JP2009281721A - Phase conversion cooler and mobile device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small and lightweight phase conversion cooler of high cooling efficiency and a mobile device. <P>SOLUTION: The phase conversion cooler comprises a cooling head 2 having a first face 2a abutting on a cooled object; a first supply/discharge port 3 provided in a second face 2b; a second supply/discharge port 4 provided in a third face 2c; first piping 5 connected to the first supply/discharge port 3; a radiating part 6 placed in a radiating environment; and second piping 7 connected to the second supply/discharge port 4. The cooling head 2 is formed by resin molding, and the first face 2a of the cooling head 2 is provided with a metal plate 9. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a phase change cooler and a portable device that are small and light and have high cooling efficiency.

  Among the components provided in the computer, components that generate a large amount of heat are subjected to a compulsory heat dissipation measure without depending on natural heat dissipation. For example, an LSI (Large Scale Integrated Circuit) such as a CPU (Central Processing Unit) generates more heat as the degree of integration increases and the processing speed increases.

  A phase conversion cooler is known as a cooler applied to such electronic components.

  As shown in FIG. 7, the conventional phase change cooler 101 includes a cooling head 102 having a first surface (front side on the back side in the drawing) in contact with an object to be cooled, and a first surface of the cooling head 102. The first supply / exhaust port 103 provided on the second surface 102b that does not oppose, and the second supply / exhaust port provided on the third surface 102c that does not oppose the first surface or the second surface 102b of the cooling head 102 104, a first pipe 105 connected to the first supply / exhaust port 103, a heat radiating unit 106 connected to the first pipe 105 and placed in a heat dissipation environment, and a heat radiating unit 106 connected to the second supply / exhaust port 104. 2nd piping 107 is provided.

  The cooling head 102 is a metal container with a high thermal conductivity formed in a substantially rectangular parallelepiped shape. The first surface of the cooling head 102 (the front side on the back side in the drawing) is in contact with the heat radiation surface of the LSI that is the object to be cooled.

  The first pipe 105 connected to the first supply / discharge port 103 extends sufficiently long in a direction perpendicular to the second surface 102 b of the cooling head 102 and is connected to the heat radiating unit 106. In the state shown in the figure, the second surface 102b of the cooling head 102 is located above the cooling head 102, so that the first pipe 105 extends upward.

  The heat dissipating part 106 has a large surface area by, for example, turning back a plurality of metal tubes having high thermal conductivity. The heat dissipating unit 106 is placed in a heat dissipating environment sufficiently away from the object to be cooled. The heat dissipation environment is an environment suitable for heat dissipation, and refers to an environment that is easy to touch the atmosphere, an environment that is in contact with a member with good thermal conductivity that is in contact with the atmosphere, an environment that does not have a heat source or a heat-sensitive member around it, etc. .

  The second pipe 107 connected to the second supply / exhaust port 104 extends relatively short in a direction perpendicular to the third surface 102 c of the cooling head 102, is bent in the direction of the heat radiating portion 106, and is connected to the first pipe 105. Is extended to be parallel to the heat radiating portion 106. In the state shown in the drawing, the third surface 102c of the cooling head 102 is located on the lateral side of the cooling head 102, so the second pipe 107 extends laterally and then upwards.

  The 1st piping 105, the thermal radiation part 106, and the 2nd piping 107 can be formed with one continuous pipe | tube.

  The phase conversion cooler 101 contains a refrigerant in an internal space that returns from the cooling head 102 to the cooling head 102 via the first pipe 105, the heat radiating unit 106, and the second pipe 107.

  In this phase conversion cooler 101, heat from the object to be cooled is conducted to the cooling head 102, and the refrigerant in the cooling head 102 is vaporized (boiling) by that heat to become a gas phase. The refrigerant that has become a gas phase rises in the cooling head 102, flows into the first pipe 105 through the first supply / discharge port 103, and is guided to the heat radiating unit 106. The gas-phase refrigerant is deprived of heat by the heat dissipating unit 106 and is liquefied (condensed) to become a liquid phase. The refrigerant in the liquid phase descends from the heat radiating section 106 through the second pipe 107 and flows into the cooling head 102 via the second supply / exhaust port 104. In this way, in the conventional phase change cooler 101, the refrigerant takes the heat of the object to be cooled by the heat of vaporization, releases the heat to the outside of the system (such as the atmosphere) by the heat radiating unit 106, becomes a liquid phase, and becomes a cooling head The refrigerant circulation of returning to 102 is repeated. Thereby, a cooling target object is forcedly cooled continuously.

