JP2010016209A - Method of manufacturing resin-sealed semiconductor device, and resin-sealed semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin-sealed semiconductor device, which can form resin burrs only at desired spots, and also to provide a resin-sealed semiconductor device. <P>SOLUTION: The method of manufacturing the resin-sealed semiconductor device 10 has connection leads 21 with a portion exposed from resin being bent. The method includes a step of preparing a lead frame 20 which is made by integrally forming a base 22, part of which is exposed from resin, a tie bar 23 provided at a position facing with the base, burr-bearing leads 24 which extend from the base to the tie bar and are formed in pairs, and connection leads, each of which extends from the base toward the tie bar but is not connected to the tie bar between the pair of burr-bearing leads 24; a step wherein the lead frame is placed in a metal mold and a portion of the base to be sealed is stored in a cavity of the metal mold, and a portion of the base to be exposed from the cavity is clamped vertically; a sealing step of supplying resin; and a step of cutting the burr-bearing leads from the base in the lead frame after the resin is hardened. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a resin-encapsulated semiconductor device, and more particularly to a method for producing a resin-encapsulated semiconductor device having connection leads exposed from the encapsulated resin and a resin-encapsulated semiconductor device using the production method.

  A conventional resin-encapsulated semiconductor device is disclosed in Patent Document 1 as a semiconductor device. In this resin-encapsulated semiconductor device, a resin burr (resin burr) 12 is formed along a lead (connection lead) 7.

  Another structure of the resin-encapsulated semiconductor device is shown in FIGS. In this resin-encapsulated semiconductor device, a part of the base is sealed with resin, and connection terminals extending from the base are connected to the outside.

In this conventional resin-encapsulated semiconductor device, a mold is used as shown in FIG. The mold is provided with a groove for leading out the connection lead from the space (cavity) into which the resin is injected, and the leading connection lead is clamped (position A shown in FIG. 6). This prevents the resin supplied into the mold from flowing out of the clamp position.
JP 2003-17643 A

  However, although the conventional resin-encapsulated semiconductor device clamps the connection lead at the position A shown in FIG. 6, a resin burr may occur along the connection lead in the region B shown in FIG.

  This is because the resin is not leaked by clamping, but the groove shape formed according to the bent shape of the connection lead derived from the mold cavity, that is, the groove relief formed according to the bent shape This is probably because the resin that is press-fitted flows out along the connection lead due to a slight gap caused by the above.

  Also, even if the mold is accurately formed according to the bent shape of the connecting lead without performing relief processing in the groove, it becomes susceptible to deterioration over time due to wear of the mold in the groove and gradually causes resin burrs. It will be.

  As described above, it is difficult to prevent the occurrence of resin burrs, and even if the resin burrs are generated, it is preferable that the resin burrs are formed only at desired positions. A method for manufacturing such a resin-encapsulated semiconductor device Was desired.

  In view of the above circumstances, an object of the present invention is to provide a method for manufacturing a resin-encapsulated semiconductor device in which a resin burr can be formed only at a desired position, and a resin-encapsulated semiconductor device using the manufacturing method.

  The present invention was devised to achieve the above object, and in a method of manufacturing a resin-encapsulated semiconductor device having a connection lead in which a portion exposed from a resin is bent, a base that partially exposes the resin from the resin is disclosed. A base, a tie bar provided at a position facing the base, a pair of burr receiving leads extending from the base to the tie bar and receiving a resin burr, and a base to tie bar between the pair of burr receiving leads A step of preparing a lead frame integrally formed with a connection lead extending without contacting the tie bar toward the tie bar, and arranging the lead frame in the mold and sealing the portion of the base to the mold A process of clamping the part exposed from the cavity from above and below, a sealing process of supplying the resin in a state where a part of the base is accommodated, and a lead frame after the resin is cured In arm, characterized in that it comprises a step of cutting between receiving burrs from the base lead, the.

The lead frame may be integrally formed so as to include a burr receiving bar that is continuous between the pair of adjacent burr receiving leads.
Further, at least one of the connection leads may be extended from the base.

  In a resin-encapsulated semiconductor device having a connection lead exposed from a resin for sealing, a base that exposes a part from the resin, a tie bar provided at a position facing the base, and from the base to the tie bar A pair of burr receiving leads extending to receive the resin burr and a connecting lead extending from the base toward the tie bar without contacting the tie bar between the pair of burr receiving leads are integrally formed. The lead frame is placed in the mold, the part to be sealed of the base is accommodated in the mold cavity, and the resin is supplied with the part exposed from the cavity clamped from above and below, and the lead after resin curing The frame is formed by cutting between the base and the burr receiving lead.

