JP2009290141A - Semiconductor module and method for manufacturing the same, and mobile device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor module having a simple configuration in which electromagnetic interference is suppressed. <P>SOLUTION: The method for manufacturing a semiconductor module includes the steps of: preparing a semiconductor module 10 having a semiconductor element 14 mounted on a substrate for mounting an element; placing a metal foil 30 on the top surface of a package 28 including the semiconductor element 14; and reforming the shape of a part of the metal foil 30 that is not covering the top surface of the package 28 so as to follow the side faces of the package 28. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor module, a manufacturing method thereof, and a portable device.

In recent years, electronic devices using semiconductor elements have been developed in various fields, and their applications and usage environments are diverse. Therefore, it is necessary to protect the semiconductor element from various environments. Specifically, for example, it is necessary to prevent intrusion of moisture and impurities. In addition to the intrusion of these impurities, there is a problem of so-called electromagnetic interference (EMI) in which electromagnetic waves generated from electronic devices affect the operation of other electronic devices. As one of various techniques for preventing such electromagnetic interference, a so-called can sealing technique is known in which a substrate provided with a semiconductor element is covered with a housing processed with a metal plate.
JP 2004-260103 A

  By the way, in recent years, further simplification of the configuration and simplification of the process have been demanded in response to the demand for miniaturization, low profile, and low cost of the semiconductor module. However, in the method such as the above-described can sealing, it is necessary to manufacture the housings one by one and attach them to the substrate, resulting in an increase in manufacturing cost. There are also problems of an increase in the material cost of the metal plate and an increase in the thickness of the entire package.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a semiconductor module having a simple configuration that is shielded from the external environment.

  In order to solve the above problems, a semiconductor module according to an aspect of the present invention includes a substrate, a semiconductor element mounted on the substrate, and a shielding film that covers the package along the shape of the package including the semiconductor element. .

  According to this aspect, since the semiconductor element is shielded from the external environment by a simple structure that is easy to process as a shielding film, it is possible to prevent moisture or impurities from entering or electromagnetic interference, and stabilize the operation of the semiconductor element. be able to.

  The shielding film may be an insulating film. Thereby, a short circuit with another member and the apparatus with which it is mounted | worn is prevented.

  Another embodiment of the present invention is also a semiconductor module. The semiconductor module includes a substrate, a semiconductor element mounted on the substrate, and a metal foil covering at least the upper surface of the package along the shape of the package including the semiconductor element.

  According to this aspect, the electromagnetic wave received by the semiconductor element from the external environment is shielded by the metal foil, and not only the received electromagnetic wave but also the electromagnetic wave oscillated from the semiconductor element and directed to the adjacent semiconductor element is shielded by the metal foil. Can be suppressed. In addition, the semiconductor module can be reduced in height as compared with the can sealing.

  The metal foil may be given a fixed potential. Thereby, the electromagnetic interference which the semiconductor element in the area | region covered with metal foil receives can be prevented more reliably. More preferably, the metal foil may be electrically connected to a ground terminal provided on the substrate.

  The metal foil may be deformed so that a portion along the side in the thickness direction of the package of the portion covering the package is folded. Thereby, for example, it becomes possible to more reliably protect the semiconductor element from electromagnetic interference caused by concentration of electromagnetic waves at the corners when the package is polygonal.

  Another aspect of the present invention is a method for manufacturing a semiconductor module. This method includes a preparation step of preparing a semiconductor module on which a semiconductor element is mounted on a substrate, an arrangement step of arranging a shielding film on an upper surface of a package including the semiconductor element, and an upper surface of the package among the shielding films. A deforming step of deforming a portion not covered along the side surface of the package.

  According to this aspect, the shielding film that can protect the semiconductor element from the external environment can be easily formed on the semiconductor module.

  Another aspect of the present invention is a method for manufacturing a semiconductor module. This method includes a preparation step of preparing a semiconductor module on which a semiconductor element is mounted on a substrate, an arrangement step of disposing a metal foil on the upper surface of the package including the semiconductor element, and covering the upper surface of the package of the metal foil. And a deforming step of deforming a portion that is not along the side surface of the package.

  According to this aspect, the metal foil that can protect the semiconductor element from electromagnetic interference can be easily formed on the semiconductor module.

  You may further include the connection process which connects a metal foil to the wiring layer into which a fixed electric potential is input among board | substrates after a deformation | transformation process. Thereby, the semiconductor module which can protect a semiconductor element from electromagnetic interference more reliably can be manufactured simply. Here, it is more preferable that the wiring layer is electrically connected to the ground terminal.

  In the deforming step, the metal foil may be deformed toward the side surface of the package by a differential pressure between the front side and the back side of the metal foil. As a result, a thin metal foil can be easily brought into close contact with the shape of the package, and the manufacturing cost and the number of processes can be reduced.