  This phase conversion cooler 101 is smaller and simpler than a cooling fan that cools an object to be cooled by air, and does not require a pump mechanism that circulates the coolant by mechanical force.

  The ratio of the liquid phase in the entire phase conversion cooler (the internal space returning from the cooling head 102 to the cooling head 102 via the first pipe 105, the heat radiating portion 106, and the second pipe 107) is 20 to 20% of the total refrigerant amount. 30%. Also in the cooling head 102, the refrigerant exists in an appropriate ratio between the gas phase and the liquid phase.

  The liquid refrigerant accumulates under the cooling head 102, and the liquid level s exceeds the second supply / discharge port 104. The gas-phase refrigerant occupies a space above the liquid level s. The first supply / discharge port 103 is above the space. Therefore, the gas-phase refrigerant whose volume is increased by vaporization easily flows into the first pipe 105 and flows only into the first pipe 105. In addition, the refrigerant that has become a liquid phase in the heat radiating unit 106 flows into the second pipe 107 according to gravity and returns to the cooling head 102. This facilitates and smoothes the circulation of the refrigerant in which the gas-phase refrigerant rises from the cooling head 102 and flows into the heat radiating unit 106, and the liquid-phase refrigerant descends from the heat radiating unit 106 and flows into the cooling head 102. .

JP 2004-85186 A JP-A-7-142886 JP 2006-125718 A

  Incidentally, the conventional phase change cooler 101 is mounted on a desktop personal computer or the like. However, if this phase change cooler 101 is to be mounted on a mobile device (mobile device) such as a mobile phone or a notebook computer, a problem arises.

  Mobile devices have a smaller housing and smaller internal space than stationary devices such as desktop computers, so the phase-conversion cooler installed in mobile devices needs to be smaller and thinner than before. Because it becomes.

  In the conventional phase change cooler 101, the cooling head 102 is entirely made of metal for the purpose of improving the efficiency of heat exchange with the object to be cooled. At the same time, since the cooling head 102 is also a container for storing a refrigerant, it needs to have a hollow structure and a sealed structure. Specifically, the cooling head 102 is formed as a so-called sheet metal by three-dimensionally combining metal plate materials and closing the joint by welding.

  In order to join with good hermeticity by welding, the metal plate material must have a predetermined thickness or more. This is because, if a thin metal plate is to be welded, the shape is distorted or a hole is formed. For this reason, the conventional phase change cooler has a thick metal plate for the cooling head. Specifically, the thickness is about 1 mm. In general, the thickness of a copper plate of 0.5 mm or more is the limit that can withstand welding. For this reason, the external dimension of the cooling head 102 becomes large. In order to reduce the size of the cooling head 102 while securing a space for accommodating the refrigerant, it is an obstacle that the thickness of the metal plate cannot be reduced.

  Further, when the metal plate materials are combined three-dimensionally, many seams are generated. As shown in FIG. 7, in order to make the cooling head 102 into a substantially rectangular parallelepiped shape, six metal plate materials are combined and 12 ridge lines are closed by welding. Further, the supply / discharge ports 103 and 104 are holes formed in a metal plate material. Since the metal pipe used as the 1st piping 105 and the 2nd piping 107 is connected to the supply / discharge port 103,104, this also becomes a welding location. Thus, when the cooling head 102 is formed of a metal plate material, there are many welding locations, and the processing cost is increased.

  Furthermore, the conventional phase change cooler 101 is heavy because the metal plate is thick as described above, and there are many welds. Heavy weight is a disadvantage for mobile devices where light weight is an important factor in commercial value.

