JP2009290034A - Method for manufacturing of surface mount inductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing of a surface mount inductor, capable of manufacturing a surface mount inductor more reliable than conventionally, without complicating a manufacturing process. <P>SOLUTION: The method for manufacturing of a surface mount inductor at least includes a rear electrode layer and a side electrode layer formed by performing press-molding of conductive powder. The method for manufacturing at least includes: a first compact formation process S20 for forming a first compact by supplying conductive powder to a molding space for pre-pressing by using a press-molding die capable of forming a prescribed molding space; a first compact disposition process S30 for disposing the first compact in the molding space so that the flat surface section of the first compact becomes the bottom surface; a second compact formation process S40 for forming a second compact by supplying insulating magnetic powder to the molding space for prepressing while a coil is disposed on the flat surface section of the first compact; and a final press process S60 for performing final pressing, while the second compact is disposed in the molding space. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a surface mount inductor.

  2. Description of the Related Art Conventionally, as a surface-mount type inductor used for an electronic device or the like, a magnetic layer having a coil disposed therein, a wiring pattern formed on the surface of the magnetic layer, two lead wires extending from the coil, and a wiring pattern 2. Description of the Related Art A surface-mount type inductor is known that includes terminal electrodes disposed on a side surface and a part of a back surface of a magnetic layer so as to connect a part thereof (see, for example, Patent Document 1).

  According to the conventional surface mount inductor, since the terminal electrode described above is provided, it is possible to electrically connect the wiring pattern arranged on the surface side of the magnetic layer and the lead wire of the coil.

JP 2003-234214 A

  By the way, when manufacturing a surface-mount type inductor having such a terminal electrode, conventionally, after forming a magnetic layer by press-molding an insulating magnetic powder, the side surface and part of the back surface of the magnetic layer are covered. Thus, the terminal electrode is separately formed. For this reason, there is a problem that the manufacturing process becomes complicated and the reliability of the manufactured surface mount inductor is not so high.

  Accordingly, the present invention has been made to solve the above problem, and is a surface-mount inductor that can manufacture a surface-mount inductor that is more reliable than the conventional one without complicating the manufacturing process. An object is to provide a manufacturing method.

(1) A method for manufacturing a surface mount inductor according to the present invention includes a magnetic layer formed by press-molding an insulating magnetic powder, a coil disposed inside the magnetic layer, and 2 extending from the coil. A first electrode and a second electrode connected to each of the two lead wires, disposed on the back surface of the magnetic layer, and formed by press-molding conductive powder; and the magnetic layer A wiring pattern formed on the surface, the first electrode, the second electrode, and a part of the wiring pattern are connected to a side surface of the magnetic layer, and the conductive powder is press-molded. A surface mounting type inductor manufacturing method comprising a side electrode layer formed by: using a press mold capable of forming a predetermined molding space, and supplying the conductive powder to the molding space. Forming a first compressed body by pre-pressing to form a first compressed body having a flat portion having two insertion holes into which the lead wire can be inserted and a wall portion standing at an end of the flat portion. A first compression body arranging step of arranging the first compression body in a molding space such that the flat surface portion of the first compression body becomes a bottom surface, and inserting the two lead wires into the two insertion holes. In the state where the coil is arranged on the flat portion of the first compressed body, the second compressed body is formed by supplying the insulating magnetic powder to the molding space and pre-pressing it. A main press which performs a main press with a pressurizing force higher than the pressurizing force during the preliminary pressing in the first compressing body forming step and the second compressing body forming step in a state where the second compressing body is disposed in the forming space. Including the steps in this order

  Therefore, according to the method for manufacturing a surface mount inductor of the present invention, not only the magnetic layer but also the back electrode layer and the side electrode layer corresponding to the terminal electrode are formed by press molding. Thus, it is possible to manufacture a surface mount inductor including a back electrode layer and a side electrode layer.

  In addition, according to the method for manufacturing a surface mount inductor of the present invention, the magnetic layer in which the coil is disposed, the back electrode layer, and the side electrode layer are integrally formed, so that the reliability is higher than the conventional one. A high surface mount inductor can be manufactured.

  Therefore, the method for manufacturing a surface mount inductor according to the present invention is a method for manufacturing a surface mount inductor capable of manufacturing a surface mount inductor having higher reliability than the conventional one without complicating the manufacturing process. .

  By the way, although the 1st compression body formed by performing the 1st compression body formation process is arranged in forming space so that the plane part of the 1st compression body may become a top surface, the 2nd compression body after that In consideration of arranging the coil in the molding space and supplying the insulating magnetic powder in the forming process, the first compression body is arranged in the molding space so that the flat portion of the first compression body becomes the bottom surface. Is desirable.

  Therefore, in the method for manufacturing a surface mount inductor according to the present invention, the first compression body placement step is performed between the first compression body formation step and the second compression body formation step, so that the plane portion of the first compression body is The first compression body is arranged in the molding space so as to be the bottom surface. For this reason, when the coil is arranged in the molding space or the insulating magnetic powder is supplied in the second compression body forming step, the coil is easily arranged or the insulating magnetic powder is supplied.

(2) In the method for manufacturing a surface mount inductor according to (1) above, before performing the first compression body forming step, as the press mold, the first molding surface capable of forming the planar portion and A first molding die having a second molding surface capable of forming an inner portion of the wall portion and having at least two pins having a cross-sectional shape corresponding to a cross-sectional shape of the lead wire formed on the first molding surface; And at least two insertion holes that are arranged to face the first mold and have at least a molding surface capable of forming the flat portion, are capable of inserting the two lead wires and can be fitted with the pins. A second molding die formed on the molding surface, a third molding die having a molding surface capable of forming at least an outer portion of the wall portion, and arranged to cover a side in the molding space; 1 Insertion hole through which the mold can be inserted A mold preparation for preparing at least a fourth mold having a molding surface capable of forming the wall portion when the first mold is combined with the third mold in a state of being inserted through the insertion hole. In the first compression body forming step, each molding die is arranged so that the first molding die is on the lower side and the second molding die is on the upper side, and the first molding die is placed on the first molding die. In a state where the conductive powder is inserted through the insertion hole of the four molds, the conductive powder is supplied to the molding space and preliminary pressing is performed. In the first compression body arranging step, the first mold becomes the upper side and the first It is preferable to invert the top and bottom of each mold so that the two molds are on the lower side.

  By adopting such a method, it is possible to manufacture the above-described excellent surface mount inductor relatively easily. Moreover, it becomes possible to change the arrangement | positioning state of a 1st compression body comparatively easily by setting it as the above methods.

(3) In the method for manufacturing a surface mount inductor according to (1) above, before performing the first compression body forming step, as the press mold, the first molding surface capable of forming the planar portion and The wall has a second molding surface capable of forming an inner portion, and at least two insertion holes into which the two lead wires can be inserted are formed in the first molding surface, and further provided in the insertion hole. A first molding die having at least two pins configured to be slidable up and down, and a molding surface that is disposed to face the first molding die and is capable of forming the flat surface portion. The mold has a molding surface having the same planar shape as that of the first molding surface of the mold, and at least two pin fitting recesses provided corresponding to the positions of the pins are formed on the molding surface. 2 molds and at least outside the wall A first molding die having a molding surface capable of forming a part and having a third molding die arranged so as to cover a side in the molding space; and an insertion hole through which the first molding die can be inserted. Can be inserted through the molding surface of the second molding die and the fourth molding die having a molding surface capable of forming the wall portion when combined with the third molding die in a state of being inserted through the insertion hole. A molding die preparing step of preparing at least a fifth molding die having an insertion hole and having a molding surface capable of forming a part of the wall portion is performed. In the first compression body forming step, the first molding is performed. Each molding die is arranged so that the die is on the lower side and the second molding die is on the upper side, and the first molding surface of the first molding die is positioned above the molding surface of the fourth molding die. So that the first mold is inserted through the insertion hole of the fourth mold, The second molding die is inserted into the insertion hole of the fifth molding die so that the molding surface of the second molding die and the molding surface of the fifth molding die are located on the same plane, and the pin is further inserted. In a state of protruding from the insertion hole, the conductive powder is supplied to the molding space to perform preliminary pressing. In the first compression body arranging step, the first molding surface of the first molding die and the first molding surface are arranged. It is preferable to lower the first mold and the second mold or raise the fourth mold and the fifth mold until the molding surface of the four molds is located on the same plane.

  By adopting such a method, the above-described excellent surface mount type inductor can be manufactured relatively easily. Moreover, it becomes possible to change the arrangement | positioning state of a 1st compression body comparatively easily also by setting it as the above methods.

