JP2010037618A - Plating equipment for tab tape, and method for manufacturing tab tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide plating equipment for a TAB tape which is an object to be plated in which made it possible to surely apply the conductor plating having a uniform thickness on the TAB tape, and to provide a method for manufacturing the TAB tape. <P>SOLUTION: The plating equipment comprising: a plating water tank 2 which holds a plating liquid 1; partitions 3 which segment the plating water tank 2 into an upper compartment 2-1 and a lower compartment 2-2 such that the plating liquid 1 can flow from the upper compartment 2-1 to the lower compartment 2-2 only through an aperture 7; a plating liquid supply section 5 which supplies the plating liquid 1 through the aperture 7 from the upper compartment 2-1 to the lower compartment 2-2; the support 6 which supports the TAB tape 10 horizontally within the lower compartment 2-2 in such a manner that the plating liquid 1 flowing down through the aperture 7 to the lower compartment 2-2 is contacted with the surface of the TAB tape 10, and a plating liquid discharge section 4 which is disposed in the lower compartment 2-2 so as to discharge the plating liquid 1. and the method for plating the TAB tape by the plating equipment are provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides plating for a TAB tape suitable for a plating apparatus or the like for filling or depositing a plated conductor on a conductive pattern such as an interlayer conductive via such as a filled via or a conformal via or a wiring pattern in a TAB tape. The present invention relates to an apparatus and a method for producing a TAB tape including a step of filling or depositing a plating conductor at a predetermined position of the TAB tape by using such a TAB tape plating apparatus.

  Conventionally, in this type of TAB tape plating apparatus and TAB tape manufacturing process, a wiring pattern formed by patterning a copper foil laminated on an insulating substrate through a series of processes such as photosensitive resist coating and exposure work. A conductor pattern such as is formed. Then, the surface of the wiring pattern or the like is used as a cathode, while the TAB tape is kept upright in the width direction, the plating solution is stored and transported through the plating water tank provided with the anode. In a so-called vertical conveyance state, the plating pattern is applied to the surface on which the TAB tape wiring pattern and the like are formed from the lateral direction (that is, in the horizontal direction in an elevational view), so that the wiring pattern of the TAB tape that is the workpiece The plated conductor is deposited on the surface of the metal, the inside of the interlayer conductive via, and the like.

FIG. 2 is a diagram schematically showing an example of the structure of the main part of a typical plating apparatus used in the process of plating such a conventional general TAB tape.
In the plating water tank 100, an anode 102 facing the surface to be plated of the TAB tape 101 that is vertically conveyed and becomes a cathode, a spray nozzle 103 between the anode 102 and the TAB tape 101, and the spray nozzle 103 and TAB tape Shields 104 are respectively arranged between the projectors 101 and 101. A TAB tape support 105 is formed integrally with the shield 104, and the TAB tape 101 is conveyed in a so-called vertical direction while being kept in an upright state by the TAB tape support 105. The DC power source 106 has a positive electrode terminal connected to the anode 102 and a negative electrode terminal connected to the portion to be plated of the TAB tape 101 via, for example, a roller contact electrode (not shown). A plating solution 107 is stored (held) in the plating water tank 100.

  The plating solution 107 is first sent from the pump 111 through the supply pipe 110 to the spray nozzle 103 as a flow 108a. Then, the flow 108b of the plating solution 107 adjusted to a predetermined pressure is sprayed as a jet from the spray nozzle 103 and is applied to the surface to be plated of the TAB tape 101 through the opening of the shield 104. Current lines formed between the anode 102 and the TAB tape 101 serving as the cathode are concentrated on the plated surface of the TAB tape 101. In this way, by applying the flow 108b of the plating solution 107 while ensuring a predetermined current density, a predetermined plating conductor can be deposited on the surface to be plated of the TAB tape 101. The used flow 108c of the plating solution 107 is eventually discharged from the plating water tank 100 to the outside through the plating solution discharge unit 109 provided above the plating solution discharge unit 109 (see Patent Document 1 above). ).