  According to the present invention, a base that partially exposes the resin, a tie bar provided at a position facing the base, and a pair of burrs that extend from the base to the tie bar and receive the resin burr. A lead frame in which a receiving lead and a connecting lead extending without contacting the tie bar from the base toward the tie bar between the pair of burr receiving leads are integrally formed is disposed in the mold. Place the part to be sealed in the mold cavity and supply the resin with the part exposed from the cavity clamped from above and below, and cut between the base and the burr receiving lead in the lead frame after resin curing Thus, a resin-encapsulated semiconductor device is formed.

  As a result, even when the resin flows out from the side surface of the base where it is difficult to obtain a clamping effect during resin sealing, the resin that has flowed out follows the burr receiving bar extending from the base. The resin that has flowed out along the burr receiving lead is cured to become a burr. Therefore, according to the present invention, when the resin flows out from the cavity, it is possible to form a burr limitedly at a desired portion. For example, the connection lead functioning as a terminal in the completed resin-encapsulated semiconductor device. The burr is not formed, and a defect caused by the burr can be prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same components are denoted by the same reference numerals in the drawings used in the embodiments, and overlapping descriptions are possible. Omitted as much as possible.

  As shown in FIGS. 1 and 2, the resin-encapsulated semiconductor device 10 of the present invention includes connection leads 21 exposed from a resin portion (resin) 1 for encapsulation, and the resin-encapsulated semiconductor device 10. Are formed by using a lead frame 20 for forming a plurality at once.

  The lead frame 20 is formed by press-forming a conductive plate member such as copper, whereby parts such as a connection lead 21, a base 22, a tie bar 23, a burr receiving lead 24, and a reinforcing lead 26, which will be described later, are integrated. Formed. In addition, a plating process is performed after press formation.

  The lead frame 20 includes a base 22 that is partially exposed from the resin portion 1, a tie bar 23 provided at a position facing the exposed base 22, and extends from the base 22 to the tie bar 23. A pair of burr receiving leads 24 that receive burrs of the cage resin portion 1, a connecting lead 21 that extends from the base 22 toward the tie bar 23 without contacting the tie bar 23, and a pair of adjacent burr receiving leads 24 between the pair of burr receiving leads. The burr receiving bar 25 is formed between the burr receiving leads, and the reinforcing lead 26 extends between the burr receiving bar 25 and the tie bar 23.

  The base 22 has a rectangular shape, one end of which is sealed by the resin portion 1 and the other end is exposed from the resin portion 1. The base 22 is electrically connected to a semiconductor chip (not shown) at one end sealed by the resin portion 1. The end surface of the other end of the base 22 is formed to be parallel to the surfaces extending in the longitudinal direction of the tie bar 23 and the burr receiving bar 25.

  A connection lead 21 is formed on the end surface of the other end of the base 22 exposed from the resin portion 1 so as to extend from the center of the end surface, and the bottom surface of the base 22 is the bottom surface of the resin-encapsulated semiconductor device 10. It is bent halfway so that it becomes the same height. The connection lead 21 functions as a terminal for electrical connection with the outside, and solder is used for the connection.

  The connection lead 21 extending from the base 22 has a tip end surface parallel to the longitudinal direction of the tie bar 23, and the tip does not reach the tie bar 23 and is separated from the tie bar 23.

  Therefore, since the connection lead 21 is separated from the tie bar 23, the entire lead can be plated in advance. That is, since the connection lead 21 of the present invention is not formed through a cutting step as in the conventional resin-encapsulated semiconductor device as shown in FIG. 5, the portion to be plated due to the cutting is not exposed. Thereby, the connection lead 21 of this invention can obtain a favorable connection in the connection with the exterior using a solder.

  A pair of burr receiving leads 24 extending from both ends of the end surface to the tie bar 23 are formed on the end surface of the other end of the base 22 exposed from the resin portion 1. More specifically, a connection lead 21 extending from the center of the end surface of the other end of the base 22 and a burr receiving lead extending from both sides of the end surface of the other end of the base 22 sandwiching the connection lead 21 at an interval. 24 and both are spaced in parallel toward the tie bar 23 with a predetermined distance from each other.

  The burr receiving bar 25 extends in parallel with the tie bar 23 between the opposite burr receiving leads 24 so as to form a pair of adjacent burr receiving leads 24. In the resin sealing step in the manufacturing method described later, The resin that flows out from the unclamped portion of the mold is received by itself, and the discharged resin is prevented from adhering to the connection lead 21.

  Similarly to the burr receiving bar 25 described above, the burr receiving lead 24 itself receives the resin flowing out from the unclamped portion of the mold in the resin sealing process, and the discharged resin adheres to the connection lead 21. To prevent.

