JP2010056116A - Heat sink test method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easy and sure test method of the performance of a heat sink. <P>SOLUTION: The temperature of fluid which is blown under a fixed condition by installing a blowing fan 3 to a heat sink body 2 to be tested set on a heating element 4 and flows in a cooled heat sink is defined as a first temperature, and the temperature when power is inputted to the heating element in contact with the heat sink is defined as a second temperature. When the second temperature reaches a prescribed value, an input power is blocked and the performance of the heat sink is determined by a ratio of the input power to a temperature difference between the second temperature and the first temperature. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a heat sink test method, and more particularly to a test method for measuring the heat sink performance of a heat sink.

The use of electronic information devices (eg personal computers) is becoming more and more popular, and the applications are expanding further. With the rapid development of electronic information industry technology, the calculation speed of electronic information is improved and the storage capacity is increased. Therefore, the components of electronic equipment that have been developed in response to these demands have generated high heat in accordance with their high-speed operation.

Taking the motherboard of a personal computer as an example, the amount of heat generated by the internal CPU occupies the majority, and if the increase in the heat amount of the CPU degrades the performance and the accumulated heat generation exceeds the allowable range, the computer's expectation There is a risk of unforeseen outages and even damage may occur. In order to solve the problem of electromagnetic radiation, the chassis housing is usually a structure in which the motherboard of the personal computer is sealed, and how to quickly derive the thermal energy of the CPU and other heat generating members is an important issue. It has become.

In current electronic devices, a heat sink that assists the heat sink operation is usually installed on the heat generating member to assist the heat sink operation of the heat generating member, but it is necessary to perform a heat sink performance test in the heat sink production process. In this test, the heat sink performance of the heat sink is judged to be superior or inferior. In the prior art, a heat sink performance test performed on a heat sink is performed by installing a heat sink on the heat generating member, installing a heat sink fan on one side of the heat sink, and introducing a heat sink fluid into the heat sink. The temperature that the heat sink fluid has before entering the heat sink is a first temperature, and after the heat sink fluid passes through the heat sink, that is, the amount of heat on the heat sink is taken away, the generated temperature is the second temperature, Furthermore, the heat generating member generates heat energy when power is input, and the heat energy of the heat generating member is transmitted to a heat sink installed on the heat generating unit, and at the same time, the temperature between the heat generating member and the heat sink is set to a third temperature. The heat sink performance of the heat sink in the prior art with temperature How to determine the relative merits, it has been judged by the height of the thermal resistance between the heat sink.
Since the thermal resistance value is a ratio value between the temperature change of the heat sink (third temperature-first temperature) and the heat energy generated when power is input to the heat generating member, the prior art controls the power that generates heat from the heat generating member. The heat energy generated by the heat sink is a constant value, and the heat sink performance of the heat sink is judged based on the level of the third temperature between the heat sink of the heat sink and the heat generating member. Both of the third temperature and the first temperature are determined. The fluctuation difference between the two is small and affected by the air flow of the heat sink fan or other causes, the fluctuation of the first temperature is likely to be indefinite, the fluctuation temperature is also unstable, and the heat sink function of the heat sink is judged to be superior or inferior Is difficult.
JP 2007-315906 A JP 2002-83908 A

An object of the present invention is to provide a test method for easily and reliably determining the superiority or inferiority of the heat sink performance of the heat sink.

In order to achieve the above object, the heat sink test method provided by the present invention is performed by the following steps of measuring the heat sink performance of the heat sink: the fluid is generated by at least one fluid device, and the fluid has a first temperature. And pass through the heat sink. The input power of the heat generating member is adjusted, the thermal energy generated by the previous heat generating member is transmitted to the heat sink accordingly, and a second temperature corresponding to the heat energy is generated between the heat sink and the heat generating member. The input power for adjusting the heat generating member is cut off when the second temperature of the heat energy reaches a predetermined upper limit value, and the heat sink function of the heat sink is determined based on the input power of the heat generating member.

The present invention has the following advantages.
1. Judgment of performance is accurate.
2. The judgment is not easily affected by external factors.
3. Parameters can be adjusted at any time.