  If the cooling head 102 is entirely made of metal, the heat conducted from the object to be cooled to the first surface of the cooling head 102 diffuses to the other surface of the cooling head 102 by heat conduction. Such diffusion of heat contributes to cooling of the object to be cooled, but is not preferable from the viewpoint of phase conversion cooling. This is because the amount of heat transferred from the object to be cooled to the refrigerant is reduced, the amount of refrigerant to be vaporized is reduced, and the efficiency of phase conversion cooling is reduced. Then, heat diffused throughout the cooling head 102 due to heat conduction is conducted to the surrounding atmosphere, so that hot air is trapped around the object to be cooled.

  The cooling head 102 can also be made of a casting. However, since the metal has a high viscosity even in a molten state, even if the cooling head 102 is made of a casting, the thickness of the metal material of the cooling head 102 cannot be reduced. Therefore, the above-mentioned problems such as wall thickness, weight, and heat conduction cannot be solved by casting.

  Then, the objective of this invention is providing the phase change cooler which solves the said subject, is small and lightweight, and has high cooling efficiency.

  In order to achieve the above object, the present invention provides a cooling head having a first surface in contact with an object to be cooled, and a first surface provided on a second surface that does not face the first surface of the cooling head. A first supply / exhaust port, a second supply / exhaust port provided on a third surface of the cooling head that does not oppose the first surface and the second surface, and a first connected to the first supply / exhaust port A pipe, a heat radiating part connected to the first pipe and placed in a heat radiating environment, and a second pipe connected to the heat radiating part and connected to the second supply / exhaust port, and the cooling head is formed by resin molding, A metal plate is provided on the first surface of the cooling head.

  You may have a metal plate in the several surface of the said cooling head.

  The metal plates on the plurality of surfaces of the cooling head may be in contact with each other.

  Of the metal plates on the plurality of surfaces of the cooling head, the metal plate provided other than the first surface may be provided on the inner surface of the cooling head.

  An opening may be formed in the resin on the first surface of the cooling head, and a metal plate may be provided to cover the opening.

  A protrusion may be formed on the metal plate.

  The metal plate may be provided on the cooling head by insert molding.

  The second pipe may have an inclined portion inclined toward the first pipe side.

  Further, in the posture in which the first surface of the cooling head is located below the cooling head, the vertical heights of the first supply / discharge port and the second supply / discharge port may be different.

  The portable device of the present invention is equipped with the phase change cooler.

  The present invention exhibits the following excellent effects.

  (1) Compact and lightweight with high cooling efficiency.

It is a figure of the cooling head of the phase change cooler which shows one embodiment of the present invention, (a) is a perspective perspective view which looked at the 2nd, 3rd, and 6th surface, and (b) is the 1st, 4th. The perspective view which looked at the 5th surface, (c) is sectional drawing which made the 1st surface down. It is a figure explaining insert molding, (a) is an assembly perspective view of a metal plate, (b) is a perspective perspective view of the cooling head after resin injection molding. (A) is an erect posture, (b) is a right tilt posture, and (c) is a front view of the phase conversion cooler of FIG. 1 in a left tilt posture. It is a figure which shows the piping connection of the phase change cooler of FIG. It is a perspective view in the horizontal attitude | position of the phase change cooler which shows one Embodiment of this invention. (A) is a perspective view of a mobile phone equipped with the phase change cooler of the present invention, and (b) is a side sectional view of the mobile phone. It is a front view in the erect posture of the conventional phase change cooler.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIGS. 3A to 3C, the phase change cooler 1 according to the present invention has a first surface 2a (see FIGS. 1 and 5) in contact with an object to be cooled. The head 2 and the first supply / exhaust port 3 provided on the second surface 2b that does not face the first surface 2a of the cooling head 2, and both the first surface 2a and the second surface 2b of the cooling head 2 A second supply / exhaust port 4 provided on the non-opposing third surface 2c, a first pipe 5 connected to the first supply / exhaust port 3, and a heat dissipating part 6 connected to the first pipe 5 and placed in a heat dissipating environment; And a second pipe 7 connected to the heat radiating section 6 and connected to the second supply / exhaust port 4.

