JP2010040929A - Electronic equipment and flexible printed circuit board - Google Patents

Electronic equipment and flexible printed circuit board Download PDF

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JP2010040929A
JP2010040929A JP2008204472A JP2008204472A JP2010040929A JP 2010040929 A JP2010040929 A JP 2010040929A JP 2008204472 A JP2008204472 A JP 2008204472A JP 2008204472 A JP2008204472 A JP 2008204472A JP 2010040929 A JP2010040929 A JP 2010040929A
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wiring portion
flexible printed
width direction
divided
wiring
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Yutaka Okazaki
裕 岡崎
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Fujikura Ltd
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Fujikura Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board that is manufactured at low cost and enhanced in bending resistance characteristics (slide resistance characteristics). <P>SOLUTION: A flat wiring portion S2 is formed to be freely bent on the whole. Slits (cutting lines) 27 which extend in a length direction L are formed at positions where the flexible printed circuit board 20 is divided into, for example, three in a width direction W. With the slits 27, the flat wiring portion S2 has a plurality of divided wiring portions S21, S22 and S23 each divided into a prescribed number of conductive layers 22, among many conductive layers 22. Further, the flat wiring portion S2 comprises: an inclined wiring portion D1 extending having its width direction w1 inclined at a prescribed angle θ1 to a width direction w2 of connector portions S1; and twist portions D2 connecting the inclined wiring portion D1 and connector portions S1 at both ends of the inclined wiring portion D1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、回路を有する複数の筐体が相対移動可能に取り付けられ、これらの筐体内の回路どうしをフレキシブルプリント配線板によって電気的に接続してなる電子機器、および該電子機器の筐体間配線に用いるフレキシブルプリント配線板に関する。   The present invention relates to an electronic device in which a plurality of housings having circuits are attached so as to be relatively movable, and circuits in these housings are electrically connected by a flexible printed wiring board, and between the housings of the electronic devices. The present invention relates to a flexible printed wiring board used for wiring.

近年、携帯電話に代表される電子機器の小型・軽量化、多機能化が急速に進展している。こうした携帯電話の内部配線材としてフレキシブルプリント配線板(以下、FPCと称する)が用いられている。   In recent years, electronic devices typified by mobile phones have been rapidly reduced in size, weight and functionality. A flexible printed wiring board (hereinafter referred to as FPC) is used as an internal wiring material of such a mobile phone.

携帯電話は、通話時の利便性と不使用時(待受時)の携帯性とを両立させるため、例えば、表示画面を備えた第一の筐体と、操作ボタンを備えた第二の筐体から構成し、これら2つの筐体を互いに屈曲、回転、スライドなどが可能なように係合させたものが主流である。そして、こうした複数の筐体間を電気的に接続(配線)するために、フレキシブルプリント配線板が好適に用いられている。   In order to achieve both convenience during a call and portability when not in use (standby), for example, a mobile phone has, for example, a first case with a display screen and a second case with an operation button. The mainstream is composed of a body and these two casings are engaged so that they can be bent, rotated, slid, and the like. And in order to electrically connect (wiring) between these some housing | casings, the flexible printed wiring board is used suitably.

こうした携帯電話のうち、最近、2つの筐体を互いに平行にスライドさせるタイプの携帯電話が利用されつつある。スライドタイプの携帯電話では、スライド前後で筐体の全長が大きく変化するため、2つの筐体間を配線する際には、筐体の厚み方向にフレキシブルプリント配線板をほぼ180°近くU字型に屈曲させて収容し、スライド前後での筐体の全長変化に対応する余長を確保している。   Among such mobile phones, recently, a mobile phone of a type in which two casings slide in parallel with each other is being used. In a slide-type mobile phone, the overall length of the housing changes greatly before and after the slide, so when wiring between two housings, the flexible printed wiring board is nearly U-shaped in the thickness direction of the housing. It is bent and accommodated, and an extra length corresponding to the change in the overall length of the housing before and after the slide is secured.

しかしながら、フレキシブルプリント配線板を筐体の厚み方向にほぼ180°近くU字型に屈曲させて、筐体のスライド操作のたびに屈曲部分の移動(摺動)を繰り返すと、例えば銅箔などから形成されたフレキシブルプリント配線板の導電層が疲労によって破断、あるいは剥離し、導通不良を引き起こす懸念があった。特に、近年の携帯電話の薄型化の進行により、フレキシブルプリント配線板の屈曲部分の曲げ半径がますます小さくなり、フレキシブルプリント配線板に過大な曲げ応力が集中することが懸念されていた。   However, if the flexible printed wiring board is bent in a U-shape nearly 180 ° in the thickness direction of the housing and the movement (sliding) of the bent portion is repeated each time the housing is slid, for example from copper foil There was a concern that the conductive layer of the formed flexible printed wiring board was broken or peeled off due to fatigue, resulting in poor conduction. In particular, with the progress of thinning of cellular phones in recent years, there has been a concern that the bending radius of the bent portion of the flexible printed wiring board becomes smaller and excessive bending stress is concentrated on the flexible printed wiring board.

こうしたフレキシブルプリント配線板の耐屈曲特性(耐摺動特性)を向上させるために、例えば、特許文献1には、導電層を特定の結晶構造を持つ銅箔によって形成したフレキシブルプリント配線板が記載されている。
また、例えば、特許文献2には、導電層を高純度銅箔によって形成したフレキシブルプリント配線板が記載されている。
特開2000−151052号公報 特開2001−168480号公報
In order to improve the bending resistance (sliding resistance) of such a flexible printed wiring board, for example, Patent Document 1 describes a flexible printed wiring board in which a conductive layer is formed of a copper foil having a specific crystal structure. ing.
For example, Patent Document 2 describes a flexible printed wiring board in which a conductive layer is formed of a high-purity copper foil.
JP 2000-151052 A JP 2001-168480 A

しかしながら、上述した特許文献1や特許文献2に記載されたフレキシブルプリント配線板は、いずれも、導電層を特定の結晶構造を持つ銅箔や高純度銅箔などを用いるため、導電層の形成材料が高価であり、また、フレキシブル基板上に導電層を形成するにあたって特殊な成膜工程が必要となるなど、製造コストが増加するという課題があった。   However, the flexible printed wiring boards described in Patent Document 1 and Patent Document 2 described above all use a copper foil having a specific crystal structure, a high-purity copper foil, or the like as the conductive layer. However, there is a problem that the manufacturing cost increases because a special film forming process is required for forming the conductive layer on the flexible substrate.

