JP2010000419A - Method for forming pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming a pattern having a desired shape of a high aspect ratio while dispensing with complicated steps, and a method and an apparatus for manufacturing an electronic apparatus or an optical apparatus by using the method for forming the pattern. <P>SOLUTION: The method for forming the pattern comprises the steps of: applying an electric field and/or a magnetic field to a negative pattern consisting of two or more substances different in dielectric constant and/or magnetic susceptibility so that coarse and dense differences of lines of electric and/or magnetic force are made to arise near the negative pattern; and moving at least one fluid substance along the coarse and dense differences of the lines of electric and/or magnetic force to form a desired positive pattern; further making at least a part of the fluid substance intrude into the inside of the negative pattern to form the positive pattern; and solidifying the positive pattern formed from at least a part of the fluid substance. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides a pattern forming method for forming a pattern (solid matter) having a desired shape by applying an electric field and / or a magnetic field to a fluid substance, and an electronic device or an optical device using the pattern forming method. The invention relates to a method of manufacturing a device.

As a conventional pattern forming method, for example, pattern processing such as photolithography and etching is widely used. In particular, in the field of semiconductors, miniaturization of electronic devices typified by integrated semiconductor circuits has progressed and multilayer structures have been developed. There is an increasing need for electronic devices. When this multilayer structure is formed by photolithography and etching, a large number of processes including masking are required, and various proposals have been made to reduce the cost by reducing this process. For example, in the manufacturing process proposed in Patent Document 1, the cost is reduced by reducing the number of necessary masks.
In addition, in an optical apparatus, a method of manufacturing a microlens pattern constituting a CCD camera by a mold or photolithography is used. However, it is costly to form a fine and specular pattern with a mold. Also, photolithography has the above-mentioned problems.

  Regarding the technology using a magnetic field, it is known that a magnet attracts Fe, Ni, Co, etc. for a substance having a large interaction with a magnetic field, such as a ferromagnetic material, and there have been many practical examples. To do.

On the other hand, weak magnetic materials such as glass, paper, and water have no spontaneous magnetization, and magnetic interaction induced by a magnetic field is very small, so that a force that can be used for mass transfer does not occur. Therefore, a technique of using a weak magnetic substance by transferring a substance by a magnetic field is hardly used.
However, when a strong magnetic field is used, the magnetic interaction induced in the magnetic field increases, so when a strong magnetic field is applied to a fluid substance, the drive changes its shape even for a weak magnetic material. helpful. Examples of such a technique using a strong magnetic field include a crystal growth method using a magnetic Archimedes effect (see Patent Document 2), and a method of aligning crystals having magnetic anisotropy so that crystal axes are aligned (Patent Document 3). And a method of changing the substance interface (see Patent Document 4), a method of simultaneously arranging different kinds of fine particles using a magnetic field (see Patent Document 5), and the like.
JP 06-283525 A JP 11-335200 A JP 2003-342100 A JP-A-8-323192 JP 2006-212616 A

  The invention disclosed in Patent Document 1 is intended to reduce the cost of a conventional pattern formation method using photolithography or etching, but is merely an improvement of a part of the prior art. Therefore, various complicated processes such as mask alignment, exposure, development, and cleaning are still required, and it cannot be expected that the cost for pattern formation will be significantly reduced. There is also a problem with the treatment of waste liquid resulting from these steps.

  On the other hand, with regard to the technique for applying a magnetic field to a weak magnetic material, both Patent Document 2 and Patent Document 3 control the crystal growth direction using a strong magnetic field. It is not something to let you.

  Patent Document 4 discloses a technique for changing the position of the interface of a fluid substance by a magnetic field response. However, the technique treats a substance in a fluid state and stops application of a magnetic field. The change of the interface cannot be maintained, and the shape of the interface cannot be preserved. Therefore, in order to apply this technique, it is necessary to always apply a magnetic field, and the application field is also limited.

  Patent Document 5 discloses a method of arranging fluid particles close to a negative pattern made of two or more substances having different magnetic susceptibility by arranging a magnetic field at an arbitrary position along the negative pattern. ing. However, in the present invention, for example, a positive pattern with a high aspect ratio in which particles are stacked in a direction away from the position of the negative pattern cannot be formed, and there is a limit to the shape that can be formed.

  Accordingly, an object of the present invention is to solve the above-mentioned problems and to apply a magnetic field and / or an electric field to a solidified fluid substance, or to apply a gravity and a magnetic field, a gravity and an electric field, or a gravity, a magnetic field and an electric field. The pattern forming method capable of forming a pattern having a desired shape with a high aspect ratio without requiring various complicated steps, a method for manufacturing an electronic device or an optical device using this pattern forming method, and An object of the present invention is to provide an apparatus for manufacturing an electronic device or an optical device using this pattern forming method.

As a result of intensive research to solve the above problems, the present inventors can solidify by applying an electric field and / or a magnetic field to negative patterns formed of materials having different dielectric constants and / or magnetic susceptibility. The flowable substance is moved by electric and / or magnetic force to form a desired shape, and at least a part of the flowable substance that can be solidified enters the inside of the negative pattern. By solidifying the material having the property, it was found that the shape of the material having the fluidity was fixed to form a desired shape pattern having a high aspect ratio, and the present invention was completed.
Here, as the “inside of the negative pattern”, for example, a concave portion or a hollow portion of the negative pattern can be exemplified, and a part of a material having fluidity formed by the negative pattern and entering from the opening can enter. Any space is applicable if it is an internal space.

  It is also possible to form a positive pattern while changing the position of the negative pattern and the substance having fluidity. For example, the negative pattern formed in a pen shape is changed to an arbitrary pattern on the surface of the substance having fluidity. It has been found that an arbitrary shape can be freely formed by moving and solidifying sequentially, and the present invention has been completed.

In addition, the specific gravity difference with a fluid material that forms a positive pattern is smaller than that of air, and the fluidity has a larger difference in dielectric constant and / or magnetic susceptibility with the fluid material that forms a positive pattern than air. By using a certain material, buoyancy assists the movement of the fluid material that forms a positive pattern, and further increases the difference in dielectric constant and / or magnetic susceptibility, thereby reducing the electric force and / or magnetic force. It has been found that the transfer of a fluid substance that forms a positive pattern can be enhanced to increase the movement of the desired pattern, and the pattern can be formed in a shorter time, thereby completing the present invention.
Furthermore, the present inventors have also found out that a desired pattern is formed on an electronic device or an optical device using the pattern forming method described above, and a manufacturing device that forms a desired pattern on the electronic device or the optical device, thereby completing the present invention. It was.

According to one embodiment of the pattern forming method of the present invention, a complicated process for forming a pattern is not required and a low cost can be achieved in a short time compared with a conventional pattern forming method using photolithography or etching. A pattern having a desired shape can be formed, and there is no need for waste liquid treatment, which is advantageous in terms of environment.
In addition, since the pattern is formed by allowing at least a part of the fluid substance to enter the negative pattern, the aspect of the conventional pattern having the fluidity can be improved by using an electric field and / or a magnetic field. Since a pattern with a high ratio can be formed, the width of the pattern that can be manufactured is widened.

Further, according to another embodiment of the pattern forming method of the present invention, the specific gravity difference with a fluid material that forms a positive pattern is smaller than air, and the fluid material that forms a positive pattern than air. By using a fluid material having a large difference in dielectric constant and / or magnetic susceptibility with a weak electric or magnetic field using a weaker electric field and / or magnetic field than using a single fluid material It is a pattern forming method that can obtain a desired pattern from a substance having fluidity in the body, can reduce equipment and manufacturing costs, and is advantageous in terms of safety.
Furthermore, also in the manufacturing method and manufacturing apparatus of an electronic device or an optical device using the pattern forming method of the present invention, the same effect as described above can be obtained.

General Description First, a general description of an embodiment of a pattern forming method of the present invention and a method for manufacturing an electronic device or an optical device using the pattern forming method will be given.
In the first embodiment of the pattern forming method of the present invention, an electric force and / or a magnetic field is applied to a negative pattern made of two or more substances having different dielectric constants and / or magnetic susceptibilities to thereby generate an electric force in the vicinity of the negative pattern. Forming a density difference between lines and / or lines of magnetic force, moving a fluid substance along the density difference between the lines of electric force and / or lines of magnetic force by electric force and / or magnetic force, and then flowing the substance Is formed into a positive pattern (solid matter) of a desired shape, and at least a part of the fluid material penetrates into the negative pattern to form a pattern with a high aspect ratio. Can do.
Here, the description of A and / or B in this specification includes the case of A alone, the case of B alone, and the case of A and B.

(Method of making the density difference of electric field lines and / or magnetic field lines arbitrary distribution)
The density difference between the electric lines of force and / or magnetic lines of force can be generated using a negative pattern made of two or more substances having different dielectric constants and / or magnetic susceptibility. This is a method using the phenomenon of being sucked into a material having a relatively high rate and / or magnetic susceptibility.
Here, FIG. 1 is a side view of the state of the electric lines of force and / or lines of magnetic force 4 when an electric field and / or magnetic field is applied to a negative pattern composed of the substances 1 and 2. The dielectric constant and / or magnetic susceptibility of the material 2 is relatively larger than the dielectric constant and / or magnetic susceptibility of the substance 2.

  As shown in FIG. 1, when an electric field and / or magnetic field is applied to a negative pattern produced by alternately arranging substances having different dielectric constants and / or magnetic susceptibility from the direction of the arrow 3 which is the normal direction, Alternatively, the magnetic field lines 4 are sucked into the substance 1 having a relatively high dielectric constant and / or magnetic susceptibility. In FIG. 1, the dark part is a part with high electric flux density and / or magnetic flux density, and the light part is a part with low electric flux density and / or magnetic flux density. As shown in FIG. 1, when a substance having fluidity is placed in a field having a density difference in electric flux density and / or magnetic flux density, an electric force and / or magnetic force corresponding to the density difference is received. A substance having fluidity moves in a shape substantially along the density difference of the bundle density and / or the magnetic flux density.

