JP2009543241A - Cooling device and cooling method - Google Patents

Abstract

The workstation cooling unit (12) includes a heat transfer path that is filled with a heat transfer fluid and is connected to a condenser to form a heat transfer circuit, and a heat exchanger that cools the workstation (40). (36). In this way, the workstation (40), such as a desk or other work area, can be directly cooled. The heat transfer fluid may include carbon dioxide.

Description

  The present invention relates to a cooling method and a cooling device. In particular, aspects of the present invention relate to cooling devices and cooling methods in the information technology field, but are not limited thereto. Preferred examples of aspects of the invention relate to the cooling of information technology equipment, in particular computer equipment such as personal computers and / or servers, and in particular to the cooling of computers and / or servers located in the area of workstations (however, Not limited to).

  For example, in an office environment, it is common to store a personal computer in a workstation or a desk. In an office, the computer equipment of each worker is often stored under the worker's desk. Depending on the office environment, some computer equipment may be housed under each desk or workstation. For example, in a banking floor environment, each workstation often houses several computers. Such computer equipment generates heat during operation, which may be concentrated below the workstation where the equipment is attached.

  In a typical office environment, an air conditioning system supplies cooling air from an overhead distributed system. This distributed system typically uses air or water that is sent through ducts or piping to the room where the workstation is located.

  However, by placing the heat generating device below the workstation, the device itself may interfere with the supply of cooling air from the air conditioning system to the device. The workstation itself can interfere with the supply of cooling air to the equipment. This problem arises from the equipment and can currently reach workstations, for example 1.5 kW per desk or in some cases 5 kW, and can be trapped under the workstations to form hot chambers. For fear of getting serious.

  Underfloor ventilation systems are used to properly supply cooling air to the equipment. In such a configuration, air is not supplied from above, but air is supplied from the grill in the underfloor to the equipment. For example, an office cooling system may have a combined air / water system that uses water as the primary coolant and air as the secondary coolant. The cooled air is pumped into the floor gap below the equipment by the fan and released into the room through a grill that is properly arranged around the floor. Air is an electrical harmless and inherently safe and very attractive coolant that can be used in such systems.

  However, as transistors become smaller and chip capacity increases, the demand for power dissipation in IT or computing equipment increases. Modern equipment requires a large amount of air to achieve the desired cooling. Thus, the disadvantage of these systems is that the system may generate excessive airflow rates at the floor and fence levels to achieve the desired cooling. This creates an unfavorable environment for work. In order to accept a large amount of air that has passed through the floor in a floor-mounted plenum with atmospheric pressure maintained, it is also necessary to increase the lift floor gap. Considering the high heat output of some devices, air cooling may not be appropriate to sufficiently cool the device, which may cause malfunctions and / or safety problems of electronic components in the device. .

  Each aspect of the present invention is to provide a cooling device that mitigates one or more of the above-mentioned drawbacks.

  According to the first aspect of the present invention, a heat transfer path in which a heat transfer fluid is placed and connected to a condenser to form a heat transfer circuit, and a heat exchanger for cooling a workstation A workstation cooling unit is provided.

  According to this aspect of the invention, direct cooling of the workstation can be achieved.

  In a particularly preferred example of each aspect of the invention referred to herein, the workstation is a device, particularly a heat generating device, including a computer device located at a desk or other work area, for example. Where the term workstation is referred to herein, this term shall include a desk or other work area (unless it is clear from the context), particularly a desk or work area that includes a heating device. Interpreted. In certain configurations, the workstation is configured such that the equipment is used by one or a few users at the desk or work area. This is in contrast to, for example, computer equipment arranged in a special work room, for example a server room. Note that such rooms are rarely accessed by users except during maintenance, as opposed to most workstations.

  Reference is made herein specifically to IT and computer equipment, in particular personal computers, but it will be understood that aspects of the invention are applicable to cooling other equipment. Certain preferred examples relate to cooling of office equipment.

  Thus, configurations according to aspects of the present invention can be used to cool individual user work areas. Preferred examples described in more detail below include a cooling system that cools a plurality of separate workstations or groups of workstations.

  In some such configurations, each cooling unit may be arranged to cool a separate workstation, for example, a separate heat exchanger for each workstation may be provided. In other configurations, each unit may be arranged to cool several workstations.

  Where workstation cooling is referred to herein, preferably cooling of a portion of the workstation and / or equipment provided on the workstation or a portion thereof (unless otherwise apparent from the context) Including cooling.

  The heat transfer fluid preferably includes a volatile fluid. According to aspects of the invention, a local cooling system that utilizes cooling water can be used to achieve improved cooling. In such a configuration, the cooling water is routed through a pipe to a heat exchanger in an appropriate location near the workstation (optionally using a fan to blow air over the cold pipe to improve cooling capacity. May be allowed). Such a configuration is superior to the air based solution because the size of the piping may be small compared to the air ducts required to perform the same cooling by an air system. However, the use of cooling water as a coolant in an office environment, particularly near electrical equipment, is considered disadvantageous in several respects. Since water is an electrical conductor, water leaks can result in dangerous or potentially dangerous situations for the equipment.

  Further, the workstation can be cooled more efficiently by using a volatile fluid as the heat transfer fluid. By utilizing the evaporation of volatile fluids, a more effective cooling effect is obtained compared to the use of non-volatile fluids.

  The heat transfer fluid preferably contains carbon dioxide. The use of carbon dioxide as a cooling fluid is known. The use of carbon dioxide as a secondary cooling fluid is known and is described in British Patent Application No. 2258298. However, conventionally, application to cooling of a workstation has not been studied.

  Volatile fluids such as carbon dioxide are electrically harmless and are used relatively safely in applications where workstations are cooled, even though high pressures are required. In the case of carbon dioxide, in the example described herein, the required fluid pressure is on the order of 50 bar (5 MPa). In this case, a fluid circulation temperature of about 14 ° C. can be achieved. According to this configuration, the fluid operates at a temperature at which almost no condensate is formed on the piping, so that under normal operating conditions, the system operates “dry”. In some other applications, lower operating temperatures can be selected to improve cooling efficiency, but if necessary, measures must be taken to accommodate the resulting condensate. For example, a saucer and a drainage channel or pump related thereto may be provided.

  When carbon dioxide is used as the volatile fluid, very energy efficient cooling can be achieved. Furthermore, the size of the cooling system tube diameter and heat exchange surface area can be reduced compared to systems using other coolants, such as air or water. The configuration described herein can achieve a maximum load of about 5 kW per workstation.

  Other volatile fluids may be used. For example, the volatile fluid may include ammonia or HFC-134a.