  The phase conversion cooler 1 contains refrigerant so that the liquid phase occupies, for example, 20% or more in the internal space returning from the cooling head 2 to the cooling head 2 via the first pipe 5, the heat radiating unit 6, and the second pipe 7. Is done. In the phase conversion cooler 1, the coolant level s is positioned above the third surface 2c in a posture in which the third surface 2c of the cooling head 2 is positioned below the cooling head 2 (see FIG. 3). Specifically, the second pipe 7 is formed with an inclined portion 8 that is inclined with respect to the first pipe 5, whereby the liquid level s of the refrigerant is held above the third surface 2 c.

  As shown in detail in FIG. 1A to FIG. 1C, in the present invention, the cooling head 2 is a container in which the outer shape is a substantially rectangular parallelepiped shape and a substantially rectangular parallelepiped space is formed inside by resin molding. . The cooling head 2 is made of engineering plastic.

  The first surface 2a of the cooling head 2 is a heat receiving surface in contact with the heat radiating surface of the object to be cooled (for example, LSI). In the present invention, the metal plate 9 is provided on the first surface 2 a which is at least the heat receiving surface of the cooling head 2. In this embodiment, the cooling head 2 includes, in addition to the first surface 2a, the second surface 2b, the third surface 2c, the fourth surface 2d facing the second surface 2b, and the third surface 2c. The metal plate 9 is provided on the fifth surface 2e facing the surface. Holes facing the first supply / exhaust port 3 and the second supply / exhaust port 4 are formed in the metal plate 9 provided on the second surface 2b and the third surface 2c.

  The metal plate 9 is a copper plate having a thickness of 0.1 mm. Although the metal plates 9 on each surface are provided so as to be in contact with each other, it is not necessary to weld the metal plates 9 together. When the cooling head 2 is formed, the metal plate 9 is provided on the cooling head 2 by insert molding.

  The metal plate 9 is formed by a method of processing a sheet metal part by progressive press processing that sequentially presses and processes each shape. The cooling head 2 is formed by resin injection molding (insert molding) in which the metal plate 9 thus processed is set in a mold and a liquid resin is injected into the mold by applying pressure. Here, as shown in FIG. 2, the metal plate 9 is provided with a protrusion 9a. By providing the protrusion 9a on the metal plate 9, the integrity with the resin can be enhanced, and the metal plate 9 can be prevented from falling off the resin.

  The metal plate 9 can be provided on the inner surface or the outer surface of the cooling head 2. As shown in FIG. 1C, in the present embodiment, the metal plate 9 is provided on the inner surface of the cooling head 2. However, an opening is formed in the resin of the first surface 2a of the cooling head 2, and the metal plate 9 is provided on the inner surface of the cooling head 2 so as to cover the opening. For this reason, the metal plate 9 can contact the heat radiating surface of the object to be cooled. The metal plate 9 on the first surface 2 a can also be provided on the outer surface of the cooling head 2 so as to cover the resin opening of the cooling head 2.

  The first supply / discharge port 3 is formed of resin by integral molding with the cooling head 2. The first supply / exhaust port 3 is a hollow cylindrical projection that allows the inside and outside of the cooling head 2 to communicate with each other, and is formed with a size that fits into the first pipe 5.

  As shown in FIG. 3 (a), the first pipe 5 connected to the first supply / exhaust port 3 is extended sufficiently long in a direction perpendicular to the second surface 2 b of the cooling head 2, and the heat radiating section 6. It leads to. In the illustrated state, the second surface 2b of the cooling head 2 is positioned above the cooling head 2, so that the first pipe 5 extends upward.

  The heat dissipating part 6 has a large surface area by, for example, turning back a plurality of metal tubes having high thermal conductivity. The heat dissipating unit 6 is placed in a heat dissipating environment sufficiently away from the object to be cooled. The heat dissipation environment is an environment suitable for heat dissipation. Insert an environment that is easy to touch the atmosphere, an environment that touches a member with good thermal conductivity that touches the atmosphere, or an environment that does not have a heat source or heat-sensitive member around it. .