本発明は、上記事情に鑑みてなされたもので、互いに移動可能に係合された複数の筐体を、摺動、屈曲、回転などの操作を繰り返しても、フレキシブルプリント配線板の導通不良を引き起こすことがない電子機器を提供することを目的とする。   The present invention has been made in view of the above circumstances, and even if a plurality of cases that are movably engaged with each other are repeatedly operated such as sliding, bending, and rotating, the continuity failure of the flexible printed wiring board is prevented. It is an object to provide an electronic device that does not cause a problem.

また、本発明は、ローコストに製造可能であり、かつ耐屈曲特性(耐摺動特性)を高めたフレキシブルプリント配線板を提供することを目的とする。   Another object of the present invention is to provide a flexible printed wiring board that can be manufactured at low cost and has improved bending resistance (sliding resistance).

本発明の請求項1に記載の電子機器は、回路を有する複数の筐体が相対移動可能に係合され、これら筐体の回路どうしをフレキシブルプリント配線板で電気的に接続してなる電子機器であって、前記フレキシブルプリント配線板は、所定の幅と長さをもつ帯状の屈曲自在なフレキシブル基板、および該フレキシブル基板の長さ方向に沿って細長く延び、かつ幅方向に沿って互いに所定の間隔を空けて並列させた多数本の導電層を少なくとも備えたフラット配線部と、該フラット配線部の両端にそれぞれ形成され、前記回路と電気的に接続される平板状のコネクタ部とからなり、前記フラット配線部は、前記フレキシブル基板の長さ方向に沿って前記フレキシブル基板に形成したスリットによって、前記多数本の導電層のうち所定の本数の導電層ごとに分割した、複数の分割配線部からなり、前記分割配線部は、その幅方向が前記コネクタ部の幅方向に対して所定の角度で傾斜して延びる傾斜配線部と、該傾斜配線部の両端でこの傾斜配線部と前記コネクタ部とを繋ぐ捻り部とからなることを特徴とする。
本発明の請求項2に記載の電子機器は、請求項1において、前記傾斜配線部は、その幅方向が前記コネクタ部の幅方向に対して略直角を成すことを特徴とする。
本発明の請求項3に記載の電子機器は、請求項1または2において、複数の前記傾斜配線部を束ねて厚み方向に積層させる結束手段を更に備えたことを特徴とする。
本発明の請求項4に記載の電子機器は、請求項1ないし3いずれか1項において、前記傾斜配線部を前記筐体の移動面に沿って屈曲させて配置したことを特徴とする。
本発明の請求項5に記載の電子機器は、請求項4において、前記傾斜配線部を前記筐体の移動面に沿ってU字型を成すように屈曲させて配置したことを特徴とする。
本発明の請求項6に記載の電子機器は、請求項1ないし5いずれか1項において、前記複数の筐体は、第1の筐体と、該第1の筐体に対してスライド可能に取り付けられた第2の筐体とからなることを特徴とする。
本発明の請求項7に記載のフレキシブルプリント配線板は、所定の幅と長さをもつ帯状の屈曲自在なフレキシブル基板、および該フレキシブル基板の長さ方向に沿って細長く延び、かつ幅方向に沿って互いに所定の間隔を空けて並列させた多数本の導電層を少なくとも備えたフラット配線部と、該フラット配線部の両端にそれぞれ形成された平板状のコネクタ部とを少なくとも備えたフレキシブルプリント配線板であって、前記フラット配線部は、前記フレキシブル基板の長さ方向に沿って前記フレキシブル基板に形成したスリットによって、前記多数本の導電層のうち所定の本数の導電層ごとに分割した、複数の分割配線部からなり、前記分割配線部は、その幅方向が前記コネクタ部の幅方向に対して所定の角度で傾斜して延びる傾斜配線部と、該傾斜配線部の両端でこの傾斜配線部と前記コネクタ部とを繋ぐ捻り部とからなることを特徴とする。
The electronic device according to claim 1 of the present invention is an electronic device in which a plurality of housings having circuits are engaged so as to be relatively movable, and the circuits of these housings are electrically connected by a flexible printed wiring board. The flexible printed wiring board includes a strip-like flexible flexible board having a predetermined width and length, and elongates along the length direction of the flexible board, and has a predetermined width with each other along the width direction. A flat wiring part having at least a large number of conductive layers arranged in parallel at intervals, and formed at both ends of the flat wiring part, each comprising a flat connector part electrically connected to the circuit, The flat wiring portion has a predetermined number of conductive layers among the plurality of conductive layers by slits formed in the flexible substrate along a length direction of the flexible substrate. Each of the divided wiring portions, and each of the divided wiring portions includes a slanted wiring portion that extends at a predetermined angle with respect to a width direction of the connector portion; It consists of the twist part which connects this inclination wiring part and the said connector part at both ends, It is characterized by the above-mentioned.
The electronic device according to a second aspect of the present invention is the electronic device according to the first aspect, wherein the inclined wiring portion has a width direction substantially perpendicular to a width direction of the connector portion.
An electronic apparatus according to a third aspect of the present invention is characterized in that in the first or second aspect, the electronic apparatus further includes a bundling means for bundling the plurality of inclined wiring portions and stacking them in the thickness direction.
According to a fourth aspect of the present invention, in the electronic device according to any one of the first to third aspects, the inclined wiring portion is bent along the moving surface of the casing.
According to a fifth aspect of the present invention, in the electronic device according to the fourth aspect, the inclined wiring portion is arranged so as to be bent in a U shape along the moving surface of the casing.
The electronic device according to a sixth aspect of the present invention is the electronic device according to any one of the first to fifth aspects, wherein the plurality of housings are slidable with respect to the first housing and the first housing. It consists of the attached 2nd housing | casing, It is characterized by the above-mentioned.
The flexible printed wiring board according to claim 7 of the present invention is a strip-like flexible flexible board having a predetermined width and length, elongates along the length direction of the flexible board, and extends along the width direction. A flexible printed wiring board comprising at least a flat wiring portion having at least a plurality of conductive layers arranged in parallel with each other at a predetermined interval, and flat connector portions formed at both ends of the flat wiring portion, respectively. The flat wiring portion is divided into a predetermined number of conductive layers among the multiple conductive layers by a slit formed in the flexible substrate along a length direction of the flexible substrate. Inclined wiring comprising a divided wiring portion, the divided wiring portion extending at a predetermined angle with respect to the width direction of the connector portion. When, characterized in that comprising a twist section connecting the this inclined wiring portion at both ends of the inclined wire portion the connector portion.