  The heat exchanger is preferably provided at the workstation. In some examples, the cooling unit has a heat exchanger located at the workstation. The heat exchanger is preferably configured to directly cool the workstation. In some configurations, the heat exchanger is provided at a workstation, for example, near the heating equipment of the workstation.

  Various improvements can be made by providing a heat exchanger on the workstation itself. For example, heat can be removed directly from the equipment at the workstation.

  In some configurations, the heat exchanger is provided near the workstation, and in other configurations, the heat exchanger is provided in the workstation.

  The heat exchanger may be located either on the side, above or below the workstation. The heat exchanger can be located on one side of the workstation or on all sides.

  In some configurations, the heat exchanger is at least partially provided within the workstation. In this way, the workstation can be effectively cooled and a compact configuration can be realized. The heat exchanger may be provided almost entirely within the workstation.

  The cooling unit is provided near, in or adjacent to the workstation, for example, in the floor (above or below the floor), in the ceiling, above or below the ceiling, or elsewhere Is provided.

  The heat exchanger is provided near the workstation.

  In one preferred configuration, the heat exchanger may be provided at a location remote from the workstation itself. In one preferred configuration, the heat exchanger is provided in the floor below the workstation or in the ceiling above the workstation. In most practical configurations, it is necessary to provide a fan or other means for moving air across the heat exchanger, as described in more detail below. However, depending on the configuration, the fan may not be included.

  The cooling unit may be configured with a suitable casing so that it can be mounted in one or more locations, eg under the desk, on the floor or ceiling. The casing may include an attachment that assists in installing the cooling unit. When the cooling unit is used as a floor mounted unit, the cooling unit may be configured to be able to be replaced with one or more floor tiles during installation, and preferably withstands normal office floor loads. Configured as follows.

  The heat exchanger preferably includes a finned coil. A suitable configuration for the heat exchanger is selected, for example, depending on the desired operating pressure of the heat exchanger. Depending on the configuration, copper piping with aluminum fins is used. In configurations where the fluid pressure in the coil should be higher, stainless steel piping with aluminum fins or aluminum ribbon extrusions with aluminum fins can be used. The coil may be pressure tested at a pressure of 100 (10 MPa) bar or higher in a configuration adapted to operate at an operating pressure of 50 bar (5 MPa). In configurations adapted to operate at higher operating pressures, eg, 100 bar (10 MPa), the coil may be pressure tested at about 200 bar (20 MPa). The evaporator may have a coil combined with a double pipe.

  Carbon dioxide is a relatively safe substance, but can be dangerous at high concentrations.

  It is preferable that the cooling unit further includes a leak detection device that detects a leak of the heat transfer fluid. The leak detection device preferably includes a gas detection monitoring chamber. The chamber is preferably configured to monitor the health of the heat exchanger and / or piping and / or other parts of the cooling unit. The system preferably includes an automatic shut-off safety device that shuts off the supply of carbon dioxide to the cooling unit and / or performs appropriate actions on the computer equipment, for example, shuts down the equipment and / or sends a warning message.

  Preferably, the cooling unit further includes a fan that moves air to the heat exchanger. In general, including a fan is the preferred option, but configurations that do not include a fan are also contemplated.

  By providing a fan that moves air to the heat exchanger, more effective cooling can be performed. Furthermore, it is possible to cool the equipment arranged so as not to be directly adjacent to the heat exchanger.

  The heat exchanger is preferably arranged in the air flow path. The heat exchanger is preferably arranged at an angle with respect to the direction of air flow in the flow path. In this way, air is allowed to pass through the heat exchanger, for example through the coil of the heat exchanger, thereby achieving more efficient cooling.

  The fan is preferably configured to move air along the flow path, and preferably flow hot air along the flow path.

  In some configurations, a fan is provided in the air flow path. This method allows air to move efficiently through the air flow path. However, in other configurations, the fan may be provided outside the flow path.

  The unit may include a plurality of air flow paths. This feature is more flexible with respect to the direction of the air in the device, and thus more efficient cooling can be achieved. In a preferred configuration, the heat exchanger may extend through several air channels.

  In one configuration, the heat exchanger is provided in an air chamber, and the apparatus further includes a dividing member that divides the air chamber to form a plurality of air flow paths. Preferably, the dividing member has a plate used for partitioning a part of the air chamber to form an air flow path.

  In some configurations, the unit further includes a housing having an air inlet and an air outlet, and the fan is configured to move air from the inlet to the outlet.

  The unit preferably further includes an air directing structure. The air directing structure preferably extends from the heat exchanger toward the heat generating device. In a preferred configuration, the end of the air directing structure is adjacent to the heat source but is preferably not fixed to the heat source. In this way, hot air from the heat generating device is effectively directed by the heat exchanger. Where the heat exchanger is disposed within the flow path or housing, the air directing structure is preferably adapted to direct air from the device to the region of the flow path or housing inlet.

  The air directing structure preferably includes a duct that defines the direction of the air. An air directing structure, such as a duct or hose, may be configured to couple to and / or adjacent to the air outlet of the heat generating device and direct the air towards the heat exchanger. Preferably, the duct further includes an inlet formation, which is adapted to surround the outlet of the device. In this way, hot air exiting the device and entering the duct can be efficiently collected. The inlet forming portion may include a ventilation tube that determines the direction of air. The end of the hose or the ventilator is preferably shaped so as not to seal the heat source. This allows additional air to flow into the device as needed, for example when the air flow rate for the heat source is less than the suction fan duty. Alternatively or additionally, orifices or air holes may be included in the duct and / or part of the inlet formation for flowing air into the duct. In such a configuration, the inlet forming portion may or may not be sealed against the heat source. The duct may include a plurality of inlet formations that surround a plurality of outlet regions of the device.

  The duct may have a flexible hose. In this manner, the duct can be configured such that the inlet forming portion can easily surround the outlet area of the device and can accommodate a range of different device configurations.

  The fan can be placed in the duct. It should be understood that a fan may have multiple fan members. The fan may be configured to direct air to the area where the heat exchanger is attached, and thus direct the hot air from the equipment across the heat exchanger.

  As the air passes over the heat exchanger, the air can be recirculated across the equipment and / or discharged into the atmosphere. Other air directing structures or ducts can be used to direct the cooling air that has passed over the heat exchanger.

  Depending on the configuration, other air directing structures or ducts may be configured to direct air, preferably cold air (from the atmosphere or cooling system) to the equipment, eg, the air inlet of the equipment.

  The fan can direct air to a cavity or floor cavity in the workstation and / or direct air to the atmosphere.

