JP2009283613A - Connection structure between lead wire and wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure that simply and surely connects a lead wire of a speaker or the like with a wiring board without using a connector. <P>SOLUTION: The ends of lead wires 2a and 2b are soldered to lead wire soldering lands 5d and 5e of first and second pattern lands 5b and 5c of a split substrate 5, and third and fourth pattern lands 4b and 4c are provided at the chip end of a conducting pattern that is covered with a resist on the lower surface of a wiring board 4. The split substrate 5 is interposed in a wiring board supporting part 3a and the wiring board 4 is placed thereon, and they are co-tightened and fixed with a screw 6. The first pattern land 5b and the third pattern land 4b and the second pattern land 5c and the fourth pattern land 4c are press-fitted respectively, resulting in a connection structure. The split substrate 5 is adopted instead of a connector, so that cost can be reduced, and poor connection or the like can be also eliminated thanks to co-tightening and fixation. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a connection structure between a lead wire and a wiring board, and more particularly to a connection structure devised so that a lead wire and a wiring board can be connected without using a connector.

  Conventionally, when connecting the lead wire (speaker wire) of a speaker built in a liquid crystal television to a wiring board, a connector is attached to the end of the speaker wire, and this connector is inserted into the connector attached to the wiring board. It is common to connect. However, since the connector is a relatively expensive part, it is desirable not to use it from the viewpoint of cost reduction.

Accordingly, the applicant of the present invention has a structure in which a speaker input terminal and a printed board are connected without using lead wires or connectors, and a conductive connecting plate is fixed to the speaker input terminal, and a conductive spring is attached to the printed board. The base end of the member is soldered, and the tip of the arm-shaped portion of the spring member is bent into a mountain and fitted into the opening of the connecting plate, and the spring member is attached to the connecting plate by the elastic restoring force of the tip of the arm-shaped Has already proposed a structure for connecting (Patent Document 1).
JP-A-10-178698

  The connection structure of the speaker input terminal disclosed in Patent Document 1 can reduce the cost because a relatively expensive connector is not used. However, since a spring member is used instead of the lead wire, the speaker and the printed circuit board are used. There is a disadvantage that the positional relationship is limited and the layout is greatly limited.

  Therefore, if the speaker lead wire is left as it is and only the connector can be omitted, the layout can be reduced without any limitation, and this is very convenient. However, the speaker lead wire is not used as such. It seems that the structure for connecting and fixing the substrate to the printed circuit board has not been developed yet within the scope investigated by the present applicant.

  The present invention has been made under the above circumstances, and a problem to be solved is to provide a connection structure that can easily and reliably connect and fix a lead wire such as a speaker and a wiring board without using a connector. .

In order to solve the above-described problem, a connection structure between a lead wire and a wiring board according to claim 1 of the present invention includes:
An annular first pattern land having a small radius to which solder is attached is provided on the upper surface around the screw insertion hole of the split substrate, and an annular second pattern land having a large radius to which solder is attached is provided on the outer surface. Providing and forming lead wire soldering lands on each pattern land, respectively piercing lead wire insertion holes in the vicinity thereof, and leading end portions of the two lead wires from the lower surface side of the split substrate to lead wire insertion holes While soldering to the lead wire soldering land portions of the first and second pattern lands,
An arc-shaped third pattern land in which solder having a radius of curvature equal to the radius of the first pattern land is attached to the lower surface around the screw insertion hole of the wiring board, and the radius of the second pattern land The arc-shaped fourth pattern land to which the same solder is attached is provided at the tip of the conductive pattern coated with the resist so as to overlap the first pattern land and the second pattern land,
The wiring board is placed with the split board interposed in the wiring board support part, and the screw is screwed into the screw hole of the wiring board support part through the screw insertion hole of the wiring board and the split board, and the wiring board and the split board. Are fastened together, and the first pattern land and the third pattern land, and the second pattern land and the fourth pattern land are respectively pressed into contact with each other.

  In the connection structure of the present invention, as described in claim 2, the lead wire soldering land portions of the first and second pattern lands are more soldered than the other portions of the first and second pattern lands. The first and second pattern lands are formed so that the swell is lowered and soldered to the lead wire soldering lands of the first and second pattern lands. It is preferable that the height be substantially the same as the rise of the solder in other portions.