  In addition, in the lead frame 20 for collectively forming a plurality of resin-encapsulated semiconductor devices 10, the resin that has flowed out may adhere to the burr receiving leads 24 located at both ends of the burr receiving bar 25. Even in such a case, the resin that flows out is received by itself and the resin is prevented from adhering to the connection lead 21.

  Furthermore, in the lead frame 20, the resin that has flowed out may also adhere to the burr receiving leads 24 that are located on the inner side of the both ends. Even in such a case, the resin that has flowed out to the burr receiving leads 24 There is a distance until the connection lead 21 is reached, and the resin hardens before reaching the connection lead 21, thereby preventing the resin from adhering to the connection lead 21.

  A reinforcing lead 26 is provided between the burr receiving bar 25 and the tie bar 23, and the burr receiving bar 25 and the burr receiving lead 24 with which the burr receiving bar 25 is coupled are prevented by the reinforcing lead 26. I am trying.

  The resin part 1 is a conventionally known epoxy-based thermosetting resin, and has insulating properties and moisture resistance.

As shown in FIG. 3, the resin portion 1 is formed by using, for example, a mold 40 that is vertically divided into two.
The mold 40 has a space called a cavity 41 having a desired shape. Resin is supplied into the cavity 41 and the resin portion 1 is formed by curing the resin. The mold 40 is provided with a groove 42 (notch) for accommodating a part of the lead frame 20 in the cavity 41 and leading out a part of the lead frame 20 to the outside of the cavity 41.

  The groove 42 of the mold 40 is formed so as to correspond to a part of the base 22 of the lead frame 20 and the shape of the connection lead 21, the burr receiving lead 24 and the burr receiving bar 25 extending from the base 22. These portions are outside the cavity 41 and are not sealed with resin.

  Incidentally, the groove 42 for leading a part of the lead frame 20 out of the cavity 41 needs to be formed according to the shape of the lead frame 20. Specifically, as shown in FIGS. 2 and 3, the connection lead 21, the burr receiving lead 24, and the burr receiving bar 25 are bent, and due to this bent shape, the groove is added with a dimensional margin called relief. 24 is formed.

  In the case where there is no clearance or there is little dimensional allowance, the use of the mold 40 causes wear, which causes the groove 42 and the lead frame 20 disposed in the groove 42 to be worn. A gap is gradually formed between them.

  In the case as described above, the resin supplied into the cavity 41 may flow out of the gap between the groove 42 and the lead frame 20 disposed in the groove 42. Specifically, the resin supplied at a high pressure into the cavity 41 flows out from the gap with the groove 42 along the side surface of the base 22 or the burr receiving bar 25, and the outflowed resin flows into the side surface of the base 22 or There is also a possibility that it adheres to the burr receiving bar 25 and possibly adheres to the side surface of the burr receiving lead 24 extending from the end surface of the other end of the base 22.

  Incidentally, a part of the lead frame 20 is clamped up and down at a position A shown in FIG.

  Therefore, even if the resin supplied into the cavity 41 flows out of the cavity 41, it is difficult to adhere to the front and back surfaces of the base 22 being clamped. In addition, in the burr receiving leads 24 extending from both sides of the end surface of the other end of the base 22, the resin hardly adheres to the front and back surfaces.

  This is because even if the front and back surfaces of the burr receiving lead 24 are not clamped, the resin flowing out to the burr receiving bar 25 and the burr receiving lead 24 along the side surface of the base 22 reduces its momentum. The resin does not have a momentum to reach the front and back surfaces of the burr receiving lead 24, and as a result, the resin hardly adheres to the front and back surfaces of the burr receiving lead 24.

Next, a method for manufacturing the resin-encapsulated semiconductor device 10 of the present invention will be described.
First, the connection lead 21 and the burr receiving lead 24 extend from the base 22, and a burr receiving bar 25 for connecting the burr receiving lead 24 and a tie bar 23 parallel to the burr receiving bar 25 are provided. Is prepared integrally.

  Next, the prepared lead frame 20 is placed in the mold 40 described above. At this time, the base 22 is arranged so that a part of the base 22 is led out from the cavity 41. Thereby, a part of the base 22, the connection lead 21 and the burr receiving lead 24 extending from the base 22, the tie bar 23, and the burr receiving bar 25 are arranged so as to be located outside the cavity 41. .

  Note that the lead frame 20 disposed in the mold 40 is clamped up and down at a position A shown in FIG.

Thereafter, the resin is supplied into the mold (inside the cavity 41).
At this time, the resin is injected into the cavity 41 at a high pressure of 10 to 20 MPa.