本発明のフレキシブルプリント配線板によればコネクタ部の幅方向に対して、例えば直角に捻られた分割配線部を、電子機器の移動面に沿ってU字型に屈曲させる、即ち、分割配線部の幅方向を電子機器の厚み方向と合致するように屈曲させて配線する事が可能になる。   According to the flexible printed wiring board of the present invention, the divided wiring portion twisted at, for example, a right angle with respect to the width direction of the connector portion is bent in a U shape along the moving surface of the electronic device, that is, the divided wiring portion. Therefore, it is possible to perform wiring by bending the width direction so that the width direction matches the thickness direction of the electronic device.

また、本発明の電子機器によれば、分割配線部の幅方向を電子機器の厚み方向と合致するように屈曲させることによって、フレキシブルプリント配線板を最小屈曲半径を電子機器の幅方向いっぱいに広げて配線することができる。   According to the electronic device of the present invention, the flexible printed wiring board is expanded to the full width direction of the electronic device by bending the width direction of the divided wiring portion so as to match the thickness direction of the electronic device. Can be wired.

これにより、電子機器の薄型化が進んだとしても、電子機器の厚みよりも寸法が相当に広い幅方向に沿ってフレキシブルプリント配線板屈曲させることができるので、反復屈曲による導電層の破断、断線を確実に防止できる。長期間に渡ってフレキシブルプリント配線板の良好な導電性を維持することが可能になる。   As a result, even if the electronic device is made thinner, the flexible printed wiring board can be bent along the width direction that is considerably wider than the thickness of the electronic device. Can be reliably prevented. It becomes possible to maintain good conductivity of the flexible printed wiring board over a long period of time.

さらに、フレキシブルプリント配線板を用いた本発明の電子機器は、薄型化に際してフレキシブルプリント配線板の最小屈曲半径を考慮する必要が無い、即ち、フレキシブルプリント配線板の最小屈曲半径は電子機器の幅方向に依存するので、電子機器のより一層の薄型化に寄与する。   Furthermore, the electronic device of the present invention using the flexible printed wiring board does not need to consider the minimum bending radius of the flexible printed wiring board when thinning, that is, the minimum bending radius of the flexible printed wiring board is the width direction of the electronic device. Therefore, it contributes to further thinning of electronic devices.

以下、本発明に係るフレキシブルプリント配線板の一実施形態を図面に基づいて説明する。なお、本発明はこのような実施形態に限定されるものではない。また、以下の説明で用いる図面は、本発明の特徴をわかりやすくするために、便宜上、要部となる部分を拡大して示している場合があり、各構成要素の寸法比率などが実際と同じであるとは限らない。   Hereinafter, an embodiment of a flexible printed wiring board according to the present invention will be described with reference to the drawings. Note that the present invention is not limited to such an embodiment. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there is a case where a main part is shown in an enlarged manner for convenience, and the dimensional ratio of each component is the same as the actual one. Not necessarily.

図1は、例えば携帯電話(電子機器)の配線に用いられる、本発明のフレキシブルプリント配線板を示す外観斜視図である。また、図2は、フレキシブルプリント配線板を俯瞰した平面図であり、図3は、フレキシブルプリント配線板の層構成を示す断面図である。なお、図2はフレキシブルプリント配線板の幅方向を拡大しており、図3は厚み方向を拡大して示している。   FIG. 1 is an external perspective view showing a flexible printed wiring board of the present invention used for wiring of, for example, a mobile phone (electronic device). FIG. 2 is a plan view of the flexible printed wiring board, and FIG. 3 is a cross-sectional view showing the layer structure of the flexible printed wiring board. 2 shows an enlarged width direction of the flexible printed wiring board, and FIG. 3 shows an enlarged thickness direction.

本発明のフレキシブルプリント配線板20は、例えば、絶縁性の柔軟な(屈曲自在な)樹脂フィルム等からなるフレキシブル基板21と、このフレキシブル基板21の一面に形成された、多数の細長い導電層22,22…とを備えている。フレキシブル基板21は、所定の幅と長さをもつ薄い帯状(リボン状)に形成されていれば良い。なお、本発明でいう幅方向Wとは、この帯状のフレキシブル基板21、ないしフレキシブルプリント配線板20の短辺方向を表すものとし、同様に長さ方向Lとは、長辺方向を表すものとする。   The flexible printed wiring board 20 of the present invention includes, for example, a flexible substrate 21 made of an insulating flexible (flexible) resin film and the like, and a number of elongated conductive layers 22 formed on one surface of the flexible substrate 21. 22... The flexible substrate 21 may be formed in a thin strip shape (ribbon shape) having a predetermined width and length. In the present invention, the width direction W represents the short side direction of the strip-shaped flexible substrate 21 or the flexible printed wiring board 20, and the length direction L similarly represents the long side direction. To do.

導電層22,22…は、それぞれがフレキシブル基板21の一面に、長さ方向Lに沿って細長く延びるように形成されている。こうした導電層22,22…は、幅方向Wに沿って互いに所定の間隔を空けて多数本、並列して形成されている。導電層22,22…は、導電性に優れた金属、例えば、銅薄膜、銀薄膜、アルミニウム薄膜などから構成されていればよい。   The conductive layers 22, 22... Are formed on one surface of the flexible substrate 21 so as to be elongated along the length direction L. The conductive layers 22, 22... Are formed in parallel along the width direction W at a predetermined interval from each other. The conductive layers 22, 22... Only need to be made of a metal having excellent conductivity, for example, a copper thin film, a silver thin film, an aluminum thin film, or the like.

図3に示すように、一面に導電層22が形成されたフレキシブル基板21を厚み方向T1で挟むように絶縁性の保護層23,24が形成されている。また、この保護層23に重ねて電磁遮蔽用の磁気シールド層25を更に形成するのが好ましい。   As shown in FIG. 3, insulating protective layers 23 and 24 are formed so as to sandwich the flexible substrate 21 having the conductive layer 22 formed on one surface in the thickness direction T1. Further, it is preferable to further form a magnetic shield layer 25 for electromagnetic shielding so as to overlap with the protective layer 23.