  The second supply / discharge port 4 is formed of resin by integral molding with the cooling head 2. The second supply / exhaust port 4 is a hollow cylindrical projection that allows the inside and outside of the cooling head 2 to communicate with each other, and is formed to have a size that fits into the second pipe 7.

  As shown in FIG. 4, the second supply / exhaust port 4 can also be connected to the second pipe 7 via a joint 10. Moreover, although not shown in figure, the 1st supply / exhaust port 3 can also be similarly connected to the 1st piping 5 via the joint 10. FIG.

  As shown in FIG. 3A, the second pipe 7 is extended in a direction perpendicular to the third surface 2c of the cooling head 2 shorter than the conventional one, bent in the direction of the heat radiating portion 6, and the cooling head. The second long surface 2 b is inclined and extended in a direction approaching the first pipe 5 from the vicinity of the second surface 2 b, and is connected to the heat radiating unit 6. In the state shown in the figure, the third surface 2c of the cooling head 2 is located on the side of the cooling head 2, so that the second pipe 7 extends slightly laterally and slightly upwards, and then occupies most of the inclination. The part 8 extends diagonally.

  In the conventional phase conversion cooler 101, welding is required to connect the metal pipes serving as the first pipe 105 and the second pipe 107 to the supply / discharge ports 103 and 104. However, in order to weld, the 1st piping 105 and the 2nd piping 107 needed sufficient length from the 2nd surface 2b and the 3rd surface 2c. On the other hand, in the present invention, since the cooling head 2 is formed by resin molding, the first supply / discharge port 3 and the second supply / discharge port 4 can be formed in a shape protruding from the cooling head 2. Since the second supply / exhaust port 4 is formed in a size that fits into the second pipe 7 (or the joint 10), the length of the second pipe 7 extending in the direction perpendicular to the third surface 2c is: It only needs to be fitted to the second supply / discharge port 4. For this reason, the length of the second pipe 7 extending in the direction perpendicular to the third surface 2 c can be made shorter than that of the conventional second pipe 7. Therefore, in the present invention, further miniaturization of the phase conversion cooler 1 is realized.

  The cooling operation of the phase change cooler of the present invention will be described with reference to FIG.

  FIG. 3A shows a state where the phase change cooler 1 of the present invention is mounted on a mobile phone and the mobile phone is in an upright posture. Here, the upright posture means the posture of the mobile phone when the user of the mobile phone is standing and talking. The phase conversion cooler 1 is in a posture in which the second surface 2 b of the cooling head 2 is positioned above the cooling head 2. At this time, the coolant level s is located above the second supply / discharge port 4.

  In this phase conversion cooler 1, heat from the object to be cooled is conducted to the cooling head 2, and the refrigerant in the cooling head is vaporized (boils) by that heat to become a gas phase. The refrigerant that has become a gas phase rises in the cooling head 2, flows into the first pipe 5 through the first supply / discharge port 3, and is guided to the heat radiating unit 6. The gas-phase refrigerant is deprived of heat by the heat dissipating unit 6 and is liquefied (condensed) to become a liquid phase. The refrigerant in the liquid phase descends from the heat radiating section 6 through the second pipe 7 and flows into the cooling head 2 through the second supply / exhaust port 4. In this way, in the phase conversion cooler 1 of the present invention, the refrigerant takes the heat of the object to be cooled by the heat of vaporization, releases the heat to the outside of the system (such as the atmosphere) at the heat radiating portion, and becomes a liquid phase to form a cooling head The refrigerant circulation of returning to 2 is repeated. Thereby, a cooling target object is forcedly cooled continuously.

  When the user sleeps on his back and puts the mobile phone on the right ear, the mobile phone is tilted to the right. When the mobile phone is tilted to the right, the phase conversion cooler 1 is configured such that the first pipe 5 faces sideways at a relatively lower position of the cooling head 2 and the second pipe 7 cools, as shown in FIG. It faces upward from the upper surface of the head 2. The second supply / discharge port 4 is positioned above the liquid level s, and the first supply / discharge port 3 is positioned below the liquid level s. At this time, the circulation path of the refrigerant is in the reverse direction of FIG. 3A, but the refrigerant circulation is smoothly repeated.