(4) In the method for manufacturing a surface mount inductor according to (1) above, before performing the first compression body forming step, as the press mold, the first molding surface capable of forming the planar portion and A first molding die having a second molding surface capable of forming an inner portion of the wall portion, wherein at least two insertion holes into which the two lead wires can be inserted are formed in the first molding surface; It is configured to be insertable / removable into the insertion hole of one molding die, and is arranged to face at least two pins having a cross-sectional shape corresponding to the cross-sectional shape of the lead wire and to form the flat portion. A molding surface having the same planar shape as the planar shape of the first molding surface of the first molding die, and provided corresponding to the position of the insertion hole of the first molding die. At least two pin fitting recesses A second molding die formed on the shape surface, a third molding die having a molding surface capable of forming at least an outer portion of the wall portion, and arranged to cover a side in the molding space; A first molding surface having an insertion hole into which the first molding die can be inserted, and a molding surface capable of forming the wall when the first molding die is inserted into the insertion hole and combined with the third molding die; A mold preparation for preparing at least a four mold and a fifth mold having an insertion hole through which the molding surface of the second mold can be inserted and having a molding surface capable of forming a part of the wall portion In the first compression body forming step, the respective molds are arranged so that the first mold is on the lower side and the second mold is on the upper side, and the first mold is formed on the first compact body. The molding surface is positioned above the molding surface of the fourth mold. The first molding die is inserted through the insertion hole of the fourth molding die, and the second molding is performed so that the molding surface of the second molding die and the molding surface of the fifth molding die are located on the same plane. In a state where the mold is inserted into the insertion hole of the fifth molding die, and the pin is inserted into the insertion hole of the first molding die, the conductive powder is supplied to the molding space to perform a preliminary press, In the first compression body arranging step, the first molding die and the second molding until the first molding surface of the first molding die and the molding surface of the fourth molding die are located on the same plane. It is preferable to lower the mold or raise the fourth mold and the fifth mold.

  By adopting such a method, the above-described excellent surface mount type inductor can be manufactured relatively easily. Moreover, it becomes possible to change the arrangement | positioning state of a 1st compression body comparatively easily also by setting it as the above methods.

(5) In the method of manufacturing a surface mount inductor according to any one of (1) to (4), in the main pressing step, the second compression body is disposed in a molding space, and the wiring pattern is formed. A transfer sheet having a wiring layer having a corresponding pattern shape formed on one surface of the sheet layer is disposed on the second compression body so that the wiring layer faces the second compression body with respect to the sheet layer. It is preferable to perform a main pressing, and after the main pressing step, perform a sheet layer peeling step for peeling the sheet layer.

As a method of forming the wiring pattern on the surface of the magnetic layer, for example, a method of forming a wiring pattern by forming a metal foil on the surface of the magnetic layer and etching the metal foil is considered. When the wiring pattern is formed, the insulating magnetic powder constituting the magnetic layer is weak against the etching solution, and thus there is a problem that the magnetic layer may be corroded during etching.
On the other hand, according to the manufacturing method of the surface mount type inductor of the present invention, since the wiring pattern is transferred by the transfer sheet, the magnetic layer is not corroded when forming the wiring pattern. A wiring pattern can be formed relatively easily on the surface.

(6) In the method for manufacturing a surface-mount inductor according to any one of (1) to (5), the surface on the back electrode layer side and the surface on the wiring pattern side are both flat in the main pressing step. It is preferable to use a press mold having a molding surface made of

  By adopting such a method, it is possible to manufacture a surface-mount inductor having relatively high flatness on the front surface and the back surface.

(7) In the method for manufacturing a surface mount inductor according to any one of (1) to (6) above, between the second compression body forming step and the main pressing step, It is preferable to perform a lead wire cutting / bending process for cutting / bending the lead wire extending from the coil disposed inside.

  By adopting such a method, it is possible to manufacture a surface-mount inductor in which lead wires are embedded in the back electrode layer.

(8) In the method for manufacturing a surface mount inductor according to any one of (1) to (5), a lead wire cutting step of cutting the lead wire extending from the back electrode layer after the main pressing step. It is preferable to carry out.

  By adopting such a method as well, it becomes possible to manufacture a surface mount inductor in which lead wires are embedded in the back electrode layer.

(9) In the method for manufacturing a surface mount inductor according to any one of (1) to (8), the conductive powder is preferably copper powder.

  By adopting such a method, it becomes possible to manufacture a surface-mount type inductor having excellent conductivity of the back electrode layer portion and the side electrode layer portion.

(10) In the method for manufacturing a surface mount inductor according to any one of (1) to (9), the insulating magnetic powder is a powder in which a silica film is formed on the surface of magnetic conductive particles. Preferably there is.

  By adopting such a method, it becomes possible to manufacture a surface-mount type inductor excellent in insulation of the magnetic layer portion.

  Hereinafter, a method for manufacturing a surface mount inductor according to the present invention will be described based on an embodiment shown in the drawings.

[Embodiment 1]
The first embodiment is an embodiment for explaining a method for manufacturing the surface mount inductor according to claim 2.

FIG. 1 is a perspective view schematically showing a surface mount inductor 1 manufactured by the method for manufacturing a surface mount inductor according to the first embodiment.
FIG. 2 is a flowchart for explaining the method for manufacturing the surface mount inductor according to the first embodiment.
3 to 5 are views for explaining the method of manufacturing the surface mount inductor according to the first embodiment. 3A to FIG. 3F, FIG. 4A to FIG. 4F, and FIG. 5A to FIG. 5F are diagrams schematically showing each step.

  6-8 is a figure shown in order to demonstrate the press-molding die used for the manufacturing method of the surface-mount type inductor based on Embodiment 1. FIG. 6A is a perspective view of the first mold 110, FIG. 6B is a perspective view of the second mold 120, and FIG. 6C is a perspective view of the third mold 130. FIG. 6D is a perspective view of the fourth mold 140. FIG. 7 is a perspective view when the first to fourth molds 110 to 140 are arranged in combination. FIG. 8A is a perspective view of the preliminary press mold 150, and FIGS. 8B and 8C are perspective views of the press molds 160 and 170. FIG.

  1 and 3 to 8, in order to facilitate understanding of the invention, the thickness of the magnetic layer 10, the thickness of the lead wires 22 and 24 of the coil 20, the thickness of the solder coating layer 40, The layer thickness of the back electrode layer 30, the layer thickness of the side electrode layer 60, the size of the electronic component 70, the size of the pin 116 of the first mold 110 (pin diameter, pin protrusion length, etc.), and the insertion of the second mold 120 The size of the hole 126 (hole diameter), the size of the standing portion 144 of the fourth molding die 140, the thickness of the flat surface portion a1 of the first compression body P1, the size of the wall portion a2, and the size of the insertion hole a3 ( (Hole diameter), the thickness of the sheet layer c1 and the wiring layer c2 of the transfer sheet S, etc. are exaggerated. Further, in FIG. 1, the wiring pattern 50 is illustrated in a simplified manner, and the solder coating layer 40 is not illustrated.

  The method for manufacturing a surface mount inductor according to the first embodiment is a method for manufacturing a surface mount inductor 1 (see FIG. 1) used in an electronic device or the like. A surface-mount inductor 1 manufactured by the method for manufacturing a surface-mount inductor according to Embodiment 1 is a magnetic body formed by press-molding an insulating magnetic powder as shown in FIGS. 1 and 5 (f). The magnetic layer 10 includes the layer 10, the coil 20 disposed inside the magnetic layer 10, and the first electrode 32 and the second electrode 34 respectively connected to the two lead wires 22 and 24 extending from the coil 20. Of the back electrode layer 30 formed by press-molding the conductive powder, the solder coating layer 40 formed on the surfaces of the first electrode 32 and the second electrode 34, and the magnetic layer 10 The wiring pattern 50 formed on the surface, the first electrode 32 and the second electrode 34, and a part of the wiring pattern 50 are arranged on the side surface of the magnetic layer 10 so as to connect the conductive powder. It includes a side surface electrode layer 60 is formed by press forming, and an electronic component 70 mounted on the wiring pattern 50.

  The size of the surface mount inductor 1 is, for example, 10 mm long × 10 mm wide × 5 mm high. The thickness of the back electrode layer 30 is, for example, 0.3 mm, and the thickness of the side electrode layer 60 is, for example, 0.3 mm. The surface mount inductor 1 has a shape in which the side electrode layer 60 is slightly protruded from the side surface of the magnetic layer 10.

  As shown in FIG. 2, the manufacturing method of the surface mount inductor according to the first embodiment includes a mold preparation step S10, a first compression body formation step S20, a first compression body arrangement step S30, and a second compression body formation step S40. The lead wire cutting / bending step S50, the main pressing step S60, the sheet layer peeling step S70, the electrode separation / heat treatment step S80, and the solder coating layer forming / mounting step S90 are sequentially performed. Hereinafter, each of these steps will be described in detail.

1. Mold preparation step S10
First, as shown in FIG. 3A, first to fourth molds 110 to 140, a pre-press mold 150, and two main press molds 160 and 170 are prepared as press molds. To do.

  As shown in FIG. 6A, the first molding die 110 has a first molding surface 112 formed on the upper surface of the molding die and a second molding surface 114 formed on a part of the side surface of the molding die. The first molding surface 112 and the second molding surface 114 are both flat, and the surface shape when the first molding surface 112 is viewed in plan is a square shape. In addition, two pins 116 having a cross-sectional shape corresponding to the cross-sectional shape of the lead wires 22 and 24 are formed on the first molding surface 112. The tip of the pin 116 is sharp.

