ′, and the rise time of the output signal at the output terminal of the operational amplifier 228 ′, that is, the external electrode 40 (APOy) can be shortened.

  Next, the operating state of the angular velocity sensor 10 will be described. In this angular velocity sensor 10, for example, the first tuning fork vibrator 70 is used to detect the rotational angular velocity applied around the X axis parallel to the short side of the circuit board 20, and the second tuning fork vibrator 72 is used to detect the rotational angular velocity applied around the Y axis parallel to the long side of the circuit board 20.

  In the first tuning-fork vibrator 70, a self-excited drive circuit is formed by a drive feedback loop including the input buffer 200, the amplitude control circuit 202, and the phase shift circuit 204. The legs 76a and 76b are, for example, shown in FIG. As shown, it vibrates with basic vibrations so as to open and close each other. In a state where the legs 76a and 76b are open to each other (indicated by a solid line in FIG. 6), in the first tuning fork vibrator 70, the portion where the central surface electrode 88 is formed extends, and the surface electrodes 86 on both sides extend. , 90 are formed. On the other hand, in the state where the legs 76a and 76b are closed to each other, in the first tuning fork vibrator 70, the portion where the central surface electrode 88 is formed contracts, and the portions where the surface electrodes 86 and 90 on both sides are formed. Is growing. At the time of this basic vibration, the two legs 76a and 76b vibrate symmetrically in the same state with respect to the polarization direction, so the same signal is output from the surface electrodes 86 and 90 on both sides. Therefore, a signal “0” is output from the differential amplifier circuit 206 for the detection circuit, and thus from the external electrode 40 (APOx).

  In this basic vibration state, when a rotational angular velocity is applied to the first tuning fork vibrator 70 around the X axis, a Coriolis force acts on the legs 76a and 76b in a direction orthogonal to the direction of the basic vibration. Since the Coriolis forces acting on the legs 76a and 76b are opposite to each other, the two legs 76a and 76b are displaced in opposite directions as shown in FIG. 7, for example. Due to this displacement, opposite phase signals are outputted from the surface electrodes 86 and 90 on both sides, and a large signal corresponding to the rotational speed is outputted from the differential amplifier circuit 206. The magnitude and polarity of the signal output in this way correspond to the magnitude of the rotational angular velocity and the direction of rotation, respectively.

  The amplitude of the output signal of the differential amplifier circuit 206 is adjusted by the amplitude adjustment circuit 208 based on the data stored in the memory 220. The signal whose amplitude is adjusted in this way is detected by the synchronous detection circuit 210 in synchronization with the detection clock of the detection clock generation circuit 212. The detected signal is temperature compensated by the adjustment circuit 214 or the like. The necessary low frequency band of the temperature-compensated signal is passed by the low-pass filter 224, and the DC component is cut by the high-pass filter 226. Then, the signal from which the DC component is cut is amplified by a post-stage amplifier including the operational amplifier 228 and is output from the output terminal of the operational amplifier 228, that is, the external electrode 40 (APOx). Therefore, the magnitude and direction of the rotational angular velocity applied around the X axis can be detected based on the magnitude and polarity of the output signal from the external electrode 40 (APOx).

  In the second tuning fork vibrator 72 as well, like the first tuning fork vibrator 70, the leg portions 76a and 76b vibrate with the fundamental vibration by the driving feedback loop including the input buffer 200 '. However, in the second tuning fork type vibrator 72, the direction of the basic vibration of the legs 76a and 76b is displaced according to the rotational angular velocity applied around the Y axis. Therefore, with respect to the second tuning-fork type vibrator 72, the magnitude and rotation of the rotational angular velocity applied around the Y axis depending on the magnitude and polarity of the output signal from the differential amplifier circuit 206 ′ and thus the external electrode 40 (APOy). The direction can be detected.