  Another embodiment of the present invention is also a semiconductor module. The semiconductor module includes a substrate, a semiconductor element mounted on the substrate, a metal foil covering the upper surface and side surfaces of the package along the shape of the package including the semiconductor element, and a wiring layer formed on the substrate And a conductive member that covers the side surface of the package from the outside of the metal foil so as to conduct the portion to which the fixed potential is input and the metal foil.

  According to this aspect, the electromagnetic interference that the semiconductor element receives can be suppressed by the metal foil. In addition, the semiconductor module can be reduced in height as compared with the can sealing.

  Yet another embodiment of the present invention is a method for manufacturing a semiconductor module. In this method, a sealing member is formed in a state where a plurality of semiconductor elements are aligned and mounted on a substrate, and a wiring layer formed on the substrate and the semiconductor elements are connected. A preparation step of preparing a package sealed by the step, an exposure step of removing a sealing member in a region between a plurality of semiconductor elements to expose a portion of the wiring layer to which a fixed potential is input, and a plurality of steps An arrangement step of disposing a metal foil on the upper surface of a package including the semiconductor element, a cutting step of cutting a portion of the metal foil above the space from which the sealing member is removed, and a conductive member from the cut portion to the space And a separation step of separating the package for each semiconductor element.

  According to this aspect, the metal foil that can protect the semiconductor element from electromagnetic interference can be easily formed on the semiconductor module. Moreover, after disposing a metal foil on the upper surface of a package including a plurality of semiconductor elements, the metal foil is cut by the space between the semiconductor elements, and the space is filled with a conductive member, whereby the metal foil is made into a semiconductor by the conductive member. It is deformed and fixed so as to be in close contact with the side surface of each package including the element. Thereby, it becomes possible to manufacture a plurality of semiconductor modules including a metal foil that suppresses electromagnetic interference that the semiconductor element receives, and the manufacturing cost is reduced.

  The portion exposed by the exposure process may be electrically connected to the ground terminal. Thereby, the electromagnetic interference which the semiconductor element in the area | region covered with metal foil receives can be prevented more reliably.

  Yet another embodiment of the present invention is also a semiconductor module. This semiconductor module includes a substrate, a wiring layer formed on the substrate, a semiconductor element mounted on the substrate, a sealing member for sealing the wiring layer and the semiconductor element, and one end portion of which is a wiring A wire connected to the layer, the other end passing through the sealing member and reaching the upper surface of the sealing member, and a conductive formed on the sealing member so as to be electrically connected to the other end of the wire And a metal foil covering the upper surface of the conductive member.

  According to this aspect, the electromagnetic interference that the semiconductor element receives can be suppressed by the metal foil.

  One end of the wire may be connected to a portion of the wiring layer to which a fixed potential is input. Thereby, the electromagnetic interference which the semiconductor element in the area | region covered with metal foil receives can be prevented more reliably. More preferably, the metal foil may be electrically connected to a ground terminal provided on the substrate.

  Yet another embodiment of the present invention is also a method for manufacturing a semiconductor module. This method includes a preparation step of preparing a package in which a plurality of semiconductor elements are arranged and mounted on a substrate and a wire is connected to a ground terminal, and the package is sealed to the extent that a part of the wire is exposed. A sealing step of sealing with a stop member, a removing step of removing a sealing member in a region between a plurality of semiconductor elements, and a space for covering the exposed wire and removing the sealing member A covering step of covering the package with a conductive member, an attaching step of attaching a metal foil to the upper surface of the conductive member, and a separation step of separating the package in a space filled with the conductive member for each semiconductor element. Including.

  According to this aspect, the metal foil that can protect the semiconductor element from electromagnetic interference can be easily formed on the semiconductor module. Moreover, since it coat | covers with an electroconductive member so that a part of exposed wire may be covered, the adhesiveness of a package and an electroconductive member increases. In addition, since the upper surface of the package is covered with the conductive member and the metal foil, and the side surface of the package is also covered with the conductive member, it is possible to more reliably prevent the electromagnetic interference that the semiconductor element receives. Moreover, it becomes possible to manufacture a plurality of semiconductor modules including a metal foil that suppresses the electromagnetic interference that the semiconductor element receives, and the manufacturing cost is reduced.

  Yet another embodiment of the present invention is a portable device. This portable device is equipped with the semiconductor module according to any one of the above-described aspects.

  According to the present invention, it is possible to provide a semiconductor module having a simple configuration which is shielded from the external environment or shields the radiation of electromagnetic waves from a semiconductor element to the external environment (for example, including an adjacent semiconductor chip). it can.

