JP2009281905A - Sensor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ensure detection precision of a sensor chip even when a substrate is tilted to a horizontal direction. <P>SOLUTION: A sensor device includes an installation part 21 having an installation face 24 vertically arranged to one face 11 of the substrate 10 and a fixing part 22 fixed in a through-hole 13 by being integrated with the installation part 21 and being in contact with a wall face of the through-hole 13, and uses a vibration absorbing member 20 having larger inside loss than the substrate 10. In this case, the sensor device arranges the sensor chip 30 on the installation face 24 of the installation part 21 so as to bring a gravity position of the sensor chip 30 between one face 11 and the other face 12 of the substrate 10 so that the sensor chip 30 directs to a parallel direction on one face 11 of the substrate 10. Thereby the sensor chip 30 is not affected by the tilt of the vibration absorbing member 20 due to gravity. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sensor device including a sensor chip that detects a physical quantity and generates an electrical signal corresponding to the physical quantity.

  Conventionally, for example, Patent Document 1 has proposed a sensor device including a sensor chip that performs acceleration detection. Specifically, Patent Document 1 proposes a sensor device in which a sensor chip is mounted on a substrate via an adhesive member. The adhesive member contains a foaming agent that vaporizes when heat is applied to the adhesive.

In the sensor device, after the sensor chip is mounted on the substrate through the adhesive member, heat is applied to the adhesive member and the foaming agent is vaporized, whereby voids are formed in the adhesive, thereby forming the adhesive member. A cushion function is added. As a result, the adhesive member becomes less elastic, and the transmission of vibration from the substrate to the sensor chip is suppressed.
JP 2005-228777 A

  However, in the conventional technique, when the substrate of the sensor device is tilted with respect to the horizontal direction, for example, parallel to the vertical direction, the adhesive member bends due to the weight of the sensor chip, and the detection axis of the sensor chip is vertical. Will be inclined to. The inclination of the sensor chip with respect to the vertical direction increases as the adhesive member is thickened to increase the vibration isolation effect and the sensor chip is moved away from the substrate. This causes a problem that the detection axis of the sensor chip is distorted, and a problem that a zero-point offset component is included in the output of the sensor chip.

  In particular, in a vehicle, there is a demand for saving space by installing a sensor device, which has been installed in a relatively large space such as a passenger compartment, in an engine room. Therefore, it is conceivable to install the sensor device in the engine room by tilting the substrate in the vertical direction with respect to the horizontal direction. However, the engine room is a place where the influence of vibration is large, and since the vibration becomes a noise component, a vibration isolation structure is indispensable. However, as described above, the detection accuracy of the sensor chip is improved by the adhesive member for vibration isolation. The problem of deteriorating arises.

  In view of the above points, an object of the present invention is to prevent the sensor chip from being affected by gravity even when the substrate is tilted with respect to the horizontal direction.

  In order to achieve the above object, the invention according to claim 1 has one surface (11) and the other surface (12) opposite to the one surface (11), and the one surface (11) and the other surface (12). A mounting portion (21) having a substrate (10) having a through hole (13) penetrating the substrate, an installation surface (24) disposed perpendicular to one surface (11) of the substrate (10), and an installation portion ( 21) and a fixed portion (22) fixed to the through hole (13) by contacting the wall surface of the through hole (13) and having a larger internal loss than the substrate (10). It is arranged on the installation surface (24) so that the center of gravity is located between the absorbent member (20) and one surface (11) and the other surface (12) of the substrate (10), and the physical quantity is detected and the physical quantity is detected. And a sensor chip (30) for generating an electrical signal.

  According to this, since the sensor chip (30) is disposed at a position where the central axes of the substrate (10) coincide with each other, the sensor chip (30) is separated from one surface (11) or the other surface (12) of the substrate (10). It is not placed at a distance. That is, it is possible to prevent the sensor chip (30) from being affected by the inclination of the vibration absorbing member (20) due to gravity. Moreover, the vibration transmitted to the vibration absorbing member (20) through the substrate (10) can be suppressed by the vibration absorbing member (20) having an internal loss larger than that of the substrate (10).

  In invention of Claim 2, it has a one surface (11) and the other surface (12) on the opposite side of the one surface (11), and penetrates the one surface (11) and the other surface (12) (13 ), An installation portion (21) having an installation surface (24) inclined with respect to one surface (11) of the substrate (10), and the installation portion (21) and being integrated therewith. A vibration absorbing member (20) having a fixed portion (22) fixed to the through hole (13) by contacting the wall surface of the hole (13) and having a larger internal loss than the substrate (10); 10) is arranged on the installation surface (24) so that the center of gravity is located between one surface (11) and the other surface (12) of the substrate (10) in a direction parallel to one surface (11), and detects a physical quantity. And a sensor chip (30) for generating an electrical signal corresponding to the physical quantity.

  Thus, even when the installation surface (24) is inclined with respect to the one surface (11) of the substrate (10), the same effect as in the first aspect can be obtained.

  In invention of Claim 3, it has the one surface (11) and the other surface (12) on the opposite side of the one surface (11), and penetrates the one surface (11) and the other surface (12) (13 ), An installation portion (21) having an installation surface (24) arranged in parallel to one surface (11) of the substrate (10), and the installation portion (21). And a vibration absorbing member (20) having a fixed portion (22) fixed to the through hole (13) by contacting the wall surface of the through hole (13) and having a larger internal loss than the substrate (10), It is arranged on the installation surface (24) so that the center of gravity is located between one surface (11) and the other surface (12) of the substrate (10) in a direction parallel to the one surface (11) of the substrate (10). And a sensor chip (30) for detecting and generating an electrical signal corresponding to the physical quantity.

  Thus, even when the installation surface (24) is arranged in parallel to the one surface (11) of the substrate (10), the same effect as in the first aspect can be obtained.

  In invention of Claim 4, it has a one surface (11) and the other surface (12) on the opposite side of one surface (11), and penetrates the one surface (11) and the other surface (12) (13 ), An installation portion (21) having an installation surface (24) arranged perpendicular to one surface (11) of the substrate (10), and the installation portion (21). And a vibration absorbing member (20) having a fixed portion (22) fixed to the through hole (13) by contacting the wall surface of the through hole (13) and having a larger internal loss than the substrate (10), A plurality of sensor chips (30) which are arranged on the installation surface (24) and detect a physical quantity and generate an electrical signal corresponding to the physical quantity, and the center of gravity of the plurality of sensor chips (30) is the substrate (10) A plurality of sensor chips (30) are provided so as to be between one surface (11) and the other surface (12). Characterized in that it is arranged on a surface (24).

  According to this, even if the sensor chip (30) is arranged at a position away from the substrate (10), each sensor chip (30) is separated from the substrate (10) from the output of each sensor chip (30). The effect can be offset. Moreover, the vibration transmitted to the vibration absorbing member (20) through the substrate (10) can be suppressed by the vibration absorbing member (20) having an internal loss larger than that of the substrate (10). As described above, the sensor chip (30) can be prevented from being affected by gravity.