The above object and the characteristics of the structure and function of the present invention will be described in detail below with reference to the drawings.

As shown in FIGS. 1 and 2, the heat sink test method of the present invention generates a fluid by at least one fluid device, and the fluid has a first temperature, passes through the heat sink 2, and performs a heat sink performance test. The fan 3 cools the heat sink 2 by introducing the heat sink fluid through the heat sink 2 through the fan 3 provided on one side of the heat sink 2. The first temperature Tin that the heat sink fluid has is generally room temperature.

The input power of the heat generating member is adjusted, the heat energy generated by the heat generating member is transmitted to the heat sink by the adjusted input power, and the heat energy having the second temperature is generated between the heat sink and the heat generating member. .

  The heat sink 2 is installed on the heat generating member 4, and the heat generating member 4 generates heat energy by the adjusted input power Qin and transmits the heat energy to the heat sink 2. A second temperature Tc is generated between the heat sinks 2.

  The input power of the heat generating member is stopped when the second temperature reaches a predetermined upper limit value, and the heat sink performance 13 of the heat sink is determined based on the input power of the heat generating member.

  The heat sink performance of the heat sink 2 is measured by increasing the second temperature Tc by increasing the thermal energy generated by the heat generating member 4 by the input power Qin of the heat generating member 4 and setting the second temperature Tc. When the temperature Tc is a predetermined upper limit, the input power Qin of the heat generating member 4 is cut off, and the superiority or inferiority of the heat sink performance of the heat sink 2 is determined by the input power Qin of the heat generating member 4.

Tcは、該第２温度値であって上記上限値を有し、Ｔｉｎは、該第１温度値であり、 一般には常温であり、Ｒｃａは、該熱抵抗値であり、Ｑｉｎは、該発熱部材の入力 電力である。 In the heat sink test method, a ratio value between the second temperature Tc and the input power Qin of the heat generating member 4 is a thermal resistance value Rca, and a calculation formula of the thermal resistance value Rca is as follows:

Tc is the second temperature value and has the above upper limit value, Tin is the first temperature value, generally room temperature, Rca is the thermal resistance value, and Qin is the heat generation This is the input power of the member.

  The input power Qin of the heat generating member 4 can be adjusted by a variable factor that generates the first temperature value of the Tin.

  In the heat sink test method of the present invention, an upper limit value is set for the second temperature Tc, and the second temperature Tc is increased by the thermal energy generated by the input power Qin of the heat generating member 4 to reach a predetermined upper limit value. The input of the input power is stopped, the heat sink performance of the heat sink 2 is determined based on the input power Qin, and the higher the input power Qin value with respect to ΔT, the better the heat sink performance.

In the present invention, preferred embodiments have been disclosed as described above. However, these are not intended to limit the present invention in any way, and anyone who is familiar with the technology can make an equivalent range without departing from the spirit and scope of the present invention. Of course, various fluctuations and moist colors can be added.

It is an Example block diagram of the heat sink test method of this invention. It is structure explanatory drawing of the heat sink test method of this invention.

Explanation of symbols

2 Heat sink 3 Fan 4 Heat generating member Tin First temperature Qin Input power Tc Second temperature Rca Thermal resistance value

Claims (4)

Set the heat sink to be tested on the heat generating member,
The reference temperature of the fluid circulating in the heat sink is the first temperature,
Adjusting the input power value to the heating member to increase the temperature between the heating member and the heat sink to a preset second temperature;
A heat sink test method, wherein the performance of the heat sink is determined by the power value.   The heat sink test method according to claim 1, wherein the second temperature of the heat energy is generated based on power adjustment of the heat generating member. In the heat sink test method, a ratio value between the second temperature and the output power of the heat generating member is a thermal resistance value, and a calculation formula for the thermal resistance value is

Tc is the second temperature value and has an upper limit value, Tin is the first temperature value and normal temperature, Rca is the thermal resistance value, and Qin is the output of the heating member. The heat sink test method according to claim 1, which is electric power.   4. The heat sink test method according to claim 2, wherein the input power to the heat generating member is adjusted according to a variation factor such as a total air volume and an outside air temperature at the first Tin temperature value. 5.

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