  An example of the present invention is a substrate, a semiconductor element mounted on the substrate, a shielding film that covers the package along the shape of the package including the semiconductor element, and shields moisture, impurities, or electromagnetic waves from the outside, It is a semiconductor module provided with. As the shielding film, a thin member that can be easily deformed, such as an insulating film or a metal foil, can be used. In the following description, a semiconductor module employing a metal foil suitable for suppressing electromagnetic interference will be described. However, for example, an insulating film may be employed from the viewpoint of preventing a short circuit due to moisture or impurities. Needless to say, the following configurations and manufacturing methods can be applied even in the case of an insulating film.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate. Moreover, the structure described below is an illustration and does not limit the scope of the present invention at all.

(First embodiment)
[Structure of semiconductor module]
FIG. 1 is a schematic cross-sectional view showing the configuration of the semiconductor module according to the first embodiment. As shown in FIG. 1, the semiconductor module 10 according to the first embodiment includes an element mounting substrate 12, a semiconductor element 14 and a wiring pattern 16 provided on the upper surface of the element mounting substrate 12, and a semiconductor element 14. And a bonding wire 18 which is a conductive member for electrically connecting the wiring pattern 16 and the wiring pattern 16. A wiring pattern 20 made of copper to which external connection terminals are connected is provided on the lower surface of the element mounting board 12.

  The electrical connection between the wiring pattern 16 and the wiring pattern 20 is made through a conductor portion 22 a provided on the inner wall surface of a via hole that penetrates the insulating substrate 22. The solder resist 24 protects the surface of the wiring pattern 20. Further, the upper surface of the element mounting substrate 12 and the semiconductor element 14 mounted on the element mounting substrate 12 are sealed with a sealing resin layer 26 to form a package 28 having a desired shape.

  The semiconductor module 10 according to the present embodiment is covered with a metal foil 30 along the shape of the package 28. In the present embodiment, the metal foil 30 is fixed via the adhesive 32, but may be fixed by, for example, pressure bonding or static electricity. The metal foil 30 is preferably an aluminum foil having a thickness of 15 to 50 μm, for example. Thus, by covering the semiconductor element 14 with the metal foil 30, the electromagnetic interference that the semiconductor element 14 receives is suppressed. In addition, when the metal foil 30 is used compared to the conventional can sealing, the space (distance) between the metal foil and the package can be reduced, so the semiconductor module 10 can be reduced in height. can do.

  Further, in the semiconductor module 10 according to the present embodiment, a part of the wiring pattern 20 functions as the ground terminal 34 that is electrically connected to the external ground potential, and the metal foil 30 is electrically connected to the ground terminal 34. . Therefore, when the semiconductor module 10 is mounted on an electronic device, the entire metal foil 30 is held at a fixed potential such as a ground potential, so that the electromagnetic interference that is received by the semiconductor element 14 in the region covered with the metal foil 30 Can be prevented more reliably. The semiconductor module 10 may be covered with an insulating film instead of or in addition to the metal foil. As a result, moisture and impurities are prevented from entering the semiconductor element, and deterioration of the semiconductor element due to short circuit and oxidation is prevented.

[Production method]
Next, a method for manufacturing the semiconductor module according to the first embodiment will be described. FIG. 2A to FIG. 2D are schematic cross-sectional views for explaining steps in the method for manufacturing the semiconductor module 10 according to the first embodiment.

  First, as shown in FIG. 2A, the semiconductor module 10 in the state of a package 28 sealed with a sealing resin layer 26 is prepared, and a metal foil 30 coated with an adhesive 32 on one side is packaged. A part of the metal foil 30 is fixed via an adhesive 32.

  Next, as shown in FIG. 2B, the semiconductor module 10 is placed on the flat support substrate 36 in the above-described state, and the space 38 between the metal foil 30 and the support substrate 36 is decompressed. At this time, the space between the front side (the upper side in the figure) and the back side (the supporting substrate side in the figure) of the metal foil 30 is blocked.

  Therefore, the metal foil 30 is deformed along the side surface of the package 28 by the differential pressure between the front side and the back side of the metal foil 30 as shown in FIG. As an example of decompression, a package in which a metal foil with an adhesive is arranged on the top surface is placed on a stage, and the package and the stage on which the package is placed are closed, for example, a flexible nylon bag, etc. And the inside of the bag is depressurized by discharging the air therein using a suction device. Thereby, the space 38 can be decompressed.