  In the invention according to claim 5, the installation part (21) and the fixing part (22) each have a plate shape, and the vibration absorbing member (20) has two fixing parts (22) arranged in parallel. It is characterized by an H shape in which an installation part (21) perpendicular to the fixing part (22) is disposed.

  In such an H-shaped structure, vibration transmission can be suppressed by the fixing portion (22) that contacts the substrate (10). Moreover, the vibration transmission path from the fixing part (22) to the sensor chip (30) on the installation part (21) can be lengthened, and the vibration isolation effect can be further enhanced.

  As in the invention described in claim 6, the installation portion (21) and the fixing portion (22) each have a plate shape, and the vibration absorbing member (20) is located on one surface (11) of the substrate (10). N-type in which an installation portion (21) arranged to be inclined with respect to the fixing portion (22) is integrated between two fixing portions (22) arranged in parallel and vertically. It can also be. In this way, the fixing portion (22) and the installation portion (21) may be N-shaped in which there is no vertical relationship.

  In the seventh aspect of the present invention, a plurality of sensor chips (30) are provided, the installation portion (21) and the fixing portion (22) each have a plate shape, and the vibration absorbing member (20) has two in parallel. Between two fixed parts (22) arranged in parallel, two installation parts (21) perpendicular to the fixed part (22) are arranged in parallel, and a plurality of sensor chips (30 ) Is arranged in each of the two installation parts (21).

  Thereby, it is possible to improve the detection accuracy by dividing the detection range by mounting a plurality of sensor chips (30) for detecting different physical quantities or mounting a plurality of the same kind of sensor chips (30).

  In the invention according to claim 8, the installation portion (21) has a plate shape, the fixing portion (22) has a hollow cylindrical shape, and the vibration absorbing member (20) is provided on the installation portion (21). The installation surface (24) is arranged in parallel to the central axis of the fixed portion (22), and the installation portion (21) is integrated with the hollow portion of the fixed portion (22).

  Thereby, after the vibration absorbing member (20) is assembled to the substrate (10), the cylindrical fixing portion (22) can be rotated around the central axis of the fixing portion (22). For this reason, the detection axis of the sensor chip (30) can be set at a free angle.

  In the invention described in claim 9, the fixing portion (22) has a plate-like shape and an arc-shaped shape, the installation portion (21) has a plate shape, and the vibration absorbing member (20) The mounting portion (21) perpendicular to the plate-like fixing portion (22) is disposed between the plate-like fixing portion (22) and the arc-shaped fixing portion (22). It is characterized by.

  Accordingly, the arc-shaped fixing portion (22) is rotated by sliding the wall surface of the through hole (13) around the contact portion between the plate-shaped fixing portion (22) and the wall surface of the through hole (13). it can. Therefore, fine adjustment of the angle of the detection axis of the sensor chip (30) can be easily performed.

  As in the invention described in claim 10, the installation portion (21) and the fixing portion (22) each have a plate shape, and the vibration absorbing member (20) includes two plate-like fixing portions (22). It can be made into the wave form which the installation part (21) was connected between. According to this, since the vibration transmission path from the substrate (10) to the sensor chip (30) can be lengthened, the vibration isolation effect can be further enhanced.

  In the invention according to claim 11, one surface (11) or the other surface (12) of the substrate (10) is provided on the contact surface (25) of the fixing portion (22) that contacts the wall surface of the through hole (13). A protrusion (28) is provided for positioning the vibration absorbing member (20) with respect to the substrate (10) by contacting the substrate.

  Thereby, the position of the vibration absorbing member (20) with respect to the substrate (10) can be fixed at an appropriate place by inserting the vibration absorbing member (20) into the through hole (13).

  In the invention according to claim 12, the contact surface (25) is provided with a groove (29) extending in a direction parallel to the direction in which the vibration absorbing member (20) is inserted into the through hole (13), The protrusion (28) is characterized in that the position on the contact surface (25) is adjusted by moving the groove (29).

  Thereby, the position of the projection (28) can be finely adjusted, and consequently the position of the vibration absorbing member (20) with respect to the substrate (10) can be finely adjusted.

  As in the thirteenth aspect of the present invention, the vibration absorbing member (20) can be made of a liquid crystal polymer.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The sensor device shown in the present embodiment is used for detecting a physical quantity for vehicle brake control or skid control, for example.

  FIG. 1 is a diagram illustrating a sensor device according to a first embodiment of the present invention. FIG. 1A is an exploded perspective view of the sensor device 1, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 1A, the sensor device 1 includes a substrate 10, a vibration absorbing member 20, and a sensor chip 30.

  The substrate 10 is formed with a wiring circuit and the like, and mounted with a driver, a microcomputer, an electronic component, and the like for communicating with the outside. The substrate 10 has one surface 11 and another surface 12 opposite to the one surface 11, and has a rectangular through hole 13 that penetrates the one surface 11 and the other surface 12. In the present embodiment, the through hole 13 is provided in the central portion of the substrate 10. Further, one surface 11 of the substrate 10 is arranged in parallel with a surface parallel to the vertical direction. Such an arrangement corresponds to a case where the sensor device 1 is mounted on a vehicle, for example.

  The board | substrate 10 is formed with the same material as what is used as what is called a printed circuit board. For example, an epoxy resin is used as the material. Although it varies depending on the type of the epoxy resin, the internal loss of the substrate 10 is 0.01 to 0.02.

  The sensor chip 30 detects a physical quantity and generates an electrical signal corresponding to the physical quantity. In the present embodiment, two sensor chips 30 are provided, one of which is a gyro sensor and the other is an acceleration sensor. Among these, the structure of the acceleration sensor will be described with reference to FIGS. 2 is a schematic plan view of the acceleration sensor, and FIG. 3 is a cross-sectional view taken along the line BB of FIG.

  As shown in FIG. 3, the semiconductor substrate 31 constituting the acceleration sensor has an oxide film 34 as an insulating layer between a first silicon substrate 32 as a support substrate and a second silicon substrate 33 as a semiconductor layer. It is a rectangular SOI substrate. In the second silicon substrate 33, a trench 35 is formed, thereby forming a beam structure having a comb tooth shape including a movable portion 36 and fixed portions 37 and 38. Among these, the movable part 36 has a configuration in which both ends of the elongated rectangular weight part 39 are integrally connected to the anchor parts 41 and 42 via the spring part 40.

  The anchor portions 41 and 42 are fixed to the oxide film 34 and supported on the first silicon substrate 32 as a support substrate via the oxide film 34. Thereby, the weight part 39 and the spring part 40 are in a state of being separated from the oxide film 34. As shown in FIG. 2, the spring portion 40 has a rectangular frame shape in which two parallel beams are connected at both ends, and the spring function is displaced in a direction perpendicular to the longitudinal direction of the two beams. It is what has.

  Specifically, the spring portion 40 displaces the weight portion 39 in the horizontal direction of the substrate surface in the direction of the arrow X when receiving an acceleration including a component in the direction of the arrow X in FIG. The original state is restored. Therefore, the movable part 36 connected to the semiconductor substrate 31 can be displaced in the arrow X direction in the horizontal direction of the substrate surface on the oxide film 34, that is, the support substrate 11 according to the application of acceleration through the spring part 40. It has become.