図1、図2に示すように、フレキシブルプリント配線板20は、その長さ方向Lにおいて、フラット配線部S2と、このフラット配線部S2の両端にそれぞれ形成されたコネクタ部S1とからなる。このうち、コネクタ部S1は、保護層23および磁気シールド層25を形成せずに導電層22,22…を露呈させた領域(部分)であり、このコネクタ部S1においては、保護層24に重ねて、更に補強層26が形成されているのが好ましい(図3参照)。   As shown in FIGS. 1 and 2, the flexible printed wiring board 20 includes a flat wiring portion S2 and connector portions S1 formed at both ends of the flat wiring portion S2 in the length direction L thereof. Among these, the connector part S1 is a region (part) where the conductive layers 22, 22... Are exposed without forming the protective layer 23 and the magnetic shield layer 25. In this connector part S1, the protective layer 24 is overlaid. In addition, a reinforcing layer 26 is preferably formed (see FIG. 3).

こうしたコネクタ部S1は、例えば、携帯電話(電子機器)の第一の回路と第二の回路との間の電気的な接続に用いる。このコネクタ部S1においては、露呈した導電層22,22…の周面を覆うように、更に、金メッキや銀メッキが施されているのが好ましい。   Such connector part S1 is used for the electrical connection between the 1st circuit of a mobile telephone (electronic device) and a 2nd circuit, for example. In the connector portion S1, it is preferable that gold plating or silver plating is further applied so as to cover the peripheral surfaces of the exposed conductive layers 22, 22.

フラット配線部S2は、全体が屈曲自在に形成されている。そして、フレキシブルプリント配線板20の幅方向Wを例えば3分割する2つの位置において、長さ方向Lに延びるスリット(切込み線)27が形成されている。このスリット27は、フレキシブルプリント配線板20のフラット配線部S2において、磁気シールド層25から保護層24までを貫いて切断されている。   The flat wiring portion S2 is formed to be freely bent as a whole. And the slit (cut line) 27 extended in the length direction L is formed in two positions which divide the width direction W of the flexible printed wiring board 20 into 3 for example. The slit 27 is cut through the magnetic shield layer 25 to the protective layer 24 in the flat wiring portion S <b> 2 of the flexible printed wiring board 20.

このようなスリット27によって、フラット配線部S2は、多数本の導電層22,22…のうち所定の本数の導電層22,22…ごとに分割した、複数の分割配線部S21,S22,S23が形成される。2本のスリット27によって区画された分割配線部S21,S22,S23は、それぞれ隣接する分割配線部に対して一定の範囲で揺動可能となる。   By such a slit 27, the flat wiring portion S2 is divided into a plurality of divided wiring portions S21, S22, S23 divided into a predetermined number of conductive layers 22, 22,. It is formed. The divided wiring portions S21, S22, S23 partitioned by the two slits 27 can swing within a certain range with respect to the adjacent divided wiring portions.

さらに、フラット配線部S2は、その幅方向w1がコネクタ部S1の幅方向w2に対して所定の角度θ1で傾斜して延びる傾斜配線部D1と、この傾斜配線部D1の両端でこの傾斜配線部D1とコネクタ部S1とを繋ぐ捻り部D2とからなる。傾斜配線部D1の幅方向w1と、コネクタ部S1の幅方向w2との成す角度θ1は、例えば略直角(約90°)であればよい。   Further, the flat wiring portion S2 has an inclined wiring portion D1 whose width direction w1 extends at a predetermined angle θ1 with respect to the width direction w2 of the connector portion S1, and the inclined wiring portion at both ends of the inclined wiring portion D1. It consists of the twist part D2 which connects D1 and connector part S1. An angle θ1 formed by the width direction w1 of the inclined wiring portion D1 and the width direction w2 of the connector portion S1 may be, for example, substantially a right angle (about 90 °).

また、分割配線部S21,S22,S23のそれぞれの捻り部D2は、コネクタ部S1と傾斜配線部D1との間で幅方向が約90°回転する(幅方向を水平から垂直にする)までフラット配線部S2を捻って形成した部位である。   Further, each twisted portion D2 of the divided wiring portions S21, S22, S23 is flat until the width direction rotates about 90 ° between the connector portion S1 and the inclined wiring portion D1 (the width direction is changed from horizontal to vertical). This is a portion formed by twisting the wiring portion S2.

このような構成のフレキシブルプリント配線板10は、コネクタ部S1の幅方向w2に対して、フラット配線部S2の傾斜配線部D1は、その幅方向が角度θ1、例えば直角を成して長さ方向Lに延びる形状であるため、例えば、スライド式の携帯電話において、2つの筐体の移動面に沿ってこの傾斜配線部D1をU字型に屈曲させる、即ち、傾斜配線部D1の幅方向w1を携帯電話の厚み方向と合致するように屈曲させて配線する事が可能になる。なお、こうした分割配線部と傾斜配線部を備えたフレキシブルプリント配線板を電子機器(携帯電話)に用いた際の作用は後ほど述べる。   In the flexible printed wiring board 10 having such a configuration, the width direction of the inclined wiring portion D1 of the flat wiring portion S2 forms an angle θ1, for example, a right angle with respect to the width direction w2 of the connector portion S1. Since the shape extends to L, for example, in a sliding mobile phone, the inclined wiring portion D1 is bent into a U shape along the moving surfaces of the two housings, that is, the width direction w1 of the inclined wiring portion D1. Can be bent and wired so as to match the thickness direction of the mobile phone. In addition, the effect | action at the time of using a flexible printed wiring board provided with such a division | segmentation wiring part and an inclination wiring part for an electronic device (cellular phone) is described later.