  The heat exchanger is preferably arranged below the workstation. In a preferred configuration, the heat exchanger is provided in or adjacent to the floor cavity below the workstation.

  By placing the heat exchanger below the workstation, space can be used efficiently. The heat exchanger unit preferably has a floor tile exchange unit.

  The heat exchanger may be configured to be mounted on the floor surface or just above the floor surface. In a workstation environment, the area below the floor tile is often utilized for cables and other power supply members to the workstation. In some situations, the available space in the underfloor area may be insufficient to provide a heat exchanger. By mounting the heat exchanger on the floor or directly above the floor, the available space below the floor is reduced. In a preferred configuration, the fluid supply is provided below the floor, and the heat exchanger is provided directly above the floor and directly below the workstation.

  The heat exchanger unit is preferably adapted to be provided in a space intended for standard floor tiles. Thus, individual floor tiles can be exchanged for heat exchanger units, in which case the workstation is located on the floor. If several workstations are arranged, for example in a row, the corresponding row of floor tiles can be exchanged with a heat exchanger unit located below the workstation.

  In another example, the heat exchanger unit is provided above the workstation. In this configuration, the heat exchanger is preferably adapted to be provided in a space intended for standard ceiling tiles. The heat exchanger is preferably provided in a space immediately above the roof-shaped ceiling. Ducts may be provided to direct air from the equipment to the heat exchanger.

  The cooling unit may further include a cable management structure. Such a structure can be used to orient electrical cables or other cables within the workstation environment. The cooling unit may include pre-made cable channels that can be easily incorporated into a desk or other workstation area with a large number of cables and still allow the cables to harmonize well. .

  The heat exchanger may be configured to cool a plurality of workstations. Depending on the configuration, each heat exchanger can cool a plurality of devices. The heat exchanger preferably extends to be located near the plurality of workstations. Depending on the configuration, air directing structures and / or ducts are arranged to cool some workstation environments. Each array can be provided with one or more heat exchange units.

  The cooling unit is preferably adapted to be used in the secondary heat transfer circuit of the cooling system. The primary circuit preferably includes an evaporator, an expansion device, a condenser, and a compressor. The secondary circuit preferably includes a heat exchanger, a pump, a condenser, and an expansion device.

  The present invention includes a cooling unit described herein, and a condenser that is connected to a heat transfer path to form a secondary heat transfer circuit and is cooled by the primary heat transfer circuit. A cooling device is also provided. In use, the secondary heat transfer circuit is filled with a volatile fluid, preferably a secondary heat transfer fluid containing carbon dioxide.

  The secondary circuit may be operable at a pressure higher than 25 bar (2.5 MPa). More preferably, the secondary circuit is operable at 50 bar (5 MPa). Depending on the configuration, it is preferred that the secondary circuit can be operated at a maximum of 100 bar (10 MPa). If the system has only a primary circuit, the circuit can operate at about 100 bar (10 MPa).

  The volatile fluid is preferably carbon dioxide. The temperature of carbon dioxide accepted in the secondary heat exchanger may be in the range of 0 ° C. to 30 ° C., more preferably in the range of 12 ° C. to 16 ° C., preferably approximately 14 ° C., in which case The secondary circuit is configured to operate “in a dry state” under normal operating conditions where condensate formation on the coil is suppressed. In some other applications, lower operating temperatures may be selected to improve cooling efficiency, but if necessary, measures must be taken to treat the resulting condensate. For example, a pan and associated drains and pumps may be provided.

  The secondary heat transfer circuit may further include a pump or be sent by gravity.

  The unit may accept integrated carbon dioxide feed and return distribution piping, or such piping may be located outside the unit housing or casing.

  According to another aspect of the present invention, a primary heat transfer circuit, a secondary heat transfer fluid, a secondary condenser adapted to be cooled by the primary heat transfer circuit, and a secondary for cooling a workstation. A workstation cooling system having a secondary heat transfer circuit including a heat exchanger is provided.

  The secondary heat transfer fluid preferably has a volatile fluid. The secondary heat transfer fluid preferably contains carbon dioxide. In a preferred example, the primary heat transfer fluid in the primary heat transfer circuit may be cooling water, air, or other coolant, such as ammonia, rather than carbon dioxide.

  Each heat exchanger can be configured to cool one or more workstations. In this way, multiple workstations can be efficiently cooled even when the workstations are spaced from each other.

  The workstation cooling system preferably has a plurality of cooling units as described herein. Multiple cooling units may be included in a single secondary heat transfer circuit or multiple such circuits or a combination of these configurations.

  By locally cooling the workstation using the cooling unit, the workstation can be efficiently cooled, and in a preferred embodiment, a safe operating temperature of the equipment can be achieved. On the other hand, the user's discomfort placed at the workstation, which can occur in a configuration where cooling is performed using a high air flow rate, can be eliminated.

  According to another aspect of the present invention, there is provided a cooling unit for cooling a workstation, an air inlet, an air outlet, an air duct, and a heat exchanger constituting a part of a secondary heat transfer circuit, A cooling unit is provided.

  In use, the heat transfer fluid flowing in the heat transfer circuit is preferably a volatile fluid.

  The present invention also provides a workstation adapted to house a cooling unit as described herein. The workstation preferably includes a compartment that houses a cooling unit, and at least a portion of the cooling unit is provided within the compartment.

  Depending on the configuration, it is preferred that at least the heat exchanger of the unit is provided in the compartment. The compartment is preferably adapted to house a heat generating device.

  The compartment is preferably such that the device is at least partially provided within the compartment.

  The workstation preferably has a heat generating device, and the heat generating device preferably has a computer device.

  The compartment may be substantially sealed when the cooling unit and the heat generating device are stored in the compartment. Compartments can provide the ability to seal some heat. In this way, the heat generated from the equipment is confined to some extent in the compartment and is therefore more efficiently removed by using a cooling unit.

  In such a configuration, the compartment is sealed, but preferably not in an airtight state. Thus, the heat load is confined in a conceptually sealed unit so that heat is well absorbed by liquid carbon dioxide.

  In other configurations, the compartment is provided adjacent to the workstation, for example, in a floor cavity.

  The compartment may have insulation. A heat load insulating screen is used to form such a compartment. The screen can be formed, for example, from open cell or closed cell foam, overcoated mineral cotton panels, plaster boards, or other suitable panels.

  By installing the unit in the compartment, the equipment can also be protected from physical damage.