  As shown in FIG. 2, the movable part 36 includes a comb-like movable electrode 43. The movable electrode 43 has a plurality of beams having a beam shape extending in opposite directions from both side surfaces of the weight portion 39 in a direction orthogonal to the longitudinal direction (arrow X direction) of the weight portion 39. In other words, a plurality of movable electrodes 43 are arranged in a comb-tooth shape along the arrangement direction with the longitudinal direction of the weight portion 39 (displacement direction of the spring portion 40, arrow X direction) being the arrangement direction. ing.

  In FIG. 2, four movable electrodes 43 are formed on the left side and the right side of the weight portion 39, and each movable electrode 43 is formed in a beam shape having a rectangular cross section and is separated from the oxide film 34. It has become. Thus, each movable electrode 43 can be displaced in the direction of the arrow X in the horizontal direction of the substrate surface together with the spring part 40 and the weight part 39 by being integrally formed with the spring part 40 and the weight part 39. ing.

  As shown in FIGS. 2 and 3, the fixing portions 37 and 38 are fixed to the oxide film 34 at the outer periphery of another set of opposite side portions where the anchor portions 41 and 42 are not supported. . The fixing portions 37 and 38 are supported on the first silicon substrate 32 as a supporting substrate via the oxide film 34.

  As shown in FIG. 2, the fixed portion 37 located on the left side of the weight portion 39 is composed of a left fixed electrode 44 and a left fixed electrode wiring portion 45. On the other hand, the fixed portion 38 located on the right side of the weight portion 39 is composed of a right fixed electrode 46 and a right fixed electrode wiring portion 47. The fixed electrodes 44 and 46 are arranged in a plurality of comb teeth so as to engage with the gaps of the comb teeth in the movable electrode 43.

  On the left side of the weight portion 39, a left fixed electrode 44 is provided on the upper side along the arrow X direction with respect to each movable electrode 43. On the other hand, on the right side of the weight portion 39, the right fixed electrode 46 is provided below the individual movable electrodes 43 along the arrow X direction.

  As described above, the fixed electrodes 44 and 46 are arranged to face the respective movable electrodes 43 in the horizontal direction of the substrate surface, and are fixed to the side surface (that is, the detection surface) of the movable electrode 43 at each facing interval. A detection interval for detecting capacitance is formed between the side surfaces of the electrodes 44 and 46 (that is, the detection surface).

  The left fixed electrode 44 and the right fixed electrode 46 are electrically independent from each other. The fixed electrodes 44 and 46 are formed in a beam shape having a rectangular cross section that extends substantially parallel to the movable electrode 43.

  The fixed electrode wiring portions 45 and 47 are fixed to the first silicon substrate 32 via the oxide film 34. The left fixed electrode 44 and the right fixed electrode 46 are formed in such a manner that a plurality of electrodes are grouped into wiring portions 45 and 47 that are electrically common.

  A left fixed electrode pad 48 and a right fixed electrode pad 49 are formed at predetermined positions on the left fixed electrode wiring portion 45 and the right fixed electrode wiring portion 47, respectively.

  A movable electrode wiring portion 50 is formed in a state of being integrally connected to one anchor portion 42, and a movable electrode pad 51 is formed at a predetermined position on the wiring portion 50. Each of the electrode pads 48, 49, 51 is formed, for example, by sputtering or vapor deposition of aluminum. Each of the electrode pads 48, 49, 51 is electrically connected to a circuit provided on the semiconductor substrate 31 through wiring or the like.

  A relatively large weight portion 39 of the movable portion 36 is provided with a plurality of through holes 52 arranged in the thickness direction of the second silicon substrate 33 as a semiconductor layer. In the present embodiment, the intersecting portion 54 of the hole frame portion 53 located between the adjacent through holes 52 has three or less intersecting shapes. That is, the intersecting portion 54 has a shape in which two straight portions intersect or a three-passage shape. The plurality of through holes 52 each have a rectangular hole shape and are arranged in a staggered pattern. That is, a plurality of rows are arranged in a state where the longitudinal direction of each through hole 52 is along the longitudinal direction of the movable portion 36 (that is, the X direction), and the staggered shape is staggered in adjacent rows.

  In the acceleration sensor configured as described above, for example, the acceleration sensor is mounted on the vehicle such that the arrow X direction is the vehicle front-rear direction. When acceleration in the vehicle front-rear direction is applied in a state where a desired potential is applied to each of the fixed portions 37 and 38, the value of the capacitance between the movable electrode 43 and the fixed electrodes 44 and 46 accordingly. Fluctuates. By taking out the fluctuation of the capacitance value through the electrode pads 48, 49, 51, it becomes possible to detect the acceleration in the longitudinal direction of the vehicle.

  The structure shown in FIGS. 2 and 3 can also be applied to a gyro sensor. The two sensor chips 30 are mounted on a vibration absorbing member 20 described below.

  The vibration absorbing member 20 is mounted with the sensor chip 30 and is disposed in the through hole 13 of the substrate 10. FIG. 4 is a perspective view of the vibration absorbing member 20 shown in FIG. As shown in this figure, the vibration absorbing member 20 includes an installation part 21, a fixing part 22, and a wiring part 23. In FIG. 1, the vibration absorbing member 20 is drawn with the wiring portion 23 omitted.

  The installation part 21 has a plate shape having an installation surface 24 on which the sensor chip 30 is mounted. In the present embodiment, both surfaces of the plate-like installation portion 21 are installation surfaces 24, and the sensor chip 30 is installed on each installation surface 24. Further, when the vibration absorbing member 20 is integrated with the substrate 10, the installation portion 21 is disposed perpendicular to the one surface 11 of the substrate 10 and perpendicular to a surface parallel to the vertical direction. That is, the installation surface 24 is parallel to a surface parallel to the horizontal direction.

  Then, as shown in FIG. 1B, when the vibration absorbing member 20 is disposed in the through hole 13 of the substrate 10, each sensor chip 30 is arranged between each surface 11 of the substrate 10 and the other surface 12. It arrange | positions at the installation surface 24 so that the gravity center position of the chip | tip 30 may come. That is, the sensor chip 30 is not arranged at a position away from the one surface 11 or the other surface 12 of the substrate 10.

  As described above, when the sensor chip 30 is arranged at a position away from the substrate 10, the member supporting the sensor chip 30 is easily deformed by gravity, and the sensor chip 30 is tilted by the influence of gravity. However, in the present embodiment, since the sensor chip 30 is disposed at substantially the same position as the substrate 10 in the vertical direction, the vibration absorbing member 20 that supports the sensor chip 30 is not tilted by gravity, and the sensor chip 30 is It will not be affected. Therefore, it is possible to prevent the detection axis of the sensor chip 30 from being out of order and the output of the sensor chip 30 from including a zero point offset component.