  The second molding die 120 is a molding die arranged to face the first molding die 110, and as shown in FIG. 6B, a molding surface 122 composed of a flat surface formed on the upper surface of the molding die, and molding And a convex portion 124 formed on the side surface of the mold. The surface shape when the molding surface 122 is viewed in a plan view is a substantially square shape in which the protruding portion 124 protrudes. The molding surface 122 has two insertion holes 126 into which the two lead wires 22 and 24 can be inserted and can be fitted to the pins 116 of the first molding die 110.

  The 3rd shaping | molding die 130 is a shaping | molding die arrange | positioned so that the side in a shaping | molding space may be covered, and as shown in FIG.6 (c), it has the shaping | molding surface 132 in which the predetermined recessed part 134 was formed. The concave portion 134 is configured to be able to fit with the convex portion 124 of the second molding die 120, the standing portion 144 of the fourth molding die 140 to be described later, and the convex portions 164 and 174 of the press molding dies 160 and 170. .

  As shown in FIG. 6D, the fourth mold 140 has an insertion hole 142 through which the first mold 110 can be inserted, and a standing part 144 formed at the end of the insertion hole 142. A flat molding surface 146 is formed on the upper surface of the standing portion 144.

  The pre-press mold 150 is a mold that can be replaced with the first mold 110, and has a flat molding surface 152 as shown in FIG. 8A.

  The press molding die 160 is a molding die used as a lower die at the time of the final pressing. As shown in FIG. 8B, the molding die 160 is formed on a flat molding surface 162 formed on the upper surface of the molding die and on the side surface of the molding die. And a convex portion 164 formed. When the molding surface 162 is viewed in plan, the surface shape is a substantially square shape with the protruding portion 164 protruding.

  The press mold 170 is a mold used as an upper mold at the time of the press. As shown in FIG. 8C, the press mold 170 is formed on a mold surface 172 formed on the upper surface of the mold and a side surface of the mold. And a convex portion 174. The surface shape when the molding surface 172 is viewed in a plan view is a substantially square shape in which the protruding portion 174 protrudes.

2. 1st compression body formation process S20
Next, as shown in FIG. 3B and FIG. 7, the first to fourth molding dies 110 to 140 are used, and the first molding dies 110 are inserted into the insertion holes 142 of the fourth molding dies 140 so that the first The first to fourth molds 110 are combined by combining the mold 110 and the fourth mold 140 so that the first mold 110 and the fourth mold 140 are the lower mold and the second mold 120 is the upper mold. With the arrangement of ~ 140, the conductive powder CP is supplied to the molding space. And as shown in FIG.3 (c), it preliminarily presses with a predetermined applied pressure (temporary press), and forms the 1st compression body P1.

  For example, copper powder is used as the conductive powder CP. A predetermined amount of a known binder may be contained. The applied pressure at the time of preliminary pressing in this step is, for example, 0.01 to 0.05 GPa.

  When the conductive powder CP is supplied to the molding space, the entire mold may be vibrated before the preliminary pressing. Thereby, the conductive powder CP can be filled with high density.

  As shown in FIG. 3 (d), the first compressed body P1 formed by performing the first compressed body forming step S20 includes a flat surface portion a1 and a wall portion a2 standing on the end of the flat surface portion a1. And have. The flat surface portion a1 is formed by the first molding surface 112 of the first molding die 110, the molding surface 122 of the second molding die 120, and the molding surface 132 of the third molding die 130. On the other hand, the wall a2 is formed by the second molding surface 114 of the first molding die 110, the molding surface 132 of the third molding die 130 (part of the recess 134), and the molding surface 146 of the fourth molding die 140. It is. In addition, two insertion holes a3 into which the lead wires 22 and 24 can be inserted are formed in the flat portion a1. The insertion hole a3 is formed by the pin 116 of the first mold 110.

3. 1st compression body arrangement | positioning process S30
Next, as shown in FIG. 3 (e), the top and bottom of each mold is inverted so that the first mold 110 (and the fourth mold 140) is on the upper side and the second mold 120 is on the lower side. The 1st compression body P1 is arrange | positioned in a shaping | molding space so that the plane part a1 of the 1st compression body P1 may become a bottom face.

4). Second compression body forming step S40
Next, as shown in FIG. 3 (f), the first molding die 110 is pulled out with the second to fourth molding dies 120 to 140 being combined, and the first molding die 110 and the preliminary press molding die. Exchange 150. Then, as shown in FIG. 4A, the two lead wires 22 and 24 are inserted into the two insertion holes a3 of the first compression body P1 and the two insertion holes 126 of the second molding die 120, and the first In a state where the coil 20 is disposed on the flat surface portion a1 of the compression body P1, as shown in FIGS. 4B and 4C, by supplying the insulating magnetic powder MP to the molding space and pre-pressing, The second compression body P2 is formed.

  As the insulating magnetic powder MP, for example, iron powder having a silica film formed on the surface thereof is used. A predetermined amount of a known binder may be contained. The applied pressure at the time of preliminary pressing in this step is, for example, 0.01 to 0.05 GPa.

  When the insulating magnetic powder MP is supplied to the molding space, the entire mold may be vibrated before the preliminary pressing. Thereby, the insulating magnetic powder MP can be filled with high density.

5. Lead wire cutting / bending process S50
Next, as shown in FIGS. 4D and 4E, the second compression body P2 is taken out from the molding space, and a part of the lead wires 22 and 24 extending from the second compression body P2 is cut and bent. . If the lengths of the lead wires 22 and 24 are not required to be cut, the lead wires need not be cut in this step.

6). This press step S60
Next, as shown in FIG. 4F, the second mold 120 and the main press mold 160 are exchanged, and the fourth mold 140, the preliminary press mold 150, and the main press mold 170 are replaced. Replace. Thereafter, as shown in FIG. 5A, the second compression body P2 is disposed in the molding space, and as shown in FIG. 5B, the wiring layer c2 having a pattern shape corresponding to the wiring pattern 50 is formed into a sheet. A transfer sheet S formed on one surface of the layer c1 is prepared. As shown in FIG. 5C, the wiring layer c2 faces the second compressed body P2 side with respect to the sheet layer c1, and the transfer is performed. The sheet S is disposed on the second compression body P2. And as shown in FIG.5 (d), by carrying out this press with the applied pressure higher than the applied pressure at the time of the preliminary press in 1st compression body formation process S20 and 2nd compression body formation process S40, it is 3rd compression body. P3 is formed.

  As the sheet layer c1, for example, a resin sheet can be used. The applied pressure at the time of this press in this step is, for example, 0.65 to 1.0 GPa.

7). Sheet layer peeling process S70
Next, as shown in FIG.5 (e), the 3rd compression body P3 is taken out from shaping | molding space, and the sheet | seat layer c1 is peeled from the 3rd compression body P3.

8). Electrode separation / heat treatment step S80
Next, although explanation by illustration is omitted, a portion corresponding to the back electrode layer 30 in the third compressed body P3 is at least a region of the first electrode 32 (region connected to the lead wire 22) and a portion of the second electrode 34. After the electrodes are separated into regions (regions connected to the lead wires 24), the third compression body P3 is heated at a predetermined temperature for a predetermined time.

  As a method for separating electrodes, various methods such as a method of separating electrodes by grinding and polishing using a grinder or the like, a method of separating electrodes by chemical treatment, and the like can be used.

9. Solder coating layer formation / mounting process S90
Then, as shown in FIG. 5F, a solder coating layer 40 is formed on the surface of the back electrode layer 30 where the lead wires 22 and 24 are exposed, and an electronic component 70 such as an IC chip, a capacitor, or a resistor is formed. It is mounted on the wiring pattern 50.

  Thus, the surface mount inductor 1 shown in FIG. 1 can be manufactured.

  As described above, according to the method for manufacturing the surface mount inductor according to the first embodiment, not only the magnetic layer 10 but also the back electrode layer 30 and the side electrode layer 60 corresponding to the terminal electrodes are formed by press molding. Therefore, it is possible to manufacture the surface mount inductor 1 including the back electrode layer and the side electrode layer 60 without complicating the manufacturing process.

  Further, according to the method for manufacturing the surface mount inductor according to the first embodiment, the magnetic layer 10 in which the coil 20 is disposed, the back electrode layer 30, and the side electrode layer 60 are integrally formed. It becomes possible to manufacture the surface mount inductor 1 having higher reliability than the conventional one.

  Therefore, the manufacturing method of the surface mount inductor according to the first embodiment can manufacture the surface mount inductor having higher reliability than the conventional one without complicating the manufacturing process. It becomes.

  Further, according to the method for manufacturing the surface mount inductor according to the first embodiment, the first compression body arranging step S30 is performed between the first compression body forming step S20 and the second compression body forming step S40, and the first compression body forming step S30 is performed. Since the first compression body P1 is arranged in the molding space so that the flat surface portion a1 of the compression body P1 becomes the bottom surface, the coil 20 is arranged in the molding space or the insulating magnetic powder MP in the second compression body forming step S40. Or the like, it becomes easy to dispose the coil 20 and supply the insulating magnetic powder MP.