(Method of patterning a material having fluidity due to the difference in density between electric field lines and / or magnetic field lines)
FIG. 2 is a diagram schematically showing a state in which a substance having fluidity is left in the vicinity of the negative pattern, where the dielectric constant and / or magnetic susceptibility of the substance having fluidity is the dielectric constant of air. And / or when the magnetic susceptibility is relatively larger than the magnetic susceptibility (see FIG. 2 (a)), the liquid surface 6 is attracted to the portion 5 having a high electric flux density and / or magnetic flux density above the substance 1, In the region of the substance 1, a undulating pattern that forms a mountain is formed. On the other hand, when the material permittivity and / or magnetic susceptibility having fluidity is relatively smaller than the dielectric constant and / or magnetic susceptibility of air (see FIG. 2B), the material having fluidity is: By receiving a repulsive force from the portion 5 having a high electric flux density and / or high magnetic flux density above the substance 1, a undulation pattern having a valley in the area of the substance 1 is formed on the liquid surface 7.

  As described above, a substantially reversed pattern can be formed depending on whether an object having fluidity has a relatively higher dielectric constant and / or magnetic susceptibility than air.

  Further, when the substance having fluidity is a mixture of three or more particles having different dielectric constants and / or magnetic susceptibility, as shown in FIG. 22, by using an inclined negative pattern, gravity and dielectric constant and / or Three or more particles can be patterned at positions where the magnetic susceptibility is balanced.

(Method of forming high aspect ratio pattern)
Since a conventional negative pattern made of two or more materials having different dielectric constants and / or magnetic susceptibility is formed in a substantially plate shape, a material having fluidity is formed by flowing by electric force and / or magnetic force. The pattern is formed on the surface of the negative pattern. Further, since the density difference between the electric lines of force and / or the lines of magnetic force is alleviated when they are separated from the negative pattern, as shown in FIG. 3, the pattern is formed at a distance 9 that is approximately 1 or more times the pattern width 8 of the negative pattern. Is difficult to form.

As shown in FIG. 4A, the negative pattern according to the present invention has a cavity 10 inside and an opening 11 with respect to the surface. The material having fluidity can be caused to flow inside the cavity by an electric force and / or a magnetic force, thereby forming a pattern 12 having a shape substantially conforming to the shape of the cavity.
For example, by using a negative pattern having an elongated cavity, a pattern 12 having a high aspect ratio that cannot be produced by a conventional method using an electric field and / or a magnetic field can be formed. Since the pattern 12 receives electrical and / or magnetic repulsive force from the negative pattern, the negative pattern and the pattern 12 are not in contact with each other, and the pattern 12 is a positive pattern smaller than the negative pattern.

  Further, in the negative pattern according to the present invention, since a positive pattern smaller than the negative pattern is formed, the reverse taper-shaped positive pattern 12 as shown in FIG. 5A or as shown in FIG. Shapes such as mushroom-shaped positive pattern 12 that could not be removed by conventional molds can also be produced.

  As described above, in the present invention, shapes that could not be punched by the conventional method can be collectively formed.

(Method of forming patterns with different shapes by changing the direction of application of an electric field and / or magnetic field to a negative pattern)
FIG. 1 shows an example in which a fluid substance is located on a surface where electric lines of force and / or magnetic lines of force and a negative pattern are substantially orthogonal to each other, but FIG. 6 shows electric lines of force and / or magnetic lines of force. An example is shown in which a fluid substance is located on a surface that is substantially parallel to the negative pattern.

  As shown in FIG. 6 (a), the substance 7 having fluidity having a dielectric constant and / or magnetic susceptibility relatively smaller than air cannot enter the cavity 10 having a high electric flux density and / or magnetic flux density. . On the other hand, as shown in FIG. 6B, the substance 6 having fluidity having a dielectric constant and / or a magnetic susceptibility relatively higher than that of air can enter the cavity 10. In this case, since the substance 6 does not receive an electric and / or magnetic repulsive force from the negative pattern, it adheres to the negative pattern.

  Three or more materials having different dielectric constants and / or magnetic susceptibility to form a negative pattern as described above can be used, and the electric force according to the difference in the dielectric constant and / or magnetic susceptibility of each material and its shape. Lines and / or magnetic field lines are sucked in, and a density difference between electric field lines and / or magnetic field lines is formed.

  A desired electric flux density and / or magnetic flux density distribution can be obtained by concentrating the electric lines of force and / or magnetic lines of force by the method as described above. In addition, an electric field and / or a magnetic field can be applied from any direction, and a part of the pattern is sequentially solidified while the electric field and / or the magnetic field is switched, or the application direction and intensity of the electric field and / or the magnetic field are changed over time. However, it is also possible to form a pattern and solidify part or all of it.

  In the present invention, any material that can be solidified can be used as the fluid material that forms a positive pattern, and can be selected from molten solids, powders, liquids, gases, and the like. Two or more can be used in combination. Moreover, when combining 2 or more, a pattern can also be obtained by solidifying at least one.

  As the solid in the molten state, it is possible to use a hot-melt type resin, a low melting point metal, or the like. In the case of a low melting point metal, it is preferably applied to the formation of solder bumps (metal protrusions) for electrical connection of electronic devices. can do.

  It is also possible to use a powder having fluidity as a material having fluidity to form a positive pattern, which can be solidified by frictional resistance of the powder, solidified by sintering, or solidified by powder. It is also possible to obtain a pattern by solidifying the liquid after patterning only the powder or the powder and the liquid after being dispersed in the liquid.

As a material having fluidity for forming a positive pattern, it is possible to use a liquid, which can be solidified by cooling or a liquid prepolymer, and in particular, a pre-solidified with active energy rays. When a polymer is used, a desired pattern can be obtained in a short time. In this case, since it can be solidified in a short time, the time during which the magnetic field is continuously applied can be shortened. Further, since heating is not particularly required, it is advantageous in the development to a non-heat resistant material.
Further, only a desired region can be solidified by using a mask that shields the irradiation of active energy rays.

  A gas can be used as the material having fluidity to form a positive pattern, and can be solidified by cooling or vapor deposition.

  As another embodiment of the pattern forming method of the present invention, the fluid substance includes two or more fluid substances, and an electric field and / or a magnetic field is applied to the fluid substance to form a pattern having a desired shape. It is conceivable to solidify at least one of the fluid substances after forming the film.

  In the present embodiment, as shown in FIG. 7, by using two or more fluid substances having different dielectric constants and / or magnetic susceptibilities together, the electrical generated between the two or more fluid substances is generated. And / or the difference in the interaction between magnetic attraction and repulsion is added as the driving force for fluid mass transfer.

In this case, by combining the substance 7 having a fluidity higher than that in the case of air with a difference in dielectric constant and / or magnetic susceptibility between the substance 7 and the fluidizing substance 7 to be solidified, Rather than doing, the flow of fluid material is enhanced. In addition to the method of using a liquid as the flowable substance 11, it is also conceivable to use a high-pressure gas as a method of increasing the relative difference in dielectric constant and / or magnetic susceptibility. In this case, by selecting a gas that has a larger difference in dielectric constant and / or magnetic susceptibility with a fluid material that forms a positive pattern than air, a material that is more fluid than in air The difference in dielectric constant and / or magnetic susceptibility can be increased.
In addition, as one of the modes in which the substance 11 having a dielectric constant and / or magnetic susceptibility different from that of the substance 7 exists in the cavity 10, not only the case of using the liquid or gas described above, but also the inside of the cavity 10 is evacuated. Is included (no substance is present).

  In addition to the enhancement of the movement of the fluid substance due to the electric field and / or magnetic field response, the effect of buoyancy by the fluid substance can also be added. The smaller the specific gravity difference between the fluid substances, the more effective, and the movement of the fluid substance can be assisted. Further, when a fluid substance that enhances the movement of the substance is located above the liquid that forms the pattern, there is a positional relationship between the fluid substance that forms the pattern and the fluid substance that enhances the movement. It is preferable to use a substance having a large specific gravity of a fluid substance that enhances movement within a range not reversing.

  By using the method as described above, a material having a low dielectric constant and / or magnetic susceptibility can be moved with a weak magnetic field generated by a permanent magnet and / or a weak electric field generated by a normal power source.

  As another embodiment of the pattern forming method of the present invention, as shown in FIG. 8, there is a case where the fluid substance is a liquid and the substrate serving as a base for forming the pattern is in contact with the liquid. Conceivable. At this time, the contact angle θa between the surface 12 of the portion that collects the liquid by electric force and / or magnetic force and the liquid, and the surface between the surface of the portion 13 that repels the liquid by electric force and / or magnetic force and the liquid. When the contact angle θb is in a relationship of θa <θb, the movement of the liquid by an electric field and / or a magnetic field can be assisted by the wettability of the liquid.

  Further, in the case where the liquid includes two liquids, the contact angle between the first liquid and the substrate surface of the portion that collects the first liquid by electric and / or magnetic force is θc, and the first liquid and The contact angle between the other portion of the substrate surface is θd, the contact angle between the second liquid and the portion of the substrate surface that collects the first liquid by electric and / or magnetic force is θe, When the contact angle between the liquid and the substrate surface of the other part is θf, when θc, θd, θe, θf are in a relationship of θc−θd <θe−θf, The movement of the second liquid by electric and / or magnetic forces is advantageously enhanced by the wettability of the liquid.

  When the flowable substance includes two liquids, when the first liquid is applied to the substrate and then the second liquid is applied, the layer of the first liquid is in contact with the surface of the substrate and the interfacial tension is applied. In the range in which the layer made of the first liquid and the layer made of the second liquid are not reversed with respect to the substrate surface, it is preferable that the specific gravity of the second liquid is larger. With regard to the relationship between the dielectric constant and / or magnetic susceptibility χ and the specific gravity ρ, the enhancement effect of liquid movement increases as Δχ / Δρ increases. In this case, it is preferable that the first liquid and the second liquid are substantially insoluble.

  By the method exemplified above, a fluid substance can be moved using a weak electric field and / or magnetic field. When two or more fluid substances are used, at least one substance can be solidified to form a pattern and the remaining fluid substances can be removed, or all fluid substances can be removed. It can be solidified to obtain a pattern. After solidification, the pattern produced by the method shown in this embodiment can be peeled from the substrate to obtain only the pattern.

  As another embodiment of the pattern forming method of the present invention, it is conceivable to form a pattern having two or more layers by repeating the above pattern forming method. According to the present embodiment, a pattern having a plurality of layers can be obtained without repeating many conventional processes.