  The fixing portion 22 shown in FIG. 4 is a plate-like member that is integrated with the installation portion 21 and is fixed to the through hole 13 by contacting the wall surface of the through hole 13. When the vibration absorbing member 20 is integrated with the substrate 10, the fixed portion 22 is disposed perpendicular to the one surface 11 of the substrate 10 and parallel to a surface parallel to the vertical direction.

  The fixing part 22 is integrated with the installation part 21. Specifically, the installation part 21 perpendicular to the fixed part 22 is arranged between the two fixed parts 22 arranged in parallel, so that the installation part 21 and the fixed part 22 have an H shape. There is no.

  The wiring part 23 electrically connects the sensor chip 30 and the circuit of the substrate 10. The wiring portion 23 is a plate-like member that is vertically disposed and integrated with the installation portion 21 and the fixing portion 22, and protrudes from the contact surface 25 that contacts the wall surface of the through hole 13 of the substrate 10 in the fixing portion 22. Projecting portion 26. The protruding portion 26 is a portion that is caught by the one surface 11 or the other surface 12 of the substrate 10 when the vibration absorbing member 20 is inserted into the through hole 13.

  The wiring part 23 is provided with a plating part 27 that functions as a wiring. Although not shown, the plating part 27 is provided not only on the wiring part 23 but also on the installation part 21 and the fixing part 22 and is electrically connected to each sensor chip 30. When the vibration absorbing member 20 is inserted into the through hole 13 and the protruding portion 26 is caught on the one surface 11 or the other surface 12 of the substrate 10, the plated portion 27 protrudes from the through hole 13. The sensor chip 30 and the circuit of the substrate 10 are electrically connected by electrically connecting the wiring (not shown) arranged around and the plated portion 27 by soldering or reflow.

  A so-called LCP member formed of a liquid crystal polymer is employed as the material of the vibration absorbing member 20 having the above configuration. The LCP member has a high internal loss, and is a member having vibration absorption of 3 to 6 times that of PBT (polybutylene terephthalate). The internal loss is an index indicating vibration absorption, and the larger the internal loss, the higher the vibration absorption.

The LCP member has a specific gravity of 1.93, a tensile strength of 90 MPa, a tensile elongation of 2.7%, a bending strength of 130 MPa, a bending elastic modulus of 10,000 MPa, an Izod impact strength of 39 J / m, and a load deflection concentration. The one having a linear expansion coefficient of 1.7 × 10 ⁻⁵ and a linear expansion coefficient of 4.8 × 10 ⁻⁵ at 200 ° C. and a perpendicular direction can be used.

  The vibration absorbing member 20 has a higher internal loss than the substrate 10. Specifically, as the vibration absorbing member 20, a member whose internal loss exhibits a value of about 0.06 is employed. This internal loss value is larger than the internal loss value (about 0.01 to 0.02) of the substrate 10 described above, and the vibration absorbing member 20 that is an LCP member has a larger value than the substrate 10. It can be said that it has large vibration absorption.

  The vibration absorbing member 20 is manufactured as follows. First, an LCP member as a raw material for the vibration absorbing member 20 is prepared and primary molding is performed. Thereby, what integrated the installation part 21 and the fixing | fixed part 22 is formed. Subsequently, an etching process and a catalyst coating process are performed. Then, the wiring part 23 is formed in what integrated the installation part 21 and the fixing | fixed part 22 by secondary shaping | molding. Then, the plating part 27 is formed by electroless plating or electrolytic plating. Thus, the vibration absorbing member 20 is completed. When the sensor chip 30 is mounted on the installation surface 24 of the installation unit 21, the one shown in FIG. 4 is obtained.

  The plated portion 27 as the wiring is not limited to a plating method, and may be formed by a printing method.

  The sensor device 1 is manufactured as follows. The substrate 10 provided with the through hole 13 is prepared, and the vibration absorbing member 20 on which the sensor chip 30 is mounted as described above is prepared. When the vibration absorbing member 20 shown in FIG. 4 is moved from the other surface 12 side of the substrate 10 to the one surface 11 side and inserted into the through hole 13 as shown in FIG. The contact surface 25 of the 20 fixed portions 22 contacts a wall surface parallel to the vertical surface of the rectangular through-hole 13, and the protruding portion 26 is caught on the other surface 12 of the substrate 10. In this state, the fixing portion 22 is fixed to the substrate 10 with an adhesive or the like, and the plating portion 27 is electrically connected to the circuit of the substrate 10 by soldering or reflow. Thus, the sensor device 1 shown in FIG. 1 is completed.

  The above is the overall configuration of the sensor device 1 according to the present embodiment. The components shown in FIG. 1 are housed in a case (not shown), and the case is fixed to an engine room or the like of the vehicle so that one surface 11 of the substrate 10 is parallel to the vertical direction.

  Next, the relationship between the detection axis of the sensor chip 30 and the substrate 10 will be described with reference to FIG. FIG. 5 is a diagram showing the detection axis of the sensor chip 30. As described above, the sensor chip 30 is formed on the semiconductor substrate 31 which is an SOI substrate, and the semiconductor substrate 31 is mounted on the installation portion 21 of the vibration absorbing member 20. Therefore, the movable direction (in the direction of arrow X in FIG. 2) of the movable electrode 43 of the movable portion 36 serving as the detection axis of the sensor chip 30 is parallel to the installation surface 24 of the installation portion 21.

  Therefore, as shown in FIG. 5A, the detection axis of the sensor chip 30 can be arranged in the x-axis direction, that is, the direction perpendicular to the one surface 11 of the substrate 10. Further, since the detection axis of the sensor chip 30 is arranged in a direction parallel to the installation surface 24, the y-axis direction perpendicular to the x-axis direction in the surface direction of the installation surface 24 is shown in FIG. That is, the detection axis of the sensor chip 30 can be arranged in a direction parallel to the one surface 11 of the substrate 10.

  According to this, since the detection axis can be easily changed from the x-axis direction to the y-axis direction simply by rotating the detection axis of the sensor chip 30 by 90 degrees, it is easy to manufacture a sensor having a detection axis according to needs. can do. On the other hand, since the detection axis of the sensor chip 30 is parallel to the installation surface 24 of the installation unit 21, the detection axis of the sensor chip 30 is not limited to the x-axis direction and the y-axis direction, depending on how the sensor chip 30 is attached. Any direction of 360 degrees in the direction parallel to the installation surface 24 can be set.

  In this embodiment, since the two sensor chips 30 are mounted on the vibration absorbing member 20, the detection axes of each sensor chip 30 may be arranged in the same direction in the x-axis direction or the y-axis direction, One may be arranged in the x-axis direction and the other in the y-axis direction.

  Next, the principle of vibration absorption in the sensor device 1 will be described. When the sensor device 1 is installed in the engine room of a vehicle, it is affected by vibration. The vibration is transmitted to the substrate 10 accommodated in the sensor device 1. As described above, since the vibration absorbing member 20 is fixed to the through hole 13 of the substrate 10 in contact with the substrate 10, the fixing portion 22 receives vibration from the substrate 10.