  Thus, in the posture in which the third surface 2 c of the cooling head 2 is positioned above the cooling head 2, the coolant level s is positioned above the first supply / discharge port 3. Since the liquid-phase refrigerant is present in the cooling head 2, the object to be cooled can be subjected to phase conversion cooling via the heat receiving surface.

  When the user sleeps on his back and puts the mobile phone on the left ear, the mobile phone is tilted to the left. When the mobile phone is tilted to the left, as shown in FIG. 3 (c), the phase conversion cooler 1 has the first pipe 5 facing sideways at a relatively upper position of the cooling head 2, and the second pipe 7 being the cooling head. 2 downward from the lower surface. The second pipe 7 extends a little downward and then bends sideways. After extending a little laterally, the second pipe 7 is inclined obliquely upward and reaches the heat radiating section 6. By providing the inclined portion 8, the length of the second pipe 7 is shortened, and the length of the second pipe 7 positioned below the third surface 2 c of the cooling head 2 is shortened. As a result, the length of the second pipe 7 filled with the refrigerant becomes shorter than that of the prior art of FIG. 7, so that the liquid level s is positioned above the third surface 2 c of the cooling head 2. Become.

  Thus, in the phase conversion cooler 1 of the present invention, in the posture in which the third surface 2c of the cooling head 2 is positioned below the cooling head 2, the liquid level s of the refrigerant is higher than the third surface 2c. Is located. Therefore, when the liquid-phase refrigerant is present in the cooling head 2, the object to be cooled can be subjected to phase conversion cooling via the heat receiving surface. Further, since the first supply / discharge port 3 is positioned above the liquid level s and the second supply / discharge port 4 is positioned below the liquid level s, the refrigerant circulation path is the same as that in FIG. Circulation is repeated smoothly.

  Next, the effect of the phase change cooler of the present invention will be described.

  The effects of the phase change cooler of the present invention are to reduce the size and weight, simplify the manufacturing, and improve the cooling efficiency.

  First, in terms of reduction in size and weight, in the present invention, the cooling head 2 is formed by resin molding. When a metal plate material is three-dimensionally combined and the seam is closed by welding like the conventional cooling head 102, it is difficult to reduce the size because the metal plate material requires a thickness. Therefore, the wall thickness of the cooling head 2 can be reduced, and as a result, the cooling head 2 is reduced in size. Further, since the main material constituting the cooling head 2 is changed from metal to resin, weight reduction is also achieved. Whereas the conventional metal plate material has a thickness of 1 mm, the metal plate 9 used in the present invention can have a thickness of 0.3 mm or less (0.1 mm in the above embodiment). Weight doesn't matter.

  Furthermore, since the main material constituting the cooling head 2 is changed from metal to resin, the processing cost is also reduced.

  Next, manufacturing simplification will be described. In the present invention, the cooling head 2 is formed by resin molding. When a metal plate is combined in a three-dimensional manner like the conventional cooling head 102 and the seam is closed and formed, all the ridge lines are welded for sealing, and the first piping 105, Welding was also required to connect the metal pipe to be the second pipe 107. In the present invention, since it is resin molding, all the welding man-hours are reduced. Further, since the cooling head 2 is formed by resin molding, the first supply / discharge port 3 and the second supply / discharge port 4 can be formed in a shape protruding from the cooling head 2, and the first pipe 5, The pipe 7 (or the joint 10) can be easily connected.