JP 2006-52471 A

However, in the TAB tape manufacturing method including the conventional plating apparatus and the plating process using the conventional plating apparatus as described above, after reaching the surface of the TAB tape 101 to be plated through the opening of the shield 104. The directivity is hardly given to the flow 108c of the plating solution 107. In addition, because of the vertical conveyance method, the plating solution 107 stored in the plating water tank 100 is inevitably affected by gravity, and is a heavy electrolytic plating containing a large amount of metal ion components having different weight densities. The plating solution 107 in the previous state and the plating solution 107 after the light electrolytic plating after the metal ion component is consumed by hitting the surface of the TAB tape 101 are not uniformly mixed in the plating water tank 100. There is a tendency for separation and uneven density. Then, coupled with the fact that the plating solution 107 is often not sufficiently stirred, the metal ion concentration distribution of the plating solution 107 stored in the plating water tank 100 tends to be non-uniform in the plating water tank 100, and is thus completed. Variations in the thickness of the plating conductors that would be judged as plating defects occur.
Further, in the conventional plating apparatus, the plating solution 107 sprayed from the spray nozzle 103 does not necessarily all hit the TAB tape 101, and passes through the opening of the shielding object 104 to the surface of the TAB tape 101. In addition to the reaching flow, for example, a flow (not shown) that reaches the plating solution discharge unit 109 by bypassing the shielding object 104 and is discharged out of the plating water tank 100 is generated. obtain.
In addition, in combination with the occurrence of warpage in the width direction peculiar to the TAB tape 101, particularly when the TAB tape 101 as the object to be plated is wide, the TAB in the width direction of the TAB tape 101, that is, in the longitudinal conveyance state. There will be a difference in the thickness of the finished plated conductor (not shown) between the upper end side and the lower end side of the tape 101 so that it is determined that the plating is defective.
Further, on the surface of the TAB tape 101, in general, various structures having a three-dimensional thickness and unevenness such as wiring patterns and interlayer conductive via holes (all not shown) are formed.
When plating is performed while maintaining such a TAB tape 101 in an upright state by vertical conveyance, bubbles remain on the three-dimensional thickness and uneven portions of the surface to be plated of the TAB tape 101, Tends to cause non-plating such as plating voids and plating defects such as uneven plating thickness.
In addition, since the TAB tape 101 in recent years is formed with very small dimensions of interlayer conduction vias and wiring patterns, the conventional TAB tape has a relatively large interlayer conduction via and wiring pattern. Even if fine bubbles adherence that was not a problem or even a small non-uniform distribution of metal ion concentration occurs, this may be the cause of plating such as plating voids and uneven plating thickness. The risk of causing defects is increasing.

As described above, in the conventional TAB tape plating apparatus and TAB tape manufacturing method, the metal ion concentration distribution in the plating solution 107 stored in the plating water tank 100 is not uniform or air bubbles adhere to the TAB tape 101 surface. Thus, there is a problem that plating defects such as uneven plating thickness and non-plating such as plating voids are likely to occur.
The present invention has been made in view of such problems, and its purpose is to suppress or eliminate the occurrence of plating defects such as uneven plating thickness and non-plating such as plating voids, and to achieve a predetermined uniformity. Another object of the present invention is to provide a TAB tape plating apparatus and a TAB tape manufacturing method capable of reliably performing conductor plating having an appropriate thickness on a TAB tape that is an object to be plated.