図4は、電子機器の配線に用いられる、本発明のフレキシブルプリント配線板の別な実施形態を示す外観斜視図である。また、図5は、図4のフレキシブルプリント配線板を俯瞰した平面図である。なお、この図5はフレキシブルプリント配線板の幅方向を拡大して表示している。
この実施形態におけるフレキシブルプリント配線板40は、長さ方向Lにおいて、フラット配線部S4と、このフラット配線部S4の両端にそれぞれ形成されたコネクタ部S3とからなり、コネクタ部S3では、導電層42,42…が露呈される。
FIG. 4 is an external perspective view showing another embodiment of the flexible printed wiring board of the present invention used for wiring of an electronic device. FIG. 5 is a plan view of the flexible printed wiring board shown in FIG. In FIG. 5, the width direction of the flexible printed wiring board is enlarged and displayed.
The flexible printed wiring board 40 in this embodiment includes, in the length direction L, a flat wiring portion S4 and connector portions S3 formed at both ends of the flat wiring portion S4. In the connector portion S3, the conductive layer 42 is provided. , 42... Are exposed.

フラット配線部S4は、フレキシブルプリント配線板40の幅方向Wを、例えば3分割する2つの位置において、長さ方向Lに延びるスリット(切込み線)47が形成され、このスリット47によって、フレキシブルプリント配線板40のフラット配線部S4は、多数本の導電層42,42…のうち所定の本数の導電層42,42…ごとに分割した、複数の分割配線部S41,S42,S43が形成される。   In the flat wiring portion S4, slits (cut lines) 47 extending in the length direction L are formed at, for example, two positions that divide the width direction W of the flexible printed wiring board 40 into three parts. The flat wiring portion S4 of the plate 40 is formed with a plurality of divided wiring portions S41, S42, S43 divided into a predetermined number of conductive layers 42, 42... Among a plurality of conductive layers 42, 42.

さらに、フラット配線部S5は、その幅方向w3がコネクタ部S3の幅方向w4に対して所定の角度θ2で傾斜して延びる傾斜配線部D3と、この傾斜配線部D3の両端でこの傾斜配線部D3とコネクタ部S3とを繋ぐ捻り部D4とからなる。傾斜配線部D3の幅方向w3と、コネクタ部S3の幅方向w4との成す角度θ2は、例えば略直角(約90°)であればよい。   Further, the flat wiring portion S5 has an inclined wiring portion D3 whose width direction w3 extends at an angle θ2 with respect to the width direction w4 of the connector portion S3, and the inclined wiring portion at both ends of the inclined wiring portion D3. It consists of the twist part D4 which connects D3 and connector part S3. The angle θ2 formed by the width direction w3 of the inclined wiring portion D3 and the width direction w4 of the connector portion S3 may be substantially a right angle (about 90 °), for example.

また、分割配線部S41,S42,S43のそれぞれの捻り部D4は、コネクタ部S3と傾斜配線部D3との間で幅方向が90°回転する(幅方向を水平から垂直にする)までフラット配線部S4を捻って形成した部位である。   Further, each twisted portion D4 of the divided wiring portions S41, S42, and S43 is a flat wiring until the width direction is rotated by 90 ° between the connector portion S3 and the inclined wiring portion D3 (the width direction is changed from horizontal to vertical). This is a part formed by twisting the part S4.

そして、このフレキシブルプリント配線板40には、分割配線部S41,S42,S43を束ねて、厚み方向T2に沿って積層させる結束手段49が形成されている。こうした結束手段49によって、分割配線部S41,S42,S43が一体とされ、断面矩形の極めてコンパクトな外形形状の結束配線部48が形成される。結束手段49は、例えば、絶縁性の硬質樹脂部材、あるいはゴムなどの軟質樹脂部材によって、分割配線部S41,S42,S43を纏めて係合させるものであればよい。   The flexible printed wiring board 40 is formed with a binding means 49 that bundles the divided wiring portions S41, S42, and S43 and stacks them along the thickness direction T2. By such a binding means 49, the divided wiring portions S41, S42, and S43 are integrated to form a binding wiring portion 48 having an extremely compact outer shape having a rectangular cross section. The bundling means 49 may be any means that collectively engages the divided wiring portions S41, S42, and S43 with, for example, an insulating hard resin member or a soft resin member such as rubber.

また、こうした結束手段49は、本実施形態では、分割配線部S41,S42,S43の両端付近に形成しているが、分割配線部S41,S42,S43の長さに応じて、分割配線部S41,S42,S43がそれぞれ個別に揺動、分離しない程度に、適切な数だけ形成されていればよい。   Further, in the present embodiment, such binding means 49 is formed near both ends of the divided wiring portions S41, S42, and S43, but depending on the length of the divided wiring portions S41, S42, and S43, the divided wiring portion S41. , S42, and S43 need only be formed in an appropriate number so that they do not individually swing and separate.

次に、図4、5に示したフレキシブルプリント配線板を備えた、本発明の電子機器の一実施形態について説明する。図6(a)は、本発明の電子機器の一例であるスライドタイプの携帯電話の携帯時(待受時)の状態を示す外観斜視図であり、図6(b)は、その通話時(操作時)の状態を示す外観斜視図である。
携帯電話(電子機器)10は、第一の筐体11と、第二の筐体12とをからなる。この第一の筐体11と、第二の筐体12とは、互いに重ねて配され、第二の筐体12は、第一の筐体11の移動面11aに沿って所定の範囲でスライド(摺動)可能に、第一の筐体11と係合されている。
Next, an embodiment of the electronic apparatus of the present invention provided with the flexible printed wiring board shown in FIGS. FIG. 6A is an external perspective view showing the state of the slide type mobile phone as an example of the electronic apparatus of the present invention when it is carried (standby), and FIG. It is an external appearance perspective view which shows the state of time.
The mobile phone (electronic device) 10 includes a first housing 11 and a second housing 12. The first casing 11 and the second casing 12 are arranged so as to overlap each other, and the second casing 12 slides within a predetermined range along the moving surface 11a of the first casing 11. It is engaged with the first casing 11 so as to be capable of sliding.

第一の筐体11には、例えば、操作ボタン13が配されている。また、第二の筐体12には、例えば、液晶ディスプレイ(LCD)14が配されている。こうした携帯電話10は、携帯時(待受時)には、その外形を小さくして携帯性を高めるために、第一の筐体11と第二の筐体12の外形が合致する位置にスライドされ、操作ボタン13が隠蔽される(図6(a)参照)。また、通話時(操作時)には、操作ボタン13が露呈される位置まで第二の筐体12を第一の筐体11に対してスライドさせる(図6(b)参照)。   For example, an operation button 13 is arranged on the first housing 11. In addition, for example, a liquid crystal display (LCD) 14 is disposed in the second housing 12. When the mobile phone 10 is carried (standby), the mobile phone 10 is slid to a position where the outer shapes of the first housing 11 and the second housing 12 match in order to reduce the outer shape and improve the portability. Then, the operation button 13 is concealed (see FIG. 6A). Further, during a call (during operation), the second casing 12 is slid relative to the first casing 11 until the operation button 13 is exposed (see FIG. 6B).