  In the method for manufacturing the surface mount inductor according to the first embodiment, the press mold described above is prepared in the mold preparing step S10, and in the first compression body arranging step S30, the first mold 110 is the upper side and the second mold is prepared. Since the top and bottom of each mold is inverted so that the mold 120 is on the lower side, the above-described excellent surface mount inductor 1 can be manufactured relatively easily, and the first compression body It becomes possible to change the arrangement state of P1 relatively easily.

  In the method for manufacturing the surface mount inductor according to the first embodiment, when the insulating magnetic powder MP is supplied to the molding space in the second compression body forming step S40, as shown in FIGS. 4 (a) and 4 (b). In a state where the fourth mold 140 is combined with the third mold 130 and the like, that is, in a state where the wall portion a2 of the first compression body P1 and the standing portion 144 of the fourth mold 140 are in contact with each other. Since the insulating magnetic powder MP is supplied to the molding space, the insulating magnetic powder MP is satisfactorily supplied to the molding space without the insulating magnetic powder MP being placed on the upper surface of the wall portion a2 of the first compression body P1. It becomes possible to do.

  In the method for manufacturing the surface mount inductor according to the first embodiment, since the wiring pattern 50 is transferred by the transfer sheet S, the magnetic layer 10 is not corroded when the wiring pattern 50 is formed. The wiring pattern 50 can be formed on the surface of the layer 10 relatively easily.

  In the method for manufacturing a surface mount inductor according to the first embodiment, in the present pressing step S60, as the upper mold and the lower mold, the present pressing molds 160 and 170 having the molding surfaces 162 and 172 that are flat surfaces are used. Therefore, it is possible to manufacture the surface mount inductor 1 having relatively high flatness on the front and back surfaces.

  In the method for manufacturing the surface mount inductor according to the first embodiment, the above-described lead wire cutting / bending step S50 is performed between the second compression body forming step S40 and the main pressing step S60. It becomes possible to manufacture the surface mount inductor 1 in which the lead wires 22 and 24 are embedded in the layer 30.

  In the method for manufacturing the surface mount inductor according to the first embodiment, since the conductive powder CP is copper powder, the surface mount inductor 1 having excellent conductivity in the back electrode layer portion and the side electrode layer portion is manufactured. It becomes possible.

  In the method for manufacturing the surface mount inductor according to the first embodiment, since the insulating magnetic powder MP is an iron powder having a silica film formed on the surface thereof, the surface mount inductor 1 having excellent insulation of the magnetic layer portion. Can be manufactured.

  In the method for manufacturing the surface mount inductor according to the first embodiment, since the tip of the pin 116 is sharp, it is possible to suppress the conductive powder CP from remaining at the tip of the pin 116 as much as possible. .

  In the method for manufacturing a surface mount inductor according to the first embodiment, in the second compression body forming step S40, the first molding die 110 is replaced with a preliminary press molding die 150 having a molding surface 152 formed of a flat surface. Therefore, it is possible to form the second compressed body P2 having a relatively high flatness on the upper surface.

[Embodiment 2]
FIG. 9 is a view for explaining the method for manufacturing the surface mount inductor according to the second embodiment. Fig.9 (a)-FIG.9 (h) are figures which show typically each process from a shaping | molding die preparation process to a 2nd compression body formation process. 9B is an enlarged view of the portion of the pin 186 and the insertion hole 188 in the first mold 180, and FIG. 9G is the case of FIG. 9F (the pin 186 is inserted into the insertion hole 188). It is an enlarged view of the part of the pin 186 and the insertion hole 188 (when retracted).
FIG. 10 is a view for explaining the press mold used in the method for manufacturing the surface mount inductor according to the second embodiment. 10A is a perspective view of the first mold 180 when the pin 186 is protruded, and FIG. 10B is a perspective view of the first mold 180 when the pin 186 is stored in the insertion hole 188. FIG. FIG.

  The method for manufacturing a surface mount inductor according to the second embodiment basically includes the same steps as the method for manufacturing the surface mount inductor according to the first embodiment, but the types of press molds prepared in the mold preparation step. And the content of the 2nd compression body formation process differs from the manufacturing method of the surface mount type inductor which concerns on Embodiment 1. FIG.

  That is, in the method for manufacturing the surface mount inductor according to the second embodiment, in the mold preparing step, as shown in FIG. 9A, the first to fourth molds 180, 120 to 140, and the present press Molds 160 and 170 are prepared.

  As shown in FIGS. 10A and 10B, the first mold 180 includes a first molding surface 182 formed on the upper surface of the mold and a second molding formed on a part of the side surface of the mold. Surface 184. The first molding surface 182 and the second molding surface 184 are both flat, and the surface shape when the first molding surface 182 is viewed in plan is a square shape. Further, two insertion holes 188 into which the lead wires 22 and 24 can be inserted are formed in the first molding surface 182, and further, two pins 186 configured to be slidable in the vertical direction are formed in the insertion hole 188. (See FIG. 9B). The pin 186 has a cross-sectional shape corresponding to the cross-sectional shape of the lead wires 22 and 24. The tip end surface 186a of the pin 186 is not sharp and is formed in a flat shape.

  Since the other second to fourth molds 120 to 140 and the press molds 160 and 170 are the same as those described in the first embodiment, detailed description thereof is omitted.

  After performing a shaping | molding die preparation process, the 1st compression body formation process and the 1st compression body arrangement | positioning process are performed similarly to the case of Embodiment 1 (refer FIG.9 (c)-FIG.9 (e)).

  In the second compression body forming step, first, as shown in FIG. 9 (f), the first molding die 180 is raised while the second to fourth molding dies 120 to 140 are combined, and the first molding is performed. The pin 186 is stored in the insertion hole 188 of the mold 180. At this time, as shown in FIG. 9G, the pin 186 is stored in the insertion hole 188 so that the tip surface 186a of the pin 186 and the first molding surface 182 of the first molding die 180 are located on the same plane. To do. Thereafter, as shown in FIG. 9 (h), the two lead wires 22 and 24 are inserted into the two insertion holes a3 of the first compression body P1 and the two insertion holes 126 of the second molding die 120, and the first Insulating magnetic powder MP is supplied to the molding space in a state where the coil 20 is disposed on the flat portion a1 of the compressed body P1. And although description by illustration is abbreviate | omitted, the 2nd compression body P2 is formed by pre-pressing.

  The subsequent steps (lead wire cutting / bending step, main pressing step, sheet layer peeling step, electrode separation / heat treatment step, solder coating layer forming / mounting step) are the same as those described in the first embodiment. Therefore, the description is omitted.

  As described above, the surface mount inductor manufacturing method according to the second embodiment is different from the surface mount inductor manufacturing method according to the first embodiment in the type of the press mold and the second preliminary press prepared in the mold preparing step. Although the contents of the process are different, as in the case of the method for manufacturing the surface mount inductor according to the first embodiment, not only the magnetic layer but also the back electrode layer and the side electrode layer corresponding to the terminal electrode are formed by press molding. Therefore, it is possible to manufacture a surface mount inductor including a back electrode layer and a side electrode layer without complicating the manufacturing process. In addition, since the magnetic body layer in which the coil 20 is disposed, the back electrode layer, and the side electrode layer are integrally formed, it is possible to manufacture a surface mount inductor having higher reliability than the conventional one. .

  In addition, in the method for manufacturing a surface mount inductor according to the second embodiment, the number of forming dies used can be reduced by one compared to the method for manufacturing the surface mount inductor according to the first embodiment. There is also. Further, in the case of the method for manufacturing the surface mount inductor according to the first embodiment, a part of the molds is exchanged when the second compression body forming step is performed (the first mold 110 and the pre-press mold 150). On the other hand, according to the method for manufacturing the surface mount inductor according to the second embodiment, it is not necessary to replace some molding dies when performing the second compression body forming step.

  The surface mount inductor manufacturing method according to the second embodiment is the same as the surface mount inductor according to the first embodiment except that the type of the press mold prepared in the mold preparing step and the content of the second compression body forming step are different. Since the manufacturing process includes the same steps as those in the manufacturing method, the corresponding effects of the manufacturing method of the surface mount inductor according to the first embodiment are directly included.

[Embodiment 3]
The third embodiment is an embodiment for explaining a method for manufacturing the surface mount inductor according to claim 3.

  11 and 12 are views for explaining the method for manufacturing the surface mount inductor according to the third embodiment. FIG. 11A to FIG. 11G and FIG. 12A to FIG. 12D are diagrams schematically showing each process from the mold preparation process to the second compression body forming process. FIG. 11B is an enlarged view of the portion of the pin 216 and the insertion hole 218 in the first mold 210, and FIG. 11D-1 is an enlarged view of the portion indicated by reference numeral A in FIG. 11 (d-2) is an enlarged view of a portion indicated by reference character B in FIG. 11 (c), and FIG. 11 (g) is an enlarged view of a portion indicated by reference character A in FIG. 11 (f). .