  Thereby, the metal foil 30 that can protect the semiconductor element 14 from electromagnetic interference can be easily formed so as to cover the semiconductor module. In addition, the thin metal foil 30 can be easily brought into close contact with the shape of the package, and the manufacturing cost and the number of processes are reduced. The shape of the support substrate is not limited to a flat shape. FIGS. 16A and 16B are schematic cross-sectional views for explaining a process in the case where a support substrate having another shape is used in the method for manufacturing a semiconductor module according to the first embodiment. As shown in FIG. 16A, the support substrate 137 is provided with a convex portion 137 a according to the size of the lower surface of the semiconductor module 10. Therefore, when the metal foil 30 is deformed along the side surface of the package 28, as shown in FIG. 16B, the metal foil 30 reaches the lower side, so that the metal foil 30 is securely attached to the side surface of the package.

  FIG. 3 is a perspective view showing a state in which the metal foil 30 is in close contact along the shape of the package 28 of the semiconductor module 10. As described above, when the semiconductor module 10 is closely attached so as to be covered with the metal foil 30 from above, the metal foil 30 is folded so that a portion 30 a along the side in the thickness direction of the package 28 is folded among the portions covering the package 28. Transforms into That is, the metal foil covering the surface 28a and the metal foil covering the surface 28b are folded over at the end (part 30a) of the metal foil 30 covering the surfaces 28a and 28b adjacent to the package portion 30a. As a result, the semiconductor element 14 can be more reliably protected from electromagnetic interference caused by concentration of electromagnetic waves at the corners of the polygonal package 28.

  After the metal foil 30 is deformed as shown in FIG. 2C, the semiconductor module 10 is removed from the support substrate 36, and the margin of the metal foil 30 is cut. Then, as shown in FIG. 2D, the metal foil 30 is pressed and bent by a plate-like jig on the lower surface side of the semiconductor module 10 and connected to the ground terminal 34 of the element mounting substrate 12. Thereby, the semiconductor module which can protect the semiconductor element 14 from electromagnetic interference more reliably can be manufactured simply. The above-described manufacturing method can also be used when the semiconductor module 10 is covered with an insulating film instead of or in addition to the metal foil. Thereby, a semiconductor module in which deterioration of the semiconductor element due to short circuit or oxidation is prevented can be easily manufactured.

(Second Embodiment)
[Structure of semiconductor module]
FIG. 4 is a schematic cross-sectional view showing the configuration of the semiconductor module according to the second embodiment. As shown in FIG. 4, the semiconductor module 110 according to the second embodiment includes an element mounting board 112, a semiconductor element 114 provided on the upper surface of the element mounting board 112, and a wiring pattern 116 made of copper. And a bonding wire 118 which is a conductive member for electrically connecting the semiconductor element 114 and the wiring pattern 116 made of copper. A wiring pattern 120 made of copper to which external connection terminals are connected is provided on the lower surface of the element mounting substrate 112.

  The electrical connection between the wiring pattern 116 and the wiring pattern 120 is made through a conductor portion 122 a provided on the inner wall surface of the via hole that penetrates the insulating substrate 122. The solder resist 124 protects the surface of the wiring pattern 120. Further, the upper surface of the element mounting substrate 112 and the semiconductor element 114 mounted on the element mounting substrate 112 are sealed with a sealing resin layer 126 to form a package 128 having a desired shape.

  The semiconductor module 110 according to the present embodiment is covered with a metal foil 130 along the shape of the package 128. The metal foil 130 is fixed to the upper surface and side surfaces of the package 128 via an adhesive 132. Further, the side surface of the package 128 is metalized so that the electrode 116a to which a fixed potential, that is, the ground potential is input in the wiring pattern 116 formed on the element mounting substrate 112, and the metal foil 130 are electrically connected. And a conductive member 135 in which a conductive paste covering from the outside of the foil 30 is solidified.

  Thus, by covering the semiconductor element 114 with the metal foil 130, the electromagnetic wave interference received by the semiconductor element 114 is suppressed. In addition, since the metal foil 130 is thinner than the conventional can sealing, the semiconductor module 110 can be reduced in height.

  Further, in the semiconductor module 110 according to the present embodiment, the electrode 116a that is a part of the wiring pattern 116 functions as a ground terminal that conducts to an external ground potential, and the metal foil 130 serves as the conductive member 135. Through the electrode 116a. Therefore, when the semiconductor module 110 is mounted on an electronic device, the entire metal foil 130 is held at a fixed potential such as a ground potential, so that the electromagnetic interference that the semiconductor element 114 in the region covered with the metal foil 130 receives is affected. Can be prevented more reliably. Moreover, the electromagnetic wave generated from the semiconductor element can be shielded, and the electromagnetic wave interference to the adjacent semiconductor element can be prevented more reliably.

[Production method]
Next, a method for manufacturing a semiconductor module according to the second embodiment will be described. FIG. 5A to FIG. 5C, FIG. 6A, and FIG. 6B are schematic cross-sectional views for explaining steps in the method for manufacturing the semiconductor module 110 according to the second embodiment. is there.