  According to one aspect of the present invention, a workstation including a device to be cooled and a cooling unit for cooling the device, the unit being filled with a heat transfer fluid and connected to a condenser for heat transfer circulation. A workstation is also provided having a heat transfer path adapted to form a path and a heat exchanger for cooling the equipment.

  The heat transfer fluid is preferably a volatile fluid.

  The heat exchanger may be provided below the workstation.

  The device may include a computer device.

  Another aspect of the present invention is a floor unit provided below a workstation area, in which a heat transfer fluid is placed and connected to a condenser to form a heat transfer circuit. And a heat exchanger for cooling the workstation area.

  The present invention also provides for the use of volatile fluids for heat transfer fluids in an apparatus for cooling a workstation. The heat transfer fluid preferably contains carbon dioxide.

  The present invention also provides a method for cooling a workstation, comprising circulating a fluid through a heat transfer circuit to a heat exchanger arranged to remove heat from the workstation.

  Where reference is made to workstation cooling, the reference preferably includes cooling of equipment located in the workstation environment.

  The heat transfer circuit has a secondary heat transfer circuit with a secondary condenser, and the method further includes circulating a fluid through the primary heat transfer circuit for cooling the secondary condenser. It is preferable.

  The present invention also provides a cooling unit, cooling device, cooling system, or workstation as described herein with reference to substantially any one or more of the accompanying drawings. Is done.

  The present invention also provides a cooling method for optionally cooling a workstation or computer equipment substantially as described herein.

  Any feature in one aspect of the invention can be applied in any appropriate combination with other aspects of the invention. In particular, method aspects may be applied to apparatus aspects and vice versa.

2 is a schematic flow diagram for an example of a single primary cooling system. 2 is a schematic flow diagram for an example primary and secondary cooling system. It is a perspective view of a workstation. FIG. 4 is a schematic cross-sectional view of a workstation of the type shown in FIG. It is a figure which shows the other structure of a workstation cooling unit. It is a figure which shows an example of a structure of the workstation which has the heat exchanger provided under the floor. It is a figure which shows an example of a structure of the workstation which has the heat exchanger provided under the floor. It is a figure which shows an example of a structure of the workstation which has the heat exchanger provided under the floor. It is a figure which shows the structure of another heat exchanger unit. It is a figure which shows another example of a heat exchanger unit. It is a figure which shows the structure by which a heat exchanger is provided in the space | gap of a ceiling. It is a figure which shows an example of the structure which a carbon dioxide flows into a several heat exchanger coil. It is a figure which shows an example of the structure which a carbon dioxide flows into a several heat exchanger coil. It is a figure which shows an example of the structure which a carbon dioxide flows into a several heat exchanger coil. FIG. 7 is a diagram showing still another cooling unit configuration for the cooling unit of FIGS. 6a, 6b, and 6c. FIG. 7 is a diagram showing still another cooling unit configuration for the cooling unit of FIGS. 6a, 6b, and 6c. FIG. 7 is a diagram showing still another cooling unit configuration for the cooling unit of FIGS. 6a, 6b, and 6c. It is a figure which shows the cooling structure which cools the array of computer equipment. It is a figure which shows the cooling structure which cools the array of computer equipment. FIG. 6 illustrates another cooling configuration for cooling an array of computer equipment. FIG. 6 illustrates another cooling configuration for cooling an array of computer equipment. FIG. 6 illustrates another cooling configuration for cooling an array of computer equipment. FIG. 6 illustrates another cooling configuration for cooling an array of computer equipment.

  Preferred features of the present invention will now be described, by way of example only, with reference to the accompanying drawings.

  FIG. 1 schematically illustrates the general operation of a primary only cooling system, and in particular shows the flow of fluid around a heat transfer circuit 20. The heat transfer circuit includes a condenser 30 that is cooled by any suitable method, a pump 32 that circulates fluid, an expansion device 34 that reduces the heat transfer fluid to a target vapor pressure, a heat exchanger 36, As will be described in detail below, it has one or more fans 38 included in a workstation cooling unit 12 that cools the equipment 10 in the workstation. The circulating fluid takes heat from around the fluid in the heat exchanger and returns to the condenser 30. In this way, the circulation path is completed. Instead of the pump 32, the circulation path may be sent by gravity.

  FIG. 2 schematically shows the general operation of the secondary cooling system, and in particular shows the flow of fluid around the primary heat transfer circuit 18 and the secondary heat transfer circuit 20. The primary heat transfer circuit 18 includes a compressor 22, a primary condenser 24, a primary expansion device 26, and an evaporator 28. The heat transfer fluid used in the primary circuit is a volatile primary refrigerant having a conventional composition. For example, cooling water, a refrigerant (eg, ammonia), or other cooling medium may be used as the primary refrigerant.

  The secondary heat transfer circuit 20 includes a secondary condenser 30 cooled by the evaporator 28, a pump 32 for circulating the fluid, a secondary expansion device 34 for reducing the heat transfer fluid to a target vapor pressure, And, optionally, one or more fans 38 included in a workstation cooling unit 12 that cools the equipment 10 at the workstation, as will be described in detail below. The circulating fluid takes heat from around the fluid in the heat exchanger and returns to the secondary condenser 30. In this way, the circulation path is completed. Instead of the pump 32, the secondary circuit may be sent by gravity.

  In this example, the heat transfer fluid circulating in the heat transfer circuit 20 is pressurized carbon dioxide. The advantages of using carbon dioxide are that it is readily available, inexpensive, relatively low toxicity, and non-polluting. However, most importantly, the specific heat of a conventional non-volatile cooling medium such as air is relatively low, whereas the latent heat of carbon dioxide is high, so a non-volatile secondary heat transfer fluid such as air The mass flow rate of carbon dioxide required to produce the same cooling effect is considerably lower than in systems using.

  Carbon dioxide reaches the heat exchanger in a volatile state at a temperature well below the local temperature that is suitable for cooling the surface area for heat exchange. The temperature should be in the range of 14 ° C in an environment with 45% to 55% relative humidity (typical office environment) at a dry bulb temperature of 20 ° C to avoid condensation on tubes and coils. Is preferred. Depending on the application, it is desirable to avoid such condensation, as water can drip, for example, near electrical equipment.

  The advantages of carbon dioxide as a volatile fluid are that it is readily available, inexpensive, relatively toxic, and non-polluting. An important property of carbon dioxide is that the specific heat of carbon dioxide is relatively low, whereas the latent heat of carbon dioxide is high, so it produces the same cooling effect compared to non-volatile media such as air and water. The required mass flow of carbon dioxide is quite low.

  In a preferred example, the operating pressure of the system is in the range of 50 bar (5 MPa). However, it may be higher or lower depending on the system configuration and the required cooling capacity.