The plating apparatus for TAB tape of the present invention comprises a plating water tank for holding a plating solution, the tank of the plating water tank vertically divided into an upper compartment and a lower compartment, and has an opening and the upper compartment only through the opening. In order to allow the plating solution to flow from the lower compartment to the partition, the plating solution is supplied to the upper compartment, and the plating solution is supplied to the upper compartment, or the plating solution is ejected to perform the plating. A plating solution supply section provided in the upper compartment so that the liquid flows from the upper compartment through the opening to the lower compartment, and plating that has flowed to the lower compartment through the opening. A support that horizontally supports the TAB tape in the lower compartment so that the liquid hits the surface of the TAB tape that is the object to be plated, and a plating solution discharge provided in the lower compartment so as to discharge the plating solution With department It is characterized in that.
The method for producing a TAB tape of the present invention is a method for producing a TAB tape including a step of forming a predetermined conductor pattern and a via hole on an insulating substrate, and a plating step of filling the via hole with a plating conductor. In the plating step, the plating water tank holding the plating solution is provided with a partition that divides the tank into upper and lower compartments in the vertical direction, and an opening is provided in the partition. The plating solution is allowed to flow from the compartment to the lower compartment, and the plating solution is supplied to the upper compartment or sprayed to the upper compartment, and the plating solution is discharged from the upper compartment. A plating solution supply part is provided for flowing through the opening to the lower compartment, and a plating solution discharge part is provided in the lower compartment so that the plating solution is discharged from the lower compartment. By supporting the TAB tape horizontally in the lower compartment, the plating solution flowing from the upper compartment through the opening to the lower compartment is applied to the surface of the TAB tape that is the object to be plated. By being applied, the plated conductor is filled in the via hole in the TAB tape.
Moreover, the manufacturing method of the TAB tape of the present invention includes a step of forming a predetermined conductor pattern on an insulating substrate and a plating step of depositing a plating conductor on the surface of the conductor pattern. In the plating step, the plating water tank holding the plating solution is provided with a partition that divides the inside of the tank into an upper compartment and a lower compartment, and an opening is provided in the partition, and only through the opening. The plating solution is allowed to flow from the upper compartment to the lower compartment, and the plating solution is supplied to the upper compartment, or the plating solution is ejected to the upper compartment, and the plating solution is supplied to the upper compartment. Provided with a plating solution supply section for flowing from the compartment to the lower compartment through the opening, and provided with a plating solution discharge section in the lower compartment to discharge the plating solution from the lower compartment And by supporting the TAB tape horizontally in the lower compartment, the plating solution that has flowed from the upper compartment through the opening to the lower compartment is a TAB tape to be plated. A plating conductor is deposited on the surface of the conductor pattern of the TAB tape.

  According to the present invention, the plating water tank that holds the plating solution is provided with the partition that divides the tank into the upper compartment and the lower compartment, and the partition is provided with an opening. Allow the plating solution to flow to the lower compartment, and supply the plating solution to the upper compartment or eject the plating solution to the upper compartment, and pass the plating solution from the upper compartment through the opening to the lower compartment. And a plating solution discharge part in the lower compartment so that the plating solution is discharged from the lower compartment, and the TAB tape is horizontally supported in the lower compartment. By applying the plating solution that has flowed from the upper section through the opening to the previous section on the surface of the TAB tape that is the object to be plated, the plated conductor is applied to the via hole or conductor pattern in the TAB tape. As a result, the plating solution can be applied at a uniform concentration and flow rate without being adversely affected by gravity, buoyancy, etc. It can be made to flow in a uniquely steady flow toward the surface of the TAB tape being supported, and can always be reliably and uniformly applied to the surface of the TAB tape. As a result, the occurrence of plating defects such as uneven plating thickness and non-plating such as plating voids can be suppressed or eliminated, and conductor plating having a predetermined uniform thickness can be reliably applied to the TAB tape to be plated. Can be applied.

  Here, in the opening, it is more preferable that the flow path length from the upper section to the lower section is ½ or more of the distance between the plating solution supply unit and the TAB tape. It is. By doing so, it is possible to arrange the flow direction of the plating solution in the opening so as to align with a predetermined direction that effectively hits the TAB tape.

Hereinafter, a TAB tape plating apparatus according to the present embodiment and a TAB tape manufacturing method including a plating process using the same will be described with reference to the drawings.
FIG. 1 is a diagram schematically showing the main structure of a TAB tape plating apparatus according to an embodiment of the present invention.