  FIGS. 13 and 14 are views for explaining a press mold used in the method for manufacturing the surface mount inductor according to the third embodiment. 13A is a perspective view of the first mold 210 when the pin 216 is protruded, and FIG. 13B is a perspective view of the first mold 210 when the pin 216 is stored in the insertion hole 218. FIG. 13 (c) is a perspective view of the second mold 220, FIG. 13 (d) is a perspective view of the third mold 230, and FIG. 13 (e) is a diagram of the fourth mold 240. FIG. 13 (f) is a perspective view of the fifth mold 250. FIG. 14 is a perspective view when the first to fifth molding dies 210 to 250 are arranged in combination.

  The method for manufacturing a surface mount inductor according to the third embodiment basically includes the same steps as the method for manufacturing the surface mount inductor according to the first embodiment, but the types of press molds prepared in the mold preparation step. In addition, the contents of the first compressed body arranging step and the second compressed body forming step are different from the method for manufacturing the surface mount inductor according to the first embodiment.

  That is, in the method for manufacturing a surface mount inductor according to the third embodiment, in the mold preparing step, as shown in FIG. 11A, the first to fifth molds 210 to 250 and the preliminary press mold 150 and the press molds 160 and 170 are prepared.

  As shown in FIGS. 13A and 13B, the first molding die 210 has a first molding surface 212 formed on the upper surface of the molding die and a second molding formed on a part of the side surface of the molding die. Surface 214. The first molding surface 212 and the second molding surface 214 are both flat, and the surface shape when the first molding surface 212 is viewed in a plane is a square shape. In addition, two insertion holes 218 into which the lead wires 22 and 24 can be inserted are formed in the first molding surface 212, and further, two pins 216 configured to be slidable in the vertical direction are formed in the insertion hole 218. (See FIG. 11B). The pin 216 has a cross-sectional shape corresponding to the cross-sectional shape of the lead wires 22 and 24. The tip of the pin 216 is sharp.

  The second molding die 220 is a molding die arranged to face the first molding die 210. As shown in FIG. 13C, the second molding die 220 includes a first molding surface 222 composed of a flat surface formed on the upper surface of the molding die. And a second molding surface 224 formed on a part of the side surface of the molding surface. The planar shape of the first molding surface 222 is the same shape as the first molding surface 212 of the first molding die 210. The first molding surface 222 is formed with two holes 226 that can be fitted to the pins 216 of the first molding die 210.

  The 3rd shaping | molding die 230 is a shaping | molding die arrange | positioned so that the side in a shaping | molding space may be covered, and as shown in FIG.13 (d), it has the shaping | molding surface 232 in which the predetermined recessed part 234 was formed. The concave portion 234 is configured to be able to fit to a standing portion 244 of a fourth molding die 240 described later, a standing portion 254 of a fifth molding die 250, and convex portions 164 and 174 of the pressing molds 160 and 170. Yes.

  As shown in FIG. 13 (e), the fourth mold 240 includes an insertion hole 242 through which the first mold 210 can be inserted, and a standing portion 244 formed at the end of the insertion hole 242. A flat molding surface 246 is formed on the upper surface of the standing portion 244.

  As shown in FIG. 13 (f), the fifth mold 250 has an insertion hole 252 through which the second mold 220 can be inserted, and a standing portion 254 formed at the end of the insertion hole 252. A flat molding surface 256 is formed on the upper surface of the standing portion 254.

  The other preliminary press molds 150 and the main press molds 160 and 170 are the same as those described in the first embodiment, and thus detailed description thereof is omitted.

  In the first compression body forming step, first, as shown in FIG. 11C and FIG. 14, the first to fifth molding dies 210 to 250 are used, and the first molding die 210 is inserted into the fourth molding die 240. The first molding die 210 and the fourth molding die 240 are combined by being inserted into the second molding die 242, and the second molding die 220 and the fifth molding die are inserted through the insertion hole 252 of the fifth molding die 250. 250, and the first to fifth molding dies 210 to 250 so that the first molding die 210 and the fourth molding die 240 become the lower die, and the second molding die 220 and the fifth molding die 250 become the upper die. Place. At this time, as shown in FIG. 11 (d-2), the first mold 210 is arranged such that the first molding surface 212 of the first molding mold 210 is positioned above the molding surface 246 of the fourth molding mold 240. Is inserted into the insertion hole 242 of the fourth mold 240, and the first molding surface 222 of the second molding die 220 and the molding surface 256 of the fifth molding die 250 are formed as shown in FIG. The second mold 220 is inserted into the insertion hole 252 of the fifth mold 250 so as to be positioned on the same plane. Then, with the pin 216 protruding from the insertion hole 218, the conductive powder CP is supplied to the molding space, and pre-pressed with a predetermined pressure as shown in FIG. P1 is formed.

  The first compression body P1 formed by performing the first compression body forming step is similar to the one described in the first embodiment, the flat surface portion a1, and the wall portion a2 that is erected on the end portion of the flat surface portion a1. And two insertion holes a3 that are formed in the flat portion a1 and into which the lead wires 22 and 24 can be inserted (see FIG. 3D described above). The flat portion a1 is formed by the first molding surface 212 of the first molding die 210, the first molding surface 222 of the second molding die 220, and the molding surface 232 of the third molding die 230. The wall portion a <b> 2 includes the second molding surface 214 of the first molding die 210, the second molding surface 224 of the second molding die 220, the molding surface 232 (part of the recess 234) of the third molding die 230, and the fourth molding die 240. The molding surface 246 and the molding surface 256 of the fifth mold 250 are formed. The insertion hole a3 is formed by the pin 216 of the first mold 210.

  In the first compressed body arranging step, as shown in FIGS. 11 (f) and 11 (g), the first molding surface 212 of the first molding die 210 and the molding surface 246 of the fourth molding die 240 are on the same plane. The first molding die 210 and the second molding die 220 are lowered while the third to fifth molding dies 230 to 250 are fixed until the second molding die 230 is positioned.

  In the second compression body forming step, first, as shown in FIG. 12A, the pin 216 is lowered and stored in the insertion hole 218 of the first molding die 210, and the first and third to fifth molding dies. The second molding die 220 is extracted in a state where 210 and 230 to 250 are combined, and the second molding die 220 and the preliminary press molding die 150 are exchanged. At this time, the pin 216 is lowered until the tip end portion of the pin 216 of the first mold 210 is positioned below the upper surface of the insertion hole 218. Thereafter, as shown in FIG. 12B, the two lead wires 22 and 24 are inserted into the two insertion holes a3 of the first compression body P1 and the two insertion holes 218 of the first mold 210, and the first In a state where the coil 20 is disposed on the flat surface portion a1 of the compressed body P1, as shown in FIGS. 12 (c) and 12 (d), by supplying the insulating magnetic powder MP to the molding space and pre-pressing, A second compression body P2 is formed.

  The subsequent steps (lead wire cutting / bending step, main pressing step, sheet layer peeling step, electrode separation / heat treatment step, solder coating layer forming / mounting step) are the same as those described in the first embodiment. Therefore, the description is omitted.

  As described above, the method for manufacturing the surface mount inductor according to the third embodiment is different from the method for manufacturing the surface mount inductor according to the first embodiment in the type of the press mold prepared in the mold preparation step and the first compression body. Although the contents of the placement step and the second compression body formation step are different, as in the case of the method for manufacturing the surface mount inductor according to the first embodiment, not only the magnetic layer but also the back electrode layer and the side surface corresponding to the terminal electrode Since the electrode layer is also formed by press molding, it is possible to manufacture a surface mount inductor including a back electrode layer and a side electrode layer without complicating the manufacturing process. In addition, since the magnetic body layer in which the coil 20 is disposed, the back electrode layer, and the side electrode layer are integrally formed, it is possible to manufacture a surface mount inductor having higher reliability than the conventional one. .

  The method for manufacturing a surface mount inductor according to the third embodiment is different from the embodiment except that the type of the press mold prepared in the mold preparing step and the contents of the first compressed body arranging step and the second compressed body forming step are different. 1 includes the same steps as those in the method of manufacturing the surface mount inductor according to the first embodiment, and thus has the corresponding effect as it is among the effects of the method of manufacturing the surface mount inductor according to the first embodiment.

[Embodiment 4]
Embodiment 4 is an embodiment for explaining a method for manufacturing a surface mount inductor according to claim 4.

  15 and 16 are views for explaining a method for manufacturing the surface mount inductor according to the fourth embodiment. 15 (a) to 15 (f) and FIGS. 16 (a) to 16 (d) are diagrams schematically showing each process from the mold preparation process to the second compression body forming process. 15 (c-1) is an enlarged view of a portion indicated by reference sign A in FIG. 15 (b), and FIG. 15 (c-2) is an enlarged view of a portion indicated by reference sign B in FIG. 15 (b). FIG. 15 (f) is an enlarged view of a portion indicated by reference numeral A in FIG. 15 (e).