  However, vibration is transmitted through the vibration absorbing member 20 having an internal loss larger than that of the substrate 10. In this case, the vibration is always transmitted through the installation portion 21 after passing through the fixed portion 22, so that the transmission path until the vibration reaches the sensor chip 30 is lengthened. Therefore, the vibration is absorbed by the fixing portion 22 and the installation portion 21 before reaching the sensor chip 30 and reduced, or disappears before reaching the sensor chip 30, so that the sensor chip 30 is affected by the vibration. There is no such thing. Thus, the vibration effect can be further enhanced by making the vibration transmission path longer. Moreover, vibration absorption is improved because the fixing part 22 and the installation part 21 are formed thick.

  As described above, in the present embodiment, the sensor chip 30 is arranged on the installation surface 24 so that the center of gravity of the sensor chip 30 comes between the one surface 11 and the other surface 12 of the substrate 10. It has become. Thereby, it is possible to prevent the sensor chip 30 from being affected by the inclination of the vibration absorbing member 20 due to gravity. In addition, since the sensor chip 30 is mounted on the vibration absorbing member 20 having an internal loss larger than that of the substrate 10, the sensor chip 30 can be made less susceptible to vibration. As described above, even when the substrate 10 is parallel to the vertical direction inclined with respect to the horizontal direction, the detection accuracy of the sensor chip 30 can be ensured.

(Second Embodiment)
In the present embodiment, only different parts from the first embodiment will be described. The present embodiment is characterized in that the vibration absorbing member 20 is provided on the substrate 10 inclined with respect to a plane parallel to the vertical direction.

  FIG. 6 is a schematic cross-sectional view of the sensor device 1 according to the present embodiment, and is a cross-sectional view corresponding to FIG. As shown in this figure, one surface 11 and the other surface 12 of the substrate 10 are inclined with respect to a surface parallel to the vertical direction.

  In addition, the vibration absorbing member 20 includes an installation portion 21 arranged perpendicular to a plane parallel to the vertical direction between two fixed portions 22 arranged in parallel to the one surface 11 of the substrate 10. It has an integrated substantially N shape. In addition, although the wiring part 23 shown by FIG. 4 is also provided in the vibration absorption member 20, it is abbreviate | omitted in FIG.

  In the present embodiment, one sensor chip 30 is mounted on the installation portion 21 of the vibration absorbing member 20. As in the first embodiment, the sensor chip 30 is installed so that the center of gravity of the sensor chip 30 is located between the one surface 11 and the other surface 12 of the substrate 10 in a direction parallel to the one surface 11 of the substrate 10. 21 on the installation surface 24.

  As described above, even if one surface 11 of the substrate 10 is tilted with respect to a surface parallel to the vertical direction, the sensor chip 30 can be prevented from being affected by gravity, as in the first embodiment. .

  In addition, the fixing | fixed part 22 may be arrange | positioned in parallel with the surface parallel to a perpendicular direction (refer FIG. 5).

(Third embodiment)
In the present embodiment, only different parts from the first embodiment will be described. The present embodiment is characterized in that the installation surface 24 of the installation part 21 of the vibration absorbing member 20 is parallel to a surface parallel to the vertical direction.

  FIG. 7 is a schematic cross-sectional view of the sensor device 1 according to this embodiment, and is a cross-sectional view corresponding to FIG. As shown in this figure, the one surface 11 and the other surface 12 of the substrate 10 are arranged in parallel with a surface parallel to the vertical direction.

  Further, two vibration absorbing members 20 are arranged in parallel to the one surface 11 of the substrate 10, and are fixed to the one surface 11 of the substrate 10 between the fixed portions 22 arranged in parallel to the surface parallel to the vertical direction. The installation portions 21 arranged in parallel with each other form an H shape. That is, the vibration absorbing member 20 in the posture shown in FIG. 5A is rotated 90 degrees in the x-axis direction. Of course, the sensor chip 30 is arranged on the installation surface 24 so that the center of gravity of the sensor chip 30 is located between the one surface 11 and the other surface 12 of the substrate 10.

  As described above, even if the one surface 11 of the substrate 10 and the installation surface 24 of the installation unit 21 are arranged in parallel with the surface parallel to the vertical direction, the sensor chip 30 is affected by gravity as in the first embodiment. You can avoid it.

(Fourth embodiment)
In the present embodiment, only different parts from the second embodiment will be described. FIG. 8 is a schematic cross-sectional view of the sensor device 1 according to this embodiment, and is a cross-sectional view corresponding to FIG. As shown in this figure, the one surface 11 and the other surface 12 of the substrate 10 are inclined with respect to a surface parallel to the vertical direction.

  The installation part 21 of the vibration absorbing member 20 is arranged in parallel with a plane parallel to the vertical direction. Moreover, the fixing | fixed part 22 is arrange | positioned perpendicularly | vertically with respect to the surface parallel to a perpendicular direction. The sensor chip 30 is arranged on the installation surface 24 so that the center of gravity of the sensor chip 30 is located between the one surface 11 and the other surface 12 of the substrate 10.

  As described above, even if the one surface 11 of the substrate 10 is tilted and the installation surface 24 is arranged in parallel to the surface parallel to the vertical direction, the sensor chip 30 is affected by gravity as in the first embodiment. Can not be.

(Fifth embodiment)
In the present embodiment, only portions different from the first to fourth embodiments will be described. In the present embodiment, the vibration absorbing member 20 having a shape different from the H shape or the N shape will be described.

  FIG. 9 is a perspective view of the vibration absorbing member 20 according to the present embodiment. The vibration absorbing member 20 shown in FIG. 9A has a shape in which two installation parts 21 that are perpendicular to the fixing part 22 are arranged in parallel between two fixing parts 22 that are arranged in parallel. I am doing. The sensor chip 30 is mounted on each installation surface 24 of each installation unit 21. That is, by changing the number of the installation parts 21, it can be set as a multistage shelf. When a plurality of sensor chips 30 can be provided, different physical quantities can be detected as in the above embodiments. In addition, since one physical quantity can be detected by a plurality of sensor chips 30 of the same type, detection accuracy can be improved by dividing the detection range.

  On the other hand, as shown in FIG. 9B, by setting the number of the installation parts 21 to three, the two installation parts 21 were arranged perpendicular to the fixing part 22 between the two fixing parts 22 arranged in parallel. It can also be set as the shape where the three installation parts 21 were arranged in parallel. In this case, the sensor chip 30 is arranged only in the installation unit 21 located in the center among the three installation units 21. According to this, it can be set as the shape which covered the sensor chip 30 with the roof of the installation part 21. FIG.

(Sixth embodiment)
In the present embodiment, only portions different from the first to fifth embodiments will be described. This embodiment is characterized in that the vibration absorbing member 20 has a hollow cylindrical shape.

  FIG. 10A is a perspective view of the vibration absorbing member 20 according to this embodiment, and FIG. 10B is a plan view of the substrate 10 as viewed from the one surface 11 side. As shown in FIG. 10A, in the vibration absorbing member 20, the fixed portion 22 has a hollow cylindrical shape, and the installation surface 24 of the installation portion 21 is arranged in parallel to the central axis of the fixed portion 22. The installation part 21 is integrated with the hollow part of the fixed part 22. A sensor chip 30 is mounted on the installation surface 24.