As another embodiment of the present invention, it is conceivable to form a desired pattern on an electronic device using the pattern forming method described above.
According to this embodiment, a desired pattern can be formed on an electronic product by using any of the above pattern forming methods. As a pattern to be formed, an arbitrary pattern is conceivable. For example, in an electronic device manufacturing method, an insulator including a semiconductor may be formed, a conductor such as a metal electrode or wiring, or plating. It is also conceivable to form a metal pattern by patterning a nucleus and plating it on the nucleus.

As another embodiment of the present invention, it is conceivable to form a desired pattern on the optical device using the pattern forming method described above.
According to the present embodiment, a desired pattern can be formed on the optical device by using any of the above pattern forming methods. As the pattern to be formed, an arbitrary pattern is conceivable. For example, it is conceivable to form an opening of a sensor, a waveguide, a diffusion plate, a reflection plate, or the like.

  Also, an apparatus or system for manufacturing an electronic device that forms a desired pattern on an electronic device using the pattern forming method described above, or an optical device that forms a desired pattern on an optical device using the pattern forming method described above. It is also possible to provide a manufacturing apparatus or a manufacturing system. In this manufacturing apparatus or manufacturing system, a negative pattern placement section for placing a substrate or a negative pattern, a fluid substance supply means for supplying a fluid substance to the substrate or the negative pattern, a substrate placed in the negative pattern placement section, An electric field / or magnetic field applying unit that applies a predetermined electric field and / or magnetic field to the negative pattern, and a pattern solidifying unit that solidifies the formed pattern as necessary.

(The invention's effect)
According to the above-described embodiment, a pattern having a desired shape can be obtained at a low cost in a short time without requiring a complicated process for forming a pattern as compared with a conventional pattern formation method using photolithography or etching. Can be formed. In addition, according to the above-described embodiment, no waste liquid is generated unlike the conventional pattern forming method using photolithography or etching, so that there is no need for waste liquid treatment, which is advantageous in terms of environment.

  In addition, according to the above-described embodiment, by using a fluid material having a different dielectric constant and / or magnetic susceptibility, a weaker magnetic field and / or electric field than using a single fluid material is used. Since a desired pattern can be obtained from a weak magnetic substance or a weak dielectric substance having fluidity, equipment and manufacturing costs can be reduced, which is advantageous in terms of safety.

  In addition, according to the above-described embodiment, in order to form a pattern by allowing at least a part of a material having fluidity to enter the negative pattern, the conventional material having fluidity is used by using an electric field and / or a magnetic field. Since a pattern having a higher aspect ratio can be formed than the method of forming a pattern, the width of the pattern that can be manufactured is increased.

  Furthermore, according to the method for manufacturing an electronic device or an optical device using the above pattern forming method, the same effects as described above can be obtained, and there are cost and time advantages as compared with the conventional method, as well as safety and environment. This is also advantageous in terms of the aspect.

Next, a pattern forming method according to the present invention, and an electronic device or an optical device using the pattern forming method will be described with reference to the drawings and tables. Specific embodiments relating to a method and an apparatus for manufacturing an electronic device or an optical device using the pattern forming method will be described. The pattern formation method using an electric field can be described in the same way, and the magnetic susceptibility, magnetic field lines, magnetic flux density, and magnetic force in the pattern formation method using a magnetic field are expressed by the dielectric constant in the pattern formation method using an electric field, The same explanation can be made by substituting with electric field lines, electric flux density, and electric force.
For pattern formation, only a magnetic field, only an electric field, or a combination of both a magnetic field and an electric field can be used in a timely manner. That is, the present invention applies an electric and / or magnetic field to a flowable substance to form the flowable substance in a desired shape by electrical and / or magnetic attraction and repulsion, and then this flowability. The present invention relates to a pattern forming method for solidifying a certain substance to obtain a pattern having a desired shape.

Here, the magnetic field (magnetic field) H (unit: AT / m = ampere-turns / meter) referred to in the present invention means a vortex field generated by the movement of charges, and exerts a force on the movement of charges. The strength of the magnetic field is expressed by magnetic flux density B (unit: T = Tesla), which is obtained by dividing the number of magnetic flux lines φ (unit: Wb = Weber) penetrating the area S (m ² ) perpendicular to the magnetic field by the area. is there.
Formula 1 B = φ / S (Wb / m ² = T)

The table of FIG. 9 shows typical magnetic field sources and their magnetic flux densities. Such a magnetic field can be generated by passing an electric current as in an electromagnet, or can be generated by aligning the direction of the magnetic moment of an electron spin of a substance as in a permanent magnet. The relationship between the magnetic flux density B and the magnetic field H is as follows in a vacuum.
Formula 2 B = μ ₀ H

Here, μ ₀ is the magnetic permeability of vacuum, which is 4π × 10 ⁻⁷ (Henry / meter = H / m) in rational units, 1 (anonymous number) in non-rational units, magnetic flux density B and magnetic field strength H Is a coefficient that connects Further, the magnetic permeability K (Henry / meter = H / m) is obtained by dividing the ratio μ between the magnetic flux density B and the magnetic field strength H when a substance is placed in a magnetic field by μ ₀ .
Formula 3 K = μ / μ ₀

The strength of the interaction of the material by the magnetic field is indicated by the magnetic susceptibility χ, and the larger the absolute value, the stronger the magnetic field is induced in the material, causing a strong magnetic interaction with the induced magnetic field. The above magnetic permeability K is a non-rational unit and the following relational expression holds.
Equation 4 K = 1 + χ

  In the following explanation, unless otherwise specified, the magnetic susceptibility χ is shown in a non-rational unit.

  Next, the magnetic susceptibility χ (cgs · emu) in a non-rational unit of a typical substance is shown in the tables of FIGS. The table of FIG. 10 shows the susceptibility of a single substance, the table of FIG. 11 shows the gram susceptibility of an organic compound, the table of FIG. 12 shows the molar susceptibility of a paramagnetic transition element, and the table of FIG. The molar magnetic susceptibility of is shown.

  As described above, the interaction between the magnetic field and the substance is determined by the strength of the magnetic field and the absolute value of the magnetic susceptibility χ, and the magnetic field is strong and the absolute value of the magnetic susceptibility χ is large (that is, the strong magnetic field and the magnetic susceptibility χ A combination of substances having a large absolute value is advantageous for pattern formation. Specifically, for example, a generally available permanent magnet (about 0.5 T) attracts Fe, Ni, and Co having a high magnetic susceptibility χ, but glass, aluminum, paper, plastic, water, etc. having a low magnetic susceptibility χ. Does not attract.

  This difference is due to the fact that materials with high magnetic susceptibility χ such as Fe, Ni, and Co (ferromagnets) are strongly magnetized and attracted strongly by magnetic fields, but glass, aluminum, paper, and plastic water have magnetic susceptibility χ. Since it is very small, it can be explained by the fact that it does not cause a strong interaction with the magnetic field to allow mass transfer.

  On the other hand, even a substance having a low magnetic susceptibility χ (weak magnetic substance) can cause mass transfer by using a strong magnetic field. Specifically, the magnetic flux density is 2T (Tesla) or more. It is preferable that it is 10T or more. Since the effect is proportional to the square of the strength of the magnetic field, the scope of application of the present invention to substances other than ferromagnetic materials is expanded by using a stronger magnetic field.

  10 to 13 exemplify materials having magnetic susceptibility χ> 0 and materials having magnetic susceptibility χ <0. The former is called a paramagnetic material and the latter is called a diamagnetic material. . In a diamagnetic material having a negative magnetic susceptibility χ, magnetization of the same pole is induced by a magnetic field, and a force acts in a direction away from the magnetic field lines. It is exactly the same as the repulsion between the north and north poles of the magnet and between the south and south poles. On the other hand, in a paramagnetic material in which the magnetic susceptibility χ has a positive value, reverse magnetization is induced by the magnetic field, and a force acts in a direction attracted to the magnetic field lines. Just like the N and S poles of the magnet attract each other.

  The magnetic field applied to a fluid substance can be applied using any magnetic field source, changing the magnetic field strength, moving or rotating the magnetic field, using a DC magnetic field, An alternating magnetic field can also be used.

<When using two liquids with different magnetic susceptibility>
Next, consider a case where a magnetic field is applied to two fluid substances having different magnetic susceptibility. In the first fluid substance and the second fluid substance that are not substantially mixed with each other, if the magnetic susceptibility χ1 of the first fluid substance and the magnetization of the second fluid substance When the ratio χ2 is in the relationship of χ1> χ2, when a magnetic field is applied to a system in which the first fluid substance and the second fluid substance are in two layers, The fluid material is attracted to the magnetic field, and the second fluid material is repelled from the magnetic field.

  More specifically, as to which of the first fluid substance and the second fluid substance is collected in the magnetic field, it is determined by a relative difference in magnetic susceptibility. In the above description, when only one fluid substance is used, it is described that the fluid substance having the magnetic susceptibility χ> 0 is attracted to the magnetic field. However, the second fluid substance is When present, the fluid material having the larger chi is relatively attracted. Even if the magnetic susceptibility χ1 of the first fluid substance is a negative value, if the magnetic susceptibility χ2 of the second fluid substance is smaller than χ1, the first fluid substance Gather in the magnetic field. That is, when the second fluid substance is repelled by the magnetic field more strongly than the first fluid substance, the first fluid substance gathers in the magnetic field. As will be described later, when the lines of magnetic force are concentrated, similarly, the first fluid substance is collected in a portion having a high magnetic flux density.

<Method of concentrating magnetic field>
As a method of concentrating the magnetic field at a predetermined position, a method of applying a magnetic field by placing a magnet processed into a predetermined shape at a predetermined position, or a method of concentrating magnetic lines of force on a substance having a higher magnetic susceptibility χ is used. be able to. In the former case, it is difficult to finely process the permanent magnet, and when the volume of the magnet is reduced, the magnetic field is weakened. Thus, it is difficult to narrow the magnetic field lines in a fine region. On the other hand, the electromagnet also needs to be made smaller in order to make the desired magnetic flux density distribution finer, and thus a limit naturally arises.

  Here, a method of selectively concentrating the magnetic field in a finer region is considered. That is, it is applied that magnetic field lines are concentrated on a material having a high magnetic susceptibility χ by applying a magnetic field to the material having a relatively high magnetic susceptibility χ.