  Further, as in claim 3, the lead wire soldering land portion of the first pattern land and the lead wire soldering land portion of the second pattern land are opposite to each other across the screw insertion hole of the split substrate. The lead pattern soldering land part of the second pattern land is circular so that the lead pattern soldering land part of the first pattern land protrudes inside the annular first pattern land. It is also preferable to form it so as to protrude outside the annular second pattern land.

  Further, as in claim 4, it is also preferable that the third pattern land and the fourth pattern land are provided so as to have a positional relationship opposite to each other across the screw insertion hole of the wiring board.

  The connection structure of the present invention is applied when any lead wire is connected, but is particularly preferably applied when a speaker wire is connected as a lead wire.

  The connection structure between the lead wire and the wiring board according to claim 1 of the present invention uses the above-described split board as an alternative to the connector at the end of the lead wire, and each lead of the first and second pattern lands. While soldering the ends of the two lead wires to the wire soldering land, the third and fourth above-mentioned surfaces are provided on the lower surface around the screw insertion hole of the wiring board as an alternative to the connector on the wiring board side. Since the pattern land is provided and neither the connector at the end of the lead wire nor the connector on the wiring board side is required, cost reduction can be achieved. Then, the wiring board is placed on the wiring board support portion with the split board interposed therebetween, and fastened together with screws to fix the first pattern land, the third pattern land, and the second pattern land, Since the fourth pattern lands are pressed against each other, they can be easily and reliably electrically connected and fixed inseparable. Moreover, the first and second pattern lands of the split substrate are formed in an annular shape, and the third and fourth pattern lands of the wiring substrate are formed in an arc shape having a radius of curvature equal to the radius of the first and second pattern lands. Even if the split substrate is rotated when it is fixed together with screws, the first pattern land and the third pattern land, and the second pattern land and the fourth pattern land are securely brought into contact with each other. Connection failure can be prevented.

  Further, when the bulge of the solder in the lead wire soldering land portion of the first and second pattern lands is the same height as the bulge of the solder in other portions of the first and second pattern lands, the lead wire When the end of the solder is soldered, the solder swell of the lead wire soldering land is one step higher than the solder swell of the other part. The first and second pattern lands of the wiring board and the third and fourth pattern lands of the wiring board may be difficult to contact evenly as a whole, resulting in poor connection. The solder lands on the lead wire soldering land portions of the first and second pattern lands are formed so as to be one step lower than the solder bulges of the other portions, and the lead wire end portions are soldered. When the solder swell of the land for soldering the wire is substantially the same height as the solder swell of the other part, when the split board and the wiring board are fastened together, the first and second patterns Since the land and the third and fourth pattern lands are in uniform contact with each other as a whole, the fear of causing a connection failure is eliminated.

  According to a third aspect of the present invention, the lead wire soldering land portions of the first and second pattern lands are positioned on opposite sides with respect to the screw insertion hole of the split substrate. The lead wire soldering land portion of the second pattern land is located outside the annular second pattern land so that the land lead wire soldering land portion protrudes inside the annular first pattern land. If the lead wire soldering lands are formed so as to protrude, even if the solder flows out of the lead wire soldering lands when soldering the ends of the lead wires, the first pattern land And the worry of shorting the second pattern land is eliminated.

  Further, as in the fourth aspect, the third pattern land and the fourth pattern land are also short-circuited when they are provided so as to be in a positional relationship opposite to each other across the screw insertion hole of the wiring board. The worry can be solved, and the third and fourth pattern lands can be uniformly pressed against the first and second pattern lands of the split substrate to prevent the tilt of the split substrate.

  Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic explanatory diagram of a connection structure between a lead wire and a wiring board according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of the connection structure, and FIG. FIG. 4B is a cross-sectional view taken along line AA of FIG. 4A, and FIG. 4 is a partially enlarged bottom view of a wiring board used in the connection structure.

  The connection structure between the lead wires and the wiring board shown in FIG. 1 is the main wiring for attaching the two lead wires 2a and 2b (speaker wires) of the speaker 1 incorporated in the liquid crystal television or the like to the rear frame 3 of the liquid crystal module. The case where it connects to the board | substrate 4 is illustrated.