  The use of carbon dioxide as a secondary cooling fluid is known and is described in GB 2258298. However, because air cooling is electrically benign and inherently safe, the use of carbon dioxide for local cooling of IT workstations, where air cooling has been dominant since the IT workstation field was born Was not previously considered suitable. Carbon dioxide is electrically benign, but not intrinsically safe. If you are not careful enough, carbon dioxide can cause health and safety problems. In the above configuration, the amount of carbon dioxide is small, but carbon dioxide is volatile, is used at high pressure, and is often used in a sealed space or a narrow space. The main dangers associated with the use of carbon dioxide at high pressure are (a) suffocation properties and (b) very low local temperatures with leaked fluid (adverse effects on nearby people or equipment). May give).

  In addition, monitoring cooling system degradation or failure is important in some cases to avoid equipment damage due to overheating and to implement maintenance and recovery measures if the cooling system fails locally. is there. The apparatus may include, for example, a gas detection device that detects leaks, similar to that described in co-pending British Patent Application No. 0515399.4. To make cooling effective, carbon dioxide is generally used at high pressure (above 50 bar (5 MPa)) for effective cooling, so leakage can be a problem. The coolant system incorporates leak detection means and life safety shut-off means, along with an exclusion system for safely handling leaked material.

  The cooling unit may be arranged below or above the workstation, for example under the floor (in the raised floor configuration or in the floor gap) or above the ceiling, for example in the ceiling gap.

  FIG. 3 is a perspective view of each part of the workstation 40. The illustrated workstation has two desk work surfaces 42, 44 and two footwells 46, 48, and the operator sits on each of the work surfaces 42, 44, facing each other. Located between the footwells 46, 48 is a computer equipment compartment 50 having a front wall 52 and a rear wall 54 facing the footwells 46, 48 and the side walls 56, 58. The front wall, the back wall, and the side walls define a compartment for the computer equipment. Each wall may be insulated as described in detail below.

  FIG. 4 shows a schematic cross-sectional view of a workstation of the type shown in FIG. A personal computer 60 is provided in the compartment. The workstation cooling unit 12 is located on the top of the compartment below the work surfaces 42 and 44, and is provided above the personal computer 60.

As schematically shown in FIG. 4, the workstation cooling unit includes a heat exchanger 36 and a fan arrangement 38, where the fan arrangement 38 is shown to include one fan. However, any number of fans may be included. In use, the computer 60 releases heat that is normally trapped in the compartment 50. A tube (not shown in FIG. 4) supplies CO ₂ to the heat exchanger 36 and receives CO ₂ from the heat exchanger. The cooling unit 12 includes an air inlet 62 and an air outlet 64, the fan arrangement 38 pumps air across the heat exchanger 36, and the cold CO ₂ removes heat from the compartment 50. In this configuration, air circulates in the compartment.

  FIG. 5 shows another configuration of the workstation cooling unit 12. Similar components have the same reference numbers as in FIG. In this configuration, the cooling unit 12 is provided to extend from the computer equipment compartment 50 through the work surface to above the desk. Further, the inlet pipe and the outlet pipe 66 reach the cooling unit 12 from below the floor through the chamber 50 and supply carbon dioxide to the heat exchanger 36. In this configuration, the fan 38 is configured to allow air to pass from the compartment 50 to the air inlet 62, pass over the heat exchanger 36, and pump upward through the air outlet 64. (Alternatively, the fan is configured to blow air down through the compartment and toward the floor.) The air outlet 64 may be coupled to an air duct to send air away from the workspace. However, in the illustrated example, air is released into the space above the desk work surfaces 42, 44. The air outlet 64 having this configuration is disposed at a position approximately 80 mm above the work surface.

  Depending on the configuration, for example, the cooling unit 12 may have an airflow extraction duct in consideration of air release characteristics of the computer equipment. Such ducts, in conjunction with the air inlet 62 of the unit and / or the air outlet of the computer equipment, direct the hot air exiting the equipment towards the cooling unit. The duct design depends on the configuration of the computer air outlet. Depending on the configuration, specific ducts may be designed for specific equipment. However, it is preferable that the duct dimensions can be changed by the duct design. For example, the duct may be adapted to extend from near the air outlet of the computer equipment towards the cooling unit. The duct or snorkel may be composed of a rigid material or may comprise a flexible material, for example in the form of a hose, in which case the snorkel can be operated to face the air outlet of the computer equipment Can be. The snorkel may have a certain length or be stretchable, for example stretchable. One end of the snorkel may be attachable to the cooling unit near the air inlet. The other end of the snorkel can be located in the region of the air outlet of the computer equipment.

  The extracted air may be delivered from the cooling unit using a fan, which is one unit per snorkel, or a plurality of units comprising a fan system with backup units and / or surplus. The plurality of fans may be provided in series or in parallel. A parallel fan assembly may incorporate a check valve to avoid inadequate circulation between the fan units. Air can be sucked or blown across a heat exchanger supplied with liquid carbon dioxide.

In a preferred configuration, the CO ₂ pressure is 50 bar (5 MPa) and the circulation temperature is 14 ° C. Depending on the configuration, loads up to 5 kW per workstation can be accommodated. With this configuration, it is also known that the air discharged from the air outlet 64 is close to room temperature. This is accomplished, for example, by selecting an appropriate carbon dioxide flow rate and / or pressure. Depending on the configuration, it may be advantageous to provide a temperature sensor that determines the temperature of the released air, and the output of this sensor may be used to adjust the flow rate and / or pressure to maintain the desired temperature. Can do.

  In another example using the configuration shown in FIG. 5, a fan configuration 38 is used to blow air into the compartment 50 from above the workstation (ie, downward in the configuration shown in FIG. 5). A grill (not shown) is provided in the base of the floor compartment for venting air near the computer equipment below the workstation.

  In the configuration of FIG. 5, the front wall 52 and the rear wall 54 include an insulator 68. In this case, the insulator includes a closed cell foam, but other materials may be used. An insulator is also provided on the side wall (not shown). Walls and insulators extend from the floor to the underside of the desk work surface to form a sealed insulation compartment 50. Thus, the heat generated from the computer 60 is generally retained in this compartment and removed by the cooling unit 12.

  The heat transfer capacity of carbon dioxide makes it possible to use smaller heat exchangers. Thus, the cooling unit can be smaller than that of a similar configuration that was possible with a similar unit using cooling water. Such smaller unit sizes are advantageous when using the unit in an office environment where space is limited and the wiring and cables are usually dense.