図7は、図6に示す携帯電話のフレキシブルプリント配線板による配線の様子を示す説明図である。スライドタイプの携帯電話10の第一の筐体11に形成された第一の回路63と、第二の筐体12に形成された第二の回路64は、それぞれのコネクタの形成位置が、携帯電話10の幅方向WBにおいてズレた位置、即ち一直線上に並ばない位置に形成されている。   FIG. 7 is an explanatory diagram showing a state of wiring by the flexible printed wiring board of the mobile phone shown in FIG. In the first circuit 63 formed in the first casing 11 of the slide type mobile phone 10 and the second circuit 64 formed in the second casing 12, each connector is formed at the position where the mobile phone is formed. It is formed at a position shifted in 10 width directions WB, that is, a position not aligned on a straight line.

そして、これら第一の回路63と第二の回路64との間を配線するフレキシブルプリント配線板40は、コネクタ部S3の幅方向w4に対して、その幅方向が例えば直角に捻られた結束配線部48を、携帯電話10の移動面10aに沿ってU字型に屈曲させる、即ち、結束配線部48の幅方向を携帯電話の厚み方向と合致するように屈曲させて配線する事が可能になる。   The flexible printed wiring board 40 for wiring between the first circuit 63 and the second circuit 64 is a bundled wiring in which the width direction is twisted, for example, at a right angle with respect to the width direction w4 of the connector portion S3. The portion 48 can be bent in a U-shape along the moving surface 10a of the mobile phone 10, that is, the wiring direction can be bent so that the width direction of the binding wiring portion 48 matches the thickness direction of the mobile phone. Become.

このように、結束配線部48の幅方向を携帯電話の厚み方向と合致するように屈曲させることによって、フレキシブルプリント配線板40を最小屈曲半径rを携帯電話10の幅方向WBいっぱいに広げて配線することができる。   As described above, the flexible printed wiring board 40 is bent so that the minimum bending radius r is expanded to the full width direction WB of the mobile phone 10 by bending the width direction of the binding wiring portion 48 so as to match the thickness direction of the mobile phone. can do.

従来のスライドタイプの携帯電話の配線に用いるフレキシブルプリント配線板は、携帯電話の厚み方向に沿ってU字型に屈曲させていたため、最小屈曲半径を携帯電話の厚みの半分以下にする必要があった。しかし、本発明のフレキシブルプリント配線板40を用いる事によって、携帯電話の薄型化が進んだとしても、携帯電話の厚みよりも寸法が相当に広い幅方向WBに沿って屈曲させることができるので、反復屈曲による導電層42,42…の破断、断線を確実に防止できる。長期間に渡ってフレキシブルプリント配線板40の良好な導電性を維持することが可能になる。   Since the flexible printed wiring board used for wiring of the conventional slide type mobile phone is bent in a U shape along the thickness direction of the mobile phone, the minimum bending radius has to be less than half of the thickness of the mobile phone. . However, by using the flexible printed wiring board 40 of the present invention, even if the mobile phone is made thinner, it can be bent along the width direction WB which is considerably wider than the thickness of the mobile phone. Breakage and disconnection of the conductive layers 42, 42... Due to repeated bending can be reliably prevented. It becomes possible to maintain good conductivity of the flexible printed wiring board 40 over a long period of time.

さらに、フレキシブルプリント配線板40を用いた本発明の電子機器(携帯電話)は、薄型化に際してフレキシブルプリント配線板40の最小屈曲半径を考慮する必要が無い、即ち、本発明のフレキシブルプリント配線板40の最小屈曲半径は携帯電話10の幅方向WBに依存するので、携帯電話(電子機器)10のより一層の薄型化に寄与する。   Furthermore, in the electronic device (mobile phone) of the present invention using the flexible printed wiring board 40, it is not necessary to consider the minimum bending radius of the flexible printed wiring board 40 when thinning, that is, the flexible printed wiring board 40 of the present invention. Since the minimum bending radius depends on the width direction WB of the mobile phone 10, it contributes to further thinning of the mobile phone (electronic device) 10.

なお、上述した実施形態では、電子機器として携帯電話を例示したが、もちろん、これ以外にも、各種情報端末や携帯電子機器などにも適用できる。また、筐体は2つである必要はなく、3つ以上の筐体からなる電子機器の配線にも、本発明のフレキシブルプリント配線板を適用することができる。複数の筐体どうしの係合形態も、上述した実施形態のようにスライド可能な係合以外にも、回転、屈曲あるいはこれらの組み合わせによる係合形態であってもよい。   In the above-described embodiment, the mobile phone is exemplified as the electronic device, but it is needless to say that the present invention can be applied to various information terminals, portable electronic devices, and the like. Further, the number of housings is not necessarily two, and the flexible printed wiring board of the present invention can be applied to the wiring of an electronic device composed of three or more housings. In addition to the slidable engagement as in the above-described embodiment, the engagement form of the plurality of housings may be an engagement form by rotation, bending, or a combination thereof.

フレキシブルプリント配線板のフラット配線部は、上述した実施形態のように、2本のスリットによって3つの分割配線部に区画されたものに限定される事はなく、1本のスリットによって2つの分割配線部に区画することや、3本以上のスリットを形成して4つ以上の分割配線部に区画したものであってもよい。   The flat wiring part of the flexible printed wiring board is not limited to one divided into three divided wiring parts by two slits as in the above-described embodiment, and two divided wirings by one slit. It may be divided into four or more divided wiring parts by forming three or more slits.