  A major feature of the connection structure between the lead wire and the wiring board is that the connection is made using the split board 5 without using a connector. As shown in FIGS. 3A and 3B, the split substrate 5 is a small disc-shaped split substrate having a screw insertion hole 5a drilled in the center, and a solder is formed on the upper surface around the screw insertion hole 5a. An annular first pattern land 5b having a small radius to which solder is attached is provided, and an annular second pattern land 5c having a large radius to which solder is attached is provided outside. The pattern lands 5b and 5c are formed with lead wire soldering lands 5d and 5e. The lead lands 5d and 5e are adjacent to the lead wire soldering lands 5d and 5e. Each 5g is perforated.

  As shown in FIG. 3 (a), the lead wire soldering land portion 5d of the first pattern land 5b and the lead wire soldering land portion 5e of the second pattern land 5c are inserted through the screw of the split substrate. One lead wire soldering land portion 5d is formed so as to protrude to the inside of the annular first pattern land 5b, and the other lead wire solder is disposed. The attaching land portion 5e is formed so as to protrude outside the annular second pattern land 5c. Therefore, when soldering the end portions of the lead wires 2a and 2b to the lead wire soldering land portions 5d and 5e, the solder may slightly flow out of the lead wire soldering land portions 5d and 5e. However, the first pattern land 5b and the second pattern land 5c are not short-circuited by the solder that has flowed out.

  Further, as shown in FIG. 3B, the lead wire soldering land portion 5d of the first pattern land 5b is soldered more than the other portion (annular portion) of the first pattern land 5b. Similarly, the lead wire soldering land portion 5e of the second pattern land 5c is more than the other portion (annular portion) of the second pattern land 5c. However, it is formed so that the rise of the solder is further lowered. Therefore, when the end portions of the lead wires 2a and 2b are soldered to the lead wire soldering land portions 5d and 5e, the solder bulges in the lead wire soldering land portions 5d and 5e are in the annular portion. When the split board 5 and the wiring board 4 are fastened together as will be described later, the first and second pattern lands 5b and 5c and the first of the wiring board 4 to be described later are formed. The third and fourth pattern lands 4b and 4c can be uniformly contacted as a whole to prevent poor connection.

  In FIG. 3B, reference numerals 5h and 5i denote copper foils of the first and second pattern lands 5b and 5c, respectively.

  As shown in FIG. 2, the lead wires 2a and 2b of the speaker 1 are inserted into the lead wire insertion holes from the lower surface side of the split substrate 5 before the split substrate 5 and the wiring substrate 4 are fastened together. The portions are soldered to the lead wire soldering lands 5d and 5e of the first and second pattern lands 5b and 5c, respectively.

  On the other hand, as shown in FIG. 4, the lower surface around the screw insertion hole 4a of the wiring substrate 4 has an arc shape in which solder having a radius of curvature equal to the radius of the first pattern land 5b of the split substrate 5 is attached. The third pattern land 4b and the arc-shaped fourth pattern land 4c to which the solder equal to the radius of the second pattern land 5c of the split substrate 5 is attached are covered with the resist film 4d. Are provided at the tips of the conductive patterns 4e and 4f.

  The third pattern land 4b and the fourth pattern land 4c are positioned so as to be opposite to each other across the screw insertion hole 4a of the wiring board 4, and the split board 5 and the wiring board 4 are screwed into the screw 6 When the two are fixed together, the first and second pattern lands 5b and 5c of the split substrate 5 are formed so as to overlap each other. Therefore, there is no fear of causing a connection failure or a short circuit, and the third and fourth pattern lands 4b and 4c are in pressure contact with the first and second pattern lands 5b and 5c of the split substrate 5 evenly. Therefore, the tilt of the split substrate 5 can be prevented.

  As shown in FIGS. 1 and 2, this connection structure is a split board in which the ends of lead wires 2a and 2b are pre-soldered on a wiring board support portion 3a formed on the rear frame 3 by drawing. 5 is interposed and screw 6 is screwed into screw hole 3b of wiring board support portion 3a through screw insertion holes 4a and 4b of wiring board 4 and split board 5 from above. The split substrate 5 is fastened together, and the first pattern land 5b and the third pattern land 4b, and the second pattern land 5c and the fourth pattern land 4c are press-contacted, respectively.