  Depending on the configuration, several units may be provided together. For example, a series of cooling units 12 may be provided side by side. If the cooling unit is provided as part of a series, each part may be, for example, 5 meters long. However, a longer or shorter part may be used as necessary.

  The unit has a gas detection monitoring chamber. By monitoring the gas in this chamber, the presence of carbon dioxide can be detected and thus the health of the heat exchanger can be monitored. An automatic shut-off safety device that shuts off the supply of carbon dioxide to the cooling unit may be provided. The notification device can inform the user of any problem with the gas flow.

  The cooling unit may incorporate a connecting chamber connectable to the carbon dioxide feed distribution pipe and the return distribution pipe. The chamber may incorporate some or all control valves and gas detection and monitoring equipment. By providing a gas detection monitoring device, leaks associated with carbon dioxide piping connections and / or control valves can be efficiently detected.

  A gas detection and monitoring instrument is described in co-pending UK patent application No. 0515399.4, which is incorporated herein by reference.

  It will be appreciated that a gas detection and monitoring device similar to that described in UK Patent Application No. 0515399.4 can be incorporated into any of the cooling device examples described herein.

  Figures 6a, 6b, and 6c show other workstation configurations. FIG. 6a is a cross-sectional side view of a desk that includes computer equipment 360 and an associated cooling unit. In this example, a part of the cooling unit is provided below the raised floor 340. The workstation has a desk that includes two work surfaces 342 and 344. In this case, the desk has a back-to-back configuration for two users, and a compartment that houses the computer equipment 360 for both desks is located below the desk. However, a similar configuration may be used for a single desk.

  The compartment has a roof 371 and walls 354, 356 as shown. The wall has a heat load screen that extends downward from the roof 371 to a position above the floor 340. The gap between the wall and the floor forms a gap for ventilation. The raised floor 340 in the compartment is provided with a ventilation grill 370 that ventilates between the compartment and the cavity 362 under the floor.

  The computer equipment 360 stands on the raised floor, and a heat exchanger 336 including a coil for carbon dioxide is provided in a floor cavity 362 below the raised floor. This configuration is illustrated in detail in the plan view of FIG.

  A snorkel device 374 including a fan 376 is disposed at the air outlet 372 of the computer equipment 360. The snorkel device 374 extends from the air outlet 372 to the inlet hole 380 of the floor grill 370. When the fan is activated, air is drawn from the air outlet 372 of the computer 360 through the snorkel device 374 (beyond the fan 376), through the inlet hole 380 and into the floor cavity 362 where it passes above the heat exchanger 336. Passes and then exits the floor cavity through the grill 370. The snorkel device may be configured to have several inlets that collect air from several outlet locations on the instrument.

  FIG. 6 c shows a rear view of the snorkel device 374 and computer 360 configuration.

  As can be seen from FIG. 6b, the heat exchanger 336 extends below some workstations to cool some computer equipment. In this configuration, there may be two or more computer devices below each desk, and the heat exchanger 336 can cool both of these computer devices. Furthermore, if several workstations are placed together, the heat exchanger can extend across several workstations and cool some workstations.

  Manifold chamber 390 is provided at the end of each coil and includes a gas detection device similar to that described in British Patent Application No. 0515399.4.

  In any example showing an integral fan, it can be coupled to each workstation through a ducted ventilation system.

  FIG. 7 shows the configuration of another heat exchanger unit 410 in which the heat exchange coil 400 is arranged on the floor (as opposed to under the floor of the configuration of FIG. 6a).

  The heat exchanger unit 410 is formed to have a size similar to the standard floor tile 412 so that it can be easily installed in the floor on the floor 414. The heat exchanger unit has a base 416, a side wall 418, and a roof having a central solid portion 420 and two parallel grilling portions 422 extending along two sides of the roof of the unit. Yes. The heat exchanger is provided below the solid part 420 in the unit. Carbon dioxide is supplied to the coil by a feed pipe and a return pipe provided in the floor gap 426. The carbon dioxide supply tube 428 includes a steel cover 430 to protect it from damage.

  The heat exchanger has a planar coil attached so that the plane is inclined with respect to the base of the unit. In this way, the unit is mounted below the workstation's snorkel, and the fan configuration blows hot air from the equipment through one of the grills 422 into the unit, passing over the tilted coil and passing through the other grille 422. It is configured to discharge. In this way, hot air from the device can be cooled.

  FIG. 8 shows another example of the heat exchanger unit. This configuration is similar to the configuration of FIG. 7, and the same parts are denoted by the same reference numerals. However, in the configuration of FIG. 8, the carbon dioxide supply pipe 428 is disposed directly below the base 416 of the unit 410. Thus, the carbon dioxide supply pipe 424 is shorter and the unit does not reach the floor gap 426. This has the advantage that there is little possibility of interfering with a power supply member already present in the floor gap, for example a cable. However, it will be appreciated that the height of the unit of FIG. 8 is greater than the height of the unit of FIG. 7, and that the configuration of FIG.

  Further, in the configuration of FIG. 8, an inlet 432 through which air flows in particularly from a snorkel device (for example, see FIG. 6a) is provided in one of the grills. The air flow through the unit is indicated by arrows.

  FIG. 9 shows a configuration in which the heat exchanger is provided in the ceiling gap. In this configuration, the floor may again have an underfloor 612 provided on the floor 614, but in this configuration, the floor gap is separated from the cooling device to provide, for example, a cable space. Can be wide.

  In this configuration, the computer device 660 is disposed below the desk 600 in the workstation 610. The duct 612 extends upward from the position adjacent to the computer device 660 below the desk 600 through the desk top 614 to the ceiling 615. The inlet forming unit 618 is provided at the lower end of the duct 612 and sends air to the duct 612 from the outlet of the computer device 660.

  The ceiling 615 has a roof-shaped ceiling 616 below the ceiling gap 620. A heat exchanger coil 622 is provided in the ceiling gap 620. The feed pipe 624 and the return pipe 625 supply carbon dioxide to the coil 622 in the same manner as described above. The duct extends upward through the roof-shaped ceiling 616 to the coil 622. A fan configuration 626 is provided at the top of the duct 612 adjacent to the coil 622. Fan configuration 626 is configured to send air from computer equipment 660 upwardly through duct 612 and from above coil 622 into ceiling gap 620. Air is cooled as it passes over the coil 622.

  FIGS. 10a, 10b, and 10c show three different configurations for supplying carbon dioxide to a plurality of heat exchanger coils and receiving carbon dioxide from the plurality of heat exchanger coils.