FIG. 8 shows the positional relationship between the explosion-proof through hole 114 provided in the cap 110 of the angular velocity sensor 10 according to the embodiment of the present invention described above and the IC 50 fixed to the circuit board 20.
The angular velocity sensor 10 is mounted on a substantially rectangular circuit board 20 with a cap 110 having a substantially rectangular planar outline in which the lengths of two adjacent sides are different and provided with an explosion-proof through hole 114, and is a tuning fork type. It seals components such as the IC 50 as a semiconductor element constituting the vibrator and the internal circuit. Therefore, the cap 110 can be mounted on the circuit board 20 in a direction rotated by 180 degrees as shown in FIG. 8 (2) in addition to the normal mounting direction as shown in FIG. 8 (1). .
Here, the IC 50, which is a semiconductor component constituting the internal circuit, is disposed in the vicinity of any corner (upper right in the example of FIG. 8) of the circuit board 20, and the through hole 114 of the cap is a circuit in which the IC 50 is disposed. It is arranged in the vicinity of one of the two corners adjacent to the corner of the cap corresponding to the corner of the substrate (lower right in the example of FIG. 8 (1)), and the through-hole of the cap Since a predetermined separation distance is ensured between 114 and the IC 50 of the circuit board, even if light enters from the through hole 114 of the cap, the output characteristics of the IC 50 are not affected.
On the other hand, when the cap 110 is mounted in a direction rotated 180 degrees with respect to the circuit board 20, the through-hole 114 of the cap has a corner portion different from the corner portion where the IC 50 is disposed (example of FIG. 8B). In the upper left), a predetermined separation distance is secured between the through hole 114 of the cap and the IC 50 of the circuit board. Therefore, even if light enters from the through hole 114 of the cap, the output characteristics of the IC 50 Will not be affected.
Therefore, in the process of mounting the cap on the circuit board to protect the vibrator and the internal circuit, the circuit board IC is formed by the light incident from the explosion-proof through hole provided in the cap without aligning the direction of the cap. It is always possible to prevent changes in characteristics.

  In this case, in the above embodiment, the case of a biaxial angular velocity sensor using two tuning fork vibrators has been described. However, the present invention is not limited to this, and a single vibrator is used. A uniaxial angular velocity sensor may be used. However, the invention of the present application is particularly useful in a biaxial angular velocity sensor in which an IC must be disposed in the vicinity of a corner of a circuit board in terms of layout.

Further, the positions of the explosion-proof through hole 114 provided in the cap 110 of the angular velocity sensor 10 according to the embodiment of the present invention described above, the IC 50 fixed to the circuit board 20, and the two tuning fork vibrators 70 and 72. The relationship is shown in FIG.
Also in this case, the angular velocity sensor 10 has a cap 110 having a substantially rectangular planar outline with different lengths of two adjacent sides on a substantially rectangular circuit board 20 and provided with an explosion-proof through hole 114. It is mounted and seals the two tuning fork vibrators 70 and 72 and components such as the IC 50 which is a semiconductor element constituting the internal circuit. Accordingly, the cap 110 can be mounted on the circuit board 20 in a direction rotated by 180 degrees as shown in FIG. 9 (2) in addition to the normal mounting direction as shown in FIG. 9 (1). .
Here, the IC 50, which is a semiconductor component constituting the internal circuit, is arranged in the vicinity of any corner (upper right in the example of FIG. 9) of the circuit board 20, and the through hole 114 of the cap is a circuit in which the IC 50 is arranged. Near one of the two corners adjacent to the corner of the cap corresponding to the corner of the substrate (lower right in the example of FIG. 9 (1)), and either tuning fork type It is arranged so as to be on the base of the vibrator (first tuning fork vibrator 70 in the example of FIG. 9).
On the other hand, when the cap 110 is mounted in a direction rotated 180 degrees with respect to the circuit board 20, the through-hole 114 of the cap is different from the corner where the IC 50 is disposed (example in FIG. 9B). In FIG. 9B, the other tuning-fork type vibrator (the second tuning-fork type vibrator 72 in the example of FIG. 9B) is disposed on the base part.
In this way, regardless of the rotation direction of the cap 110 mounted on the circuit board 20, the cap through-hole 114 is in the vicinity of a corner different from the corner where the IC 50 is disposed, and The position of the through hole 114 of the cap and the two on the circuit board are always arranged on the base of the tuning fork vibrator of the two tuning fork vibrators fixed to the circuit board. Since the position of the base portion of the tuning fork vibrators 70 and 72 is set, a predetermined separation distance is always ensured between the through hole 114 of the cap and the IC 50 of the circuit board, and the through hole 114 of the cap. Even if light is incident from, it is blocked by the base portion of any tuning fork vibrator and does not affect the output characteristics of the IC 50.
Therefore, in the process of mounting the cap on the circuit board to protect the vibrator and the internal circuit, the circuit board IC is formed by the light incident from the explosion-proof through hole provided in the cap without aligning the direction of the cap. It is always possible to prevent changes in characteristics of the