  FIG. 17 is a view for explaining the press mold used in the method for manufacturing the surface mount inductor according to the fourth embodiment. 17 (a) is a perspective view of the first mold 310, FIG. 17 (b) is a perspective view of the pins 360 and 362, and FIG. 17 (c) is a perspective view of the second mold 320. FIG. 17D is a perspective view of the third mold 330, FIG. 17E is a perspective view of the fourth mold 340, and FIG. 17F is a perspective view of the fifth mold 350. .

  The method for manufacturing a surface mount inductor according to the fourth embodiment basically includes the same steps as the method for manufacturing the surface mount inductor according to the first embodiment, but the types of press molds prepared in the mold preparation step. In addition, the contents of the first compressed body arranging step and the second compressed body forming step are different from the manufacturing method of the surface mount inductor according to the first embodiment.

  That is, in the method for manufacturing the surface mount inductor according to the fourth embodiment, in the mold preparation step, as shown in FIG. 15A, the first to fifth molds 310 to 350 and the two pins 360 and 362 are used. Then, a preliminary press mold 150 and main press molds 160 and 170 are prepared.

  As shown in FIG. 17A, the first molding die 310 has a first molding surface 312 formed on the upper surface of the molding die and a second molding surface 314 formed on a part of the side surface of the molding die. The first molding surface 312 and the second molding surface 314 are both flat, and the surface shape when the first molding surface 312 is viewed in a plane is a square shape. The first molding surface 312 is formed with two insertion holes 316 into which the lead wires 22 and 24 can be inserted.

  The two pins 360 and 362 shown in FIG. 17B are configured to be inserted into and removed from the insertion hole 316 of the first mold 310 and have a cross-sectional shape corresponding to the cross-sectional shape of the lead wires 22 and 24. The tips of the pins 360 and 362 are sharp.

  The second molding die 320 is a molding die disposed to face the first molding die 310, and as shown in FIG. 17 (c), a first molding surface 322 composed of a flat surface formed on the upper surface of the molding die, And a second molding surface 324 formed on a part of the side surface of the molding die. The planar shape of the first molding surface 322 is the same shape as the first molding surface 312 of the first molding die 310. The first molding surface 322 has two pin fitting holes 326 provided corresponding to the positions of the pins 360 and 362 when the pins 360 and 362 are inserted into the insertion holes 316.

  The 3rd shaping | molding die 330 is a shaping | molding die arrange | positioned so that the side in a shaping | molding space may be covered, and as shown in FIG.17 (d), it has the shaping | molding surface 332 in which the predetermined recessed part 334 was formed. The concave portion 334 is configured to be able to be fitted to a standing portion 344 of a fourth molding die 340, which will be described later, a standing portion 354 of a fifth molding die 350, and convex portions 164 and 174 of the pressing molds 160 and 170. Yes.

  As shown in FIG. 17 (e), the fourth mold 340 includes an insertion hole 342 through which the first mold 310 can be inserted, and a standing portion 344 formed at the end of the insertion hole 342. A flat molding surface 346 is formed on the upper surface of the standing portion 344.

  As shown in FIG. 17 (f), the fifth mold 350 includes an insertion hole 352 through which the second mold 320 can be inserted, and a standing portion 354 formed at the end of the insertion hole 352. A flat molding surface 356 is formed on the upper surface of the standing portion 354.

  The other preliminary press molds 150 and the main press molds 160 and 170 are the same as those described in the first embodiment, and thus detailed description thereof is omitted.

  In the first compression body forming step, first, as shown in FIG. 15B, the first molding die 310 is replaced with the fourth molding die 340 using the first to fifth molding dies 310 to 350 and the pins 360 and 362. The first molding die 310 and the fourth molding die 340 are combined through the insertion hole 342 and the second molding die 320 is inserted into the insertion hole 352 of the fifth molding die 350 and the second molding die 320 and the fifth molding die 350 are combined. In combination with the molding die 350, the first to fifth molding dies 310 so that the first molding die 310 and the fourth molding die 340 become the lower die and the second molding die 320 and the fifth molding die 350 become the upper die. ~ 350 are arranged. At this time, as shown in FIG. 15 (c-2), the first molding die 310 so that the first molding surface 312 of the first molding die 310 is positioned above the molding surface 346 of the fourth molding die 340. Is inserted into the insertion hole 342 of the fourth molding die 340, and the first molding surface 322 of the second molding die 320 and the molding surface 356 of the fifth molding die 350 are formed as shown in FIG. The second mold 320 is inserted through the insertion hole 352 of the fifth mold 350 so as to be positioned on the same plane. Further, with the pins 360 and 362 inserted into the insertion holes 316 of the first mold 310, the conductive powder CP is supplied to the molding space, and as shown in FIG. Preliminary pressing is performed to form the first compressed body P1.

  In the first compressed body arranging step, as shown in FIGS. 15E and 15F, the first molding surface 312 of the first molding die 310 and the molding surface 346 of the fourth molding die 340 are on the same plane. The first molding die 310 and the second molding die 320 are lowered while the third to fifth molding dies 330 to 350 are fixed until they are positioned at the position.

  In the second compressed body forming step, first, as shown in FIG. 16A, the pins 360 and 362 are removed from the insertion holes 316 of the first mold 310 and the first and third to fifth molds 310, The second molding die 320 is extracted in a state where 330 to 350 are combined, and the second molding die 320 and the preliminary press molding die 150 are exchanged. Thereafter, as shown in FIG. 16B, the two lead wires 22 and 24 are inserted into the two insertion holes a3 of the first compression body P1 and the two insertion holes 316 of the first molding die 310, so that the first In a state where the coil 20 is disposed on the flat surface portion a1 of the compressed body P1, as shown in FIGS. 16C and 16D, by supplying the insulating magnetic powder MP to the molding space and pre-pressing, A second compression body P2 is formed.

  The subsequent steps (lead wire cutting / bending step, main pressing step, sheet layer peeling step, electrode separation / heat treatment step, solder coating layer forming / mounting step) are the same as those described in the first embodiment. Therefore, the description is omitted.

  As described above, the method for manufacturing the surface mount inductor according to the fourth embodiment is different from the method for manufacturing the surface mount inductor according to the first embodiment in the type of the press mold prepared in the mold preparation step and the first compression body. Although the contents of the placement step and the second compression body formation step are different, as in the case of the method for manufacturing the surface mount inductor according to the first embodiment, not only the magnetic layer but also the back electrode layer and the side surface corresponding to the terminal electrode Since the electrode layer is also formed by press molding, it is possible to manufacture a surface mount inductor including a back electrode layer and a side electrode layer without complicating the manufacturing process. In addition, since the magnetic body layer in which the coil 20 is disposed, the back electrode layer, and the side electrode layer are integrally formed, it is possible to manufacture a surface mount inductor having higher reliability than the conventional one. .

  The manufacturing method of the surface mount inductor according to the fourth embodiment is different from the embodiment except that the type of the press mold prepared in the molding die preparation process and the contents of the first compression body arranging process and the second compression body forming process are different. 1 includes the same steps as those in the method of manufacturing the surface mount inductor according to the first embodiment, and thus has the corresponding effect as it is among the effects of the method of manufacturing the surface mount inductor according to the first embodiment.

[Embodiment 5]
Embodiment 5 is an embodiment for explaining a method for manufacturing a surface mount inductor according to claim 8.

FIG. 18 is a flowchart for explaining the method for manufacturing the surface mount inductor according to the fifth embodiment.
19 to 21 are views for explaining a method for manufacturing the surface mount inductor according to the fifth embodiment. FIG. 19A to FIG. 19F, FIG. 20A to FIG. 20F, and FIG. 21A to FIG. 21E are diagrams schematically showing each step.
19 to 21, the same members as those in FIGS. 3 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The method for manufacturing a surface mount inductor according to the fifth embodiment basically includes the same steps as the method for manufacturing the surface mount inductor according to the first embodiment, but the types of press molds prepared in the mold preparation step. Is different from the method for manufacturing the surface mount inductor according to the first embodiment in that the lead wire cutting step is performed instead of the lead wire cutting / bending step.

  As shown in FIG. 18, the manufacturing method of the surface mount inductor according to the fifth embodiment includes a mold preparing step S110, a first compressed body forming step S120, a first compressed body arranging step S130, and a second compressed body forming step S140. The pressing step S150, the lead wire cutting step S160, the sheet layer peeling step S170, the electrode separation / heat treatment step S180, and the solder coating layer forming / mounting step S190 are sequentially performed.

  In the mold preparing step S110, as shown in FIG. 19A, first to fourth molds 110 to 140, a pre-press mold 150, and a main press mold 170 are prepared. That is, the press molding die 160 prepared as the lower die at the time of the main press in the first embodiment is not prepared in this step.

  The first to fourth molds 110 to 140, the pre-press mold 150, and the main press mold 170 are the same as those described in the first embodiment, and thus detailed description thereof is omitted.

  After performing the mold preparation step S110, the first compression body formation step S120, the first compression body arrangement step S130, and the second compression body formation step S140 are performed as in the case of the first embodiment (FIG. 19B). (Refer to FIG.19 (f) and FIG.20 (a)-FIG.20 (c)).