  First, as shown in FIG. 5A, a plurality of semiconductor elements 114 are arranged and mounted on the element mounting substrate 112 and are formed on the element mounting substrate 112. In a state where the wiring pattern 116 and the semiconductor element 114 are connected by the bonding wire 118, a package 128 sealed with the sealing resin layer 126 is prepared.

  Next, as shown in FIG. 5B, the sealing resin layer 126 in the region 136 between the plurality of semiconductor elements 114 is removed, and an electrode to which a fixed potential (ground potential) is input in the wiring pattern 116. 116a is exposed. Laser exposure or half dicing is used as the exposure method. Then, as shown in FIG. 5 (c), the metal foil 130 coated with the adhesive 132 on one side is disposed on the upper surface of the package 128 including the plurality of semiconductor elements 114, and the metal foil 130 is interposed via the adhesive 132. Fix a part of. In this state, a portion of the metal foil 130 on the region 136 where the sealing resin layer 126 is removed is cut.

  Next, as shown in FIG. 6A, the conductive member 135 is filled from the cut portion of the metal foil 130, and the conductive member 135 is deformed so that the metal foil 130 is in close contact with the side surface of each package 128. And fixed. As a result, the metal foil 130 and the electrode 116a are electrically connected. Thereafter, as shown in FIG. 6B, the package 128 is separated at the position of the conductive member 135 for each semiconductor element 114 to manufacture a plurality of semiconductor modules 110.

  According to the manufacturing method as described above, the metal foil 130 that can protect the semiconductor element 114 from electromagnetic interference can be easily formed on the plurality of semiconductor modules 110. In addition, it is possible to manufacture a plurality of semiconductor modules 110 including the metal foil 130 that suppresses the electromagnetic interference that the semiconductor element 114 receives, and the manufacturing cost is reduced.

(Third embodiment)
In this embodiment, a package in which rewiring is collectively formed at the wafer level is separated into semiconductor chips, and a predetermined space is decompressed on the support substrate as in the first embodiment. A semiconductor module in which a metal foil is in close contact with a plurality of semiconductor chips is manufactured.

  FIG. 7 is a schematic diagram showing a concept of manufacturing a wafer level package. FIG. 8 is a schematic configuration diagram showing the configuration of the semiconductor module according to the third embodiment. The semiconductor module shown in FIG. 8 is obtained by forming a metal foil on the wafer level package shown in FIG.

  As shown in FIG. 8, the semiconductor module 210 according to the third embodiment includes an element mounting substrate 212 and a semiconductor chip 214 provided on the upper surface of the element mounting substrate 212. A wiring pattern 220 made of copper to which external connection terminals are connected is provided on the lower surface of the element mounting substrate 212. A rewiring pattern 216 is formed inside the element mounting substrate 212. The solder resist 224 protects the surface of the wiring pattern 220. In this way, the package has a desired shape.

  The semiconductor module 210 according to the present embodiment is covered with a metal foil 230 along the shape of the semiconductor chip 214. In the present embodiment, the metal foil 230 is fixed via an adhesive 232. Thus, by covering the semiconductor chip 214 with the metal foil 230, the electromagnetic wave interference received by the semiconductor chip 214 is suppressed. In addition, the space (distance) between the metal foil and the package can be reduced in the case where the metal foil 230 is used compared to the conventional can sealing, so the semiconductor module 210 can be reduced in height. can do.

  Further, in the semiconductor module 210 according to the present embodiment, a part of the wiring pattern 220 functions as the ground terminal 234 that conducts to the external ground potential, and the metal foil 230 is conducted to the ground terminal 234. . For this reason, when the semiconductor module 210 is mounted on an electronic device, the entire metal foil 230 is held at a fixed potential such as a ground potential, so that the electromagnetic wave interference received by the semiconductor chip 214 in the region covered with the metal foil 230 is reduced. Can be prevented more reliably. Since the manufacturing method is the same as that of the first embodiment, the description thereof is omitted.

(Fourth embodiment)
[Structure of semiconductor module]
FIG. 9 is a schematic cross-sectional view showing the configuration of the semiconductor module according to the fourth embodiment. As shown in FIG. 9, the semiconductor module 310 according to the fourth embodiment includes an element mounting substrate 312, a semiconductor element 314 provided on the upper surface of the element mounting substrate 312, and a wiring pattern 316 made of copper, And a bonding wire 318 which is a conductive member for electrically connecting the semiconductor element 314 and the wiring pattern 316. The upper surface of the element mounting substrate 312 and the semiconductor element 314 mounted on the element mounting substrate 312 are sealed with a sealing resin layer 326 to form a package 328 having a desired shape.