  On the other hand, the substrate 10 is provided with a circular through hole 13. The vibration absorbing member 20 is inserted into the circular through hole 13 and fixed to the substrate 10. Thereby, the cylindrical vibration absorbing member 20 can rotate in the surface direction of the one surface 11 of the substrate 10 around the central axis of the vibration absorbing member 20. Therefore, as shown in FIG. 10B, the detection axis of the sensor chip 30 can be adjusted in a desired direction by rotating the vibration absorbing member 20.

  As described above, by making the vibration absorbing member 20 cylindrical, the detection axis of the sensor chip 30 can be set at a free angle after the vibration absorbing member 20 is assembled to the substrate 10. Also, fine adjustment of the direction of the detection axis can be performed.

(Seventh embodiment)
In the present embodiment, only parts different from the first to sixth embodiments will be described. The present embodiment is characterized in that the vibration absorbing member 20 is wavy.

  FIG. 11 is a schematic cross-sectional view of the sensor device 1 according to this embodiment, and is a cross-sectional view corresponding to FIG. As shown in this figure, the vibration absorbing member 20 has a wave shape in which an installation portion 21 is connected between two plate-like fixing portions 22.

  Specifically, as shown in FIG. 11A, the installation portions 21 are arranged in parallel between the two fixed portions 22, and the vibrations of the waveform are obtained by integrally connecting the two portions. Absorbing member 20 is formed. The fixing unit 22 and the installation unit 21 are arranged perpendicular to the one surface 11 of the substrate 10, and the sensor chip 30 is mounted on the installation surface 24.

  On the other hand, as shown in FIG. 11 (b), between the two fixing parts 22 arranged in parallel, the installation part 21 is arranged perpendicularly to the fixing part 22, and each is integrally connected. As a result, a corrugated vibration absorbing member 20 is formed. The fixing unit 22 is disposed perpendicular to the one surface 11 of the substrate 10, the installation surface 24 of the installation unit 21 is disposed in parallel to the one surface 11 of the substrate 10, and the sensor chip 30 is mounted on the installation surface 24. .

  As described above, the vibration absorbing member 20 having a waveform in which the fixing portion 22 and the installation portion 21 are integrally connected can also be used. In this case, the vibration transmission path from the substrate 10 to the sensor chip 30 can be lengthened, and the vibration isolation effect can be enhanced.

(Eighth embodiment)
In the present embodiment, only parts different from the first to seventh embodiments will be described. The present embodiment is characterized in that a projection is provided on the vibration absorbing member 20.

  FIG. 12A is a perspective view of the vibration absorbing member 20 according to this embodiment, and FIGS. 12B and 12C are schematic cross-sectional views when the vibration absorbing member 20 is attached to the substrate 10. In FIG. 12A, the sensor chip 30 is omitted, and FIGS. 12B and 12C are cross-sectional views corresponding to FIG.

  As shown in FIG. 12A, a projection 28 for positioning the vibration absorbing member 20 with respect to the substrate 10 is provided on the contact surface 25 of the fixed portion 22 of the vibration absorbing member 20. The protrusion 28 serves to fix the position of the vibration absorbing member 20 with respect to the substrate 10 by being brought into contact with the one surface 11 or the other surface 12 of the substrate 10 when the vibration absorbing member 20 is inserted into the through hole 13. Fulfill. The material of the projecting portion 28 is preferably the same as that of the fixed portion 22, but other materials such as metal may be used.

  For example, as shown in FIG. 12B, a protrusion 28 provided on the contact surface 25 of one fixing portion 22 and a protrusion 28 provided on the contact surface 25 of the other fixing portion 22 are It is assumed that they are arranged at symmetrical positions on the contact surface 25 of the fixed portion 22. In this case, when the protrusion 28 is caught on the one surface 11 of the substrate 10, the sensor chip 30 is further parallel to the one surface 11 of the substrate 10 so that the installation surface 24 of the installation portion 21 and the one surface 11 of the substrate 10 are parallel. The vibration absorbing member 20 can be easily positioned so that the center of gravity of the sensor chip 30 comes between the one surface 11 and the other surface 12 in the direction.

  Further, as shown in FIG. 12C, when the position of the protrusion 28 provided on each contact surface 25 of each fixing portion 22 is arranged at an asymmetric position on the contact surface 25, one fixing portion 22. And the other fixing portion 22 have different depths inserted into the through holes 13. For this reason, one surface 11 of the substrate 10 is inclined with respect to the installation surface 24 of the installation unit 21. In this way, when manufacturing a substrate in which the substrate 10 and the installation portion 21 are inclined, the protrusion 28 is provided on the contact surface 25 of the fixing portion 22 so that the vibration absorbing member 20 can be positioned with respect to the substrate 10. It can be done easily.

  As described above, by providing the protrusions 28 on the fixing portion 22, vibrations can be made without adjusting the positional relationship between the sensor chip 30 and the substrate 10 and the angle relationship between the substrate 10 and the installation portion 21. The position of the vibration absorbing member 20 with respect to the substrate 10 can be fixed at an appropriate place simply by inserting the absorbing member 20 into the through hole 13.

(Ninth embodiment)
In the present embodiment, only parts different from the eighth embodiment will be described. FIG. 13 is an exploded perspective view of the vibration absorbing member 20 according to the present embodiment. As shown in this figure, the contact surface 25 of the fixing portion 22 is provided with a groove portion 29 extending in the direction in which the vibration absorbing member 20 is inserted into the through hole 13. And the position of the projection part 28 is adjusted by moving the groove part 29 shown by FIG. The protruding portion 28 whose position has been adjusted is fixed to the fixing portion 22 with an adhesive or the like.

  Thus, since the projection 28 can be moved, the position of the projection 28 can be finely adjusted. Moreover, since the position of the protrusion 28 can be freely determined by the groove 29, the versatility of the vibration absorbing member 20 can be improved.

(10th Embodiment)
In the present embodiment, only portions different from the first to ninth embodiments will be described. FIG. 14A is a perspective view of the vibration absorbing member 20 according to this embodiment, and FIGS. 14B and 14C are schematic cross-sectional views when the vibration absorbing member 20 is attached to the substrate 10. In FIG. 14A, the sensor chip 30 is omitted, and FIGS. 14B and 14C are cross-sectional views corresponding to FIG.

  As shown in FIG. 14A, in the vibration absorbing member 20, the fixed portion 22 is provided with a plate-shaped member and an arc-shaped member. Then, between the plate-like fixing portion 22 and the arc-like fixing portion 22, the installation portion 21 perpendicular to the plate-like fixing portion 22 is arranged and integrated, so that the vibration absorbing member 20 is integrated. Is configured. According to this, the vibration-absorbing member 20 has a shape like an anchor. Further, a protrusion 28 for positioning is provided on the contact surface 25 of the fixed portion 22.