  This TAB tape plating apparatus includes a plating solution 1, a plating water tank 2, a partition wall 3, a plating solution discharge unit 4, a plating solution supply unit 5, and a support 6. As prepared. An opening 7 is provided in the partition wall 3. This TAB tape plating apparatus includes an anode 9 for supplying an electrolytic plating current to the flow 8 (mainly 8b) of the plating solution 1, a positive electrode terminal connected to the anode 9, and a cathode. A DC power supply 11 to which a negative electrode terminal is connected to a certain TAB tape 10 via a roller contact electrode (not shown) or the like is provided as a main part of its electrical configuration. A pump 12 for supplying and discharging the plating solution 1 to and from the plating water tank 2 is disposed outside the plating water tank 2.

  The plating water tank 2 is for holding the plating solution 1 in the tank. A partition wall 3, a plating solution discharge unit 4, a plating solution supply unit 5, a support 6, and an anode 9 are disposed in the plating water tank 2.

The partition wall 3 is provided so as to divide the inside of the plating water tank 2 into an upper upper section 2-1 and a lower lower section 2-2 in the vertical direction. An opening 7 is formed in the partition wall 3. The plating solution 1 can flow from the upper section 2-1 to the lower section 2-2 only through the opening 7. Therefore, the plating solution 1 cannot flow from the upper section 2-1 to the lower section 2-2 through other flow paths. Further, since the plating solution 1 stored in the upper section 2-1 is subjected to gravity (since it has a relatively large and stable position head hydrodynamically), the plating passing through the opening 7 is used. The flow 1b of the liquid 1 basically has a potential of a down flow that constantly flows from the upper section 2-1 to the lower section 2-2 even if no water is given by the plating solution supply section 5. is doing.
The depth of the opening 7 provided in the partition wall 3, that is, the flow path length from the upper section 2-1 to the lower section 2-2 through the opening 7 is at least the outlet of the plating solution supply section 5. The distance to the surface of the TAB tape 10 is ½ or more. By doing in this way, it is possible to arrange the flow direction of the flow 8b of the plating solution 1 in the opening 7 so as to be aligned with a predetermined direction so as to be almost directly opposed to the surface of the TAB tape 10. Become. Here, if the flow path length is less than ½ of the distance between the jet port of the plating solution supply unit 5 and the surface of the TAB tape 10, the effect of adjusting the flow direction is sufficient. There is a high risk that it will be difficult to do. Note that the upper limit of the flow path length is theoretically equal to the distance between the jet port of the plating solution supply unit 5 and the surface of the TAB tape 10 (that is, the liquid supply unit 5 due to structural limitations). Needless to say, this is equal to the distance between the nozzle outlet and the surface of the TAB tape 10.

  The plating solution discharge unit 4 is provided on, for example, the left and right side walls of the lower section 2-2, and is configured to discharge the plating solution 1 from the lower section 2-2 to the outside. A flow 8c of the plating solution 1 discharged by the plating solution discharge unit 4 is circulated by a pump 12 and is plated with a predetermined metal ion concentration by a regenerator (not shown) provided in the middle of the return path. It is possible to regenerate the liquid 1 and supply it to the plating water tank 2 again. Or although illustration is abbreviate | omitted, you may make it discard the plating solution 1 discharged | emitted by the plating solution discharge | emission part 4 instead of using it cyclically or storing outside.

The plating solution supply unit 5 supplies the plating solution 1 to the upper section 2-1 by the flow 8a from the pump 12 to the upper section 2-2 or ejects the plating solution 1 and passes through the opening 7 to lower the section 2-2. In the upper section 2-1, the surface 8b of the TAB tape 10 supported in a horizontal posture is made to collide (apply) the flow 8b of the sprayed plating solution 1. The plating solution supply unit 5 may have, for example, a tapered opening, that is, a nozzle-shaped supply port, when it is necessary to spray the plating solution 1 with a strong momentum. Alternatively, for example, a hydrodynamic water amplification structure such as an ejector (not shown) may be provided. Alternatively, when the moment of jetting the plating solution 1 may be weak, it may be provided with a direct outlet that is not nozzle-like (no water amplification or biasing action). Is possible.