  By applying a magnetic field to a negative pattern made of two or more substances having different magnetic susceptibility, it is possible to form a magnetic field line density difference in the vicinity of the negative pattern. A positive pattern (solid matter) having a desired shape can be formed by moving a fluid substance by a magnetic force along a density difference of magnetic field lines and then solidifying the fluid substance. At this time, a pattern having a high spectrum ratio can be formed by at least a part of the substance having fluidity entering the negative pattern.

  The density difference between the magnetic lines of force can be generated using a negative pattern made of two or more substances having different magnetic susceptibility, and is a method using a phenomenon in which magnetic lines of force are absorbed into a substance having a relatively large magnetic susceptibility.

  When a material having fluidity is left in the vicinity of the negative pattern, the material having a relatively high magnetic susceptibility than air is attracted to the high magnetic flux density portion above the material having a large negative magnetic susceptibility. On the other hand, a substance having a relatively low magnetic susceptibility than air receives a repulsive force from a portion having a high magnetic flux density above the substance having a low magnetic susceptibility, thereby forming a pattern.

  Since the conventional negative pattern composed of two or more substances having different magnetic susceptibility is formed in a substantially plate shape, the pattern formed by the flowable substance flowing by magnetic force is formed on the surface of the negative pattern. The In addition, the density difference of the magnetic lines of force is alleviated when the pattern is separated from the negative pattern. Therefore, it is difficult to form a pattern at a distance of about 1 times or more the pattern width of the negative pattern.

  Since the negative pattern according to the present invention has a cavity inside and an opening with respect to the surface, a material having fluidity is caused to flow inside the cavity by a magnetic force, and is roughly shaped into a cavity. A conformal pattern can be formed. For example, by using a negative pattern having an elongated cavity, it is possible to form a pattern with a high aspect ratio that cannot be produced by a conventional method using a magnetic field. Since the pattern receives a magnetic repulsive force from the negative pattern, the negative pattern and the pattern are non-contact, and the pattern becomes a positive pattern smaller than the negative pattern.

  Since a positive pattern smaller than the negative pattern is formed, it is also possible to produce a shape that could not be removed with a conventional mold, such as a reverse taper shape or a mushroom shape.

  Three or more substances with different magnetic susceptibility forming a negative pattern can be used. The magnetic field lines are sucked along the difference in magnetic susceptibility and the shape of each substance, and a density difference of the magnetic field lines is formed.

  A desired magnetic flux density distribution can be obtained by concentrating the magnetic lines of force by the method as described above.

  After the desired shape is obtained by moving at least one or more fluid substances in this manner, at least one or more of these fluid substances is arbitrarily heated, irradiated with light, moisture cured, or irradiated with energy rays. By hardening by means, a desired pattern can be obtained. In this case, when two or more fluid substances are used, the pattern can be obtained by solidifying at least one of the fluid substances, or the pattern can be obtained by solidifying two or more fluid substances. You can also get Furthermore, a pattern can be laminated | stacked by mounting the fluid substance which can be solidified on this pattern, applying an electric field and / or a magnetic field, making a shape, and making it solidify then. The pattern thus obtained can be removed from the surface of the substrate used for concentrating the lines of magnetic force and used as a single pattern.

<With wetness>
When the fluid material is a liquid and the liquid is in contact with a substrate for forming a pattern, the surface of the position where the pattern is formed by collecting the liquid by an electric and / or magnetic field response is easily modified. It can be thought of as quality. The term “modification” as used herein means that a liquid is collected by an electric and / or magnetic field response to make a surface on which a pattern is formed easily wetted, a surface on which a pattern is not formed is made difficult to wet, or a combination of both. . In terms of the interfacial free energy, the modification means that the interfacial free energy between the portion where the liquid is collected by the electric field and / or magnetic field response to form the pattern and the liquid is changed by the electric field and / or the magnetic field response. It means making it larger than the interface free energy between the repelling part and the liquid. As a substrate surface modification method, for example, a material that easily wets is selected, a plasma treatment is performed so that an arbitrary part is easily wetted, or a surface of an arbitrary part is coated with a silane coupling agent. be able to.

For example, the contact angle θa between the liquid and the surface of the part that collects the liquid by electric force and / or magnetic force and the contact angle θb between the liquid and the surface of the other part have a relationship of θa <θb. At some point, the wettability of the liquid enhances the movement of the liquid by an electric and / or magnetic field.

  Further, in the case where the liquid includes two liquids, the contact angle between the first liquid and the substrate surface of the portion that collects the first liquid by electric and / or magnetic force is θc, and the first liquid and The contact angle between the other portion of the substrate surface is θd, the contact angle between the second liquid and the portion of the substrate surface that collects the first liquid by electric and / or magnetic force is θe, When the contact angle between the liquid and the substrate surface of the other part is θf, when θc, θd, θe, θf are in a relationship of θc−θd <θe−θf, The movement of the second liquid due to electric and / or magnetic force is enhanced by the difference in wettability.

  Here, in order to adjust interfacial tension and wetting, at least one of the liquids that can be used in the present invention, various surfactants can be blended. Examples of such surfactants include soaps, lauryl sulfate, polyoxyethylene alkyl ether sulfate, alkyl benzene sulfonate, polyoxyethylene alkyl ether phosphate, polyoxyethylene alkyl phenyl ether phosphate. Acid, N-acyl amino acid salt, α-olefin sulfonate, alkyl sulfate ester salt, alkyl phenyl ether sulfate ester salt, methyl taurate, and the like. Examples of amphoteric surfactants include alkyl diaminoethyl glycine hydrochloride, 2 -Alkyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine, lauryldimethylaminoacetic acid betaine, coconut oil fatty acid amidopropyl betaine, fatty acid alkyl betaine, sulfobetaine, amidoxide, etc. Nonionic (nonionic) surfactants include polyethylene glycol alkyl ester compounds, alkyl ether compounds such as triethylene glycol monobutyl ether, ester compounds such as polyoxysorbitan esters, alkylphenol compounds, fluorine compounds Examples thereof include silicone compounds and silicone type compounds. These compounds can be used alone or in combination of two or more.

<About fluid substances>
As a fluid substance used in pattern formation using an electric field and / or a magnetic field, any substance can be used as long as it can solidify after moving the fluid substance into a desired shape by an electric field and / or magnetic field response. be able to.

  In particular, the fluid substance is preferably a liquid, and the lower the viscosity of the liquid is, the more preferable it is because the movement by an electric field and / or a magnetic field can be performed smoothly. In addition to this, it can be applied to fluid powder and gas, and is not restricted by the form of the substance.

  As this fluid substance, a curable organic component and an inorganic component can be used as appropriate. Among these, as the organic component, in addition to various epoxy compounds, siloxane compounds, etc., prepolymers such as curable monomers and oligomers can be used, and these can be melted in a polymer state or dissolved in a solvent. Or a fine powder with fluidity can be used. Of these, thermoplastic resins include prepolymers and polymers made of vinyl acetate, vinyl alcohol, vinyl butyral, vinyl chloride, methacrylate, acrylic acid, methacrylic acid, styrene, ethylene, amide, cellulose, isobutylene, vinyl ether, and the like. be able to. Examples of the thermosetting resin include prepolymers and polymers made of urea, melamine, phenol, resorcinol, epoxy, episulfide, isocyanate, imide and the like. These compounds can be used alone or in combination of two or more.

  When blending such a curable prepolymer into a fluid substance, a curing agent or a polymerization initiator for curing the prepolymer can be blended as necessary. The kind of these hardening | curing agents and a polymerization initiator can be suitably selected according to the kind of prepolymer to mix | blend. As such a curing agent and polymerization initiator, a compound that initiates a reaction by energy rays can be preferably used. For example, photo radical polymerization type resin of acrylic monomer / oligomer, photo Michael addition type resin of polyene-thiol curing system, epoxy, and photo cationic polymerization type resin of oxetane and vinyl ether monomer / oligomer can be exemplified. Moreover, various well-known photoreaction sensitizers can also be used for these formulations.

  Examples of the active energy ray include ultraviolet rays and electron beams, but are not particularly limited thereto. Moreover, when irradiating an active energy ray, it is not limited to the atmosphere, It can irradiate in various atmospheres, such as air | atmosphere, inert gas, such as nitrogen and argon, and a vacuum, and temperature environment.

  Examples of inorganic components that can be used for pattern formation include various metal alkoxides, various metal chlorides, water glass, colloidal silica, various silicon oxides, silicon nitrides, silicon fluorides, metal oxides, metal nitrides, A metal silicide or a metal phosphate solution can be used, or a fine powder having fluidity can be used.

  A fluid substance containing such an inorganic component can be formed into an inorganic pattern by using a sol-gel reaction or high-temperature baking. In this case, a sol-gel reaction catalyst is also incorporated into the fluid substance. can do.

  As the catalyst for the sol-gel reaction, an inorganic component is hydrolyzed and polycondensed, an acid such as hydrochloric acid; an alkali such as sodium hydroxide, an amine, or dibutyltin diacetate, dibutyltin dioctate, dibutyltin dilaurate, Organotin compounds such as dibutyltin dimaleate, dioctyltin dilaurate, dioctyltin dimaleate, tin octylate; isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, tetraalkyl titanate Organic titanate compounds such as: tetrabutyl zirconate, tetrakis (acetylacetonate) zirconium, tetraisobutyl zirconate, butoxytris ( Cetylacetonato) Zirconium, zirconium naphthenate, and other organic zirconium compounds; Tris (ethyl acetoacetate) aluminum, tris (acetylacetonato) aluminum, and other organic aluminum compounds; Zinc naphthenate, cobalt naphthenate, cobalt octylate, etc. A metal catalyst etc. can be mentioned. Among these, a dibutyltin compound (SCAT-24 manufactured by Sansha Machinery Chemical Co., Ltd.) can be specifically mentioned as a commercial product. These compounds can be used alone or in combination of two or more. These organic components and inorganic components can be used as needed alone or in combination of organic and inorganic as appropriate.