  Thereby, the resin supplied at a high pressure may flow out from the side surface of the base 22 that is not clamped. In this case, the resin that has flowed out flows along the side surface of the base 22, and further flows out along the side surface of the burr receiving lead 24 that extends from the side surface of the base 22 and both sides of the end surface of the other end of the base 22. To do. In some cases, the resin that has flowed out may further travel from the side surface of the burr receiving lead 24 to the side surface of the burr receiving bar 25.

  However, even if the resin that has flowed out adheres to the side surface of the base 22, the side surface of the burr receiving lead 24, and the side surface of the burr receiving bar 25, it does not adhere to the connection lead 21. This is due to the positional relationship between the resin outflow path and the connection lead 21.

  That is, the resin that has flowed out of the cavity 41 first flows along the side surface of the other end of the base 22, and the flowed resin further flows out to the side surface of the burr receiving bar 25 that follows the other end of the base 22. Further, in some cases, it also flows out to the side surface of the burr receiving lead 24 extending from the end surface of the other end of the base 22, more specifically, to the outer side surface of the pair of burr receiving leads 24 facing each other via the connection lead 21. There is a fear. However, since the resin that has flowed out is away from the connection lead 21 at any position, the resin that has flowed out is cured before reaching the connection lead 21, and the resin that has flowed out does not adhere to the connection lead 21.

Next, when the resin injected into the cavity 41 of the mold 40 is cured, the mold 40 is removed.
Thereafter, the resin-encapsulated semiconductor device 10 is separated from the lead frame 20 at a location indicated by a broken line in FIG.

  By the way, in the present invention, when the resin-encapsulated semiconductor devices 10 are separated from the lead frame 20, there is no need to cut the connection leads 21, and the metal bars are not exposed at the connection leads 21. Therefore, since the connection lead 21 functioning as a terminal is plated throughout and there is no portion that is not plated, a good connection can be obtained in connection with the outside using solder.

  In particular, the cutting on the base 22 side will be described in detail. The cutting position is the base 22 and the end surface of the other end of the base 22, and the burr receiving lead 24 extending from the base 22 is cut off at this end surface. . Thereby, the resin-encapsulated semiconductor device 10 can be manufactured without attaching the resin to the connection lead 21 (forming a resin burr).

1 is a perspective view of a resin-encapsulated semiconductor device of the present invention. It is a top view of the resin sealing semiconductor device of this invention. It is metal mold | die sectional drawing for demonstrating the manufacturing method of the resin sealing semiconductor device of this invention. It is a perspective view of the conventional resin-encapsulated semiconductor device. It is a top view of the conventional resin-encapsulated semiconductor device. It is metal mold | die sectional drawing for demonstrating to the manufacturing method of the conventional resin-encapsulated semiconductor device. It is a top view which shows the cutting location at the time of manufacturing the resin-encapsulated semiconductor device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin part 10 Resin sealing semiconductor device 20 Lead frame 21 Connection lead 22 Base 23 Tie bar 24 Burr receiving lead 25 Burr receiving bar 40 Mold 41 Cavity 42 Groove

Claims (4)

In the method for manufacturing a resin-encapsulated semiconductor device having a connection lead where a portion exposed from the resin is bent,
A base that partially exposes the resin; a tie bar provided at a position facing the base; a pair of burr receiving leads that extend from the base to the tie bar and receive a burr of the resin; Preparing a lead frame integrally formed with the connection lead extending from the base toward the tie bar without contacting the tie bar between a pair of burr receiving leads;
Placing the lead frame in a mold, accommodating a part to be sealed of the base in a cavity of the mold and clamping a part exposed from the cavity from above and below;
A sealing step of supplying resin in a state in which a part of the base is accommodated;
A method of manufacturing a resin-encapsulated semiconductor device, comprising: a step of cutting between the burr receiving leads from the base in a lead frame after resin curing.   2. The method of manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein the lead frame is integrally formed so as to include a burr receiving bar that is connected between the pair of adjacent burr receiving leads. .   The method for manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein at least one of the connection leads extends from the base. In a resin-encapsulated semiconductor device having a connection lead exposed from the resin for encapsulation,
A base that partially exposes the resin; a tie bar provided at a position facing the base; a pair of burr receiving leads that extend from the base to the tie bar and receive a burr of the resin; A lead frame formed integrally with the connection lead extending without contacting the tie bar from the base toward the tie bar between the pair of burr receiving leads is disposed in the mold, The part to be sealed is housed in the cavity of the mold and the part exposed from the cavity is clamped from above and below, and the resin is supplied, and in the lead frame after the resin is cured, the base and the burr receiving lead are cut. A resin-encapsulated semiconductor device comprising:

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