  In order to improve the cooling efficiency, in the present invention, the cooling head 2 has a metal plate 9 on at least the first surface 2a which is the heat receiving surface. When the metal plate 9 is provided on the inner surface of the cooling head 2, heat conduction from the cooling head 2 to the refrigerant is promoted by the metal plate 9 coming into contact with the refrigerant. On the other hand, when the metal plate 9 is provided on the outer surface of the cooling head 2, heat conduction from the cooling object to the cooling head 2 is promoted by the metal plate 9 being in direct contact with the cooling object. Further, as described with reference to FIGS. 1A to 1C, the inner surface of the cooling head 2 is formed so that the metal plate 9 covers the resin opening of the cooling head 2 formed on the first surface 2a. Alternatively, when provided on the outer surface, heat conduction from the object to be cooled to the cooling head 2 is promoted, and heat conduction from the cooling head 2 to the refrigerant is promoted. Moreover, in this invention, since the part which does not have the metal plate 9 of the cooling head 2 is resin, thermal conductivity is lower than a metal. Therefore, the heat of the metal plate 9 does not conduct much heat throughout the entire cooling head 2 and is conducted exclusively to the refrigerant. For this reason, much of the heat from the object to be cooled contributes to the vaporization of the refrigerant, and the entire cooling head 2 and its ambient temperature are prevented from rising due to heat conduction. Thus, the present invention can improve the efficiency of phase conversion cooling.

  The posture when the mobile phone is used is limited. As described with reference to FIGS. 3A to 3C, which mobile phone is equipped with the phase conversion cooler 1 of the present invention. Even in the posture, the phase conversion cooler 1 has a liquid-phase refrigerant in the cooling head 2. In any posture, the liquid refrigerant always comes into contact with the first surface 2 a of the cooling head 2. Therefore, the heat conduction to the refrigerant can be reliably achieved by providing the metal plate 9 on the first surface 2a.

  When the metal plate 9 is provided on the other surface of the cooling head 2 other than the first surface 2a, the metal plate 9 on the surface other than the first surface 2a also contributes to heat exchange with the refrigerant. In particular, as can be seen from FIG. 3A to FIG. 3C, the fourth surface 2d facing the second surface 2b, the fifth surface 2e facing the third surface 2c, and the third surface Since the surface 2c has the opportunity to be completely immersed in the liquid-phase refrigerant, it is preferable to provide the metal plate 9.

  Moreover, it is preferable that the metal plate 9 provided on the surface other than the first surface 2 a which is a heat receiving surface is provided on the inner surface of the cooling head 2. By doing in this way, it can suppress that the heat transmitted from the 1st surface 2a to surfaces other than the 1st surface 2a thermally conducting to the atmosphere around the cooling head 2. Therefore, it is possible to prevent hot air from being trapped around the object to be cooled and to conduct most of the heat of the metal plate 9 to the refrigerant. Therefore, the efficiency of phase conversion cooling can be improved.

  Further, as described in FIG. 1C, by providing the metal plates 9 on each surface so as to be in contact with each other, the first surface 2a from the metal plate 9 provided on the first surface 2a which is a heat receiving surface. Heat is easily transmitted to the metal plate 9 provided on the other surface. By doing in this way, in the case where the phase conversion cooler 1 is in the posture shown in FIGS. 3A to 3C, the liquid phase is transferred from the metal plate 9 on the first surface 2 a that is the heat receiving surface. Heat is easily transferred to the metal plate 9 on the surface that is completely immersed in the refrigerant. Therefore, heat conduction from the cooling head 2 to the refrigerant can be promoted, and the efficiency of phase conversion cooling can be improved.

  Next, another embodiment of the present invention will be described.

  As shown in FIG. 5, the cooling head 2 of the phase conversion cooler 1 is mounted such that the first surface 2 a that is the heat receiving surface is in contact with the LSI 41 that is the object to be cooled.

  The second supply / discharge port 4 is formed at a position near the first surface 2 a of the third surface 2 c of the cooling head 2. On the other hand, the first supply / discharge port 3 is formed at a position close to the sixth surface 2 f facing the first surface 2 a of the cooling head 2. That is, in the posture in which the first surface 2 a of the cooling head 2 is positioned below the cooling head 2, the vertical heights of the first supply / exhaust port 3 and the second supply / exhaust port 4 are different.