本発明の効果を検証した実施例を以下に示す。本発明例として図4、図5に示すような、フラット配線部に設けた2本のスリットによって3つの分割配線部を形成し、更にこの3つの分割配線部を結束手段によって結束した結束配線部を有するフレキシブルプリント配線板を本発明例とした。また、比較例として、こうしたスリットを設けずに均一な幅で延びる従来のフレキシブルプリント配線板を比較例とした。   Examples in which the effects of the present invention are verified will be described below. As an example of the present invention, as shown in FIGS. 4 and 5, a bundled wiring portion in which three divided wiring portions are formed by two slits provided in the flat wiring portion, and these three divided wiring portions are further bound by a binding means. The flexible printed wiring board which has this was made into the example of this invention. Further, as a comparative example, a conventional flexible printed wiring board extending with a uniform width without providing such a slit was used as a comparative example.

本発明例と比較例との共通の仕様は以下の通りである。
1.導電層の形成ピッチ:0.3mm、
2.導電層の並列数:12本(本発明では、これを4本ごとにスリットを形成し、4本の導電層をもつ分割配線部を3つ形成)
3.配線版の全長:100mm
4.コネクタ部の長さ:3mm
5.コネクタ部の補強板長さ:5mm
6.各導電層の幅:0.2mm
7.各導電層の厚み:0.018mm
8.フレキシブル基板:ポリイミドフィルム(厚み13nm)+接着剤
9.保護層:ポリイミドフィルム(厚み13nm)+接着剤
10.磁気シールド層:銀ペースト+カーボンコート(厚み10nm)
The specifications common to the examples of the present invention and the comparative examples are as follows.
1. Conductive layer formation pitch: 0.3 mm,
2. Number of parallel conductive layers: 12 (in the present invention, slits are formed for every four conductive layers, and three divided wiring portions having four conductive layers are formed)
3. Total length of wiring plate: 100mm
4). Connector length: 3mm
5). Reinforcing plate length of connector part: 5mm
6). Width of each conductive layer: 0.2mm
7). Thickness of each conductive layer: 0.018mm
8). 8. Flexible substrate: polyimide film (thickness 13 nm) + adhesive Protective layer: polyimide film (thickness 13 nm) + adhesive 10. Magnetic shield layer: silver paste + carbon coat (thickness 10nm)

以上の構成の本発明例と比較例のフレキシブルプリント配線板を用いて、繰り返し屈曲動作を行い、耐屈曲性を検証した。
検証方法は、IPC法に準拠し、ストローク25mm,スピード500回/分として、それぞれのサンプル数を10個について調べた。これらの検証結果(平均値)を表1に示す。
Using the flexible printed wiring boards of the present invention example and the comparative example having the above-described configuration, the bending operation was repeatedly performed to verify the bending resistance.
The verification method was based on the IPC method, and the number of samples was examined for 10 samples with a stroke of 25 mm and a speed of 500 times / minute. These verification results (average values) are shown in Table 1.

Figure 2010040929
Figure 2010040929

表1に示す結果によれば、本発明例のフレキシブルプリント配線板は、従来の比較例のフレキシブルプリント配線板と比較して、屈曲配線スペースが3mmで約7倍の耐屈曲性能があることが判明した。本発明のフレキシブルプリント配線板の顕著な耐屈曲性効果が確認された。   According to the results shown in Table 1, the flexible printed wiring board of the example of the present invention has a bending resistance of about 7 times with a bent wiring space of 3 mm as compared with the flexible printed wiring board of the conventional comparative example. found. The remarkable bending-resistant effect of the flexible printed wiring board of this invention was confirmed.

本発明のフレキシブルプリント配線板の一例を示す斜視図である。It is a perspective view which shows an example of the flexible printed wiring board of this invention. 本発明のフレキシブルプリント配線板の一例を示す平面図である。It is a top view which shows an example of the flexible printed wiring board of this invention. 本発明のフレキシブルプリント配線板の一例を示す断面図である。It is sectional drawing which shows an example of the flexible printed wiring board of this invention. 本発明のフレキシブルプリント配線板の別な一例を示す斜視図である。It is a perspective view which shows another example of the flexible printed wiring board of this invention. 本発明のフレキシブルプリント配線板の別な一例を示す平面図である。It is a top view which shows another example of the flexible printed wiring board of this invention. 本発明の電子機器(携帯電話)の一例を示す斜視図である。。It is a perspective view which shows an example of the electronic device (cellular phone) of this invention. . 本発明の電子機器(携帯電話)の配線状態を示す説明図である。It is explanatory drawing which shows the wiring state of the electronic device (cellular phone) of this invention.

符号の説明Explanation of symbols

10 電子機器(携帯電話)、11,12 筐体、20 フレキシブルプリント配線板、22 導電層、27 スリット、48 結束配線部、49 結束手段、S1 フラット配線部、S2 コネクタ部、S21,S22,S23 分割配線部、D1 傾斜配線部、D2 捻り部。   DESCRIPTION OF SYMBOLS 10 Electronic device (mobile phone), 11, 12 Case, 20 Flexible printed wiring board, 22 Conductive layer, 27 Slit, 48 Bundling wiring part, 49 Bundling means, S1 Flat wiring part, S2 Connector part, S21, S22, S23 Divided wiring part, D1 inclined wiring part, D2 twisted part.

Claims (7)