  For the fluid substance that can be used in the present invention, a solvent can be appropriately selected according to the blending components, if necessary. Specific examples of such solvents include hydrocarbons (propane, n-butane, n-pentane, isohexane, cyclohexane, n-octane, isooctane, benzene, toluene, xylene, ethylbenzene, amylbenzene, turpentine oil, pinene, and the like). , Halogenated hydrocarbons (methyl chloride, chloroform, carbon tetrachloride, ethylene chloride, methyl bromide, ethyl bromide, chlorobenzene, chlorobromomethane, bromobenzene, fluorodichloromethane, dichlorodifluoromethane, difluorochloroethane, etc.), alcohol (methanol , Ethanol, n-propanol, isopropanol, n-amyl alcohol, isoamyl alcohol, n-hexanol, n-heptanol, 2-octanol, n-dodecanol, nonanol, cyclohexa Ether, acetal (ethyl ether, dichloroethyl ether, isopropyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, ethylbenzyl ether, furan, furfural, 2-methylfuran, cineol, methylal) , Ketone (acetone, methyl ethyl ketone, methyl-n-propyl ketone, methyl-n-amyl ketone, diisobutyl ketone, phorone, isophorone, cyclohexanone, acetophenone, etc.), ester (methyl formate, ethyl formate, propyl formate, methyl acetate, ethyl acetate, Propyl acetate, acetic acid-n-amyl, methyl cyclohexyl acetate, methyl butyrate, ethyl butyrate, propyl butyrate, butyl stearate), polyhydric alcohols and their derivatives Glycol, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether, methoxymethoxyethanol, ethylene glycol monoacetate, diethylene glycol, diethylene glycol monomethyl ether, propylene glycol, propylene glycol monoethyl ether), fatty acids and phenols ( Formic acid, acetic acid, acetic anhydride, propionic acid, propionic anhydride, butyric acid, isovaleric acid, phenol, cresol, o-cresol, xylenol, etc., nitrogen compounds (nitromethane, nitroethane, 1-nitropropane, nitrobenzene, monomethylamine, dimethyl) Amine, trimethylamine, monoethylamine, diamylamine, aniline, monomethyl Aniline, o-toluidine, o-chloroaniline, dichloroamine, dicyclohexylamine, monoethanolamine, formamide, N, N-dimethylformamide, acetamide, acetonitrile, pyridine, α-picoline, 2,4-lutidine, quinoline, morpholine Etc.), sulfur, phosphorus, other compounds (carbon disulfide, dimethyl sulfoxide, 4,4-diethyl-1,2-dithiolane, dimethyl sulfide, dimethyl disulfide, methanethiol, propane sultone, triethyl phosphate, tophenyl phosphate, carbonic acid Diethyl, ethylene carbonate, amyl borate, etc.), inorganic solvents (liquid ammonia, silicone oil, etc.), water and the like.

  In the liquid used in the present invention, a stabilizer, a coupling agent and the like can be appropriately selected and blended as necessary. Specific examples of such stabilizers include 2,6-di-tert-butyl-phenol, 2,4-di-tert-butyl-phenol, 2,6-di-tert-butyl-4-ethyl- Phenol-based antioxidants exemplified by phenol, 2,4-bis- (n-octylthio) -6- (4-hydroxy-3,5-di-tert-butyl-anilino) -1,3,5-triazine and the like Agent, alkyldiphenylamine, N, N'-diphenyl-p-phenylenediamine, 6-ethoxy-2,2,4-trimethyl-1,2-dihydroquinoline, N-phenyl-N'-isopropyl-p-phenylenediamine, etc. Aromatic amine antioxidants, dilauryl-3,3'-thiodipropionate, ditridecyl-3,3'-thiodipropionate, bis [2-methyl Sulfide hydroperoxide decomposer exemplified by -4- {3-n-alkylthiopropionyloxy} -5-tert-butyl-phenyl] sulfide, 2-mercapto-5-methyl-benzimidazole, and the like, tris (isodecyl) phos Phyto, phenyl diisooctyl phosphite, diphenyl isooctyl phosphite, di (nonylphenyl) pentaerythritol diphosphite, 3,5-di-tert-butyl-4-hydroxy-benzyl phosphate diethyl ester, sodium bis (4 -Tert-butylphenyl) phosphate, etc., a phosphorus hydroperoxide decomposing agent, phenyl salicylate, a salicylate light stabilizer exemplified by 4-tert-octylphenyl salicylate, etc., 2,4-dihydroxy Benzophenone light stabilizers exemplified by cibenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid, 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2,2′-methylenebis Benzotriazole light stabilizers exemplified by [4- (1,1,3,3-tetramethylbutyl) -6- (2N-benzotriazol-2-yl) phenol] and the like, phenyl-4-piperidinyl Hindered amine light stabilizers exemplified by carbonates, bis- [2,2,6,6-tetramethyl-4-piperidinyl sebacate] and the like, [2,2′-thio-bis (4-t-octylphenol) Lat)]-2-ethylhexylamine-nickel- (II) Over preparative based light stabilizers, and the like oxalic acid anilide-based light stabilizer. Further, as such a coupling agent, specifically, ((tridecafluoro-1,1,2,2-tetrahydrooctyl) triethoxysilane, epoxy-modified silane coupling agent as a fluorine-based silane coupling agent) (KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.), as an oxetane-modified silane coupling agent (TESOX manufactured by Toagosei Co., Ltd.), or vinyltrimethoxysilane, vinyltriethoxysilane, γ-chloropropyltrimethoxysilane, γ -Aminopropyltriethoxysilane, N- (β-aminoethyl) -γ-aminopropyltrimethoxysilane, N- (β-aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-glycidoxypropyltrimethoxysilane , Β-glycidoxypropylmethyl dimeth Silane coupling agents such as silane, γ-methacryloxyxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-mercaptopropyltrimethoxysilane, triethanolamine titanate, titanium acetylacetonate, titanium ethylacetate Acetate, titanium lactate, titanium lactate ammonium salt, tetrastearyl titanate, isopropyl tricumyl phenyl titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, dicumylphenyloxyacetate titanate, isopropyl trioctainol titanate, isopropyl dimethacryloiso Stearoyl titanate, titanium lactate ethyl ester, octylene glycol tita , Isopropyl triisostearoyl titanate, triisostearyl isopropyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, tetra (2-ethylhexyl) titanate, butyl titanate dimer, isopropyl isostearoyl diacryl titanate, isopropyl tri (dioctyl phosphate) titanate, isopropyl Tris (dioctylpyrophosphate) titanate, tetraisopropylbis (dioctylphosphite) titanate, tetraoctylbis (ditridecylphosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (di-tridecyl) phos Phyto titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dio Examples include titanium coupling agents such as (octylpyrophosphate) ethylene titanate, tetra-i-propyl titanate, tetra-n-butyl titanate, and diisostearoyl ethylene titanate. These compounds can be used alone or in combination of two or more.

  In addition, if necessary, various dyes and pigments are added to the flowable substance to easily check the pattern formation status of the flowable substance or add an optical function to the pattern. You can also. Examples of such dyes include anthraquinone dyes, aminium dyes, polymethine dyes, diimonium dyes, cyanine dyes, phthalocyanine dyes, pyrazolone dyes, nigrosine dyes, anthraquinone dyes, azo dyes, and chromium complex dyes. However, it is not limited to these. In addition, examples of such pigments include colorless or colored pigments. Specifically, titanium dioxide, barium sulfate, calcium carbonate, magnetic iron oxide, ultramarine, ultramarine, bitumen, zinc yellow, red rose, yellow lead. , Lead white, titanium white, carbon black, transparent iron oxide, aluminum powder and other inorganic pigments, azo, triphenylmethane, quinoline, anthraquinone, phthalocyanine, lake pigment, isoindoline pigment, quinacridone pigment, etc. Examples thereof include, but are not limited to, organic pigments, carbon black, and metal colloids. These dyes and pigments can be used alone or in combination of two or more.

  In order to improve the mechanical strength, thermal characteristics, and electrical characteristics of the pattern to be formed, various fillers can be blended with the fluid substance used in the present invention as necessary. Insulating fillers include powders of metal oxides such as alumina, silica, zirconia and titania, sols such as colloidal silica, titania sol and alumina sol, clay minerals such as talc, kaolinite and smectite, and carbides such as silicon carbide and titanium carbide. And nitrides such as silicon nitride, aluminum nitride and titanium nitride, borides such as boron nitride, titanium boride and boron oxide, complex oxides such as mullite, hydroxides such as aluminum hydroxide and magnesium hydroxide, etc. It is done. As the conductive filler, metals such as Ag, Cu, Au, Al, Mg, Rh, W, Mo, Co, Ni, Pt, Pd, Cr, Ta, Pb, V, Zr, Ti, In, Fe, Zn, etc. Powders, flakes, or colloids can be used. Sn—Pb, Sn—In, Sn—Bi, Sn—Ag, Sn—Zn alloy powders and flakes, acetylene black, furnace black, channel black Conductive carbon materials such as carbon black, graphite, graphite fiber, graphite fibril, carbon fiber, activated carbon, charcoal, carbon nanotube, fullerene, and metal oxide conductive fillers such as zinc oxide, tin oxide, indium oxide , Titanium oxide (titanium dioxide, titanium monoxide, etc.) etc. surplus due to the presence of lattice defects It includes fillers exhibiting conductivity generated by the child. Such fillers can be used alone or in combination of two or more, and it is also preferable to use a filler whose surface is treated with a coupling agent or the like.

  By using the additive having magnetic anisotropy, the magnetic field orientation and patterning of the additive can be simultaneously performed.

  Moreover, in order to adjust a dielectric constant and / or a magnetic susceptibility, various substances can be mix | blended with the fluid substance used for this invention (in addition to the substance illustrated above). In the case where the fluid substance is a liquid, such a substance may be dissolved in the liquid or may be dispersed without being dissolved. Alternatively, it may be dissolved in an arbitrary solvent and emulsified in this liquid. Among the substances for adjusting the magnetic susceptibility, as a substance for increasing the magnetic susceptibility, a ferromagnetic material such as Fe, Ni, Co, etc. can be added to the liquid in addition to the paramagnetic transition element compound. Examples of materials that increase the dielectric constant include barium titanate and lead zirconate titanate. At this time, only the additive that adjusts the dielectric constant and / or magnetic susceptibility is dissolved or added so that it does not separate from the fluid substance by interacting with the electric field and / or magnetic field. In the latter case, the particle diameter is more preferably in the range of 20 to 10 nm.

  In addition, examples of the substance that decreases the magnetic susceptibility include superconductors and bismuth. Examples of substances that lower the dielectric constant include lead zirconate and monoammonium phosphate. Moreover, these substances can be used alone or in appropriate combination of two or more. Furthermore, the blending ratio of the above various blending components constituting the fluid substance can be appropriately determined according to the blending components.