  The semiconductor module 310 has one end connected to an electrode 316a that is formed on a part of the wiring pattern 316 and receives a ground potential, and the other end penetrates the sealing resin layer 326 to form a sealing resin. A bonding wire 318a reaching the upper surface of the layer 326, a conductive member 335 formed on the sealing resin layer 326 so as to be electrically connected to the other end of the bonding wire 318a, and an upper surface of the conductive member 335. Covering metal foil 330.

  In other words, in the semiconductor module 310 according to the present embodiment, the electrode 316a that is a part of the wiring pattern 316 functions as a ground terminal that conducts to the external ground potential, and the metal foil 330 serves as the bonding wire 318a and the conductive wire. The conductive member 335 is electrically connected to the electrode 316a. Therefore, when the semiconductor module 310 is mounted on an electronic device, the entire metal foil 330 is held at a fixed potential such as a ground potential, so that the electromagnetic interference that the semiconductor element 314 in the region covered with the metal foil 330 receives is affected. Can be prevented more reliably.

[Production method]
Next, a method for manufacturing a semiconductor module according to the fourth embodiment will be described. FIG. 10A to FIG. 10C and FIG. 11A to FIG. 11C are schematic cross-sectional views for explaining the steps in the method for manufacturing the semiconductor module 310 according to the fourth embodiment. is there.

  First, as shown in FIG. 10A, a plurality of semiconductor elements 314 are aligned and mounted on an element mounting substrate 312, and a wiring pattern 316 and a semiconductor element 314 formed on the element mounting substrate 312 are formed. Are connected by a bonding wire 318. At this time, the electrodes 316a serving as ground terminals constituting a part of the wiring pattern 316 are electrically connected by the bonding wires 318a. In this state, as shown in FIG. 10B, the upper surface of the element mounting substrate 312 and the semiconductor element 314 is sealed with a sealing resin layer 326 so that a part of the bonding wire 318a is exposed.

  Thereafter, in the present embodiment, the folded portion of the bonding wire 318a is cut as shown in FIG. 10C, and a plurality of semiconductor elements are formed in the sealing resin layer 326 as shown in FIG. The portion in the region between 314 is removed. Next, as shown in FIG. 11B, the package 328 is covered with a paste-like conductive member 335 so as to cover the exposed bonding wire 318a and fill the space from which the sealing resin layer 326 is removed. The metal foil 330 is attached to the upper surface of the conductive member 335. Then, as shown in FIG. 11C, the semiconductor module 310 is manufactured by separating each semiconductor element 314 by dicing in a space filled with the conductive member 335.

  As described above, the metal foil 330 that can protect the semiconductor element 314 from electromagnetic interference can be easily formed so as to cover the semiconductor module. Further, since the conductive member 335 is covered so as to cover a part of the exposed bonding wire 318a, the adhesion between the package 328 and the conductive member 335 is increased. In addition, the upper surface of the package 328 is covered with the conductive member 335 and the metal foil 330, and the side surface of the package 328 is also covered with the conductive member 335, so that the electromagnetic interference that the semiconductor element 314 receives can be more reliably prevented. . Moreover, it becomes possible to manufacture a plurality of semiconductor modules 310 including the metal foil 330 that suppresses the electromagnetic interference that the semiconductor element 314 receives, and the manufacturing cost is reduced.

(Fifth embodiment)
FIG. 12 is a schematic cross-sectional view showing the configuration of the semiconductor module according to the fifth embodiment. As shown in FIG. 12, the semiconductor module 410 according to the fifth embodiment includes an element mounting substrate 412, a semiconductor element 414 provided on the upper surface of the element mounting substrate 412, and a wiring pattern 416 made of copper. A bonding wire 418 that is a conductive member that electrically connects the semiconductor element 414 and the wiring pattern 416. The upper surface of the element mounting substrate 412 and the semiconductor element 414 mounted on the element mounting substrate 412 are sealed with a sealing resin layer 426 to form a package 428 having a desired shape.

  The semiconductor module 410 includes a conductive member 435 formed on the sealing resin layer 426 and a metal foil 430 that covers the upper surface of the conductive member 435. In the semiconductor module 410 according to the present embodiment, the peripheral portion 430a of the metal foil 430 is bent toward the element mounting substrate 412 side. Therefore, compared with the case where the metal foil 430 is flat, the range covering the semiconductor element 414 is widened, and the electromagnetic interference that the semiconductor element 414 receives can be more reliably prevented. Further, by bending the peripheral edge portion 430a, electric field concentration that occurs when the portion has a shape having a corner portion is suppressed.

  In order to make the peripheral edge portion 430a of the metal foil 430 bent as described above, for example, in the step shown in FIG. 11C, the conductive member 335 may be diced in a semi-cured state.