  Then, as shown in FIG. 14B, when the vibration absorbing member 20 is moved from the one surface 11 side of the substrate 10 to the other surface 12 side and inserted into the through hole 13, the protrusion 28 is formed on the one surface 11 of the substrate 10. Get caught. Accordingly, the vibration absorbing member 20 is arranged on the substrate 10 so as to be parallel to the installation surface 24 of the installation unit 21 and the one surface 11 of the substrate 10. Of course, the sensor chip 30 is arranged such that the center of gravity of the sensor chip 30 comes between the one surface 11 and the other surface 12 of the substrate 10 in a direction parallel to the one surface 11 of the substrate 10.

  Further, when the vibration absorbing member 20 is pushed into the other surface 12 side of the substrate 10, the position of the plate-like fixing portion 22 is fixed by the protrusion 28, but the arc-like fixing portion 22 is free with respect to the substrate 10. Therefore, it can move to the other surface 12 side. That is, as shown in FIG. 14C, the vibration absorbing member 20 is slid along the wall surface of the through-hole 13 around the arc-shaped fixing portion 22 around the contact portion between the substrate 10 and the plate-like fixing portion 22. The installation surface 24 of the installation unit 21 can be tilted with respect to the one surface 11 of the substrate 10. Thereby, the fine adjustment of the angle of the detection axis of the sensor chip 30 can be easily performed.

  In FIG. 14, the contact surface 25 of the fixing portion 22 is provided with the protrusion 28. However, the protrusion 28 is not essential and may not be provided.

(Eleventh embodiment)
In the present embodiment, only portions different from the first to tenth embodiments will be described. FIG. 15 is a schematic cross-sectional view of the sensor device 1 according to this embodiment, and is a cross-sectional view corresponding to FIG. Note that the vibration absorbing member 20 shown in FIG. 1 is used.

  As shown in FIG. 15, the plurality of sensor chips 30 are arranged on the installation portion 21 of the vibration absorbing member 20 so as not to overlap the substrate 10 in a direction parallel to the one surface 11 of the substrate 10. However, each sensor chip 30 is placed on the installation portion 21 of the vibration absorbing member 20 so that the center of gravity of the plurality of sensor chips 30 is located between the one surface 11 and the other surface 12 of the substrate 10 in a direction parallel to the one surface 11 of the substrate 10. Has been placed.

  According to this, each sensor chip 30 is arranged at a position away from the substrate 10. For this reason, each sensor chip 30 may be affected by gravity. However, since the sensor chips 30 are arranged symmetrically around the substrate 10, the effect that each sensor chip 30 is separated from the substrate 10 can be offset from the output of each sensor chip 30. As described above, a plurality of sensor chips 30 may be arranged at positions away from the substrate 10.

(Other embodiments)
The configuration of the vibration absorbing member 20 shown in FIG. 4 is an example, and is not limited to this configuration, but may be another configuration. For example, the wiring part 23 may not be provided in the vibration absorbing member 20, and the vibration absorbing member 20 may be configured by the installation part 21 and the fixing part 22. In this case, it is only necessary that the wiring is formed on the installation portion 21 and the fixing portion 22 by plating and printing so that the sensor chip 30 and the circuit of the substrate 10 are electrically connected.

  The shape of the through hole 13 is not limited to a square shape or a circular shape, but may be a triangular shape, a hexagonal shape, or the like. In this case, the vibration absorbing member 20 only needs to be provided with a fixing portion 22 so that the vibration absorbing member 20 is inserted into the through hole 13 and fixed. Further, the position of the through-hole 13 in the substrate 10 may be provided in another place instead of the central portion of the one surface 11 of the substrate 10.

  In the first embodiment, two sensor chips 30 are mounted on the vibration absorbing member 20, but the number of sensor chips 30 may be one or three or more. In this case, each sensor chip 30 is vibrated so that the center of gravity of each of the plurality of sensor chips 30 and the plurality of sensor chips 30 is between the one surface 11 and the other surface 12 of the substrate 10 in a direction parallel to the one surface 11 of the substrate 10. It is good to arrange in the installation part 21 of the absorbing member 20. The same applies to the other embodiments.

  In the first embodiment, the detection axis of the sensor chip 30 is oriented in the horizontal direction. However, the sensor chip 30 has the detection axis in the Z direction perpendicular to the arrow X direction shown in FIG. You may adopt what you have. Accordingly, the detection axis can be arranged in a direction perpendicular to the x-axis direction and the y-axis direction.

  In FIG. 2, the structure of the acceleration sensor is shown. However, this structure shows an example and may be another structure. For example, although FIG. 2 shows one movable part (element), a structure in which two movable parts are provided may be employed. In addition, by providing a plurality of movable parts in one sensor chip 30, it is also possible to employ one sensor chip 30 provided with a plurality of detection axes.

  In each of the above embodiments, the use of the LCP member as the vibration absorbing member 20 has been described. However, the vibration absorbing member 20 may be formed of rubber. For example, the internal loss of rubber is about 0.2, and the vibration absorption is a very high value.

  In each of the above embodiments, the vibration absorbing member 20 having a larger internal loss than the substrate 10 is used, but a member having a lower tensile elastic modulus than the substrate 10 may be used. When a printed circuit board is used as the substrate 10, the tensile elastic modulus is about 5 to 10 GPa although it depends on the material. On the other hand, when an LCP member is used as the vibration absorbing member 20, the tensile elastic modulus depends on the material. About 9-30 MPa. Further, although the rubber has a tensile modulus of elasticity of about 1 MPa, depending on the material, it has a very low elasticity. As described above, the vibration absorbing effect can be enhanced by using the vibration absorbing member 10 having a low elastic modulus with good vibration damping characteristics. The above LCP member has a higher tensile elastic modulus than PBT or the like, but is a preferable material as a vibration absorbing member because of its high internal loss.

  In the first to tenth embodiments described above, “the sensor chip 30 is arranged on the installation surface 24 so that the center of gravity of the sensor chip 30 is located between the one surface 11 and the other surface 12 of the substrate 10”. However, this includes that “the sensor chip 30 is arranged on the installation surface 24 so as to overlap the substrate 10 in a direction parallel to the one surface 11 of the substrate 10”. Similarly, in the eleventh embodiment, “each sensor chip 30 vibrates so that the center of gravity of the plurality of sensor chips 30 is located between the one surface 11 and the other surface 12 of the substrate 10 in a direction parallel to the one surface 11 of the substrate 10. Although it is described that “arranged in the installation portion 21 of the absorbing member 20”, this means that “the center of gravity of the plurality of sensor chips 30 overlaps the substrate 10 in a direction parallel to the one surface 11 of the substrate 10. Each sensor chip 30 is disposed on the installation portion 21 of the vibration absorbing member 20 ”.