<Composition of substance for concentrating electric lines of force and / or lines of magnetic force>
In order to concentrate the electric field lines and / or magnetic field lines, an electrode and / or magnet having a shape to be patterned is used, or the electric field lines and / or the material having a relatively high dielectric constant and / or magnetic susceptibility is used. The principle of concentration of magnetic field lines can be used. In the latter case, the electric field lines and / or magnetic field lines are added to the selected substance having a relatively large dielectric constant and / or magnetic susceptibility by appropriately selecting a combination of substances having a large difference in dielectric constant and / or magnetic susceptibility. And an electric field and / or magnetic field having an arbitrary electric flux density and / or magnetic flux density distribution can be formed and used for pattern formation. Such electric field lines and / or magnetic field lines gather at a relatively large dielectric constant and / or magnetic susceptibility, and thus can be applied to all materials having a difference in dielectric constant and / or magnetic susceptibility. It is preferable to use a combination of substances having a large difference in the rate and / or magnetic susceptibility. It is also possible to perform pattern formation by obtaining a substrate containing two or more substances having different dielectric constants and / or magnetic susceptibility by printing substances having different dielectric constants and / or magnetic susceptibility on the substrate.

<Combination of fluid substances that enhance electric and / or magnetic field response>
In the pattern formation method of the present invention, the second fluid substance that enhances the electric and / or magnetic field response is not completely dissolved in the first fluid substance as described above, An arbitrary fluid substance that forms two layers of the first fluid substance layer and the second fluid substance substance layer can be appropriately selected. In order to enhance the electric field and / or magnetic field response, these fluid substances are preferably those having a large difference in dielectric constant and / or magnetic susceptibility, specifically, dielectric constant and / or air than air. Alternatively, a combination that increases the difference in magnetic susceptibility is preferable.

  In addition to the enhancement of liquid movement by the electric field and / or magnetic field response, there is an effect that the second fluid substance can press the first fluid substance by gravity. It is effective when the specific gravity of the second fluid substance is heavier than air, and the second fluid substance presses the first fluid substance, so that the fluid substance body Movement is assisted. Preferably, the specific gravity of the second fluid substance should be large as long as the specific gravity of the first fluid substance is not exceeded.

  When the fluid substance is a liquid, the second liquid is applied after the first liquid is applied to the substrate, and the layer of the first liquid comes into contact with the surface of the substrate and is bound by the interfacial tension. When the first liquid layer and the second liquid layer are not reversed with respect to the substrate surface, the specific gravity of the second liquid is preferably as large as possible.

  The enhancement effect of the liquid movement in the relationship between the dielectric constant and / or the magnetic susceptibility χ and the specific gravity ρ includes the difference Δχ in the magnetic susceptibility of the first fluid substance, the specific gravity of the second fluid substance. The larger the relational expression Δχ / Δρ with respect to the difference Δρ, the more advantageous.

  The above ingredients can be combined with a solvent and stirred to form a solution or suspension. Stirring can be performed by appropriately selecting various stirring devices such as a propeller mixer, a planetary mixer, a hybrid mixer, a kneader, a homogenizer for emulsification, and an ultrasonic homogenizer. Moreover, it can also stir, heating or cooling as needed.

  As described above, if two or more fluid substances with different permittivity, magnetic susceptibility, and specific gravity are used, the mobility of the substance with fluidity is increased by the interaction between attractive force and repulsive force and gravity. In the case where a certain substance is a liquid, the mass transfer by the magnetic field response can be advantageously advanced by the interface free energy. By using such a technique for enhancing the magnetic field response, it is possible to move a weak magnetic material using a general magnetic field generator without using an expensive strong magnetic field generator. A desired pattern can be obtained by solidifying a fluid substance having a desired shape obtained by an electric field and / or magnetic field response. Examples using the pattern forming method of the present invention will be described below.

  In Example 1, using the pattern forming method of the present invention, a continuous lens shape was manufactured on a pixel of a charge coupled device image sensor (CCD image sensor). An example of the manufacturing method is shown in FIGS. 14a to 14e which are side sectional views of a CCD image sensor.

  Here, the apparatus schematically shown in FIG. 14a is a kind of CCD image sensor of an optical apparatus, and parts not directly related to the description of the present invention are omitted. The member indicated by reference numeral 14 is a photodetector, and the light sensitivity of the CCD image sensor can be improved by condensing light on this portion. FIG. 14B shows a state in which a high refractive index transparent liquid UV curable resin (diamagnetism) 15 is applied on the surface of the CCD image sensor, and a negative pattern 16 made of a ferromagnetic material is provided immediately above the CCD image sensor. Place it so that it is located in In this case, it arrange | positions so that the hole 11 may be located in the upper part of the photodetector 14. FIG. FIG. 14 c shows a state in which a layer 17 of an aqueous manganese chloride solution (2 mol / l), which is a paramagnetic liquid, is formed on the coating film 15. FIG. 14d shows a state in which the positive pattern 18 is formed by applying the magnetic field 3 from the normal direction of the negative pattern 15 (see arrow). The positive pattern 18 formed in this way is irradiated with UV to solidify the positive pattern 18, and then the manganese chloride aqueous solution layer 15 is removed, whereby a CCD having a lens shape formed on the surface as shown in FIG. 14e. An image sensor can be manufactured. F

For example, by using a manufacturing apparatus or system as shown below, a CCD image sensor (optical apparatus) having a lens shape as shown in FIG. It can be manufactured safely and stably.
As a manufacturing apparatus of this CCD image sensor (optical device), as shown in FIGS. 14a and 14b, a negative pattern placement unit for placing a substrate on which a photodetector 14 is mounted and placing a negative pattern 16 thereon is provided. As shown in FIGS. 14b and 14c, fluid substance supplying means for supplying a fluid substance (UV curable resin 15 and manganese chloride aqueous solution 17) to the substrate or negative pattern 16, and as shown in FIG. It is conceivable to include a magnetic field applying means for applying a predetermined magnetic field 3 and a pattern solidifying means for irradiating and solidifying the formed pattern 18 with UV to obtain a product as shown in FIG. 14e.

(Manufacturing method of the optical device shown in FIG. 15)
The optical device shown in FIG. 15 was manufactured by the following method. First, a UV curable highly transparent high refractive index coating solution showing diamagnetism was applied to the surface of the CCD image sensor, and then holes were formed along the arrangement of the photodetectors formed on the CCD image sensor. A negative pattern made of a ferromagnetic material is placed so that the holes are positioned on each photodetector, and a magnetic field is applied from the normal direction of the negative pattern to concentrate magnetic lines of force on the ferromagnetic part of the negative pattern. The coating solution having diamagnetism was repelled in the direction of the holes by the magnetic field response. Next, a pattern 18 having a lens structure on the photodetector was produced by curing the coating solution. This will be described in more detail below.

(UV curable highly transparent high refractive index liquid resin composition)
Bisphenol A type liquid epoxy resin (EPICLON 850S manufactured by Dainippon Ink and Chemicals, Inc.) 100 parts, epoxy-modified silane coupling agent (KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.), photocation initiator (Asahi Denka Kogyo Co., Ltd.) 4 parts of Adekaoptomer SP-170 manufactured by company and 30 parts of Oxetane resin (OXT-211 manufactured by Toagosei Co., Ltd.) are put into a planetary mixer with a cooling jacket and stirred until a uniform solution is obtained, and then photocured. A functional resin composition was obtained. At this time, stirring was performed while cooling the solution so as not to exceed 25 ° C. so that the coating solution did not react with heat generated during stirring.

(Application)
The coating solution prepared above was applied on the electronic device shown in FIG. 14a so as to have a liquid thickness of 10 μm.

(Negative pattern production)
Using a femtosecond laser on a 25.times.25.times.0.05 mm purity 99.998% iron foil, 100.times.100 through-holes of .phi.0.02 mm were made to produce a negative pattern.

(Positive pattern positioning)
Adjustment was made so that the through hole of the negative pattern produced above was positioned directly above each photo detector of the CCD image sensor, and further, the negative pattern was made close to the surface of the coating solution at a distance of 5 μm.

(Liquid injection to increase the difference in magnetic susceptibility)
A manganese chloride aqueous solution (2 mol / l) was injected from the negative pattern through hole so that the inside of the through hole was filled with the manganese chloride aqueous solution.

(Application of magnetic field)
A vertical magnetic field of 0.5 T (Tesla) was applied for 30 seconds perpendicularly to the negative pattern, and the UV curable resin was patterned to form a lens shape directly under the through hole of the negative pattern.

(Curing application liquid)
Next, while applying the magnetic field, using a metal halide lamp (LIGHTNINGCURE LC5) manufactured by Hamamatsu Photonics, UV irradiation with a wavelength of 365 nm was irradiated at 6000 mJ / cm ² to cure the coating film, and then the application of the magnetic field was stopped. Thus, a CCD image sensor having a lens formed on the photodetector was manufactured.

(Confirmation of lens formation)
As shown in FIG. 15, it was confirmed that the surface of the UV curable resin had a wavy lens shape.

In Example 2, a projection pattern having a high aspect ratio was formed on the substrate by the pattern forming method of the present invention. An example of the manufacturing method is shown in FIGS. 16a to 16e which are side sectional views.
Here, FIG. 16a shows a glass substrate 19 on which a diamagnetic UV curable resin coating film 15 is formed. FIG. 16 b shows a state in which the negative pattern 16 made of a ferromagnetic material is fixed in a state where the negative pattern 16 is brought close to the coating film 15. FIG. 16 c shows a state in which a layer 17 made of a liquid that is paramagnetic and substantially insoluble in the coating film 15 is formed. FIG. 16d shows a state where the pattern 12 is formed by applying a magnetic field from the normal direction of the negative pattern and undulating the liquid surface of the coating film. FIG. 16e shows a state in which the negative pattern and the paramagnetic layer are removed to form a projection pattern after the pattern 12 is UV cured.

(Preparation of coating liquid)
50 parts of oxetane-modified silsesquioxane (OX-SQH manufactured by Toagosei Co., Ltd.), 10 parts of alicyclic epoxy resin (Celoxide 2021P manufactured by Daicel Chemical Industries, Ltd.), 5 parts of photothermal cation initiator (SI-100) Was put into a planetary mixer with a cooling jacket, and stirred until a uniform solution was obtained to obtain a liquid. At this time, the coating liquid was stirred while cooling in a range where the liquid temperature did not exceed 25 ° C. so that the coating liquid did not react with the heat generated during stirring to obtain a coating liquid. The approximate magnetic susceptibility of this coating liquid is −0.6 (10 ⁻⁶ cm ³ g ⁻¹ ).

