JP2010040834A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve high-efficiency heat control by securing miniaturization, and to provide robust mounting arrangement excelling in quake resistance. <P>SOLUTION: This electronic apparatus is composed such that a thermally-conductive member 17 with a power unit 13 supported thereto is housed by mounting its leg parts 171 to a bottom face of a housing body 11 of an apparatus housing 10 provided with an air inlet 112 and an air outlet 113; a radiator 14 supported to a sidewall surface of the housing body 11 is stacked on top of it while being thermally coupled thereto; a board unit 15 is stacked on the radiator 14 while being thermally coupled thereto; and the power unit 13 and the board unit 15 are thermally controlled by the single radiator 14. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device such as a broadcast transmitter on which a power supply unit is mounted, and more particularly to a heat dissipation structure thereof.

  Generally, an electronic device is equipped with a heating element, and since a large amount of heat is generated when the electronic device is driven, a heat dissipation structure that obtains desired performance characteristics by heat-controlling the heating element using a radiator is provided. It has been adopted. In such a radiator, when the heat radiating fins are erected at a predetermined interval in the heat coupling portion, and the amount of heat from, for example, a heating element mounted on the board unit is heat transported to the heat coupling portion, the heat radiating fins The heat is controlled from the heat to a desired temperature.

  By the way, in recent electronic devices, the amount of generated heat has increased due to the increase in capacity of the power supply unit, which is a heating element, and the performance enhancement of the electronic components mounted on the board unit. Is one of the important issues. In order to control the heat of multiple heating elements of a power supply unit or board unit with increased heat generation, efficient heat control can be realized by adopting a structure that dissipates heat using a radiator. However, there is a problem that the device casing becomes large.

Therefore, as a heat dissipation mounting structure for controlling the heat of a plurality of heating elements, for example, a power transistor is thermally coupled to both surfaces of a double-sided mount type heatsink, and each power transistor is disposed on a heatsink fin of the heatsink. It has been proposed that the power transistors disposed on both sides of the heat radiator are configured to perform thermal control at the same time by being electrically connected to a printed wiring board disposed opposite to each other with respect to each other. 1).
JP-A-8-37387

  However, in the above heat dissipation mounting structure, when the heat sink and the printed wiring board are assembled and arranged with a desired seismic strength in the equipment casing, the support structure becomes complicated. Has the problem of becoming.

  The present invention has been made in view of the above circumstances, so that it is possible to realize a highly efficient thermal control and a robust mounting arrangement excellent in earthquake resistance after ensuring miniaturization. An object is to provide an electronic device.

  The present invention relates to a device housing provided with an air intake port and an air exhaust port, a power supply unit accommodated in the device housing, and the power supply unit supported by the device housing. Corresponding to the three side portions of the bottom surface of the device casing, a heat conducting member provided with a plurality of legs protruding from the bottom surface of the device housing, and a heat coupling portion sandwiching the radiation fins And a heat sink supported on a side surface of the device housing, wherein one of the heat coupling portions is thermally coupled onto the heat conducting member, and the other of the heat coupling portions of the heat radiator And an electronic device comprising a board unit housed and disposed in the device casing.

  According to the said structure, a heat conductive member supports a power supply unit, the leg part is attached to the bottom face of an apparatus housing | casing, and one side of the thermal coupling part of a radiator is thermally couple | bonded on it. The radiator is attached to and supported by the side wall surface of the equipment casing, and the substrate unit is attached by being thermally coupled to the other of the thermal coupling portions. The heat transferred from both of the heats of the power supply unit transferred through the heat conducting member is radiated from the heat radiating fins to perform heat control.

  This makes it possible to effectively use the installation space, secure the downsizing of the equipment housing, and realize the robust installation of the radiator to ensure the desired seismic strength. High-efficiency thermal control of the power supply unit and the substrate unit accommodated using the container can be realized.

  As described above, according to the present invention, an electronic device capable of realizing high-efficiency thermal control while ensuring downsizing and realizing a robust mounting arrangement excellent in earthquake resistance. Can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1 to 3 show an electronic apparatus according to an embodiment of the present invention. FIG. 1 shows a state where an upper surface side panel of the apparatus housing 10 is removed and viewed from the upper surface side, and FIG. FIG. 3 shows a state where the front panel is removed from the device housing 10 and viewed from the front surface side, and FIG. 3 shows a state where the device housing 10 is viewed from the back surface side.