  In this case, in the above embodiment, the two tuning fork vibrators are arranged in the vicinity of two sides adjacent to the corner of the circuit board on which the IC is arranged, and the respective leg portions are arranged on the IC. Although described as a thing, this invention is not limited to this. For example, even if two tuning fork vibrators are arranged in the vicinity of two sides that are not adjacent to the corner of the circuit board on which the IC is arranged, and the cap is mounted on the circuit board in any rotation direction, The position of the through hole of the cap and the position of the two tuning fork vibrators are such that the through hole of the cap is always provided on the base of the tuning fork vibrator of either of the two tuning fork vibrators. The position of the base part may be set. That is, for example, when the IC 50 is arranged on the upper right side of the circuit board as shown in FIG. 9, the first tuning fork vibrator 70 is arranged in the vicinity of the lower side of the circuit board. The portion is disposed at the lower right side of the circuit board corresponding to the position of the through hole 114 in the normal cap mounting direction, and the leg portion is disposed toward the lower left direction of the circuit board. The type vibrator 72 is disposed in the vicinity of the left side of the circuit board, and is disposed on the upper left side of the circuit board corresponding to the position of the through hole 114 in the cap mounting direction in which the base portion is rotated 180 degrees. The part may be arranged so as to face the lower left direction of the circuit board.

  In the above embodiment, the case where a tuning fork type vibrator is used as the vibrator has been described. However, the present invention is not limited to this, and a vibrator other than the tuning fork type vibrator, such as a cantilever structure, is used as the vibrator. A sound piece type vibrator may be used, and the effect of the present invention is achieved.

  In the said embodiment, although demonstrated that the cap was a container-shaped thing, this invention is not limited to this. For example, a circuit board formed in a vessel shape may be covered with a flat cap.

As described above, according to the present invention, in the process of mounting the cap on the circuit board in order to protect the vibrator and the internal circuit, the explosion-proof penetration provided in the cap without aligning the direction of the cap. Since the change in characteristics of the semiconductor element on the circuit board due to the light incident from the hole can always be prevented, a highly reliable angular velocity sensor can be efficiently produced.
Note that the present invention is not limited to the above-described embodiments, and as long as the effects of the present invention are achieved, the constituent elements described in the respective embodiments are appropriately replaced, new constituent elements are added, or a part thereof It goes without saying that the constituent elements may be deleted.