  In the main pressing step S150, as shown in FIG. 20D, the fourth molding die 140, the preliminary pressing molding die 150, and the main pressing molding die 170 are exchanged. In addition, the 2nd shaping | molding die 120 is used as a lower mold | type at the time of this press. Thereafter, as shown in FIGS. 20E and 20F, a transfer sheet S having a sheet layer c1 and a wiring layer c2 is prepared, and the wiring layer c2 is second compressed body P2 with respect to the sheet layer c1. The transfer sheet S is disposed on the second compression body P2 so as to face the side. And as shown to Fig.21 (a), by carrying out this press by the pressurization pressure higher than the pressurization force at the time of the pre-press in 1st compression body formation process S120 and 2nd compression body formation process S140, 3rd compression body P3 is formed.

  In the lead wire cutting step S160, as shown in FIG. 21 (b), the third compression body P3 is taken out of the molding space, and as shown in FIG. 21 (c), the lead wire 22 extending from the back surface of the third compression body P3. , 24 is cut.

  The subsequent steps (sheet layer peeling step S170, electrode separation / heat treatment step S180, and solder coating layer forming / mounting step S190) are the same as those described in the first embodiment, and thus description thereof is omitted.

  As described above, the surface mount inductor manufacturing method according to the fifth embodiment is different from the surface mount inductor manufacturing method according to the first embodiment in the type of the press mold prepared in the mold preparing step and the lead. Although the lead wire cutting step is performed instead of the wire cutting / bending step, as in the case of the method for manufacturing the surface mount inductor according to the first embodiment, not only the magnetic layer but also the back surface corresponding to the terminal electrode Since the electrode layer and the side electrode layer are also formed by press molding, it is possible to manufacture a surface mount inductor including the back electrode layer and the side electrode layer without complicating the manufacturing process. In addition, since the magnetic body layer in which the coil 20 is disposed, the back electrode layer, and the side electrode layer are integrally formed, it is possible to manufacture a surface mount inductor having higher reliability than the conventional one. .

  The surface mount inductor manufacturing method according to the fifth embodiment is carried out except that the type of the press mold prepared in the mold preparation step is different and that the lead wire cutting step is performed instead of the lead wire cutting / bending step. Since the same steps as those in the method of manufacturing the surface mount inductor according to the first embodiment are included, the corresponding effects among the effects of the method of manufacturing the surface mount inductor according to the first embodiment are directly included.

  As mentioned above, although the manufacturing method of the surface mount type inductor of this invention was demonstrated based on said each embodiment, this invention is not limited to said each embodiment, In the range which does not deviate from the summary, various For example, the following modifications are possible.

  In the fifth embodiment, the case where the lead wire cutting step is performed instead of the lead wire cutting / bending step based on the manufacturing method of the surface mount inductor described in the first embodiment has been described. The present invention is not limited to this. For example, a method of performing a lead wire cutting step instead of a lead wire cutting / bending step based on the method for manufacturing a surface mount inductor described in the second to fourth embodiments is also included in the present invention.

  In the first and third embodiments, the pin of the first mold has a sharp tip, and in the fourth embodiment, the pin having a sharp tip is used, but the present invention is limited to this. Instead, a first mold having a pin with a sharp tip or a pin with a sharp tip may be used.

  In the fifth embodiment, the case where the sheet layer peeling step is performed after the lead wire cutting step is illustrated and described, but the present invention is not limited to this, and the sheet layer peeling step is performed first. Then, the lead wire cutting step may be performed.

  In each of the above embodiments, the case where the wiring pattern is formed on the surface of the magnetic layer by transferring the wiring pattern with the transfer sheet has been described as an example, but the present invention is not limited thereto, The wiring pattern may be formed on the surface of the magnetic layer using other known means.

  In each of the above embodiments, copper powder is used as the conductive powder, but the present invention is not limited to this, and metal powder that can be used as an electrode layer, for example, silver powder, nickel powder, aluminum powder Alternatively, titanium powder or a powder made of an alloy thereof may be used. In each of the above embodiments, the insulated magnetic powder is used as the insulated magnetic powder. However, the present invention is not limited to this, and a metal magnetic powder such as Sendust or Permalloy is insulated. Etc. may be used.

  In each of the above embodiments, the case where the electrode layer of the manufactured surface mount inductor is separated into two regions of the first electrode and the second electrode has been described as an example, but the present invention is limited to this. Instead, for example, the electrode layer may be separated into three or more regions.

  In each of the above embodiments, the case where a surface-mount type inductor having two side electrode layers is manufactured has been described as an example, but the present invention is not limited to this, and three or more side electrode layers are provided. A method of manufacturing the surface mount inductor provided is also included in the present invention.

  In the third and fourth embodiments, in the first compression body arranging step, the third to fifth moldings are performed until the first molding surface of the first molding die and the molding surface of the fourth molding die are located on the same surface. Although the case where the 1st shaping | molding die and the 2nd shaping | molding die are lowered | hung with the type | mold fixed is illustrated and demonstrated, this invention is not limited to this, The state which fixed the 1st-3rd shaping | molding die The fourth mold and the fifth mold may be raised.

  In each of the above embodiments, the case where the surface-mounted inductor 1 having a shape in which the side electrode layer 60 part slightly protrudes from the side surface of the magnetic layer 10 has been described as an example. It is not limited. In order to manufacture a surface-mount inductor in which the side electrode layer portion and the side surface of the magnetic layer are flat (the side electrode layer 60 portion does not protrude from the side surface of the magnetic layer 10), the shape of the mold is adjusted as appropriate. May be.

  In each of the above-described embodiments, the case where one compressed body is formed by one press molding (manufacturing process) has been described as an example, but the present invention is not limited to this and is not limited to this. The shape and the like of the mold may be adjusted as appropriate so that a plurality of compressed bodies are formed simultaneously by press molding.

1 is a perspective view schematically showing a surface mount inductor 1 manufactured by a method for manufacturing a surface mount inductor according to Embodiment 1. FIG. 3 is a flowchart for explaining a method for manufacturing the surface mount inductor according to the first embodiment. FIG. 5 is a view for explaining the method for manufacturing the surface mount inductor according to the first embodiment. FIG. 5 is a view for explaining the method for manufacturing the surface mount inductor according to the first embodiment. FIG. 5 is a view for explaining the method for manufacturing the surface mount inductor according to the first embodiment. FIG. 5 is a view for explaining a press mold used in the method for manufacturing the surface mount inductor according to the first embodiment. FIG. 5 is a view for explaining a press mold used in the method for manufacturing the surface mount inductor according to the first embodiment. FIG. 5 is a view for explaining a press mold used in the method for manufacturing the surface mount inductor according to the first embodiment. FIG. 10 is a view for explaining the method for manufacturing the surface mount inductor according to the second embodiment. It is a figure shown in order to demonstrate the press-molding die used for the manufacturing method of the surface mount type inductor which concerns on Embodiment 2. FIG. It is a figure shown in order to demonstrate the manufacturing method of the surface mount type inductor which concerns on Embodiment 3. FIG. It is a figure shown in order to demonstrate the manufacturing method of the surface mount type inductor which concerns on Embodiment 3. FIG. It is a figure shown in order to demonstrate the press-molding die used for the manufacturing method of the surface mount type inductor which concerns on Embodiment 3. FIG. It is a figure shown in order to demonstrate the press-molding die used for the manufacturing method of the surface mount type inductor which concerns on Embodiment 3. FIG. It is a figure shown in order to demonstrate the manufacturing method of the surface mount type inductor which concerns on Embodiment 4. FIG. It is a figure shown in order to demonstrate the manufacturing method of the surface mount type inductor which concerns on Embodiment 4. FIG. It is a figure shown in order to demonstrate the press mold used for the manufacturing method of the surface mount type inductor which concerns on Embodiment 4. FIG. 10 is a flowchart for explaining a method for manufacturing a surface-mount inductor according to the fifth embodiment. FIG. 10 is a view for explaining the method for manufacturing the surface mount inductor according to the fifth embodiment. FIG. 10 is a view for explaining the method for manufacturing the surface mount inductor according to the fifth embodiment. FIG. 10 is a view for explaining the method for manufacturing the surface mount inductor according to the fifth embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Surface mount type inductor, 10 ... Magnetic body layer, 20 ... Coil, 22, 24 ... Lead wire, 30 ... Back electrode layer, 32 ... 1st electrode, 34 ... 2nd electrode, 40 ... Solder coating layer, 50 ... Wiring pattern, 60 ... side electrode layer, 70 ... electronic component, 110,180,210,310 ... first molding die, 112,182,212,312 ... first molding surface (of the first molding die), 114,184 , 214, 314 ... second molding surface (of the first molding die), 116, 186, 216, 360, 362 ... pin, 120, 220, 320 ... second molding die, 122 ... (of the second molding die) Surface, 124 ... convex part of (second molding die), 126 ... insertion hole of (second molding die), 130, 230, 330 ... third molding die, 132, 232, 332 ... (of third molding die) Molding surface, 134, 234, 334 (third molding) ) Recess, 140, 240, 340 ... fourth mold, 142, 242, 342 ... (fourth mold) insertion hole, 144, 244, 344 ... (fourth mold) standing part, 146 246, 346... (Fourth molding die) molding surface, 150... Pre-press molding die, 152... (Pre-press molding die) molding surface, 160, 170... Press molding die, 162, 172. Forming surface of the pressing mold), 164, 174... Convex portion of the pressing mold, 186a... Tip end surface of the pin, 188, 218, 316. 322 ... first molding surface (of the second molding die), 224, 324 ... second molding surface (of the second molding die), 226, 326 ... holes (of the second molding die), a1 ... (first compression body) A) plane part, a2 ... wall part (of the first compression body), a3 ... insertion hole, c1 ... sheet layer c2 ... wiring layer, CP ... conductive powder, MP ... insulating magnetic powder, P1 ... first compression member, P2 ... second compression member, P3 ... third compression member, S ... transfer sheet