回路を有する複数の筐体が相対移動可能に係合され、これら筐体の回路どうしをフレキシブルプリント配線板で電気的に接続してなる電子機器であって、
前記フレキシブルプリント配線板は、所定の幅と長さをもつ帯状の屈曲自在なフレキシブル基板、および該フレキシブル基板の長さ方向に沿って細長く延び、かつ幅方向に沿って互いに所定の間隔を空けて並列させた多数本の導電層を少なくとも備えたフラット配線部と、該フラット配線部の両端にそれぞれ形成され、前記回路と電気的に接続される平板状のコネクタ部とからなり、
前記フラット配線部は、前記フレキシブル基板の長さ方向に沿って前記フレキシブル基板に形成したスリットによって、前記多数本の導電層のうち所定の本数の導電層ごとに分割した、複数の分割配線部からなり、
前記分割配線部は、その幅方向が前記コネクタ部の幅方向に対して所定の角度で傾斜して延びる傾斜配線部と、該傾斜配線部の両端でこの傾斜配線部と前記コネクタ部とを繋ぐ捻り部とからなることを特徴とする電子機器。
A plurality of housings having circuits are engaged so as to be relatively movable, and the circuits of these housings are electrically connected by a flexible printed wiring board,
The flexible printed wiring board includes a strip-like flexible substrate having a predetermined width and length, and is elongated along the length direction of the flexible substrate, and is spaced apart from each other along the width direction. A flat wiring portion having at least a plurality of conductive layers arranged in parallel, and a flat connector portion formed at each end of the flat wiring portion and electrically connected to the circuit,
The flat wiring portion is divided from a plurality of divided wiring portions divided into a predetermined number of conductive layers among the multiple conductive layers by slits formed in the flexible substrate along a length direction of the flexible substrate. Become
The divided wiring portion has an inclined wiring portion whose width direction extends at a predetermined angle with respect to the width direction of the connector portion, and connects the inclined wiring portion and the connector portion at both ends of the inclined wiring portion. An electronic device comprising a twisted portion.
前記傾斜配線部は、その幅方向が前記コネクタ部の幅方向に対して略直角を成すことを特徴とする請求項1に記載の電子機器。   The electronic device according to claim 1, wherein the inclined wiring portion has a width direction substantially perpendicular to a width direction of the connector portion. 複数の前記傾斜配線部を束ねて厚み方向に積層させる結束手段を更に備えたことを特徴とする請求項1または2に記載の電子機器。   The electronic apparatus according to claim 1, further comprising a binding unit that bundles the plurality of inclined wiring portions and stacks the inclined wiring portions in the thickness direction. 前記傾斜配線部を前記筐体の移動面に沿って屈曲させて配置したことを特徴とする請求項1ないし3いずれか1項に記載の電子機器。   The electronic device according to claim 1, wherein the inclined wiring portion is arranged to be bent along a moving surface of the housing. 前記傾斜配線部を前記筐体の移動面に沿ってU字型を成すように屈曲させて配置したことを特徴とする請求項4項に記載の電子機器。   The electronic device according to claim 4, wherein the inclined wiring portion is arranged to be bent along a moving surface of the housing so as to form a U shape. 前記複数の筐体は、第1の筐体と、該第1の筐体に対してスライド可能に取り付けられた第2の筐体とからなることを特徴とする請求項1ないし5いずれか1項に記載の電子機器。   The plurality of casings include a first casing and a second casing that is slidably attached to the first casing. The electronic device as described in the paragraph. 所定の幅と長さをもつ帯状の屈曲自在なフレキシブル基板、および該フレキシブル基板の長さ方向に沿って細長く延び、かつ幅方向に沿って互いに所定の間隔を空けて並列させた多数本の導電層を少なくとも備えたフラット配線部と、該フラット配線部の両端にそれぞれ形成された平板状のコネクタ部とを少なくとも備えたフレキシブルプリント配線板であって、
前記フラット配線部は、前記フレキシブル基板の長さ方向に沿って前記フレキシブル基板に形成したスリットによって、前記多数本の導電層のうち所定の本数の導電層ごとに分割した、複数の分割配線部からなり、
前記分割配線部は、その幅方向が前記コネクタ部の幅方向に対して所定の角度で傾斜して延びる傾斜配線部と、該傾斜配線部の両端でこの傾斜配線部と前記コネクタ部とを繋ぐ捻り部とからなることを特徴とするフレキシブルプリント配線板。
A strip-like flexible substrate having a predetermined width and length, and a plurality of conductive wires extending in the longitudinal direction of the flexible substrate and arranged in parallel at predetermined intervals along the width direction. A flexible printed wiring board comprising at least a flat wiring part provided with a layer, and flat connector parts respectively formed at both ends of the flat wiring part,
The flat wiring portion is divided from a plurality of divided wiring portions divided into a predetermined number of conductive layers among the multiple conductive layers by slits formed in the flexible substrate along a length direction of the flexible substrate. Become
The divided wiring portion has an inclined wiring portion whose width direction extends at a predetermined angle with respect to the width direction of the connector portion, and connects the inclined wiring portion and the connector portion at both ends of the inclined wiring portion. A flexible printed wiring board comprising a twisted portion.
JP2008204472A 2008-08-07 2008-08-07 Electronic equipment and flexible printed circuit board Pending JP2010040929A (en)

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Publication number Priority date Publication date Assignee Title
JP2012033850A (en) * 2010-08-02 2012-02-16 Itei Kofun Yugenkoshi Bound flexible wiring having waterproof section
CN102385950A (en) * 2010-09-06 2012-03-21 易鼎股份有限公司 Bunched flexible circuit cable with waterproof section
WO2014109135A1 (en) * 2013-01-08 2014-07-17 株式会社村田製作所 Flexible substrate and electronic apparatus
DE112021007971T5 (en) 2021-10-05 2024-05-02 Yamaichi Electronics Co., Ltd. Cable device and method for its manufacture

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JPH1139953A (en) * 1997-07-25 1999-02-12 Advanced Display:Kk Flexible flat cable
JP2007073924A (en) * 2005-09-02 2007-03-22 Itei Kofun Yugenkoshi Circuit connecting bus line having changeable corresponding pin positions
JP2008153478A (en) * 2006-12-19 2008-07-03 Nitto Denko Corp Printed wiring board, manufacturing method thereof and electronic apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1139953A (en) * 1997-07-25 1999-02-12 Advanced Display:Kk Flexible flat cable
JP2007073924A (en) * 2005-09-02 2007-03-22 Itei Kofun Yugenkoshi Circuit connecting bus line having changeable corresponding pin positions
JP2008153478A (en) * 2006-12-19 2008-07-03 Nitto Denko Corp Printed wiring board, manufacturing method thereof and electronic apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012033850A (en) * 2010-08-02 2012-02-16 Itei Kofun Yugenkoshi Bound flexible wiring having waterproof section
US8546697B2 (en) 2010-08-02 2013-10-01 Advanced Flexible Circuits Co., Ltd. Bundled flexible circuit board based flat cable with water resistant section
CN102385950A (en) * 2010-09-06 2012-03-21 易鼎股份有限公司 Bunched flexible circuit cable with waterproof section
WO2014109135A1 (en) * 2013-01-08 2014-07-17 株式会社村田製作所 Flexible substrate and electronic apparatus
JP5582276B1 (en) * 2013-01-08 2014-09-03 株式会社村田製作所 Flexible substrate and electronic device
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DE112021007971T5 (en) 2021-10-05 2024-05-02 Yamaichi Electronics Co., Ltd. Cable device and method for its manufacture

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