  As described above, this connection structure uses the split substrate 5 as an alternative to the connector at the end portion of the lead wire, and each lead wire soldering land portion 5d of the first and second pattern lands 5b, 5c. , 5e are soldered to the ends of the two lead wires 2a, 2b of the speaker 1, while a third and a third are formed on the lower surface around the screw insertion hole 4a of the wiring board 4 as an alternative to the connector on the wiring board side. Since the four pattern lands 4b and 4c are provided and the connector at the end of the lead wire and the connector on the wiring board side are not required, the cost can be reduced.

  Then, the wiring board 4 is placed with the split board 5 interposed in the wiring board support portion 3a, and fastened together with the screws 6, and the first pattern land 5b, the third pattern land 4b, and the second Since the pattern land 5c and the fourth pattern land 4c are in pressure contact with each other, they can be easily and reliably electrically connected and fixed inseparable.

  Further, the first and second pattern lands 5b and 5c of the split substrate 5 are formed in an annular shape, and the third and fourth pattern lands 4b and 4c of the wiring substrate 4 are formed as the first and second pattern lands 5b, Since it is formed in an arc shape having a radius of curvature equal to the radius of 5c, even if the split substrate 5 rotates when it is fastened together with the screw 6, the first pattern land 5b, the third pattern land 4b, and the second pattern land 5b The pattern land 5c and the fourth pattern land 4c can be reliably contacted to prevent connection failure.

  The connection structure of the present invention has been described above by taking as an example the case where the lead wire (speaker wire) of the speaker is connected to the wiring board. It goes without saying that it is a thing.

FIG. 1 is a schematic explanatory view of a connection structure between a lead wire and a wiring board according to an embodiment of the present invention. It is an expanded sectional view of the connection structure. (A) is a top view of the split board used for the connection structure, (b) is the sectional view on the AA line of (a). It is a partially expanded bottom view of the wiring board used for the connection structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Speaker 2a, 2b Lead wire 3a Wiring board support part 3b Screw hole of a wiring board support part 4 Wiring board 4a Screw insertion hole of a wiring board 4b 3rd pattern land 4c 4th pattern land 4d Resist film 4e, 4f Conductive pattern 5 split board 5a split board screw insertion hole 5b first pattern land 5c second pattern land 5d first pattern land lead wire soldering land portion 5e second pattern land lead wire soldering land portion 5f, 5g Lead wire insertion hole 6 Screw

Claims (5)

An annular first pattern land having a small radius to which solder is attached is provided on the upper surface around the screw insertion hole of the split substrate, and an annular second pattern land having a large radius to which solder is attached is provided on the outer surface. Providing and forming lead wire soldering lands on each pattern land, respectively piercing lead wire insertion holes in the vicinity thereof, and leading end portions of the two lead wires from the lower surface side of the split substrate to lead wire insertion holes While soldering to the lead wire soldering land portions of the first and second pattern lands,
An arc-shaped third pattern land in which solder having a radius of curvature equal to the radius of the first pattern land is attached to the lower surface around the screw insertion hole of the wiring board, and the radius of the second pattern land The arc-shaped fourth pattern land to which the same solder is attached is provided at the tip of the conductive pattern coated with the resist so as to overlap the first pattern land and the second pattern land,
The wiring board is placed with the split board interposed in the wiring board support part, and the screw is screwed into the screw hole of the wiring board support part through the screw insertion hole of the wiring board and the split board, and the wiring board and the split board. The connection structure between the lead wire and the wiring board, wherein the first pattern land and the third pattern land, and the second pattern land and the fourth pattern land are press-contacted respectively. .   The lead soldering lands of the first and second pattern lands are formed so that the rise of the solder is one step lower than the other parts of the first and second pattern lands. The solder bulges at the end portions of the lead wires soldered to the lead wire soldering land portions of the pattern lands are substantially the same height as the solder bulges of the other portions of the first and second pattern lands. The connection structure according to claim 1, wherein:   The lead pattern soldering land portion of the first pattern land and the lead wire soldering land portion of the second pattern land are positioned opposite to each other across the screw insertion hole of the split substrate. The lead wire soldering land portion of the second pattern land is projected outside the annular second pattern land so that the lead land soldering land portion of the pattern land protrudes inside the annular first pattern land. The connection structure according to claim 1, wherein the connection structure is formed so as to protrude from the top.   The third pattern land and the fourth pattern land are provided so as to be in a positional relationship opposite to each other across the screw insertion hole of the wiring board. The connection structure described.   5. The connection structure according to claim 1, wherein the lead wire is a speaker wire.

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