Claims (10)

A magnetic layer formed by press molding insulating magnetic powder;
A coil disposed inside the magnetic layer;
A back electrode layer having a first electrode and a second electrode respectively connected to two lead wires extending from the coil and disposed on the back surface of the magnetic layer, and formed by press molding conductive powder;
A wiring pattern formed on the surface of the magnetic layer;
A side electrode layer formed on the side surface of the magnetic layer so as to connect the first electrode and the second electrode to a part of the wiring pattern and formed by press molding the conductive powder; A method for manufacturing a surface mount inductor comprising:
Using a press mold that can form a predetermined molding space, supplying the conductive powder to the molding space and pre-pressing the flat portion having two insertion holes into which the lead wires can be inserted and the plane A first compression body forming step of forming a first compression body having a wall portion standing at an end of the portion;
A first compression body arranging step of arranging the first compression body in a molding space such that the flat surface portion of the first compression body is a bottom surface;
By inserting the two lead wires into the two insertion holes and placing the coil on the flat surface portion of the first compression body, supplying the insulating magnetic powder into the molding space and pre-pressing A second compression body forming step of forming the second compression body;
A main pressing step in which main pressing is performed at a pressing force higher than the pressing force at the time of preliminary pressing in the first compression body forming step and the second compression body forming step in a state in which the second compression body is disposed in the molding space. A method of manufacturing a surface mount inductor, which is included in this order. In the manufacturing method of the surface mount inductor according to claim 1,
Before performing the first compression body forming step, the lead mold has a first molding surface capable of forming the flat surface portion and a second molding surface capable of forming an inner portion of the wall portion, and the lead At least two pins having a cross-sectional shape corresponding to the cross-sectional shape of the line are arranged to face the first forming die, the first forming die formed on the first forming surface, and at least the flat portion can be formed. A second molding die having at least two insertion holes in which the two lead wires can be inserted and can be fitted to the pins, and at least an outer portion of the wall portion. A third molding die that has a moldable molding surface and is disposed so as to cover a side in the molding space; and an insertion hole through which the first molding die can be inserted. With the third molding die in a state of being inserted through the insertion hole Perform mold preparation step of at least prepare a fourth mold having the wall portion capable of forming a molding surface when combined viewed,
In the first compression body forming step,
With each mold placed so that the first mold is on the lower side and the second mold is on the upper side, and the first mold is inserted through the insertion hole of the fourth mold, Supply the conductive powder to the molding space and perform a preliminary press,
In the first compressed body arranging step,
A method of manufacturing a surface mount inductor, wherein the top and bottom of each mold is inverted so that the first mold is on the upper side and the second mold is on the lower side. In the manufacturing method of the surface mount inductor according to claim 1,
Before performing the first compression body forming step, the press mold has a first molding surface capable of forming the flat surface portion and a second molding surface capable of forming an inner portion of the wall portion, A first mold having at least two insertion holes formed in the first molding surface, into which one lead wire can be inserted, and further provided in the insertion hole and configured to be slidable up and down And a molding surface that is disposed opposite to the first molding die and is capable of forming the planar portion and has the same planar shape as the planar shape of the first molding surface of the first molding die. A second molding die in which at least two pin fitting recesses provided corresponding to the positions of the pins are formed on the molding surface, and a molding surface capable of forming at least the outer portion of the wall portion. And to cover the side in the molding space A third molding die to be arranged; and an insertion hole through which the first molding die can be inserted; and when the first molding die is inserted into the insertion hole and combined with the third molding die, A fourth molding die having a molding surface capable of forming a wall portion; an insertion hole through which the molding surface of the second molding die can be inserted; and a molding surface having a molding surface capable of forming a part of the wall portion. 5 Perform a mold preparation step to prepare at least a mold,
In the first compression body forming step,
The respective molding dies are arranged so that the first molding die is on the lower side and the second molding die is on the upper side, and the first molding surface of the first molding die is more than the molding surface of the fourth molding die. The first molding die is inserted through the insertion hole of the fourth molding die so that the molding surface of the second molding die is flush with the molding surface of the fifth molding die. The second molding die is inserted into the insertion hole of the fifth molding die so as to be positioned at the position, and the conductive powder is supplied to the molding space in a state where the pin protrudes from the insertion hole. Do the press,
In the first compressed body arranging step,
The first molding die and the second molding die are lowered or the fourth molding until the first molding surface of the first molding die and the molding surface of the fourth molding die are located on the same plane. A method of manufacturing a surface mount inductor, wherein the mold and the fifth mold are raised. In the manufacturing method of the surface mount inductor according to claim 1,
Before performing the first compression body forming step, the press mold has a first molding surface capable of forming the flat surface portion and a second molding surface capable of forming an inner portion of the wall portion, A first mold in which at least two insertion holes into which one lead wire can be inserted are formed on the first molding surface; and a cross-sectional shape of the lead wire configured to be insertable / removable into the insertion hole of the first mold And a planar shape of the first molding surface of the first molding die, which is a molding surface that is disposed opposite to the first molding die and can form the flat surface portion. A second molding die having a molding surface having the same planar shape as the first molding die and having at least two pin fitting recesses formed on the molding surface corresponding to the positions of the insertion holes of the first molding die. And forming at least the outer part of the wall A third molding die that has an effective molding surface and is disposed so as to cover a side in the molding space; and an insertion hole through which the first molding die can be inserted, and the first molding die is inserted through the first molding die. A fourth molding die having a molding surface capable of forming the wall when combined with the third molding die in a state of being inserted into the hole, and an insertion hole through which the molding surface of the second molding die can be inserted. Having a molding die preparing step of preparing at least a fifth molding die having a molding surface capable of forming a part of the wall portion,
In the first compression body forming step,
The respective molding dies are arranged so that the first molding die is on the lower side and the second molding die is on the upper side, and the first molding surface of the first molding die is more than the molding surface of the fourth molding die. The first molding die is inserted through the insertion hole of the fourth molding die so that the molding surface of the second molding die is flush with the molding surface of the fifth molding die. The conductive powder is inserted into the molding space in a state where the second molding die is inserted into the insertion hole of the fifth molding die so that the pin is inserted into the insertion hole of the first molding die. To make a preliminary press,
In the first compressed body arranging step,
The first molding die and the second molding die are lowered or the fourth molding die until the first molding surface of the first molding die and the molding surface of the fourth molding die are located on the same plane. And the manufacturing method of the surface mount type inductor characterized by raising the said 5th shaping | molding die. In the manufacturing method of the surface mount inductor according to any one of claims 1 to 4,
In the present pressing step, the second compressed body is disposed in the molding space, and a transfer sheet in which a wiring layer having a pattern shape corresponding to the wiring pattern is formed on one surface of the sheet layer is used. This press is performed on the second compressed body so as to face the second compressed body side with respect to the sheet layer,
After the said press process, the sheet layer peeling process which peels the said sheet layer is performed, The manufacturing method of the surface mount type inductor characterized by the above-mentioned. In the manufacturing method of the surface mount inductor according to any one of claims 1 to 5,
In the present pressing step, a surface mounting type inductor manufacturing method is characterized in that a press mold having a molding surface in which both the back electrode layer side surface and the wiring pattern side surface are flat surfaces is used. In the manufacturing method of the surface mount inductor according to any one of claims 1 to 6,
Performing a lead wire cutting / bending step of cutting / bending the lead wire extending from the coil disposed in the second compression body between the second compression body forming step and the main pressing step; A method for manufacturing a surface mount inductor. In the manufacturing method of the surface mount inductor according to any one of claims 1 to 5,
A method of manufacturing a surface mount inductor, comprising performing a lead wire cutting step of cutting the lead wire extending from the back electrode layer after the main pressing step. In the manufacturing method of the surface mount inductor according to any one of claims 1 to 8,
The method for manufacturing a surface mount inductor, wherein the conductive powder is copper powder. In the manufacturing method of the surface mount inductor according to any one of claims 1 to 9,
The method of manufacturing a surface mount inductor, wherein the insulating magnetic powder is a powder in which a silica film is formed on the surface of conductive particles having magnetism.