(Application)
The coating solution prepared above was applied on the glass substrate shown in FIG. 16a so as to have a liquid thickness of 50 μm.

(Negative pattern production)
A negative pattern was produced by drilling a 10 × 10 through hole with a diameter of 0.1 mm in an iron foil of 50 × 50 × 0.3 mm with a purity of 99.998% using a drill.

(Installation of negative pattern)
The negative pattern produced above was placed on a substrate on which a coating film was formed as shown in FIG. 16b, and was further brought close to the coating solution surface at a distance of 10 μm.

(Liquid injection to increase the difference in magnetic susceptibility)
As shown in FIG. 16c, a manganese chloride aqueous solution (2 mol / l) was injected from the negative pattern through-hole so that the inside of the through-hole was filled with the manganese chloride aqueous solution.

(Application of magnetic field)
As shown in FIG. 16d, a vertical magnetic field of 0.5 T (Tesla) was applied for 30 seconds perpendicularly to the negative pattern to pattern the UV curable resin.

(Curing application liquid)
Next, while applying the magnetic field, using a metal halide lamp (LIGHTNINGCURE LC5) manufactured by Hamamatsu Photonics, UV irradiation with a wavelength of 365 nm was irradiated at 6000 mJ / cm ² to harden the coating film, and then application of the magnetic field was stopped. As shown in FIG. 16e, a positive pattern having a high aspect ratio was formed.

(Confirmation of pattern formation)
As a result, as shown in FIG. 17, it was confirmed that a pattern having a high aspect ratio was formed.

In Example 3, a pattern that could not be punched was formed on the substrate by the pattern forming method of the present invention. An example of the manufacturing method is shown in FIGS. 18a to 18e which are side sectional views.
Here, FIG. 18a shows a glass substrate 19 on which a diamagnetic UV curable resin coating film 15 is formed. FIG. 18 b shows a state in which the negative pattern 20 made of a ferromagnetic material is fixed in a state where the negative pattern 20 is brought close to the coating film 15. FIG. 18 c shows a state in which a layer 17 made of a liquid that is paramagnetic and substantially insoluble in the coating film 15 is formed. FIG. 18d shows a state in which a magnetic field is applied from the normal direction of the negative pattern and the liquid surface of the coating film is waved to form the pattern 21. FIG. FIG. 18e shows a state in which, after the pattern 21 is UV cured, the negative pattern and the paramagnetic layer are removed to form a projection pattern.

(Preparation of coating liquid)
The same coating solution as in Example 1 was produced.

(Application)
The coating solution prepared above was applied on the glass substrate shown in FIG. 18a so as to have a thickness of 50 μm.

(Negative pattern production)
Use a drill to drill 10 × 10 through holes of φ0.1 mm in an iron foil of 50 × 50 × 0.3 mm purity 99.998%, and then drill this through hole using a drill of φ0.15 mm. A negative pattern 20 having a tapered shape inside was prepared by making a hole so as not to penetrate a hole that is slightly larger in the center.

(Installation of negative pattern)
As shown in FIG. 18b, the negative pattern produced above was placed on the substrate on which the coating film was formed, and was further brought close to the coating solution surface so as to be located at a distance of 10 μm.

(Liquid injection to increase the difference in magnetic susceptibility)
As shown in FIG. 18c, a manganese chloride aqueous solution (2 mol / l) was injected from the negative pattern through-hole so that the inside of the through-hole was filled with the manganese chloride aqueous solution.

(Application of magnetic field)
As shown in FIG. 18d, a vertical magnetic field of 0.5 T (Tesla) was applied for 30 seconds perpendicularly to the negative pattern to pattern the UV curable resin.

(Curing application liquid)
Next, while applying the magnetic field, using a metal halide lamp (LIGHTNINGCURE LC5) manufactured by Hamamatsu Photonics, UV irradiation with a wavelength of 365 nm was irradiated at 6000 mJ / cm ² to harden the coating film, and then application of the magnetic field was stopped. As shown in FIG. 18e, a mushroom-shaped pattern was formed.

(Confirmation of pattern formation)
As a result, as shown in FIG. 19, a mushroom shape that could not be punched by the conventional method could be formed.

In Example 4, a catalyst core and an insulating film for electroless plating were collectively formed on a substrate by the pattern forming method of the present invention. An example of the manufacturing method is shown in FIGS. 20a to 20e which are side sectional views.
Here, FIG. 20 a shows a dispersion prepared by dispersing diamagnetic hot melt particles 22 and hot melt particles 23 kneaded with catalyst nuclei and ferromagnetic nanoparticles in a solvent 24. It shows how it was applied. FIG. 20 b shows a state in which the negative pattern 20 made of a ferromagnetic material is fixed in a state where the negative pattern 20 is brought close to the particles 22 and 23. FIG. 20 c shows a state in which a magnetic field is applied from the normal direction of the negative pattern, and the particles 22 are aggregated in the negative pattern holes and the particles 23 are aggregated under the ferromagnetic material forming the negative pattern. FIG. 20d shows a state in which the pattern was formed by removing the negative pattern after the magnetic field application was stopped, then evaporating the solvent, and further fusing the hot melt by heating. FIG. 20e shows a state in which an electroless plating pattern 27 is formed on the surface 26 by performing electroless plating.

(Preparation of dispersion liquid)
Polyvinyl alcohol (manufactured by Kureha Co., Ltd .; PVA124), iron oxide nanoparticles (manufactured by CI Kasei Co., Ltd .; NanoTek Fe ₂ O ₃ ), 100 parts of water at 80 ° C. for 12 hours using an ultrasonic homogenizer (S. (Met; UH-600S) and then cooled to room temperature, added with 3 parts pyromellitic acid, 0.2 part chromium hexafluoride and 0.08 part palladium chloride, and stirred at room temperature for 1 hour. . At this time, stirring was performed while cooling so that the liquid temperature did not rise. This was spread thinly on a Teflon sheet, dried to obtain a film, and then finely crushed to produce a powder 23 of about 1 μm. 10 parts of each of this powder 23 and polystyrene particles 22 (Mortex Co., Ltd. 5000 series, particle size 1 μm) were dispersed in 100 parts of ethanol to prepare a dispersion liquid.

(Application)
The dispersion liquid prepared above was applied on the glass substrate shown in FIG. 20a so as to have a liquid thickness of 200 μm and allowed to stand until each particle settled.

(Negative pattern production)
10 sheets of 50 × 50 × 0.3 mm purity 99.998% iron foil, 9 pieces of 50 × 25 × 0.3 mm PET film as a gap, and two pieces are overlapped together, with a gap of 0.1 mm on one side. A laminate of iron foil having a space of 3 mm was produced, and this was used as a negative pattern 20.

(Installation of negative pattern)
As shown in FIG. 20b, the negative pattern prepared above was placed on the substrate on which the coating film was formed, and was further brought close to the settled particle layer at a distance of 5 μm.

(Application of magnetic field)
As shown in FIG. 20c, a vertical magnetic field of 0.5 T (Tesla) is applied for 30 seconds perpendicularly to the negative pattern, and the particles 22 are gathered under the negative pattern gap and the particles 23 are gathered under the iron foil. I let you.

(Drying and solidification of particle pattern)
Next, as shown in FIG. 20d, after the application of the magnetic field was stopped, the negative pattern 20 was slowly pulled out, and then the particle pattern was dried at room temperature for 24 hours. Subsequently, the pattern which consists of particles was heated at 200 degreeC for 60 minutes, the particle | grains were fuse | melted, and it solidified by further cooling.

(Electroless plating)
After dissolving 3.7 parts of silver nitrate in 50 parts of water, a solution in which 50 parts of an aqueous glucose solution (5%) was added to a solution in which an aqueous ammonia solution (28%) was added until the pH reached 9.5 was prepared. Then, after washing with diluted hydrochloric acid (0.5N) for 30 minutes, the pattern washed with pure water for 30 minutes was immersed for 1 hour to deposit silver plating 27 on the surface of the pattern 26 as shown in FIG. 20e.

(Confirmation of pattern formation)
As a result of observing the produced pattern with an optical microscope, it was confirmed that a silver plating line 28 was formed on the substrate surface as shown in FIG.

For example, by using a manufacturing apparatus or system as shown below, an electronic member (apparatus) as shown in FIG. 21 can be manufactured safely and stably at a low manufacturing cost in a short time. .
As an apparatus for manufacturing an electronic member (apparatus), as shown in FIGS. 20a and 20b, a glass substrate is placed, and a negative pattern placement portion for placing the negative pattern 20 on top thereof, and a dispersion liquid as shown in FIG. 20a. The flowable substance supplying means for supplying 22, 23, 24 to the glass substrate, the magnetic field applying means for applying a predetermined magnetic field 3 to the glass substrate as shown in FIG. 20c, and the formed pattern is dried and fused. It is conceivable to provide a pattern solidifying means for solidifying the film.

As described above, by using the pattern forming method of the present invention, it is possible to produce a negative pattern and a positive pattern in a non-contact manner, and solve the problem of mold release and the problem of lifetime due to mold wear. Can do. In addition, the pattern formation method using an electric field and / or a magnetic field can invalidate the fine flaws of the negative pattern by relaxation associated with the repulsion between the electric lines of force and / or the lines of magnetic force. Mirror patterning can be performed. Moreover, the pattern formation method using an electric field and / or a magnetic field can form a positive pattern that is slightly smaller than the negative pattern by changing the application direction of the electric field and / or magnetic field, and thus has a high aspect ratio that is difficult to die-cut. Patterns and mushroom shapes with a small neck circumference can also be patterned.
Further, since a substance having fluidity is pushed into the negative pattern by electric force and / or magnetic force, the liquid can be easily introduced even in an elongated pattern, and the pattern transferability can be increased. It is also possible to pattern materials having different dielectric constants and / or magnetic susceptibility all at once. By utilizing such characteristics, it can be preferably applied to the microlens shape, the molding of LED transparent sealant, the micro-sized magic tape (registered trademark), and the batch formation of the plating pattern and the insulating film. .