  In the support 6, the flow 8 b of the plating solution 1 flowing from the upper section 2-1 through the opening 7 to the lower section 2-2 is effectively uniform on the surface of the TAB tape 10 that is the object to be plated. The TAB tape 10 can be moved in the longitudinal direction while horizontally supporting the TAB tape 10 in the lower section 2-2. The TAB tape 10 is supported in a horizontal position by the support 6 and is moved in the longitudinal direction at a predetermined speed, whereby predetermined conductor plating is performed over the entire length.

Using such a TAB tape plating apparatus according to this embodiment, the TAB tape 10 can be subjected to conductor plating with a uniform film thickness. Next, a manufacturing method of the TAB tape according to the present embodiment centering on such a TAB tape plating step will be described.
First, prior to performing the step of plating the TAB tape 10, a predetermined conductor pattern and via holes are formed on the insulating substrate (both not shown).

  Then, a plating process is performed for filling the via hole of the TAB tape 10 with the plating conductor or for depositing the plating conductor on the surface of the conductor pattern. At that time, for the TAB tape as described above By performing plating using a plating apparatus, conductor plating with a uniform film thickness can be applied to the TAB tape 10 extremely effectively without causing any non-plating or uneven plating thickness.

In the plating process, first, it is desirable to store the plating solution 1 in the plating water tank 2 while always maintaining a substantially constant storage amount. This is because when the amount of the plating solution 1 stored in the upper compartment 2-1 in the plating water tank 2 varies greatly, along with this, the opening 7 passes from the upper compartment 2-1 to the lower compartment 2-2. Therefore, a significant difference is caused in the hydrodynamic position head of the down flow 8b flowing down and the flow rate per unit time of the flow 8b of the plating solution 1 hitting the TAB tape 10 is significantly different from a predetermined design value. This is because there is a high possibility that the film thickness of the finished plating conductor is different from the intended plating film thickness.
In order to keep the plating solution 1 at a substantially constant storage amount as described above, the supply amount of the plating solution 1 supplied into the plating water tank 2 by being ejected from the plating solution supply unit 5, and the plating solution It is important to adjust the discharge amount of the plating solution 1 discharged to the outside of the plating water tank 2 by the discharge unit 4 so as to always be balanced.

While continuing such adjustment, the plating solution 1 is supplied to the upper section 2-1, or the plating solution 1 is ejected from the plating solution supply section 5 arranged in the upper section 2-1, and the flow of the plating solution 1 is performed. 8b is produced and flows from the upper section 2-1 through the opening 7 to the lower section 2-2. In the lower section 2-2, the TAB tape 10 is horizontally supported by the support 6 so that the plating that has flowed from the upper section 2-1 through the opening 7 to the lower section 2-2. The flow 1b of the liquid 1 can be effectively and uniformly applied to the surface of the TAB tape 10 that is the object to be plated. Then, the flow 8c of the plating solution 1 that has released the metal ions by hitting the surface of the TAB tape 10 is transferred to the outside of the plating water tank 2 by the plating solution discharge portions 4 arranged on the left and right sides of the lower section 2-2. And discharged.
In this way, it is possible to fill the via holes in the TAB tape 10 with the plating conductors uniformly without causing uneven plating thickness and without causing non-plating such as plating voids, For example, it is possible to realize the deposition of a plating conductor on the surface.

As described above, in the TAB tape plating apparatus and the TAB tape manufacturing method according to the present embodiment, the flow 8 (8a, 8b, 8c) of the plating solution 1 is steadily and uniquely (others). Without forming a main flow path, the plating solution supply section 5 of the upper section 2-1 can be applied to the surface of the TAB tape 10 of the lower section 2-2 through the opening 7 of the partition wall 3. And after that, the flow 8c of the plating solution 1 is sucked into the plating solution discharge part 4 of the lower section 2-2, and finally flows backward from the lower section 2-2 to the upper section 2-1. The flow is discharged to the outside without any generation. In this way, the flow 8 of the plating solution 1 is along a series of flow paths with strong directivity, and is always kept in such a unique direction and path.
In addition, the flow path length in the opening 7 is set to 1/2 or more of the distance between the plating solution supply part 5 and the surface of the TAB tape 10 as described above, so The flow 8b to the section 2-2 ensures stronger (clear) directivity. Furthermore, since the anodes 9 are arranged in the vicinity of both the left and right wall surfaces in the plating water tank 2, the current line path for electrolytic plating is less likely to be obstructed than the anode arrangement structure in the conventional plating apparatus. It has become.