  In this configuration, it is assumed that the posture of the phase conversion cooler 1 is a posture in which the cooling head 2 is positioned on the LSI 41 and the first surface 2a of the cooling head 2 is in contact with the LSI 41 as shown in the figure. Posture is horizontal posture). The second supply / discharge port 4 is positioned below the liquid level s, and the first supply / discharge port 3 is positioned above the liquid level s. Therefore, according to this embodiment, the circulation of the refrigerant is smoothly repeated even in the horizontal posture in addition to the posture of the phase conversion cooler 1 shown in FIG.

  In addition, since the first surface 2a which is a heat receiving surface is entirely immersed in the refrigerant and has the metal plate 9, the cooling efficiency of the phase conversion cooling is large.

  Next, an embodiment in which the phase change cooler 1 of the present invention is mounted on a mobile phone will be described.

  As shown in FIGS. 6A and 6B, the mobile phone 51 is formed by rotatably connecting a key operation unit 52 and a display unit 53 with a hinge 54. The key operation unit 52 incorporates an LSI 41 mounted on a substrate (not shown), and the cooling head 2 of the phase conversion cooler 1 is mounted on the heat radiation surface of the LSI 41. The display unit 53 incorporates the heat dissipation unit 6. The first pipe 5 and the second pipe 7 are piped from the key operation unit 52 into the display unit 53.

  As shown in the figure, the key operation unit 52 is leveled by placing the phase-conversion cooler 1 on a flat ground or holding it in the hand, and the display unit 53 is opened so that the opening angle with respect to the key operation unit 52 becomes 120 °. Suppose you do it. At this time, since the cooling head 2 is in the horizontal posture shown in FIG. 5, the phase conversion cooler 1 has a large cooling effect.

  It is assumed that the cellular phone 51 is opened at an opening angle of 180 ° and used for a call. Depending on the posture of the user, the mobile phone has an upright posture, a left-tilt posture, and a right-tilt posture. As described with reference to FIGS. 3 (a) to 3 (c), the phase conversion cooler 1 depends on the use posture. Therefore, the phase conversion cooling can be sufficiently performed and the cooling effect is great.

DESCRIPTION OF SYMBOLS 1 Phase conversion cooler 2 Cooling head 2a 1st surface 2b 2nd surface 2c 3rd surface 2d 4th surface 2e 5th surface 2f 6th surface 3 1st inlet / outlet 4 2nd inlet / outlet 5 1st piping 6 Heat radiation part 7 2nd piping 8 Inclined part 9 Metal plate 10 Joint

Claims (10)

A cooling head having a first surface in contact with an object to be cooled; a first supply / exhaust port provided on a second surface not facing the first surface of the cooling head; and the first of the cooling head. A first supply / exhaust port provided on a third surface not facing the first surface and the second surface; a first pipe connected to the first supply / exhaust port; and a heat dissipation environment connected to the first pipe. And a second pipe connected to the second supply / exhaust port connected to the heat dissipation part,
The phase conversion cooler, wherein the cooling head is formed by resin molding and has a metal plate on the first surface of the cooling head.   The phase change cooler according to claim 1, further comprising a metal plate on a plurality of surfaces of the cooling head.   The phase change cooler according to claim 2, wherein metal plates on a plurality of surfaces of the cooling head are in contact with each other.   3. The phase conversion cooling according to claim 2, wherein, among the metal plates on the plurality of surfaces of the cooling head, a metal plate provided on a surface other than the first surface is provided on an inner surface of the cooling head. vessel.   5. The phase change cooler according to claim 1, wherein an opening is formed in the resin on the first surface of the cooling head, and a metal plate is provided so as to cover the opening.   6. The phase change cooler according to claim 1, wherein a protrusion is formed on the metal plate.   The phase conversion cooler according to claim 1, wherein the metal plate is provided on the cooling head by insert molding.   The phase conversion cooler according to claim 1, wherein the second pipe has an inclined portion inclined toward the first pipe.   The vertical height of the first supply / exhaust port is different from that of the second supply / exhaust port in a posture in which the first surface of the cooling head is positioned below the cooling head. To 8. The phase change cooler according to claim 8.   A portable device comprising the phase change cooler according to claim 1.

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