  10a, 10b, and 10c, the carbon dioxide feed pipe 700 and the carbon dioxide return pipe 702 supply carbon dioxide to the plurality of heat transfer coils 710. Valves 720 and 721 are provided to control the flow of carbon dioxide within the system. In the configuration of FIG. 10a, the double coil units can be arranged in parallel by the arrangement of the valves, whereby other coils can be arranged in series. 10b and 10c show another configuration.

  FIG. 11a shows an alternative cooling unit configuration to the cooling unit configuration shown in FIG. 6a. In the configuration of FIG. 11, the snorkel or duct 374 ′ has a flexible hose 500 that extends from an inlet formation 502 that surrounds the outlet region 504 of the instrument to a fan configuration 376.

  A cable path enclosure 506 is positioned below the workstation and above the coil to receive cables from equipment, cooling units, and / or other cables. A drain point 508 for removing water condensed on the coil may be provided below the heat exchanger.

  In FIG. 11b, unlike FIG. 6b, it allows for various snorkel positions, thus providing flexibility with respect to placement of equipment at the workstation and / or providing each equipment with more than one snorkel or hose configuration for cooling. It can be seen that another inlet 380 is provided in the grill 370 to improve.

  Figures 12a and 12b show a cooling arrangement for cooling an array of computer equipment.

  FIG. 12a shows a schematic plan view of an array of eight computer equipment 800 arranged side by side below a desk (not shown). The width of the desk may be 1600 mm (A), for example, and the depth (B) of the desk may be 600 mm.

  In the configuration of FIGS. 12a and 12b, the cooling configuration for cooling the computer device 800 may be the same as the cooling configuration of FIGS. 6a to 6c, for example.

  Referring to FIG. 6c, the coil unit extends below the entire array of eight computer equipment 800, with the computer equipment being located between the ventilation grills.

  FIG. 12b shows a side view of the heat exchanger coil 810 provided below the computer equipment 800 (in this configuration, the coil is tilted to allow more efficient cooling). For example, similar to the configuration shown in FIG. 8, hot air from the computer equipment passes through one of the ventilation grills 820 above the coil 810 and exits through the opposite ventilation grill 840.

  In many cases, the air inlet and air outlet are in the same direction for each computer device, but in this configuration, the air inlet grill and the air outlet grill are interchangeable. Therefore, in this configuration, the direction of the air flow may be any direction across the coil 810. This has the advantage that the computer equipment can be oriented in the most convenient orientation for the user, i.e. the air outlet of the equipment is directed to the grill 820 or grill 840.

  In addition, as shown in the configuration of FIGS. 12a and 12b, one or more drive members can be provided for a particular portion of the coil 810 so that the air flow can be controlled.

  In the configuration of FIG. 12a, a dividing plate 850 is provided between two computer devices. The plate extends substantially vertically through the passage that includes the heat exchanger coil 810, and more preferably extends through the lower compartment of the desk that contains the computer equipment. In the configuration shown in FIG. 12b, the coil passes through the plate 850.

  By separating the air flow at the two sides of the dividing plate 850, the air flow at the two sides may be different. As shown in FIG. 12a, the air flow on one side of the split plate may be in the opposite direction to the air flow on the other side. Thus, on one side of the plate 850, the grill is an air inlet grill 820 for the hot air arising from the equipment E1-E4. On the other side of plate 850, the grill is an air outlet grill 840 'for equipment E5-E8. Similarly, on one side of the plate, the other grill is hot air from the air outlet grill 840 or equipment E1-E4, and on the other side the grill is an air inlet grill 820 ′ for equipment E5-E8. Is configured.

  Thus, the split plates allow flows in opposite directions to each other, thus obviating the need to direct all of the equipment in the same direction. Since the equipment is typically directed towards the user, the use of a dividing plate can provide more flexibility for various desk workstation layout possibilities.

  It will be appreciated that further changes in the air flow using other dividing plates can provide more flexibility with respect to the placement of the equipment relative to the cooling unit.

  Figures 13a to 13d show a cooling arrangement for cooling an array of computer equipment. FIGS. 13 a and 13 b each show a perspective view and a side cross-sectional view of a workstation 900 that includes a desk 910 and is arranged so that two users can work on each other at the desk 910. An insulating compartment 914 provided with a plurality of computer devices 916 is positioned below the work surface 912 of the desk. The configuration of the compartment 914 is similar to the configuration in the example shown in FIG. In this configuration, a double wall configuration including a heat load screen is used.

  From the perspective view of FIG. 13a and the top view of this configuration shown in FIG. 13c, it can be seen that the compartment 914 extends across the width of the desk 910 and houses eight computer devices 916A-916H.

  The structure of the cooling device is similar to the configuration of FIGS. 6 and 11 except that the air directing structure that defines the direction of air is not provided in the desk. A cooling unit 918 having a plurality of floor tile replacement units (600 mm square) is provided below the compartment 914. The cooling unit 918 extends across (optionally beyond) the width of the desk 910 and includes an air flow path 919 provided with a vertically disposed heat exchanger coil 920 and a fan 922. The carbon dioxide supply pipe 923 supplies carbon dioxide to the coil 920. A manifold chamber is provided at each end of the coil and includes a gas detector.

  The air flow path of the cooling unit 918 is in communication with the inside of the compartment via air inlet and outlet grills 924, 926. The computer equipment is placed on the floor of the compartment 914 and at least partially above the grilles 924, 926 and rests on a platform 928 with a perforated hole. Accordingly, the air flow to the grill is hardly obstructed by the computer equipment 916. The protruding platform allows air to enter the underfloor plenum.

  Referring to FIG. 13a, when the fan is activated, air circulates between the compartment 914 and the air flow path 919. Specifically, hot air exiting the computer air outlet 930 passes through the compartment 914 to the air inlet grille 924, is drawn into the air flow path 919 by the fan 922, passes over the coil 920, There, the air is cooled.

  In this way, the device can be effectively cooled. For example, in a configuration similar to that described above, the air exiting outlet 930 may have a temperature of 30 ° C. to 35 ° C., and the cooled air entering compartment 914 has a temperature of about 15 ° C. Can do. Depending on the configuration, another fan may be provided on the upstream side of the coil 920 in the air flow path 919.

  Referring to FIG. 13c, similar to the method of the configuration of FIG. 12, the air flow path is provided so that the air flow in the reverse direction with respect to the devices 916E to 916H can be realized at the portion of the compartment for cooling the devices 916A to 916D. It can be seen that a dividing plate 932 is provided therein. Thus, the dividing plate forms two air flow paths below the desk, and the coil extends through both air flow paths.