(Sixth embodiment)
FIG. 13 is a top view of a semiconductor module 510 according to the sixth embodiment. When metal foil is affixed on a conductive member like the semiconductor module of 4th Embodiment or 5th Embodiment, air enters between a conductive member and metal foil, and metal There is a possibility that a swollen part is formed on a part of the surface of the foil. In such a state, when the semiconductor module is mounted on an electronic device, the swollen portion may be broken or come into contact with other components.

  Therefore, in the semiconductor module 510 according to the present embodiment, an opening 530a is formed so that air that has entered between the metal foil 530 and the conductive member escapes. This suppresses air from remaining between the metal foil 530 and the conductive member. Moreover, as shown in FIG. 13, the orientation of the semiconductor module 510 can be easily known by forming the opening 530a at a position shifted from the center. In addition, air can be easily removed by making the burrs of the metal foil when the opening 530a is formed outside. On the other hand, by making the metal foil burrs on the inside, the operator's hand and other parts are less likely to be caught in the opening 530a, and the burrs are prevented from being caught on the conductive member and the metal foil is prevented from peeling off. Is done.

(Seventh embodiment)
Next, a portable device including the semiconductor module according to each of the above embodiments will be described. In addition, although the example mounted in a mobile telephone as a portable apparatus is shown, electronic devices, such as a personal digital assistant (PDA), a digital video camera (DVC), and a digital still camera (DSC), may be sufficient, for example.

  FIG. 14 is a diagram illustrating a configuration of a mobile phone including the semiconductor module according to each of the above-described embodiments. The mobile phone 600 has a structure in which a first housing 602 and a second housing 604 are connected by a movable portion 606. The first housing 602 and the second housing 604 can rotate around the movable portion 606. The first housing 602 is provided with a display portion 608 and a speaker portion 610 that display information such as characters and images. The second housing 604 is provided with an operation unit 612 such as operation buttons and a microphone unit 614. The semiconductor module according to each of the above-described embodiments is mounted inside such a mobile phone 600.

  FIG. 15 is a partial cross-sectional view (cross-sectional view of the first housing 602) of the mobile phone shown in FIG. For example, the semiconductor module 10 according to each embodiment described above is mounted on the printed board 618 via the solder bumps 616 and is electrically connected to the display unit 608 and the like via the printed board 618. Further, a heat radiating substrate 620 such as a metal substrate is provided on the back surface side (the surface opposite to the solder bump 616) of the semiconductor module 10, and for example, heat generated from the semiconductor module is collected inside the first housing 602. It is possible to efficiently dissipate heat to the outside of the first housing 602 without making it.

  As described above, the present invention has been described with reference to the above-described embodiments. However, the present invention is not limited to the above-described embodiments, and the configurations of the embodiments are appropriately combined or replaced. Those are also included in the present invention. Further, based on the knowledge of those skilled in the art, the order of the manufacturing method of the semiconductor module in each embodiment is appropriately changed, and various design changes and the like in the element mounting substrate and the semiconductor module are modified with respect to each embodiment. Embodiments to which such modifications are added can also be included in the scope of the present invention.

It is a schematic sectional drawing which shows the structure of the semiconductor module which concerns on 1st Embodiment. FIG. 2A to FIG. 2D are schematic cross-sectional views for explaining steps in the method for manufacturing the semiconductor module according to the first embodiment. It is a perspective view which shows the state which metal foil closely_contact | adheres along the shape of the package of a semiconductor module. It is a schematic sectional drawing which shows the structure of the semiconductor module which concerns on 2nd Embodiment. FIG. 5A to FIG. 5C are schematic cross-sectional views for explaining steps in the method for manufacturing a semiconductor module according to the second embodiment. FIG. 6A and FIG. 6B are schematic cross-sectional views for explaining steps in the method for manufacturing a semiconductor module according to the second embodiment. It is a schematic diagram which shows the production concept of a wafer level package. It is a schematic block diagram which shows the structure of the semiconductor module which concerns on 3rd Embodiment. It is a schematic sectional drawing which shows the structure of the semiconductor module which concerns on 4th Embodiment. FIG. 10A to FIG. 10C are schematic cross-sectional views for explaining steps in the method for manufacturing a semiconductor module according to the fourth embodiment. FIG. 11A to FIG. 11C are schematic cross-sectional views for explaining steps in the method for manufacturing a semiconductor module according to the fourth embodiment. It is a schematic sectional drawing which shows the structure of the semiconductor module which concerns on 5th Embodiment. It is a top view of the semiconductor module which concerns on 6th Embodiment. It is a figure which shows the structure of the mobile telephone provided with the semiconductor module which concerns on each embodiment. It is a fragmentary sectional view of the mobile telephone shown in FIG. FIGS. 16A and 16B are schematic cross-sectional views for explaining a process in the case where a support substrate having another shape is used in the method for manufacturing a semiconductor module according to the first embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Semiconductor module, 12 Element mounting board | substrate, 14 Semiconductor element, 16 Wiring pattern, 18 Bonding wire, 20 Wiring pattern, 22 Insulating board, 26 Sealing resin layer, 28 Package, 30 Metal foil, 32 Adhesive, 34 Ground terminal 36 Support substrate.