  That is, the device housing 10 is called a so-called bathtub type, and is formed of a concave housing body 11 and a cover portion 12 attached to the opening side of the housing body 11 (see FIG. 2). An electronic component unit 16 such as a filter is juxtaposed and accommodated in the casing body 11 together with a power supply unit 13, a radiator 14 and a substrate unit 15 that are stacked and arranged as will be described later (FIG. 1 and FIG. 1). (See FIG. 4).

  The power supply unit 13 is assembled by being thermally coupled to a substantially rectangular heat conducting member 17 formed of a metal material such as aluminum. The heat conducting member 17 includes a plurality of fixing leg portions 171 having a predetermined interval corresponding to at least three sides of the peripheral wall, for example, the three sides of the front surface, the rear surface, and one side surface of the device housing 10. Then, it is provided to project into a leg shape. The heat conducting member 17 has a plurality of leg portions 171 placed on the bottom surface of the housing body 11 in proximity to one side surface of the housing body 11 of the device housing 10, for example, a screw (not shown). It is screwed using and attached.

  In this way, the heat conducting member 17 is attached to the bottom surface of the housing main body 11 with the plurality of legs 171, and the power supply unit 13, the radiator 14 and the board unit 15 are connected to the equipment housing 10 through the heat conducting member 17. By housing in the device casing 10, the bottom surface area of the casing body 11 can be kept to a minimum, and the power supply unit 13, the radiator 14, and the radiator 14 have a desired seismic strength. The substrate unit 15 can be accommodated.

  On the heat conducting member 17, the heat radiator 14 is thermally coupled and attached. The radiator 14 has a so-called double-sided structure in which radiating fins 141 are sandwiched by thermal coupling portions 142. The radiator 14 has one of the thermal coupling portions 142 thermally coupled to the heat conducting member 17, and a wind shielding / fixing provided in the housing body 11 between the thermal coupling portions 142. The frame-shaped attachment portion 111 is inserted (see FIG. 5), and is attached to the attachment portion 111 by, for example, screwing using a screw (not shown). The mounting portion 111 has a function of supporting the radiator 14 and a wind shielding function that blocks air from flowing between the radiator 14 and the side wall of the housing body 11.

  In this way, the radiator 14 is supported on the heat conducting member 17 and the side wall surface of the housing body 11 via the mounting portion 111 and is accommodated and disposed in the device housing 10 with a desired seismic strength. . The support fulcrum of the radiator 14 is located above the power supply unit 13 serving as the center of gravity, so that the radiator 14 can be securely and securely mounted and arranged. The heat radiator 14 is reduced in size and weight by setting the area of the thermal coupling portion 142 to be smaller than the mounting area of the heat conducting member 17 and substantially the same shape as the board unit 15. ing.

  Further, the housing body 11 of the device housing 10 is provided with an air intake 112 on the front side panel and an air exhaust port 113 (see FIG. 3) on the back side panel. A blower duct 18 is provided between the air intake 112 and the heat conducting member 17 and the radiator 14, and the air taken in through the air intake 112 is guided to the blower duct 18 and described above. The power supply unit 13 supported by the heat conducting member 17 and the heat radiating fins 141 of the heat radiator 14 are guided.

  Further, cooling fans 19 and 20 constituting forced air circulation means are attached to the air intake 112 and the air outlet 113, respectively. As a result, the cooling fan 18 takes in outside air and forcibly supplies it into the device casing 10 via the air duct 18, and the air guided into the device casing 10 is cooled by the cooling fan 20. The air is forcedly discharged from the air outlet 113 of the body body 11 to the outside of the device housing 10. The air led into the device casing 11 passes between the power supply unit 13 and the heat radiation fins 141 of the heat radiator 14, deprives the surrounding heat and exhausts the heat to the outside.

  In the above configuration, the power supply unit 10 is configured so that the bottom surface area of the housing body 11 occupies about 80% of the installation area of the power supply unit 13 and about 20% of the installation area of the electronic component unit 16. 13 and the size of the electronic component unit 20 are set to approximately the same size. A heat conducting member 17 that supports the power supply unit 13 on the bottom surface thereof is attached to and accommodated in the casing body 11 using the leg portions 171.

  On the heat conducting member 17, the radiator 14 supported by the attachment portion 111 on the side wall surface of the housing body 11 is stacked and disposed with one of the heat coupling portions 142 being thermally coupled. Then, the board unit 15 is stacked and thermally coupled to the other of the heat coupling portions 142 of the radiator 14.

  The casing body 11 accommodates the electronic component unit 16 in parallel with the power supply unit 13, the radiator 14 and the board unit 15 which are stacked, and the cover portion 12 is attached to the opening side thereof. Is done. Cooling fans 19 and 20 are attached to the air intake 112 and the air outlet 113 of the housing body 11 of the device housing 10.