  This configuration is shown in FIG. 13d, which is a schematic perspective view of each part of the cooling unit 918.

  From FIGS. 13c and 13d, it can be seen that a single coil is provided across the array of devices, with one fan configuration for each pair of computer devices. It will be appreciated that other configurations are possible. For example, other divisions to form other air flow paths (eg, so that only one fan is provided in each flow path) and / or to partition compartment 914 to further direct the air flow A plate may be provided.

  In this configuration, two users sitting at the desk facing each other can each have a plurality of computer devices facing the user. On the other hand, it will be appreciated that a common cooling unit configuration can be used to increase efficiency by cooling all equipment on the workstation.

  It will be understood that the present invention has been described by way of example only and that details can be modified within the scope of the invention.

  Each feature disclosed in the description and (where appropriate) the claims and drawings may be provided independently or in any appropriate combination.

Claims (49)

A heat transfer path in which a heat transfer fluid is placed and connected to a condenser to form a heat transfer circuit;
A workstation cooling unit having a heat exchanger for cooling the workstation.   The cooling unit of claim 1, wherein the heat transfer fluid comprises a volatile fluid.   The cooling unit according to claim 2, wherein the heat transfer fluid includes carbon dioxide.   The cooling unit according to any one of claims 1 to 3, wherein the heat exchanger is provided in the workstation.   The cooling unit according to claim 4, wherein the heat exchanger is adapted to be at least partially provided in the workstation.   The cooling unit according to claim 1, wherein the heat exchanger includes a finned coil.   The cooling unit according to claim 1, further comprising a leak detection device that detects a leak of the heat transfer fluid.   The cooling unit according to any one of claims 1 to 7, further comprising a fan adapted to move air above the heat exchanger.   The cooling unit according to any one of claims 1 to 8, wherein the heat exchanger is disposed in an air flow path.   The cooling unit according to claim 9, wherein a fan is provided in the air flow path.   The cooling unit according to claim 9 or 10, comprising a plurality of air flow paths.   The said heat exchanger is provided in an air chamber, The said apparatus further has a division member which divides | segments the said air chamber and forms a some air flow path, It is any one of Claim 1 to 11 Cooling unit.   13. A cooling unit according to any one of claims 8 to 12, further comprising a housing having an air inlet and an air outlet, wherein the fan is configured to move air from the inlet to the outlet.   The cooling unit according to claim 1, wherein the unit further includes an air directing structure.   The cooling unit of claim 14, wherein the air directing structure includes a duct that directs air.   The cooling unit according to claim 15, wherein the duct further includes an inlet forming portion, and the inlet forming portion surrounds an outlet of the device.   The cooling unit according to claim 16, wherein the duct includes a plurality of inlet forming portions surrounding a plurality of outlet regions of the device.   The cooling unit according to any one of claims 15 to 17, wherein the duct has a flexible hose.   The cooling unit according to any one of claims 15 to 18, comprising a fan disposed in the duct.   The cooling unit according to any one of claims 1 to 19, wherein the heat exchanger is provided below the workstation.   The cooling unit according to any one of claims 1 to 20, wherein the heat exchanger is provided on a floor surface or immediately above the floor surface.   The cooling unit according to any one of claims 1 to 21, further comprising a cable management structure.   The cooling unit according to any one of claims 1 to 22, wherein the heat exchanger is adapted to cool a plurality of workstations.   24. A cooling unit according to any one of claims 1 to 23, adapted for use in a secondary heat transfer circuit of a cooling system.   A condenser connected to the cooling unit according to any one of claims 1 to 24 and the heat transfer path forming a secondary heat transfer circuit, and is cooled by the primary heat transfer circuit. And a cooling device. A primary heat transfer circuit,
A secondary heat transfer fluid circuit, a secondary condenser adapted to be cooled by the primary heat transfer circuit, and a secondary heat transfer circuit including a secondary heat exchanger for cooling the workstation. Workstation cooling system.   28. A workstation cooling system according to claim 27, comprising a plurality of cooling units according to any one of claims 1 to 24.   A cooling unit for cooling a workstation, comprising an air inlet, an air outlet, an air duct, and a heat exchanger that forms part of a secondary heat transfer circuit.   25. A workstation adapted to house a cooling unit according to any one of the preceding claims.   30. The workstation of claim 29, including a compartment that houses the cooling unit, wherein at least a portion of the cooling unit is provided in the compartment.   31. A workstation according to claim 30, wherein a heat generating device is adapted to be stored in the compartment.   32. The workstation of claim 31, comprising a heat generating device, preferably the heat generating device comprises a computer device.   33. A workstation according to claim 31 or 32, wherein the compartment is adapted to be substantially sealed when the cooling unit and equipment are housed within the compartment.   34. A workstation according to any one of claims 31 to 33, wherein the compartment comprises a thermal insulator. A workstation having equipment to be cooled and a cooling unit for cooling the equipment, the unit comprising:
A heat transfer path in which a heat transfer fluid is placed and connected to a condenser to form a heat transfer circuit;
And a heat exchanger for cooling the equipment.   36. The workstation of claim 35, wherein the heat transfer fluid is a volatile fluid, preferably carbon dioxide.   37. A workstation according to claim 35 or claim 36, wherein the heat exchanger is provided below the equipment.   38. A workstation according to any one of claims 29 to 37, wherein the device comprises a computer device. A floor unit provided below the workstation area, in which a heat transfer fluid is placed and connected to a condenser to form a heat transfer circuit;
A floor unit having a heat exchanger for cooling the workstation area.   Use of volatile fluids in heat transfer fluids in equipment that cools workstations.   41. Use according to claim 40, wherein the heat transfer fluid comprises carbon dioxide. A method of cooling a workstation,
Circulating a fluid through a heat transfer circuit to a heat exchanger located adjacent to or within the workstation. A method of cooling a workstation,
Circulating the fluid through a heat transfer circuit to a heat exchanger arranged to remove heat from the workstation.   44. A method according to claim 42 or claim 43, wherein the fluid is a volatile fluid, preferably carbon dioxide. The heat transfer circuit includes a secondary heat transfer circuit having a secondary condenser,
45. The method of any one of claims 42 to 44, wherein the method further comprises circulating a fluid through a primary heat transfer circuit and cooling the secondary condenser.   A cooling unit substantially as described herein with reference to any one or more of the accompanying drawings.   A cooling device or system as substantially described herein with reference to any one or more of the accompanying drawings.   A workstation substantially as described herein with reference to any one or more of the accompanying drawings.   A cooling method that optionally cools a workstation or computer equipment, substantially as described herein.

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