  As a result, the metal ion concentration of the plating solution 1 applied to the surface of the TAB tape 10, which is the object to be plated, is constantly uniform, and its flow rate and flow path are fluctuated or non-uniform. Can prevent or eliminate plating defects such as uneven plating thickness and non-plating such as plating voids, so that conductor plating having a predetermined uniform thickness and volume can be It is possible to reliably apply to a certain TAB tape 10.

  Further, in a so-called wet process in which plating is performed by immersing the TAB tape 10 which is an object to be plated in the plating solution 1, it is generally difficult to avoid air bubbles being mixed. However, even when such bubbles are mixed, it is possible to prevent the bubbles from remaining on the surface to be plated of the TAB tape 10 or to be reattached, such as plating voids caused by the adhesion of such bubbles. It is possible to eliminate the occurrence of plating defects. That is, since the bubbles necessarily have buoyancy, the buoyancy of the bubbles on the surface of the TAB tape 10 that is horizontally supported is effective in peeling off the bubbles themselves from the surface of the TAB tape 10. Will be a powerful force. In addition, after the bubbles are once peeled off from the surface of the TAB tape 10, the plating solution 1 is applied by the hydrodynamic suction force having a clear directivity applied to the plating solution 1 by the plating solution discharge unit 4. Since it flows in the left direction or the right direction in the lower section 2-2 together with the flow 8c and is finally discharged to the outside from the plating solution discharge portion 4, there is no possibility of reattaching to the surface of the TAB tape 10. . As a result, it is possible to suppress or eliminate the occurrence of non-plating such as plating voids and plating defects such as uneven plating thickness due to the adhesion or reattachment of bubbles on the surface of the TAB tape 10 as the object to be plated. Is possible.

In the above embodiment, in consideration of the fact that electrolytic plating is often performed for the formation of filled vias and the like in an actual TAB tape, the best mode for applying the present invention is when electrolytic plating is performed. However, the plating method to which the present invention can be applied is not limited to electrolytic plating. In addition to this, a TAB tape manufacturing method including a plating process by electroless plating such as a full additive method, and a plating process having both elements of electroless plating and electrolytic plating such as a semi-additive method, The present invention can also be applied to a TAB tape plating apparatus used therefor.
For example, when it is desirable to flow the plating solution 1 over a relatively slow time as in the case of the above electroless plating, the fluid of the flow 8b obtained by ejecting the plating solution 1 is used. Without relying on a dynamic speed head, the plating solution 1 can be obtained by the position head of gravity applied to the plating solution 1 stored in the upper section 2-1 and the pressure head caused by the plating solution sucking out by the plating solution discharge unit 4. You may make it produce the flow 8b of the downflow which goes to the lower division 2-2 from the upper division 2-1 through the opening 7. FIG. In that case, the flow rate per unit time of the flow 8b of the downflow is adjusted, for example, by adjusting the storage amount of the plating solution 1 in the upper section 2-1, and adjusting the plating solution discharge efficiency by the plating solution discharge unit 4. It is possible to control by adjusting etc.
Alternatively, the plating water tank 2 has a sealed container shape, and the pressure of the plating solution 1 stored in the plating water tank 2 is forcibly pressurized from the outside, so that the plating solution 1 mainly has a pressure head. Thus, the water flow of the downflow 8b that proceeds from the upper section 2-1 of the plating solution 1 to the lower section 2-2 through the opening 7 may be controlled.
Further, as a method of discharging the plating solution 1 performed in the plating solution discharge unit 4, in addition to the direct suction method using the pump 12, for example, an indirect suction method using a venturi pipe (not shown) can be used.