1 is a schematic structural diagram of an angular velocity sensor according to an embodiment of the present invention. It is an exploded view of an angular velocity sensor according to an embodiment of the present invention. It is an electrode arrangement | positioning figure on the back surface of the circuit board of the angular velocity sensor concerning one Embodiment of this invention. 1 is a schematic structural diagram of a tuning fork vibrator of an angular velocity sensor according to an embodiment of the present invention. It is a circuit block diagram of the angular velocity sensor concerning one Embodiment of this invention. It is a figure which shows the operation state at the time of the drive of the tuning fork type vibrator of the angular velocity sensor concerning one Embodiment of this invention. It is a figure which shows the operation state at the time of angular velocity detection of the tuning fork type vibrator of the angular velocity sensor concerning one Embodiment of this invention. It is explanatory drawing of the positional relationship of the through-hole of the cap of the angular velocity sensor concerning one Embodiment of this invention, and IC on a circuit board. It is explanatory drawing of the positional relationship of the through-hole of the cap of the angular velocity sensor concerning one Embodiment of this invention, IC on a circuit board, and the base part of two tuning fork type vibrators.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Angular velocity sensor 20 Circuit board 22 Recessed part 24 IC electrode 26a, 26b, 26c 1st tuning fork type vibrator electrode 28a, 28b, 28c 2nd tuning fork type vibrator electrode 30 Chip capacitor electrode 40 External electrode 42a, 42b, 42c, 42d First tuning-fork type vibrator testing electrode 42e, 42f, 42g, 42h Second tuning-fork type vibrator testing electrode 50 IC
60 Chip Capacitor 70 First Tuning Fork Vibrator 72 Second Tuning Fork Vibrator 74 Tuning Fork Vibrator Base 76a, 76b Tuning Fork Vibrator Legs 80, 82 Piezoelectric Substrate for Tuning Fork Vibrator 84 Tuning fork vibrator intermediate electrode 86, 88, 90 Tuning fork vibrator surface electrode 92 Tuning fork vibrator full face electrode 100 Tuning fork vibrator bonding material 110 Cap 112 Cap adhesive 114 Through-hole

Claims (2)

A vibrator,
An internal circuit for driving the vibrator and detecting an angular velocity signal;
An external part for fixing a part including the semiconductor element constituting the vibrator and the internal circuit, electrically connecting each surface electrode of the vibrator and the part constituting the internal circuit, and extracting an angular velocity detection signal A substantially rectangular circuit board having electrodes and formed so as to electrically connect the output electrode of the internal circuit and the external electrode;
A cap having a substantially rectangular planar outline with different lengths of two adjacent sides, mounted on the circuit board and sealed so as to cover the vibrator fixed to the circuit board and an internal circuit, A cap having an explosion-proof through hole;
An angular velocity sensor comprising:
The semiconductor element constituting the internal circuit is disposed in the vicinity of any corner of the circuit board,
The through hole of the cap is disposed in the vicinity of one of the two corners adjacent to the corner of the cap corresponding to the corner of the circuit board on which the semiconductor element is disposed. An angular velocity sensor. Two transducers,
An internal circuit for driving the two vibrators and detecting two angular velocity signals;
The two vibrators are fixed in a direction orthogonal to each other, a part including the semiconductor element constituting the internal circuit is fixed, and each surface electrode of the two vibrators and the part constituting the internal circuit are electrically connected. And an external electrode for taking out two angular velocity detection signals, and a substantially rectangular circuit board formed to electrically connect the output electrode of the internal circuit and the external electrode;
Mounted on the circuit board and sealed so as to cover the two vibrators fixed to the circuit board and the internal circuit, having a substantially rectangular planar outline in which the lengths of two adjacent sides are different A cap having an explosion-proof through hole;
An angular velocity sensor comprising:
The semiconductor element constituting the internal circuit is disposed in the vicinity of any corner of the circuit board,
Each of the two vibrators has a base portion disposed in the vicinity of two corner portions adjacent to the corner portion of the circuit board on which the semiconductor element is disposed,
The through hole of the cap is disposed in the vicinity of one of the two corners adjacent to the corner of the cap corresponding to the corner of the circuit board on which the semiconductor element is disposed,
Even if the cap is mounted on the circuit board in any rotation direction, the base part of one of the two vibrators in which the through hole of the cap is fixed to the circuit board The angular velocity sensor is characterized in that the position of the through hole of the cap and the position of the base portion of the two vibrators on the circuit board are set so as to be always provided on the circuit board.

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