(A) is a disassembled perspective view of the sensor apparatus which concerns on 1st Embodiment of this invention, (b) is AA sectional drawing of (a). It is a schematic plan view of an acceleration sensor. It is BB sectional drawing of FIG. FIG. 2 is a perspective view of a vibration absorbing member shown in FIG. 1. (A) is the figure which showed a mode that the detection axis of the sensor chip was facing the direction perpendicular | vertical to the one surface of a board | substrate, (b) is the direction parallel to the one surface of a board | substrate in (b). It is a figure. It is a schematic sectional drawing of the sensor apparatus which concerns on 2nd Embodiment of this invention. It is a schematic sectional drawing of the sensor apparatus which concerns on 3rd Embodiment of this invention. It is a schematic sectional drawing of the sensor apparatus which concerns on 4th Embodiment of this invention. It is a perspective view of the vibration absorption member which concerns on 5th Embodiment of this invention. It is the figure which showed the vibrational absorption member which concerns on 6th Embodiment of this invention. It is a schematic sectional drawing of the sensor apparatus which concerns on 7th Embodiment of this invention. It is the figure which showed the vibrational absorption member which concerns on 8th Embodiment of this invention. It is a disassembled perspective view of the vibration absorption member which concerns on 9th Embodiment of this invention. It is the figure which showed the vibrational absorption member which concerns on 10th Embodiment of this invention. It is a schematic sectional drawing of the sensor apparatus which concerns on 11th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate 11 One surface 12 Other surface 13 Through-hole 20 Vibration absorption member 21 Installation part 22 Fixing part 24 Installation surface 25 Contact surface 28 Projection part 29 Groove part 30 Sensor chip

Claims (13)

A substrate (10) having one surface (11) and another surface (12) opposite to the one surface (11), and having a through hole (13) penetrating the one surface (11) and the other surface (12). )When,
An installation part (21) having an installation surface (24) arranged perpendicular to one surface (11) of the substrate (10), and the through hole (13) integrated with the installation part (21) A vibration absorbing member (20) having a fixed portion (22) fixed to the through hole (13) by contacting the wall surface of the substrate and having a larger internal loss than the substrate (10);
Arranged on the installation surface (24) so that the center of gravity is located between one surface (11) and the other surface (12) of the substrate (10), detects the physical quantity and generates an electrical signal corresponding to the physical quantity A sensor device comprising a sensor chip (30). A substrate (10) having one surface (11) and another surface (12) opposite to the one surface (11), and having a through hole (13) penetrating the one surface (11) and the other surface (12). )When,
An installation portion (21) having an installation surface (24) inclined with respect to one surface (11) of the substrate (10), and a wall surface of the through hole (13) integrated with the installation portion (21) A vibration absorbing member (20) having a fixed portion (22) fixed to the through-hole (13) by contacting the substrate and having a larger internal loss than the substrate (10),
Arranged on the installation surface (24) so that the center of gravity is located between the one surface (11) and the other surface (12) of the substrate (10) in a direction parallel to the one surface (11) of the substrate (10). A sensor device comprising a sensor chip (30) that detects a physical quantity and generates an electrical signal corresponding to the physical quantity. A substrate (10) having one surface (11) and another surface (12) opposite to the one surface (11), and having a through hole (13) penetrating the one surface (11) and the other surface (12). )When,
An installation part (21) having an installation surface (24) arranged in parallel to one surface (11) of the substrate (10), and the through hole (13) integrated with the installation part (21) A vibration absorbing member (20) having a fixed portion (22) fixed to the through hole (13) by contacting the wall surface of the substrate and having a larger internal loss than the substrate (10);
Arranged on the installation surface (24) so that the center of gravity is located between the one surface (11) and the other surface (12) of the substrate (10) in a direction parallel to the one surface (11) of the substrate (10). A sensor device comprising a sensor chip (30) that detects a physical quantity and generates an electrical signal corresponding to the physical quantity. A substrate (10) having one surface (11) and another surface (12) opposite to the one surface (11), and having a through hole (13) penetrating the one surface (11) and the other surface (12). )When,
An installation part (21) having an installation surface (24) arranged perpendicular to one surface (11) of the substrate (10), and the through-hole (13) integrated with the installation part (21) A vibration absorbing member (20) having a fixed portion (22) fixed to the through hole (13) by contacting the wall surface of the substrate and having a larger internal loss than the substrate (10);
A plurality of sensor chips (30) disposed on the installation surface (24) for detecting a physical quantity and generating an electrical signal corresponding to the physical quantity;
The plurality of sensor chips (30) are arranged on the installation surface (24) so that the centers of gravity of the plurality of sensor chips (30) are between one surface (11) and the other surface (12) of the substrate (10). It is arrange | positioned in the sensor apparatus characterized by the above-mentioned. The installation part (21) and the fixing part (22) each have a plate shape,
The vibration absorbing member (20) has an H shape in which the installation part (21) perpendicular to the fixing part (22) is disposed between the two fixing parts (22) arranged in parallel. The sensor device according to any one of claims 1 to 4, wherein the sensor device is configured as follows. The installation part (21) and the fixing part (22) each have a plate shape,
The vibration absorbing member (20) is disposed between the fixed portion (22) and two fixed portions (22) arranged in parallel and perpendicular to the one surface (11) of the substrate (10). The sensor device according to claim 2, wherein the installation portion (21) arranged in an inclined manner is an integrated N shape. A plurality of the sensor chips (30) are provided,
The installation part (21) and the fixing part (22) each have a plate shape,
In the vibration absorbing member (20), two installation parts (21) perpendicular to the fixing part (22) are arranged in parallel between the two fixing parts (22) arranged in parallel. It has a side-by-side shape,
The sensor device according to any one of claims 1 to 4, wherein the plurality of sensor chips (30) are arranged in each of the two installation portions (21). The installation portion (21) has a plate shape, and the fixing portion (22) has a hollow cylindrical shape,
In the vibration absorbing member (20), the installation surface (24) of the installation part (21) is arranged in parallel to the central axis of the fixing part (22), and the installation part (21) is arranged in the fixing part (22). The sensor device according to any one of claims 1 to 4, wherein the sensor device has a shape integrated with the hollow portion. The fixing portion (22) has a plate-like shape and an arc-shaped shape, respectively, and the installation portion (21) has a plate shape,
The vibration absorbing member (20) is perpendicular to the plate-shaped fixing portion (22) between the plate-shaped fixing portion (22) and the arc-shaped fixing portion (22). 5. The sensor device according to claim 1, wherein the sensor unit has a shape in which the installation part is arranged. The installation part (21) and the fixing part (22) each have a plate shape,
The vibration absorbing member (20) has a wave shape in which the installation portion (21) is connected between the two plate-like fixing portions (22). The sensor apparatus as described in any one.   The contact surface (25) that contacts the wall surface of the through hole (13) in the fixed portion (22) is in contact with one surface (11) or the other surface (12) of the substrate (10). The sensor device according to any one of claims 5 to 10, further comprising a protrusion (28) for positioning the vibration absorbing member (20) with respect to (10). The contact surface (25) is provided with a groove (29) extending in a direction parallel to the direction in which the vibration absorbing member (20) is inserted into the through hole (13).
The sensor device according to claim 11, wherein the position of the protrusion (28) on the contact surface (25) is adjusted by moving the groove (29).   The sensor device according to any one of claims 1 to 12, wherein the vibration absorbing member (20) is formed of a liquid crystal polymer.

Images