It is a figure which shows typically the main structures of the plating apparatus for TAB tapes concerning embodiment of this invention. It is a figure which shows typically an example of the structure of the principal part of the typical plating apparatus used at the process of plating on the conventional general TAB tape.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plating liquid 2 Plating water tank 2-1 Upper section 2-2 Lower section 3 Partition 4 Plating liquid discharge part 5 Plating liquid supply part 6 Support body 7 Opening 8 (Plating liquid flow) Anode 10 TAB tape 11 DC power supply 12 Pump

Claims (6)

A plating water tank for holding a plating solution;
In order to divide the inside of the plating water tank vertically into an upper compartment and a lower compartment, and to have an opening, allowing the plating solution to flow from the upper compartment to the lower compartment only through the opening, A partition wall provided in the plating water tank;
Plating provided in the upper compartment so that a plating solution is supplied to the upper compartment or the plating solution is ejected to flow the plating solution from the upper compartment to the lower compartment through the opening. A liquid supply unit;
A support that horizontally supports the TAB tape in the lower compartment so that the plating solution that has flowed to the lower compartment through the opening hits the surface of the TAB tape that is the object to be plated;
A plating apparatus for a TAB tape, comprising: a plating solution discharge portion provided in the lower compartment so as to discharge the plating solution. In the TAB tape plating apparatus according to claim 1,
The TAB tape plating, wherein a flow path length from the upper compartment to the lower compartment in the opening is ½ or more of a distance between the plating solution supply unit and the TAB tape. apparatus. In the TAB tape plating apparatus according to claim 1 or 2,
The TAB tape plating apparatus having a plating filling via formed by electrolytic plating or electroless plating. A method for producing a TAB tape comprising a step of forming a predetermined conductor pattern and a via hole on an insulating substrate, and a plating step of filling the via hole with a plating conductor,
In the plating step, the plating water tank holding the plating solution is provided with a partition that divides the inside of the tank into an upper compartment and a lower compartment, and an opening is provided in the partition, and only from the upper compartment through the opening. The plating solution is allowed to flow to the lower compartment, the plating solution is supplied to the upper compartment or the plating solution is ejected to the upper compartment, and the plating solution is opened from the upper compartment to the opening. A plating solution supply section for flowing to the lower section through the plate section, and a plating solution discharge section provided in the lower section so as to discharge the plating solution from the lower section, and the TAB tape By horizontally supporting in the lower compartment, the plating solution that has flowed from the upper compartment through the opening to the lower compartment is applied to the surface of the TAB tape that is the object to be plated. Method for producing a TAB tape, which comprises filling the plated conductor into the via holes in the TAB tape. A method for producing a TAB tape comprising: a step of forming a predetermined conductor pattern on an insulating substrate; and a plating step of depositing a plating conductor on the surface of the conductor pattern,
In the plating step, the plating water tank holding the plating solution is provided with a partition that divides the inside of the tank into an upper compartment and a lower compartment, and an opening is provided in the partition, and only from the upper compartment through the opening. The plating solution is allowed to flow to the lower compartment, the plating solution is supplied to the upper compartment or the plating solution is ejected to the upper compartment, and the plating solution is opened from the upper compartment to the opening. A plating solution supply section for flowing to the lower section through the plate section, and a plating solution discharge section provided in the lower section so as to discharge the plating solution from the lower section, and the TAB tape is removed from the lower section. By supporting horizontally in the compartment, the plating solution that has flowed from the upper compartment through the opening to the lower compartment is applied to the surface of the TAB tape that is the object to be plated, and the T Method for producing a TAB tape, characterized in that depositing a plating conductor surface of the conductor pattern in B tape. In the manufacturing method of the TAB tape of Claim 4 or 5,
The manufacture of a TAB tape characterized in that a flow path length from the upper section to the lower section in the opening is at least 1/2 of a distance between the plating solution supply unit and the TAB tape. Method.

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