  In this state, the power supply unit 13, the board unit 15, and the electronic component unit 16 are driven, and heat is generated by each drive. Among these, the heat generated by the power supply unit 13 is transferred to one side of the heat coupling portion 142 of the radiator 14 via the heat conducting member 17. Then, the heat generated in the other board unit 15 is transferred to the other side of the heat coupling part 142 of the radiator 14. Then, the radiator 14 radiates the heat transferred to the thermal coupling part 142 from the radiation fins 141 into the device casing 10.

  Then, the cooling fans 19 and 20 are driven, and air is taken into the device casing 10 from the air inlet 112 of the casing body 11 and discharged from the air outlet 113 to be forcedly circulated. Thereby, the heat dissipated from the radiation fins 141 of the radiator 14 is exhausted from the air outlet 113 of the housing body 11 together with the air, and here, the heat control of the power supply unit 13 and the board unit 15 is performed. .

  As described above, the electronic device includes the heat conductive member 17 that supports the power supply unit 13, the leg portion 171 of the bottom surface of the housing body 11 of the device housing 10 provided with the air intake 112 and the air exhaust 113. The radiator 14 supported on the side wall surface of the casing body 11 is thermally coupled and stacked thereon, and the board unit 15 is stacked on the radiator 14. The power supply unit 13 and the substrate unit 15 are configured to be thermally controlled by a single radiator 14 by being thermally coupled.

  According to this, it is possible to effectively use the arrangement space, and after securing the downsizing of the device housing 10, the heat sink 14 can be firmly attached, and the desired seismic strength can be secured. In addition, highly efficient thermal control of the power supply unit 13 and the substrate unit 15 accommodated using the radiator 14 can be realized.

  In the above embodiment, the cooling fans 19 and 20 are arranged in both the air inlet 112 and the air outlet 113 of the device housing 10 so that air is forcibly circulated in the device housing 10. However, the present invention is not limited to this, and a cooling fan may be arranged in one of the air intake port 112 and the air discharge port 113, and various other cooling methods such as a natural circulation method may be applied.

  In the above embodiment, for convenience of explanation, the air intake 112 and the air discharge port 113 are provided on the front side and the back side with the four sides around the device housing 10 as the front side, the back side, and the left and right side sides. Although the case of the configuration has been described, the present invention is not limited to this arrangement configuration, and various other configurations are possible.

  Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

It is the top view which showed the state which removed the upper surface side panel and looked at the principal part from the upper surface side of the electronic device which concerns on one embodiment of this invention. It is the top view which showed the state which removed the front side panel of FIG. 1 and looked at the principal part from the front side. It is the top view which showed the state seen from the back side panel side of FIG. It is the top view which showed the state which removed the right side panel of FIG. 1 and looked at the principal part from the right side. It is the top view which showed the state which removed the left side panel of FIG. 1 and looked at the principal part from the left side.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Equipment housing | casing, 11 ... Housing | casing main body, 111 ... Mounting part, 112 ... Air intake port, 113 ... Air exhaust port, 12 ... Cover part, 13 ... Power supply unit, 14 ... Radiator, 141 ... Radiation fin, 142 DESCRIPTION OF SYMBOLS ... Thermal coupling part, 15 ... Board | substrate unit, 16 ... Electronic component unit, 17 ... Thermal conduction member, 171 ... Leg part, 18 ... Duct for ventilation, 19, 20 ... Cooling fan.

Claims (5)

An equipment housing provided with an air intake and an air exhaust; and
A power supply unit housed in the device casing;
The power supply unit is supported, and a plurality of leg portions that are fixed to the bottom surface of the device housing protrude at least on the three sides of the bottom surface of the device housing around the power supply unit. And a heat conducting member provided,
A heat sink provided with a heat radiating fin interposed therebetween, one of the heat coupling portions being thermally coupled to the heat conducting member and supported by a side portion of the device housing;
A substrate unit that is thermally coupled to the other of the heat coupling portions of the radiator and is housed in the device housing; and
An electronic apparatus comprising:   The electronic device according to claim 1, further comprising an air forced circulation unit that takes in air from an air intake port of the device housing and exhausts the air through the air exhaust port.   The electronic device according to claim 1, wherein the device housing is formed of a concave housing body and a cover portion attached to the opening side of the housing body.   The electronic device according to claim 1, wherein an area of the heat coupling portion of the radiator is smaller than an installation area of the power supply unit.   The electronic equipment unit is accommodated and disposed in the device casing in parallel with the heat conduction member that supports the power supply units arranged in a stack, the radiator, and the board unit. Item 5. The electronic device according to any one of Items 1 to 4.

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