An electric and / or magnetic field 3 from the normal direction into a substantially plate-like negative pattern comprising a material 1 having a relatively high dielectric constant and / or magnetic susceptibility and a material 2 having a relatively low dielectric constant and / or magnetic susceptibility. It is a figure showing a mode that electric field lines and / or lines of magnetic force 4 were sucked into 1, and field 5 with high electric flux and / or magnetic flux density was generated along a negative pattern by applying. (A) is a figure which shows the shape of the wave | undulation of the surface when an electric field and / or a magnetic field are applied to the substance which has the fluidity | liquidity with a larger dielectric constant and / or magnetic susceptibility than air, (b) ) Is a diagram showing the shape of surface undulation when an electric field and / or magnetic field is applied to a material having fluidity having a dielectric constant and / or magnetic susceptibility relatively smaller than air. FIG. 5 is a schematic diagram showing an effective distance of a pattern formed by a density difference of electric flux and / or magnetic flux density generated when an electric field and / or magnetic field is applied to a negative pattern made of a material having different dielectric constant and / or magnetic susceptibility. is there. (A) is a figure which shows the positional relationship of the surface of the substance which has the fluidity before applying an electric field and / or a magnetic field, and a negative pattern, (b) is after applying an electric field and / or a magnetic field. It is a figure which shows the change of the surface shape of the substance which has fluidity | liquidity. (A) is a figure which shows the surface shape of the substance which has the fluidity | liquidity whose dielectric constant and / or magnetic susceptibility are relatively smaller than the air transcribe | transferred along the negative pattern which has a reverse taper, (b) FIG. 5 is a diagram showing a surface shape of a substance having fluidity whose relative permittivity and / or magnetic susceptibility is relatively smaller than air transferred along a negative pattern in which an opening is smaller than a hole. (A) shows the electric flux and / or magnetic flux density distribution when an electric field and / or magnetic field is applied substantially parallel to the negative pattern surface, and fluidity having a dielectric constant and / or magnetic susceptibility relatively smaller than air. FIG. 7B is a diagram showing the surface shape of a substance having the electric flux and / or magnetic flux density distribution when an electric field and / or magnetic field is applied substantially parallel to the negative pattern surface, and a dielectric relative to air. It is a figure which shows the surface shape of the substance which has the fluidity | liquidity with a large rate and / or magnetic susceptibility. A two-layer structure is formed with a fluid material that forms a positive pattern by solidification and a second fluid material that has a different dielectric constant and / or magnetic susceptibility, and is based on electric and / or magnetic force. It is a figure which shows the method of enhancing the movement of the substance which has fluidity | liquidity. It is a figure which shows the method of assisting the patterning by an electric force and / or a magnetic force by the difference in wettability with a substrate surface, when the substance which has fluidity | liquidity is a liquid. It is a table | surface showing the generation source of a typical magnetic field, and its magnetic flux density. It is a table | surface which shows the gram magnetic susceptibility of a single-piece | unit. It is a table | surface which shows the gram magnetic susceptibility of an organic compound. It is a table | surface which shows the molar magnetic susceptibility of a paramagnetic transition element. It is a table | surface which shows the molar magnetic susceptibility of a ferromagnetic. It is a schematic diagram of a CCD image sensor. It is the schematic diagram arrange | positioned so that the opening part of a negative pattern may be located just above the photo-detector part of a CCD image sensor. It is a figure which shows a mode that the layer of the 2nd liquid which assists the patterning by a magnetic force was formed. It is a figure which shows a mode that the interface of the substance which has fluidity | liquidity with a magnetic force, and the 2nd liquid was made into the lens shape. It is the figure which showed the produced lens shape typically. 2 is an optical micrograph of a microlens formed on the surface of a CCD image sensor. It is a figure which shows the glass substrate which apply | coated UV curable transparent liquid resin. It is a figure which shows the state which made the negative pattern adjoin to the coating film. It is a figure which shows a mode that the layer of the 2nd liquid which assists the patterning by a magnetic force was formed. It is a figure which shows a mode that the interface of the substance which has fluidity | liquidity with a magnetic force, and the 2nd liquid was made to invade | invade to the inside of the void | hole of a negative pattern. It is the figure which showed the produced high aspect ratio pattern typically. It is an optical micrograph of a high aspect ratio pattern. It is a figure which shows the glass substrate in which the diamagnetic UV curable resin coating film was formed. It is a figure which shows a mode that the negative pattern produced with the ferromagnetic material was fixed in the state made to approach the coating film 15. FIG. It is a figure which shows a mode that the layer which consists of a paramagnetism and a substantially insoluble liquid in a coating film was formed. It is a figure which shows a mode that the magnetic field was applied from the normal line direction of the negative pattern, and the liquid level of the coating film was swelled and the pattern was formed. It is a figure which shows a mode that the negative pattern and the paramagnetic layer were removed and the projection pattern was formed after UV-curing the pattern. It is an optical micrograph of a mushroom-shaped projection pattern. It is a figure which shows a mode that the dispersion liquid produced by disperse | distributing the diamagnetic hot-melt particle, the catalyst nucleus, and the hot-melt particle which knead | mixed the nanoparticle of ferromagnetic material to the solvent was applied to the glass substrate. It is a figure which shows a mode that the negative pattern produced with the ferromagnetic material was fixed in the state made to approach particle | grains. A diagram showing a state in which a magnetic field is applied from the normal direction of the negative pattern, particles exhibiting diamagnetism are aggregated in the holes of the negative pattern, and particles exhibiting ferromagnetism are aggregated under the ferromagnetic material forming the negative pattern. It is. It is a figure which shows a mode that the pattern was formed by removing a negative pattern after stopping a magnetic field application, then evaporating a solvent, and also fusing a hot melt by heating. It is a figure which shows a mode that the electroless-plating pattern was formed in the surface of resin which kneaded the catalyst nucleus by performing electroless plating. It is an optical microscope photograph of an electroless plating pattern. It is a figure which shows the case where 3 or more particle | grains are patterned in the position where gravity, a dielectric constant, and / or a magnetic susceptibility balance by using a negative pattern inclined.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Material with a relatively large dielectric constant and / or magnetic susceptibility 2 Material with a relatively small dielectric constant and / or magnetic susceptibility 3 Application direction of electric field and / or magnetic field 4 Electric field lines and / or magnetic field lines 5 Electric flux and / or Or the region 6 having a relatively high magnetic flux density 6 The shape of the surface undulation when an electric field and / or magnetic field is applied to a fluid material having a dielectric constant and / or magnetic susceptibility that is relatively higher than that of air 7 rather than air Surface waviness shape when an electric and / or magnetic field is applied to a fluid material having a relatively small dielectric constant and / or magnetic susceptibility 8 Pattern width 9 Pattern density and / or magnetic flux density difference is alleviated Distance 10 to be formed Hole 11 formed in the negative pattern 12 Opening portion 12 The dielectric constant and / or magnetic susceptibility is relatively smaller than the air sucked into the hole formed in the negative pattern by the electric force and / or the magnetic force. Flow The surface of the material having the property 13 The material having the fluidity which is not substantially mixed with the material having the fluidity forming the positive pattern and having a different dielectric constant and / or magnetic susceptibility 12 The substrate which is relatively easily wetted with the material having the fluidity 13 A substrate that is relatively difficult to wet with a substance having fluidity 14 A photodetector 15 A liquid UV curable resin 16 having a high refractive index and a transparent liquid 16 A negative pattern 17 made of a ferromagnetic material 17 A manganese chloride aqueous solution 18 A lens-shaped positive pattern 19 Glass Substrate 20 Negative pattern 21 formed of a ferromagnetic material having pores with a narrow opening portion Mushroom-shaped projection pattern 22 Polystyrene particles (diamagnetic hot melt particles)
23 Particles of polyvinyl alcohol in which iron oxide nanoparticles, palladium chloride, chromium hexafluoride and pyromellitic acid are combined (hot melt particles in which nanoparticles are kneaded)
24 Ethanol (solvent)
25 Fused polystyrene 26 Fused polyvinyl alcohol composite 27 Silver plating layer 28 Silver plating

Claims (9)

  An electric field and / or magnetic field is applied to a negative pattern made of two or more substances having different dielectric constants and / or magnetic susceptibility to generate a density difference between electric lines of force and / or lines of magnetic force in the vicinity of the negative pattern, and the electric force A method for forming a desired positive pattern by moving at least one or more fluid substances along a density difference between lines and / or lines of magnetic force, wherein at least one of the fluid substances is formed inside the negative pattern. A pattern forming method comprising: forming a positive pattern by partly entering, and further solidifying and forming at least a part of the positive pattern.   A negative pattern having one or more openings is formed in the material forming the negative pattern, and there is a difference in specific gravity between the negative pattern having the openings and a fluid material that forms a positive pattern rather than air. It contains a material having a fluidity that is small and has a large difference in dielectric constant and / or magnetic susceptibility from the material having fluidity that forms a positive pattern than air, and the opening is applied by applying an electric field and / or magnetic field. Forming a positive pattern by substituting at least part of the substance having fluidity forming a positive pattern with the substance having fluidity inside the portion, and further solidifying and forming at least part of the positive pattern. The pattern forming method according to claim 1.   A pattern is continuously formed by moving the negative pattern in an arbitrary direction on the surface of a material having fluidity that can be solidified, and at least a part of the pattern is continuously solidified. The pattern formation method of Claim 1 or 2.   When a positive pattern is formed on a substrate surface using a liquid as the fluid substance, the wettability between the liquid and a portion of the substrate that collects the liquid by electric force and / or magnetic force is improved. The pattern forming method according to claim 1, wherein the pattern forming method is a pattern forming method. A pattern forming method comprising: forming a pattern having two or more layers by repeating the pattern forming method according to claim 1.   An electronic device manufacturing method, wherein a desired pattern is formed on an electronic product using the pattern forming method according to claim 1.   A method for manufacturing an optical device, wherein a desired pattern is formed on the optical device using the pattern forming method according to claim 1.   An apparatus for manufacturing an electronic apparatus, wherein a desired pattern is formed on the electronic apparatus using the pattern forming method according to any one of claims 1 to 5.   An apparatus for manufacturing an optical apparatus, wherein a desired pattern is formed on the optical apparatus using the pattern forming method according to any one of claims 1 to 5.