Claims (17)

A substrate,
A semiconductor element mounted on the substrate;
A shielding film covering the package along the shape of the package including the semiconductor element;
A semiconductor module comprising:   The semiconductor module according to claim 1, wherein the shielding film is an insulating film. A substrate,
A semiconductor element mounted on the substrate;
A metal foil covering at least the upper surface of the package along the shape of the package including the semiconductor element;
A semiconductor module comprising:   The semiconductor module according to claim 3, wherein a fixed potential is applied to the metal foil.   The semiconductor module according to claim 4, wherein the metal foil is electrically connected to a ground terminal provided on the back surface of the substrate.   6. The metal foil according to claim 3, wherein the metal foil is deformed so that a portion along a side in a thickness direction of the package of the portion covering the package is folded. Semiconductor module. A preparation step of preparing a semiconductor module on which a semiconductor element is mounted on a substrate;
An arrangement step of arranging a shielding film on an upper surface of a package including the semiconductor element;
A deformation step of deforming a portion of the shielding film that does not cover the upper surface of the package along the side surface of the package;
A method for manufacturing a semiconductor module comprising: A preparation step of preparing a semiconductor module on which a semiconductor element is mounted on a substrate;
An arrangement step of arranging a metal foil on an upper surface of a package including the semiconductor element;
A deformation step of deforming a portion of the metal foil that does not cover the upper surface of the package along the side surface of the package;
A method for manufacturing a semiconductor module comprising:   9. The method of manufacturing a semiconductor module according to claim 8, further comprising a connecting step of connecting the metal foil to a wiring layer to which a fixed potential is inputted in the substrate after the deforming step.   10. The method of manufacturing a semiconductor module according to claim 8, wherein in the deforming step, the metal foil is deformed toward a side surface of the package by a pressure difference between a front side and a back side of the metal foil. A substrate,
A semiconductor element mounted on the substrate;
A metal foil covering an upper surface and a side surface of the package along the shape of the package including the semiconductor element;
A conductive member that covers a side surface of the package from the outside of the metal foil so as to conduct the portion of the wiring layer formed on the substrate to which a fixed potential is input and the metal foil;
A semiconductor module comprising: Sealed by a sealing member in a state in which a plurality of semiconductor elements are aligned and mounted on a substrate, and a wiring layer formed on the substrate is connected to the semiconductor elements. A preparatory process for preparing the package,
An exposure step of removing the sealing member in a region between the plurality of semiconductor elements to expose a portion of the wiring layer to which a fixed potential is input;
An arranging step of arranging a metal foil on the upper surfaces of the plurality of packages;
A cutting step of cutting a portion of the metal foil above the space from which the sealing member is removed;
A filling step of filling the space from the cut portion with a conductive member;
A separation step of separating each package;
A method for manufacturing a semiconductor module comprising:   The method of manufacturing a semiconductor module according to claim 12, wherein the portion exposed by the exposing step is electrically connected to a ground terminal. A substrate,
A wiring layer formed on the substrate;
A semiconductor element mounted on the substrate;
A sealing member for sealing the wiring layer and the semiconductor element;
One end is connected to the wiring layer, and the other end penetrates the sealing member and reaches the upper surface of the sealing member;
A conductive member formed on the sealing member so as to be electrically connected to the other end of the wire;
A metal foil covering the upper surface of the conductive member;
A semiconductor module comprising:   The semiconductor module according to claim 14, wherein one end of the wire is connected to a portion of the wiring layer to which a fixed potential is input. A preparation step of preparing a package in which a plurality of semiconductor elements are arranged and mounted on a substrate and a wire is connected to a ground terminal;
A sealing step of sealing the package with a sealing member to such an extent that a part of the wire is exposed;
A removing step of removing the sealing member in a region between the plurality of semiconductor elements;
A covering step of covering the package with a conductive member so as to fill the space from which the sealing member is removed while covering the exposed wire;
An attaching step of attaching a metal foil to the upper surface of the conductive member;
A separation step of separating the package in a space filled with the conductive member for each semiconductor element;
A method for manufacturing a semiconductor module comprising:   A portable device comprising the semiconductor module according to any one of claims 1, 2, 3, 4, 5, 6, 11, 14, and 15.

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